Processing equipment for ultra-large-specification quartz wafer and preparation process of ultra-large-specification quartz wafer
By using a screw and slider system and precision clamping mechanism driven by a multi-axis motor in quartz wafer processing equipment, the problems of low positioning accuracy and unstable clamping in traditional equipment in large-scale wafer processing are solved, and efficient and high-precision quartz wafer processing are achieved.
Patent Information
- Application Number
- CN202510119623.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-03-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional quartz wafer processing equipment has problems such as low positioning accuracy, unstable clamping, low processing efficiency and poor processing accuracy when processing large-scale wafers.
The screw and slider system driven by a multi-axis motor is adopted, combined with a precision chip clamping mechanism, to achieve high-precision multi-directional positioning and stable clamping of quartz wafers.
It improves positioning accuracy and clamping stability during processing, significantly improves processing efficiency and accuracy, and meets the high requirements for the surface quality of quartz wafers in high-end applications.
Smart Images
Figure CN119635450A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of quartz wafer processing, and in particular to processing equipment for super-large quartz wafers and a preparation process thereof. Background Art
[0002] Quartz wafers are widely used in many high-tech fields such as electronics, communications, optics, precision instruments and scientific research due to their excellent physical and chemical properties. With the development of science and technology, the requirements for quartz wafers are also increasing, especially in terms of size and precision. Ultra-large quartz wafers (such as wafers with a diameter of more than 100 mm) are particularly important in fields such as large-scale integrated circuits and high-power lasers. These applications require wafers with extremely high surface quality and dimensional accuracy.
[0003] Traditional quartz wafer processing equipment often has the following shortcomings when processing large-sized wafers: (1) Low positioning accuracy: Traditional equipment mostly uses manual or simple mechanical positioning methods, which makes it difficult to achieve high-precision positioning of large-sized quartz wafers, especially in multi-directional movement and adjustment. Position deviation is prone to occur, affecting the processing quality. (2) Unstable clamping: Due to the large size of quartz wafers, traditional clamping mechanisms may have problems such as uneven clamping force distribution and loose clamping when fixing the wafer, resulting in the displacement or damage of the wafer during processing. (3) Low processing efficiency: When performing processing operations such as grinding and cutting, traditional equipment has a slow processing speed and requires frequent shutdowns to adjust the position, which greatly reduces production efficiency. (4) Poor processing accuracy: Traditional equipment finds it difficult to achieve high-precision processing of the surface of quartz wafers, especially in terms of flatness, parallelism and surface roughness, and it is difficult to meet the needs of high-end applications. Summary of the invention
[0004] The present invention provides a processing device for an ultra-large quartz wafer and a preparation process thereof. By adopting a multi-axis motor to drive a lead screw and a slider system, high-precision multi-directional positioning and stable clamping of the wafer are achieved, thereby improving processing efficiency and processing accuracy.
[0005] The technical solution adopted by the present invention is: a processing equipment for super-large quartz wafers, comprising a base, one side of the base is fixedly connected with a front-and-rear adjustment motor, the output end of the front-and-rear adjustment motor is provided with a first screw rod, the first screw rod is threadedly connected with a first threaded slider, the top of the first threaded slider is fixedly connected with a movable seat slidably connected to the base, one side of the movable seat is fixedly connected with a left-and-right adjustment motor, the output end of the left-and-right adjustment motor is provided with a second screw rod, the second screw rod is threadedly connected with a second threaded slider, the top of the second threaded slider is fixedly connected with a processing platform slidably connected to the movable seat, a plurality of wafer clamping mechanisms are fixedly connected with the top of the processing platform, one end of the base is fixedly connected with a side frame, the top of the side frame is fixedly connected with a height adjustment motor, the output end of the height adjustment motor is provided with a third screw rod, the third screw rod is threadedly connected with a third threaded slider, one side of the third threaded slider is fixedly connected with an installation frame slidably connected to the side frame, a wafer processing motor is installed in the installation frame, and the output end of the wafer processing motor is provided with a grinding block located above the processing platform.
[0006] As a further improvement of the present invention, a plurality of first bearing seats are installed on the base and are rotatably connected to the first screw rod via the plurality of first bearing seats.
