A multi-chip stacked package solid state drive with an integrated heat sink

Abstract

The present invention discloses a multi-chip stacked package solid-state drive with an integrated heat sink, belonging to the technical field of solid-state drives. A multi-chip stacked package solid-state drive with an integrated heat sink of the present invention includes a bottom plate, an integrated heat sink cover and a circuit board. The bottom plate is covered with the integrated heat sink cover, and the integrated heat sink cover and the bottom plate enclose an external package structure. A circuit board is arranged between the bottom plate and the integrated heat sink cover, and a plurality of vertically stacked NAND flash memory chips are arranged on the circuit board. The multi-chip stacked package solid-state drive with an integrated heat sink proposed by the present invention realizes a multi-directional heat dissipation design by arranging a first heat sink on the top of the NAND flash memory chip and a chip side heat dissipation structure on the side of the NAND flash memory chip, ensuring that heat can be quickly exported from multiple directions, improving the overall heat dissipation efficiency, and solving the heat dissipation problem of the multi-chip stacked package solid-state drive.

Description

Technical Field

[0001] The present invention relates to the technical field of solid - state drives, and specifically to a multi - chip stacked package solid - state drive with an integrated heat sink. Background Art

[0002] With the development of information technology, the demand for data storage is increasing day by day. Solid - state drives (SSDs) are widely used in personal computers, servers, and various mobile devices due to their advantages such as fast read - write speed and no mechanical moving parts. However, with the increase in storage density and operating frequency, the heat generated by solid - state drives during operation is gradually increasing, which not only affects the working efficiency of the SSD but also may shorten its service life.

[0003] Chinese Patent with publication number CN112447621B discloses a semiconductor package. In this patent, the heat - dissipating component is on the insulating layer, and the heat - dissipating component includes an area on the upper surface of the first semiconductor chip where the second semiconductor chip is not provided and an area on the upper surface of the second semiconductor chip. The heat - dissipating structures are all located on the upper surface of the chips, making it difficult to dissipate heat from the side of the chips. The heat - dissipating direction is single. Especially in a multi - chip stacked package structure, the demand for heat dissipation is large, and the prior art is difficult to meet the heat - dissipation requirements. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi - chip stacked package solid - state drive with an integrated heat sink. By setting a first heat sink on the top of the NAND flash memory chips and a chip side - heat - dissipation structure on the side of the NAND flash memory chips, a multi - directional heat - dissipation design is realized, ensuring that heat can be quickly exported from multiple directions, improving the overall heat - dissipation efficiency, solving the heat - dissipation problem of the multi - chip stacked package solid - state drive, and solving the problems raised in the above - mentioned background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A multi - chip stacked package solid - state drive with an integrated heat sink, including a bottom plate, an integrated heat - dissipation cover, and a circuit board. The bottom plate is covered with the integrated heat - dissipation cover, and the integrated heat - dissipation cover and the bottom plate enclose an external package structure. A circuit board is arranged between the bottom plate and the integrated heat - dissipation cover. A number of vertically stacked NAND flash memory chips are arranged on the circuit board. The integrated heat - dissipation cover is in contact with the NAND flash memory chips. A ventilation opening structure is arranged on the integrated heat - dissipation cover. A chip side - heat - dissipation structure connected to the side of the stacked NAND flash memory chips is also arranged on the integrated heat - dissipation cover. The ventilation opening structure guides the cooling air to the top of the integrated heat - dissipation cover and the chip side - heat - dissipation structure inside the integrated heat - dissipation cover at the same time, dissipating heat from the top and side of the NAND flash memory chips simultaneously.

[0006] Preferably, a control chip is further provided on the circuit board. The control chip is in contact with the integrated heat sink through heat dissipation posts. Both the NAND flash memory chip and the control chip are mainly cooled by the integrated heat sink above.

[0007] Preferably, the main body of the heat dissipation post is made of heat-conducting rubber. Spiral vanes are provided on the outer wall of the heat-conducting rubber. The heat-conducting rubber absorbs the heat on the control chip and dissipates heat through the first heat sink. The spiral vanes cooperate with the gas flow inside the solid-state drive to improve the heat dissipation effect.

