Circuit board substrate cutting device

Abstract

The invention discloses a circuit board substrate cutting device, and relates to the technical field of circuit board cutting. The circuit board cutting device comprises a circuit board cutting table, two linear telescopic pieces are arranged at the top of the inner wall of the circuit board cutting table, the output ends of the two linear telescopic pieces are fixedly connected with a mounting block, a cutting knife is arranged on the lower side of the mounting block, and a fastener used for fixing the cutting knife is arranged on the mounting block; a containing groove is formed in one side of the circuit board cutting table, and a first collecting box and a second collecting box are arranged in the containing groove. The continuous extrusion assembly is arranged on one side of the circuit board cutting table, when the linear telescopic piece drives the cutting knife to cut downwards or reset upwards, the screen plate is driven to vibrate in the containing groove through continuous extrusion of the continuous extrusion assembly and the elasticity of the continuous extrusion assembly, and the screening efficiency of small or large offcut is improved.

Description

Technical Field

[0001] The invention belongs to the field of circuit board cutting, and in particular relates to a circuit board substrate cutting device. Background Art

[0002] Circuit boards are essential components in electronic products. During the production process, circuit boards need to be segmented so that their size can adapt to the product. Circuit board cutting devices can be used to cut circuit board (PCB) substrates.

[0003] When the existing circuit board cutting device is in use, a large amount of dust will be generated when cutting the substrate, and small or large edge materials will also be cut off from the substrate. In order not to affect the continuous cutting of the circuit board, the dust and edge materials need to be cleaned and recovered after each circuit board is cut, which is easy to affect the efficiency of circuit board cutting. Moreover, when cutting the circuit board, since the cutter exerts pressure on one side of the circuit board, the circuit board to be cut may be subjected to excessive force and may shift or warp, thereby affecting the cutting accuracy of the circuit board.

[0004] In view of this, the present invention is proposed. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a circuit board substrate cutting device to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is: A circuit board substrate cutting device, comprising: a circuit board cutting table, two linear telescopic members are arranged on the top of the inner wall of the circuit board cutting table, the output ends of the two linear telescopic members are fixedly connected to a mounting block, a cutting knife is arranged on the lower side of the mounting block, and a fastener for fixing the cutting knife is arranged on the mounting block; A placement groove is provided on one side of the circuit board cutting table, a first collection box and a second collection box are arranged in the placement groove, a sieve plate is elastically fitted in the placement groove, the first collection box is located below the sieve plate, the second collection box is located on one side of the sieve plate, a continuous extrusion component connected to the mounting block is provided on one side of the circuit board cutting table, the continuous extrusion component cooperates with the sieve plate, a pressure plate is elastically fitted on one side of the mounting block, a collection cover is fixedly connected to one side of the mounting block, and a dust collection component connected to the collection cover is provided on the upper side of the circuit board cutting table.

[0007] Optionally, one side of the mounting block is fixedly connected to a fixing block, one side of the fixing block is provided with a sliding groove, the sliding groove is slidably matched with a sliding block fixedly connected to one side of the pressure plate, and a first spring is fixedly connected between the sliding block and the sliding groove.

[0008] Optionally, a mounting groove is provided at the bottom of the mounting block, the cutting knife is located in the mounting groove, and the fastener includes a threaded hole provided on one side of the fixing block and connected to the mounting groove, and a fastening bolt threadedly fitted in the threaded hole and abutting against the cutting knife at the threaded end.

[0009] Optionally, the dust collection assembly includes a plurality of dust collection tubes fixedly connected to the upper side of the collection cover and communicated therewith, a telescopic tube fixedly connected to the circuit board cutting table and connected to the plurality of dust collection tubes, an exhaust fan and a dust collection box arranged on the upper side of the circuit board cutting table, an air inlet of the exhaust fan connected to the telescopic tube, and an air outlet of the exhaust fan communicated with the dust collection box.

