Circuit board drilling equipment

Abstract

The invention discloses circuit board drilling equipment. The circuit board drilling equipment comprises a rack, a drilling address, a material moving device and a buffering device. The rack is provided with a working platform, and the working platform is provided with a machining station; the drilling device is arranged on the rack and located above the machining station; the material moving device is arranged on the rack, the material moving device comprises a clamping mechanism and a driving mechanism, the clamping mechanism can clamp the circuit board, and the driving mechanism is in transmission connection with the clamping mechanism and can drive the clamping mechanism to move to be close to or away from the machining station; the buffer device comprises a paper tape, and the paper tape is arranged on the working platform and is at least partially located at the processing position; the material moving device can drive the circuit board to move on the working platform, the pre-machining position of the circuit board is located at the machining position, and the paper tape is located below the circuit board. Therefore, the paper tape can reduce the stress borne by the circuit board, and is beneficial to reducing burrs formed at the orifices, so that the processing quality and the processing efficiency of the circuit board can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board drilling, and in particular to a circuit board drilling device. Background Art

[0002] When drilling holes, existing circuit board drilling equipment usually directly places the circuit board on the drilling platform, and then moves the drill bit to the pre-drilling position on the circuit board to perform the drilling operation. However, this method is likely to generate large mechanical stress on the circuit board, causing the copper foil on the edge of the hole on each layer of the circuit board to easily drag to form a wire drawing phenomenon, and then easily form a large burr at the hole mouth. For this reason, additional processes are required to remove the burr at the hole mouth, which not only greatly reduces the processing quality of the circuit board, but also greatly reduces the processing efficiency of the circuit board. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a circuit board drilling device that can effectively reduce the flash formed by the hole opening, which is conducive to improving the processing quality and processing efficiency of the circuit board.

[0004] According to an embodiment of the present invention, the circuit board drilling equipment includes: a frame with a working platform, the working platform has a processing position; a drilling device, which is arranged on the frame and located above the processing position; a material moving device, which is arranged on the frame, the material moving device includes a clamping mechanism and a driving mechanism, the clamping mechanism can clamp the circuit board, the driving mechanism is transmission-connected to the clamping mechanism and can drive the clamping mechanism to move closer to or away from the processing position; a buffer device, the buffer device includes a paper tape, the paper tape is arranged on the working platform and partially located at the processing position; wherein the material moving device can drive the circuit board to move on the working platform, and make the pre-processing position of the circuit board located at the processing position, and the paper tape is located below the circuit board.

[0005] The circuit board drilling device according to the embodiment of the present invention has at least the following beneficial effects:

[0006] By adopting the circuit board drilling device of the embodiment of the present invention, when drilling, the circuit board is first clamped by the clamping mechanism, and then the clamping mechanism is driven by the driving mechanism to drive the circuit board to move on the working platform, so that the pre-processing position of the circuit board is located at the processing position. By setting a buffer mechanism, the paper tape in the buffer mechanism is arranged on the working platform and partially located at the processing position, so that when the pre-processing position of the circuit board is located at the processing position, the paper tape is located below the circuit board, thereby, in the process of drilling the circuit board by the drilling device, the drill bit of the drilling device can fall on the paper tape after passing through the pre-processing position of the circuit board, and the paper tape can play a buffering role on the circuit board, reducing the stress on the circuit board, thereby helping to reduce the flash formed by the hole, thereby improving the processing quality of the circuit board, and also saving the subsequent flash removal process, which is conducive to improving the processing efficiency of the circuit board.

[0007] According to some embodiments of the present invention, a camera device and a control device are further included. The frame is provided with a mounting seat, the camera device is installed on the mounting seat and faces downward toward the processing position, the control device is installed on the frame and is located on one side of the working platform, the control device is electrically connected to the camera device and can control the operation of the driving mechanism according to the image information fed back by the camera device.

[0008] According to some embodiments of the present invention, the buffer device also includes a paper tape conveying mechanism, the paper tape is movably arranged on the working platform along the X-axis direction and is at least partially located at the processing position, the paper tape conveying mechanism is arranged on the frame and can drive the paper tape to move along the X-axis direction; each time the drilling device completes a drilling operation, the paper tape conveying mechanism can drive the paper tape to move forward along the X-axis by a first preset distance.

