Silicon wafer stacking box and silicon wafer transfer device

Abstract

The utility model discloses a silicon wafer stacking box and a silicon wafer transfer device, the silicon wafer stacking box comprises a bottom plate, baffle plates and an adjusting assembly, the baffle plates are provided with a plurality of wafer placing spaces for placing silicon wafers, the wafer placing spaces are defined above the bottom plate, at least one of the two oppositely arranged baffle plates is connected with the adjusting assembly, and the adjusting assembly is connected with the baffle plates. The adjusting assembly comprises an elastic piece and a driving piece, the elastic piece applies elastic force close to the wafer containing space to the baffle, the driving piece is used for applying acting force away from the wafer containing space to the baffle, the silicon wafer transfer device comprises a silicon wafer stacking box, and the driving piece can enable the baffle to overcome the elastic force of the elastic piece to be opened so that silicon wafers can be loaded and unloaded conveniently. After the driving piece removes driving of the baffle, the baffle is automatically tightened inwards under the action of the elastic force of the elastic piece, and the silicon wafers are aligned and tightly attached to the baffle under the action of the elastic force, so that the silicon wafers are kept stable in the transfer process, and the silicon wafers are prevented from being damaged due to friction and collision between the silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer transfer boxes in the preparation process of solar cell wafers, and particularly relates to a silicon wafer stacking box and a silicon wafer transfer device. Background Art

[0002] During the production process of solar cell wafers, it is necessary to place the silicon wafers in a stacking box, and the silicon wafers are efficiently transferred between different processes by transporting the stacking box. The stacking box in the related technology includes a bottom plate for placing the silicon wafers and side plates located on the periphery of the bottom plate. The side plates limit the silicon wafers within the enclosed space. However, in order to quickly load and unload the silicon wafers, there is a certain gap between the side plates and the silicon wafers, which causes the silicon wafers not to be aligned in the stacking box, and there is a risk of friction and damage to the silicon wafers. In addition, the stability of the silicon wafers during transportation mainly depends on their own gravity, and the shaking of the silicon wafers during transportation easily causes damage to the silicon wafers, resulting in unstable silicon wafer transmission and low silicon wafer transmission yield. Summary of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, the utility model provides a silicon wafer stacking box, which can improve the stability of silicon wafer transmission.

[0004] The utility model also provides a silicon wafer transfer device with the above-mentioned silicon wafer stacking box.

[0005] The silicon wafer stacking box according to the first aspect embodiment of the utility model includes:

[0006] A bottom plate;

[0007] A plurality of baffles are provided and are arranged around the periphery of the bottom plate to define a wafer placement space above the bottom plate for placing the silicon wafers;

[0008] An adjusting assembly, at least one of two relatively arranged baffles is connected to the adjusting assembly. The adjusting assembly includes an elastic member and a driving member. The elastic member and the driving member are both connected to the baffle. The elastic member applies an elastic force to the baffle towards the wafer placement space, and the driving member is used to apply a force to the baffle away from the wafer placement space.

[0009] The silicon wafer stacking box according to the embodiment of the utility model has at least the following beneficial effects:

[0010] In the present utility model, the silicon wafers are placed in a wafer placement space formed by a plurality of baffles surrounding above the bottom plate. The elastic member applies an elastic force towards the baffles to approach the wafer placement space. The driving member is used to apply a force to the baffles away from the wafer placement space, so that the baffles overcome the elastic force of the elastic member and open, facilitating the loading and unloading of the silicon wafers. After the driving member withdraws the driving force on the baffles, the baffles automatically tighten inward under the action of the elastic force of the elastic member. The silicon wafers are aligned and closely attached to the baffles under the action of the elastic force, so that the silicon wafers remain stable during the transfer process and prevent friction and collision between the silicon wafers, causing damage to the silicon wafers.

