Silicon wafer cleaning system

Abstract

The invention provides a silicon wafer cleaning system, and relates to the technical field of semiconductors, and the silicon wafer cleaning system comprises a silicon wafer bearing device which is used for bearing the edge of a silicon wafer and driving the silicon wafer to rotate on a horizontal plane; the silicon wafer cleaning device is arranged below the silicon wafer and comprises at least one liquid medicine cleaning nozzle and a liquid medicine supply structure connected with the liquid medicine cleaning nozzle, and the at least one liquid medicine cleaning nozzle is used for absorbing liquid medicine from the liquid medicine supply structure and spraying cleaning liquid medicine towards the center of the back face of the silicon wafer from at least one angle; wherein one liquid medicine cleaning nozzle corresponds to one angle. The problem that the cleaning liquid medicine is sprayed to the front side of the silicon wafer due to the fact that the cleaning liquid medicine is sprayed to the back side of the whole or large-range silicon wafer is solved, and the silicon wafer is supported only by the edge of the silicon wafer, so that the contact area with the silicon wafer and the size of the silicon wafer bearing device are reduced as much as possible; and the problem that the cleaning liquid medicine is possibly collided to the front surface of the silicon wafer by the silicon wafer bearing device is also avoided.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a silicon wafer cleaning system. Background Art

[0002] After the silicon wafer has gone through the chemical grinding and polishing process, grinding fluid or some foreign matter will often remain on the surface of the silicon wafer, so the silicon wafer needs to be cleaned. Currently, the commonly used cleaning method is mainly the single silicon wafer cleaning method, and the single silicon wafer cleaning is mainly carried out by a single wafer cleaning machine.

[0003] During the process of cleaning the silicon wafer by the single-wafer cleaning machine, the silicon wafer is kept facing up, and the silicon wafer cleaning machine sprays cleaning liquid on the back of the silicon wafer to clean and remove the slurry, particles and metal ions remaining on the silicon wafer. However, in the prior art, the cleaning liquid is sprayed on the back of the entire silicon wafer in a large area, which may cause the cleaning liquid to be sprayed on the front of the silicon wafer, or the cleaning liquid may be collided to the front of the silicon wafer by the silicon wafer clamping mechanism, resulting in residual cleaning liquid on the front of the silicon wafer, affecting the yield and quality of the silicon wafer. Summary of the invention

[0004] The embodiment of the present invention provides a silicon wafer cleaning system to solve the problem that the cleaning liquid sprayed on the back side of the silicon wafer by the existing single-wafer cleaning machine may be sprayed or collided onto the front side of the silicon wafer.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] An embodiment of the present invention provides a silicon wafer cleaning system, comprising:

[0007] A silicon wafer carrying device, the silicon wafer carrying device is used to carry the edge of the silicon wafer and drive the silicon wafer to rotate on a horizontal plane;

[0008] A silicon wafer cleaning device, the silicon wafer cleaning device is arranged below the silicon wafer, the silicon wafer cleaning device comprises at least one liquid cleaning nozzle and a liquid supply structure connected to the liquid cleaning nozzle, the at least one liquid cleaning nozzle is used to absorb liquid from the liquid supply structure, and spray the cleaning liquid toward the back center of the silicon wafer from at least one angle;

[0009] Wherein, each of the at least one liquid cleaning nozzle corresponds to a different angle.

[0010] In some embodiments, the silicon wafer cleaning device further includes a liquid medicine recovery mechanism, and the liquid medicine recovery mechanism is disposed below the silicon wafer;

[0011] An opening is provided above the liquid medicine recovery mechanism;

[0012] The liquid recovery mechanism receives the cleaning liquid dripping from the back of the silicon wafer through the opening and recovers the cleaning liquid.

[0013] In some embodiments, the at least one liquid cleaning nozzle comprises a plurality of liquid cleaning nozzles;

[0014] A plurality of the liquid cleaning nozzles are evenly distributed below the silicon wafer;

[0015] The plurality of liquid cleaning nozzles are located at the same level.