[0007] As a further improvement of the present invention, first slide rails are fixedly connected to both sides of the first screw rod on the base, and a plurality of first guide sliding blocks matched with the first slide rails are fixedly connected to the bottom of the movable seat.
[0008] As a further improvement of the present invention, a plurality of second bearing seats are mounted on the movable seat and are rotationally connected to the second screw rod via the plurality of second bearing seats.
[0009] As a further improvement of the present invention, second slide rails are fixedly connected to both sides of the second screw rod on the movable seat, and a plurality of second guide slide blocks matched with the second slide rails are fixedly connected to the bottom of the processing platform.
[0010] As a further improvement of the present invention, a plurality of third bearing seats are installed on one side of the side frame and are rotatably connected to the third screw rod through the plurality of third bearing seats.
[0011] As a further improvement of the present invention, one side of the side frame is fixedly connected to third slide rails on both sides of the third screw rod, and one side of the installation frame is fixedly connected to a third guide slider that matches the third slide rail.
[0012] As a further improvement of the present invention, the wafer clamping mechanism includes a fixing frame fixedly connected to the processing platform, a screw threadedly connected to the top wall of the fixing frame is passed through, a knob is fixedly connected to the top end of the screw, and a pressure block is rotatably connected to the bottom end of the screw through a bearing.
[0013] As a further improvement of the present invention, a sliding block slidably connected to a fixing frame is fixedly connected to one side of the pressing block, and a sliding groove for sliding the sliding block is provided on a side wall of the fixing frame.
[0014] A process for preparing an ultra-large quartz wafer using the above-mentioned ultra-large quartz wafer processing equipment comprises the following steps:
[0015] Step 1: Place the quartz wafer to be processed in the wafer clamping mechanism of the processing platform, and rotate the knob to drive the screw to rotate, so that the pressing block is pressed down to firmly clamp the quartz wafer;
[0016] Step 2: The first screw rod and the second screw rod are driven to rotate by the front-back adjustment motor and the left-right adjustment motor respectively, thereby driving the first threaded slider and the second threaded slider to move, so as to achieve precise adjustment of the position of the processing platform;
[0017] Step 3: The third screw rod is driven to rotate by the height adjustment motor, and the third threaded slider is driven to move up and down, thereby adjusting the height of the wafer processing motor so that the grinding block contacts the wafer;
[0018] Step 4: By controlling the start of the wafer processing motor, the grinding block is driven to rotate at high speed to grind the wafer.
[0019] The beneficial effects of the present invention are as follows: (1) Improving positioning accuracy and stability: The present invention can achieve accurate multi-directional positioning of ultra-large quartz wafers through a screw and slider system driven by a multi-axis motor, greatly improving the positioning accuracy during the processing. The wafer clamping mechanism ensures the stability of clamping through the design of the screw and the pressure block, and can keep the quartz wafer fixed even during high-speed grinding, avoiding the problems of uneven clamping force distribution and loose clamping commonly seen in traditional equipment, thereby improving the qualification rate and surface quality of the processed products.
[0020] (2) Improve processing efficiency and precision: Compared with traditional manual or simple mechanical positioning methods, the multi-axis motor automatic positioning technology adopted in the present invention can quickly and accurately complete the position adjustment of the chip, reduce the downtime caused by position adjustment, and significantly improve the processing efficiency. At the same time, the high-precision position adjustment is combined with the efficient polishing mechanism, so that the equipment performs well in processing the high-precision requirements such as flatness, parallelism and surface roughness of quartz chips.
