Gypsum board thickness automatic measurement and adjustment control device and method
By installing automatic measurement and adjustment control devices on the gypsum board production line, the problem of timely measurement and adjustment of gypsum board thickness is solved, and automatic adjustment of gypsum board thickness is achieved, and production efficiency and product quality are improved.
Patent Information
- Application Number
- CN202411826052.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-03-18
AI Technical Summary
During the production process of gypsum board, since the plates need to be manually measured after a long distance, a large number of gypsum boards that do not meet the requirements are produced, and the board thickness cannot be adjusted in time, affecting the product quality.
A control device for automatic measurement and adjustment of gypsum board thickness is designed, including a forming table, an extrusion device, an infrared rangefinder and a control unit. The board thickness of gypsum board is measured in real time through an infrared rangefinder, and the working conditions of the extrusion device are automatically adjusted according to the relationship between the required board thickness and the actual board thickness.
The timely measurement and automatic adjustment of the thickness of gypsum boards is realized to ensure that the produced gypsum board can meet actual production requirements and improve production efficiency and product quality.
Smart Images

Figure CN119635796A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of gypsum board production, and in particular to a device and method for automatically measuring and adjusting the thickness of a gypsum board. Background Art
[0002] In the gypsum board production process, the board needs to pass through the forming belt and the cutting system and then be manually measured to obtain the actual board thickness, which is then fed back to the production personnel to determine whether the actual board thickness meets the production requirements so as to adjust the production working conditions of the gypsum board. However, since the distance from the production of the gypsum board to the actual measurement is too far, and the subsequent manual measurement and feedback cannot be timely, it is easy to produce a large number of gypsum boards that do not meet the requirements, resulting in the gypsum boards being unable to meet actual needs. Therefore, there is an urgent need for a device that can monitor the thickness of the gypsum board in time and automatically adjust the thickness of the board. Summary of the invention
[0003] In order to solve the technical problem, the present invention provides a gypsum board thickness automatic measurement and adjustment control device, comprising:
[0004] Forming table;
[0005] An extrusion device is arranged above the forming table, and the extrusion device is used to adjust the actual plate thickness of the gypsum board;
[0006] A screw rod is rotatably arranged on the forming table, and the screw rod is used to adjust the distance;
[0007] An infrared rangefinder, arranged on the extrusion device, and used to measure the actual thickness of the gypsum board;
[0008] The control unit is used to obtain the required board thickness of the gypsum board and the actual board thickness of the produced gypsum board, and control the extrusion device to work based on the relationship between the required board thickness and the actual board thickness.
[0009] Furthermore, the extrusion device comprises:
[0010] Extruded board, for extruded gypsum board;
[0011] A cylinder is connected above the extrusion plate, and the cylinder is used to drive the extrusion plate to move up and down.
[0012] Furthermore, the control unit comprises:
[0013] A collection module, used for collecting the actual sheet thickness of the gypsum board after adjustment and the actual sheet thickness of the gypsum board detected in real time;
[0014] a processing module connected to the acquisition module, the processing module being used to obtain the required sheet thickness of the gypsum board, and to set and adjust the working conditions of the extrusion device according to the relationship between the required sheet thickness, the actual sheet thickness and the actual sheet thickness;
[0015] A control module is connected to the processing module, and is used to control the extrusion device to work according to working conditions.
[0016] Furthermore, the processing module is used to:
[0017] The processing module is used to obtain the required plate thickness △G of the gypsum board, the processing module is also used to set the actual plate thickness preset value G0 of the gypsum board, the processing module is also used to set the preset difference g1, the preset difference g2, the third preset difference g3 and the fourth preset difference g4, and g1<g2<g3<g4; the processing module is also used to set the preset working condition matrix A1 (a1, b1), the preset working condition matrix A2 (a2, b2), the third preset working condition matrix A3 (a3, b3) and the fourth preset working condition matrix A4 (a4, b4), wherein a1-a4 are respectively the pressures to the fourth preset cylinder, and a1<a2<a3<a4, b1-b4 are respectively the strokes to the fourth preset extrusion plate, and b1<b2<b3<b4;
[0018] According to the difference between the actual plate thickness △G of the gypsum board and the preset value G0 of the actual plate thickness of the gypsum board, a preset working condition matrix Ai is selected as the initial working condition of the extrusion device;
[0019] When △G-G0≤g1, the preset working condition matrix A1 is selected as the initial working condition of the extrusion device;
[0020] When g1<△G-G0≤g2, the preset working condition matrix A2 is selected as the initial working condition of the extrusion device;
[0021] When g2<△G-G0≤g3, the third preset working condition matrix A3 is selected as the initial working condition of the extrusion device;
[0022] When g3<ΔG-G0≤g4, the fourth preset working condition matrix A4 is selected as the initial working condition of the extrusion device.
