Method and system for quickly positioning and detecting mainboard access and performance problems of electronic equipment

Abstract

The invention relates to the technical field of electronic communication, in particular to a method and system for rapidly positioning and detecting electronic equipment mainboard access and performance problems, and the method comprises the following steps: setting a test environment, and ensuring that test equipment and software tools are available; the probe is connected to a test point of the mainboard of the electronic equipment, so that accurate and stable signal transmission is ensured; running test software, observing a result, and paying attention to abnormity; analyzing data, finding out an abnormal reason, and checking a mainboard path; the test efficiency is improved, comprehensiveness is ensured, the problem is rapidly positioned, and the discovery and solving time is shortened; compared with manual testing, personal errors are reduced, and the result is more accurate; the method is suitable for various communication terminal devices, performance indexes are rapidly detected, performance bottlenecks and problems are identified, the problem checking time is shortened, the positioning efficiency is improved, and maintenance and optimization are more efficient.

Description

Technical Field

[0001] The present invention relates to the field of electronic communication technology, and in particular to a method and system for quickly locating and detecting electronic equipment mainboard access and performance problems. Background Art

[0002] With the rapid development of China's mobile phone market, competition between domestic and foreign mobile phone manufacturers has become increasingly fierce. For mobile phone manufacturers, product quality and project node delivery are crucial. The speed of time to market is directly related to the degree of market capture. In the process of mobile phone development, the initial board function debugging is particularly important. This part of the work includes software debugging and hardware circuit inspection. For existing development solutions, it is usually necessary to insert the software into the code of active devices and use corresponding tools to check the connection ports at the reserved end. If abnormal data is encountered, it is necessary to manually check the connectivity and path codes of the devices one by one, which seriously affects the debugging progress and analysis direction of the first board.

[0003] Taking the RF module as an example, Figure 1 The current conventional test scheme is shown. In this scheme, the test object needs to be connected to the comprehensive tester and the computer. The TXpower / RSSI and other indicators of the RF port are tested through platform tools and instruments to check the path and debug performance. If the function is abnormal, it is necessary to check the device problems on the path one by one. In the process of device troubleshooting, it takes a certain amount of time, which will undoubtedly affect the overall debugging progress.

[0004] In order to meet this challenge, many mobile phone manufacturers have begun to seek more efficient methods to optimize the debugging process. A common practice is to introduce automated testing tools, which can complete a large amount of data collection and preliminary analysis in a short period of time, thereby reducing the time for manual troubleshooting. In addition, some manufacturers have also adopted modular design, breaking down complex hardware circuits into multiple independent modules, each with clear functions and interface definitions. In this way, when a problem occurs in a module, engineers can quickly locate the specific module and debug it in a targeted manner, greatly improving debugging efficiency.

[0005] In terms of software debugging, some advanced mobile phone manufacturers have begun to use virtualization technology to simulate the hardware environment, so as to debug the software without actual hardware. This method can not only discover potential software problems in advance, but also perform some debugging work when the hardware is not yet completed, thereby shortening the overall development cycle. In addition, by introducing the continuous integration and continuous delivery (CI / CD) process, mobile phone manufacturers can achieve rapid code iteration and automated testing, further improving development efficiency and product quality.

[0006] In short, in the current fiercely competitive mobile phone market, mobile phone manufacturers must continue to innovate and optimize the development process to ensure that they stand out in the fierce market competition. By introducing advanced technologies and tools, and adopting more scientific management methods, mobile phone manufacturers can effectively improve product quality and development efficiency, thereby occupying a favorable position in the market. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention discloses a method and system for quickly locating and detecting electronic equipment mainboard access and performance problems, which are used to solve the above problems.

