A wafer nitrogen filling and glue removing machine facilitating the adjustment of an LED ultraviolet lamp

Abstract

The present invention discloses a wafer nitrogen filling and glue removing machine facilitating the adjustment of an LED ultraviolet lamp, which relates to the technical field of wafer glue removing processing. A wafer nitrogen filling and glue removing machine facilitating the adjustment of an LED ultraviolet lamp includes a crystal ring clamping and feeding mechanism, and the crystal ring clamping and feeding mechanism is arranged on a mounting shaft. This wafer nitrogen filling and glue removing machine facilitating the adjustment of an LED ultraviolet lamp automatically clamps and feeds a crystal ring with a wafer adhered thereto through the crystal ring clamping and feeding mechanism, and then cooperates with an LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the illumination distance of the LED ultraviolet lamp, and then irradiates and removes the glue from the clamped and fed crystal ring. After the glue removing is completed, the mounting shaft is driven to rotate to the position of the blanking mechanism, and then the blanking mechanism automatically unloads the wafer on the crystal ring after glue removing and simultaneously automatically unloads the crystal ring, thereby realizing the automatic glue removing of the wafer and greatly improving the glue removing efficiency of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer degumming processing, and specifically relates to a wafer nitrogen-filling degumming machine facilitating the adjustment of an LED ultraviolet lamp. Background Art

[0002] In the production process of electronic components such as chips, a wafer is an important basic raw material. When processing the wafer, to avoid damaging the surface of the wafer, a protective film needs to be adhered to the surface of the wafer. Subsequently, the protective film is adhesively bonded to a crystal ring and supported by the crystal ring. Then, the crystal ring is moved for processing. After the processing is completed, the protective film adhered to the crystal ring needs to be separated from the crystal ring, and at the same time, the protective film needs to be separated from the wafer. When separating the protective film, since the protective film is fixed to the wafer by an adhesive, after the protective film is torn, there are still some adhesive blocks adhering to the wafer. Therefore, photo-degumming is often used to bond the protective film to the wafer, and before tearing the protective film, the wafer is placed under a degumming machine for exposure degumming.

[0003] During the use of the current degumming machine, it is usually necessary to manually place the crystal ring with the wafer into the degumming machine for degumming. After degumming, it is manually removed. Subsequently, the protective film is manually torn off from the crystal ring, and the crystal ring is recycled. Then, the wafer with the protective film is placed into the separation process for separation. During the entire degumming process, the operation is relatively cumbersome and the degree of automation is low, resulting in a low degumming efficiency of the wafer. At the same time, the light source for degumming cannot be adjusted during the degumming process, and the light uniformity of the irradiation on the wafer and the crystal ring is low, resulting in a poor degumming effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer nitrogen-filling degumming machine facilitating the adjustment of an LED ultraviolet lamp to solve the deficiencies in the above background art.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A wafer nitrogen-filling degumming machine facilitating the adjustment of an LED ultraviolet lamp, including a main installation box and an installation shaft rotatably connected inside the main installation box. One end of the installation shaft is fixedly connected to a first drive motor fixedly connected to the main installation box through a coupling;

[0007] A crystal ring clamping and material-taking mechanism, which is arranged on the installation shaft and is used for automatically clamping and taking the crystal ring;

[0008] An LED ultraviolet lamp irradiation adjustment mechanism, which is arranged on the installation shaft and is used for irradiating the wafer on the crystal ring and automatically adjusting the light.

[0009] The blanking mechanism is arranged inside the main body of the installation box, and the blanking mechanism is used for automatically blanking the crystal ring and the wafer.

[0010] As a further solution of the present invention: the crystal ring clamping and picking mechanism includes a plurality of connecting columns fixedly connected to the installation shaft. One end of the connecting column is fixedly connected with an installation ring. An installation groove is formed inside the installation ring. A transmission ring is rotatably connected inside the installation groove. A plurality of first electric telescopic rods are fixedly connected inside the transmission ring through connecting blocks. One end of the first electric telescopic rod is fixedly connected with a clamping frame. A second electric telescopic rod is fixedly connected inside the clamping frame. One end of the second electric telescopic rod is fixedly connected with a clamping block;

[0011] One side of the transmission ring is in transmission connection with a first transmission mechanism connected to the installation ring. The first transmission mechanism is used to drive the transmission ring to rotate. A feeding mechanism is arranged inside the main body of the installation box. The feeding mechanism is used for automatically feeding the crystal ring adhered by the protective film.