[0021] (3) Enhance the adaptability and flexibility of the equipment: The adjustment mechanisms in different directions (front and back, left and right, up and down) of the present invention are all driven by independent motors, which not only facilitates the operator's control and adjustment of the processing flow, but also enhances the equipment's adaptability to quartz wafers of different specifications and shapes, so that the equipment can flexibly respond to various processing requirements, such as grinding and polishing, without changing the basic structure, greatly expanding the application range of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic diagram of the overall structure of a processing device for an ultra-large quartz wafer and its preparation process according to the present invention;
[0023] Figure 2 It is a partial structural schematic diagram of a processing device for an ultra-large quartz wafer and a preparation process thereof according to the present invention;
[0024] Figure 3 This is a partial structural decomposition of a processing device for an ultra-large quartz wafer and its preparation process of the present invention. Figure 1 ;
[0025] Figure 4 The invention discloses a processing device for ultra-large quartz wafers and a preparation process thereof. Figure 3 Another perspective of the structure;
[0026] Figure 5 This is a partial structural decomposition of a processing device for an ultra-large quartz wafer and its preparation process of the present invention. Figure 2
[0027] Figure 6 The invention discloses a processing device for ultra-large quartz wafers and a preparation process thereof. Figure 5 Another perspective of the structure;
[0028] Figure 7 The invention discloses a processing device for ultra-large quartz wafers and a preparation process thereof. Figure 1 Schematic diagram of part A in the middle.
[0029] As shown in the figure: 1. Base; 2. Front and rear adjustment motor; 3. First screw rod; 4. First threaded slider; 5. Movable seat; 6. Left and right adjustment motor; 7. Second screw rod; 8. Second threaded slider; 9. Processing platform; 10. Wafer clamping mechanism; 1001. Fixed frame; 1002. Screw rod; 1003. Knob; 1004. Pressure block; 11. Side frame; 12. Height adjustment motor; 13. Third screw rod; 14. Third threaded slider; 15. Mounting frame; 16. Wafer processing motor; 17. Grinding block; 18. First bearing seat; 19. First slide rail; 20. First guide slider; 21. Second bearing seat; 22. Second slide rail; 23. Second guide slider; 24. Third bearing seat; 25. Third slide rail; 26. Third guide slider. DETAILED DESCRIPTION
[0030] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to their structure and are relative concepts. Therefore, they may change accordingly according to their different locations and different usage states; therefore, these or other directional terms should not be interpreted as restrictive terms.
[0031] The singular forms "a", "said" and "the" used in this specification are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and implementation methods. It should be understood that the implementation methods described herein are only used to explain this application and are not used to limit this application.
[0033] The present invention provides the following Figure 1-7The processing equipment of an oversized quartz wafer shown in the figure comprises a base 1, a front-and-rear adjustment motor 2 is fixedly connected to one side of the base 1, a first screw rod 3 is provided at the output end of the front-and-rear adjustment motor 2, a first threaded slider 4 is threadedly connected to the first screw rod 3, a movable seat 5 slidably connected to the base 1 is fixedly connected to the top of the first threaded slider 4, a left-and-right adjustment motor 6 is fixedly connected to one side of the movable seat 5, a second screw rod 7 is provided at the output end of the left-and-right adjustment motor 6, a second threaded slider 8 is threadedly connected to the second screw rod 7, a second threaded slider 8 is fixedly connected to the top of the second threaded slider 8 A processing platform 9 is connected, and a plurality of wafer clamping mechanisms 10 are fixedly connected to the top of the processing platform 9. A side frame 11 is fixedly connected to one end of the base 1, and a height adjustment motor 12 is fixedly connected to the top of the side frame 11. A third screw rod 13 is provided at the output end of the height adjustment motor 12, and a third threaded slider 14 is threadedly connected to the third screw rod 13. One side of the third threaded slider 14 is fixedly connected to a mounting frame 15 slidably connected to the side frame 11, and a wafer processing motor 16 is installed in the mounting frame 15. A grinding block 17 located above the processing platform 9 is provided at the output end of the wafer processing motor 16.
[0034] like Figure 2 , Figure 4 , Figure 5 , Figure 6 As shown, in the present invention, a plurality of first bearing seats 18 are installed on the base 1 and are rotatably connected to the first screw rod 3 through the plurality of first bearing seats 18. First slide rails 19 are fixedly connected to both sides of the first screw rod 3 on the base 1, and a plurality of first guide sliders 20 matching the first slide rails 19 are fixedly connected to the bottom of the movable base 5.
[0035] like Figure 3 and Figure 4 As shown, in the present invention, a plurality of second bearing seats 21 are installed on the movable seat 5 and are rotatably connected to the second screw rod 7 through the plurality of second bearing seats 21. The movable seat 5 is fixedly connected to second slide rails 22 on both sides of the second screw rod 7, and a plurality of second guide sliders 23 matching the second slide rails 22 are fixedly connected to the bottom of the processing platform 9.