[0023] Furthermore, the processing module is used to:
[0024] The processing module is used to calculate the difference between the required plate thickness and the actual plate thickness, obtain the thickness difference, and adjust the initial working conditions of the extrusion device according to the thickness difference.
[0025] Furthermore, the processing module is used to:
[0026] The processing module is used to obtain the thickness difference △T, and the processing module is also used to set a preset actual plate thickness difference T1, a preset actual plate thickness difference T2, a third preset actual plate thickness difference T3 and a fourth preset actual plate thickness difference T4, and T1<T2<T3<T4; the processing module is also used to set a preset adjustment coefficient m1, a preset adjustment coefficient m2, a third preset adjustment coefficient m3 and a fourth preset adjustment coefficient m4, and 0.8<m1<m2<m3<m4<1.2;
[0027] The processing module is used to select a preset adjustment coefficient according to the relationship between the thickness difference △T and each preset actual plate thickness difference Ti to adjust the working conditions in the i-th preset working condition matrix Ai when the i-th preset working condition matrix Ai is selected as the initial working condition of the automatic lifting and extrusion device;
[0028] When △T≤T1, the working conditions in the i-th preset working condition matrix Ai are not adjusted;
[0029] When T1<△T≤T2, the preset adjustment coefficient m1 is selected to adjust Ai, and the adjusted value is Ai(ai*m1,bi*m1);
[0030] When T2<△T≤T3, the preset adjustment coefficient m2 is selected to adjust Ai, and the adjusted value is Ai(ai*m2, bi*m2);
[0031] When T3<△T≤T4, the third preset adjustment coefficient m3 is selected to adjust Ai, and the adjusted value is Ai(ai*m3,bi*m3);
[0032] When T4<ΔT, the fourth preset adjustment coefficient m4 is selected to adjust Ai, and the adjusted coefficient is Ai(ai*m4, bi*m4).
[0033] Furthermore, the screw rod is arranged below the infrared rangefinder, and the screw rod is used to adjust the distance between the infrared rangefinder and the screw rod according to the actual thickness of the plate.
[0034] The present invention also provides a gypsum board thickness automatic measurement adjustment control method, which is characterized by comprising:
[0035] obtaining a required sheet thickness of the gypsum board and setting an initial working condition of the extrusion device based on the required sheet thickness;
[0036] Obtain the actual thickness of the gypsum board produced, and adjust the screw rod so that the distance between the screw rod and the infrared rangefinder is consistent with the actual thickness of the board;
[0037] The actual plate thickness is measured by an infrared rangefinder, and the difference between the required plate thickness and the actual plate thickness is calculated to obtain the thickness difference;
[0038] The initial working condition of the extrusion device is adjusted according to the thickness difference, and the extrusion device is controlled to work according to the adjusted working condition.
[0039] Compared with the prior art, the device and method for automatically measuring and adjusting the thickness of a gypsum board according to the embodiment of the present invention have the following beneficial effects:
[0040] The present invention can timely measure the sheet thickness of the produced gypsum board and quickly feed back to the control unit. The control unit automatically adjusts the working conditions of the extrusion device based on the relationship between the required sheet thickness and the actual sheet thickness, and timely adjusts the sheet thickness of the gypsum board so that the produced gypsum board can meet the actual production requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] Figure 1 It is a schematic diagram of the structure of the automatic measurement and adjustment control device for the thickness of a gypsum board according to an embodiment of the present invention;
[0042] Figure 2 It is a flow chart of the automatic measurement and adjustment control method of the thickness of a gypsum board in an embodiment of the present invention.
[0043] The numbers in the figure are: 1. forming table, 2. extrusion plate, 3. cylinder, 4. screw, 5. infrared rangefinder. DETAILED DESCRIPTION
[0044] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0045] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the platform or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0046] The terms "", "", "" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined with "", "", "" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "multiple" is two or more.
[0047] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technical personnel in this field, the specific meanings of the terms in this application can be understood according to specific circumstances.