[0011] According to some embodiments of the present utility model, the baffle is slidably connected to the bottom plate and can approach or move away from the wafer placement space;

[0012] Alternatively, the baffle is rotatably connected to the bottom plate through a rotating shaft, and the part of the baffle above the rotating shaft can approach or move away from the wafer placement space.

[0013] According to some embodiments of the present utility model, the baffle is rotatably connected to the bottom plate through a rotating shaft. The elastic member is located below the rotating shaft and on the side of the baffle facing the wafer placement space. Two ends of the elastic member are respectively connected to the baffle and the bottom plate. The output end of the driving member is located below the rotating shaft and on the side of the baffle facing away from the wafer placement space.

[0014] According to some embodiments of the present utility model, an installation groove is provided on the peripheral side of the bottom plate. The installation groove extends to the peripheral surface of the bottom plate and forms an opening. The elastic member and part of the baffles are accommodated in the installation groove. One end of the elastic member is connected to the groove wall of the installation groove facing away from the opening. The output end of the driving member can enter the installation groove through the opening and push the baffle to rotate.

[0015] According to some embodiments of the present utility model, the adjusting assembly further includes two supports respectively located on opposite sides of the installation groove. The supports are fixed to the top of the bottom plate, and two ends of the rotating shaft are respectively connected to the two supports.

[0016] According to some embodiments of the present utility model, the adjusting assembly further includes a limiting member. The baffle is rotatably connected to the bottom plate through a rotating shaft. The limiting member is located below the rotating shaft and on the side of the baffle facing away from the wafer placement space. The elastic member is located below the rotating shaft and on the side of the baffle facing the wafer placement space. The limiting member can abut against the baffle and limit the rotation angle of the baffle towards the wafer placement space.

[0017] According to some embodiments of the present utility model, the adjusting assembly further includes a base. The base is installed on the bottom plate. The limiting member is detachably connected to the base and can move vertically relative to the base.

[0018] According to some embodiments of the utility model, at least two baffles are arranged opposite to each other along the first direction, and one of the baffles is fixed to the top of the bottom plate, and the other baffle is rotatably connected to the bottom plate, or both of the baffles are rotatably connected to the bottom plate;

[0019] And / or, at least two of the baffles are arranged relatively along the second direction, and one of the baffles is fixed to the top of the base plate, and the other baffle is rotatably connected to the base plate, or both baffles are rotatably connected to the base plate, and the first direction intersects with the second direction.

[0020] According to some embodiments of the present invention, the bottom plate has an operating opening that passes through from top to bottom, and at least part of the driving member is located below the bottom plate and avoids the operating opening.

[0021] According to the second aspect of the present invention, a silicon wafer transfer device includes:

[0022] The silicon wafer stacking box of the first aspect of the embodiment, the bottom plate is provided with an operation opening which passes through from top to bottom;

[0023] The push assembly is located below the bottom plate. The push assembly includes a push plate and a push member. The push plate is connected to the push member and can be pushed by the push member to pass through the operation port and drive the silicon wafer to rise and fall.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 A schematic diagram of an embodiment of a silicon wafer stacking box of the utility model;

[0027] Figure 2 for Figure 1 A top view of the wafer stacking box;

[0028] Figure 3 for Figure 1 Side view of the wafer stacking box;

[0029] Figure 4 for Figure 1 Bottom view of the wafer stacking box;

[0030] Figure 5 This is a schematic diagram of an embodiment of a silicon wafer transfer device of the present invention.