[0012] As a further solution of the present invention: the feeding mechanism includes a first drawer slidably connected to the main body of the installation box. Two transmission threaded rods are rotatably connected inside the first drawer. A second transmission motor is fixedly connected inside the first drawer. The output end of the second transmission motor is fixedly connected with a first transmission shaft through a coupling. The first transmission shaft and the outer surface of the transmission threaded rod are in transmission connection through a transmission wheel and a transmission belt. A transmission disk is in threaded cooperation with the outer surface of the transmission threaded rod. The top of the transmission disk is slidably connected with a first placement disk through a positioning groove. A first feeding rod is slidably connected to the first placement disk. A plurality of crystal ring bodies are placed inside the first feeding rod. A wafer is adhered to the crystal ring body through a protective film. A buffer rubber pad is fixedly connected to the crystal ring body.

[0013] As a further solution of the present invention: the first transmission mechanism includes a third transmission motor fixedly connected to the installation ring. The output end of the third transmission motor is fixedly connected with a second transmission shaft through a coupling. A transmission gear is fixedly sleeved on the outer surface of the second transmission shaft. The outer surface of the transmission gear is meshed with a transmission tooth ring fixedly connected to the transmission ring.

[0014] As a further solution of the present invention: the LED ultraviolet lamp irradiation adjustment mechanism includes a functional cavity formed on the installation shaft. A plurality of transmission columns are slidably connected inside the functional cavity. One end of the transmission column is fixedly connected with an LED ultraviolet lamp panel body. The outer surface of the transmission column is in transmission connection with an adjustment mechanism connected to the installation shaft. The adjustment mechanism is used to adjust the irradiation distance of the LED ultraviolet lamp panel body to the wafer.

[0015] As a further solution of the present invention: The adjusting mechanism includes a fourth driving motor fixedly connected to the mounting shaft. The output end of the fourth driving motor is fixedly connected with a third transmission shaft rotatably connected to the functional cavity through a coupling. A first bevel gear is fixedly sleeved on the outer surface of the third transmission shaft. A second bevel gear is meshed with the outer surface of the first bevel gear. An adjusting screw rod rotatably connected to the functional cavity is fixedly sleeved in the middle of the second bevel gear. A transmission frame is in threaded cooperation with the outer surface of the adjusting screw rod. The transmission frame is fixedly connected with the transmission column. A slide rod fixedly connected with the functional cavity is slidably connected to the transmission frame.

[0016] As a further solution of the present invention: The blanking mechanism includes a third electric telescopic rod fixedly connected to the main body of the installation box. One end of the third electric telescopic rod is fixedly connected with a transmission plate. A fourth electric telescopic rod is fixedly connected to the bottom of the transmission plate. The bottom end of the fourth electric telescopic rod is fixedly connected with a ring tube through a connecting plate. A plurality of vacuum suction cups are fixedly connected to the outer surface of the ring tube. The outer surface of the ring tube is fixedly connected with a vacuum pump fixedly connected to the main body of the installation box through a hose. A receiving drawer is fixedly connected to one side of the main body of the installation box. A crystal ring blanking mechanism is arranged on the main body of the installation box, and the crystal ring blanking mechanism is used for blanking crystal rings.

[0017] As a further solution of the present invention: The crystal ring blanking mechanism includes a second drawer slidably connected to the main body of the installation box. A second placement plate is fixedly connected in the second drawer. A second blanking rod is fixedly connected to one side of the second placement plate. A fifth electric telescopic rod is fixedly connected to one side of the second placement plate. One end of the fifth electric telescopic rod is fixedly connected with two sixth electric telescopic rods through a connecting block. One end of the sixth electric telescopic rod is fixedly connected with an electromagnetic iron plate through a connecting block.

[0018] As a further solution of the present invention: A nitrogen filling inlet pipe and a nitrogen filling exhaust pipe are fixedly connected to one side of the main body of the installation box.

[0019] As a further solution of the present invention: A glass observation window is fixedly connected to one side of the main body of the installation box.