[0048] like Figure 1 As shown, in an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, including: a forming table; an extrusion device, arranged above the forming table, and the extrusion device is used to adjust the actual board thickness of the gypsum board; a screw rod, rotatably arranged on the forming table, and the screw rod is used to adjust the distance; an infrared rangefinder, arranged on the extrusion device, and the infrared rangefinder is used to measure the actual board thickness of the gypsum board; a control unit, used to obtain the required board thickness of the gypsum board and the actual board thickness of the produced gypsum board, and control the extrusion device to work based on the relationship between the required board thickness and the actual board thickness.
[0049] Furthermore, the present invention can timely measure the thickness of the gypsum board produced, and quickly feed back to the control unit. The control unit automatically adjusts the working conditions of the extrusion device based on the relationship between the required board thickness and the actual board thickness, and timely adjusts the board thickness of the gypsum board, so that the produced gypsum board can meet the actual production requirements.
[0050] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, wherein the extrusion device comprises: an extrusion plate for extruding the gypsum board; and a cylinder connected above the extrusion plate, wherein the cylinder is used to drive the extrusion plate to move up and down.
[0051] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, and the control unit includes: an acquisition module, used to collect the actual board thickness of the gypsum board after adjustment and the actual board thickness of the gypsum board detected in real time; a processing module, connected to the acquisition module, the processing module is used to obtain the required board thickness of the gypsum board, and set and adjust the working conditions of the extrusion device according to the required board thickness, the actual board thickness and the relationship between the actual board thickness; a control module, connected to the processing module, the control module is used to control the extrusion device to work according to the working conditions.
[0052] Specifically, the acquisition module is responsible for acquiring the actual thickness of the adjusted gypsum board; the processing module is connected to the acquisition module to obtain the required thickness of the gypsum board. It is responsible for setting and adjusting the relationship between the required thickness, the actual thickness and the actual thickness, and adjusting the working conditions of the extrusion device accordingly; the control module is connected to the processing module, and controls the extrusion device to work according to the working conditions generated by the processing module. These modules form a closed-loop feedback system, which ensures that the thickness of the gypsum board meets the requirements through real-time acquisition, processing and control, improves production efficiency and product quality, and reduces human errors.
[0053] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, wherein the processing module is used for: the processing module is used for obtaining the required board thickness △G of the gypsum board, the processing module is used for setting a preset value G0 of the actual board thickness of the gypsum board, the processing module is used for setting a preset difference g1, a preset difference g2, a third preset difference g3 and a fourth preset difference g4, and g1<g2<g3<g4; the processing module is also used for setting a preset working condition matrix A1 (a1, b1), a preset working condition matrix A2 (a2, b2), a third preset working condition matrix A3 (a3, b3) and a fourth preset working condition matrix A4 (a4, b4), wherein a1-a4 are pressures to the fourth preset cylinder respectively, and a1<a2<a3<a4, b1-b4 are sequentially to the stroke of the fourth preset extrusion plate, b1<b2<b3<b4; according to the difference between the actual plate thickness △G of the gypsum board and the preset value G0 of the actual plate thickness of the gypsum board, the preset working condition matrix Ai is selected as the initial working condition of the extrusion device; when △G-G0≤g1, the preset working condition matrix A1 is selected as the initial working condition of the extrusion device; when g1<△G-G0≤g2, the preset working condition matrix A2 is selected as the initial working condition of the extrusion device; when g2<△G-G0≤g3, the third preset working condition matrix A3 is selected as the initial working condition of the extrusion device; when g3<△G-G0≤g4, the fourth preset working condition matrix A4 is selected as the initial working condition of the extrusion device.
[0054] Specifically, the processing module is responsible for obtaining the required sheet thickness △G of the gypsum board, and the processing module is also responsible for setting the preset value G0 of the actual sheet thickness of the gypsum board, which is the reference value for setting production targets; the processing module sets the preset difference values g1, g2, g3, g4, and sets the corresponding preset working condition matrices A1, A2, A3, A4; according to the difference △G-G0 between the actual sheet thickness and the preset value, the processing module selects the corresponding preset working condition matrix as the initial working condition of the extrusion device according to the set difference threshold value. Specifically, when △G-G0 is within different ranges, the corresponding preset working condition matrix will be selected as the initial working condition. This step can automatically adjust the working conditions of the extrusion device according to the actual sheet thickness of the gypsum board in actual production to ensure that the quality of the final product meets the requirements and improve the stability and efficiency of the production line.
