PCB assembly and household electrical appliance

Abstract

The invention provides a PCB assembly and a household electrical appliance, the PCB assembly comprises a PCB and a conductive pump, the conductive pump comprises a first electrode, a second electrode and a heat dissipation flow channel used for accommodating a dielectric medium, and the heat dissipation flow channel is arranged on the PCB; at least one part of the first electrode and at least one part of the second electrode are located in the heat dissipation flow channel; the first electrode and the second electrode are used for being electrically connected with a voltage generating device so as to form an electric field between the first electrode and the second electrode for driving the dielectric in the heat dissipation flow channel to flow. According to the technical scheme, effective integration of the conductance pump and the PCB is achieved, when the first electrode and the second electrode are electrically connected with the voltage generation device, an electric field can be formed between the first electrode and the second electrode to drive the dielectric in the heat dissipation flow channel to flow, the dielectric can exchange heat with the surrounding environment in the flowing process, and therefore the heat dissipation efficiency is improved. Therefore, heat on the PCB is taken away, and efficient heat dissipation of the PCB is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB board heat dissipation, and in particular relates to a PCB board component and a household appliance. Background Art

[0002] In recent years, electronic technology has developed rapidly, and the integration of electronic components has become increasingly higher, accompanied by the heat dissipation problem of high-power components (such as CPU, GPU, etc.). At present, the commonly used PCB heat dissipation technologies on the market include heat sinks and heat pipes, etc. These methods can only achieve local heat dissipation and are costly; or they are cooled by air cooling or water cooling, but these heat dissipation methods require many components, large space, and noise during operation, which seriously affects the user experience. At present, there are also related patents that carry out thermal management of electronic components based on the structure of the PCB itself. For example, patent CN 108650778 A uses thermal connection elements to make the heat distribution on the PCB more uniform, but its heat dissipation capacity is very weak and cannot be applied to high-heat devices. Patent CN 110868796 B and patent CN 221329202 U connect the heating device and the heat dissipation device through PCB vias to reduce thermal resistance, but it is still inevitable to use heat dissipation devices such as heat sinks, heat pipes, and heat sinks, but the heat dissipation devices are arranged on the bottom surface of the PCB. Therefore, PCB needs a more efficient heat dissipation method. EHD (electrohydrodynamic) conductivity pumps have been widely used in the medical and aerospace fields due to their novel structure and unique driving characteristics. Their heat dissipation capacity can fully meet the needs of PCB boards. In addition, conductivity pumps have the advantages of no mechanical parts, silent operation, precise flow control, and small size. They are very suitable for the heat dissipation needs of PCBs. However, how to integrate conductivity pumps into PCBs to achieve heat dissipation of PCB boards has become a technical problem that needs to be solved. Summary of the invention

[0003] Therefore, the present invention provides a PCB board assembly and a household appliance, and the main technical problem to be solved is: how to integrate the conductivity pump into the PCB board to achieve heat dissipation of the PCB board.

[0004] In order to solve the above problems, the present invention provides a PCB board assembly, which includes a PCB board and a conductivity pump;

[0005] The conductivity pump includes a first electrode, a second electrode and a heat dissipation channel for accommodating a dielectric, and the heat dissipation channel is arranged on the PCB board; at least a part of the first electrode and the second electrode are both located in the heat dissipation channel; the first electrode and the second electrode are both used to be electrically connected to a voltage generating device to form an electric field therebetween to drive the flow of the dielectric in the heat dissipation channel.

[0006] In some embodiments, the PCB board has a first end, and the PCB board assembly further includes a connecting plate, which is disposed on the first end side of the PCB board, and the heat dissipation channel is formed between the connecting plate and the first end.

[0007] In some embodiments, the first electrode and the second electrode are both disposed on the first end.

[0008] In some embodiments, a connection circuit is provided on the PCB board, and the first electrode and the second electrode are both electrically connected to the connection circuit so as to be electrically connected to the voltage generating device through the connection circuit.

[0009] In some embodiments, the conductivity pump also includes a flow channel plate, which is arranged between the connecting plate and the first end, and the flow channel plate has a first a end opposite to the first end and a second a end opposite to the connecting plate; the heat dissipation channel is arranged on the flow channel plate and passes through the first a end and the second a end, wherein the first end covers the opening of the heat dissipation channel on the first a end, and the connecting plate covers the opening of the heat dissipation channel on the second a end.