[0020] The beneficial effects of the present invention:

[0021] (1) Drive the mounting shaft to rotate through the first drive motor. The mounting shaft drives the crystal ring clamping and material taking mechanism to rotate. Subsequently, the crystal ring clamping and material taking mechanism automatically clamps and feeds the crystal ring adhered with wafers. Then, cooperate with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the illumination distance of the LED ultraviolet lamp. Subsequently, irradiate and dissolve the glue of the clamped and fed crystal ring. When the glue dissolution is completed, then drive the mounting shaft to rotate to the position of the unloading mechanism. Subsequently, the unloading mechanism automatically unloads the wafers on the crystal ring after glue dissolution and simultaneously automatically unloads the crystal ring, thereby realizing the automatic glue dissolution of the wafers and greatly improving the glue dissolution efficiency of the wafers.

[0022] (2) The crystal ring clamping and material taking mechanism is used to realize the automatic clamping and material taking of crystal rings of different sizes adhered with wafers. At the same time, after material taking, the wafers are irradiated and dissolved with glue by the main body of the LED ultraviolet lamp panel. At the same time, the clamped crystal ring is driven to rotate by the first transmission mechanism, so that the illumination evenly irradiates the surface of the crystal ring, thereby enabling the uniform illumination and glue dissolution of the crystal ring protective film and the wafers on the protective film, greatly improving the glue dissolution effect of the wafers.

[0023] (3) Drive the third transmission shaft to rotate through the fourth drive motor. The third transmission shaft drives the transmission frame and the transmission column to move through the first bevel gear, the second bevel gear and the adjustment threaded rod. The transmission column drives the main body of the LED ultraviolet lamp panel to move, so that the main body 43 of the LED ultraviolet lamp panel can adjust the illumination range according to the size of the crystal ring, and at the same time adjust the irradiation intensity of the main body 43 of the LED ultraviolet lamp panel, realizing the irradiation and glue dissolution of crystal rings of different sizes. At the same time, by arranging a plurality of main bodies of the LED ultraviolet lamp panel on the outer surface of the mounting shaft 2, the glue dissolution is realized throughout the entire process of clamping, material taking, unloading of the crystal ring, realizing the simultaneous feeding, unloading and glue dissolution, greatly reducing the glue dissolution time and further improving the glue dissolution efficiency of the wafers.

[0024] (4) Drive the crystal ring clamping and material taking mechanism to rotate through the mounting shaft, so that the crystal ring after glue dissolution rotates to the upper part. Then, drive the ring tube and the vacuum suction cup to suck the protective film on the crystal ring. Subsequently, drive the crystal ring to rotate forward and backward by the first transmission mechanism, so that the film adhered with wafers after glue dissolution is separated from the crystal ring. Subsequently, the protective film with wafers is put into the receiving drawer 66, realizing the automatic unloading of the protective film. Then, rotate to the position of the crystal ring unloading mechanism. Subsequently, the crystal ring unloading mechanism automatically unloads the crystal ring, thereby realizing the automatic unloading and collection of the wafers and crystal rings after glue dissolution, without manual operation, greatly improving the glue dissolution efficiency of the wafers. Brief Description of the Drawings

[0025] The present invention will be further described below with reference to the accompanying drawings.

[0026] Figure 1is the first three-dimensional view of the external structure of the present invention;

[0027] Figure 2 is the second three-dimensional view of the external structure of the present invention;

[0028] Figure 3 is the first three-dimensional view of the internal structure of the present invention;

[0029] Figure 4 is the second three-dimensional view of the internal structure of the present invention;

[0030] Figure 5 is the three-dimensional view of the external structure of the mounting ring of the present invention;

[0031] Figure 6 is the three-dimensional view of the internal structure of the mounting ring of the present invention;

[0032] Figure 7 is the front view of the internal structure of the mounting shaft of the present invention;

[0033] Figure 8 is the present invention Figure 3 magnified view of A in;

[0034] Figure 9 is the present invention Figure 3 magnified view of B in;

[0035] Figure 10 is the present invention Figure 4 magnified view of C in.

