Deep hole processing device special for semiconductor

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a deep hole processing device special for a semiconductor, a mounting bottom box is fixedly connected to the bottom of a mounting top plate, a protruding rotating cylinder is slidably clamped to the bottom of the mounting bottom box, a limiting sliding strip is arranged on the outer side of the protruding rotating cylinder, and the limiting sliding strip is slidably clamped to the mounting bottom box; a protection rotating ring is rotatably connected to the inner side of the protruding rotating cylinder, a protection mounting column is fixedly connected to the inner side of the protection rotating ring, an adjusting groove is formed in the protection mounting column, and a moving groove is formed in the protection mounting column. By means of a series of mechanical linkage devices, accurate positioning and direction adjustment of the machining head are achieved, the strict requirement for deep hole machining in the semiconductor industry is met, the machining efficiency is improved, the machining quality is guaranteed, and workpieces and tools are protected.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor-specific deep hole processing device. Background Art

[0002] With the continuous improvement of semiconductor technology and the expansion of its application fields, the demand for semiconductor deep hole processing is also increasing. In order to meet this demand, processing equipment and technology need to be continuously innovated and developed.

[0003] In the prior art, the materials used in semiconductor deep hole processing are mostly hard and brittle materials, such as single crystal silicon, silicon carbide, quartz glass, etc. These materials are prone to edge collapse and short tool life during processing, and have extremely high requirements on the surface quality and precision of the workpiece, requiring the workpiece and tools to be protected; for this reason, the present invention provides a semiconductor-specific deep hole processing device. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor-specific deep hole processing device to solve the problems raised in the above-mentioned background technology.

[0005] The technical solution of the present invention is: a semiconductor-specific deep hole processing device, comprising a processing base and a mounting top plate, the bottom of the mounting top plate is fixedly connected to a mounting bottom box, the bottom of the mounting bottom box is slidably engaged with a protruding rotating cylinder, the outer side of the protruding rotating cylinder is provided with a limiting slide bar, the limiting slide bar is slidably engaged with the mounting bottom box, the inner side of the protruding rotating cylinder is rotatably connected to a protective rotating ring, the inner side of the protective rotating ring is fixedly connected to a protective mounting column, the interior of the protective mounting column is provided with an adjustment groove, the interior of the protective mounting column is provided with a moving groove, and the bottom of the protective mounting column is provided with a rotating groove. The adjusting slot is connected with the moving slot through a rotating slot, the adjusting slot has a main sliding rod slidably connected inside the adjusting slot, and a secondary sliding rod slidably connected inside the moving slot, the bottom of the main sliding rod is fixedly connected with a fixed rotating shaft, the outer side of the fixed rotating shaft is rotatably connected with a processing mounting plate, a processing module is installed at the bottom of the processing mounting plate, the inner side of the secondary sliding rod is fixedly connected with a sliding rotating shaft, the inner side of the processing mounting plate is provided with a sliding hole, the sliding rotating shaft is slidably connected in the sliding hole, the inner side of the mounting top plate is fixedly connected with a rotating motor, the output end of the rotating motor is fixedly connected with a rotating top shaft, the secondary sliding rod is fixedly connected with a sliding rotating shaft, and the processing mounting plate is provided with a sliding hole. The sliding rotating shaft is slidably connected in the sliding hole. The inner side of the mounting top plate is fixedly connected with a rotating motor, and the output end of the rotating motor is fixedly connected with a rotating top shaft. The slide bar is fixedly connected to the bottom of the rotating top shaft, the main slide bar is slidably engaged with the inside of the rotating top shaft, the outer side of the rotating top shaft is rotatably connected with an external threaded ring, the external threaded ring is threadedly connected to the inside of the protruding rotating cylinder, the top of the external threaded ring is fixedly connected with a protruding disk, and the outer side of the protruding disk is provided with an external toothed ring; when in use: when processing, the protective mounting column enters the interior of the workpiece, and the processing module is located inside the protective mounting column. Through the protection of the protective mounting column, the workpiece or the processing module is prevented from being touched and damaged when not being processed, and the rotation of the external toothed ring is controlled to drive the protruding disk Rotation drives the external thread ring to rotate, and the protruding rotating cylinder is limited by the limiting slide bar, and the protruding rotating cylinder is moved up through thread transmission, driving the protective rotating ring to move up, driving the protective mounting column to move up, and the main slide bar and the auxiliary slide bar are fixed to expose the processing head of the processing module to process the bottom of the deep hole of the workpiece. By controlling the main slide bar to move up and down, the auxiliary slide bar is fixed, and the sliding shaft is fixed, the fixed shaft will be pushed downward to make the sliding shaft move along the sliding hole, and the processing plate will gradually rotate to make the processing module rotate and align with the side wall of the hole, and then the protective mounting column is rotated as a whole, so that the processing module can process the side wall of the deep hole of the workpiece.