[0009] According to some embodiments of the present invention, the paper tape conveying mechanism includes a paper tape unwinding mechanism and a paper tape receiving mechanism, and the paper tape unwinding mechanism and the paper tape receiving mechanism are correspondingly arranged on both sides of the frame along the X-axis direction, one end of the paper tape is wound around the paper tape unwinding mechanism, and the other end is wound around the paper tape receiving mechanism, and the paper tape can be moved by the paper tape unwinding mechanism toward the paper tape receiving mechanism and wound up on the paper tape receiving mechanism.

[0010] According to some embodiments of the present invention, a guide groove arranged along the X direction and passing through the processing position is opened on the working platform, and the paper tape is located in the guide groove.

[0011] According to some embodiments of the present invention, the drilling device includes a drill bit and a pressing mechanism, the drill bit is located above the processing position, the pressing mechanism is arranged on the frame and is transmission-connected to the drill bit, and the pressing mechanism can drive the drill bit to move in the up and down directions close to or away from the processing position; it also includes a heat dissipation device, the heat dissipation device includes an aluminum strip and an aluminum strip conveying mechanism, the aluminum strip is arranged above the working platform along the X-axis and is partially located above the processing position; when the material moving device moves the circuit board to the working platform and makes the pre-processing position located at the processing position, the pressing mechanism can drive the drill bit to move downward and penetrate the aluminum strip, the circuit board and the paper tape in sequence; each time the drilling device completes a drilling operation, the aluminum strip conveying mechanism can drive the aluminum strip to move forward along the X-axis by a second preset distance.

[0012] According to some embodiments of the present invention, the clamping mechanism includes a mobile frame and a plurality of suction nozzles, the driving mechanism is transmission-connected to the mobile frame and can drive the mobile frame to move, and all the suction nozzles are arranged on the mobile frame and can move with the mobile frame.

[0013] According to some embodiments of the present invention, it also includes a loading mechanism, which includes a loading platform and a loading lifting mechanism. The loading platform is movably installed on the side of the frame, and the loading lifting mechanism is installed on the frame and is transmission-connected to the loading platform. The loading lifting mechanism can drive the loading platform to move in the up and down directions close to or away from the working platform.

[0014] According to some embodiments of the present invention, a material unloading mechanism is further included, which includes a material unloading platform and a material unloading lifting mechanism. The material unloading platform is movably installed on the side of the frame and is located on one side of the loading platform. The material unloading lifting mechanism is installed on the frame and is transmission-connected to the material unloading platform. The material unloading lifting mechanism can drive the material unloading platform to move in the up and down directions close to or away from the working platform.

[0015] According to some embodiments of the present invention, a loading guide plate corresponding to the loading platform and a unloading guide plate corresponding to the unloading platform are installed on the side of the frame; the loading guide plate is provided with a plurality of loading guide holes arranged along the up-down direction, and the plurality of loading guide holes are arranged at intervals along the X-axis direction, and a loading support plate corresponding to each of the loading guide holes is installed on the bottom surface of the loading belt, and the loading support plate is movably inserted in the corresponding loading guide hole; the unloading guide plate is provided with a plurality of unloading guide holes arranged along the up-down direction, and the plurality of unloading guide holes are arranged at intervals along the X-axis direction, and a unloading support plate corresponding to each of the unloading guide holes is installed on the bottom surface of the unloading belt, and the unloading support plate is movably inserted in the corresponding unloading guide hole.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 A schematic diagram of a circuit board drilling device according to an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of a circuit board drilling device according to an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of a circuit board drilling device according to an embodiment of the present invention;

[0021] Figure 4 A schematic cross-sectional view of a circuit board drilling device according to an embodiment of the present invention;

[0022] Figure 5 A partial schematic diagram of a circuit board drilling device according to an embodiment of the present invention;

[0023] Figure 6 It is a partial schematic diagram of a circuit board drilling device according to an embodiment of the present invention.