[0036] In the figure: 1, main body of the installation box; 2, mounting shaft; 3, first drive motor; 11, connecting column; 12, mounting ring; 13, mounting groove; 14, drive ring; 15, first electric telescopic rod; 16, clamping frame; 17, second electric telescopic rod; 18, clamping block; 21, first drawer; 22, drive threaded rod; 23, second drive motor; 24, first drive shaft; 25, drive disk; 26, first placement disk; 27, first feeding rod; 28, main body of the crystal ring; 29, buffer rubber pad; 31, third drive motor; 32, second drive shaft; 33, drive gear; 34, drive gear ring; 41, functional cavity; 42, drive column; 43, main body of the LED ultraviolet lamp panel; 51, fourth drive motor; 52, third drive shaft; 53, first bevel gear; 54, second bevel gear; 55, adjusting threaded rod; 56, drive frame; 61, third electric telescopic rod; 62, drive plate; 63, fourth electric telescopic rod; 64, ring tube; 65, vacuum chuck; 66, receiving drawer; 71, second drawer; 72, second placement disk; 73, second feeding rod; 74, fifth electric telescopic rod; 75, sixth electric telescopic rod; 76, electromagnetic iron plate; 81, nitrogen charging inlet pipe; 82, nitrogen charging exhaust pipe. Detailed implementation manners

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0038] Embodiment 1

[0039] Please refer to Figures 1-10 As shown, the present invention is a wafer nitrogen filling and glue removing machine for facilitating the adjustment of an LED ultraviolet lamp, including a main installation box 1. A mounting shaft 2 is rotatably connected inside the main installation box 1. One end of the mounting shaft 2 is fixedly connected to a first driving motor 3 fixedly connected to the main installation box 1 through a coupling. The first driving motor 3 is controlled by a PLC programming program, and the first driving motor 3 can be controlled to rotate forward and backward and the rotation angle. A crystal ring clamping and material taking mechanism is arranged on the mounting shaft 2, and the crystal ring clamping and material taking mechanism is used for automatically clamping and taking the crystal ring. An LED ultraviolet lamp irradiation adjustment mechanism is arranged on the mounting shaft 2, and the LED ultraviolet lamp irradiation adjustment mechanism is used for irradiating the wafer on the crystal ring and automatically adjusting the light at the same time. A blanking mechanism is arranged inside the main installation box 1, and the blanking mechanism is used for automatically blanking the crystal ring and the wafer.

[0040] One side of the main installation box 1 is fixedly connected with a nitrogen filling inlet pipe 81 and a nitrogen filling exhaust pipe 82.

[0041] The first driving motor 3 drives the mounting shaft 2 to rotate. The mounting shaft 2 drives the crystal ring clamping and material taking mechanism to rotate. Subsequently, the crystal ring clamping and material taking mechanism automatically clamps and loads the crystal ring with the wafer glued on it. Then, it cooperates with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the light distance of the LED ultraviolet lamp. Then, the clamped and loaded crystal ring is irradiated for glue removal. When the glue removal is completed, then it drives the mounting shaft 2 to rotate to the position of the blanking mechanism. Subsequently, the blanking mechanism automatically blanks the wafer on the glue-removed crystal ring and automatically blanks the crystal ring at the same time, thereby realizing the automatic glue removal of the wafer and greatly improving the glue removal efficiency of the wafer.

[0042] At the same time, nitrogen is filled into the main installation box 1 through the cooperation of a nitrogen filling machine, a nitrogen filling inlet pipe 81 and a nitrogen filling exhaust pipe 82, so that light irradiation glue removal is carried out under nitrogen.

[0043] Embodiment 2

[0044] On the basis of Embodiment 1, please refer to Figures 3-6 , Figure 8 and Figure 9As shown in the figure, the crystal ring clamping and picking mechanism includes a plurality of connecting columns 11 fixedly connected to the mounting shaft 2. One end of the connecting column 11 is fixedly connected with a mounting ring 12. An installation groove 13 is formed in the mounting ring 12. A transmission ring 14 is rotatably connected in the installation groove 13. A plurality of first electric telescopic rods 15 are fixedly connected in the transmission ring 14 through connecting blocks. One end of the first electric telescopic rod 15 is fixedly connected with a clamping frame 16. A second electric telescopic rod 17 is fixedly connected in the clamping frame 16. One end of the second electric telescopic rod 17 is fixedly connected with a clamping block 18;

