Wafer test box

Abstract

This invention discloses a wafer testing box. The wafer testing box includes a first housing, a second housing, and a magnetic barrier assembly. The first housing has a first magnetic element. The second housing has a second magnetic element, which is correspondingly disposed with the first magnetic element. When the first housing and the second housing are in contact, an accommodating space is formed between them. The magnetic barrier assembly is configured to connect to the first housing or the second housing to reduce or release the magnetic attraction force generated between the first magnetic element and the second magnetic element. Before the first housing and the second housing come into contact, the magnetic barrier assembly is used to reduce or release the magnetic attraction force. When the first housing and the second housing are in contact, the effect of the magnetic barrier assembly is released, so that the first housing and the second housing are tightly bonded by magnetic attraction force. The magnetic attraction force is reduced by the magnetic barrier assembly, so that the first housing and the second housing can be separated.

Description

Technical Field

[0001] This invention relates to a wafer testing box, and more particularly to a wafer testing box with a magnetic fixing structure. Background Technology

[0002] When an integrated circuit is designed on a wafer, it needs to undergo burn-in testing and electrical testing. Traditionally, burn-in and reliability testing of wafers involves testing each wafer separately using a test bench and probe cards. Each wafer is placed on a platform, and the test is completed by electrical contact with the probes of the probe card. Therefore, the more wafers produced, the more test benches and probe cards are required, resulting in significant time and equipment costs for the testing process.

[0003] In the prior art, in order to improve the efficiency of pre-burn-in testing, a composite test unit system has been developed, which can simultaneously perform pre-burn-in testing on several wafers. The aforementioned system has multiple test unit arrays in a test device, with each wafer configured in a separate test unit array. Each test unit has at least one chuck to fix the wafer, and the wafer is connected to the tester for pre-burn-in testing or electrical testing.

[0004] On the other hand, a wafer test box has recently been developed. The probe card and wafer are pre-positioned and placed inside the test box, which is then directly electrically connected to the test equipment. The test box is placed within the test unit for pre-burn-in testing or electrical testing. Existing wafer test boxes use either a snap-fit ​​or vacuum-sealed connection between the upper and lower housings. The snap-fit ​​method has limited effectiveness in securing the upper and lower housings and suffers from uneven stress and deformation. The vacuum-sealed method is prone to vacuum failure when the wafer test box is subjected to external forces, and may also experience reduced vacuum performance due to aging of the seals.

[0005] Therefore, how to improve the performance of wafer test boxes through structural design improvements and overcome the above-mentioned defects has become one of the important issues that this project aims to address. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a wafer test box that addresses the shortcomings of the prior art. The box is characterized by comprising: a first housing having at least one first magnetic element; a second housing having at least one second magnetic element, the second magnetic element being correspondingly disposed with the first magnetic element, wherein when the first housing and the second housing are in contact, an accommodating space is formed between the first housing and the second housing; and a magnetic blocking component configured to be connected to the first housing or the second housing, for reducing or releasing the magnetic attraction force generated between the first magnetic element and the second magnetic element; wherein before the first housing and the second housing are in contact, the magnetic blocking component is used to reduce or release the magnetic attraction force; wherein when the first housing and the second housing are in contact, the effect of the magnetic blocking component is released, so that the first housing and the second housing are tightly bound together by the magnetic attraction force; wherein the magnetic blocking component reduces the magnetic attraction force of the first housing and the second housing tightly bound together by the magnetic attraction force, so that the first housing and the second housing can be separated.

[0007] Preferably, the first magnetic component is a permanent magnet, and the second magnetic component is a permanent magnet or a non-magnetic magnetically conductive object. The magnetic blocking component is movably disposed in the first housing or the second housing and is located between the first magnetic component and the second magnetic component. When the magnetic blocking component moves to a position that shields the first magnetic component or the second magnetic component, the magnetic attraction force generated between the first magnetic component and the second magnetic component is reduced.