[0031] Reference numerals:

[0032] Silicon wafer stacking box 100, wafer placement space 101, bottom plate 110, operation port 111, installation groove 112, opening 113, baffle 120, adjustment assembly 130, elastic member 131, driving member 132, rotating shaft 133, support 134, limiting member 135, base 136;

[0033] Thrust assembly 200, top plate 210, thrust member 220, guiding structure 230. Detailed implementation manners

[0034] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0035] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0036] In the description of the present utility model, the meaning of several is more than one, and the meaning of multiple is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0037] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0038] In the description of the present utility model, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0039] Referring to Figure 1 , in an embodiment of the present utility model, a wafer stacking box 100 is provided. The wafer stacking box 100 includes a bottom plate 110, a baffle 120, and an adjusting assembly 130. A plurality of baffles 120 are provided and are disposed around the periphery of the bottom plate 110. The plurality of baffles 120 define a wafer placement space 101 above the bottom plate 110 for placing wafers. After the wafers are placed in the placement space 101, they are stacked vertically. The lowermost wafer contacts the top surface of the bottom plate 110, and the bottom plate 110 supports all the wafers in the placement space 101.

[0040] Among the plurality of baffles 120 disposed around the periphery of the bottom plate 110, at least one of the two relatively disposed baffles 120 is connected to the adjusting assembly 130. The adjusting assembly 130 is used to drive the baffle 120 to approach or move away from the placement space 101. When the baffle 120 approaches the placement space 101, the baffles 120 are relatively tightened. The wafers in the placement space 101 are pushed by the baffles 120 to be aligned, and the baffles 120 are in close contact with the wafers, ensuring the stability of the wafers during transfer. When the baffle 120 moves away from the placement space 101, the baffles 120 are relatively opened, and the tightening force of the baffles 120 on the wafers is removed, facilitating the quick loading and unloading of the wafers.

[0041] Specifically, in combination with Figure 2 , the adjusting assembly 130 includes an elastic member 131 and a driving member 132. Both the elastic member 131 and the driving member 132 are connected to the baffle 120. The elastic member 131 applies an elastic force to the baffle 120 to approach the placement space 101, and the driving member 132 is used to apply a force to the baffle 120 to move away from the placement space 101. That is, when the wafers need to be loaded and unloaded, the driving member 132 acts to cause the baffle 120 to open against the elastic force of the elastic member 131, and the baffle 120 withdraws the push on the wafers, facilitating the loading and unloading of the wafers by loading and unloading equipment such as a manipulator in the placement space 101. After the wafers are loaded and unloaded, the driving member 132 retracts, and the baffle 120 automatically tightens inward under the action of the elastic force of the elastic member 131. If there are wafers placed in the placement space 101, the wafers are aligned and in close contact with the baffle 120 under the action of the elastic force, keeping the wafers stable during transfer and preventing friction and collision between the wafers, resulting in damage to the wafers.

[0042] The driving member 132 is provided with a power component capable of providing reciprocating motion, such as a cylinder, an electric cylinder, etc.; the elastic member 131 is provided as an elastic element having a certain elasticity and capable of automatically recovering after deformation, such as a shrapnel, a spring, a soft pad, etc.

[0043] It should be noted that the baffle 120 is arranged to approach or move away from the wafer placement space 101 in a moving or rotating manner. Specifically, in one embodiment, the baffle 120 is slidably connected to the bottom plate 110, and a sliding structure can be arranged between the bottom plate 110 and the baffle 120 to enable the baffle 120 to slide relative to the bottom plate 110. The sliding structure is not limited to the cooperation structure of a chute and a slider, a shaft-hole cooperation structure, etc.; the driving member 132 is arranged to push the baffle 120 to move away from the wafer placement space 101. When the wafer needs to be loaded or unloaded, the driving member 132 drives the baffle 120 to move and open. The elastic member 131 is arranged to push the baffle 120 to move towards the wafer placement space 101. After the wafer is loaded or unloaded, the driving force of the driving member 132 on the baffle 120 is removed, and the baffle 120 is automatically tightened under the push of the elastic member 131.