[0045] One side of the transmission ring 14 is drivingly connected with a first transmission mechanism connected to the mounting ring 12. The first transmission mechanism is used to drive the transmission ring 14 to rotate. The first transmission mechanism includes a third transmission motor 31 fixedly connected to the mounting ring 12. The third transmission motor 31 is controlled by a PLC programming program, and the third transmission motor 31 can be controlled to rotate forward and backward and the rotation angle. The output end of the third transmission motor 31 is fixedly connected with a second transmission shaft 32 through a coupling. A transmission gear 33 is fixedly sleeved on the outer surface of the second transmission shaft 32. The outer surface of the transmission gear 33 is meshed with a transmission tooth ring 34 fixedly connected to the transmission ring 14. The second transmission shaft 32 is driven to rotate by the third transmission motor 31. The second transmission shaft 32 drives the transmission tooth ring 34 to rotate through the transmission gear 33, and the transmission tooth ring 34 drives the transmission ring 14 to rotate;

[0046] A feeding mechanism is arranged in the installation box main body 1. The feeding mechanism is used for automatically feeding the crystal rings adhered by the protective film. The feeding mechanism includes a first drawer 21 slidably connected to the installation box main body 1. Two transmission threaded rods 22 are rotatably connected in the first drawer 21. A second transmission motor 23 is fixedly connected in the first drawer 21. The second transmission motor 23 is controlled by a PLC programming program, and the second transmission motor 23 can be controlled to rotate forward and backward and the rotation angle. The output end of the second transmission motor 23 is fixedly connected with a first transmission shaft 24 through a coupling. The outer surface of the first transmission shaft 24 is drivingly connected with the transmission threaded rods 22 through transmission wheels and transmission belts. A transmission disc 25 is in threaded fit with the outer surface of the transmission threaded rod 22. The top of the transmission disc 25 is slidably connected with a first placement disc 26 through a positioning groove. A first feeding rod 27 is slidably connected to the first placement disc 26. A plurality of crystal ring bodies 28 are placed in the first feeding rod 27. A wafer is adhered to the crystal ring body 28 through a protective film. A buffer rubber pad 29 is fixedly connected to the crystal ring body 28,

[0047] By pulling out the first drawer 21, then turning the multiple crystal rings with wafers adhered thereto onto the first feeding rod 27 on the first placing plate 26, then pushing the first drawer 21 into the installation box main body 1, then driving the first transmission shaft 24 to rotate by the second transmission motor 23, the first transmission shaft 24 drives the transmission threaded rod 22 to rotate through the transmission wheel and the transmission belt, the transmission threaded rod 22 drives the transmission plate 25 to move, the transmission plate 25 drives the first placing plate 26 to move upward, the first placing plate 26 drives the multiple crystal rings on the first feeding rod 27 to move upward, so that the top crystal ring enters into the installation ring 12, then driving the clamping frame 16 to move by the first electric telescopic rod 15, then driving the clamping block 18 to move by the second electric telescopic rod 17, the clamping block 18 clamps and fixes the crystal ring, then drives the first placing plate 26 to move downward, thereby realizing the automatic clamping and material taking of crystal rings of different sizes. After the clamping and material taking are completed, then driving the installation shaft 2 to rotate by the first transmission motor 3, and at the same time irradiating and de-bonding the crystal ring by the LED ultraviolet lamp irradiation adjustment mechanism. During the de-bonding process, driving the transmission ring 14 to rotate by the first transmission mechanism, the transmission ring 14 drives the first electric telescopic rod 15 to rotate, the first electric telescopic rod 15 drives the clamping frame 16 to rotate, and the clamping frame 16 drives the crystal ring to rotate, so that the light uniformly irradiates the surface of the crystal ring, thereby uniformly irradiating and de-bonding the crystal ring protective film and the wafer on the protective film, greatly improving the de-bonding effect of the wafer.

[0048] Embodiment 3

[0049] On the basis of Embodiment 2, please refer to Figure 4 and Figure 7 As shown, the LED ultraviolet lamp irradiation adjustment mechanism includes a functional cavity 41 opened on the installation shaft 2. A plurality of transmission columns 42 are slidably connected in the functional cavity 41. One end of the transmission column 42 is fixedly connected with an LED ultraviolet lamp panel main body 43. The outer surface of the transmission column 42 is drivingly connected with an adjustment mechanism connected to the installation shaft 2. The adjustment mechanism is used to adjust the irradiation distance of the LED ultraviolet lamp panel main body 43 on the wafer. The adjustment mechanism includes a fourth transmission motor 51 fixedly connected to the installation shaft 2. The fourth transmission motor 51 is controlled by a PLC programming program, and can control the fourth transmission motor 51 to rotate forward and backward and the rotation angle. The output end of the fourth transmission motor 51 is fixedly connected with a third transmission shaft 52 rotatably connected to the functional cavity 41 through a coupling. A first bevel gear 53 is fixedly sleeved on the outer surface of the third transmission shaft 52. A second bevel gear 54 is meshed with the outer surface of the first bevel gear 53. A regulating threaded rod 55 rotatably connected to the functional cavity 41 is fixedly sleeved in the middle of the second bevel gear 54. A transmission frame 56 is in threaded fit with the outer surface of the regulating threaded rod 55. The transmission frame 56 is fixedly connected with the transmission column 42. A sliding rod fixedly connected with the functional cavity 41 is slidably connected to the transmission frame 56.

