Copper dissolving system for iron ion copper plating and ion concentration control method

Abstract

The invention relates to the field of electroplating, and discloses a copper dissolving system for iron ion copper plating and an ion concentration control method. The copper dissolving system comprises: a copper dissolving main tank in which a copper dissolving space for storing a reaction liquid medicine is formed; the winding and unwinding mechanism is arranged opposite to the copper dissolving main tank, and the winding and unwinding mechanism is in transmission connection with each copper storage part so as to control the copper storage parts to stretch into or break away from the copper dissolving space; the ion detection device is used for detecting the ion concentration in the main copper dissolving tank, and the number of the copper storage pieces placed in the main copper dissolving tank is determined by the ion concentration; a copper storage space used for storing copper materials is formed in the copper storage part, the copper storage part is further provided with an overflowing structure, and under the condition that the copper storage part stretches into the copper dissolving space, the copper storage space communicates with the copper dissolving space through the overflowing structure. The ion concentration is monitored through the ion concentration detection device, and the copper storage piece is controlled to extend into or be separated from the copper dissolving main tank through the retracting and releasing mechanism, so that the ion concentration in the liquid medicine is accurately controlled.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, and in particular to a copper dissolving system for iron ion copper plating and an ion concentration control method. Background Art

[0002] In the related art, in the field of PCB (printed circuit board) copper electroplating, the traditional copper plating methods are mainly divided into two types: (1) Soluble anode electroplating: electroplating by adding phosphor copper balls. The advantage of this method is that the process is mature and the operation is simple, but the cost is relatively high. (2) Insoluble anode electroplating: electroplating by adding copper oxide powder. Although this method reduces the consumption of anode materials, it may encounter the problem of insufficient stability in practical applications.

[0003] With the development of technology, the iron ion copper plating system has been proposed and gradually applied in laboratory and small-scale production environments. This system uses a copper rod as an anode material to react with a solution containing iron ions under specific conditions to generate copper ions. However, it is difficult to control the ion concentration in the existing iron ion copper plating system, and the dynamic balance between iron ions, ferrous ions and copper ions is difficult to maintain, resulting in unstable product quality. The existing system lacks effective means to monitor and adjust the concentration of these ions in real time. Summary of the invention

[0004] In view of this, the present invention provides a copper dissolving system and an ion concentration control method for iron ion copper plating to solve the problem that the ion concentration cannot be accurately controlled in the related art.

[0005] In a first aspect, the present invention provides a copper dissolving system for iron ion copper plating, comprising:

[0006] The main copper dissolving tank has a copper dissolving space formed inside for storing the reaction liquid;

[0007] At least two copper storage members and a retracting mechanism, wherein the retracting mechanism is arranged opposite to the copper dissolving main tank, and the retracting mechanism is respectively connected to each of the copper storage members in a transmission manner to control the copper storage members to extend into or out of the copper dissolving space;

[0008] An ion detection device, used for detecting the ion concentration in the copper dissolving main tank, and the number of copper storage parts placed in the copper dissolving main tank is determined by the ion concentration;

[0009] A copper storage space for storing copper material is formed inside the copper storage member, and the copper storage member is also provided with a flow structure. When the copper storage member extends into the copper dissolving space, the copper storage space is connected with the copper dissolving space through the flow structure.

[0010] Beneficial effect: The ion concentration is monitored by the ion concentration detection device, and the copper storage piece is controlled to extend into or out of the main copper dissolving tank by the retracting and releasing mechanism, thereby realizing accurate control of the ion concentration in the liquid medicine.

[0011] In an optional embodiment, the top of the copper dissolving main tank is open to form an inlet and outlet, and the retractable mechanism is located above the copper dissolving main tank and is arranged opposite to the inlet and outlet;

[0012] The retractable mechanism comprises at least two automatic lifting devices, and each of the automatic lifting devices is respectively connected in transmission with at least one of the copper storage members.

[0013] Beneficial effects: Since the top of the main copper dissolving tank is open, the copper storage parts can be directly put in or taken out from above, which simplifies the operation process and reduces the need for manual intervention. At the same time, the design of multiple automatic lifting devices enables the movement of each copper storage part to be controlled individually, avoiding the error accumulation problem that may be caused by a traditional single control point, and ensuring the stability and reliability of the system.

[0014] In an optional embodiment, the top of the copper storage member is open to form a feed inlet, the bottom or side wall of the copper storage member is formed with the flow structure, and the size of the flow structure is smaller than the size of the copper material.

[0015] Beneficial effect: The open top design makes it very simple to add copper materials. Operators can directly put the copper materials into the feed port, reducing cumbersome operating steps and improving work efficiency.

[0016] On the one hand, the design of the flow structure ensures that the liquid medicine can smoothly enter the copper storage part and fully contact with the copper material, promoting the occurrence of chemical reactions. This not only speeds up the reaction speed, but also improves the efficiency of copper ion generation. On the other hand, by precisely controlling the size of the flow structure, it ensures that the copper material will not leak out of the copper storage part during the reaction, avoiding potential safety hazards and material waste.

[0017] In an optional embodiment, the flow structure includes a liquid inlet hole and a liquid outlet hole, a plurality of the liquid inlet holes are formed on the bottom of the copper storage member, and a plurality of the liquid outlet holes are formed on the side wall of the copper storage member.

[0018] Beneficial effects: The multiple liquid inlet holes at the bottom ensure that the liquid medicine can quickly and evenly enter the copper storage part and fully contact the copper material; the multiple liquid outlet holes on the side wall ensure that the liquid medicine after the reaction can be discharged in time to avoid retention. This design significantly improves the circulation efficiency of the liquid medicine and promotes the occurrence of chemical reactions.

[0019] In an optional embodiment, a reinforcing bracket is provided on the outer side of the copper storage member, and the reinforcing bracket is arranged around the outer peripheral wall of the copper storage member and avoids the feed port.

[0020] Beneficial effect: The existence of the reinforced bracket significantly enhances the compressive resistance of the copper storage device, especially when the copper storage device is filled with copper materials, effectively preventing the copper storage device from bending or breaking during the lifting process, thereby extending the service life of the equipment.