[0044] Or, in another embodiment, the baffle 120 is rotatably connected to the bottom plate 110 through a rotating shaft 133. The part of the baffle 120 above the rotating shaft 133 can approach or move away from the wafer placement space 101. The driving member 132 is arranged to drive the baffle 120 to rotate, so that the part of the baffle 120 above the rotating shaft 133 rotates away from the wafer placement space 101. When the wafer needs to be loaded or unloaded, the driving member 132 drives the baffle 120 to rotate and open. The elastic member 131 is arranged to push the baffle 120 to rotate towards the wafer placement space 101. After the wafer is loaded or unloaded, the driving force of the driving member 132 on the baffle 120 is removed, and the baffle 120 is automatically tightened under the push of the elastic member 131. It should be noted that in this embodiment, the driving member 132 is provided as a power component capable of outputting rotational power, such as a rotary cylinder. The driving member 132 is connected to the rotating shaft 133, and by driving the rotating shaft 133 to rotate, the rotating shaft 133 drives the baffle 120 to rotate; or, the driving member 132 is provided as a power component capable of outputting linear power, such as a linear cylinder. The output end of the driving member 132 can abut against the baffle 120 and push the baffle 120 to rotate relative to the rotating shaft 133.

[0045] In addition, at least one of the two opposite baffles 120 of the present utility model is connected to the adjusting assembly 130, that is, the two opposite baffles 120 can approach or move away from the wafer placement space 101 simultaneously under the drive of the adjusting assembly 130, or one of the baffles 120 is individually driven by the adjusting assembly 130 to approach or move away from the wafer placement space 101; it can be understood that since the two baffles 120 are oppositely arranged, when at least one of the two baffles 120 approaches the wafer placement space 101, the opposite sides of the silicon wafer can respectively closely adhere to the two side baffles 120 and remain stable under the cooperative limitation of the two baffles 120. When at least one of the two baffles 120 moves away from the wafer placement space 101, the thrust of the two side baffles 120 on the silicon wafer is removed, facilitating the loading and unloading of the silicon wafer.

[0046] Specifically, in one embodiment, at least two baffles 120 are oppositely arranged along the first direction, and one of the two oppositely arranged baffles 120 is fixed to the top of the bottom plate 110, and the other baffle 120 is rotatably connected to the bottom plate 110; that is, one of the baffles 120 always remains fixed, and the other baffle 120 is driven by the adjusting assembly 130 to rotate in the first direction and approach or move away from the wafer placement space 101, and the two baffles 120 cooperate with each other to tighten and closely adhere to the silicon wafer, or open and move away from the silicon wafer. Or, the two opposite baffles 120 are both rotatably connected to the bottom plate 110, that is, the two baffles 120 are both driven by the adjusting assembly 130 to rotate and approach or move away from the wafer placement space 101, and the two baffles 120 cooperate with each other to tighten and closely adhere to the silicon wafer, or open and move away from the silicon wafer.

[0047] Furthermore, in other embodiments, the adjusting assembly 130 is provided with oppositely arranged baffles 120 in different directions, and multiple groups of oppositely arranged baffles 120 cooperate with each other to be able to push the silicon wafer in different directions and closely adhere to the silicon wafer, which can further enhance the stability of the silicon wafer during the transfer process. Specifically, at least two baffles 120 are oppositely arranged along the second direction, the first direction intersects with the second direction, and one of the two oppositely arranged baffles 120 is fixed to the top of the bottom plate 110, and the other baffle 120 is rotatably connected to the bottom plate 110; that is, one of the baffles 120 always remains fixed, and the other baffle 120 is driven by the adjusting assembly 130 to rotate in the second direction and approach or move away from the wafer placement space 101, and the two baffles 120 cooperate with each other to tighten and closely adhere to the silicon wafer, or open and move away from the silicon wafer. Or, the two opposite baffles 120 are both rotatably connected to the bottom plate 110, that is, the two baffles 120 are both driven by the adjusting assembly 130 to rotate and approach or move away from the wafer placement space 101, and the two baffles 120 cooperate with each other to tighten and closely adhere to the silicon wafer, or open and move away from the silicon wafer. It can be understood that the intersection of the first direction and the second direction means that the first direction and the second direction are not parallel, and the included angle formed between the two directions can be an acute angle, an obtuse angle, or a right angle.