[0036] like Figure 5 and Figure 6 As shown, in the present invention, a plurality of third bearing seats 24 are installed on one side of the side frame 11 and are rotatably connected to the third screw rod 13 through the plurality of third bearing seats 24. A third slide rail 25 is fixedly connected to both sides of the third screw rod 13 on one side of the side frame 11, and a third guide slider 26 matching the third slide rail 25 is fixedly connected to one side of the mounting frame 15.
[0037] like Figure 7As shown, the wafer clamping mechanism 10 of the present invention includes a fixing frame 1001 fixedly connected to the processing platform 9, a screw 1002 threadedly connected to the fixing frame 1001 is provided on the top wall, a knob 1003 is fixedly connected to the top of the screw 1002, and a pressing block 1004 is rotatably connected to the bottom of the screw 1002 through a bearing. A slider slidably connected to the fixing frame 1001 is fixedly connected to one side of the pressing block 1004, and a sliding groove for the sliding slider to slide is provided on the side wall of the fixing frame 1001.
[0038] Example:
[0039] This embodiment provides a process for preparing an ultra-large quartz wafer using the above-mentioned ultra-large quartz wafer processing equipment, comprising the following steps:
[0040] Step 1: Place the quartz wafer to be processed in the wafer clamping mechanism 10 of the processing platform 9, and rotate the knob 1003 to drive the screw 1002 to rotate, so that the pressing block 1004 is pressed down to firmly clamp the quartz wafer;
[0041] Step 2: The first screw rod 3 and the second screw rod 7 are driven to rotate by the front-back adjustment motor 2 and the left-right adjustment motor 6 respectively, thereby driving the first threaded slider 4 and the second threaded slider 8 to move, so as to achieve precise adjustment of the position of the processing platform 9;
[0042] Step 3: The third screw rod 13 is driven to rotate by the height adjustment motor 12, and the third threaded slider 14 is driven to move up and down, thereby adjusting the height of the wafer processing motor 16, so that the grinding block 17 contacts the wafer;
[0043] Step 4: By controlling the start of the wafer processing motor 16, the grinding block 17 is driven to rotate at high speed to grind the wafer.
[0044] It can be seen from the above embodiments that the ultra-large-size quartz wafer processing equipment and its preparation process of the present invention not only improve the processing accuracy and efficiency, but also significantly enhance the adaptability and flexibility of the equipment. By adopting a screw and slider system driven by a multi-axis motor, combined with a precise wafer clamping mechanism, the present invention ensures high-precision positioning and stable clamping of the quartz wafer during the processing process. This design not only avoids the common clamping problems in traditional equipment, but also improves the qualified rate and surface quality of the processed products. At the same time, the equipment of the present invention can quickly and accurately complete the position adjustment of the wafer, significantly reducing downtime, thereby improving processing efficiency. In addition, the high-precision position adjustment of the equipment is combined with an efficient grinding mechanism, so that it performs well in processing the high-precision requirements such as flatness, parallelism and surface roughness of quartz wafers. More importantly, the different direction adjustment mechanisms in the present invention are all driven by independent motors, which not only facilitates the operator's control and adjustment of the processing flow, but also enhances the adaptability of the equipment to quartz wafers of different specifications and shapes. Therefore, the equipment can flexibly respond to a variety of processing requirements, such as grinding, polishing, etc., without changing the basic architecture, greatly expanding the scope of application of the equipment. In summary, the ultra-large-size quartz wafer processing equipment and the preparation process thereof of the present invention have significant technical advantages and broad market application prospects.
[0045] The above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the implementation modes of the present invention.