[0016] In some embodiments, the liquid medicine recovery mechanism includes a collection tube and a guide tube;

[0017] The collecting tube is funnel-shaped, and the size of the opening above the collecting tube is larger than the size of the opening below the collecting tube;

[0018] The guide tube is in communication with the opening below the collecting cylinder;

[0019] The collecting tube receives the cleaning liquid dripping from the back of the silicon wafer through the opening above the collecting tube;

[0020] The cleaning liquid is diverted and recovered through the opening below the collecting tube and the diversion pipe.

[0021] In some embodiments, at least one through hole is formed on the side wall of the collecting cylinder;

[0022] One of the liquid cleaning nozzles passes through one of the through holes and sprays the cleaning liquid from an angle toward the back center of the silicon wafer.

[0023] In some embodiments, the liquid spraying surface of the liquid cleaning nozzle protrudes from the inner wall surface of the side wall of the collecting tube;

[0024] Wherein, the liquid spraying surface is used for spraying the cleaning liquid.

[0025] In some embodiments, the height of the liquid spray surface protruding from the inner wall surface is 3mm-8mm.

[0026] In some embodiments, in the vertical direction, the center of the lower surface of the silicon wafer is located on the center line of the collecting tube.

[0027] In some embodiments, the liquid cleaning nozzle is made of a high molecular polymer material.

[0028] In some embodiments, the collecting tube is made of polymer material.

[0029] The embodiments of the present invention have the following beneficial effects:

[0030] The silicon wafer cleaning system provided by the embodiment of the present invention supports the edge of the silicon wafer through a silicon wafer supporting device, and sprays cleaning liquid toward the center of the back side of the silicon wafer from different angles through at least one liquid cleaning nozzle in the silicon wafer cleaning device. Afterwards, the silicon wafer is driven to move in a horizontal plane through the edge of the silicon wafer, so that the cleaning liquid in the center of the silicon wafer cleans the entire back side of the silicon wafer, thereby avoiding the problem of cleaning liquid being sprayed onto the front side of the silicon wafer due to spraying cleaning liquid toward the entire or a large area of ​​the back side of the silicon wafer. The silicon wafer is supported only by the edge of the silicon wafer, thereby minimizing the contact area with the silicon wafer and the size of the silicon wafer supporting device, thereby avoiding the problem that the cleaning liquid may be collided with the front side of the silicon wafer by the silicon wafer supporting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram showing the structure of a silicon wafer cleaning system provided by an embodiment of the present invention;

[0032] Figure 2 A three-dimensional schematic diagram showing a side wall integrated with a liquid cleaning nozzle of a collecting cylinder provided in an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 1-silicon wafer carrying device; 2-silicon wafer; 3-chemical liquid cleaning nozzle; 4-chemical liquid recovery mechanism; 5-cover plate. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0036] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0037] In order to solve the problem that the cleaning liquid sprayed on the back side of the silicon wafer by the existing single-wafer cleaning machine may be sprayed or collided onto the front side of the silicon wafer, an embodiment of the present invention provides a silicon wafer cleaning system.

[0038] like Figure 1 As shown, an embodiment of the present invention provides a silicon wafer cleaning system, comprising:

[0039] A silicon wafer carrying device 1, the silicon wafer carrying device 1 is used to carry the edge of the silicon wafer 2 and drive the silicon wafer 2 to rotate on a horizontal plane;

[0040] A silicon wafer cleaning device, wherein the silicon wafer cleaning device is arranged below the silicon wafer 2, and the silicon wafer cleaning device comprises at least one liquid cleaning nozzle 3 and a liquid supply structure connected to the liquid cleaning nozzle 3, wherein the at least one liquid cleaning nozzle 3 is used to absorb liquid from the liquid supply structure and spray cleaning liquid toward the back center of the silicon wafer from at least one angle; each of the at least one liquid cleaning nozzle corresponds to a different angle.