[0021] In an optional embodiment, the copper dissolving system further comprises:

[0022] The raw material conveying mechanism comprises an automatic conveying device and a collecting box. The automatic conveying device is used to convey the copper material into the collecting box. A discharge port is formed on the collecting box and is connected with the feed port of the copper storage member through the discharge port.

[0023] Beneficial effects: The raw material conveying mechanism realizes the fully automatic conveying and delivery of copper materials, greatly improving production efficiency and reducing labor costs. The system can quickly adjust the speed and amount of material conveying according to actual needs to adapt to different production rhythms.

[0024] At the same time, the automated conveying process reduces the chances of operators coming into direct contact with heavy materials, reduces safety risks, and ensures that each material delivery is accurate, avoiding safety hazards caused by human errors.

[0025] In an optional embodiment, the discharge port is formed at the bottom of the collecting box, the number of the collecting boxes is equal to the number of the copper storage members, and a corresponding copper storage member is provided under each of the collecting boxes.

[0026] Beneficial effects: The one-to-one matching design ensures that the material can enter the corresponding copper storage accurately, so that each copper storage can be replenished with material, reducing the possibility of manual intervention and improving the safety and reliability of operation. In addition, by setting the position of the discharge port and the feed port of the copper storage relative to each other, it is ensured that the copper material can enter the copper storage accurately, avoiding the safety hazards caused by human errors.

[0027] In an optional embodiment, the automatic conveying device includes a plurality of conveying drive members, a plurality of rollers and an annular conveyor belt composed of a plurality of interconnected conveying boxes, the conveying drive members are drivingly connected to the rollers, and the rollers are drivingly connected to the annular conveyor belt, wherein the conveying drive members are used to drive the annular conveyor belt to move in a circular motion via the rollers so that the conveying boxes convey the copper material into the collection box.

[0028] Beneficial effects: Through the above-mentioned specific structural design, the automatic conveying device not only realizes the efficient and safe transportation of copper materials, but also significantly improves the overall performance and reliability of the copper dissolving system.

[0029] In an optional embodiment, the copper dissolving system further comprises:

[0030] The material transport mechanism comprises an automatic lifting device, a material placement table and a vibration plate, wherein the automatic lifting device is used to automatically lift the material onto the material placement table, and the material placement table is located above the vibration plate and is detachable relative to the vibration plate, and the vibration plate is connected to the conveying box;

[0031] When the material placement table is disassembled, the copper material is suitable for falling into the vibration plate and being distributed into the plurality of conveying boxes through the vibration plate.

[0032] Beneficial effects: The material transport mechanism realizes fully automatic operation from material lifting to distribution, reducing the need for manual handling, reducing labor intensity and improving work efficiency. The system can also quickly adjust the speed and amount of material transportation according to actual needs, adapt to different production rhythms, and ensure production continuity.

[0033] The automated lifting and distribution process reduces the chances of operators coming into direct contact with heavy materials, reducing safety risks. In addition, the uniform distribution of the vibrating plate ensures that each material placement is accurate, avoiding safety hazards caused by human error.

[0034] In an optional embodiment, the copper dissolving system further includes a liquid medicine collecting tank, which is located outside the copper dissolving main tank, and an overflow plate is provided between the liquid medicine collecting tank and the copper dissolving main tank, and an overflow port is defined at the top of the overflow plate, and the reacted liquid medicine in the copper dissolving main tank is suitable for flowing into the liquid medicine collecting tank through the overflow port.

[0035] Beneficial effects: The liquid collection tank not only realizes the safe and efficient collection of liquid after reaction, but also significantly improves the overall performance and reliability of the copper dissolving system. In particular, the design of the overflow plate ensures that the liquid will flow into the collection tank only when it reaches a certain height, thus avoiding unnecessary loss of liquid and improving the safety and environmental protection of the operation.

[0036] In a second aspect, the present invention further provides an ion concentration control method, which is applied to the copper dissolving system for iron ion copper plating described in the embodiment of the first aspect of the present invention, and the method comprises:

[0037] Based on the ion detection device, obtaining the ion concentration in the copper dissolving main tank;

[0038] Determining the target number of copper storage parts in the copper dissolving main tank according to the ion concentration;

[0039] According to the target number of copper storage pieces, the retracting and releasing mechanism is controlled to perform retracting and releasing operations on a plurality of the copper storage pieces.

[0040] Beneficial effects: Through the coordinated work of the ion detection device and the retractable mechanism, the automatic monitoring and adjustment of the ion concentration is realized, the need for manual intervention is reduced, and the automation level of the system is improved. At the same time, based on the real-time monitoring data, the system can quickly respond to changes in ion concentration, ensuring that the copper dissolving process is always in the best state, avoiding the safety hazards caused by excessively high or low ion concentrations. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A front view of a copper dissolving system for iron ion copper plating according to an embodiment of the present invention;

[0043] Figure 2 for Figure 1 A top view of a copper dissolving system for iron ion copper plating is shown;

[0044] Figure 3 for Figure 1 A side view of a copper dissolving system for iron ion copper plating is shown;

[0045] Figure 4 It is a partial structural schematic diagram of a copper dissolving system according to an embodiment of the present invention when a copper storage part is located in a copper dissolving main tank;

[0046] Figure 5 This is a schematic structural diagram of a copper storage member according to an embodiment of the present invention;

[0047] Figure 6 It is a structural schematic diagram of a material conveying mechanism according to an embodiment of the present invention;

[0048] Figure 7 Schematic diagram of the flow of the ion concentration control method according to an embodiment of the present invention.

[0049] Description of reference numerals:

[0050] 1. Main copper dissolving tank; 11. Copper dissolving space; 12. Inlet and outlet; 2. Copper storage parts; 21. Feeding port; 22. Liquid inlet hole; 23. Liquid outlet hole; 24. Strengthening bracket; 3. Automatic lifting device; 4. Collection box; 41. Discharging port;

[0051] 51. Transmission drive member; 52. Roller; 53. Annular conveyor belt; 54. Conveyor box; 6. Automatic lifting device; 7. Material placement table; 8. Vibrating plate; 9. Liquid medicine collection tank; 91. Overflow plate; 10. Material bag. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0053] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0054] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0055] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] A copper dissolving system for iron ion copper plating and an ion concentration control method provided by the present invention are introduced below with reference to the accompanying drawings, wherein the ion concentration control method provided by the present invention is implemented based on the copper dissolving system for iron ion copper plating provided by the present invention.