[0008] Preferably, the first magnetic component is a non-permanent magnet (electromagnet), the second magnetic component is a paramagnetic object, the magnetic blocking component controls whether the first magnetic component generates or does not generate magnetic force, the magnetic blocking component is connected to the first magnetic component, and the magnetic blocking component is a switch or a microprocessor.

[0009] Preferably, the first housing includes at least one first positioning structure, and the second housing includes at least one second positioning structure. The first positioning structure and the second positioning structure are correspondingly arranged to make the first housing and the second housing make corresponding contact.

[0010] Preferably, the wafer test box further includes a probe card and a wafer, wherein the probe card and the wafer are disposed in the accommodating space.

[0011] One of the beneficial effects of the present invention is that the wafer test box provided by the present invention can strengthen the structure of the wafer test box, enhance the ability of the first and second shells to be combined and fixed, and enhance the alignment accuracy during combination through technical solutions such as "the wafer test box includes a first shell and a second shell", "the first shell has a first magnetic element", "the second shell has a second magnetic element", "when the first magnetic element of the first shell and the second magnetic element of the second shell are relatively close, a magnetic attraction force is generated between the first magnetic element and the second magnetic element to combine and fix the first shell and the second shell", and "the magnetic barrier is used to reduce or interrupt the magnetic attraction force generated between the first magnetic element and the second magnetic element, so that the first shell and the second shell can be separated". It can also improve the wafer test box's effect of fixing the wafer.

[0012] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0013] Figure 1 This is a first schematic diagram of a wafer testing box according to the first embodiment of the present invention.

[0014] Figure 2 This is a second schematic diagram of the wafer test box according to the first embodiment of the present invention.

[0015] Figure 3 This is a perspective view of the wafer test box according to the first embodiment of the present invention.

[0016] Figure 4 This is a schematic diagram of the appearance of the first housing and the second housing according to the first embodiment of the present invention.

[0017] Figure 5 This is a schematic diagram of a wafer testing box according to the second embodiment of the present invention.

[0018] Figure 6 This is a schematic diagram of a wafer testing box according to the third embodiment of the present invention.

[0019] Figure 7A This is a first schematic diagram of a wafer testing box according to the fourth embodiment of the present invention.

[0020] Figure 7B This is a second schematic diagram of a wafer testing box according to the fourth embodiment of the present invention.

[0021] Figure 7C This is a third schematic diagram of the wafer test box according to the fourth embodiment of the present invention.

[0022] Figure 8A This is a first schematic diagram of a wafer testing box according to the fifth embodiment of the present invention.

[0023] Figure 8B This is a second schematic diagram of a wafer testing box according to the fifth embodiment of the present invention.

[0024] Figure 8C This is a third schematic diagram of the wafer test box according to the fifth embodiment of the present invention.

[0025] Figure 9 This is a schematic diagram of a wafer testing box according to the sixth embodiment of the present invention. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the "wafer test box" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, the term "or" as used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.

[0027] Please see Figure 1 , Figure 2 , Figure 3 as well as Figure 4 , Figure 1 This is a first schematic diagram of a wafer testing box according to the first embodiment of the present invention. Figure 2 This is a second schematic diagram of the wafer testing box according to the first embodiment of the present invention. Figure 3 This is a perspective view of the first embodiment of the present invention. Figure 4 This is a schematic diagram of the appearance of the first housing and the second housing according to the first embodiment of the present invention.

[0028] The wafer test box 1A includes a first housing 11 and a second housing 12. The first housing 11 has a first magnetic element 111, and the second housing 12 has a second magnetic element 121. Figure 1 as well as Figure 2 The image shows the wafer test box 1A of this embodiment from a side view perspective.

[0029] In this embodiment, the wafer test box 1A can be square, circular or other shapes, which can be adjusted according to actual needs and are not limited in this invention.