[0055] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, and the processing module is used for: the processing module is used to calculate the difference between the required board thickness and the actual board thickness, obtain the thickness difference, and adjust the initial working conditions of the extrusion device according to the thickness difference.
[0056] Specifically, the processing module calculates the difference between the required plate thickness and the actual plate thickness, that is, the thickness difference, and adjusts the initial working conditions of the extrusion device based on this thickness difference. The production process is adjusted in real time according to actual conditions to ensure that the quality of the final product meets the requirements, thereby improving the stability of the production line and the consistency of the products.
[0057] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, and the processing module is used for: the processing module is used to obtain the thickness difference △T, and the processing module is also used to set the preset actual plate thickness difference T1, the preset actual plate thickness difference T2, the third preset actual plate thickness difference T3 and the fourth preset actual plate thickness difference T4, and T1<T2<T3<T4; the processing module is also used to set the preset adjustment coefficient m1, the preset adjustment coefficient m2, the third preset adjustment coefficient m3 and the fourth preset adjustment coefficient m4, and 0.8<m1<m2<m3<m4<1.2; the processing module is used to select the i-th preset working condition matrix Ai as the initial working condition of the automatic lifting and extrusion device according to the relationship between the thickness difference △T and each preset actual plate thickness difference Ti. A preset adjustment coefficient is determined to adjust the working conditions in the i-th preset working condition matrix Ai; when △T≤T1, the working conditions in the i-th preset working condition matrix Ai are not adjusted; when T1<△T≤T2, the preset adjustment coefficient m1 is selected to adjust Ai, and the adjusted value is Ai(ai*m1, bi*m1); when T2<△T≤T3, the preset adjustment coefficient m2 is selected to adjust Ai, and the adjusted value is Ai(ai*m2, bi*m2); when T3<△T≤T4, the third preset adjustment coefficient m3 is selected to adjust Ai, and the adjusted value is Ai(ai*m3, bi*m3); when T4<△T, the fourth preset adjustment coefficient m4 is selected to adjust Ai, and the adjusted value is Ai(ai*m4, bi*m4).
[0058] Specifically, the processing module is responsible for obtaining the difference △T between the required plate thickness and the actual plate thickness; the processing module sets the preset actual plate thickness difference T1, T2, T3, T4, and the corresponding preset adjustment coefficients m1, m2, m3, m4; when a preset working condition matrix Ai is selected as the initial working condition of the automatic lifting and extrusion device, the processing module will select the corresponding preset adjustment coefficient according to the relationship between the thickness difference △T and the preset actual plate thickness difference Ti to adjust the working conditions in the working condition matrix Ai. Specifically, according to the different relationships between △T and Ti, the corresponding adjustment coefficient is selected to adjust the working condition matrix. This step adjusts the working conditions of the extrusion device in real time according to the difference between the actual plate thickness and the required value to ensure the production of products that meet the requirements, which can improve the flexibility of the production line and the stability of product quality.
[0059] In an embodiment of the present application, a gypsum board thickness automatic measurement and adjustment control device is provided, wherein the screw rod is arranged below the infrared rangefinder, and the screw rod is used to adjust the distance between the infrared rangefinder and the screw rod according to the actual board thickness.
[0060] Specifically, the screw rod is arranged directly below the infrared rangefinder, and is used to adjust the distance between the infrared rangefinder and the screw rod according to the actual plate thickness so that the distance is consistent with the actual plate thickness, so that the distance measured by the infrared rangefinder to the screw rod is the actual plate thickness.
[0061] like Figure 2 As shown, in an embodiment of the present application, a method for automatic measurement, adjustment and control of the thickness of a gypsum board is provided, including: S100: obtaining the required board thickness of the gypsum board, and setting the initial working conditions of the extrusion device based on the required board thickness; S200: obtaining the actual board thickness of the produced gypsum board, and adjusting the screw rod so that the distance between the screw rod and the infrared rangefinder is consistent with the actual board thickness; S300: obtaining the actual board thickness by measuring with the infrared rangefinder, and calculating the difference between the required board thickness and the actual board thickness to obtain the thickness difference; S400: adjusting the initial working conditions of the extrusion device according to the thickness difference, and controlling the extrusion device to work according to the adjusted working conditions.