[0048] Referring to Figure 1 , in a specific embodiment, the bottom plate 110 is set as a rectangular plate. The peripheral side of the bottom plate 110 has four side edges, and each side edge is connected with a baffle 120, and two sets of baffles 120 arranged oppositely are formed. The two oppositely arranged baffles 120 in the same group can cooperate to tighten or open. The two sets of baffles 120 approach or move away from the silicon wafer from two perpendicular directions respectively to adapt to the transfer requirements of the rectangular silicon wafer. In addition, multiple baffles 120 can be connected to each side edge of the bottom plate 110, and the multiple baffles 120 are respectively attached to the silicon wafer from different positions; each side edge of the bottom plate 110 is connected with a baffle 120, and the baffle 120 is located at the midpoint of the corresponding side edge, so that the transfer of the silicon wafer is more stable.

[0049] For the case where the baffle 120 is rotatably connected to the bottom plate 110 through a rotating shaft 133, in one embodiment, the output end of the driving member 132 can reciprocate and drive the rotating shaft 133 to rotate by pushing the rotating shaft 133. Specifically, the output end of the driving member 132 is located below the rotating shaft 133 and on the side of the baffle 120 facing away from the wafer placement space 101. When the output end of the driving member 132 extends, the extending end of the driving member 132 abuts against the part of the baffle 120 below the rotating shaft 133. The part of the baffle 120 below the rotating shaft 133 receives the driving force of the driving member 132 towards the wafer placement space 101, so that the baffle 120 rotates relative to the rotating shaft 133, and the part of the baffle 120 above the rotating shaft 133 moves away from the wafer placement space 101, causing the baffle 120 to open; when the output end of the driving member 132 retracts, the output end of the driving member 132 moves away from the part of the baffle 120 below the rotating shaft 133, and the driving force of the driving member 132 on the baffle 120 is removed. The baffle 120 rotates relative to the rotating shaft 133 under the action of the elastic member 131, and the part of the baffle 120 above the rotating shaft 133 approaches the wafer placement space 101 and tightens; the output end of the driving member 132 does not need to always contact the baffle 120. After the driving member 132 retracts, the output end of the driving member 132 is separated from the baffle 120, and the baffle 120 rotates only under the action of the elastic member 131, and the tightening process of the baffle 120 is not affected by the driving member 132.

[0050] It can be understood that setting the driving member 132 below the rotating shaft 133 and on the side of the baffle 120 facing away from the wafer placement space 101, on the one hand, the driving member 132 does not occupy the wafer placement space 101 and does not affect the loading and unloading of the silicon wafer in the wafer placement space 101. On the other hand, the driving member 132 is relatively close to the bottom plate 110 and can be conveniently installed on the bottom plate 110.

[0051] Furthermore, referring to Figure 2, the bottom plate 110 is provided with an operation opening 111 penetrating up and down, and the operation opening 111 allows a module for assisting in wafer loading and unloading to extend in and perform corresponding operations. It can be understood that, according to the length of the bottom plate 110 in different directions and the space margin below the bottom plate 110, the driving member 132 can be selectively arranged on the side or below the bottom plate 110. In one embodiment, referring to Figure 3 and Figure 4 , at least a part of the driving member 132 is located below the bottom plate 110 and avoids the operation opening 111. The position setting of the driving member 132 does not affect the normal operation of other modules. Arranging the driving member 132 below the bottom plate 110 can make full use of the vertical space of the wafer stacking box 100, reduce the area of the wafer stacking box 100 in the horizontal direction, and make the internal structure connection of the wafer stacking box 100 more compact.