[0024] Reference numerals:

[0025] Frame 100, working platform 110, processing position 120, mounting seat 130, camera device 140, control device 150;

[0026] Drilling device 200;

[0027] Clamping mechanism 300, moving frame 310, suction nozzle 320;

[0028] Driving mechanism 400, X-axis driving mechanism 410, Y-axis driving mechanism 420;

[0029] Paper tape 500, paper tape unloading mechanism 510, tensioning mechanism 520;

[0030] A loading platform 600, a loading support plate 610, a loading guide plate 620, and a loading guide hole 621;

[0031] A material unloading platform 700 , a material unloading support plate 710 , a material unloading guide plate 720 , and a material unloading guide hole 721 . DETAILED DESCRIPTION

[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] Reference Figures 1 to 6 An embodiment of the present invention provides a circuit board drilling device, including a frame 100, a drilling site, a material moving device and a buffer device. The frame 100 has a working platform 110, and the working platform 110 has a processing position 120; the drilling device 200 is arranged on the frame 100 and is located above the processing position 120; the material moving device is arranged on the frame 100, and the material moving device includes a clamping mechanism 300 and a driving mechanism 400, the clamping mechanism 300 can clamp the circuit board, and the driving mechanism 400 is connected to the clamping mechanism 300 in a transmission manner and can drive the clamping mechanism 300 to move closer to or away from the processing position 120; the buffer device includes a paper tape 500, the paper tape 500 is arranged on the working platform 110 and is at least partially located at the processing position 120; wherein the material moving device can drive the circuit board to move on the working platform 110, and make the pre-processing position of the circuit board be located at the processing position 120, and the paper tape 500 is located below the circuit board.

[0037] By adopting the circuit board drilling device of the embodiment of the present invention, when drilling, the circuit board is first clamped by the clamping mechanism 300, and then the clamping mechanism 300 is driven by the driving mechanism 400 to drive the circuit board to move on the working platform 110, so that the pre-processing position of the circuit board is located at the processing position 120. By setting a buffer mechanism, the paper tape 500 in the buffer mechanism is arranged on the working platform 110 and partially located at the processing position 120, so that when the pre-processing position of the circuit board is located at the processing position 120, the paper tape 500 is located below the circuit board, thereby, in the process of drilling the circuit board by the drilling device 200, the drill bit of the drilling device 200 can fall on the paper tape 500 after passing through the pre-processing position of the circuit board, and the paper tape 500 can play a buffering role on the circuit board, reduce the stress on the circuit board, and thus help to reduce the flash formed by the hole, thereby improving the processing quality of the circuit board, and also save the subsequent flash removal process, which is conducive to improving the processing efficiency of the circuit board.

[0038] In some embodiments, when processing non-copper-plated holes on a circuit board, a dry film can be applied first, and then a circuit pattern can be made on the surface of the circuit board, and then the circuit board can be placed on the work platform 110 for drilling operations, and finally etching. The drilling method adopts the process of first applying the dry film, then making the circuit, and then drilling, which can improve the sealing ability of the dry film, simplify the drilling process, and avoid the situation where the etching solution passes through the hole from the non-copper surface to etch the inner copper ring at the edge of the hole due to drilling first and then applying the dry film, thereby causing serious side corrosion of the copper ring in the hole. In addition, the drilling method uses the circuit board drilling equipment of the embodiment of the present invention to process non-copper-plated holes, which can not only reduce the flash formed at the hole mouth and improve the processing quality of the circuit board, but also save the subsequent flash removal process, which is beneficial to improving the processing efficiency of the circuit board.

[0039] In some embodiments, when processing holes on a single-sided circuit board, an oil film can be used instead of a dry film. Specifically, a photosensitive ink can be first coated on the surface of the circuit board, and then the circuit board drilling device of the embodiment of the present invention is used to drill the pipe hole on the circuit board, and then the circuit board drilling device of the embodiment of the present invention is used to drill the non-copper-plated hole on the circuit board. This drilling method uses the circuit board drilling device of the embodiment of the present invention to process the non-copper-plated hole, which can not only reduce the flash formed at the hole mouth and improve the processing quality of the circuit board, but also save the subsequent flash removal process, which is conducive to improving the processing efficiency of the circuit board.

[0040] Reference Figures 1 to 6In some embodiments, the circuit board drilling equipment also includes a camera device 140 and a control device 150. The frame 100 is provided with a mounting seat 130. The camera device 140 is installed on the mounting seat 130 and faces downward toward the processing position 120. The control device 150 is installed on the frame 100 and is located on one side of the working platform 110. The control device 150 is electrically connected to the camera device 140 and can control the operation of the driving mechanism 400 according to the image information fed back by the camera device 140.