[0030] like Figure 1 as well as Figure 2As shown, the wafer test box 1A includes at least one set of corresponding first magnetic components 111 and second magnetic components 121. The first magnetic components 111 are disposed around the first housing 11, and the second magnetic components 121 are disposed around the second housing 12. Each set of corresponding first magnetic components 111 and second magnetic components 121 are disposed in a corresponding manner. That is, the position of the first magnetic component 111 on the first housing 11 corresponds to the position of the second magnetic component 121 on the second housing 12.

[0031] When the first housing 11 and the second housing 12 of the wafer test box 1A are joined together, a servo motor or a stepper motor can be used as the driving device for the first housing 11 and the second housing 12. The servo motor or the stepper motor can provide more precise driving force and provide a smooth joining process when the first housing 11 and the second housing 12 approach each other.

[0032] When the first housing 11 and the second housing 12 are positioned close together, the first magnetic element 111 and the second magnetic element 121 attract each other, generating a magnetic attraction. However, excessively strong magnetic attraction may cause excessive contact force between the upper and lower housings, leading to damage to the probe or wafer. Therefore, the wafer test cassette of the present invention also includes a magnetic barrier assembly to reduce or eliminate the magnetic attraction between the first magnetic element 111 and the second magnetic element 121. The magnetic barrier assembly is configured to connect to the first housing 11 or the second housing 12 to reduce the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 before contact with the upper second housing 12, or to eliminate the magnetic attraction between the first magnetic element 111 and the second magnetic element 121.

[0033] In this embodiment, the first magnetic element 111 and the second magnetic element 121 are paramagnetic objects, such as permanent magnets, non-permanent magnets, or non-magnetic magnetic conductive objects.

[0034] When the first magnetic element 111 and the second magnetic element 121 are both permanent magnets, or when one of the first magnetic element 111 and the second magnetic element 121 is a permanent magnet and the other is a non-permanent magnet, in order to generate magnetic attraction between the first magnetic element 111 and the second magnetic element 121, the two ends facing each other of the first magnetic element 111 and the second magnetic element 121 are of different polarities.

[0035] According to some embodiments, of the first magnetic component 111 and the second magnetic component 121, one is a non-permanent magnet, such as an electromagnet, and the other is a paramagnetic object, such as a magnetically conductive object like iron, cobalt, or nickel. According to some embodiments, the paramagnetic object can be a permanent magnet or an electromagnet.

[0036] exist Figure 1 as well as Figure 2In this embodiment, a first magnetic element 111 and a second magnetic element 121 are respectively disposed within a first housing 11 and a second housing 12. According to some embodiments, the first housing 11 includes at least one first positioning structure, and the second housing 12 includes at least one second positioning structure. For example, the first positioning structure may include a downwardly extending first convex structure 11F around the first housing 11. Similarly, the second positioning structure may also include an upwardly extending second convex structure 12F around the second housing 12. In this embodiment, the first magnetic element 111 is disposed within the first convex structure 11F. The second magnetic element 121 is disposed within the second convex structure 12F. However, this application is not limited thereto. The first convex structure 11F and the second convex structure 12F are correspondingly disposed. When the first housing 11 and the second housing 12 are tightly joined by the first magnetic element 111 and the second magnetic element 121, the first convex structure 11F will be tightly joined with the second convex structure 12F. According to some embodiments, the first magnetic element 111 and the second magnetic element 121 may be one or more, and are correspondingly disposed to each other. In other words, the first magnetic component 111 and the second magnetic component 121 can be respectively disposed at any position in the first housing 11 and the second housing, and their positions correspond to each other. According to... Figure 3 In the embodiment shown, there are multiple first magnetic elements 111 and second magnetic elements 121. Figure 1 and Figure 2 As shown, the first housing 11 and the second housing 12 of the wafer test box 1A can be joined and fixed by the magnetic attraction generated by the first magnetic element 111 and the second magnetic element 121. In this embodiment, when the first magnetic element 111 and the second magnetic element 121 are arranged, they generate a magnetic force that attracts each other (as mentioned above, the facing surfaces of the first magnetic element 111 and the second magnetic element 121 have opposite polarities). In other words, this application does not limit the first magnetic element 111 and the second magnetic element 121 to facing each other; as long as they can generate a magnetic attraction to join and fix the first housing 11 and the second housing 12, it is within the scope of protection of this application. In addition, when the first housing 11 and the second housing 12 are in corresponding contact, an accommodating space S is formed between the first housing 11 and the second housing 12.