[0052] In addition, both ends of the elastic member 131 are respectively connected to the baffle 120 and the bottom plate 110. The elastic member 131 is located below the rotating shaft 133 and on the side of the baffle 120 facing the wafer placement space 101. The elastic member 131 can be directly connected by using the side part of the bottom plate 110 and apply an elastic force to the part of the baffle 120 below the rotating shaft 133 to rotate away from the wafer placement space 101. The connection between the elastic member 131 and the bottom plate 110 is more convenient. The output end of the driving member 132 is located below the rotating shaft 133 and on the side of the baffle 120 facing away from the wafer placement space 101. Thus, the driving member 132 and the elastic member 131 are respectively located on opposite sides of the baffle 120 and both act on the part of the baffle 120 below the rotating shaft 133 to apply opposite acting forces to the baffle 120.

[0053] When wafers need to be loaded and unloaded, the output end of the driving member 132 extends out, and the extending end of the driving member 132 abuts against the part of the baffle 120 below the rotating shaft 133. The part of the baffle 120 below the rotating shaft 133 receives the driving force towards the wafer placement space 101 from the driving member 132, causing the baffle 120 to rotate relative to the rotating shaft 133. The part of the baffle 120 above the rotating shaft 133 moves away from the wafer placement space 101, causing the baffle 120 to open, and at the same time, the elastic member 131 is compressed; after the wafer loading and unloading are completed, the output end of the driving member 132 retracts, and the output end of the driving member 132 is separated from the part of the baffle 120 below the rotating shaft 133. The elastic member 131 rebounds and elongates, and applies an elastic force to the part of the baffle 120 below the rotating shaft 133 to move away from the wafer placement space 101, causing the baffle 120 to rotate relative to the rotating shaft 133. The part of the baffle 120 above the rotating shaft 133 approaches the wafer placement space 101 and tightens.

[0054] Such as Figure 2, an installation groove 112 is further provided on the peripheral side of the bottom plate 110. The installation groove 112 extends to the peripheral surface of the bottom plate 110 and forms an opening 113. The elastic member 131 and a part of the baffle 120 are accommodated in the installation groove 112. One end of the elastic member 131 is connected to the groove wall of the installation groove 112 facing away from the opening 113. The output end of the driving member 132 can enter the installation groove 112 through the opening 113 and push the baffle 120 to rotate. The installation groove 112 provides a accommodating space for the elastic member 131 and a part of the baffle 120, and provides a moving space for the baffle 120 and the output end of the driving member 132. The connection between the components in the wafer stacking box 100 is relatively compact, and the exterior of the wafer stacking box 100 is cleaner.

[0055] Further, the adjusting assembly 130 further includes supports 134 respectively located on opposite sides of the installation groove 112. The supports 134 are fixed to the top of the bottom plate 110. Both ends of the rotating shaft 133 are respectively connected to the two supports 134. The two supports 134 cooperate with each other to support the rotating shaft 133, so that the part of the baffle 120 located below the rotating shaft 133 is accommodated in the installation groove 112, facilitating the cooperation with the elastic member 131 and the driving member 132. It can be understood that the baffle 120 is rotatably connected to the support 134 through the rotating shaft 133. For example, both ends of the rotating shaft 133 are fixedly connected to the two supports 134 respectively. The rotating shaft 133 passes through the baffle 120 and is rotatably connected to the baffle 120. Or, rotating shafts 133 are connected to opposite sides of the baffle 120 respectively. One side of the two supports 134 facing each other is provided with a shaft hole. The rotating shaft 133 passes through the shaft hole and is rotatably connected to the support 134.

[0056] The adjusting assembly 130 further includes a limiting member 135. The limiting member 135 is located below the rotating shaft 133 and on the side of the baffle 120 facing away from the wafer placement space 101, without occupying the internal area of the wafer placement space 101, avoiding the wafers. The limiting member 135 can abut against the baffle 120 and limit the rotation angle of the baffle 120 towards the wafer placement hole. After the driving member 132 retracts, the part of the baffle 120 located above the rotating shaft 133 rotates under the elastic force of the elastic member 131 and tightens towards the wafer placement space 101. After the baffle 120 rotates to a certain angle, the part of the baffle 120 located below the rotating shaft 133 abuts against the limiting member 135, restricting the baffle 120 from continuing to rotate towards the wafer placement space 101, so that the baffle 120 tightens to a preset angle, preventing the baffle 120 from being damaged due to excessive tightening under the elastic force of the elastic member 131.