[0006] Preferably, the top of the main sliding rod is fixedly connected with a sliding bar bar, the outer side of the rotating top shaft is provided with an outer push groove, and an adjusting block is slidably engaged in the outer push groove, and the adjusting block is fixedly connected to the top of the sliding bar bar, and the interior of the mounting top plate is fixedly connected with two adjusting push cylinders, the output end of the adjusting push cylinder is fixedly connected with an adjusting push plate, the inner side of the adjusting push plate is rotatably connected with an adjusting push plate, and the adjusting block is fixedly connected to the inner side of the adjusting push plate, and the bottom of the mounting bottom box is fixedly connected with a protruding motor, and the output end of the protruding motor is fixedly connected with a protruding gear, and the protruding gear and the outer gear ring are meshed with each other, and a workpiece module is installed on the top of the processing base, and one side of the processing base is fixedly connected to the mounting base, and the mounting base A rotating shaft box is fixedly connected inside, a vertical electric cylinder is installed on the inner side of the rotating shaft box, an output end of the vertical electric cylinder is fixedly connected to a vertical mounting plate, a horizontal electric cylinder is installed inside the vertical mounting plate, and an output end of the horizontal electric cylinder is fixedly connected to the mounting top plate; when in use: by setting the rotating shaft box, the vertical electric cylinder and the horizontal electric cylinder, the up and down movement and position of the mounting top plate are controlled, the adjustment push plate is pushed downward by the adjustment push cylinder, the adjustment push plate is moved downward, and the adjustment slider pushes the slide bar downward, so as to control the rotation of the processing mounting plate, the probe gear is driven to rotate by the probe motor, the probe gear is meshed with the outer gear ring, the power of the rotation of the probe plate is used to drive the rotating top shaft through the rotating motor, and the protective mounting column is driven to rotate, so that the processing module can adjust the processing direction.

[0007] The present invention provides a semiconductor-specific deep hole processing device through improvement, which has the following improvements and advantages compared with the prior art: First, the semiconductor-specific deep hole processing device described in the present invention, during processing, the protective mounting column enters the interior of the workpiece, and the processing module is located inside the protective mounting column. Through the protection of the protective mounting column, the workpiece or the processing module is prevented from being touched and damaged when not processed. By controlling the rotation of the outer gear ring, the probe disk is driven to rotate, and the outer thread ring is driven to rotate. The probe rotating cylinder is limited by the limiting slide bar, and the probe rotating cylinder is moved up through the thread transmission, which drives the protective rotating ring to move up and drives the protective mounting column to move up. The main slide bar and the auxiliary slide bar are fixed to expose the processing head of the processing module to process the bottom of the deep hole of the workpiece. By controlling the main slide bar to move up and down, the auxiliary slide bar is fixed, and the sliding shaft is fixed, the fixed shaft will be pushed downward to make the sliding shaft move along the sliding hole. The processing plate is gradually rotated to rotate the processing module to align with the side wall of the hole, and then the protective mounting column is rotated as a whole, so that the processing module can process the side wall of the deep hole of the workpiece. Second, the semiconductor-specific deep hole processing device described in the present invention controls the up and down movement and position of the mounting top plate by setting a rotating shaft box, a vertical electric cylinder and a horizontal electric cylinder, pushes the adjustment push plate downward by adjusting the push cylinder, moves the adjustment push plate downward, and makes the adjustment slider push the slide bar downward, thereby controlling the rotation of the processing mounting plate, drives the probe gear to rotate by the probe motor, and the probe gear meshes with the outer gear ring, and drives the rotating top shaft through the rotating motor through the power of the rotation of the probe plate, drives the protective mounting column to rotate, so that the processing module can adjust the processing direction; Summary: The semiconductor-specific deep hole processing device described in the present invention has high flexibility and accuracy, and can realize precise control of deep hole processing. Through a series of mechanical linkage devices, it realizes precise positioning and direction adjustment of the processing head, thereby meeting the strict requirements of the semiconductor industry for deep hole processing. The device not only improves the processing efficiency, but also ensures the processing quality and protects the workpiece and tools. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments: Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the structure of the processing base of the present invention; Figure 3 It is a schematic diagram of the installation top plate structure of the present invention; Figure 4 It is a schematic diagram of the structure of the rotating electrical machine of the present invention; Figure 5 It is a schematic diagram of the structure of the probe plate of the present invention; Figure 6 It is a schematic diagram of the rotating top shaft structure of the present invention; Figure 7 It is a schematic diagram of the structure of the protruding drum of the present invention; Figure 8 It is a schematic diagram of the main slide bar structure of the present invention; Fig. 9 It is a schematic diagram of the processing and mounting structure of the present invention; Fig.10 It is a cross-sectional schematic diagram of the protective mounting column of the present invention.