[0010] Optionally, an inclined groove is provided in the placement groove, the sieve plate is located in the inclined groove, and a plurality of second springs are fixedly connected between the sieve plate and the inclined groove; a groove connected to the inclined groove is provided on one side of the inner wall of the circuit board cutting table, and a continuous extrusion assembly is located in the groove; the continuous extrusion assembly includes a movable plate slidingly fitted in the groove, a plurality of extrusion blocks fixedly connected to one side of the movable plate, and a connecting plate fixedly connected to one side of the movable plate and fixedly connected to the mounting block; a plurality of the extrusion blocks are provided with rounded corners on one side, and the extrusion blocks abut against the sieve plate through the rounded corners.

[0011] Optionally, a fixing groove corresponding to the cutting knife is opened at the bottom of the inner wall of the circuit board cutting table, and a protective plate is arranged in the fixing groove.

[0012] Optionally, a rubber pad is fixedly connected to the bottom of the pressing plate.

[0013] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all the advantages described below at the same time: By means of the dust collecting assembly arranged on the circuit board cutting table, when the linear telescopic member drives the cutting knife to move downward to cut the circuit board, the dust collecting assembly is started to absorb the dust generated during cutting through the collecting cover and then collect it, so that the dust can be collected conveniently. By means of the sieve plate arranged obliquely in the circuit board cutting table, the cut smaller or larger edge materials can be screened and fall into the first collecting box and the second collecting box respectively for collection, so that the smaller or larger edge materials can be classified and collected, thereby reducing the situation where the dust and edge materials affect the continuous cutting of the circuit board. By setting a continuous extrusion component on one side of the circuit board cutting table, when the linear telescopic member drives the cutting knife to cut downward or reset upward, the continuous extrusion of the continuous extrusion component and its own elastic force drive the screen plate to vibrate in the placement slot, thereby improving the efficiency of screening smaller or larger edge materials; By using the pressure plate on one side of the mounting block, when the linear telescopic member drives the cutting knife to cut the circuit board, the pressure plate can squeeze and fix the circuit board to be cut through elastic force, reducing the situation where the circuit board to be cut is subjected to excessive force and causes deviation or warping, thereby improving the efficiency of circuit board cutting.

[0014] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings: Figure 1 It is a schematic diagram of the circuit board cutting table structure; Figure 2 It is a schematic diagram of the structure of the dust collection component; Figure 3 This is a schematic diagram of the installation block structure; Figure 4 It is a schematic diagram of the pressure plate structure; Figure 5 Schematic diagram of the sieve plate structure; Figure 6 Schematic diagram of the continuous extrusion component structure.

[0016] In the accompanying drawings, the components represented by the reference numerals are listed as follows: Circuit board cutting table 1, linear telescopic member 2, mounting block 3, cutting knife 4, pressing plate 5, rubber pad 6, placement groove 7, first collecting box 8, second collecting box 9, sieve plate 10, collecting cover 11, dust collecting assembly 12, dust collecting tube 1201, telescopic tube 1202, exhaust fan 1203, dust collecting box 1204, mounting groove 13, threaded hole 14, fastening bolt 15, fixing block 16, slide groove 17, slider 18, first spring 19, fixing groove 20, protective plate 21, inclined groove 22, second spring 23, continuous extrusion assembly 24, moving plate 2401, extrusion block 2402, connecting plate 2403, groove 25.

[0017] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but are intended to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0018] The present invention will now be described in further detail with reference to the accompanying drawings.

[0019] See also Figure 1-6As shown, in this embodiment, a circuit board substrate cutting device is provided, comprising: a circuit board cutting table 1, two linear telescopic members 2 are arranged on the top of the inner wall of the circuit board cutting table 1, the output ends of the two linear telescopic members 2 are fixedly connected to a mounting block 3, a cutting knife 4 is arranged on the lower side of the mounting block 3, and a fastener for fixing the cutting knife 4 is arranged on the mounting block 3, wherein the linear telescopic member 2 can be a hydraulic cylinder, an electric telescopic rod or a cylinder; A placement groove 7 is provided on one side of the circuit board cutting table 1, and a first collection box 8 and a second collection box 9 are arranged in the placement groove 7. A sieve plate 10 is elastically matched in the placement groove 7, the first collection box 8 is located below the sieve plate 10, and the second collection box 9 is located on one side of the sieve plate 10. A continuous extrusion component 24 connected to the mounting block 3 is provided on one side of the circuit board cutting table 1, and the continuous extrusion component 24 cooperates with the sieve plate 10. A pressure plate 5 is elastically matched on one side of the mounting block 3, and a collection cover 11 is fixedly connected to one side of the mounting block 3. A dust collection component 12 connected to the collection cover 11 is provided on the upper side of the circuit board cutting table 1.