[0010] In some embodiments, the first end a is bonded and fixed to the first end via a first adhesive layer;

[0011] And / or, the second end a is bonded and fixed to the connecting plate via a second adhesive layer.

[0012] In some embodiments, the PCB board, the flow channel plate and the connecting plate are all flexible boards.

[0013] In some embodiments, the PCB board assembly further includes a heat dissipation channel disposed on the PCB board, the heat dissipation channel having an inlet and an outlet, one end of the heat dissipation channel being connected to the inlet, and the other end being connected to the outlet.

[0014] In some embodiments, the first electrode and the second electrode form an electrode group, the number of the electrode groups is more than two, and the electrode groups are sequentially arranged at intervals along the extension direction of the heat dissipation channel; wherein,

[0015] The PCB board assembly includes a first conductive member, and the first electrode of each electrode group is arranged on the first conductive member to be electrically connected to the voltage generating device through the first conductive member; and / or, the PCB board assembly includes a second conductive member, and the second electrode of each electrode group is arranged on the second conductive member to be electrically connected to the voltage generating device through the second conductive member.

[0016] In some embodiments, when the PCB board assembly includes both the first conductive member and the second conductive member, each of the first electrodes is disposed on the first b side of the first conductive member, and each of the second electrodes is disposed on the second b side of the second conductive member;

[0017] The first b side is opposite to the second b side, and the first electrodes and the second electrodes are arranged alternately in sequence.

[0018] In some embodiments, the distance between the first electrode and the second electrode in each electrode group is L1, and the distance between two adjacent electrode groups is L2, wherein L2 is greater than L1;

[0019] And / or, each of the first electrodes is a high voltage bus electrode, and each of the second electrodes is a ground electrode, wherein the width of each of the first electrodes is B1, the width of each of the second electrodes is B2, B1=a*B2, a=2-3;

[0020] and / or, the distance between two adjacent first electrodes is L3, the distance between two adjacent second electrodes is L4, and the distance between the first electrode and the second electrode in each electrode group is L1, wherein L3=L4=b*L1, b=4-6;

[0021] And / or, each of the first electrodes is a high-voltage bus electrode, each of the second electrodes is a ground electrode, and the width of each of the second electrodes is B2, where B2 = 0.5-2 mm.

[0022] In some embodiments, when the PCB board assembly further includes a connecting plate, and the connecting plate is disposed on the first end side of the PCB board, the heat dissipation channel is formed between the connecting plate and the first end, and the first electrode and the second electrode are both disposed on the first end, and the PCB board assembly includes the first conductive member and the second conductive member at the same time,

[0023] The first conductive member, the second conductive member and each electrode group form a first electrode structure, and a second electrode structure is provided on the connecting plate. The first electrode structure and the second electrode structure are symmetrical, and the first electrode and the second electrode in the second electrode structure are also used to be electrically connected to a voltage generating device to form an electric field therebetween to drive the flow of the dielectric in the heat dissipation channel.

[0024] The present invention also provides a household appliance, comprising any one of the above-mentioned PCB board components.

[0025] A PCB board assembly and household appliance provided by the present invention have the following beneficial effects:

[0026] 1. By designing a heat dissipation channel on the PCB board and making at least a part of the first electrode and the second electrode of the conductivity pump located in the heat dissipation channel, the conductivity pump and the PCB board can be effectively integrated. When the first electrode and the second electrode are electrically connected to the voltage generating device, an electric field can be formed between the first electrode and the second electrode to drive the flow of the dielectric in the heat dissipation channel. During the flow, the dielectric can exchange heat with the surrounding environment to take away the heat on the PCB board, thereby realizing efficient heat dissipation of the PCB board.