[0008] Preferably, an I-shaped support plate is provided at one end of the bottom plate. Fan slots are symmetrically provided on both sides of the I-shaped support plate. Heat dissipation fans are installed in the fan slots through brackets. Sealing plates are symmetrically provided on both sides of the I-shaped support plate. The I-shaped support plate, the fan slots and the sealing plates are connected in a non-planar manner to form concave and convex grooves, which can increase the heat dissipation area. An air inlet is provided on one side of the fan slot. A first dust-proof net is provided at a position close to the air inlet of the fan slot. Air is supplied to the heat dissipation fans through the air inlet, and the first dust-proof net filters the incoming air to prevent dust from entering the fan slot.

[0009] Preferably, a first heat sink is provided on the top of the integrated heat sink. The first heat sink is perpendicular to the integrated heat sink and is equidistantly distributed, forming a plurality of heat dissipation channels on the top of the integrated heat sink. A air outlet structure is provided at a position of the integrated heat sink close to the fan slot. The air outlet structure is communicated with the fan slot to blow out the heat dissipation air in the fan slot.

[0010] Preferably, the air outlet structure includes an upper top plate, an inclined panel, a triangular plate and a lower hanging plate. The upper top plate is connected to the first heat sink. One side of the upper top plate is closed with the upper end of the fan slot. Triangular plates are symmetrically provided on both sides of the lower surface of the upper top plate. The lower end of the triangular plate is fixedly connected to the inclined panel. The lower end position of the inclined panel is lower than the lower end of the first heat sink. Air blows from the lower end of the inclined panel to the upper end of the inclined panel. The inclined panel and the triangular plate play a guiding role and can accelerate the heat dissipation of the first heat sink. The upper top plate can block the inclined panel to achieve the effects of waterproofing and dust-proofing. In addition, due to the inclined setting of the inclined panel, it can play a water guiding effect to waterproof the circuit board in the solid-state drive. The lower end of the inclined panel is connected to one side of the fan slot through the lower hanging plate. Air distribution holes are provided on the inclined panel. A waterproof plate is fixedly connected to the side of the air distribution hole far from the fan slot. The air distribution holes are inclined towards the fan slot, and the air at the air outlet of the fan slot moves along the direction of the inclined panel.

[0011] Preferably, a heat-conducting silicone grease layer is provided on the top and side walls of the NAND flash memory chip. The heat-conducting silicone grease layer is filled between the NAND flash memory chip, the integrated heat sink and the chip side heat dissipation structure to reduce the thermal resistance and improve the heat conduction efficiency. The chip side heat dissipation structure includes heat-conducting side plates and a second heat sink. The second heat sink is sandwiched between two layers of heat-conducting side plates. The heat-conducting side plates and the second heat sink form a heat dissipation channel below the air distribution holes.

[0012] Preferably, the second heat sink has a wavy and discontinuous structure, and a partition board is arranged at the middle position of the heat-conducting side plate. The second heat sinks on both sides of the partition board are symmetrically arranged, and the positions where the second heat sinks are provided with notches are bent towards the partition board.

[0013] Preferably, an air outlet structure is arranged at one end of the integrated heat sink away from the air outlet structure. The air outlet structure includes a V-shaped plate recessed into the integrated heat sink and a third dust-proof net. The third dust-proof net covers one side of the V-shaped plate. An air outlet is formed in the side plate above the V-shaped plate, and the air outlet is arranged downward, which can play a waterproof role, and the third dust-proof net enhances the dust-proof effect.

[0014] Preferably, a tray assembly for supporting the circuit board is arranged on the integrated heat sink. The tray assembly includes a guide rod, a tray body is sleeved on the guide rod, the tray body is connected to both sides of the circuit board, a support spring is sleeved on the guide rod below the tray body, and the support spring plays a buffering role for the tray body when vibration occurs. A shock-absorbing rod is also arranged on the lower surface of the tray body, and the shock-absorbing rod is hinged to the tray body and the bottom plate at the same time. The shock-absorbing rod and the support spring cooperate to reduce the influence of vibration on the circuit board.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] A multi-chip stacked package solid-state hard disk with an integrated heat sink proposed by the present invention realizes a multi-faceted heat dissipation design by arranging a first heat sink on the top of the NAND flash memory chip and a chip side heat dissipation structure on the side of the NAND flash memory chip, ensuring that heat can be quickly exported from multiple directions, improving the overall heat dissipation efficiency, solving the heat dissipation problem of the multi-chip stacked package solid-state hard disk. The first heat sink and the second heat sink can be cooled through the air outlet structure, and at the same time, the design of the inclined panel can play a waterproof role. A tray assembly is arranged below the circuit board to absorb vibration energy, protect internal components, and improve the seismic performance of the solid-state hard disk. The good heat dissipation design ensures that the chip can still maintain high performance under high load, avoiding performance degradation caused by overheating. The uniform heat dissipation and reliable physical protection enable the solid-state hard disk to operate stably in various environments, improving the overall performance and stability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the overall structure diagram of the multi-chip stacked package solid-state hard disk with an integrated heat sink of the present invention;