[0037] in accordance with Figure 1 and Figure 2 In the illustrated embodiment, the first magnet 111 and the second magnet 121 are located around the first housing 11 and the second housing 12 (i.e., on both sides of the accommodating space S). However, according to some embodiments, other sets of the first magnet 111 and the second magnet 121 may also be provided at other locations in the wafer test box 1A (e.g., above or below the accommodating space S). The user can adjust the magnitude of the magnetic attraction force between the first magnet 111 and the second magnet 121, or their distribution position, according to requirements (e.g., the sealing between the first housing 11 and the second housing 12), and this application is not limited thereto.

[0038] According to some embodiments, in order to align the first housing 11 and the second housing 12, the first housing 11 and the second housing 12 also have an engaging structure (e.g., a male / female engaging structure). Figure 1 and Figure 2 As shown, in this embodiment, the first convex structure 11F of the first housing 11 has an engaging structure 11FP, and the second convex structure 12F of the second housing 12 has a corresponding engaging structure 12FP. The engaging structure 11FP may or may not correspond to the first magnetic element 111. Similarly, the engaging structure 12FP may or may not correspond to the second magnetic element 121. However, this application does not limit the engaging structures to be provided on the first convex structure 11F of the first housing 11 and the second convex structure 12F of the second housing 12. According to some embodiments, the engaging structures 11FP and 12FP are respectively located on the lower surface of the first housing 11 and the upper surface of the second housing 12, as shown below. Figure 4 As shown. In other words, according to Figure 4 In the embodiment shown, the first engaging structure 11FP and the second engaging structure 12FP are disposed in the accommodating space S.

[0039] According to some embodiments, the first housing 11 and the second housing 12 have a locking structure (such as the aforementioned locking structure 11FP and the corresponding locking structure 12FP). When the first housing 11 and the second housing 12 are aligned and positioned, the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 causes the first housing 11 and the second housing 12 to be combined and fixed, thereby achieving the effect of locking the first housing 11 and the second housing 12 together.

[0040] like Figures 1 to 4 As shown, the magnetic blocking component, when used with a permanent magnet, is a magnetic shield 15A. By moving laterally, it shields the second magnetic element 121, thereby breaking the magnetic attraction between the first magnetic element 111 and the second magnetic element 121. However, according to some embodiments, the magnetic blocking component can be a switch or a microprocessor when used with an electromagnet. In other embodiments, the magnetic blocking component can also be a magnetic force generating component (e.g., an electromagnet). According to... Figure 1In the illustrated embodiment, a probe card 112 is further disposed in the first housing 11. The probe card 112 includes one or more probes 1121. When the first housing 11 and the second housing 12 are combined, one or more probes 1121 protrude toward the second housing 12. Further, in this embodiment, a wafer 13 is also disposed in the wafer test cassette 1A, and the second housing 12 carries the wafer 13. When the first housing 11 and the second housing 12 are combined, one or more probes 1121 protrude toward the second housing to abut against the wafer 13, allowing the probes 1121 to make electrical contact with the pads (test contact points) of the wafer 13. In other words, both the probe card 112 and the wafer 13 are disposed within the accommodating space S. According to some embodiments, the wafer 13 is electrically connected to the second housing 12.

[0041] In this embodiment, the first housing 11 includes several mechanisms for securing the probe card 112, such as a first fixing member 112F. The first fixing member 112F is located on one side of the first housing, facing the probe card 112, and is used to engage and secure the probe card 112. In this embodiment, the first fixing member 112F is located on the outer side of the probe card 112. The first fixing member 112F can also be designed in the mating area between the probe card 112 and the first housing 11 to ensure a tight fit with the probe card 112.