[0027] 2. By designing the PCB board, the runner board and the connecting board as flexible boards, the PCB board assembly can be bent as a whole, which can adapt to the bending conditions and meet the heat dissipation of the flexible PCB board in the bent state. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. The drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0029] Figure 1 This is an assembly structure diagram of a PCB board component and a voltage generating device provided by an embodiment of the present invention;

[0030] Figure 2 is a partially exploded schematic diagram of a PCB board assembly provided by an embodiment of the present invention;

[0031] Figure 3 It is a structural diagram of the PCB board;

[0032] Figure 4 yes Figure 3 The enlarged schematic diagram of point A in the middle;

[0033] Figure 5 It is a schematic diagram of the structure of the flow channel plate;

[0034] Figure 6 It is a structural schematic diagram of the connecting plate;

[0035] Figure 7 is a schematic diagram of the structure of the first adhesive layer;

[0036] Figure 8 Schematic diagram of the structure of the second adhesive layer.

[0037] The accompanying drawings are marked as follows:

[0038] 1. PCB board; 2. conductivity pump; 3. heat dissipation pipe; 4. liquid reservoir; 6. electronic component area; 7. voltage generating device; 10. electrode group; 11. first end; 12. second end; 20. heat dissipation channel; 20a. outlet; 20b. inlet; 31. liquid inlet pipe section; 32. liquid outlet pipe section; 101. first electrode structure; 102. first conductive member; 103. second conductive member; 104. first electrode; 105. second electrode; 201. first adhesive layer; 202. flow channel plate; 203. second adhesive layer; 204. connecting plate; 205. second electrode structure; 2021. first a end; 2022. second a end; 1021. first b side; 1031. second b side. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0041] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0042] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0043] See also Figure 1-8 As shown, according to an embodiment of the present invention, a PCB board assembly is provided, which includes a PCB board 1 and a conductivity pump 2. The conductivity pump 2 includes a first electrode 104, a second electrode 105 and a heat dissipation channel 20 (such as Figure 3 and Figure 4 The heat dissipation channel 20 is provided on the PCB board 1. At least a portion of the first electrode 104 and the second electrode 105 are both located in the heat dissipation channel 20. The first electrode 104 and the second electrode 105 are both used to be electrically connected to the voltage generating device 7 to form an electric field therebetween to drive the flow of the dielectric in the heat dissipation channel 20.

[0044] Among them, one of the first electrode 104 and the second electrode 105 is a high voltage electrode, and the other is a ground electrode. The above-mentioned voltage generating device 7 is a high voltage generating device, and the specific structure of the voltage generating device 7 is a prior art and is not repeated here. According to the principle of electrohydrodynamics, by applying a high voltage DC electric field between the first electrode 104 and the second electrode 105 to form a high-intensity non-uniform electric field, the ions or charge carriers in the dielectric liquid can be moved, thereby forming the flow of the dielectric.

[0045] In the above example, by setting the heat dissipation channel 20 of the conductivity pump 2 on the PCB board 1, and making at least a part of the first electrode 104 and the second electrode 105 of the conductivity pump 2 located in the heat dissipation channel 20, the conductivity pump 2 can be effectively integrated with the PCB board 1. When the first electrode 104 and the second electrode 105 are both electrically connected to the voltage generating device 7, an electric field can be formed between the first electrode 104 and the second electrode 105 to drive the flow of the dielectric in the heat dissipation channel 20. During the flow, the dielectric can exchange heat with the surrounding environment to take away the heat on the PCB board 1, thereby achieving efficient heat dissipation of the PCB board 1.

[0046] Among them, since the heat dissipation channel 20 is directly arranged on the PCB board 1, the dielectric in the heat dissipation channel 20 is in direct contact with the PCB board 1, thereby achieving contact heat dissipation and having a higher heat dissipation effect.

[0047] In order to form the aforementioned heat dissipation channel 20, in some embodiments, as Figure 2 As shown, the PCB board 1 has a first end 11. The aforementioned PCB board assembly may further include a connecting plate 204, which is arranged on the side of the first end 11 of the PCB board 1, and the aforementioned heat dissipation channel 20 is formed between the connecting plate 204 and the first end 11.