[0018] Figure 2 It is the exploded view of the multi-chip stacked package solid-state hard disk with an integrated heat sink of the present invention;

[0019] Figure 3Internal structure diagram of the bottom plate and integrated heat dissipation cover of the present invention;

[0020] Figure 4 Structure diagram of the bottom plate of the present invention;

[0021] Figure 5 Cross-sectional view of the bottom plate and integrated heat dissipation cover of the present invention;

[0022] Figure 6 Partial structure diagram of the chip side heat dissipation structure of the present invention;

[0023] Figure 7 Structure diagram of the pallet assembly of the present invention.

[0024] In the figure: 1. Bottom plate; 11. I-shaped support plate; 12. Fan slot; 121. Air inlet; 122. First dust-proof net; 13. Sealing plate; 2. Integrated heat dissipation cover; 21. First heat sink; 22. Air outlet structure; 221. Upper top plate; 222. Inclined panel; 2221. Air distribution hole; 2222. Waterproof plate; 223. Triangular plate; 224. Lower hanging plate; 2241. Second dust-proof net; 23. Chip side heat dissipation structure; 231. Heat conduction side plate; 2311. Partition plate; 232. Second heat sink; 24. Heat dissipation column; 241. Heat conduction rubber; 242. Spiral blade; 25. Air outlet structure; 251. V-shaped plate; 2511. Air outlet; 252. Third dust-proof net; 26. Pallet assembly; 261. Guide rod; 262. Pallet body; 263. Support spring; 264. Shock-absorbing rod; 3. Circuit board; 31. NAND flash chip; 311. Heat conduction silicone grease layer; 32. Control chip; 4. Heat dissipation fan. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] In order to solve the problem that the existing heat dissipation structures are all located on the upper surface of the chip, it is difficult to achieve heat dissipation on the side of the chip, the heat dissipation direction is single, especially in the multi-chip stacked packaging structure, the demand for heat dissipation is large, and the existing technology is difficult to meet the heat dissipation needs. Please refer to Figures 1-7 This embodiment provides the following technical solutions:

[0027] A multi-chip stacked package solid-state drive with an integrated heat sink, comprising a bottom plate 1, an integrated heat sink cover 2, and a circuit board 3. The bottom plate 1 and the integrated heat sink cover 2 are covered together, and the integrated heat sink cover 2 and the bottom plate 1 enclose an external package structure, and a circuit board 3 is arranged between the bottom plate 1 and the integrated heat sink cover 2.

[0028] On the circuit board 3, a plurality of vertically stacked NAND flash memory chips 31 are arranged. The multiple NAND flash memory chips 31 are closely arranged to form multiple storage units to achieve high-density storage. The NAND flash memory chips 31 are stacked by using the through-silicon via technology or the micro-bump technology, saving the space of the solid-state drive. The through-silicon via technology is to vertically drill holes inside the chip and fill them with conductive materials to form vertical interconnection channels. The micro-bump technology is to fabricate tiny metal bumps on the chip surface and connect the chips through these bumps. The top of the NAND flash memory chip 31 is in contact with the integrated heat sink cover 2. A control chip 32 is also arranged on the circuit board 3. The control chip 32 is in contact with the integrated heat sink cover 2 through a heat dissipation column 24. Both the NAND flash memory chip 31 and the control chip 32 are mainly cooled by the integrated heat sink cover 2 above.

[0029] One end of the bottom plate 1 is provided with an I-shaped support plate 11. On both sides of the I-shaped support plate 11, fan slots 12 are symmetrically arranged. A heat dissipation fan 4 is installed in the fan slots 12 through brackets. An air inlet 121 is opened on one side of the fan slots 12. A first dust-proof net 122 is arranged at a position of the fan slots 12 close to the air inlet 121. Air is supplied to the heat dissipation fan 4 through the air inlet 121, and the first dust-proof net 122 filters the incoming air to prevent dust from entering the fan slots 12. Sealing plates 13 are symmetrically arranged on both sides of the I-shaped support plate 11. The sealing plates 13 are perpendicularly connected to the I-shaped support plate 11. The I-shaped support plate 11, the fan slots 12, and the sealing plates 13 are non-planar connected to form concave and convex grooves, which can increase the heat dissipation area. At positions of the integrated heat sink cover 2 close to the I-shaped support plate 11, the fan slots 12, and the sealing plates 13, connection fixing plates are arranged.