[0042] The second housing 12 also includes some mechanisms for fixing the wafer 13, such as a second fixing member 13F. In this embodiment, the second fixing member 13F is used to fix the outer edge of the wafer 13. The first fixing member 112F and the second fixing member 13F in this embodiment can be achieved using other fixing structures, which are not limited in this invention.

[0043] That is, before the second housing 12 is assembled, the probe card 112 and the wafer 13 are already aligned, so when they are assembled, at least one probe 1121 of the probe card 112 can abut against the pads of the wafer 13.

[0044] Please see Figure 5 , Figure 5 The wafer test box 1B includes a seal 16 located between a first housing 11 and a second housing 12. In one embodiment, the seal 16 is an O-ring. The seal 16 is used to enhance the airtightness after the first housing 11 and the second housing 12 are joined. According to some embodiments, the seal 16 can be disposed on the first convex structure 11F or the second convex structure 12F, and the user can adjust it according to actual needs. This application does not limit the placement of the seal 16. When the seal 16 is disposed between the first convex structure 11F and the second convex structure 12F, when the first housing 11 and the second housing 12 are joined by the magnetic attraction of the first magnetic element 111 and the second magnetic element 121, the first housing 11 and the second housing 12 are in a tightly joined state.

[0045] Please see Figure 6 The second housing 12 includes two second magnetic elements 121 on each side, and the first housing 11 includes two first magnetic elements 111 on each side, each aligned with its corresponding magnetic element. Furthermore, the polarity and magnetic attraction between the two first magnetic elements 111 and the second magnetic elements 121 can be different. In this embodiment, the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 near the inner edge of the wafer test box is stronger than that between the first magnetic element 111 and the second magnetic element 121 near the outer edge of the wafer test box. Moreover, the first magnetic element 111 near the inner edge of the wafer test box has its N pole facing upward and its S pole facing downward, and its corresponding second magnetic element 121 has the same configuration: N pole facing upward and S pole facing downward. Conversely, the first magnetic element 111 near the outer edge of the wafer test box can have its N pole facing downward and its S pole facing upward, while the corresponding second magnetic element 121 has the opposite configuration: S pole facing downward and N pole facing upward. At this time, without interference from the magnetic blocking component 15A, the first housing and the second housing will be tightly joined by the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 near the inner edge of the wafer test box. When the magnetic blocking component 15A is used to shield the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 near the inner edge of the wafer test box, the magnetic repulsion between the first magnetic element 111 and the second magnetic element 121 near the outer edge of the wafer test box is approximately equal to the magnetic attraction between the first magnetic element 111 and the second magnetic element 121 near the outer edge of the wafer test box. Therefore, the magnetic attraction near the inner edge of the wafer test box and the repulsion near the outer edge of the wafer test box will cancel each other out, so as to separate the upper second housing 12.

[0046] Please see Figures 7A to 7C , Figure 7A This is a first schematic diagram of a wafer testing box according to the fourth embodiment of the present invention. Figure 7B This is a second schematic diagram of a wafer testing box according to the fourth embodiment of the present invention. Figure 7C This is a third schematic diagram of the wafer testing box according to the fourth embodiment of the present invention.

[0047] In this embodiment, the structure and function of the wafer test box 1D are similar to those of the wafer test box 1A in the first embodiment. The first magnetic component 111C of the wafer test box 1D in this embodiment is a permanent magnet, and the second magnetic component 121C is a paramagnetic object, such as the aforementioned magnetically conductive materials like iron, cobalt, or nickel; the paramagnetic object can also be a permanent magnet.

[0048] First, as the first housing 11 and the second housing 12 of the wafer test box 1D gradually approach each other, their respective driving devices, such as, but not limited to, servo motors or stepper motors, can make the first housing 11 and the second housing 12 eventually contact each other and be tightly bonded by magnetic force.

[0049] After the wafer 13 has completed the test program or pre-burn-in program of the probe card 112, the first housing 11 and the second housing 12 can be separated by their respective drive devices, such as, but not limited to, servo motors or stepper motors, by gradually increasing the power.