[0048] In some embodiments, Figure 3-4 As shown, the aforementioned first electrode 104 and the second electrode 105 can be disposed on the first end 11 of the PCB board. Preferably, the first electrode 104 and the second electrode 105 can be integrally formed on the PCB board 1, so that the connection stability between the first electrode 104 and the second electrode 105 and the PCB board 1 can be improved, and the integration degree between the conductive pump and the PCB board 1 can be higher. Specifically, the first electrode 104 and the second electrode 105 can be directly formed on the PCB board 1 by PCB board processing, so that the conductive pump 2 is directly integrated with the PCB board 1 with high density, which is simple to manufacture, occupies a small space, and has controllable shape and size.

[0049] In some embodiments, the aforementioned PCB board 1 may be provided with a connection circuit, which is an integrated circuit integrated on the PCB board 1. The first electrode 104 and the second electrode 105 are both electrically connected to the connection circuit to be electrically connected to the voltage generating device 7 through the connection circuit.

[0050] In the above example, the first electrode 104, the second electrode 105 and the connecting circuit can be integrated on the PCB board 1. The first electrode 104 and the second electrode 105 are connected to the voltage generating device 7 through the connecting circuit, which avoids the first electrode 104 and the second electrode 105 being electrically connected to the voltage generating device 7 by a wire, so that the integration of the conductivity pump 2 and the PCB board 1 is higher, which can save wiring space.

[0051] In order to further form the aforementioned heat dissipation channel 20, in some embodiments, as Figure 2 As shown, the aforementioned conductivity pump 2 also includes a flow channel plate 202, which is arranged between the connecting plate 204 and the first end 11. The flow channel plate 202 has a first a end 2021 opposite to the first end 11 and a second a end 2022 opposite to the connecting plate 204. The aforementioned heat dissipation channel 20 is arranged on the flow channel plate 202, and passes through the first a end 2021 and the second a end 2022 of the flow channel plate 202. Among them, the first end 11 of the PCB board 1 covers the opening of the heat dissipation channel 20 at the first a end 2021, and the connecting plate 204 covers the opening of the heat dissipation channel 20 at the second a end 2022, so that the PCB board 1 and the connecting plate 204 can cooperate to cover the openings at both ends of the heat dissipation channel 20 to form the aforementioned heat dissipation channel 20.

[0052] In the above example, the heat dissipation channel 20 is formed by separately designing the channel plate 202, which has the advantage of convenient processing.

[0053] In some embodiments, Figure 2 As shown, the first a-end 2021 can be bonded and fixed to the first end 11 through the first adhesive layer 201 to improve the stability of the connection between the flow channel plate 202 and the PCB board 1. The second a-end 2022 can be bonded and fixed to the connecting plate 204 through the second adhesive layer 203 to improve the connection stability between the flow channel plate 202 and the connecting plate 204.

[0054] The thickness of both the first adhesive layer 201 and the second adhesive layer 203 does not exceed 1 mm.

[0055] In some embodiments, the aforementioned PCB board 1, flow channel plate 202 and connecting plate 204 can all be flexible boards. Specifically, the PCB board 1 can be a flexible PCB board, and the flow channel plate 202 and connecting plate 204 can all be made of flexible materials such as PDMS materials. Among them, by designing the PCB board 1, the flow channel plate 202 and the connecting plate 204 as flexible boards, the PCB board assembly can be bent as a whole, which can adapt to bending conditions and meet the heat dissipation of the flexible PCB board 1 in a bent state.

[0056] In some embodiments, Figure 1 and Figure 5 As shown, the aforementioned PCB board assembly may further include a heat dissipation pipe 3 disposed on the PCB board 1. The aforementioned heat dissipation channel 20 has an inlet 20b and an outlet 20a, one end of the heat dissipation pipe 3 is connected to the inlet 20b, and the other end is connected to the outlet 20a.

[0057] In the above example, the heat dissipation pipe 3 and the heat dissipation channel 20 form a circulation flow path, so that the dielectric circulates inside the two. The additional heat dissipation pipe 3 can increase the heat dissipation area and improve the heat dissipation effect on the PCB board 1.

[0058] In some embodiments, the heat dissipation pipe 3 is in direct contact with the PCB board 1 to further improve the heat dissipation effect on the PCB board 1. In a specific application example, the heat dissipation pipe 3 can be arranged on the first end 11 of the PCB board 1.