[0057] like Figures 1 to 6 As shown, the copper dissolving system for iron ion copper plating according to the first embodiment of the present invention includes a copper dissolving main tank 1, at least two copper storage members 2, a retracting mechanism and an ion detection device.

[0058] A copper dissolving space 11 for storing reaction liquid is formed inside the copper dissolving main tank 1 .

[0059] The retractable mechanism is arranged opposite to the copper dissolving main tank 1 , and is respectively connected to each copper storage member 2 in a transmission manner to control the copper storage member 2 to extend into or out of the copper dissolving space 11 .

[0060] The ion detection device is used to detect the ion concentration in the copper dissolving main tank 1, and the number of copper storage members 2 placed in the copper dissolving main tank 1 is determined by the ion concentration.

[0061] Among them, a copper storage space for storing copper materials is formed inside the copper storage member 2, and the copper storage member 2 is also provided with a flow structure. When the copper storage member 2 extends into the copper dissolving space 11, the copper storage space is connected with the copper dissolving space 11 through the flow structure.

[0062] The copper dissolving system for iron ion copper plating according to the embodiment of the present invention has a specific structural composition as follows: the copper dissolving main tank 1 is the main container of the entire system, and a copper dissolving space 11 for storing the reaction liquid is formed inside. The tank provides a closed environment for the chemical reaction, ensuring the necessary reaction between the liquid and the copper material in the copper storage part 2, and also serves as a basic platform for other components (such as the retractable mechanism and the ion detection device).

[0063] Each copper storage member 2 has a copper storage space for storing copper materials (such as copper rods or copper balls) formed therein, and the copper storage member 2 is provided with a flow structure, including a liquid inlet 22 and a liquid outlet 23. The copper storage member 2 is connected to the retracting mechanism through a transmission connection, allowing it to extend into or out of the copper dissolving space 11 in the copper dissolving main tank 1 as needed. When the copper storage member 2 is immersed in the copper dissolving space 11, the liquid medicine flows into the copper storage space through the flow structure thereon and contacts the copper material; when the copper storage member 2 is lifted out of the copper dissolving space 11, further chemical reactions are stopped, thereby controlling the generation rate of copper ions.

[0064] The retractable mechanism is arranged opposite to the main copper dissolving tank 1, and is respectively connected to each copper storage member 2 in a transmission manner. It should be noted that the retractable mechanism can realize the retractable copper storage member 2 by lifting, moving, rotating and other retractable forms, and the present invention does not impose any special restrictions on this, as long as the retractable mechanism can control the copper storage member 2 to extend into or out of the copper dissolving space 11. The retractable mechanism can determine whether and how the copper storage member 2 goes deep into the main copper dissolving tank 1, that is, directly determine the number of copper storage members 2 participating in the reaction, thereby affecting the final ion concentration.

[0065] The ion detection device can monitor the concentration of specific ions (such as ferric ions, ferrous ions, and cupric ions) in the copper dissolving main tank 1 in real time. The ion detection device can be installed near the copper dissolving main tank 1 to directly detect the ion concentration of the solution in the tank. At the same time, in the case where the system of the present invention has a control system, the ion detection device can provide instant feedback to the control system so as to adjust the number and position of the copper storage parts 2 to maintain the ideal ion concentration level.

[0066] Further, the specific working principle of the copper dissolving system of the present invention is as follows: the operation of the copper dissolving system is based on the precise control of the ion concentration in the copper dissolving main tank 1. The system can determine the current reaction state by continuously monitoring the concentration of ferric ions, ferrous ions and cupric ions in the tank through the ion detection device. If it is detected that the concentration of certain ions is too high or too low, the control system will issue instructions to the retracting mechanism accordingly, and then adjust the number of copper storage parts 2 extending into the copper dissolving main tank 1, and the degree to which the copper storage parts 2 extend into the copper dissolving space 11. In this way, the system can dynamically adjust the quality of the copper material that reacts with the liquid medicine, and then regulate the amount of copper ions generated to maintain a stable production process.

[0067] Based on the description of the above structure and principle, the working process of the copper dissolving system of the present invention is roughly as follows:

[0068] Put an appropriate amount of copper material into the copper storage 2, and ensure that all copper storages 2 are in the ready position, ready to accept the next step of operation. Start the pump to introduce the electroplating solution into the copper dissolving main tank 1, and at the same time make the copper storage 2 descend to the copper dissolving space 11. At this time, the solution enters the copper storage space through the flow structure on the copper storage 2, and reacts with the copper material to produce copper ions. The ion detection device continuously measures the ion concentration in the copper dissolving main tank 1 and transmits the data to the control system. According to the change of ion concentration, the control system commands the retracting and releasing mechanism to adjust the number of copper storages 2 extending into the copper dissolving main tank 1. Specifically, when the copper ion concentration is too high (or the iron ion concentration is too low), the number of copper storages 2 participating in the reaction is reduced; conversely, when the copper ion concentration is insufficient (or the iron ion concentration is too high), the number of copper storages 2 extending into the copper dissolving main tank 1 is increased.

[0069] As production progresses, the above steps will be repeatedly performed to ensure that the ion concentration in the copper dissolving process always remains within an optimized range until the scheduled production task is completed.

[0070] It can be understood that the above description is realized based on the automatic control of the control system. It should be pointed out that the copper dissolving system of the present invention can also manually operate the retracting and releasing mechanism to increase or decrease the number of copper storage parts 2 in the copper dissolving main tank 1. The present invention does not make any special restrictions here.

[0071] Specifically, in the manual operation mode, the operator can directly control the retracting mechanism to increase or decrease the number of copper storage pieces 2 in the main copper dissolving tank 1. For example, if the retracting mechanism is designed with a manual operating handle or lever, the operator can directly lift or lower the copper storage piece 2 through these components. For another example, some retracting mechanisms may be equipped with manual controllers, such as buttons, switches, etc., allowing the operator to manually start or stop the lifting and lowering action of the copper storage piece 2 according to the real-time data provided by the ion detection device. For another example, although the system emphasizes automation, in some cases, a mode between fully automatic and fully manual can be adopted. For example, when the control system recommends adjusting the number of copper storage pieces 2, it will give specific instructions (such as icons or sound prompts), and then the operator will confirm and perform the corresponding manual operation.