[0030] On the top of the integrated heat sink cover 2, a first heat sink 21 is arranged. The first heat sink 21 is perpendicular to the integrated heat sink cover 2 and is equidistantly distributed, forming multiple heat dissipation channels on the top of the integrated heat sink cover 2. A heat dissipation port structure 22 is opened at a position of the integrated heat sink cover 2 close to the fan slots 12. The heat dissipation port structure 22 is communicated with the fan slots 12 to blow out the heat dissipation air in the fan slots 12.

[0031] The air diffuser structure 22 includes an upper top plate 221, an inclined panel 222, a triangular plate 223 and a hanging plate 224. The upper top plate 221 is connected to the first heat sink 21. One side of the upper top plate 221 is covered with the upper end of the fan slot 12. Triangular plates 223 are symmetrically arranged on both sides of the lower surface of the upper top plate 221. The lower end of the triangular plate 223 is fixedly connected to the inclined panel 222. The lower end position of the inclined panel 222 is lower than the lower end of the first heat sink 21. Wind blows from the lower end of the inclined panel 222 to the upper end of the inclined panel 222. The inclined panel 222 and the triangular plate 223 play a guiding role and can accelerate the heat dissipation of the first heat sink 21. The upper top plate 221 can shield the inclined panel 222 and play a waterproof and dustproof effect. Coupled with the inclined setting of the inclined panel 222, it can play a water guiding effect to waterproof the circuit board 3 in the solid-state drive. The lower end of the inclined panel 222 is connected to one side of the fan slot 12 through the hanging plate 224 to ensure the sealing of the connection between the bottom plate 1 and the integrated heat dissipation cover 2. A second dust-proof net 2241 is arranged between the hanging plate 224 and the upper top plate 221. The second dust-proof net 2241 filters the air for the second time to achieve waterproof and dustproof effects.

[0032] Meanwhile, in order to improve the heat dissipation inside the solid-state drive, air distribution holes 2221 are formed in the inclined panel 222. A waterproof plate 2222 is fixedly connected to the side of the air distribution holes 2221 away from the fan slot 12. The air distribution holes 2221 are inclined towards the fan slot 12. The wind at the air outlet of the fan slot 12 moves along the direction of the inclined panel 222. Part of the wind enters the air distribution holes 2221. The air distribution holes 2221 are communicated with the structure enclosed by the bottom plate 1 and the integrated heat dissipation cover 2. And a chip side heat dissipation structure 23 communicated with the air distribution holes 2221 is arranged below the inclined panel 222.

[0033] To improve the lateral heat dissipation effect of the NAND flash memory chip 31, a chip lateral heat dissipation structure 23 connected thereto is provided on the side of the stacked NAND flash memory chips 31. A thermal grease layer 311 is provided on the top and side walls of the NAND flash memory chip 31. The thermal grease layer 311 is filled between the NAND flash memory chip 31, the integrated heat dissipation cover 2, and the chip lateral heat dissipation structure 23 to reduce the thermal resistance and improve the heat conduction efficiency. The specific structure of the chip lateral heat dissipation structure 23 includes a heat conduction side plate 231 and a second heat sink 232. The second heat sink 232 is sandwiched between two layers of heat conduction side plates 231. The heat conduction side plate 231 and the second heat sink 232 form a heat dissipation channel below the air distribution hole 2221. The second heat sink 232 has a wavy and discontinuous structure, and a partition plate 2311 is provided at the middle position of the heat conduction side plate 231. The second heat sinks 232 on both sides of the partition plate 2311 are symmetrically arranged. The positions where the second heat sink 232 is provided with notches are bent toward the partition plate 2311. When the air distribution hole 2221 blows air toward the chip lateral heat dissipation structure 23, the air flow in the chip lateral heat dissipation structure 23 is accelerated, and the second heat sink 232 dissipates heat. At the same time, the air flow speed in the chip lateral heat dissipation structure 23 is fast, and the guiding of the second heat sink 232 can attract the air outside the chip lateral heat dissipation structure 23 to move into the chip lateral heat dissipation structure 23, thereby accelerating the gas flow in the solid-state drive and improving the lateral heat dissipation effect of the NAND flash memory chip 31.