[0062] Specifically, S100: obtain the required sheet thickness of the gypsum board, and set the initial working conditions of the extrusion device based on the required sheet thickness. This step ensures that the working conditions of the extrusion device are pre-set according to the product requirements at the beginning of production; S200: the system obtains the actual sheet thickness of the produced gypsum board, and adjusts the screw rod to make the distance between the screw rod and the infrared rangefinder consistent with the actual sheet thickness. This step ensures that the system can accurately know the actual thickness of each gypsum board through real-time measurement and adjustment; S300: the system measures the actual sheet thickness through the infrared rangefinder, and calculates the difference between the required sheet thickness and the actual sheet thickness to obtain the thickness difference. This step is to obtain the difference between the actual sheet thickness and the required sheet thickness for subsequent adjustment; S400: the system adjusts the initial working conditions of the extrusion device according to the thickness difference, and controls the extrusion device to work according to the adjusted working conditions. The method can adjust the working conditions of the extrusion device in real time according to the actual situation to ensure that the gypsum board produced meets the requirements. The whole process integrates real-time measurement, data calculation and automatic adjustment to ensure product quality and consistency during the production process.
[0063] In summary, the embodiment of the present invention provides a gypsum board thickness automatic measurement and adjustment control device and method, which includes: a forming table; an extrusion device, which is arranged above the forming table and is used to adjust the actual board thickness of the gypsum board; a screw, which is rotatably arranged on the forming table and is used to adjust the distance; an infrared rangefinder, which is arranged on the extrusion device and is used to measure the actual board thickness of the gypsum board; a control unit, which is used to obtain the required board thickness of the gypsum board and the actual board thickness of the produced gypsum board, and control the extrusion device to work based on the relationship between the required board thickness and the actual board thickness. The present invention can timely measure the board thickness of the produced gypsum board to quickly feed back to the control unit, and the control unit automatically adjusts the working conditions of the extrusion device based on the relationship between the required board thickness and the actual board thickness, and timely adjusts the board thickness of the gypsum board, so that the produced gypsum board can meet the actual production requirements.
[0064] Finally, it should be noted that: Obviously, a person skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the present invention and its equivalent technology, the present invention is also intended to include these modifications and variations.
[0065] The above is only an example of implementation of the present invention, but it cannot be used to limit the scope of the present invention. Any structural changes made according to the present invention, as long as they do not lose the essence of the present invention, should be regarded as falling within the scope of protection of the present invention and being restricted. Technical personnel in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process and related instructions of the described platform can refer to the corresponding process in the aforementioned platform embodiment, and will not be repeated here.
[0066] The term "comprises" or any other similar term is intended to cover a non-exclusive inclusion such that a process, platform, article, or apparatus / platform that includes a list of elements includes not only those elements but also other elements not expressly listed or inherent to such process, platform, article, or apparatus / platform.
[0067] So far, the technical solutions of the present invention have been described in conjunction with the further embodiments shown in the accompanying drawings. However, it is easy for a person skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to closely related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.
[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.
Claims
1. A gypsum board thickness automatic measurement and adjustment control device, characterized in that: include: Forming table; An extrusion device is arranged above the forming table, and the extrusion device is used to adjust the actual plate thickness of the gypsum board; A screw rod is rotatably arranged on the forming table, and the screw rod is used to adjust the distance; An infrared rangefinder, arranged on the extrusion device, and used to measure the actual thickness of the gypsum board; The control unit is used to obtain the required board thickness of the gypsum board and the actual board thickness of the produced gypsum board, and control the extrusion device to work based on the relationship between the required board thickness and the actual board thickness.
2. A gypsum board thickness automatic measurement and adjustment control device according to claim 1, characterized in that: The extrusion device comprises: Extruded board, for extruded gypsum board; A cylinder is connected above the extrusion plate, and the cylinder is used to drive the extrusion plate to move up and down.
3. A gypsum board thickness automatic measurement and adjustment control device according to claim 2, characterized in that: The control unit comprises: A collection module, used for collecting the actual sheet thickness of the gypsum board after adjustment and the actual sheet thickness of the gypsum board detected in real time; a processing module connected to the acquisition module, the processing module being used to obtain the required sheet thickness of the gypsum board, and to set and adjust the working conditions of the extrusion device according to the relationship between the required sheet thickness, the actual sheet thickness and the actual sheet thickness; A control module is connected to the processing module, and is used to control the extrusion device to work according to working conditions.