[0041] By adopting the above structure, the camera device 140 can take pictures of the surface of the circuit board on the work platform 110 and send the obtained image information to the control device 150. The control device 150 can obtain the information of the pre-processing position on the circuit board based on the image information fed back by the camera device 140, and control the drive mechanism 400 to move the circuit board on the clamping mechanism 300 to the pre-processing position at the processing position 120, so that the drilling process of the circuit board can be more precise.

[0042] It is understandable that, in some embodiments, the control device 150 also has a display module, which can obtain image information from the camera device 140 and display the image information, thereby facilitating operators to observe and identify the image of the circuit board.

[0043] It is understandable that the camera device 140 may specifically be a CCD camera.

[0044] It is understandable that the control device 150 may specifically be a computer.

[0045] Reference Figures 1 to 6 In some embodiments, the buffer device also includes a paper tape 500 conveying mechanism, the paper tape 500 is movably arranged on the working platform 110 along the X-axis direction and is at least partially located at the processing position 120, the paper tape 500 conveying mechanism is arranged on the frame 100 and can drive the paper tape 500 to move along the X-axis direction; each time the drilling device 200 completes a drilling operation, the paper tape 500 conveying mechanism can drive the paper tape 500 to move forward along the X-axis by a first preset distance.

[0046] By adopting the above structure, when drilling, when the pre-processing position of the circuit board is located at the processing position 120, the paper tape 500 is located below the circuit board. During the process of the drilling device 200 drilling the circuit board, the drill bit can pass through the circuit board and press down onto the paper tape 500, and may directly pass through the paper tape 500. For this reason, by setting a paper tape 500 conveying mechanism, after the drilling device 200 completes each drilling operation, the paper tape 500 conveying mechanism can drive the paper tape 500 to move forward along the X-axis for a first preset distance, thereby allowing a new paper tape 500 to be conveyed to the processing position 120 to facilitate drilling buffering for the next pre-processing position of the circuit board, thereby conveniently reducing the stress on the circuit board during each drilling operation, which is beneficial to reducing the burr formed at each orifice, thereby further improving the processing quality of the circuit board, and also saving the subsequent burr removal process, further improving the processing efficiency of the circuit board.

[0047] It is understandable that, referring to Figures 1 to 6 The X-axis direction may specifically be the length direction of the rack 100 .

[0048] It is understandable that the above-mentioned first preset distance may be 1 cm, 2 cm or other lengths, and the present invention does not impose any specific limitation on this. It is only necessary to ensure that the first preset distance is greater than the diameter of the previous drill hole.

[0049] Reference Figures 1 to 6 In some embodiments, the paper tape 500 conveying mechanism includes a paper tape 500 unwinding mechanism and a paper tape 500 receiving mechanism. The paper tape 500 unwinding mechanism and the paper tape 500 receiving mechanism are correspondingly arranged on both sides of the frame 100 along the X-axis direction. One end of the paper tape 500 is wound around the paper tape 500 unwinding mechanism, and the other end is wound around the paper tape 500 receiving mechanism. The paper tape 500 can be moved from the paper tape 500 unwinding mechanism toward the paper tape 500 receiving mechanism and wound around the paper tape 500 receiving mechanism.

[0050] By adopting the above structure, the paper tape 500 is more convenient to convey and reel in. Specifically, the paper tape 500 unwinding mechanism can be a paper tape 500 unwinding roller, and the paper tape 500 reeling mechanism can be a paper tape 500 reeling roller. The unused end of the paper tape 500 is wound around the paper tape 500 unwinding roller, and the used end of the paper tape 500 is wound around the paper tape 500 reeling roller. Thus, the paper tape 500 can be pulled from the paper tape 500 unwinding roller toward the paper tape 500 reeling roller and reeled on the paper tape 500 reeling roller by driving the paper tape 500 reeling roller or the paper tape 500 feeding roller to rotate. The structure is simple and the conveying is convenient.

[0051] It can be understood that the paper tape 500 unloading mechanism and the paper tape 500 receiving mechanism are correspondingly arranged on both sides of the frame 100 along the X-axis direction. Specifically, the horizontal heights of the paper tape 500 unloading mechanism and the paper tape 500 conveying mechanism are both located below the working platform 110, thereby making it convenient to place the paper tape 500 on the surface of the working platform 110, so that when the circuit board is placed on the working platform 110, the paper tape 500 can be located below the circuit board.