[0020] The application of one aspect of this embodiment is as follows: when it is necessary to cut a circuit board, first place the circuit board to be cut on the circuit board cutting table 1, start the linear telescopic member 2 and the dust collecting assembly 12, and when the linear telescopic member 2 drives the cutting knife 4 to move downward to cut the circuit board, the pressing plate 5 squeezes and fixes the circuit board to be cut by elastic force, and the dust collecting assembly 12 is started to absorb the dust generated during cutting through the collecting cover 11, and the cut smaller or larger edge materials fall onto the sieve plate 10 for screening, and the smaller edge materials directly fall into the first collection box 8, and the larger edge materials slide into the second collection box 9 through the inclined sieve plate 10, and when the linear telescopic member 2 drives the cutting knife 4 to cut downward or reset upward, the continuous extrusion assembly 24 is driven to start, and the continuous extrusion assembly 24 starts to drive the elastic sieve plate 10 to vibrate, thereby accelerating the screening of the edge materials. It should be noted that all electrical equipment involved in this application can be powered by batteries or external power supplies.

[0021] By setting the dust collecting assembly 12 on the circuit board cutting table 1, when the linear telescopic member 2 drives the cutting knife 4 to move downward to cut the circuit board, the dust collecting assembly 12 is started to absorb the dust generated during cutting through the collecting cover 11 and then collect it, which is convenient for collecting dust. By setting the sieve plate 10 obliquely in the circuit board cutting table 1, the smaller or larger edge materials cut off can be screened and fall into the first collection box 8 and the second collection box 9 for collection, which is convenient for classifying and collecting smaller or larger edge materials, thereby reducing the situation where dust and edge materials affect the continuous cutting of the circuit board; A continuous extrusion component 24 is arranged on one side of the circuit board cutting table 1. When the linear telescopic member 2 drives the cutting knife 4 to cut downward or reset upward, the continuous extrusion component 24 and its own elastic force drive the screen plate 10 to vibrate in the placement groove 7, thereby improving the efficiency of screening smaller or larger edge materials; through the pressure plate 5 on one side of the mounting block 3, when the linear telescopic member 2 drives the cutting knife 4 to cut the circuit board, the pressure plate 5 can squeeze and fix the circuit board to be cut through the elastic force, thereby reducing the situation where the circuit board to be cut is subjected to excessive force and deflected or warped, thereby improving the efficiency of circuit board cutting.

[0022] like Figure 4 As shown, one side of the mounting block 3 of this embodiment is fixedly connected to a fixing block 16, one side of the fixing block 16 is provided with a slide groove 17, the slide groove 17 is slidably matched with a slider 18 fixedly connected to one side of the pressing plate 5, and a first spring 19 is fixedly connected between the slider 18 and the slide groove 17, wherein the pressing plate 5 is an L-shaped structure; When the linear telescopic member 2 drives the cutting knife 4 to cut the circuit board, the slider 18 moves in the slide groove 17, so that when the cutting knife 4 moves downward and squeezes, the pressure plate 5 squeezes and fixes the circuit board to be cut through the elastic force of the first spring 19, thereby reducing the situation where the circuit board to be cut is subjected to excessive force and deflected or warped, thereby improving the efficiency of circuit board cutting.

[0023] like Figure 4 As shown, a mounting groove 13 is provided at the bottom of the mounting block 3 of this embodiment, and the cutting blade 4 is located in the mounting groove 13. The fastener includes a threaded hole 14 provided on one side of the fixing block 16 and connected to the mounting groove 13, and a fastening bolt 15 threadedly engaged in the threaded hole 14 and abutting against the cutting blade 4 at the threaded end. By using the fasteners provided on the mounting block 3 and using a wrench to screw the fastening bolt 15 forward or reversely, the fastening bolt 15 is screwed into or out of the threaded hole 14, and the cutting knife 4 can be disassembled and assembled in the mounting groove 13, thereby facilitating the replacement of the cutting knife 4.