[0034] The main body of the heat dissipation column 24 connected to the control chip 32 is a heat-conducting rubber 241. A spiral blade 242 is provided on the outer wall of the heat-conducting rubber 241. The heat-conducting rubber 241 absorbs the heat on the control chip 32 and dissipates heat through the first heat sink 21. The spiral blade 242 cooperates with the gas flow in the solid-state drive to improve the heat dissipation effect. Heat-conducting copper wires can also be provided in the heat-conducting rubber 241, and the lower ends of the heat-conducting copper wires penetrate through the control chip 32 to further improve the heat dissipation effect of the control chip 32.

[0035] An air outlet structure 25 is provided at one end of the integrated heat dissipation cover 2 away from the air outlet structure 22. The air outlet structure 25 includes a V-shaped plate 251 recessed into the integrated heat dissipation cover 2 and a third dust-proof net 252 provided in front of the V-shaped plate 251. An air outlet 2511 is opened on the side plate above the V-shaped plate 251, and the air outlet 2511 is arranged downward, which can play a waterproof role. The third dust-proof net 252 enhances the dust-proof effect.

[0036] A support board assembly 26 for supporting the circuit board 3 is provided on the integrated heat sink cover 2. The support board assembly 26 includes guide rods 261. A support board body 262 is sleeved on the guide rods 261. The support board body 262 is connected to both sides of the circuit board 3. A support spring 263 is sleeved on the guide rods 261 below the support board body 262. The support spring 263 plays a buffering role for the support board body 262 when vibration occurs. A shock-absorbing rod 264 is further provided on the lower surface of the support board body 262. The shock-absorbing rod 264 is hingedly connected to both the support board body 262 and the bottom plate 1. The shock-absorbing rod 264 and the support spring 263 cooperate to reduce the impact of vibration on the circuit board 3.

[0037] Working process: Vertically drill holes in the NAND flash memory chip and fill them with conductive materials to form vertical interconnection channels. Stack multiple NAND flash memory chips 31 vertically to form multiple layers of memory cells. Fill a thermal grease layer 311 between the top of the NAND flash memory chip 31 and the integrated heat sink cover 2, and between the side of the NAND flash memory chip 31 and the chip side heat dissipation structure 23. A heat dissipation column 24 connected to the inner top of the integrated heat sink cover 2 is provided on the top of the control chip 32. Connect the circuit board 3 to the support board body 262, and the bottom plate 1 is covered and encapsulated with the integrated heat sink cover 2. During the use of the solid-state drive, the first heat sink 21 directly absorbs heat from the NAND flash memory chip 31, and at the same time absorbs the heat on the control chip 32 through the heat dissipation column 24. To improve heat dissipation, the cooling fan 4 can be turned on. The cooling fan 4 blows air. Under the guidance of the air outlet structure 22, part of the air blows towards the first heat sink 21 to cool the first heat sink 21, and part of the air blows towards the chip side heat dissipation structure 23 to dissipate heat from the side of the NAND flash memory chip 31, accelerating the internal gas flow of the solid-state drive. At the same time, the internal gas of the solid-state drive is discharged from the air outlet 2511 on the V-shaped plate 251. The support board body 262 is connected to the circuit board 3, and the shock-absorbing rod 264 and the support spring 263 cooperate to reduce the impact of vibration on the circuit board 3.