[0052] Reference Figures 1 to 6 In some embodiments, a tensioning mechanism 520 is provided on the frame 100 between the paper tape 500 unwinding mechanism and the paper tape 500 receiving mechanism, so as to make the conveyance of the paper tape 500 more stable. Specifically, the tensioning mechanism 520 can be a tensioning roller.

[0053] In some embodiments, a guide groove arranged along the X direction and passing through the processing position 120 is opened on the working platform 110, and the paper tape 500 is located in the guide groove.

[0054] By adopting the above structure, the setting of the guide groove can guide the conveyance of the paper tape 500, thereby reducing the risk of displacement of the middle part of the paper tape 500 during conveyance.

[0055] It is understandable that in order for the paper tape 500 to buffer the circuit board and reduce the stress on the circuit board during the drilling process, the depth of the guide groove should be less than the thickness of the paper tape 500 .

[0056] Reference Figures 1 to 6 In some embodiments, the drilling device 200 includes a drill bit and a pressing mechanism. The drill bit is located above the processing position 120. The pressing mechanism is arranged on the frame 100 and is in transmission connection with the drill bit. The pressing mechanism can drive the drill bit to move in the up and down direction close to or away from the processing position 120. The circuit board drilling equipment also includes a heat dissipation device (not shown in the figure). The heat dissipation device includes an aluminum strip and an aluminum strip conveying mechanism. The aluminum strip is arranged above the working platform 110 along the X-axis and is partially located above the processing position 120. When the material transfer device moves the circuit board to the working platform 110 and makes the pre-processing position located at the processing position 120, the pressing mechanism can drive the drill bit to move downward and penetrate the aluminum strip, the circuit board and the paper tape 500 in sequence; each time the drilling device 200 completes a drilling operation, the aluminum strip conveying mechanism can drive the aluminum strip to move forward along the X-axis for a second preset distance.

[0057] By adopting the above structure, the arrangement of the aluminum tape can not only dissipate heat for the circuit board during the drilling process, but also reduce the flash formed at the hole openings on the upper surface of the circuit board, thereby further improving the processing quality of the circuit board, and also saving the subsequent flash removal process, further improving the processing efficiency of the circuit board. And by arranging an aluminum tape conveying mechanism, a brand new aluminum tape can be conveyed to the processing position 120 during each drilling operation to dissipate heat for the upcoming drilling operation and reduce the flash at the hole openings on the surface of the circuit board, thereby conveniently reducing the flash formed at each hole opening on the upper surface of the circuit board, thereby further improving the processing quality of the circuit board and further improving the processing efficiency of the circuit board.

[0058] It can be understood that the aluminum strip conveying mechanism includes an aluminum strip unwinding mechanism and an aluminum strip receiving mechanism. The aluminum strip unwinding mechanism and the aluminum strip receiving mechanism are correspondingly arranged on both sides of the frame 100 along the X-axis direction. One end of the aluminum strip is wound around the aluminum strip unwinding mechanism, and the other end is wound around the aluminum strip receiving mechanism. The aluminum strip can be moved from the aluminum strip unwinding mechanism toward the aluminum strip receiving mechanism and wound around the aluminum strip receiving mechanism.

[0059] By adopting the above structure, the conveying of the aluminum strip is more convenient and the winding of the aluminum strip is easy. Specifically, the aluminum strip unwinding mechanism can be an aluminum strip unwinding roller, and the aluminum strip receiving mechanism can be an aluminum strip receiving roller. The unused end of the aluminum strip is wound around the aluminum strip unwinding roller, and the used end of the aluminum strip is wound around the aluminum strip receiving roller. Thus, the aluminum strip receiving roller or the aluminum strip feeding roller can be driven to rotate to pull the aluminum strip from the aluminum strip unwinding roller toward the aluminum strip receiving roller and be wound around the aluminum strip receiving roller. The structure is simple and the conveying is convenient.

[0060] It is understandable that the second preset distance may be 1 cm, 2 cm or other lengths, and the present invention does not impose any specific limitation on this. It is only necessary to ensure that the second preset distance is greater than the diameter of the previous drill hole.

[0061] Reference Figures 1 to 4 In some embodiments, the clamping mechanism 300 includes a moving frame 310 and a plurality of suction nozzles 320 . The driving mechanism 400 is transmission-connected to the moving frame 310 and can drive the moving frame 310 to move. All suction nozzles 320 are disposed on the moving frame 310 and can move with the moving frame 310 .