[0057] The adjusting assembly 130 further includes a base 136. The base 136 is installed on the top of the bottom plate 110. The limiting member 135 is detachably connected to the base 136 and can move vertically relative to the base 136 to change the height of the limiting member 135 in the vertical direction, thereby adjusting the preset angle at which the baffle 120 can tighten to adapt to the tightening requirements of wafers of different specifications.

[0058] The detachable connection manner between the limiting member 135 and the base 136 is not limited to threaded connection, snap connection, etc. The limiting member 135 can be connected to the base 136 in the horizontal direction. For example, the limiting member 135 extends horizontally, and the end portion is inserted into the base 136. The base 136 is provided with a slot extending vertically. The limiting member 135 is inserted into the slot and can change its installation position in the slot; or, the limiting member 135 is connected to the base 136 in the vertical direction. For example, a threaded fastener passes through the limiting member 135 and the base 136 vertically, and the height of the limiting member 135 can be adjusted by changing the locking position of the limiting member 135 on the threaded fastener.

[0059] The present utility model further provides a silicon wafer transfer device, which includes the above-mentioned silicon wafer stacking box 100, and further includes a pushing assembly 200. The pushing assembly 200 is located below the bottom plate 110. The bottom plate 110 is provided with an operation opening 111 penetrating up and down. The pushing assembly 200 includes a top plate 210 and a pushing member 220. The top plate 210 is connected to the pushing member 220 and is pushed by the pushing member 220 to pass through the operation opening 111 and drive the silicon wafer to move up and down.

[0060] Specifically, when the top surface of the top plate 210 is higher than the bottom surface of the bottom plate 110, the top plate 210 enters the wafer placement space 101. The silicon wafers in the wafer placement space 101 are supported by the top plate 210 and move up and down following the top plate 210. Exemplarily, when loading silicon wafers into the silicon wafer stacking box 100, the driving member 132 drives the baffle 120 to rotate and open. The top plate 210 rises under the drive of the pushing member 220. The manipulator places the silicon wafers into the wafer placement space 101 and places them on the top plate 210. Each time a silicon wafer is placed into the wafer placement space 101, the pushing member 220 drives the top plate 210 to descend by a preset height, and the preset height is equal to the thickness of a single silicon wafer, so that the placement height and position of the silicon wafers are always kept unchanged, which is convenient for the manipulator to operate and can improve the wafer loading efficiency. After the silicon wafers are placed, the pushing member 220 drives the top plate 210 to descend below the bottom plate 110. The silicon wafers are placed on the bottom plate 110. The driving member 132 retracts, and the baffle 120 rotates under the elastic force of the elastic member 131. The baffle 120 pushes the silicon wafers to align and stick tightly to the silicon wafers, so that the silicon wafers remain stable during subsequent transfer. When it is necessary to unload the silicon wafers, the driving member 132 drives the baffle 120 to rotate and open. The pushing member 220 drives the top plate 210 to rise. The top plate 210 synchronously drives the silicon wafers to rise to a specified height. The manipulator unloads the silicon wafers in the wafer placement space 101. Each time a silicon wafer is unloaded, the pushing member 220 drives the top plate 210 to descend by a preset height, and the preset height is the thickness of a single silicon wafer; after the silicon wafers are unloaded, the pushing member 220 drives the top plate 210 to descend below the bottom plate 110. The driving member 132 retracts, and the baffle 120 rotates and tightens under the elastic force of the elastic member 131.