[0009] Description of reference numerals: 1. Processing base; 2. Workpiece module; 3. Installing base; 4. Installing top plate; 5. Rotating shaft box; 6. Vertical electric cylinder; 7. Vertical mounting plate; 8. Horizontal electric cylinder; 9. Installing bottom box; 10. Rotating motor; 11. Adjusting push cylinder; 12. Adjusting push plate; 13. Adjusting push plate; 14. Adjusting slider; 15. Extending motor; 16. Extending gear; 17. Rotating top shaft; 18. Extending plate; 19. Protective mounting column; 20. Extending rotating cylinder; 21. External threaded ring; 22. External gear ring; 23. Limiting slide bar; 24. Protective swivel; 25. Main slide bar; 26. Slide bar; 27. Auxiliary slide bar; 28. Processing mounting plate; 29. ​​Fixed rotating shaft; 30. Processing module; 31. Sliding rotating shaft. DETAILED DESCRIPTION

[0010] The present invention is described in detail below, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0011] The present invention provides a semiconductor-specific deep hole processing device through improvement. The technical solution of the present invention is: like Figure 1-Figure 10As shown, a semiconductor-specific deep hole processing device comprises a processing base 1 and a mounting top plate 4. The bottom of the mounting top plate 4 is fixedly connected with a mounting bottom box 9. The bottom of the mounting bottom box 9 is slidably engaged with a protruding rotating cylinder 20. A limiting slide bar 23 is provided on the outer side of the protruding rotating cylinder 20. The limiting slide bar 23 is slidably engaged with the mounting bottom box 9. A protective rotating ring 24 is rotatably connected to the inner side of the protruding rotating cylinder 20. A protective mounting column 19 is fixedly connected to the inner side of the protective rotating ring 24. An adjustment groove is provided inside the protective mounting column 19. A moving groove is provided inside the protective mounting column 19. A rotating groove is provided at the bottom of the protective mounting column 19. The adjustment groove is connected to the moving groove through the rotating groove. The main slide bar 25 is slidably connected to the bottom of the movable groove, and the auxiliary slide bar 27 is slidably connected to the inside of the movable groove. The bottom of the main slide bar 25 is fixedly connected to a fixed shaft 29, and the outer side of the fixed shaft 29 is rotatably connected to a processing plate 28. A processing module 30 is installed at the bottom of the processing plate 28. The inner side of the auxiliary slide bar 27 is fixedly connected to a sliding shaft 31. A sliding hole is opened on the inner side of the processing plate 28. The sliding shaft 31 is slidably connected to the sliding hole. The inner side of the mounting top plate 4 is fixedly connected to a rotating motor 10. The output end of the rotating motor 10 is fixedly connected to a rotating top shaft 17. The auxiliary slide bar 27 is fixedly connected to the bottom of the rotating top shaft 17. The main slide bar 25 is slidably connected to the rotating top shaft 17. Internally, the outer side of the rotating top shaft 17 is rotatably connected with an external threaded ring 21, and the external threaded ring 21 is threadedly connected to the inside of the protruding rotating drum 20. The top of the external threaded ring 21 is fixedly connected with a protruding disk 18, and the outer side of the protruding disk 18 is provided with an external toothed ring 22. When in use: when processing, the protective mounting column 19 enters the interior of the workpiece, and the processing module 30 is located inside the protective mounting column 19. Through the protection of the protective mounting column 19, when not processing, the workpiece or the processing module 30 is prevented from being touched and damaged. By controlling the rotation of the external toothed ring 22, the rotation of the protruding disk 18 is driven to drive the rotation of the external threaded ring 21, and the protruding rotating drum 20 is limited by the limiting slide bar 23, and through thread transmission, The protruding rotating cylinder 20 moves upward, driving the protective rotating ring 24 to move upward, driving the protective mounting column 19 to move upward, and the main slide bar 25 and the auxiliary slide bar 27 are fixed, so that the processing head of the processing module 30 is exposed to process the bottom of the deep hole of the workpiece. By controlling the main slide bar 25 to move up and down, the auxiliary slide bar 27 is fixed, and the sliding shaft 31 is fixed, the fixed shaft 29 is pushed downward, and the sliding shaft 31 moves along the sliding hole. The processing plate 28 gradually rotates, and the processing module 30 rotates to align with the side wall of the hole. Then the protective mounting column 19 rotates as a whole, so that the processing module 30 can process the side wall of the deep hole of the workpiece, and the processing plate 28 can be expanded inside the deep hole. It can be used for deep holes with small mouths and large insides.