[0062] By adopting the above structure, the circuit board is adsorbed by multiple suction nozzles 320 and driven to move on the working platform 110, which not only ensures stable clamping but also protects the circuit board and avoids scratches on the surface of the circuit board.

[0063] Reference Figures 1 to 4In some embodiments, the driving mechanism 400 may specifically include an X-axis driving mechanism 410400 and a Y-axis driving mechanism 420400. The working platform 110 is provided with an X-axis guide rail and a Y-axis guide rail. The X-axis guide rail is arranged along the X-axis direction, and a Y-axis guide rail is movably installed on the X-axis guide rail. The Y-axis guide rail is arranged along the Y-axis direction. The movable frame 310 is movably installed on the Y-axis guide rail. The X-axis driving mechanism 410400 is transmission-connected to the Y-axis guide rail and can drive the Y-axis guide rail to move along the X-axis guide rail. The Y-axis driving mechanism 420400 is transmission-connected to the movable frame 310 and can drive the movable frame 310 to move along the Y-axis guide rail.

[0064] It is understandable that the X-axis drive mechanism 410400 can specifically adopt a linear drive structure such as an electric push rod, a motor-driven screw nut mechanism, or a cylinder, and the present invention does not make specific limitations on this. Similarly, the Y-axis drive mechanism 420400 can specifically adopt a linear drive structure such as an electric push rod, a motor-driven screw nut mechanism, or a cylinder, and the present invention does not make specific limitations on this.

[0065] It is understandable that, referring to Figures 1 to 6 The Y-axis direction is perpendicular to the X-axis direction, and may specifically be the width direction of the rack 100 .

[0066] Reference Figures 1 to 6 In some embodiments, a loading mechanism is also included, which includes a loading platform 600 and a loading lifting mechanism. The loading platform 600 is movably installed on the side of the frame 100, and the loading lifting mechanism is installed on the frame 100 and is transmission-connected to the loading platform 600. The loading lifting mechanism can drive the loading platform 600 to move in the up and down directions toward or away from the working platform 110.

[0067] By adopting the above structure, multiple circuit boards can be stacked on the loading platform 600, and the loading lifting mechanism drives the loading platform 600 to move upward, thereby facilitating the clamping mechanism 300 to obtain the circuit boards. In addition, the loading lifting mechanism can also drive the loading platform 600 to move downward, thereby facilitating the operator to stack the circuit boards to be processed on the loading platform 600, thereby facilitating the operator's operation and improving the loading efficiency of the circuit boards.

[0068] Reference Figures 1 to 6 In some embodiments, a loading guide plate 620 corresponding to the loading platform 600 is installed on the side of the frame 100, and a plurality of loading guide holes 621 are arranged along the up and down directions. The plurality of loading guide holes 621 are arranged at intervals along the X-axis direction. A loading support plate 610 corresponding to each loading guide hole 621 is installed on the bottom surface of the loading belt, and the loading support plate 610 is movably inserted into the corresponding loading guide hole 621.

[0069] By adopting the above structure, the guide holes on the loading guide plate 620 can guide the lifting and lowering of the loading platform 600, making the lifting and lowering of the loading platform 600 more stable. The setting of the loading support plate 610 can support the loading platform 600, which is beneficial to improve the structural strength of the loading platform 600, improve the load-bearing capacity of the loading platform 600, and enable the surface of the loading platform 600 to stabilize the other circuit board.

[0070] It can be understood that the provision of multiple support plates can further improve the structural stability of the loading platform 600.

[0071] It can be understood that in the above structure, the loading and lifting mechanism can be set on the rear side of the loading guide plate 620, and at least one loading support plate 610 can be transmission-connected to the loading and lifting mechanism, thereby not only realizing the lifting and lowering of the loading platform 600, but also the loading and lifting mechanism can be hidden, thereby protecting the loading and lifting mechanism and improving the appearance of the circuit board drilling equipment.

[0072] It is understandable that the feeding and lifting mechanism may specifically adopt a linear drive structure such as an electric push rod, a motor-driven screw-nut mechanism or a cylinder, and the present invention does not make any specific limitation on this.