4. A gypsum board thickness automatic measurement and adjustment control device according to claim 3, characterized in that: The processing module is used for: The processing module is used to obtain the required plate thickness △G of the gypsum board, the processing module is also used to set the actual plate thickness preset value G0 of the gypsum board, the processing module is also used to set the preset difference g1, the preset difference g2, the third preset difference g3 and the fourth preset difference g4, and g1<g2<g3<g4; the processing module is also used to set the preset working condition matrix A1 (a1, b1), the preset working condition matrix A2 (a2, b2), the third preset working condition matrix A3 (a3, b3) and the fourth preset working condition matrix A4 (a4, b4), wherein a1-a4 are respectively the pressures to the fourth preset cylinder, and a1<a2<a3<a4, b1-b4 are respectively the strokes of the fourth preset extrusion plate, and b1<b2<b3<b4; According to the difference between the actual plate thickness △G of the gypsum board and the preset value G0 of the actual plate thickness of the gypsum board, a preset working condition matrix Ai is selected as the initial working condition of the extrusion device; When △G-G0≤g1, the preset working condition matrix A1 is selected as the initial working condition of the extrusion device; When g1<△G-G0≤g2, the preset working condition matrix A2 is selected as the initial working condition of the extrusion device; When g2<△G-G0≤g3, the third preset working condition matrix A3 is selected as the initial working condition of the extrusion device; When g3<ΔG-G0≤g4, the fourth preset working condition matrix A4 is selected as the initial working condition of the extrusion device.
5. A gypsum board thickness automatic measurement and adjustment control device according to claim 4, characterized in that: The processing module is used for: The processing module is used to calculate the difference between the required plate thickness and the actual plate thickness, obtain the thickness difference, and adjust the initial working conditions of the extrusion device according to the thickness difference.
6. The device for automatically measuring and adjusting the thickness of a gypsum board according to claim 5, characterized in that: The processing module is used for: The processing module is used to obtain the thickness difference △T, and the processing module is also used to set a preset actual plate thickness difference T1, a preset actual plate thickness difference T2, a third preset actual plate thickness difference T3 and a fourth preset actual plate thickness difference T4, and T1<T2<T3<T4; the processing module is also used to set a preset adjustment coefficient m1, a preset adjustment coefficient m2, a third preset adjustment coefficient m3 and a fourth preset adjustment coefficient m4, and 0.8<m1<m2<m3<m4<1.2; The processing module is used to select a preset adjustment coefficient according to the relationship between the thickness difference △T and each preset actual plate thickness difference Ti to adjust the working conditions in the i-th preset working condition matrix Ai when the i-th preset working condition matrix Ai is selected as the initial working condition of the automatic lifting and extrusion device; When △T≤T1, the working conditions in the i-th preset working condition matrix Ai are not adjusted; When T1<△T≤T2, the preset adjustment coefficient m1 is selected to adjust Ai, and the adjusted value is Ai(ai*m1,bi*m1); When T2<△T≤T3, the preset adjustment coefficient m2 is selected to adjust Ai, and the adjusted value is Ai(ai*m2, bi*m2); When T3<△T≤T4, the third preset adjustment coefficient m3 is selected to adjust Ai, and the adjusted value is Ai(ai*m3,bi*m3); When T4<ΔT, the fourth preset adjustment coefficient m4 is selected to adjust Ai, and the adjusted coefficient is Ai(ai*m4, bi*m4).
7. A method for automatically measuring and adjusting the thickness of a gypsum board according to claim 1, characterized in that: The screw rod is arranged below the infrared rangefinder, and is used to adjust the distance between the infrared rangefinder and the screw rod according to the actual thickness of the plate.
8. A method for automatically measuring and adjusting the thickness of a gypsum board, characterized in that: include: obtaining a required sheet thickness of the gypsum board and setting an initial working condition of the extrusion device based on the required sheet thickness; Obtain the actual thickness of the gypsum board produced, and adjust the screw rod so that the distance between the screw rod and the infrared rangefinder is consistent with the actual thickness of the board; The actual plate thickness is measured by an infrared rangefinder, and the difference between the required plate thickness and the actual plate thickness is calculated to obtain the thickness difference; The initial working condition of the extrusion device is adjusted according to the thickness difference, and the extrusion device is controlled to work according to the adjusted working condition.