[0059] In some embodiments, Figure 1 As shown, the heat dissipation pipe 3 may also be provided with a liquid reservoir 4. The liquid reservoir 4 is used to store dielectrics to ensure sufficient dielectric flow in the circulation flow path.

[0060] The heat dissipation pipe 3 has a liquid inlet pipe section 31 and a liquid outlet pipe section 32 . The heat dissipation pipe 3 is connected to the outlet 20 a of the heat dissipation channel 20 through the liquid inlet pipe section 31 , and the heat dissipation channel 20 is connected to the inlet 20 b of the heat dissipation channel 20 through the liquid outlet pipe section 32 .

[0061] In some embodiments, Figure 3-4 As shown, the aforementioned first electrode 104 and the second electrode 105 together form an electrode group 10, the number of the electrode groups 10 is more than two, and they are arranged in sequence along the extension direction of the heat dissipation channel 20. Among them, the aforementioned PCB board assembly may include a first conductive member 102, and the first electrode 104 of each electrode group 10 is arranged on the first conductive member 102 to be electrically connected to the voltage generating device 7 through the first conductive member 102, so as to improve the wiring efficiency and avoid the first electrodes 104 being connected to the voltage generating device 7 one by one.

[0062] The aforementioned PCB board assembly also includes a second conductive member 103, and the second electrode 105 of each electrode group 10 is arranged on the second conductive member 103 to be electrically connected to the voltage generating device 7 through the second conductive member 103. This can improve the wiring efficiency and avoid connecting each first electrode 104 to the voltage generating device 7 one by one.

[0063] It should be noted that: when a connection circuit is provided on the PCB board 1, and the first electrode 104 and the second electrode 105 are electrically connected to the connection circuit to be electrically connected to the voltage generating device 7 through the connection circuit, each first electrode 104 is electrically connected to the connection circuit through the first conductive member 102, so that the first conductive member 102 is electrically connected to the voltage generating device 7 through the connection circuit. Similarly, each second electrode 105 is electrically connected to the connection circuit through the second conductive member 103, so that the second conductive member 103 is electrically connected to the voltage generating device 7 through the connection circuit.

[0064] In some embodiments, Figure 4 As shown, when the PCB board assembly includes the first conductive member 102 and the second conductive member 103 at the same time, each first electrode 104 is arranged on the first b side 1021 of the first conductive member, and preferably, each first electrode 104 is integrally formed on the first b side 1021 of the first conductive member. Each second electrode 105 is arranged on the second b side 1031 of the second conductive member, and preferably, each second electrode 105 is integrally formed on the second b side 1031 of the second conductive member. Among them, the first b side 1021 is opposite to the second b side 1031, and the first electrodes 104 and the second electrodes 105 are arranged alternately in sequence.

[0065] In the above example, each first electrode 104 is arranged on the first b side 1021 of the first conductive member, so that each first electrode 104 cooperates with the first conductive member 102 to form a first interdigitated structure, which has the advantage of convenient processing. Similarly, each second electrode 105 is arranged on the second b side 1031 of the second conductive member, so that each second electrode 105 cooperates with the second conductive member 103 to form a second interdigitated structure, which has the advantage of convenient processing. Among them, the first interdigitated structure and the second interdigitated structure are arranged in a staggered manner according to the first electrode 104 and the second electrode 105, so as to form the aforementioned electrode group 10 arranged in sequence, which has the advantage of conveniently setting more than two electrode groups 10 at the same time.

[0066] The distance between the first b side and the second b side is m1, and the channel width of the heat dissipation channel 20 is m2, m1=m2, so that the electrode group 10 formed by the first electrode 104 on the first b side and the second electrode 105 on the second b side can form an electric field throughout the width of the heat dissipation channel 20, so that the dielectric within the entire width of the heat dissipation channel 20 can flow under the action of the electric field, which is beneficial to improving the flow efficiency of the dielectric.

[0067] In some embodiments, Figure 4 As shown, the distance between the first electrode 104 and the second electrode 105 in each electrode group 10 is L1, and the distance between two adjacent electrode groups 10 is L2, wherein L2 is greater than L1. In this way, an asymmetric electrode distribution can be formed, wherein the asymmetric electrode distribution can generate a non-uniform electric field, which can more effectively drive the movement of the dielectric, while the symmetric distribution will offset part of the electric field and weaken the electric field strength. In addition, the asymmetric structure also has the effect of reducing the electrolytic reaction on the electrode surface and reducing the dead zone.