[0041] Among them, each of the at least one liquid cleaning nozzle corresponds to a different angle, which can be understood as, one of the liquid cleaning nozzles 3 corresponds to one angle, or it can be understood as, one of the liquid cleaning nozzles 3 is located at an angle or one of the liquid cleaning nozzles 3 is at an angle and sprays cleaning liquid from the angle toward the center of the back side of the silicon wafer.

[0042] The liquid supply structure is not shown in the figure. The liquid supply structure is used to store the cleaning liquid and provide the cleaning liquid to the liquid cleaning nozzle 3.

[0043] The cleaning liquid is a liquid containing chemical ozone or a liquid containing hydrogen fluoride (HF).

[0044] When cleaning the back side of the silicon wafer (or the lower surface of the silicon wafer), the cleaning liquid is sprayed toward the center of the back side of the silicon wafer 2 through the liquid cleaning nozzles 3 at different angles, and then the silicon wafer 2 is driven to rotate by the silicon wafer carrier 1, so that the cleaning liquid in the center of the silicon wafer 2 flows to the entire back side of the silicon wafer, thereby cleaning the back side of the silicon wafer 2. This avoids the problem of the cleaning liquid being sprayed onto the front side of the silicon wafer due to the cleaning liquid being sprayed toward the entire or a large area of ​​the back side of the silicon wafer.

[0045] The rotation speed of the silicon wafer 2 can be adjusted according to the amount of the sprayed cleaning solution and the size of the silicon wafer.

[0046] Optionally, the rotation speed of the silicon wafer 2 may be 800 rpm-2000 rpm.

[0047] Furthermore, since the silicon wafer carrier 1 only contacts the edge of the silicon wafer 2 and supports the silicon wafer 2 by the edge of the silicon wafer 2, the contact area and contact position between the silicon wafer carrier 1 and the silicon wafer 2 are minimized, thereby avoiding the problem of the cleaning solution being collided by the silicon wafer carrier 1 to the front of the silicon wafer.

[0048] The process of using the above-mentioned liquid cleaning nozzle 3 to clean the lower surface of the silicon wafer 2 can be repeated several times to ensure that the metal impurities and particles on the back of the silicon wafer are effectively removed.

[0049] It should be noted that after the silicon wafer is cleaned by the cleaning solution according to the above process, it is rinsed with deionized water (DIW) and finally dried with nitrogen (N2). After the silicon wafer is dried, the silicon wafer cleaning system can exit the silicon wafer to complete the cleaning.

[0050] The deionized water may also be sprayed toward the center of the lower surface of the silicon wafer 2 using the liquid cleaning nozzle 3 provided in the embodiment of the present invention, and then driven by the rotation of the silicon wafer 2 to the entire lower surface of the silicon wafer 2 .

[0051] For example, ozone water (cleaning solution containing chemical ozone) is first sprayed toward the center of the lower surface of the silicon wafer 2 by the liquid cleaning nozzle 3 for a period of time, and then hydrogen fluoride solution (cleaning solution containing hydrogen fluoride) is sprayed toward the center of the lower surface of the silicon wafer 2 by the liquid cleaning nozzle 3 for a period of time, and then deionized water is sprayed toward the center of the lower surface of the silicon wafer 2 by the liquid cleaning nozzle 3 for a period of time, and then dried.

[0052] In some embodiments, the silicon wafer cleaning system further includes a nitrogen nozzle, and the number of the nitrogen nozzle is at least one. The nitrogen nozzle is used to dry the liquid on the surface and edge of the silicon wafer to dry the silicon wafer.

[0053] In some embodiments, the silicon wafer cleaning system also includes a nozzle holder, which is used to support at least one nitrogen nozzle. The nozzle holder can be designed as a circular ring structure, and the circular ring nozzle holder can adjust the angle of the nitrogen nozzle so that the nitrogen can be accurately sprayed onto the surface and edge of the silicon wafer, thereby improving the accuracy and yield of the process.