[0050] To further explain, such as Figure 7A As shown, the magnetic barrier component of the wafer test box 1D is a magnetic shield 15A, which can be disposed on one side of the first magnetic component 111C or the second magnetic component 121C. In this embodiment, the magnetic shield 15A is located on the side of the second magnetic component 121C. The magnetic shield 15A can shield the second magnetic component 121C by moving it, thereby reducing or eliminating the magnetic attraction between the first magnetic component 111C and the second magnetic component 121C. When the first housing 11 and the second housing 12 approach each other, the magnetic shield 15A shields the second magnetic component 121C, allowing the first housing 11 and the second housing 12 to approach and contact (join) in a less strenuous manner, thus preventing the aforementioned excessive magnetic attraction from damaging the wafer or probe card inside the wafer test box 1D.

[0051] like Figure 7B As shown, when the first housing 11 comes into contact with the second housing 12, the magnetic shield 15A moves away from the second magnetic component 121C by moving (moving along direction D1), and the magnetic attraction between the first magnetic component 111C and the second magnetic component 121C makes the first housing 11 and the second housing 12 tightly connected.

[0052] like Figure 7C As shown, when the wafer test box 1D completes the test, the magnetic shield 15A shields the second magnetic component 121C by moving, eliminating or reducing the aforementioned magnetic attraction. At this time, the bonding ability between the first housing 11 and the second housing 12 is weak, so the first housing 11 and the second housing 12 can be separated in a more effortless way.

[0053] Please see Figure 8A , Figure 8B as well as Figure 8C , Figure 8A This is a first schematic diagram of a wafer testing box according to the fifth embodiment of the present invention. Figure 8B This is a second schematic diagram of a wafer testing box according to the fifth embodiment of the present invention. Figure 8C This is the fifth schematic diagram of the wafer test box according to the third embodiment of the present invention.

[0054] In this embodiment, the structure and function of the wafer test box 1E are similar to those of the wafer test boxes 1A-1C in the first embodiment. In this embodiment, the first magnetic component 111E of the wafer test box 1E is a permanent magnet, the second magnetic component 121E is a non-permanent magnet (electromagnet), and the magnetic blocking component is a current switch 15B connected to the power supply P.

[0055] like Figure 8A As shown, when the current switch 15B is in the open mode, there is no magnetic attraction between the first magnetic component 111E and the second magnetic component 121E. At this time, the first housing 11 and the second housing 12 are close to each other and in contact. Figure 8B As shown, when the first housing 11 and the second housing 12 are in contact (engaged), the current switch 15B is in the off mode. At this time, a magnetic attraction force is generated between the first magnetic element 111E and the second magnetic element 121E, causing the first housing 11 and the second housing 12 to be tightly engaged, resulting in a locking effect between the first housing 11 and the second housing 12. Figure 8C As shown, after the wafer 13 completes the test procedure, the current switch 15 is turned on again, eliminating the magnetic attraction between the first magnetic component 111E and the second magnetic component 121E. In this way, the first housing 11 and the second housing 12 can be separated from each other in a relatively effortless manner.

[0056] According to some embodiments, the first magnetic component 111E is a non-permanent magnet (electromagnet), and the second magnetic component 121E is also a non-permanent magnet (electromagnet). The first magnetic component 111E and the second magnetic component 121E are respectively connected to a magnetic blocking assembly, which is a current switch 15B. In other words, there are multiple current switches 15B, each electrically connected to the first magnetic component 111E and the second magnetic component 121E. Please refer to [link / reference]. Figures 8A to 8C Similarly, in this embodiment, the user turns the current switch 15B on and off, causing the first magnetic component 111E and the second magnetic component 121E to generate magnetic attraction or cut off (eliminate) the magnetic attraction, so that the first housing 11 and the second housing 12 can approach, contact and align with each other with less effort. After the first housing 11 and the second housing 12 are aligned, they are further bound together by generating magnetic attraction. After the wafer 13 testing program is completed, the magnetic attraction is cut off (eliminated) again so that the first housing 11 and the second housing 12 can be easily separated.