[0008] The present invention is achieved through the following technical solutions:

[0009] In a first aspect, the present invention provides a method for quickly locating and detecting electronic equipment mainboard path and performance problems, comprising the following steps:

[0010] Prepare the test environment and ensure that all test equipment and software tools are ready and in working order;

[0011] Connect the probe to the designated test point on the electronic device motherboard, and ensure that the probe is in good contact with the test point to ensure the accuracy and stability of signal transmission;

[0012] Start the test software, select the corresponding test items, observe the test results on the software interface, and pay attention to whether any abnormal conditions occur;

[0013] According to the recorded data, compare it with the normal value range, analyze the cause of the data abnormality, and based on the analysis results, further check the corresponding path part on the main board of the electronic equipment.

[0014] Furthermore, in the method, first, the electronic device is preheated to ensure that its internal temperature reaches a stable state to avoid test errors caused by temperature changes; secondly, a preliminary visual inspection of the electronic device is performed to rule out obvious physical damage or connection problems.

[0015] Furthermore, in the method, if an abnormality is found during the functional test, the test software is used to perform in-depth diagnosis on the corresponding module to locate the fault point; for the detected fault point, corresponding maintenance measures are taken according to the type and severity of the fault, and after the maintenance, functional testing and performance testing are re-performed to ensure that all problems are resolved and the equipment performance is restored to normal levels.

[0016] Furthermore, the method also includes stress testing the electronic device's motherboard to simulate performance under long-term operation. By applying voltage and current higher than normal operating conditions, the stability and reliability of the motherboard under extreme conditions are observed. Stress testing helps to discover potential hardware defects and ensure that the electronic device can withstand long-term high-load operation in actual use.

[0017] Furthermore, the method provides upgrade and optimization suggestions for the electronic device motherboard, and based on the test results and diagnostic analysis, proposes improvements to the motherboard hardware or software to improve the overall performance and service life of the device.

[0018] Furthermore, in the method, the improvement plan includes replacing electronic components with better performance, updating firmware versions, or adjusting system settings.

[0019] Furthermore, the method also includes an electromagnetic compatibility (EMC) test on the electronic device motherboard to evaluate its performance in an electromagnetic interference environment. By simulating different electromagnetic interference scenarios, the anti-interference ability and signal integrity of the motherboard are checked to ensure that the electronic device can operate stably in a complex electromagnetic environment.

[0020] Furthermore, the method also includes power consumption testing of the electronic device's mainboard to evaluate its energy consumption performance under different working conditions, and optimizes the energy efficiency of the device by measuring the mainboard's power consumption under idle, medium load and full load conditions.

[0021] Furthermore, the method also includes a thermal management test on the electronic device's motherboard to evaluate its heat dissipation performance under long-term operation. By simulating a high-load working state, the temperature distribution and heat dissipation efficiency of the motherboard are measured to ensure that the electronic device will not affect performance or damage hardware due to overheating during long-term use.

[0022] In a second aspect, the present invention provides a system for quickly locating and detecting electronic device mainboard path and performance problems, comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the memory is coupled to the processor, and when the processor executes the computer program, the method for quickly locating and detecting electronic device mainboard path and performance problems described in the first aspect is implemented.

[0023] The beneficial effects of the present invention are:

[0024] The present invention aims to significantly improve the test efficiency and ensure the comprehensiveness of the test process. Through a comprehensive test, the problem can be quickly and accurately located, thereby greatly shortening the time for problem discovery and resolution. Compared with the traditional manual testing method, the present invention greatly reduces the error of human operation, making the test results more accurate and reliable.