[0072] In the related art, in the field of PCB (printed circuit board) copper electroplating, the traditional copper plating methods are mainly divided into two types: (1) Soluble anode electroplating: electroplating by adding phosphor copper balls. The advantage of this method is that the process is mature and the operation is simple, but the cost is relatively high. (2) Insoluble anode electroplating: electroplating by adding copper oxide powder. Although this method reduces the consumption of anode materials, it may encounter the problem of insufficient stability in practical applications.

[0073] With the development of technology, the iron ion copper plating system has been proposed and gradually applied in laboratory and small-scale production environments. This system uses a copper rod as an anode material to react with a solution containing iron ions under specific conditions to generate copper ions. However, it is difficult to control the ion concentration in the existing iron ion copper plating system, and the dynamic balance between iron ions, ferrous ions and copper ions is difficult to maintain, resulting in unstable product quality. The existing system lacks effective means to monitor and adjust the concentration of these ions in real time.

[0074] Therefore, in order to solve the technical defects existing in the above-mentioned related technologies, the present invention provides a copper dissolving system for iron ion copper plating, which monitors the ion concentration through an ion concentration detection device, and controls the copper storage member 2 to extend into or out of the copper dissolving main tank 1 through a retracting mechanism, thereby realizing accurate control of the ion concentration in the liquid. Furthermore, the copper dissolving system of the present invention has the following advantages compared with the related technologies:

[0075] (1) Accurate ion concentration control: The ion detection device monitors the concentrations of ferrous ions, ferrous ions and cupric ions in the main copper dissolving tank 1 in real time. The instant feedback mechanism enables the system to respond quickly to concentration changes and maintain an ideal ion balance, thereby ensuring the high quality of the electroplating products.

[0076] At the same time, based on the change in ion concentration, the system can automatically determine the number of copper storage members 2 to be placed in or removed from the copper dissolving space 11. This not only improves the controllability of the reaction process, but also ensures the stability of the ion concentration during the production process.

[0077] (2) High degree of automation: The retracting and releasing mechanism can automatically control the copper storage member 2 to extend into or out of the copper dissolving space 11, reducing the need for manual intervention, improving operating efficiency and reducing labor costs. Combined with the data from the ion detection device, the entire system forms a closed-loop control system, realizing a fully automated process from monitoring to adjustment, and improving the continuity and stability of production.

[0078] (3) Strong flexibility and adaptability: The design of the retractable mechanism is not limited to a specific form (such as lifting), but can adopt a variety of methods such as horizontal movement and rotation according to actual needs. This flexibility enables the system to better adapt to different production environments and process requirements. The copper storage part 2 is provided with a flow structure inside. When it extends into the copper dissolving space 11, the liquid medicine can fully contact with the copper material through these structures, which promotes the uniformity and efficiency of the reaction.

[0079] (4) Improve production efficiency: Due to the high degree of automation of the system, it can respond to changes in ion concentration in a short time and adjust the number of copper storage parts 2 in time, thereby speeding up the production rhythm. In addition, the automated and intelligent design reduces operational errors caused by human factors, thereby reducing the possibility of equipment downtime for maintenance and maintaining the continuous operation of the production line.

[0080] like Figure 1 , Figure 3 and Figure 4 As shown, according to some embodiments of the present invention, the top of the copper dissolving main tank 1 is open to form an inlet and outlet 12 , and the retracting and releasing mechanism is located above the copper dissolving main tank 1 and is arranged opposite to the inlet and outlet 12 .

[0081] The retracting and releasing mechanism comprises at least two automatic lifting devices 3 , and each automatic lifting device 3 is respectively connected to at least one copper storage member 2 in a transmission manner.

[0082] In this embodiment, the top of the copper dissolving main tank 1 is open to form an inlet and outlet 12, which allows the copper storage member 2 to easily enter and exit the copper dissolving space 11 to ensure sufficient contact between the liquid medicine and the copper material. The open top also makes it easy for operators to monitor the internal situation and perform necessary maintenance work.

[0083] The automatic lifting device 3 can accurately control the vertical movement of the copper storage member 2, thereby determining whether it enters or leaves the copper dissolving space 11. At the same time, since multiple automatic lifting devices 3 work simultaneously, multiple copper storage members 2 can be controlled simultaneously or independently, thereby improving the flexibility and response speed of the system. Each copper storage member 2 can smoothly extend into or out of the copper dissolving space 11 driven by each automatic lifting device 3, thereby ensuring that the ion concentration during the reaction process can be dynamically adjusted as needed.

[0084] In this way, since the top of the copper dissolving main tank 1 is open, the copper storage member 2 can be directly put in or taken out from above, which simplifies the operation process and reduces the need for manual intervention. At the same time, the design of multiple automatic lifting devices 3 enables the movement of each copper storage member 2 to be controlled individually, avoiding the error accumulation problem that may be caused by a traditional single control point, and ensuring the stability and reliability of the system.

[0085] In addition, the retracting and releasing mechanism is arranged just above the main copper dissolving tank 1, which not only fully utilizes the vertical space, but also makes the overall equipment layout more compact and reasonable, and adapts to various factory conditions.

[0086] like Figure 5 As shown, according to some embodiments of the present invention, the top of the copper storage member 2 is open to form a feed port 21, and a flow structure is formed at the bottom or side wall of the copper storage member 2, and the size of the flow structure is smaller than the size of the copper material.

[0087] It can be understood that the top of the copper storage member 2 is open to form a feed port 21, which is convenient for adding and replenishing copper materials (such as copper rods or copper balls) without the need for additional disassembly of equipment, thereby improving the convenience and efficiency of operation. At the same time, the bottom or side wall of the copper storage member 2 forms a flow structure, such as a liquid inlet 22 and a liquid outlet 23.