[0057] According to some embodiments, the magnetic barrier component is a processor connected to a power supply P. The processor changes the strength of the magnetic field by increasing or decreasing the current intensity, thereby eliminating or weakening the aforementioned magnetic attraction (when the first housing 11 and the second housing 12 are close to or in contact), and generating or strengthening the aforementioned magnetic attraction (when it is desired to tightly bind the first housing 11 and the second housing 12). After the wafer 13 completes the testing process, the processor reduces the current intensity to reduce or eliminate the magnetic attraction, so that the first housing 11 and the second housing 12 can be separated. In this embodiment, the power supply P can be a battery or a DC power generation circuit to provide power to the first magnetic component 111E or the second magnetic component 121E. When the power supply P is a battery, it can be a lithium-ion battery, a lithium manganese battery, a lithium polymer battery, or a nickel-metal hydride battery.

[0058] Please see Figure 9 In this embodiment, the magnetic blocking component is a magnetic force generating component 15C (e.g., an electromagnet), disposed between the first magnetic element 111E and the second magnetic element 121E. The magnetic force generating component 15C is used to shield or regulate the magnetic attraction between the first magnetic element 111E or the second magnetic element 121E. The first magnetic element 111E and the second magnetic element 121E can be permanent magnets or non-magnetic conductive objects. In this embodiment, the magnetic force generating component 15C is disposed within the second housing 12. The magnetic force generating component 15C is connected to the control circuit CRT and the external power supply P2.

[0059] in accordance with Figure 9 In the embodiment shown, the surface of the magnetic force generating component 15C facing the first magnetic element 111E has the same polarity as the first magnetic element 111E (e.g., both are N poles), and the surface of the magnetic force generating component 15C facing the second magnetic element 121E has the same polarity as the second magnetic element 121E (e.g., both are S poles).

[0060] When the first housing 11 and the second housing 12 are about to approach and contact each other, the control circuit CRT controls the current of the magnetic force generating component 15C, so that the mutual repulsion between the magnetic force generating component 15C and the first magnetic element 111E and the second magnetic element 121E is less than or slightly less than the magnetic attraction between the first magnetic element 111E and the second magnetic element 121E. After the first housing 11 and the second housing 12 are aligned and in contact, the control circuit CRT gradually reduces the current of the magnetic force generating component 15C, thereby reducing or eliminating the mutual repulsion between the magnetic force generating component 15C and the first magnetic element 111E and the second magnetic element 121E, resulting in a tight connection between the first housing 11 and the second housing 12. After the test procedure is completed on wafer 13, the control circuit CRT increases the current of the magnetic force generating component 15C, thereby enhancing or generating the mutual repulsion between the magnetic force generating component 15C and the first magnetic element 111E and the second magnetic element 121E, making it greater than the magnetic attraction between the first magnetic element 111E and the second magnetic element 121E. In this way, the first housing 11 and the second housing 12 are in a state where they can be easily separated.

[0061] [Beneficial Effects of the Examples]

[0062] One of the beneficial effects of the present invention is that the wafer test box provided by the present invention can strengthen the structure of the wafer test box, enhance the ability of the first and second shells to be combined and fixed, and enhance the alignment accuracy during combination through technical solutions such as "the wafer test box includes a first shell and a second shell", "the first shell has a first magnetic element", "the second shell has a second magnetic element", "when the first magnetic element of the first shell and the second magnetic element of the second shell are relatively close, a magnetic attraction force is generated between the first magnetic element and the second magnetic element to combine and fix the first shell and the second shell", and "the magnetic barrier is used to reduce or interrupt the magnetic attraction force generated between the first magnetic element and the second magnetic element, so that the first shell and the second shell can be separated". It can also improve the wafer test box's effect of fixing the wafer.

[0063] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included in the scope of the patent application of the present invention.