[0054] Optionally, the nozzle bracket is also used to adjust the injection angle of the nitrogen nozzle, or drive the nitrogen nozzle to rotate.

[0055] The nozzle bracket drives the nitrogen nozzle to rotate at a speed of 1000prm-2000prm.

[0056] In some embodiments, the angle between the liquid cleaning nozzle 3 and the horizontal plane is between 45° and 60°, so as to avoid the generation of turbulence and achieve the best cleaning effect.

[0057] Optionally, the number of the liquid cleaning nozzles 3 is 5.

[0058] In some embodiments, the silicon wafer cleaning system further includes a nozzle bracket, and the nozzle bracket is used to support the at least one liquid cleaning nozzle 3.

[0059] The nozzle bracket can be designed as a circular ring structure, and the circular ring-shaped nozzle bracket can adjust the angle of the liquid cleaning nozzle 3, so that the cleaning liquid can be accurately sprayed to the center of the back side of the silicon wafer.

[0060] In another optional embodiment, the number of nozzle brackets can be two or three, the two nozzle brackets or the three nozzle brackets have different sizes, and the two nozzle brackets are divided into two inner and outer circles or the three nozzle brackets are divided into three inner and outer circles, and each nozzle bracket carries at least one liquid cleaning nozzle 3.

[0061] Optionally, when there are two nozzle holders, the liquid cleaning nozzle 3 on one nozzle holder is used to spray the cleaning liquid, and the liquid cleaning nozzle 3 on the other nozzle holder is used to spray deionized water.

[0062] When the number of nozzle holders can be three, the liquid cleaning nozzle 3 on one nozzle holder is used to spray ozone water (cleaning liquid containing chemical ozone), the liquid cleaning nozzle 3 on another nozzle holder is used to spray hydrogen fluoride liquid (cleaning liquid containing hydrogen fluoride), and the liquid cleaning nozzle 3 on another nozzle holder is used to spray deionized water.

[0063] Among them, the injection pressures of the liquid cleaning nozzles 3 on different nozzle brackets are different and can be adjusted, and the injection pressure of the liquid cleaning nozzles 3 on the outer ring nozzle bracket is greater than the injection pressure of the liquid cleaning nozzles 3 on the outer ring nozzle bracket.

[0064] The directions of the liquid cleaning nozzles 3 on the same nozzle bracket have the same angle with the horizontal plane.

[0065] In some embodiments, the silicon wafer carrying device 1 includes a support platform and a silicon wafer clamp located above the support platform;

[0066] Among them, the silicon wafer clamp is used to clamp the edge of the silicon wafer to achieve the support of the silicon wafer; the support platform is used to maintain the stability of the silicon wafer clamp.

[0067] Optionally, the silicon wafer clamp is a chuck pin, and there are multiple silicon wafer clamps. In order to maintain the stability of clamping the silicon wafer, the multiple silicon wafer clamps are evenly distributed to clamp the edge of the silicon wafer.

[0068] Therein, a receiving space is provided between the supporting platforms, or the supporting platforms are formed into a ring-shaped structure, and the receiving space or the interior of the ring-shaped structure is used to receive the silicon wafer cleaning device.

[0069] It should also be noted that the silicon wafer supporting device 1 can also drive the silicon wafer to rise and fall, so as to control the position of the silicon wafer and ensure that the cleaning liquid is sprayed to the center of the lower surface of the silicon wafer.

[0070] In some embodiments, the silicon wafer cleaning device further includes a liquid medicine recovery mechanism 4, and the liquid medicine recovery mechanism 4 is disposed below the silicon wafer 2;

[0071] An opening is provided above the liquid medicine recovery mechanism 4;

[0072] The liquid recovery mechanism 4 receives the cleaning liquid dripping from the back side of the silicon wafer 2 through the opening and recovers the cleaning liquid.