[0025] In addition, the present invention has strong versatility and can be applied to various communication function terminal devices. It can quickly detect and evaluate the performance indicators at each access point, so as to quickly identify the specific sections and related devices where the performance bottlenecks and problems are located. In this way, the present invention significantly reduces the time for troubleshooting, improves the efficiency of problem location, and makes maintenance and optimization work more efficient and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a conventional measurement scheme schematic diagram in the prior art;

[0028] Figure 2 It is a principle and step diagram of the method for quickly locating and detecting the mainboard path and performance problems of an electronic device of the present invention;

[0029] Figure 3 This is a diagram of implementation steps of an embodiment of the present invention taking a mobile phone as an example. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] In one embodiment, please refer to Figure 2 As shown, a method for quickly locating and detecting electronic equipment mainboard path and performance problems is provided, comprising the following steps:

[0032] Prepare the test environment and ensure that all test equipment and software tools are ready and in working order;

[0033] Connect the probe to the designated test point on the electronic device motherboard, and ensure that the probe is in good contact with the test point to ensure the accuracy and stability of signal transmission;

[0034] Start the test software, select the corresponding test items, observe the test results on the software interface, and pay attention to whether any abnormal conditions occur;

[0035] According to the recorded data, compare it with the normal value range, analyze the cause of the data abnormality, and based on the analysis results, further check the corresponding path part on the main board of the electronic equipment.

[0036] In one embodiment, if Figure 3 As shown in the figure, by using the probe design, the corresponding software tools can be used to modify and control the corresponding test points. While testing the RFport, the indicators of the probe position can be tested. For example, if the RFport test is abnormal, the abnormal problem point can be determined by viewing the data at the corresponding test point. Specifically, if the TXpower / RSSI test of RFport (④) fails, the order of the TXpower path is ①②③, and the order of the RSSI path is ③②①. By viewing the TXpower / RSSI values ​​corresponding to ①②③, the cause can be quickly located and the problem can be analyzed and analyzed.

[0037] In another embodiment, the method further includes a signal integrity test on the electronic device motherboard to evaluate its performance during high-speed data transmission. By using a high-speed oscilloscope and logic analyzer, the key signal paths on the motherboard can be accurately measured to ensure the accuracy and stability of the signal during transmission. Signal integrity testing helps to find problems such as interference, reflection, and crosstalk caused by high-speed signal transmission, thereby ensuring the performance and reliability of the electronic device when running at high speed.

[0038] In addition, the method also includes environmental adaptability testing of the electronic device motherboard to evaluate its performance under different environmental conditions. By simulating environmental factors such as extreme temperature, humidity, vibration and shock, the stability and reliability of the motherboard under various harsh conditions can be tested. Environmental adaptability testing helps to discover problems that electronic devices may encounter in actual use and ensure that they can work properly in various environments.

[0039] In a further embodiment, the method further includes software compatibility testing of the electronic device motherboard to evaluate its performance under different operating systems and software versions. By running the same test program in different software environments, the compatibility and stability of the motherboard under different software configurations can be checked. Software compatibility testing helps to discover performance problems caused by software incompatibility and ensure that the electronic device can operate normally in various software environments.

[0040] The method and system for quickly locating and detecting electronic equipment mainboard access and performance problems provided by the present invention can comprehensively and accurately evaluate the performance and stability of the electronic equipment mainboard by comprehensively using multiple testing methods. Through these tests, the problem can be quickly located and effective improvement plans can be proposed, thereby improving the overall performance and service life of the electronic equipment.

[0041] The present invention is not only applicable to the research and development and debugging stages, but can also play an important role in various links such as the production process and after-sales maintenance, thereby achieving rapid problem location and efficient problem solving.

[0042] In one embodiment, first, we need to fully preheat the electronic device to ensure that its internal temperature reaches a stable state. This process is crucial because temperature fluctuations may have a significant impact on the test results, resulting in inaccurate test data. Through proper preheating, we can effectively eliminate the test errors caused by such temperature changes.

[0043] Next, after the preheating process is complete, we need to perform a preliminary visual inspection of the electronic device. The purpose of this inspection step is to rule out any obvious physical damage or connection problems. By carefully observing the appearance of the device, the wiring, and the connections between the various components, we can promptly discover and solve some simple problems that may cause the device to operate abnormally.