Claims

1. A wafer testing box, characterized in that, include: A first housing having at least one first magnetic element; The second housing has at least one second magnetic element, which is correspondingly disposed to the first magnetic element, wherein when the first housing and the second housing are in corresponding contact, an accommodating space is formed between the first housing and the second housing; and A magnetic barrier component is configured to be connected to the first housing or the second housing to reduce or release the magnetic attraction force generated between the first magnetic component and the second magnetic component. Before the first housing comes into contact with the second housing, the magnetic barrier component is used to reduce or release the magnetic attraction force. Specifically, when the first housing and the second housing are in corresponding contact, the effect of the magnetic barrier component is eliminated, allowing the first housing and the second housing to be tightly bonded by the magnetic attraction force; and The first housing and the second housing are tightly bound together by the magnetic attraction force. The magnetic barrier component is used to reduce the magnetic attraction force so that the first housing and the second housing can be separated.

2. The wafer testing box as described in claim 1, characterized in that, The first magnetic component is a permanent magnet, and the second magnetic component is a permanent magnet or a non-magnetic magnetic conductive object. The magnetic blocking component is movably disposed in the first housing or the second housing and is located between the first magnetic component and the second magnetic component. When the magnetic blocking component moves to a position that shields the first magnetic component or the second magnetic component, the magnetic attraction force generated between the first magnetic component and the second magnetic component is reduced.

3. The wafer testing box as described in claim 2, characterized in that, The magnetic barrier component is a magnetic shield or a magnetic force generating component.

4. The wafer testing box as described in claim 3, characterized in that, The magnetic barrier component is the magnetic force generating component, which is used to adjust the magnetic attraction between the first magnetic component and the second magnetic component so that the first housing and the second housing are tightly joined or separated.

5. The wafer testing box as described in claim 1, characterized in that, The first magnetic component is a non-permanent magnet, the second magnetic component is a paramagnetic object, the magnetic blocking component controls whether the magnetic force of the first magnetic component is generated or not, the magnetic blocking component is connected to the first magnetic component, and the magnetic blocking component is a switch or a microprocessor.

6. The wafer testing box as described in claim 1, characterized in that, There are multiple first magnetic components and multiple second magnetic components, and the number of multiple first magnetic components is the same as the number of multiple second magnetic components.

7. The wafer testing box as described in claim 1, characterized in that, The wafer test box also includes a seal disposed around the accommodating space, and the first housing, the second housing, and the seal define the accommodating space.

8. The wafer testing box as described in claim 1, characterized in that, The first housing includes at least one first positioning structure, and the second housing includes at least one second positioning structure. The first positioning structure and the second positioning structure are correspondingly arranged to make the first housing and the second housing make corresponding contact.

9. The wafer testing box as described in claim 8, characterized in that, One side of the first housing includes the first positioning structure, and one side of the second housing includes the second positioning structure. The first positioning structure is a first convex structure, and the second positioning structure is a second convex structure. The first convex structure and the second convex structure are correspondingly arranged. When the first housing and the second housing are tightly joined, the first convex structure and the second convex structure are tightly joined.

10. The wafer testing box as described in claim 1, characterized in that, One side of the first housing includes a first convex structure, and one side of the second housing includes a second convex structure. The first convex structure and the second convex structure are correspondingly arranged. When the first housing and the second housing are tightly joined, the first convex structure and the second convex structure are tightly joined.

11. The wafer testing box as described in claim 10, characterized in that, The first housing, the first convex structure, the second housing, and the second convex structure define the accommodating space.

12. The wafer testing box as described in claim 1, characterized in that, The wafer test kit also includes a probe card and a wafer, which are disposed in the accommodating space.

13. The wafer testing box as described in claim 12, characterized in that, The first housing carries the probe card, the probe card including at least one probe, and when the first housing and the second housing are combined, the probe protrudes toward the second housing; The wafer test box further includes a wafer having at least one solder pad, and the second housing carries the wafer; wherein, when the first housing and the second housing are combined, the at least one probe is in electrical contact with the at least one solder pad of the wafer.

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