[0012] Furthermore, a slide bar 26 is fixedly connected to the top of the main slide bar 25, an outer push groove is opened on the outer side of the rotating top shaft 17, and an adjustment slider 14 is slidably engaged in the outer push groove, and the adjustment slider 14 is fixedly connected to the top of the slide bar 26, and two adjustment push cylinders 11 are fixedly connected to the inside of the mounting top plate 4, and the output end of the adjustment push cylinder 11 is fixedly connected to the adjustment push plate 12, and the inner side of the adjustment push plate 12 is rotatably connected to the adjustment push plate 13, and the adjustment slider 14 is fixedly connected to the inner side of the adjustment push plate 13, and the bottom of the mounting bottom box 9 is fixedly connected to the protrusion motor 15, and the output end of the protrusion motor 15 is fixedly connected to the protrusion gear 16, and the protrusion gear 16 is meshed with the outer gear ring 22, and a workpiece module 2 is installed on the top of the processing base 1, and a mounting base 3 is fixedly connected to one side of the processing base 1, and a rotating shaft is fixedly connected to the inside of the mounting base 3. Box 5, a vertical electric cylinder 6 is installed on the inner side of the rotating shaft box 5, and the output end of the vertical electric cylinder 6 is fixedly connected to the vertical mounting plate 7, and a horizontal electric cylinder 8 is installed inside the vertical mounting plate 7, and the output end of the horizontal electric cylinder 8 is fixedly connected to the mounting top plate 4; when in use: by setting the rotating shaft box 5, the vertical electric cylinder 6 and the horizontal electric cylinder 8, the up and down movement and position of the mounting top plate 4 are controlled, and the adjustment push cylinder 11 pushes the adjustment push plate 12 downward to make the adjustment push disk 13 move downward, and the adjustment slider 14 pushes the slide bar 26 downward, so as to control the rotation of the processing mounting plate 28, and the probe motor 15 drives the probe gear 16 to rotate, and the probe gear 16 is meshed with the outer gear ring 22. The power of the rotation of the probe disk 18 drives the rotating top shaft 17 through the rotating motor 10, and drives the protective mounting column 19 to rotate, so that the processing module 30 can adjust the processing direction.

[0013] Working principle: When in use: During processing, the protective mounting column 19 enters the interior of the workpiece, and the processing module 30 is located inside the protective mounting column 19. Through the protection of the protective mounting column 19, when not processing, the workpiece or the processing module 30 is prevented from being damaged by contact. By controlling the rotation of the outer gear ring 22, the probe disk 18 is driven to rotate, and the outer threaded ring 21 is driven to rotate. The probe rotating cylinder 20 is limited by the limiting slide bar 23, and the probe rotating cylinder 20 is moved up through the threaded transmission, driving the protective rotating ring 24 to move up, driving the protective mounting column 19 to move up, the main slide bar 25 and the auxiliary slide bar 27 are fixed, so that the processing head of the processing module 30 is exposed, and the bottom of the deep hole of the workpiece is processed. By controlling the main slide bar 25 to move up and down, the auxiliary slide bar 27 is fixed, and the sliding shaft 31 is fixed, the fixed shaft 29 is pushed downward, so that the sliding shaft 31 is fixed. The movable rotating shaft 31 moves along the sliding hole, and the processing mounting plate 28 gradually rotates, so that the processing module 30 rotates and aligns with the side wall of the hole, and then the protective mounting column 19 rotates as a whole, so that the processing module 30 can process the side wall of the deep hole of the workpiece. By setting the rotating shaft box 5, the vertical electric cylinder 6 and the horizontal electric cylinder 8, the up and down movement and position of the mounting top plate 4 are controlled, and the adjustment push plate 12 is pushed down by the adjustment push cylinder 11 to move the adjustment push plate 13 down, and the adjustment slider 14 pushes the slide bar 26 down, so as to control the rotation of the processing mounting plate 28, and the extension motor 15 drives the extension gear 16 to rotate, and the extension gear 16 is meshed with the outer gear ring 22. The power of the rotation of the extension disk 18 drives the rotating top shaft 17 through the rotating motor 10, and drives the protective mounting column 19 to rotate, so that the processing module 30 can adjust the processing direction.