[0068] In some embodiments, Figure 4As shown, the aforementioned first electrodes 104 are all high voltage mother electrodes, and the second electrodes 105 are all ground electrodes. The width of each first electrode 104 is B1, and the width of each second electrode 105 is B2, B1=a*B2, a=2-3, preferably, a=2. This is conducive to forming the aforementioned asymmetric electrode distribution.

[0069] In some embodiments, Figure 4 As shown, the distance between the two adjacent first electrodes 104 is L3, the distance between the two adjacent second electrodes 105 is L4, and the distance between the first electrode 104 and the second electrode 105 in each electrode group 10 is L1, wherein L3=L4=b*L1, b=4~6, preferably, b=4; this is conducive to forming the aforementioned asymmetric electrode distribution.

[0070] In some embodiments, Figure 4 As shown, each of the first electrodes 104 can be a high voltage mother electrode, each of the second electrodes 105 is a ground electrode, and each of the second electrodes 105 has a width of B2, B2 = 0.5-2 mm. Preferably, B2 = 0.5 mm, 1.0 mm or 1.5 mm, so that the processing of the second electrode 105 is more convenient, and the structure size is reasonable and beautiful.

[0071] In some embodiments, when the PCB board assembly further includes a connecting plate 204, and the connecting plate 204 is disposed on the first end 11 side of the PCB board 1, the aforementioned heat dissipation channel 20 is formed between the connecting plate 204 and the first end 11, and the first electrode 104 and the second electrode 105 are both disposed on the first end 11, and the PCB board assembly also includes a first conductive member 102 and a second conductive member 103, the first conductive member 102, the second conductive member 103 and each electrode group 10 form a first electrode structure 101, and the aforementioned connecting plate 204 is provided with a second electrode structure 205, and the first electrode structure 101 and the second electrode structure 205 are symmetrical. In addition, the first electrode 104 and the second electrode 105 in the second electrode structure 205 are also used to be electrically connected to the voltage generating device 7, so as to form an electric field therebetween to drive the flow of the dielectric in the heat dissipation channel 20.

[0072] In the above example, the first electrode structure 101 and the second electrode structure 205 cooperate to form an electric field on both the upper and lower sides of the dielectric, which is beneficial to increase the flow speed of the dielectric, thereby improving the heat dissipation efficiency.

[0073] It should be noted that the symmetrical distribution of the first electrode structure 101 and the second electrode structure 205 can avoid the occurrence of electric field disorder and breakdown.

[0074] like Figure 3As shown, the number of the first electrode structures 101 can be more than two, and the first electrode structures 101 are arranged in sequence in the extension direction of the heat dissipation channel 20. The number of the second electrode structures 205 is equal to the number of the first electrode structures 101 and corresponds one to one.

[0075] The first conductive member 102 in the second electrode structure 205 can be electrically connected to the voltage generating device 7 through the first conductive wire, so that the voltage generating device 7 is electrically connected to each first electrode 104 on the first conductive member 102 through the first conductive wire. Similarly, the second conductive member 103 in the second electrode structure 205 can be electrically connected to the voltage generating device 7 through the second conductive wire, so that the voltage generating device 7 is electrically connected to each second electrode 105 on the second conductive member 103 through the second conductive wire.

[0076] In some embodiments, Figure 1 As shown, the aforementioned PCB board 1 has a second end 12 opposite to the first end 11, and the aforementioned voltage generating device 7 can be arranged at the second end 12. The second end 12 also has an electronic component area 6 for installing electronic components.

[0077] To prevent the charge injection phenomenon, the corners of the first electrode 104 and the second electrode 105 need to be rounded. The dielectric in the present invention can be a refrigerant, transformer oil, silicone oil, etc.