[0050] According to the size of the crystal ring, the fourth drive motor 51 drives the third transmission shaft 52 to rotate. The third transmission shaft 52 drives the adjustment screw rod 55 to rotate through the first bevel gear 53 and the second bevel gear 54. The adjustment screw rod 55 drives the transmission frame 56 to move. The transmission frame 56 drives the transmission column 42 to move. The transmission column 42 drives the LED ultraviolet lamp panel main body 43 to move, so that the LED ultraviolet lamp panel main body 43 can adjust the illumination range according to the size of the crystal ring, and at the same time adjust the irradiation intensity of the LED ultraviolet lamp panel main body 43, so as to realize the irradiation and degumming of crystal rings of different sizes. At the same time, by arranging a plurality of LED ultraviolet lamp panel main bodies 43 on the outer surface of the installation shaft 2, degumming is carried out throughout the entire process of clamping, feeding and discharging of the crystal ring, realizing simultaneous feeding and discharging and degumming, greatly reducing the degumming time, and further improving the degumming efficiency of the wafer.

[0051] Example Four

[0052] On the basis of Example Two, please refer to Figure 2 、 Figure 4 、 Figure 8 、 Figure 9 and Figure 10 As shown in, the blanking mechanism includes a third electric telescopic rod 61 fixedly connected to the installation box main body 1. One end of the third electric telescopic rod 61 is fixedly connected with a transmission plate 62. The bottom of the transmission plate 62 is fixedly connected with a fourth electric telescopic rod 63. The bottom end of the fourth electric telescopic rod 63 is fixedly connected with a ring pipe 64 through a connecting plate. A plurality of vacuum suction cups 65 are fixedly connected to the outer surface of the ring pipe 64. The outer surface of the ring pipe 64 is fixedly connected with a vacuum pump fixedly connected to the installation box main body 1 through a hose. One side of the installation box main body 1 is fixedly connected with a receiving drawer 66. A crystal ring blanking mechanism is arranged on the installation box main body 1. The crystal ring blanking mechanism is used for blanking the crystal ring. The crystal ring blanking mechanism includes a second drawer 71 slidably connected to the installation box main body 1. A second placing plate 72 is fixedly connected in the second drawer 71. A second feeding rod 73 is fixedly connected to one side of the second placing plate 72. A fifth electric telescopic rod 74 is fixedly connected to one side of the second placing plate 72. One end of the fifth electric telescopic rod 74 is fixedly connected with two sixth electric telescopic rods 75 through a connecting block. One end of the sixth electric telescopic rod 75 is fixedly connected with an electromagnetic iron plate 76 through a connecting block.