Claims
1. A processing device for ultra-large quartz wafers, comprising a base (1), characterized in that: A front-to-rear adjustment motor (2) is fixedly connected to one side of the base (1); a first screw rod (3) is provided at the output end of the front-to-rear adjustment motor (2); a first threaded slider (4) is threadedly connected to the first screw rod (3); a movable seat (5) slidably connected to the base (1) is fixedly connected to the top of the first threaded slider (4); a left-right adjustment motor (6) is fixedly connected to one side of the movable seat (5); a second screw rod (7) is provided at the output end of the left-to-right adjustment motor (6); a second threaded slider (8) is threadedly connected to the second screw rod (7); a processing platform (9) slidably connected to the movable seat (5) is fixedly connected to the top of the second threaded slider (8); A plurality of wafer clamping mechanisms (10) are fixedly connected to the top of the platform (9); one end of the base (1) is fixedly connected to a side frame (11); the top of the side frame (11) is fixedly connected to a height adjustment motor (12); a third screw rod (13) is provided at the output end of the height adjustment motor (12); a third threaded slider (14) is threadedly connected to the third screw rod (13); one side of the third threaded slider (14) is fixedly connected to a mounting frame (15) slidably connected to the side frame (11); a wafer processing motor (16) is installed in the mounting frame (15); and a grinding block (17) located above the processing platform (9) is provided at the output end of the wafer processing motor (16).
2. The processing equipment for ultra-large quartz wafers according to claim 1, characterized in that: A plurality of first bearing seats (18) are mounted on the base (1) and are rotatably connected to the first screw rod (3) via the plurality of first bearing seats (18).
3. The processing equipment for super large quartz wafers according to claim 1, characterized in that: The base (1) is fixedly connected to first slide rails (19) on both sides of the first screw rod (3), and the bottom of the movable seat (5) is fixedly connected to a plurality of first guide sliding blocks (20) that match the first slide rails (19).
4. The processing equipment for super large quartz wafers according to claim 1, characterized in that: A plurality of second bearing seats (21) are mounted on the movable seat (5) and are rotationally connected to the second screw rod (7) via the plurality of second bearing seats (21).
5. The processing equipment for super large quartz wafers according to claim 1, characterized in that: The movable seat (5) is fixedly connected to second slide rails (22) on both sides of the second screw rod (7), and the bottom of the processing platform (9) is fixedly connected to a plurality of second guide slide blocks (23) matched with the second slide rails (22).
6. The processing equipment for super large quartz wafers according to claim 1, characterized in that: A plurality of third bearing seats (24) are installed on one side of the side frame (11) and are rotationally connected to the third screw rod (13) via the plurality of third bearing seats (24).
7. The processing equipment for super large quartz wafers according to claim 1, characterized in that: One side of the side frame (11) is fixedly connected to third slide rails (25) on both sides of the third screw rod (13), and one side of the installation frame (15) is fixedly connected to a third guide slider (26) that matches the third slide rail (25).
8. The processing equipment for super large quartz wafers according to claim 1, characterized in that: The wafer clamping mechanism (10) comprises a fixing frame (1001) fixedly connected to the processing platform (9), a screw (1002) threadedly connected to the fixing frame (1001) is passed through the top wall of the fixing frame (1001), a knob (1003) is fixedly connected to the top end of the screw (1002), and a pressure block (1004) is rotatably connected to the bottom end of the screw (1002) via a bearing.
9. The processing equipment for super large quartz wafers according to claim 8, characterized in that: A sliding block slidably connected to the fixing frame (1001) is fixedly connected to one side of the pressing block (1004), and a sliding groove for the sliding block to slide is provided on the side wall of the fixing frame (1001).
10. A process for preparing an ultra-large quartz wafer using the ultra-large quartz wafer processing equipment according to claims 1-9, characterized in that: The following steps are involved: Step 1: Place the quartz wafer to be processed in the wafer clamping mechanism (10) of the processing platform (9), and rotate the knob (1003) to drive the screw (1002) to rotate, thereby pressing the pressing block (1004) downward to firmly clamp the quartz wafer; Step 2: The first screw rod (3) and the second screw rod (7) are driven to rotate respectively by the front-back adjustment motor (2) and the left-right adjustment motor (6), thereby driving the first threaded slider (4) and the second threaded slider (8) to move, thereby realizing accurate adjustment of the position of the processing platform (9); Step 3: The third screw rod (13) is driven to rotate by the height adjustment motor (12), driving the third threaded slider (14) to move up and down, thereby adjusting the height of the wafer processing motor (16) so that the grinding block (17) contacts the wafer; Step 4: By controlling the start-up of the wafer processing motor (16), the grinding block (17) is driven to rotate at high speed to grind the wafer.