[0014] The above description enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor-specific deep hole processing device, comprising a processing base (1) and a mounting top plate (4), characterized in that: The bottom of the mounting top plate (4) is fixedly connected to a mounting bottom box (9), the bottom of the mounting bottom box (9) is slidably engaged with a protruding rotating cylinder (20), a limiting slide bar (23) is provided on the outer side of the protruding rotating cylinder (20), the limiting slide bar (23) is slidably engaged with the mounting bottom box (9), the inner side of the protruding rotating cylinder (20) is rotatably connected to a protective rotating ring (24), the inner side of the protective rotating ring (24) is fixedly connected to a protective mounting column (19), and the interior of the protective mounting column (19) is provided with an adjustment A movable groove is provided inside the protective mounting column (19), a rotating groove is provided at the bottom of the protective mounting column (19), the adjustment groove is connected to the movable groove through the rotating groove, a main slide bar (25) is slidably connected inside the adjustment groove, a secondary slide bar (27) is slidably connected inside the movable groove, a fixed rotating shaft (29) is fixedly connected to the bottom of the main slide bar (25), a processing plate (28) is rotatably connected to the outer side of the fixed rotating shaft (29), and a processing module (30) is installed at the bottom of the processing plate (28).

2. A semiconductor-specific deep hole processing device according to claim 1, characterized in that: A sliding shaft (31) is fixedly connected to the inner side of the auxiliary sliding rod (27), a sliding hole is opened on the inner side of the processing mounting plate (28), and the sliding shaft (31) is slidably engaged in the sliding hole.

3. A semiconductor-specific deep hole processing device according to claim 2, characterized in that: A rotating motor (10) is fixedly connected to the inner side of the mounting top plate (4), an output end of the rotating motor (10) is fixedly connected to a rotating top shaft (17), the auxiliary sliding rod (27) is fixedly connected to the bottom of the rotating top shaft (17), and the main sliding rod (25) is slidably engaged with the inside of the rotating top shaft (17).

4. A semiconductor-specific deep hole processing device according to claim 3, characterized in that: The top of the main slide bar (25) is fixedly connected to a slide bar (26); the outer side of the rotating top shaft (17) is provided with an outer push groove, in which an adjustment slider (14) is slidably engaged; the adjustment slider (14) is fixedly connected to the top of the slide bar (26); the inside of the mounting top plate (4) is fixedly connected to two adjustment push cylinders (11); the output end of the adjustment push cylinder (11) is fixedly connected to an adjustment push plate (12); the inner side of the adjustment push plate (12) is rotatably connected to an adjustment push disk (13); and the adjustment slider (14) is fixedly connected to the inner side of the adjustment push disk (13).

5. A semiconductor-specific deep hole processing device according to claim 4, characterized in that: An external threaded ring (21) is rotatably connected to the outer side of the rotating top shaft (17), and the external threaded ring (21) is threadedly connected to the inside of the protruding rotating drum (20). A protruding disc (18) is fixedly connected to the top of the external threaded ring (21), and an external gear ring (22) is provided on the outer side of the protruding disc (18).

6. A semiconductor-specific deep hole processing device according to claim 5, characterized in that: The bottom of the mounting bottom box (9) is fixedly connected to a protruding motor (15), the output end of the protruding motor (15) is fixedly connected to a protruding gear (16), and the protruding gear (16) is meshed with an outer gear ring (22).

7. The semiconductor-specific deep hole processing device according to claim 1, characterized in that: A workpiece module (2) is installed on the top of the processing base (1); a mounting base (3) is fixedly connected to one side of the processing base (1); a rotating shaft box (5) is fixedly connected inside the mounting base (3); a vertical electric cylinder (6) is installed inside the rotating shaft box (5); an output end of the vertical electric cylinder (6) is fixedly connected to a vertical mounting plate (7); a horizontal electric cylinder (8) is installed inside the vertical mounting plate (7); and the output end of the horizontal electric cylinder (8) is fixedly connected to the mounting top plate (4).

Images