[0044] If any anomalies are found during the functional test, we will use professional test software to conduct in-depth diagnosis of the corresponding module. This diagnostic process includes a detailed inspection of each component inside the module to locate the specific fault point. In this way, we can accurately identify the problem and provide a clear direction for subsequent repair work.

[0045] Once the fault point is detected, we will take appropriate repair measures based on the type and severity of the fault. For some simple faults, it may only require replacing a damaged component or re-soldering a loose connection point. For more complex faults, more in-depth repair work may be required, such as replacing the entire module or repairing the circuit board. After the repair is completed, we also need to re-perform functional testing and performance testing to ensure that all problems have been thoroughly resolved and the performance of the equipment has returned to normal levels. This verification step is essential because it ensures that the equipment can operate reliably after being put back into use, avoiding further failures caused by unresolved problems.

[0046] In one embodiment, it also includes stress testing the electronic device's mainboard to simulate performance under long-term operation. By applying voltage and current higher than normal operating conditions, the stability and reliability of the mainboard under extreme conditions are observed. Stress testing helps to discover potential hardware defects and ensure that the electronic device can withstand long-term high-load operation in actual use.

[0047] In one embodiment, when upgrading and optimizing the motherboard of an electronic device, we first need to conduct a series of detailed tests and diagnostic analyses. Through these test results and diagnostic analyses, we can gain an in-depth understanding of the current performance status and potential bottlenecks of the motherboard. Based on this information, we can propose a series of specific improvement plans aimed at significantly improving the overall performance of the device and extending its service life.

[0048] Improvement plans may include the following aspects:

[0049] First, we can consider replacing electronic components with better performance. For example, upgrading to a higher frequency processor, a memory module with larger capacity and faster read / write speed, or a more efficient power module. These high-performance electronic components can significantly improve the processing power and stability of the motherboard, thereby improving the operating efficiency of the entire machine.

[0050] Secondly, updating the firmware version is also an important improvement measure. Firmware is the underlying control program of various hardware components on the motherboard. Regular firmware updates can fix known vulnerabilities and compatibility issues, while introducing new features and optimizations to improve the operating efficiency and stability of the hardware. By keeping in close contact with hardware manufacturers and obtaining the latest firmware updates in a timely manner, you can ensure that the motherboard is always in the best working condition.

[0051] Finally, adjusting system settings is also an important aspect of optimizing motherboard performance. By entering the BIOS or UEFI settings interface, we can fine-tune various hardware parameters, such as adjusting memory timing, CPU voltage, and fan speed. Reasonable system settings can ensure that the hardware runs in the best state while avoiding overheating and excessive power consumption, thereby extending the service life of the device.

[0052] In summary, through comprehensive testing, diagnosis and improvement of electronic equipment motherboards, we can significantly improve their overall performance and service life. This requires not only hardware upgrades and optimizations, but also software-level adjustments and support. Only in this way can we ensure that the device can perform well in various application scenarios and meet user needs.

[0053] In one embodiment, it also includes an electromagnetic compatibility (EMC) test of the electronic device motherboard to evaluate its performance in an electromagnetic interference environment. By simulating different electromagnetic interference scenarios, the anti-interference ability and signal integrity of the motherboard are checked to ensure that the electronic device can operate stably in a complex electromagnetic environment.

[0054] It also includes power consumption testing of electronic device motherboards to evaluate their energy consumption performance under different working conditions, and optimizes the energy efficiency of the device by measuring the power consumption of the motherboard under idle, medium load and full load conditions.

[0055] It also includes thermal management testing of electronic device motherboards to evaluate their heat dissipation performance under long-term operation. By simulating high-load working conditions, the temperature distribution and heat dissipation efficiency of the motherboard are measured to ensure that the electronic device will not affect performance or damage hardware due to overheating during long-term use.

[0056] In one embodiment, a system for quickly locating and detecting electronic device mainboard path and performance problems includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. The memory is coupled to the processor, and when the processor executes the computer program, a method for quickly locating and detecting electronic device mainboard path and performance problems is implemented.