[0088] The size of the flow structure is designed to be smaller than the size of the copper material to ensure that the copper material does not leak through these holes. Specifically, the flow structure allows the liquid medicine to freely enter and exit the copper storage member 2, ensuring sufficient contact between the copper material and the liquid medicine, thereby improving the reaction efficiency. In addition, since the size of the flow structure is smaller than the copper material, the copper material is effectively prevented from accidentally falling off from the copper storage member 2, ensuring the safety and stability of the system.

[0089] In this way, the open-top design makes it very simple to add copper materials, and the operator can directly put the copper materials into the feed port 21, which reduces cumbersome operating steps and improves work efficiency.

[0090] On the one hand, the design of the flow structure ensures that the liquid medicine can smoothly enter the copper storage member 2 and fully contact with the copper material, thereby promoting the occurrence of chemical reactions. This not only speeds up the reaction speed, but also improves the efficiency of copper ion generation. On the other hand, by precisely controlling the size of the flow structure, it is ensured that the copper material will not leak out of the copper storage member 2 during the reaction, thereby avoiding potential safety hazards and waste of the material package 10.

[0091] like Figure 5 As shown, in some specific embodiments of the present invention, the flow structure includes a liquid inlet hole 22 and a liquid outlet hole 23, a plurality of liquid inlet holes 22 are formed on the bottom of the copper storage member 2, and a plurality of liquid outlet holes 23 are formed on the side wall of the copper storage member 2.

[0092] In this way, the multiple liquid inlet holes 22 at the bottom ensure that the liquid medicine can quickly and evenly enter the copper storage member 2 and fully contact the copper material; the multiple liquid outlet holes 23 on the side wall ensure that the liquid medicine after the reaction can be discharged in time to avoid retention. This design significantly improves the circulation efficiency of the liquid medicine and promotes the occurrence of chemical reactions.

[0093] At the same time, the design of multiple liquid inlet holes 22 and liquid outlet holes 23 makes the distribution of the liquid medicine in the entire copper storage member 2 more uniform, reducing the problem of local concentration being too high or too low, thereby improving the consistency of the reaction and the product quality.

[0094] like Figure 4 and Figure 5 As shown, in some specific embodiments of the present invention, a reinforcing bracket 24 is provided on the outer side of the copper storage member 2 , and the reinforcing bracket 24 is arranged around the outer peripheral wall of the copper storage member 2 and avoids the feed port 21 .

[0095] In this way, the presence of the reinforcing bracket 24 significantly enhances the compressive resistance of the copper storage member 2, especially when the copper storage member 2 is filled with copper material, effectively preventing the copper storage member 2 from bending or breaking during the lifting process, thereby extending the service life of the equipment.

[0096] On the one hand, by surrounding the outer peripheral wall of the copper storage member 2, the reinforcing bracket 24 not only reinforces the copper storage member 2 itself, but also indirectly protects the liquid inlet 22 and the liquid outlet 23 from external interference, ensuring the stability and reliability of the circulation of the liquid medicine. On the other hand, the reinforcing bracket 24 deliberately avoids the top feed port 21, ensuring that the operator can conveniently add copper materials without touching the reinforcing bracket 24, reducing the operating risk and improving the work efficiency.

[0097] In addition, since the reinforcing bracket 24 does not cover the key parts of the copper storage member 2 (such as the feed port 21 and the flow structure), it will not be hindered during daily cleaning and inspection, thereby reducing the difficulty of maintenance.

[0098] For example, the copper storage member 2 can be a titanium basket, and the four sides and the bottom plate of the titanium basket are all made of titanium plates. It can be understood that titanium is a metal with extremely strong corrosion resistance, which can effectively prevent the corrosion of the copper storage member 2 by the liquid medicine. A plurality of small holes (i.e., liquid inlet holes 22) are provided on the bottom plate of the titanium basket, and the liquid inlet holes 22 are used for the liquid medicine to enter the interior of the titanium basket to ensure that the liquid medicine can fully contact and dissolve the copper balls in the titanium basket. Small holes (i.e., liquid outlet holes 23) are also provided on the side plates of the titanium basket for the solution to flow out. The dissolved solution is discharged through the liquid outlet hole 23, taking away the copper ions.

[0099] Since the copper ball placed for the first time is very heavy (probably close to 1 ton), in order to prevent the titanium basket from deforming, a layer of titanium square tube is wrapped around the titanium basket as a reinforcement. This layer of titanium square tube surrounds the outer wall of the titanium basket, enhancing the strength of the overall structure. At the same time, a lifting ring is provided at the top of the titanium square tube to facilitate the use of the automatic lifting device 3 to lift the titanium basket.

[0100] like Figure 1 and Figure 6 As shown, according to some embodiments of the present invention, the copper dissolving system further includes a raw material conveying mechanism.

[0101] The raw material conveying mechanism includes an automatic conveying device and a collecting box 4 . The automatic conveying device is used to convey the copper material into the collecting box 4 . A discharge port 41 is formed on the collecting box 4 and is connected to the feed port 21 of the copper storage member 2 through the discharge port 41 .

[0102] In this embodiment, the main purpose of the raw material conveying mechanism is to automatically convey copper materials (such as copper rods or copper balls) to the copper storage part 2 (titanium basket), thereby reducing manual intervention and improving operating efficiency. Among them, the automatic conveying device is responsible for conveying the copper material from the initial position to the collection box 4. Collection box 4: located on the conveying path or at the end of the automatic conveying device, used to receive the copper material conveyed. Each collection box 4 has a discharge port 41, which is connected to the feed port 21 of the copper storage part 2 to ensure that the material bag 10 can directly enter the interior of the copper storage part 2.

[0103] In this way, the raw material conveying mechanism realizes the fully automatic conveying and delivery of copper materials, greatly improving production efficiency and reducing labor costs. The system can quickly adjust the speed and amount of material package 10 conveying according to actual needs to adapt to different production rhythms.

[0104] At the same time, the automated conveying process reduces the chances of operators directly contacting the heavy material packages 10, reduces safety risks, and ensures that each delivery of the material packages 10 is accurate, avoiding safety hazards caused by human errors.