[0078] The present invention also provides a household appliance, which may include any of the above-mentioned PCB board assemblies. Among them, because the household appliance adopts the above-mentioned PCB board assembly, by designing a heat dissipation channel 20 on the PCB board 1, and making at least a part of the first electrode 104 and the second electrode 105 of the conductivity pump 2 located in the heat dissipation channel 20, the conductivity pump 2 can be effectively integrated with the PCB board 1. When the first electrode 104 and the second electrode 105 are both electrically connected to the voltage generating device 7, an electric field can be formed between the first electrode 104 and the second electrode 105 to drive the flow of the dielectric in the heat dissipation channel 20. During the flow, the dielectric can exchange heat with the surrounding environment to take away the heat on the PCB board 1, thereby realizing efficient heat dissipation of the PCB board 1.

[0079] In some embodiments, the household appliance may be an air conditioner or the like.

[0080] Among them, the technical solution of the present invention solves the problem that traditional PCB heat dissipation methods (air cooling, water cooling, etc.) occupy a large space and cannot be used for high-density integration. It also solves the problem that traditional PCB heat dissipation methods are noisy and consume a lot of power during use. It also solves the technical problem that non-contact PCB heat dissipation methods are inefficient and the cooling capacity is lost during the transmission process.

[0081] The present invention adopts a conductivity pump 2 to dissipate heat from the PCB board 1. The conductivity pump 2 is a heat dissipation method based on electrohydrodynamics. It has the advantages of no mechanical parts, silent operation, precise flow control, and small size, and is very suitable for the heat dissipation requirements of the PCB.

[0082] The working principle of the present invention is as follows: the heat dissipation channel 20 can be arranged below the heating element and can be adjusted according to the position distribution of the heating element. The voltage generating device 7 is electrically connected to the first conductive member 102 to be electrically connected to each first electrode 104 through the first conductive member 102, and the voltage generating device 7 is also electrically connected to the second conductive member 103 to be electrically connected to each second electrode 105 through the second conductive member 103. Among them, the first electrode 104 can be a high-voltage mother electrode, the second electrode 105 can be a grounding electrode, and the voltage generating device 7 can be a high-voltage generating device. When the output voltage of the voltage generating device 7 reaches a certain value (related to the properties of the dielectric), the dielectric will flow due to the action of the Coulomb force, and the dielectric circulates in the loop formed by the heat dissipation channel 20 and the heat dissipation pipe 3, and exchanges heat with the surrounding environment, that is, convection is generated, the convection heat transfer coefficient is increased, and a better heat dissipation effect is achieved, thereby dissipating heat from the PCB board 1. Among them, when the structure of the conductivity pump 2 is determined, the convective heat transfer intensity is only related to the number of electrodes and the applied electric field strength, so the flow rate can be accurately adjusted by adjusting the electric field strength.

[0083] It is easy for those skilled in the art to understand that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0084] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention. These improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A PCB board assembly, characterized in that: It comprises a PCB board (1) and a conductivity pump (2); The conductivity pump (2) comprises a first electrode (104), a second electrode (105) and a heat dissipation channel (20) for accommodating a dielectric, wherein the heat dissipation channel (20) is arranged on the PCB board (1); at least a portion of both the first electrode (104) and the second electrode (105) are located in the heat dissipation channel (20); and the first electrode (104) and the second electrode (105) are used to be electrically connected to a voltage generating device (7) so as to form an electric field therebetween for driving the dielectric in the heat dissipation channel (20) to flow.

2. The PCB board assembly according to claim 1, characterized in that: The PCB board (1) has a first end (11), and the PCB board assembly further comprises a connecting plate (204), wherein the connecting plate (204) is arranged on the side of the first end (11) of the PCB board (1), and the heat dissipation channel (20) is formed between the connecting plate (204) and the first end (11).

3. The PCB board assembly according to claim 2, characterized in that: The first electrode (104) and the second electrode (105) are both arranged on the first end (11).

4. The PCB board assembly according to claim 3, characterized in that: The PCB board (1) is provided with a connection circuit, and the first electrode (104) and the second electrode (105) are both electrically connected to the connection circuit so as to be electrically connected to the voltage generating device (7) through the connection circuit.