[0073] In this embodiment, a liquid medicine recovery mechanism 4 is provided to recover the cleaning liquid after cleaning, so as to avoid environmental pollution or to enable subsequent treatment and use of the recovered liquid medicine.

[0074] The size of the opening can be set according to the size of the silicon wafer 2. On the basis of not hindering the bearing capacity of the silicon wafer, the opening can be designed to be circular with a diameter as close as possible to the diameter of the silicon wafer 2, so as to recycle as much cleaning solution as possible.

[0075] In some embodiments, the at least one liquid cleaning nozzle 3 includes a plurality of liquid cleaning nozzles 3;

[0076] The multiple liquid cleaning nozzles 3 are evenly distributed below the silicon wafer 2, so that the cleaning liquid sprayed to the center of the back side of the silicon wafer 2 by the liquid cleaning nozzles 3 in all directions can be more uniform, thereby causing the cleaning liquid driven by rotation to be more uniform to the entire back side of the silicon wafer.

[0077] The plurality of liquid cleaning nozzles 3 are located at the same level. Arranging the plurality of liquid cleaning nozzles 3 at the same height can also make the intensity of the cleaning liquid sprayed from each liquid cleaning nozzle 3 to the center of the back side of the silicon wafer 2 more uniform.

[0078] In some embodiments, the liquid medicine recovery mechanism 4 includes a collection tube and a guide tube;

[0079] The collecting tube is funnel-shaped, and the size of the opening above the collecting tube is larger than the size of the opening below the collecting tube, that is, one end of the large opening of the funnel-shaped collecting tube faces the lower surface of the silicon wafer 2, and one end of the small opening of the funnel-shaped collecting tube faces the flow guide tube.

[0080] The collecting tube receives the cleaning liquid dripping from the back side of the silicon wafer through the opening above the collecting tube.

[0081] The size of the opening above the collecting tube can be as close as possible to the diameter of the silicon wafer 2, so that as much used cleaning liquid as possible can be recovered.

[0082] The guide tube is communicated with the opening below the collecting tube, and the cleaning liquid is guided and recovered through the opening below the collecting tube and the guide tube.

[0083] By designing a funnel-shaped collecting tube, it is possible to recover the cleaning liquid while saving space, and it is also convenient to integrate the liquid recovery mechanism 4 with the liquid cleaning nozzle.

[0084] In some embodiments, at least one through hole is formed on the side wall of the collecting cylinder;

[0085] One of the liquid cleaning nozzles 3 is provided with one of the through holes, and sprays the cleaning liquid toward the center of the back side of the silicon wafer 2 from an angle.

[0086] That is, in this embodiment, a through hole is opened on the side wall of the collecting tube, and the liquid cleaning nozzle 3 is integrated on the collecting tube through the through hole. Since the collecting tube is funnel-shaped and its side surface is an inclined surface, it is also possible to achieve that one liquid cleaning nozzle 3 is at an inclined angle, and then different liquid cleaning nozzles 3 can spray the cleaning liquid from different angles toward the back center of the silicon wafer 2. Through one device, both the converging spray of the cleaning liquid and the recovery of the used cleaning liquid can be achieved.

[0087] In some embodiments, the liquid spraying surface of the liquid cleaning nozzle 3 protrudes from the inner wall surface of the side wall of the collecting tube; wherein the liquid spraying surface is used to spray the cleaning liquid.

[0088] That is, in this embodiment, the spray surface of the liquid cleaning nozzle 3 is designed to be higher than the inner wall surface of the side wall of the collecting tube, so that the spray surface of the liquid cleaning nozzle 3 can be close to the lower surface of the silicon wafer 2 to avoid splashing of the cleaning liquid sprayed from the spray surface.