[0105] like Figure 1 and Figure 6 As shown, further, the automatic conveying device includes a plurality of conveying drive members 51, a plurality of rollers 52 and an annular conveyor belt 53 composed of a plurality of mutually connected conveying boxes 54, the conveying drive members 51 are transmission-connected to the rollers 52, and the rollers 52 are transmission-connected to the annular conveyor belt 53, wherein the conveying drive member 51 is used to drive the annular conveyor belt 53 to move in a circular motion through the rollers 52, so that the conveying boxes 54 convey the copper material into the collecting box 4.

[0106] It can be understood that the transmission drive 51 is the core component that provides power for the entire transmission system, and generally includes a power source such as a motor and a transmission mechanism (such as a gear or belt drive) for driving the roller 52 to rotate. Several rollers 52 are installed inside the endless conveyor belt 53 to contact and support it. The rollers 52 are connected to the transmission drive 51 through a shaft. When the drive is working, the rollers 52 rotate accordingly, driving the endless conveyor belt 53 to move.

[0107] The endless conveyor belt 53 is the main part for carrying the copper material. Each conveying box 54 is an independently designed container, which are connected in series to form a closed loop path. When the roller 52 rotates, the endless conveyor belt 53 moves in a circle, transporting the copper material placed in the conveying box 54 from one place to another, for example, transporting the copper material from the initial position to the collection box 4.

[0108] In this way, through the above-mentioned specific structural design, the automatic conveying device not only realizes the efficient and safe transportation of copper materials, but also significantly improves the overall performance and reliability of the copper dissolving system.

[0109] like Figure 1 and Figure 6 As shown, further, a discharge port 41 is formed at the bottom of the collection box 4, the number of the collection boxes 4 is equal to the number of the copper storage pieces 2, and a copper storage piece 2 is correspondingly provided below each collection box 4. Preferably, the discharge port 41 is connected to the feed port 21 of the copper storage piece 2 through a discharge pipe.

[0110] In this embodiment, the one-to-one matching design ensures that the material bag 10 can accurately enter the corresponding copper storage part 2, so that each copper storage part 2 can be replenished with the material bag 10, reducing the possibility of manual intervention and improving the safety and reliability of operation. In addition, the relative position of the discharge port 41 and the feed port 21 of the copper storage part 2 ensures that the copper material can accurately enter the copper storage part 2, avoiding the safety hazards caused by human errors.

[0111] In addition, the material bag 10 in the collection box 4 can pass through the discharge port 41 and the discharge pipe under the action of gravity and automatically fall into the feed port 21 of the copper storage part 2, which can avoid the setting of redundant driving devices, simplify the structure and improve space utilization.

[0112] like Figure 1 , Figure 2 and Figure 6 As shown, according to some embodiments of the present invention, the copper dissolving system further includes a material transport mechanism.

[0113] The material transport mechanism includes an automatic lifting device 6, a material placement table 7 and a vibration plate 8. The automatic lifting device 6 is used to automatically lift the material package 10 onto the material placement table 7. The material placement table 7 is located above the vibration plate 8 and is detachable compared to the vibration plate 8. The vibration plate 8 is connected to the conveying box 54.

[0114] When the material placement table 7 is disassembled, the copper material is suitable for falling into the vibration plate 8 and being distributed into a plurality of conveying boxes 54 through the vibration plate 8 .

[0115] In this embodiment, the automatic lifting device 6 is used to automatically lift the ton bag or container containing the copper material to the material placement platform 7. The automatic lifting device 6 can be composed of an electric hoist or other forms of lifting equipment, which can operate smoothly within a set height range.

[0116] It can be understood that the material placement table 7 can be used as a temporary storage point for placing the copper material lifted by the automatic lifting device 6. It is designed to be detachable for easy cleaning and maintenance, and also allows different material packages 10 types or specifications to be quickly replaced when necessary.

[0117] The vibration plate 8 is connected to the conveying box 54 and is used to distribute and guide the copper material into each conveying box 54. Specifically, the vibration plate 8 evenly disperses the material bag 10 by vibration and guides it to each conveying box 54 through a specific path. The above design ensures the uniformity and efficiency of the distribution of the material bag 10, while reducing the risk of blockage.

[0118] Furthermore, the specific working process of the material transport mechanism is as follows:

[0119] Copper materials (such as copper bars or copper balls) are usually stored in ton bags or other containers, located on the ground or at a lower position. The operator starts the automatic lifting device 6, which smoothly lifts the container containing copper materials to a predetermined height through an electric hoist, a hydraulic lift or other forms of lifting equipment. The automatic lifting device 6 accurately places the container containing copper materials on the material placement table 7. At this time, the material placement table 7 is located above the vibration plate 8 and is detachably arranged relative to the vibration plate 8.

[0120] When it is necessary to add a material bag 10, the operator can disassemble the material placement table 7 so that the copper material naturally falls into the vibration plate 8 below. Once the material bag 10 falls into the vibration plate 8, the vibration plate 8 starts to work, and through its unique vibration mechanism, the material bag 10 is evenly dispersed and guided to a specific path. The vibration plate 8 is directly connected to the conveying box 54, and the material bag 10 smoothly enters each conveying box 54 through the guide path of the vibration plate 8. Each conveying box 54 is independently designed to ensure that the material bag 10 can enter the corresponding conveying box 54 accurately, avoiding the problem of human intervention and wrong delivery.

[0121] The entire material transport mechanism is usually equipped with an integrated control system to monitor the working status of each component in real time. The operator can adjust the speed of the automatic lifting device 6, the frequency of the vibrating plate 8 and other parameters through the control system to meet different production needs. The control system can also monitor potential problems in the system in real time and issue an alarm when an abnormality is found, reminding the operator to deal with it in time, reducing downtime and improving system reliability.

[0122] In this way, the material transport mechanism realizes fully automatic operation from lifting to distributing the material package 10, reducing the need for manual handling, reducing labor intensity, and improving work efficiency. The system can also quickly adjust the speed and amount of material package 10 delivery according to actual needs, adapt to different production rhythms, and ensure production continuity.

[0123] The automated lifting and distribution process reduces the chances of operators directly contacting the heavy material packages 10, reducing safety risks. Moreover, the uniform distribution of the vibration plate 8 ensures that each material package 10 is accurately placed, avoiding safety hazards caused by human errors.