[0024] like Figure 2As shown, specifically, the specific structure of the dust collecting assembly 12 includes the following: a plurality of dust collecting tubes 1201 fixedly connected to the upper side of the collecting cover 11 and communicated therewith, a telescopic tube 1202 fixedly connected to the circuit board cutting table 1 and connected to the plurality of dust collecting tubes 1201, an exhaust fan 1203 and a dust collecting box 1204 arranged on the upper side of the circuit board cutting table 1, an air inlet of the exhaust fan 1203 is connected to the telescopic tube 1202, and an air outlet of the exhaust fan 1203 is communicated with the dust collecting box 1204; Among them, the exhaust fan 1203 is started, and the exhaust fan 1203 generates suction to the collection hood 11 through the telescopic tube 1202 and multiple dust collecting tubes 1201. The suction in the collection hood 11 can absorb the dust generated during cutting. The absorbed dust enters the dust collecting box 1204 through multiple dust collecting tubes 1201 and the telescopic tube 1202 for collection, which facilitates the collection of dust.

[0025] like Figure 5 As shown, an inclined groove 22 is provided in the placement groove 7 of this embodiment, the sieve plate 10 is located in the inclined groove 22, and a plurality of second springs 23 are fixedly connected between the sieve plate 10 and the inclined groove 22; a groove 25 connected to the inclined groove 22 is provided on one side of the inner wall of the circuit board cutting table 1, and the continuous extrusion assembly 24 is located in the groove 25; like Figure 5-6 As shown, specifically, the specific structure of the continuous extrusion assembly 24 includes the following: a movable plate 2401 slidingly fitted in the groove 25, a plurality of extrusion blocks 2402 fixedly connected to one side of the movable plate 2401, and a connecting plate 2403 fixedly connected to one side of the movable plate 2401 and fixedly connected to the mounting block 3; one side of the plurality of extrusion blocks 2402 are all provided with rounded corners, and the extrusion blocks 2402 are abutted against the screen plate 10 through the rounded corners.

[0026] When the linear telescopic member 2 drives the cutting knife 4 to cut downward or reset upward, the cutting knife 4 drives the movable plate 2401 to move in the groove 25 through the connecting plate 2403, and the movement of the movable plate 2401 drives the multiple extrusion blocks 2402 to move. The multiple extrusion blocks 2402 continuously extrude the sieve plate 10 through the rounded corners, and the sieve plate 10 is reset by the elastic force of the multiple second springs 23. The sieve plate 10 vibrates in the inclined groove 22 by the elastic force of the multiple second springs 23 and the extrusion of the multiple extrusion blocks 2402, and the cut smaller or larger edge materials fall onto the vibrating sieve plate 10 for screening, and the smaller edge materials directly fall into the first collecting box 8, and the larger edge materials slide into the second collecting box 9 through the inclined sieve plate 10, which is convenient for classifying and collecting smaller or larger edge materials, thereby reducing the impact of dust and edge materials on the continuous cutting of the circuit board.

[0027] like Figure 3As shown, a fixing groove 20 corresponding to the cutting knife 4 is opened at the bottom of the inner wall of the circuit board cutting table 1 of this embodiment, and a protective plate 21 is arranged in the fixing groove 20, wherein the protective plate 21 can be a rubber block or a wooden block, which can protect the blade of the cutting knife 4.

[0028] like Figure 2 As shown, a rubber pad 6 is fixedly connected to the bottom of the pressing plate 5 of this embodiment, wherein the rubber pad 6 can protect the surface of the circuit board when the pressing plate 5 presses the circuit board.

[0029] The present invention is not limited to the above-mentioned embodiments. Anyone should be aware that any structural changes made under the enlightenment of the present invention, and any technical solutions that are the same or similar to the present invention, fall within the protection scope of the present invention. The technology, shape, and structural parts not described in detail in the present invention are all well-known technologies.