[0053] The first drive motor 3 drives the mounting shaft 2 to rotate. The mounting shaft 2 drives the crystal ring clamping and picking mechanism to rotate above. At this time, the glued crystal ring is basically de-glued. Subsequently, the third electric telescopic rod 61 drives the transmission plate 62 to move. The transmission plate 62 drives the fourth electric telescopic rod 63 to move. The fourth electric telescopic rod 63 drives the ring tube 64 and the vacuum suction cup 65 to move downward. Subsequently, the vacuum suction cup 65 sucks the protective film on the crystal ring. Subsequently, the first transmission mechanism drives the transmission ring 14 to rotate forward and backward. The transmission ring 14 drives the first electric telescopic rod 15 and the clamping frame 16 to rotate. The clamping frame 16 drives the crystal ring to rotate, so that the film with the wafer adhered after de-gluing is separated from the crystal ring. Subsequently, the first electric telescopic rod 15 drives the ring tube 64 to move upward. At the same time, the third electric telescopic rod 61 drives the transmission plate 62 to move, so that the adsorbed protective film with the wafer is placed into the receiving drawer 66, realizing automatic blanking of the protective film. After the blanking is completed, then drive the mounting shaft 2 to rotate to the position of the crystal ring blanking mechanism. Subsequently, the fifth electric telescopic rod 74 drives the sixth electric telescopic rod 75 to move. Subsequently, the sixth electric telescopic rod 75 drives the electromagnetic iron plate 76 to move. Subsequently, the electromagnetic iron plate 76 is electrified, and the electromagnetic iron plate 76 adsorbs the column crystal ring. Subsequently, the clamping block 18 of the clamping frame 16 no longer clamps the crystal ring. Subsequently, the fifth electric telescopic rod 74 drives the sixth electric telescopic rod 75 to move, driving the crystal ring to be inserted into the second feeding rod 73 for collection. Subsequently, the electromagnetic iron plate 76 is powered off. Subsequently, the sixth electric telescopic rod 75 drives the electromagnetic iron plate 76 to move downward for the next crystal ring blanking, realizing automatic blanking of the crystal ring, thereby realizing automatic blanking and collection of the de-glued wafer and crystal ring, without manual operation, and greatly improving the de-gluing efficiency of the wafer.

[0054] The working principle of the present invention: The first drive motor 3 drives the mounting shaft 2 to rotate. The mounting shaft 2 drives the crystal ring clamping and picking mechanism to rotate. Subsequently, the crystal ring clamping and picking mechanism automatically clamps and feeds the crystal ring with the wafer adhered by glue. Subsequently, it cooperates with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the illumination distance of the LED ultraviolet lamp. Subsequently, the clamped and fed crystal ring is irradiated for de-gluing. When the de-gluing is completed, then drive the mounting shaft 2 to rotate to the position of the blanking mechanism. Subsequently, the blanking mechanism automatically blanks the wafer on the de-glued crystal ring, and at the same time automatically blanks the crystal ring, thereby realizing automatic de-gluing of the wafer and greatly improving the de-gluing efficiency of the wafer.

[0055] The above has described a specific embodiment of the present invention in detail, but the content described is only the preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A wafer nitrogen filling and disassembling machine that is convenient for adjusting LED ultraviolet lamps, characterized in that: include: An installation box body (1) and an installation shaft (2) rotatably connected inside the installation box body (1), one end of the installation shaft (2) being fixedly connected to a first transmission motor (3) fixedly connected to the installation box body (1) via a coupling; A wafer ring clamping and picking mechanism, the wafer ring clamping and picking mechanism being arranged on the mounting shaft (2), the wafer ring clamping and picking mechanism being used for automatically clamping and picking the wafer ring; An LED ultraviolet lamp irradiation adjustment mechanism, the LED ultraviolet lamp irradiation adjustment mechanism being arranged on the mounting shaft (2), the LED ultraviolet lamp irradiation adjustment mechanism being used to irradiate the wafers on the wafer ring and automatically adjust the illumination at the same time; A material unloading mechanism, the material unloading mechanism being arranged in the installation box body (1), and being used for automatically unloading wafer rings and wafers; The wafer ring clamping and picking mechanism comprises a plurality of connecting columns (11) fixedly connected to the mounting shaft (2), one end of the connecting column (11) being fixedly connected to a mounting ring (12), a mounting groove (13) being provided in the mounting ring (12), a transmission ring (14) being rotatably connected in the mounting groove (13), a plurality of first electric telescopic rods (15) being fixedly connected in the transmission ring (14) via a connecting block, one end of the first electric telescopic rod (15) being fixedly connected to a clamping frame (16), a second electric telescopic rod (17) being fixedly connected in the clamping frame (16), and one end of the second electric telescopic rod (17) being fixedly connected to a clamping block (18); One side of the transmission ring (14) is transmission-connected to a first transmission mechanism connected to the mounting ring (12), the first transmission mechanism being used to drive the transmission ring (14) to rotate, and a feeding mechanism being provided in the mounting box body (1), the feeding mechanism being used to automatically feed the wafer ring adhered by the protective film.