[0089] In addition, the spray surface of the liquid cleaning nozzle 3 is designed to be higher than the inner wall surface of the side wall of the collecting tube, which can also prevent the used cleaning liquid from dripping into the liquid cleaning nozzle 3 when the collecting tube is used to collect the used cleaning liquid, causing subsequent contamination problems.

[0090] Optionally, when there are multiple liquid cleaning nozzles 3, the multiple liquid cleaning nozzles 3 are evenly arranged on the side wall of the collecting cylinder, and the heights of the multiple liquid cleaning nozzles 3 remain consistent, that is, the distances between the multiple liquid cleaning nozzles 3 and the lower surface of the silicon wafer in the vertical direction are consistent.

[0091] Figure 2 It is a three-dimensional schematic diagram of the liquid cleaning nozzle 3 integrated into the side wall of the collecting tube.

[0092] In some embodiments, the height of the liquid spray surface protruding from the inner wall surface is 3mm-8mm.

[0093] Preferably, the height of the liquid spraying surface protruding from the inner wall surface is 5 mm.

[0094] In some embodiments, the liquid cleaning nozzle 3 includes an injection part, a bending part and an absorption part, wherein the injection part is a straight tube, the bending part is a curved tube, and the absorption part is a straight tube. The injection part is connected to the absorption part through the bending part, and the injection part, the bending part and the absorption part are connected in sequence. The absorption part is connected to the liquid providing structure.

[0095] Designing the absorption part as a linear tube body allows the liquid cleaning nozzle 3 to smoothly absorb the cleaning liquid in the liquid supply structure.

[0096] The purpose of designing the bent portion is to better integrate the liquid cleaning nozzle 3 into the side of the funnel-shaped collecting tube to save space.

[0097] The spraying part is designed as a linear tube body in order to better control the cleaning liquid sprayed by the spraying part to be directed toward the center of the back side of the silicon wafer, that is, to better control the spraying angle of the cleaning liquid.

[0098] In some embodiments, in the vertical direction, the center of the lower surface of the silicon wafer 2 is located on the center line of the collecting tube.

[0099] That is, the collecting tube is located directly below the lower surface of the silicon wafer 2. This design allows the multiple liquid cleaning nozzles 3 integrated in the collecting tube to be evenly arranged directly below the lower surface of the silicon wafer 2, ensuring that the cleaning liquid sprayed by the multiple liquid cleaning nozzles 3 converges to the center of the lower surface of the silicon wafer 2.

[0100] In some embodiments, the liquid cleaning nozzle 3 is made of a high molecular polymer material.

[0101] Using high molecular polymer material to make the liquid cleaning nozzle 3 can prevent the cleaning liquid from corroding the liquid cleaning nozzle 3, increase the service life of the liquid cleaning nozzle 3, and prevent burrs from forming on the inner wall surface of the liquid cleaning nozzle 3. That is, the inner wall surface of the liquid cleaning nozzle 3 is smooth, which can avoid splashing of the sprayed cleaning liquid.

[0102] Optionally, the high molecular polymer material is perfluoroalkoxy (PFA).

[0103] In some embodiments, the collecting tube is made of polymer material.

[0104] By making the collection tube of polymer material, the cleaning liquid can be prevented from corroding the collection tube, the service life of the collection tube can be increased, and the inner wall surface of the collection tube can be prevented from adhering to the used cleaning liquid, so that the used cleaning liquid can flow into the guide tube more smoothly for recovery.

[0105] In some embodiments, such as Figure 1As shown, the silicon wafer cleaning system further includes a cover plate (Table Cover) 5, which is disposed above the silicon wafer 2, and is used to cover the silicon wafer 2, the silicon wafer supporting device and the silicon wafer cleaning device.

[0106] The cover plate can not only prevent the cleaning liquid from splashing and contaminating other components, but also cover the top of the silicon wafer 2 to prevent other substances or environments from contaminating the front of the silicon wafer 2 during the cleaning of the back of the silicon wafer 2.