Claims

1. A circuit board substrate cutting device, characterized in that: include: A circuit board cutting table (1), wherein two linear telescopic members (2) are arranged on the top of the inner wall of the circuit board cutting table (1), the output ends of the two linear telescopic members (2) are fixedly connected to a mounting block (3), a cutting knife (4) is arranged on the lower side of the mounting block (3), and a fastener for fixing the cutting knife (4) is arranged on the mounting block (3); A placement groove (7) is provided on one side of the circuit board cutting table (1), a first collection box (8) and a second collection box (9) are arranged in the placement groove (7), a sieve plate (10) is elastically matched in the placement groove (7), the first collection box (8) is located below the sieve plate (10), and the second collection box (9) is located on one side of the sieve plate (10), a continuous extrusion component (24) connected to the mounting block (3) is provided on one side of the circuit board cutting table (1), the continuous extrusion component (24) is matched with the sieve plate (10), a pressing plate (5) is elastically matched on one side of the mounting block (3), a collection cover (11) is fixedly connected to one side of the mounting block (3), and a dust collection component (12) connected to the collection cover (11) is provided on the upper side of the circuit board cutting table (1).

2. A circuit board substrate cutting device according to claim 1, characterized in that: A fixing block (16) is fixedly connected to one side of the mounting block (3); a slide groove (17) is provided on one side of the fixing block (16); a sliding block (18) is slidably matched with the slide groove (17) and fixedly connected to one side of the pressure plate (5); a first spring (19) is fixedly connected between the sliding block (18) and the slide groove (17).

3. A circuit board substrate cutting device according to claim 1, characterized in that: The bottom of the mounting block (3) is provided with a mounting groove (13), the cutting knife (4) is located in the mounting groove (13), and the fastener comprises a threaded hole (14) provided on one side of the fixing block (16) and connected to the mounting groove (13), and a fastening bolt (15) threadedly engaged with the threaded end of the threaded hole (14) and abutting against the cutting knife (4).

4. A circuit board substrate cutting device according to claim 1, characterized in that: The dust collection assembly (12) comprises a plurality of dust collection tubes (1201) fixedly connected to the upper side of the collection cover (11) and communicated therewith, a telescopic tube (1202) fixedly connected to the circuit board cutting table (1) and connected to the plurality of dust collection tubes (1201), an exhaust fan (1203) and a dust collection box (1204) arranged on the upper side of the circuit board cutting table (1), an air inlet of the exhaust fan (1203) being connected to the telescopic tube (1202), and an air outlet of the exhaust fan (1203) being communicated with the dust collection box (1204).

5. The circuit board substrate cutting device according to claim 1, characterized in that: An inclined groove (22) is provided in the placement groove (7), the sieve plate (10) is located in the inclined groove (22), and a plurality of second springs (23) are fixedly connected between the sieve plate (10) and the inclined groove (22).

6. A circuit board substrate cutting device according to claim 5, characterized in that: A groove (25) connected to the inclined groove (22) is provided on one side of the inner wall of the circuit board cutting table (1), and the continuous extrusion component (24) is located in the groove (25).

7. A circuit board substrate cutting device according to claim 6, characterized in that: The continuous extrusion assembly (24) comprises a movable plate (2401) slidably fitted in the groove (25), a plurality of extrusion blocks (2402) fixedly connected to one side of the movable plate (2401), and a connecting plate (2403) fixedly connected to one side of the movable plate (2401) and fixedly connected to the mounting block (3).

8. A circuit board substrate cutting device according to claim 7, characterized in that: A rounded corner is provided on one side of each of the plurality of extrusion blocks (2402), and the extrusion blocks (2402) are in contact with the sieve plate (10) via the rounded corner.

9. The circuit board substrate cutting device according to claim 1, characterized in that: A fixing groove (20) corresponding to the cutting knife (4) is provided at the bottom of the inner wall of the circuit board cutting table (1), and a protective plate (21) is arranged in the fixing groove (20).

10. The circuit board substrate cutting device according to claim 1, characterized in that: A rubber pad (6) is fixedly connected to the bottom of the pressing plate (5).

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