[0061] Understandably, the pushing member 220 can be set as a screw rod assembly, a cylinder, an electric cylinder or other components capable of outputting linear power; in addition, the pushing assembly 200 further includes a guiding structure 230, and the guiding structure 230 is used to provide guidance when the top plate 210 moves up and down, making the lifting of the top plate 210 more stable. The guiding structure 230 is not limited to a matching structure of a slider and a sliding groove, a shaft hole matching structure, etc.

[0062] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A silicon wafer stacking box, characterized in that: include: Base plate; A plurality of baffles are provided and arranged around the periphery of the bottom plate to define a wafer placement space above the bottom plate for placing silicon wafers; An adjustment component, wherein at least one of the two relatively arranged baffles is connected to the adjustment component, and the adjustment component includes an elastic member and a driving member, wherein both the elastic member and the driving member are connected to the baffle, the elastic member applies an elastic force to the baffle close to the sheet placement space, and the driving member is used to apply a force to the baffle away from the sheet placement space.

2. The silicon wafer stacking box according to claim 1, characterized in that: The baffle is slidably connected to the bottom plate and can be moved close to or away from the film placement space; Alternatively, the baffle is rotatably connected to the bottom plate via a rotating shaft, and a portion of the baffle located above the rotating shaft can be close to or away from the sheet placement space.

3. The silicon wafer stacking box according to claim 1, characterized in that: The baffle is rotatably connected to the base plate via a rotating shaft, the elastic member is located below the rotating shaft and on the side of the baffle facing the sheet placement space, the two ends of the elastic member are respectively connected to the baffle and the base plate, and the output end of the driving member is located below the rotating shaft and on the side of the baffle facing away from the sheet placement space.

4. The silicon wafer stacking box according to claim 3, characterized in that: A mounting groove is provided on the peripheral side of the base plate, and the mounting groove extends to the peripheral surface of the base plate and forms an opening. The elastic member and part of the baffle are accommodated in the mounting groove, and one end of the elastic member is connected to the groove wall of the mounting groove facing away from the opening. The output end of the driving member can enter the mounting groove through the opening and push the baffle to rotate.

5. The silicon wafer stacking box according to claim 4, characterized in that: The adjustment assembly also includes two supports respectively located on two opposite sides of the mounting groove, the supports are fixed to the top of the bottom plate, and the two ends of the rotating shaft are respectively connected to the two supports.

6. The silicon wafer stacking box according to claim 1, characterized in that: The adjustment assembly also includes a limit member, the baffle is rotatably connected to the base plate via a rotating shaft, the limit member is located below the rotating shaft and on the side of the baffle facing away from the sheet placement space, the elastic member is located below the rotating shaft and on the side of the baffle facing the sheet placement space, the limit member can abut against the baffle and limit the rotation angle of the baffle toward the sheet placement space.

7. The silicon wafer stacking box according to claim 6, characterized in that: The adjustment assembly also includes a base, which is installed on the bottom plate. The limiting member is detachably connected to the base and can move vertically relative to the base.

8. The silicon wafer stacking box according to claim 1, characterized in that: At least two baffles are arranged opposite to each other along the first direction, and one of the baffles is fixed to the top of the bottom plate, and the other baffle is rotatably connected to the bottom plate, or both of the baffles are rotatably connected to the bottom plate; And / or, at least two of the baffles are arranged relatively along the second direction, and one of the baffles is fixed to the top of the base plate, and the other baffle is rotatably connected to the base plate, or both baffles are rotatably connected to the base plate, and the first direction intersects with the second direction.

9. The silicon wafer stacking box according to claim 1, characterized in that: The bottom plate has an operation opening which passes through from top to bottom, and at least part of the driving member is located below the bottom plate and avoids the operation opening.

10. A silicon wafer transport device, characterized in that: include: The silicon wafer stacking box according to any one of claims 1 to 9, wherein the bottom plate is provided with an operation opening extending vertically; The push assembly is located below the bottom plate. The push assembly includes a push plate and a push member. The push plate is connected to the push member and can be pushed by the push member to pass through the operation port and drive the silicon wafer to rise and fall.

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