[0073] Reference Figures 1 to 6 In some embodiments, the circuit board drilling equipment also includes a material unloading mechanism, which includes a material unloading platform 700 and a material unloading lifting mechanism. The material unloading platform 700 is movably installed on the side of the frame 100 and is located on one side of the loading platform 600. The material unloading lifting mechanism is installed on the frame 100 and is transmission-connected to the material unloading platform 700. The material unloading lifting mechanism can drive the material unloading platform 700 to move in the up and down directions toward or away from the working platform 110.

[0074] By adopting the above structure, the unloading table 700 is driven to move downward close to the working platform 110 through the unloading lifting mechanism, so that the material moving device can move the circuit board with completed drilling to the unloading table 700, and the unloading table 700 can be used to stack the processed circuit boards. Then, the unloading lifting mechanism can drive the unloading table 700 to move downward, thereby making it convenient for operators to unload the processed circuit boards, facilitating the operation of operators, and helping to improve the loading efficiency of circuit boards.

[0075] Reference Figures 1 to 6In some embodiments, a material unloading guide plate 720 corresponding to the material unloading platform 700 is installed on the side of the frame 100; the material unloading guide plate 720 is provided with a plurality of material unloading guide holes 721 arranged along the up-down direction, and the plurality of material unloading guide holes 721 are arranged at intervals along the X-axis direction, and a material unloading support plate 710 corresponding to each material unloading guide hole 721 is installed on the bottom surface of the material unloading belt, and the material unloading support plate 710 is movably inserted into the corresponding material unloading guide hole 721.

[0076] By adopting the above structure, the guide holes on the unloading guide plate 720 can guide the lifting and lowering of the unloading platform 700, making the lifting and lowering of the unloading platform 700 more stable. The setting of the unloading support plate 710 can support the unloading platform 700, which is beneficial to improve the structural strength of the unloading platform 700, improve the load-bearing capacity of the unloading platform 700, and enable the surface of the unloading platform 700 to stabilize the other circuit board.

[0077] It can be understood that the provision of multiple unloading support plates 710 can further improve the structural stability of the unloading platform 700 .

[0078] It can be understood that in the above structure, the material unloading lifting mechanism can be set on the rear side of the material unloading guide plate 720, and at least one material unloading support plate 710 can be connected to the material unloading lifting mechanism in a transmission manner. This not only enables the unloading table 700 to be lifted and lowered, but also allows the material unloading lifting mechanism to be hidden, thereby protecting the material unloading lifting mechanism and improving the appearance and neatness of the circuit board drilling equipment.

[0079] It is understandable that the material unloading and lifting mechanism can specifically adopt an electric push rod, a click-driven screw nut mechanism or a linear drive structure such as a cylinder, and the present invention does not make specific limitations on this.

[0080] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Circuit board drilling equipment, characterized in that: include: A frame (100) has a working platform (110), wherein the working platform (110) has a processing position (120); A drilling device (200) is arranged on the frame (100) and is located above the processing position (120); A material moving device is arranged on the frame (100), the material moving device comprises a clamping mechanism (300) and a driving mechanism (400), the clamping mechanism (300) is capable of clamping a circuit board, and the driving mechanism (400) is transmission-connected to the clamping mechanism (300) and is capable of driving the clamping mechanism (300) to move closer to or farther from the processing position (120); A buffer device, the buffer device comprising a paper tape (500), the paper tape (500) being arranged on the working platform (110) and being partially located at the processing position (120); The material moving device is capable of driving the circuit board to move on the working platform (110), so that the pre-processing position of the circuit board is located at the processing position (120), and the paper tape (500) is located below the circuit board.

2. The circuit board drilling equipment according to claim 1, characterized in that: The machine frame (100) further comprises a camera device (140) and a control device (150); the frame (100) is provided with a mounting seat (130); the camera device (140) is mounted on the mounting seat (130) and faces downward toward the processing position (120); the control device (150) is mounted on the frame (100) and is located on one side of the working platform (110); the control device (150) is electrically connected to the camera device (140) and can control the operation of the driving mechanism (400) according to image information fed back by the camera device (140).

3. The circuit board drilling equipment according to claim 1 or 2, characterized in that: The buffer device further comprises a paper tape (500) conveying mechanism, the paper tape (500) being movably arranged on the working platform (110) along the X-axis direction and at least partially located at the processing position (120), the paper tape (500) conveying mechanism being arranged on the frame (100) and being capable of driving the paper tape (500) to move along the X-axis direction; Each time the drilling device (200) completes a drilling operation, the paper tape (500) conveying mechanism can drive the paper tape (500) to move forward along the X-axis by a first preset distance.