[0124] like Figure 1 As shown, according to some embodiments of the present invention, it also includes a liquid medicine collecting tank 9, which is located outside the copper dissolving main tank 1, and an overflow plate 91 is provided between the liquid medicine collecting tank 9 and the copper dissolving main tank 1, and an overflow port is defined at the top of the overflow plate 91, and the reacted liquid medicine in the copper dissolving main tank 1 is suitable for flowing into the liquid medicine collecting tank 9 through the overflow port.

[0125] In this embodiment, the liquid medicine collecting tank 9 can form a structure surrounding or partially surrounding the copper dissolving main tank 1, or simply be arranged on one side of the copper dissolving main tank 1. The liquid medicine collecting tank 9 is used to collect the post-reaction liquid medicine overflowing from the copper dissolving main tank 1 to prevent the liquid medicine from leaking into the environment, thereby ensuring the safety and environmental protection of the production process.

[0126] The overflow plate 91 is arranged between the copper dissolving main tank 1 and the liquid medicine collecting tank 9 as a partition between the two. The overflow port on the top of the overflow plate 91 is a key passage for the liquid medicine to flow from the copper dissolving main tank 1 to the liquid medicine collecting tank 9. It can be understood that the overflow plate 91 not only plays a partitioning role, but also controls the flow direction and speed of the liquid medicine through the overflow port, ensuring that the liquid medicine will flow into the liquid medicine collecting tank 9 only when it reaches a certain height.

[0127] Specifically, its working principle is as follows: During the copper dissolving process, as the reaction proceeds, the liquid in the copper dissolving main tank 1 may increase or rise due to bubbles generated by the reaction. When the liquid level exceeds the height of the overflow plate 91, the liquid will automatically flow into the liquid collection tank 9 through the overflow port. The liquid flowing into the liquid collection tank 9 can be collected and recovered, and after appropriate treatment (such as filtration, regeneration or waste treatment), the recycling of resources or safe discharge can be achieved.

[0128] In this way, the liquid medicine collection tank 9 not only realizes the safe and efficient collection of the liquid medicine after the reaction, but also significantly improves the overall performance and reliability of the copper dissolving system. In particular, the design of the overflow plate 91 ensures that the liquid medicine will flow into the collection tank only when it reaches a certain height, thereby avoiding unnecessary loss of liquid medicine and improving the safety and environmental protection of the operation.

[0129] like Figure 7 As shown, according to an embodiment of the second aspect of the present invention, a method for controlling ion concentration is provided.

[0130] Before introducing the ion concentration control method of an embodiment of the present invention, the application scenario of the ion concentration control method is first explained. The ion concentration control method of the present invention can be applied to the copper dissolving system for iron ion copper plating described in the first aspect of the present invention, and can also be applied to smart terminals such as smart phones, tablets and computers connected to the copper dissolving system. It can also be applied to a server connected to the copper dissolving system. The present invention is not particularly limited here, as long as it can carry and implement the ion concentration control method of the present invention.

[0131] The ion concentration control method of the embodiment of the present invention is described below by taking the copper dissolving system as an example, wherein the structure of the copper dissolving system has been described in detail above and will not be repeated here.

[0132] like Figure 7 As shown, the ion concentration control method according to an embodiment of the present invention includes:

[0133] Step S1, obtaining the ion concentration in the copper dissolving main tank 1 based on the ion detection device;

[0134] Step S2, determining the target number of copper storage parts 2 in the copper dissolving main tank 1 according to the ion concentration;

[0135] Step S3, controlling the retracting and releasing mechanism to perform retracting and releasing operations on a plurality of copper storage components 2 according to the target number of copper storage components 2.

[0136] The specific working process of the ion concentration control method according to the embodiment of the present invention is as follows: In step S1, an ion detection device is used to monitor the ion concentration (such as copper ions or iron ions) in the copper dissolving main tank 1 in real time. Based on the ion concentration data obtained in step S1, the target number of copper storage parts 2 required in the copper dissolving main tank 1 is calculated and determined.

[0137] Specifically, the system compares the current copper ion concentration with the preset ideal concentration range to evaluate whether the number of copper storage parts 2 needs to be adjusted. If the copper ion concentration is too high, the number of copper storage parts 2 may need to be reduced to reduce the reaction rate; conversely, if the copper ion concentration is too low, the number of copper storage parts 2 is increased to improve the reaction efficiency. The specific increase or decrease depends on the pre-set control algorithm and empirical parameters. Finally, a suitable target number of copper storage parts 2 is determined so that the ion concentration in the main copper dissolving tank 1 remains within the optimal range.

[0138] According to the target number of copper storage pieces 2 determined in step S2, the number of copper storage pieces 2 in the main copper dissolving tank 1 is automatically adjusted by the retracting and releasing mechanism. Specifically, the control system issues instructions according to the target number of copper storage pieces 2, and the retracting and releasing mechanism performs corresponding actions accordingly to ensure that the number of copper storage pieces 2 in the main copper dissolving tank 1 reaches a predetermined value. After the retracting and releasing operation is completed, the system confirms the new ion concentration again through the ion detection device to form a closed-loop control to ensure the stability and accuracy of the entire process.

[0139] In this way, through the coordinated work of the ion detection device and the retracting and releasing mechanism, the automatic monitoring and adjustment of the ion concentration is realized, the need for manual intervention is reduced, and the automation level of the system is improved. At the same time, based on the real-time monitoring data, the system can quickly respond to changes in ion concentration, ensuring that the copper dissolving process is always in the best state, avoiding the safety hazards caused by excessively high or low ion concentrations.

[0140] A specific embodiment of the copper dissolving system and the ion concentration control method thereof of the present invention is given below.

[0141] Taking the copper dissolving system including 20 titanium baskets (ie, copper storage parts 2) as an example, the electroplating solution is evenly distributed into the copper dissolving main tank 1 through the pump system. The copper dissolving main tank 1 is divided into 20 areas, and a titanium basket is placed in each area.

[0142] During normal production, the titanium basket is in a falling state, so that the liquid medicine can enter the titanium basket through the mesh opening at the bottom of the titanium basket. During this process, the iron ions in the liquid medicine react with the copper rod in the titanium basket to generate copper ions. Subsequently, the generated copper ions flow into the main copper dissolving tank 1 through the mesh opening at the top of the titanium basket, and are re-injected into the copper tank through the pump system for electroplating reaction.