5. The PCB assembly according to any one of claims 2 to 4, characterized in that: The conductivity pump (2) further comprises a flow channel plate (202), the flow channel plate (202) being arranged between the connecting plate (204) and the first end (11), the flow channel plate (202) having a first a end (2021) opposite to the first end (11) and a second a end (2022) opposite to the connecting plate (204); the heat dissipation flow channel (20) is arranged on the flow channel plate (202) and passes through the first a end (2021) and the second a end (2022), wherein the first end (11) covers an opening of the heat dissipation flow channel (20) on the first a end (2021), and the connecting plate (204) covers an opening of the heat dissipation flow channel (20) on the second a end (2022).

6. The PCB board assembly according to claim 5, characterized in that: The first end a (2021) is bonded and fixed to the first end (11) via a first adhesive layer (201); And / or, the second end a (2022) is bonded and fixed to the connecting plate (204) via a second adhesive layer (203).

7. The PCB board assembly according to claim 5, characterized in that: The PCB board (1), the flow channel plate (202) and the connecting plate (204) are all flexible boards.

8. The PCB assembly according to any one of claims 1-4, 6-7, characterized in that: It also comprises a heat dissipation pipe (3) arranged on the PCB board (1), the heat dissipation channel (20) having an inlet (20b) and an outlet (20a), one end of the heat dissipation pipe (3) being in communication with the inlet (20b), and the other end being in communication with the outlet (20a).

9. The PCB assembly according to any one of claims 1-4, 6-7, characterized in that: The first electrode (104) and the second electrode (105) together form an electrode group (10); the number of the electrode groups (10) is more than two and they are arranged in sequence and at intervals along the extension direction of the heat dissipation channel (20); wherein: The PCB board assembly comprises a first conductive member (102), and the first electrode (104) of each electrode group (10) is arranged on the first conductive member (102) to be electrically connected to the voltage generating device (7) through the first conductive member (102); and / or the PCB board assembly comprises a second conductive member (103), and the second electrode (105) of each electrode group (10) is arranged on the second conductive member (103) to be electrically connected to the voltage generating device (7) through the second conductive member (103).

10. The PCB board assembly according to claim 9, characterized in that: When the PCB board assembly includes both the first conductive member (102) and the second conductive member (103), each of the first electrodes (104) is arranged on the first b side (1021) of the first conductive member, and each of the second electrodes (105) is arranged on the second b side (1031) of the second conductive member; The first b-side (1021) is opposite to the second b-side (1031), and the first electrodes (104) and the second electrodes (105) are arranged alternately in sequence.

11. The PCB board assembly according to claim 10, characterized in that: The distance between the first electrode (104) and the second electrode (105) in each electrode group (10) is L1, and the distance between two adjacent electrode groups (10) is L2, wherein L2 is greater than L1; And / or, each of the first electrodes (104) is a high voltage bus electrode, and each of the second electrodes (105) is a ground electrode, wherein the width of each of the first electrodes (104) is B1, the width of each of the second electrodes (105) is B2, B1=a*B2, a=2-3; and / or, the distance between two adjacent first electrodes (104) is L3, the distance between two adjacent second electrodes (105) is L4, and the distance between the first electrode (104) and the second electrode (105) in each electrode group (10) is L1, wherein L3=L4=b*L1, b=4-6; And / or, each of the first electrodes (104) is a high-voltage mother electrode, each of the second electrodes (105) is a grounding electrode, and each of the second electrodes (105) has a width B2, where B2 = 0.5-2 mm.

12. The PCB board assembly according to claim 9, characterized in that: When the PCB board assembly further includes a connecting plate (204), and the connecting plate (204) is arranged on the first end (11) side of the PCB board (1), the heat dissipation channel (20) is formed between the connecting plate (204) and the first end (11), and the first electrode (104) and the second electrode (105) are both arranged on the first end (11), and the PCB board assembly also includes the first conductive member (102) and the second conductive member (103), the first conductive member (102 ), the second conductive member (103) and each of the electrode groups (10) form a first electrode structure (101), a second electrode structure (205) is provided on the connecting plate (204), the first electrode structure (101) and the second electrode structure (205) are symmetrical, and the first electrode (104) and the second electrode (105) in the second electrode structure (205) are also used to be electrically connected to the voltage generating device (7) to form an electric field therebetween for driving the flow of the dielectric in the heat dissipation channel (20).

13. A household appliance, characterized in that: A PCB board assembly comprising any one of claims 1-12.

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