4. The circuit board drilling equipment according to claim 3, characterized in that: The paper tape (500) conveying mechanism comprises a paper tape (500) unwinding mechanism and a paper tape (500) receiving mechanism. The paper tape (500) unwinding mechanism and the paper tape (500) receiving mechanism are arranged on both sides of the frame (100) along the X-axis direction. One end of the paper tape (500) is wound around the paper tape (500) unwinding mechanism, and the other end is wound around the paper tape (500) receiving mechanism. The paper tape (500) can be moved by the paper tape (500) unwinding mechanism toward the paper tape (500) receiving mechanism and be wound around the paper tape (500) receiving mechanism.

5. The circuit board drilling equipment according to claim 4, characterized in that: The working platform (110) is provided with a guide groove arranged along the X direction and passing through the processing position (120), and the paper tape (500) is located in the guide groove.

6. The circuit board drilling equipment according to claim 1 or 2, characterized in that: The drilling device (200) comprises a drill bit and a pressing mechanism, wherein the drill bit is located above the processing position (120), the pressing mechanism is arranged on the frame (100) and is in driving connection with the drill bit, and the pressing mechanism can drive the drill bit to move in an up-down direction toward or away from the processing position (120); It also includes a heat dissipation device, the heat dissipation device includes an aluminum strip and an aluminum strip conveying mechanism, the aluminum strip is arranged above the working platform (110) along the X-axis and is partially located above the processing position (120); When the material moving device moves the circuit board to the working platform (110) and makes the pre-processing position located at the processing position (120), the pressing mechanism can drive the drill to move downward and penetrate the aluminum strip, the circuit board and the paper strip (500) in sequence; Each time the drilling device (200) completes a drilling operation, the aluminum strip conveying mechanism can drive the aluminum strip to move forward along the X-axis by a second preset distance.

7. The circuit board drilling equipment according to claim 1, characterized in that: The clamping mechanism (300) comprises a movable frame (310) and a plurality of suction nozzles (320); the driving mechanism (400) is transmission-connected to the movable frame (310) and is capable of driving the movable frame (310) to move; and all the suction nozzles (320) are arranged on the movable frame (310) and are capable of moving with the movable frame (310).

8. The circuit board drilling equipment according to claim 1, characterized in that: The machine also comprises a loading mechanism, the loading mechanism comprising a loading platform (600) and a loading lifting mechanism, the loading platform (600) being movably mounted on a side of the frame (100), the loading lifting mechanism being mounted on the frame (100) and being transmission-connected to the loading platform (600), the loading lifting mechanism being capable of driving the loading platform (600) to move in an up-and-down direction toward or away from the working platform (110).

9. The circuit board drilling equipment according to claim 8, characterized in that: The machine also includes a material unloading mechanism, which includes a material unloading platform (700) and a material unloading lifting mechanism. The material unloading platform (700) is movably mounted on a side of the frame (100) and is located on one side of the loading platform (600). The material unloading lifting mechanism is mounted on the frame (100) and is transmission-connected to the material unloading platform (700). The material unloading lifting mechanism can drive the material unloading platform (700) to move in an up-down direction to approach or move away from the working platform (110).

10. The circuit board drilling equipment according to claim 1, characterized in that: A loading guide plate (620) corresponding to the loading platform (600) and a unloading guide plate (720) corresponding to the unloading platform (700) are installed on the side of the frame (100); The feeding guide plate (620) is provided with a plurality of feeding guide holes (621) arranged in the up-down direction, and the plurality of feeding guide holes (621) are arranged at intervals in the X-axis direction. The bottom surface of the feeding belt is provided with a feeding support plate (610) corresponding to each of the feeding guide holes (621) one by one, and the feeding support plate (610) is movably inserted in the corresponding feeding guide hole (621); The material removal guide plate (720) is provided with a plurality of material removal guide holes (721) arranged in the up-down direction, and the plurality of material removal guide holes (721) are arranged at intervals along the X-axis direction. A material removal support plate (710) corresponding to each of the material removal guide holes (721) is installed on the bottom surface of the material removal belt, and the material removal support plate (710) is movably inserted into the corresponding material removal guide hole (721).

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