[0143] The system is equipped with an ion detection device to monitor the changes in ion concentration in the main copper dissolving tank 1 in real time. These changes are related to various factors such as temperature, copper plating thickness, fluid speed, etc. According to the data provided by the ion detection device, the control system can dynamically adjust the number of titanium baskets participating in the reaction to maintain the ideal ion concentration range and ensure stable product quality.

[0144] Under normal production conditions, all 20 titanium baskets participate in the reaction. When the iron ion concentration is detected to be too high, the control system will instruct the retracting mechanism to lift some titanium baskets, for example, from 20 to 18 or less (such as 15), to slow down the reaction rate and prevent excessive copper ion generation. Conversely, if the copper ion concentration is detected to be low, the control system will reduce the additional titanium baskets, such as from 15 to 17 or even more (such as 18), to speed up the reaction rate and increase the copper ion concentration to the ideal level.

[0145] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A copper dissolving system for iron ion copper plating, characterized in that: include: A copper dissolving main tank (1) is formed with a copper dissolving space (11) for storing a reaction liquid; At least two copper storage members (2) and a retracting and releasing mechanism, wherein the retracting and releasing mechanism is arranged opposite to the copper dissolving main tank (1), and the retracting and releasing mechanism is respectively connected in a transmission manner to each of the copper storage members (2) to control the copper storage members (2) to extend into or out of the copper dissolving space (11); An ion detection device, used for detecting the ion concentration in the copper dissolving main tank (1), wherein the number of copper storage members (2) placed in the copper dissolving main tank (1) is determined by the ion concentration; A copper storage space for storing copper material is formed inside the copper storage member (2), and the copper storage member (2) is also provided with a flow structure. When the copper storage member (2) extends into the copper dissolving space (11), the copper storage space is connected to the copper dissolving space (11) through the flow structure.

2. The copper dissolving system for iron ion copper plating according to claim 1, characterized in that: The top of the copper dissolving main tank (1) is open to form an inlet and outlet (12); the retractable mechanism is located above the copper dissolving main tank (1) and is arranged opposite to the inlet and outlet (12); The retractable mechanism comprises at least two automatic lifting devices (3), and each of the automatic lifting devices (3) is respectively connected in transmission with at least one of the copper storage members (2).

3. The copper dissolving system for iron ion copper plating according to claim 2, characterized in that: The top of the copper storage member (2) is open to form a feed port (21), the bottom or side wall of the copper storage member (2) is formed with the flow-through structure, and the size of the flow-through structure is smaller than the size of the copper material.

4. The copper dissolving system for iron ion copper plating according to claim 3, characterized in that: The flow structure comprises a liquid inlet hole (22) and a liquid outlet hole (23); a plurality of the liquid inlet holes (22) are formed on the bottom of the copper storage member (2); and a plurality of the liquid outlet holes (23) are formed on the side wall of the copper storage member (2).

5. The copper dissolving system for iron ion copper plating according to claim 3, characterized in that: A reinforcing bracket (24) is arranged on the outer side of the copper storage member (2); the reinforcing bracket (24) is arranged around the outer peripheral wall of the copper storage member (2) and avoids the feed port (21).

6. The copper dissolving system for iron ion copper plating according to any one of claims 3 to 5, characterized in that: Also includes: The material conveying mechanism comprises an automatic conveying device and a collecting box (4), wherein the automatic conveying device is used to convey the copper material into the collecting box (4), and the collecting box (4) is provided with a discharge port and is connected to a feed port (21) of the copper storage member (2) through the discharge port.

7. The copper dissolving system for iron ion copper plating according to claim 6, characterized in that: The bottom of the collecting box (4) forms the discharge port (41), the number of the collecting boxes (4) is equal to the number of the copper storage members (2), and a corresponding copper storage member (2) is provided below each of the collecting boxes (4).

8. The copper dissolving system for iron ion copper plating according to claim 6, characterized in that: The automatic conveying device comprises a plurality of conveying driving members (51), a plurality of rollers (52) and an annular conveyor belt (53) composed of a plurality of mutually connected conveying boxes (54), wherein the conveying driving member (51) is in driving connection with the rollers (52), and the rollers (52) are in driving connection with the annular conveyor belt (53), wherein the conveying driving member (51) is used to drive the annular conveyor belt (53) to move cyclically via the rollers (52), so that the conveying boxes (54) convey the copper material into the collecting box (4).

9. The copper dissolving system for iron ion copper plating according to claim 8, characterized in that: Also includes: The material transport mechanism comprises an automatic lifting device (6), a material placement table (7) and a vibration plate (8), wherein the automatic lifting device (6) is used to automatically lift the material onto the material placement table (7), and the material placement table (7) is located above the vibration plate (8) and is detachable relative to the vibration plate (8), and the vibration plate (8) is connected to the conveying box (54); When the material placement table (7) is disassembled, the copper material is suitable for falling into the vibration plate (8) and being distributed into a plurality of the conveying boxes (54) through the vibration plate (8).

10. The copper dissolving system for iron ion copper plating according to any one of claims 1 to 5, characterized in that: The invention also comprises a liquid medicine collecting tank (9), wherein the liquid medicine collecting tank (9) is located outside the copper dissolving main tank (1), and an overflow plate (91) is provided between the liquid medicine collecting tank (9) and the copper dissolving main tank (1), and an overflow port is defined at the top of the overflow plate (91), and the liquid medicine after the reaction in the copper dissolving main tank (1) is suitable for flowing into the liquid medicine collecting tank (9) through the overflow port.

11. An ion concentration control method, applied to a copper dissolving system for iron ion copper plating as claimed in any one of claims 1 to 10, characterized in that: The method comprises: Based on the ion detection device, obtaining the ion concentration in the copper dissolving main tank (1); Determining the number of target copper storage parts (2) in the copper dissolving main tank (1) according to the ion concentration; According to the target number of copper storage pieces (2), the retracting and releasing mechanism is controlled to perform retracting and releasing operations on a plurality of the copper storage pieces (2).

Images