[0057] In summary, the present invention aims to significantly improve the test efficiency and ensure the comprehensiveness of the test process. Through a comprehensive test, the problem can be quickly and accurately located, thereby greatly shortening the time for problem discovery and resolution. Compared with the traditional manual testing method, the present invention greatly reduces the error of human operation, making the test results more accurate and reliable.

[0058] In addition, the present invention has strong versatility and can be applied to various communication function terminal devices. It can quickly detect and evaluate the performance indicators at each access point, so as to quickly identify the specific sections and related devices where the performance bottlenecks and problems are located. In this way, the present invention significantly reduces the time for troubleshooting, improves the efficiency of problem location, and makes maintenance and optimization work more efficient and convenient.

[0059] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for quickly locating and detecting electronic equipment mainboard access and performance problems, characterized in that: The following steps are involved: Prepare the test environment and ensure that all test equipment and software tools are ready and in working order; Connect the probe to the designated test point on the electronic device motherboard, and ensure that the probe is in good contact with the test point to ensure the accuracy and stability of signal transmission; Start the test software, select the corresponding test items, observe the test results on the software interface, and pay attention to whether any abnormal conditions occur; According to the recorded data, compare it with the normal value range, analyze the cause of the data abnormality, and based on the analysis results, further check the corresponding path part on the main board of the electronic equipment.

2. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1 is characterized in that: In the method, first, the electronic device is preheated to ensure that its internal temperature reaches a stable state to avoid test errors caused by temperature changes; second, a preliminary visual inspection of the electronic device is performed to eliminate obvious physical damage or connection problems.

3. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1 is characterized in that: In the method, if an abnormality is found during the functional test, the test software is used to perform in-depth diagnosis on the corresponding module to locate the fault point; for the detected fault point, corresponding maintenance measures are taken according to the type and severity of the fault, and after the maintenance, the functional test and performance test are re-performed to ensure that all problems are resolved and the equipment performance is restored to normal levels.

4. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1 is characterized in that: The method also includes stress testing the electronic device motherboard to simulate performance under long-term operation. By applying voltage and current higher than normal working conditions, the stability and reliability of the motherboard under extreme conditions are observed. The stress test helps to discover potential hardware defects and ensure that the electronic device can withstand long-term high-load operation in actual use.

5. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1, characterized in that: The method provides upgrade and optimization suggestions for the electronic device motherboard, and based on the test results and diagnostic analysis, proposes improvements to the motherboard hardware or software to improve the overall performance and service life of the device.

6. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 5, characterized in that: In the method, the improvement plan includes replacing electronic components with better performance, updating firmware versions, or adjusting system settings.

7. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1, characterized in that: The method also includes an electromagnetic compatibility (EMC) test on the electronic device motherboard to evaluate its performance in an electromagnetic interference environment. By simulating different electromagnetic interference scenarios, the anti-interference ability and signal integrity of the motherboard are checked to ensure that the electronic device can operate stably in a complex electromagnetic environment.

8. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1, characterized in that: The method also includes power consumption testing of the electronic device's mainboard to evaluate its energy consumption performance under different working conditions, and optimizing the energy efficiency of the device by measuring the mainboard's power consumption under idle, medium load and full load conditions.

9. The method for quickly locating and detecting electronic equipment mainboard access and performance problems according to claim 1, characterized in that: The method also includes a thermal management test on the electronic device motherboard to evaluate its heat dissipation performance under long-term operation. By simulating a high-load working state, the temperature distribution and heat dissipation efficiency of the motherboard are measured to ensure that the electronic device will not affect performance or damage hardware due to overheating during long-term use.

10. A system for quickly locating and detecting electronic equipment mainboard access and performance problems, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the memory is coupled to the processor, and when the processor executes the computer program, the method for quickly locating and detecting the path and performance problems of the mainboard of an electronic device as described in any one of claims 1 to 9 is implemented.

Images