2. According to claim 1, a wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamps is characterized in that: The feeding mechanism comprises a first drawer (21) slidably connected to the installation box body (1); two transmission threaded rods (22) are rotatably connected in the first drawer (21); a second transmission motor (23) is fixedly connected in the first drawer (21); an output end of the second transmission motor (23) is fixedly connected to a first transmission shaft (24) via a coupling; the first transmission shaft (24) is transmission-connected to the outer surface of the transmission threaded rod (22) via a transmission wheel and a transmission belt; a transmission disk (25) is threadedly matched to the outer surface of the transmission threaded rod (22); a first placement disk (26) is slidably connected to the top of the transmission disk (25) via a positioning groove; a first discharge rod (27) is slidably connected to the first placement disk (26); a plurality of wafer ring bodies (28) are placed in the first discharge rod (27); wafers are adhered to the wafer ring bodies (28) via a protective film; and a buffer rubber pad (29) is fixedly connected to the wafer ring bodies (28).

3. The wafer nitrogen filling and dissolving machine that is convenient for adjusting the LED ultraviolet lamp according to claim 2 is characterized in that: The first transmission mechanism comprises a third transmission motor (31) fixedly connected to the mounting ring (12); an output end of the third transmission motor (31) is fixedly connected to a second transmission shaft (32) via a coupling; a transmission gear (33) is fixedly sleeved on an outer surface of the second transmission shaft (32); and an outer surface of the transmission gear (33) is meshingly connected to a transmission ring gear (34) fixedly connected to the transmission ring (14).

4. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: The LED ultraviolet lamp irradiation adjustment mechanism comprises a functional cavity (41) provided on a mounting shaft (2), a plurality of transmission columns (42) being slidably connected in the functional cavity (41), one end of the transmission column (42) being fixedly connected to an LED ultraviolet lamp panel body (43), an outer surface of the transmission column (42) being transmission-connected to an adjustment mechanism connected to the mounting shaft (2), the adjustment mechanism being used to adjust the irradiation distance of the LED ultraviolet lamp panel body (43) to the wafer.

5. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 4 is characterized in that: The adjustment mechanism comprises a fourth transmission motor (51) fixedly connected to the mounting shaft (2); an output end of the fourth transmission motor (51) is fixedly connected to a third transmission shaft (52) rotatably connected to the functional chamber (41) via a coupling; a first bevel gear (53) is fixedly sleeved on an outer surface of the third transmission shaft (52); a second bevel gear (54) is meshingly connected to an outer surface of the first bevel gear (53); an adjustment threaded rod (55) rotatably connected to the functional chamber (41) is fixedly sleeved in the middle of the second bevel gear (54); a transmission frame (56) is threadedly fitted on an outer surface of the adjustment threaded rod (55); the transmission frame (56) is fixedly connected to the transmission column (42); and a sliding rod fixedly connected to the functional chamber (41) is slidably connected to the transmission frame (56).

6. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: The unloading mechanism comprises a third electric telescopic rod (61) fixedly connected to the installation box body (1); one end of the third electric telescopic rod (61) is fixedly connected to a transmission plate (62); the bottom of the transmission plate (62) is fixedly connected to a fourth electric telescopic rod (63); the bottom end of the fourth electric telescopic rod (63) is fixedly connected to a ring tube (64) via a connecting plate; the outer surface of the ring tube (64) is fixedly connected to a plurality of vacuum suction cups (65); the outer surface of the ring tube (64) is fixedly connected to a vacuum pump fixedly connected to the installation box body (1) via a hose; one side of the installation box body (1) is fixedly connected to a material receiving drawer (66); and a wafer ring unloading mechanism is provided on the installation box body (1), and the wafer ring unloading mechanism is used to unload wafer rings.

7. The wafer nitrogen filling and dissolving machine that is convenient for adjusting the LED ultraviolet lamp according to claim 6 is characterized in that: The wafer ring unloading mechanism comprises a second drawer (71) slidably connected to the installation box body (1); a second placement tray (72) is fixedly connected inside the second drawer (71); a second discharge rod (73) is fixedly connected to one side of the second placement tray (72); a fifth electric telescopic rod (74) is fixedly connected to one side of the second placement tray (72); one end of the fifth electric telescopic rod (74) is fixedly connected to two sixth electric telescopic rods (75) via a connecting block; and one end of the sixth electric telescopic rod (75) is fixedly connected to an electromagnet plate (76) via a connecting block.

8. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: A nitrogen filling air inlet pipe (81) and a nitrogen filling air exhaust pipe (82) are fixedly connected to one side of the installation box body (1).

9. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: A glass observation window is fixedly connected to one side of the installation box body (1).

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