[0038] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0039] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A multi-chip stacked package solid-state hard disk with an integrated heat sink, comprising a base plate (1), an integrated heat sink cover (2) and a circuit board (3), characterized in that: The bottom plate (1) is covered with the integrated heat dissipation cover (2), the integrated heat dissipation cover (2) and the bottom plate (1) enclose an external structure of the package, a circuit board (3) is arranged between the bottom plate (1) and the integrated heat dissipation cover (2), a plurality of vertically stacked NAND flash memory chips (31) are arranged on the circuit board (3), the integrated heat dissipation cover (2) is in contact with the NAND flash memory chips (31), an air dissipation vent structure (22) is arranged on the integrated heat dissipation cover (2), and a chip side heat dissipation structure (23) connected to the side of the stacked NAND flash memory chips (31) is also arranged on the integrated heat dissipation cover (2), the air dissipation vent structure (22) simultaneously guides heat dissipation air to the top of the integrated heat dissipation cover (2) and the chip side heat dissipation structure (23) inside the integrated heat dissipation cover (2), thereby dissipating heat from the top and side of the NAND flash memory chips (31) at the same time; A control chip (32) is also provided on the circuit board (3); the control chip (32) contacts the integrated heat dissipation cover (2) via a heat dissipation column (24); the heat dissipation column (24) has a main body made of heat-conducting rubber (241); and spiral blades (242) are provided on the outer wall of the heat-conducting rubber (241); The top of the integrated heat dissipation cover (2) is provided with a first heat dissipation fin (21); a position of the integrated heat dissipation cover (2) close to the fan slot (12) is provided with an air dissipation outlet structure (22); the air dissipation outlet structure (22) is in communication with the fan slot (12); the air dissipation outlet structure (22) comprises an upper top plate (221), an inclined plate (222), a triangular plate (223) and a lower hanging plate (224); the upper top plate (221) is connected to the first heat dissipation fin (21); one side of the upper top plate (221) is provided with an air dissipation outlet structure (22); the air dissipation outlet structure (22) is in communication with the fan slot (12); the air dissipation outlet structure (22) comprises an upper top plate (221), an inclined plate (222), a triangular plate (223) and a lower hanging plate (224); the upper top plate (221) is connected to the first heat dissipation fin (21); The upper side of the upper top plate (221) covers the upper end of the fan slot (12); triangular plates (223) are symmetrically arranged on both sides of the lower surface of the upper top plate (221); the lower end of the triangular plates (223) is fixedly connected to the inclined plate (222); the lower end of the inclined plate (222) is connected to one side of the fan slot (12) via a lower hanging plate (224); an air distribution hole (2221) is provided on the inclined plate (222); and a waterproof plate (2222) is fixedly connected to the side of the air distribution hole (2221) away from the fan slot (12).

2. The multi-chip stacked package solid state drive with integrated heat sink according to claim 1, characterized in that: An I-shaped support plate (11) is provided at one end of the bottom plate (1), fan slots (12) are symmetrically provided on both sides of the I-shaped support plate (11), a heat dissipation fan (4) is installed in the fan slot (12) via a bracket, sealing plates (13) are symmetrically provided on both sides of the I-shaped support plate (11), an air inlet (121) is provided on one side of the fan slot (12), and a first dustproof net (122) is provided at a position of the fan slot (12) close to the air inlet (121).

3. The multi-chip stacked package solid state drive with integrated heat sink according to claim 1, characterized in that: The top and side walls of the NAND flash memory chip (31) are provided with a thermally conductive silicone grease layer (311), the thermally conductive silicone grease layer (311) is filled between the chip side heat dissipation structure (23) and the NAND flash memory chip (31), the chip side heat dissipation structure (23) comprises a thermally conductive side plate (231) and a second heat sink (232), the thermally conductive side plate (231) is provided with two layers, and the second heat sink (232) is sandwiched between the two layers of the thermally conductive side plates (231).

4. The multi-chip stack package solid state drive with integrated heat sink according to claim 3, characterized in that: The second heat sink (232) is a wave-shaped discontinuous structure, and a partition plate (2311) is provided in the middle of the heat-conducting side plate (231), the second heat sinks (232) on both sides of the partition plate (2311) are symmetrically arranged, and the positions where the second heat sinks (232) are provided with notches are all bent in the direction of the partition plate (2311).

5. The multi-chip stacked package solid state drive with integrated heat sink according to claim 4, characterized in that: An air outlet structure (25) is provided at one end of the integrated heat dissipation cover (2) away from the air dissipation outlet structure (22); the air outlet structure (25) comprises a V-shaped plate (251) recessed into the interior of the integrated heat dissipation cover (2) and a third dustproof net (252); the third dustproof net (252) covers one side of the V-shaped plate (251); and an air outlet (2511) is provided on a side plate above the V-shaped plate (251).

6. The multi-chip stack package solid state drive with integrated heat sink according to claim 5, characterized in that: The integrated heat dissipation cover (2) is provided with a support plate assembly (26) for supporting the circuit board (3), the support plate assembly (26) comprising a guide rod (261), a support plate body (262) being sleeved on the guide rod (261), the support plate body (262) being connected to two sides of the circuit board (3), a support spring (263) being sleeved on the guide rod (261) below the support plate body (262), and a shock absorbing rod (264) being further provided on the lower surface of the support plate body (262).

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