[0107] Optionally, the cover plate can be raised and lowered by a driving structure. Before placing the silicon wafer on the silicon wafer carrier, the cover plate is raised to a certain height to facilitate the robot arm to place the silicon wafer on the silicon wafer carrier. After that, the cover plate is driven to descend to a certain height to prevent the cleaning liquid from splashing. After the silicon wafer is cleaned and dried, the cover plate is raised to a certain height to facilitate taking out the silicon wafer for subsequent processing.

[0108] In some embodiments, the silicon wafer cleaning system may further include a brush head, which is disposed above the silicon wafer and is used to clean the upper surface of the silicon wafer.

[0109] When the back side of the silicon wafer is cleaned by the chemical cleaning nozzle 3, the upper surface of the silicon wafer is cleaned by the brush head.

[0110] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A silicon wafer cleaning system, characterized in that: include: A silicon wafer carrying device, the silicon wafer carrying device is used to carry the edge of the silicon wafer and drive the silicon wafer to rotate on a horizontal plane; A silicon wafer cleaning device, the silicon wafer cleaning device is arranged below the silicon wafer, the silicon wafer cleaning device comprises at least one liquid cleaning nozzle and a liquid supply structure connected to the liquid cleaning nozzle, the at least one liquid cleaning nozzle is used to absorb liquid from the liquid supply structure, and spray the cleaning liquid toward the back center of the silicon wafer from at least one angle; Wherein, each of the at least one liquid cleaning nozzle corresponds to a different angle.

2. The silicon wafer cleaning system according to claim 1, characterized in that: The silicon wafer cleaning device further comprises a liquid medicine recovery mechanism, and the liquid medicine recovery mechanism is arranged below the silicon wafer; An opening is provided above the liquid medicine recovery mechanism; The liquid recovery mechanism receives the cleaning liquid dripping from the back of the silicon wafer through the opening and recovers the cleaning liquid.

3. The silicon wafer cleaning system according to claim 1, characterized in that: The at least one liquid cleaning nozzle comprises a plurality of liquid cleaning nozzles; A plurality of the liquid cleaning nozzles are evenly distributed below the silicon wafer; The plurality of liquid cleaning nozzles are located at the same level.

4. The silicon wafer cleaning system according to claim 2, characterized in that: The liquid medicine recovery mechanism includes a collecting tube and a flow guide tube; The collecting tube is funnel-shaped, and the size of the opening above the collecting tube is larger than the size of the opening below the collecting tube; The guide tube is in communication with the opening below the collecting cylinder; The collecting tube receives the cleaning liquid dripping from the back of the silicon wafer through the opening above the collecting tube; The cleaning liquid is diverted and recovered through the opening below the collecting tube and the diversion pipe.

5. The silicon wafer cleaning system according to claim 4, characterized in that: At least one through hole is formed on the side wall of the collecting cylinder; One of the liquid cleaning nozzles passes through one of the through holes and sprays the cleaning liquid from an angle toward the back center of the silicon wafer.

6. The silicon wafer cleaning system according to claim 5, characterized in that: The liquid spraying surface of the liquid cleaning nozzle protrudes from the inner wall surface of the side wall of the collecting tube; Wherein, the liquid spraying surface is used for spraying the cleaning liquid.

7. The silicon wafer cleaning system according to claim 6, characterized in that: The height of the liquid spraying surface protruding from the inner wall surface is 3mm-8mm.

8. The silicon wafer cleaning system according to claim 4, characterized in that: In the vertical direction, the center of the lower surface of the silicon wafer is located on the center line of the collecting tube.

9. The silicon wafer cleaning system according to any one of claims 1 to 3 and 5 to 6, characterized in that: The liquid cleaning nozzle is made of high molecular polymer material.

10. The silicon wafer cleaning system according to claim 4, characterized in that: The collecting tube is made of polymer material.

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