Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic device includes: a housing; the mainboard assembly is arranged in the shell; the first heat dissipation plate covers the first side of the mainboard assembly; the second heat dissipation plate covers the second side of the mainboard assembly, and the first heat dissipation plate is connected with the second heat dissipation plate; and the active heat dissipation module is arranged on the mainboard assembly, and the first heat dissipation plate or the second heat dissipation plate covers the active heat dissipation module.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In the related art, electronic devices usually set a heat dissipation layer such as a graphite film or a metal heat spreader on the side of the motherboard where the chips, batteries and other heat-generating components are arranged to absorb the heat generated by the chips, batteries and other heat-generating components on the motherboard. Then the heat dissipation material exchanges heat with the air outside the electronic device to complete the heat dissipation process of the electronic device. However, this heat dissipation method mainly relies on natural convection between the heat dissipation material and the air around the electronic device to achieve heat dissipation, resulting in an unsatisfactory heat exchange effect and limited heat dissipation capacity, which in turn leads to low heat dissipation efficiency of the electronic device. Summary of the invention

[0003] The present application aims to provide an electronic device that can solve the technical problem of low heat dissipation efficiency of electronic devices in related technologies.

[0004] The present application provides an electronic device, including:

[0005] case;

[0006] A mainboard assembly is disposed in the housing;

[0007] A first heat sink, covering a first side of the mainboard assembly;

[0008] A second heat sink covers the second side of the mainboard assembly, and the first heat sink is connected to the second heat sink;

[0009] An active heat dissipation module is arranged on the mainboard assembly, and the first heat dissipation plate or the second heat dissipation plate covers the active heat dissipation module.

[0010] The electronic device of the embodiment of the present application can increase the heat dissipation area of ​​the mainboard component by respectively setting the first heat dissipation plate and the second heat dissipation plate on the first side of the mainboard component and the second side of the mainboard component, and connect the first heat dissipation plate with the second heat dissipation plate, so as to achieve heat dissipation of the heat emitted by the mainboard component on both sides of the mainboard component at the same time, and can also conduct the heat through the connection between the first heat dissipation plate and the second heat dissipation plate when the heat emitted by the first side of the mainboard component and the heat emitted by the second side of the mainboard component are different, thereby improving the heat dissipation efficiency. At the same time, by setting an active heat dissipation module, active heat dissipation of the first heat dissipation plate or the second heat dissipation plate can be achieved, instead of relying solely on the natural convection between the first heat dissipation plate or the second heat dissipation plate and the surrounding air, and active heat dissipation of the mainboard component can also be achieved, further improving the heat dissipation effect of the mainboard component.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 One of the structural schematic diagrams of the electronic device according to the embodiment of the present application is shown;

[0014] Figure 2 A second structural schematic diagram of an electronic device according to an embodiment of the present application is shown;

[0015] Figure 3 Shows Figure 1 One of the structural diagrams of the active heat dissipation module;

[0016] Figure 4 Shows Figure 1 The second structural diagram of the active heat dissipation module;

[0017] Figure 5 Shows Figure 1 Schematic diagram of the structure of the middle and rear cover;

[0018] Figure 6 Shows Figure 1 A schematic diagram of the structure of the first heat sink, the second heat sink and the third heat sink;

[0019] Figure 7 Shows Figure 1 One of the structural schematic diagrams of the first heat sink and the second heat sink;

[0020] Figure 8 Shows Figure 1 The second structural schematic diagram of the first heat sink and the second heat sink.

[0021] Reference numerals:

[0022] 100 electronic device, 102 shell, 104 mainboard assembly, 106 first heat sink, 108 active heat dissipation module, 110 first shell, 112 second through hole, 114 second shell, 116 sealed space, 118 fan, 124 sealed silencer cavity, 126 air inlet, 130 back cover, 132 support layer, 134 heat dissipation layer, 136 decorative layer, 138 first hollow portion, 140 second heat sink, 142 third heat sink, 148 sealant, 150 first through hole, 152 frame, 154 sub-heat sink, 156 shell, 158 first surface, 160 second surface, 162 air inlet, 164 air outlet. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0024] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, and internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] Combine the following Figures 1 to 8 An electronic device according to an embodiment of the present application is described.

[0027] In some embodiments of the present application, an electronic device is provided. Figure 1 One of the structural schematic diagrams of the electronic device according to the embodiment of the present application is shown; Figure 2 The second structural diagram of the electronic device according to the embodiment of the present application is shown; Figure 1 and Figure 2 As shown, the electronic device 100 includes: a housing 102; a mainboard assembly 104, which is arranged in the housing 102; a first heat sink 106, which covers the first side of the mainboard assembly 104; a second heat sink 140, which covers the second side of the mainboard assembly 104, and the first heat sink 106 is connected to the second heat sink 140; an active heat dissipation module 108, which is arranged on the mainboard assembly 104, and the first heat sink 106 or the second heat sink 140 covers the active heat dissipation module 108.

[0028] In the embodiment of the present application, the electronic device 100 includes a housing 102 and a mainboard assembly 104 disposed in the housing 102, wherein the mainboard assembly 104 integrates multiple electrical components of the electronic device 100 to realize the relevant functions of the electronic device 100 and ensure the compactness of the structure of the electronic device 100. The housing 102 can be used to protect the mainboard assembly 104 to prevent the electrical components from being damaged by the impact of external objects.

[0029] Furthermore, the electronic device 100 also includes a first heat sink 106, which can cover the first side of the mainboard assembly 104, so that during the operation of the mainboard assembly 104, the heat emitted by the mainboard assembly 104 can be absorbed by the first heat sink 106 to cool the mainboard assembly 104 and avoid damage to the mainboard assembly 104 due to excessive temperature.

[0030] It is understandable that the mainboard assembly 104 usually integrates various processing chips required during the operation of the electronic device 100, as well as heating devices such as batteries that provide some power for various processing chips. During the operation of the electronic device 100, the temperature of the processing chip and the battery will gradually increase. In the case of excessively high temperatures, the processing chip may burn. Therefore, by providing a first heat sink 106 and covering the first heat sink 106 on one side of the mainboard assembly 104, the heating area of ​​the first heat sink 106 can be increased, thereby improving the heat dissipation effect of the first heat sink 106 on the mainboard assembly 104.

[0031] The electronic device 100 may further include a second heat sink 140, which may cover the second side of the mainboard assembly 104, that is, the side away from the first side of the mainboard assembly 104. By providing the second heat sink 140, the heat emitted by the mainboard assembly 104 may be absorbed on both sides of the mainboard assembly 104 in cooperation with the first heat sink 106, thereby improving the heat dissipation efficiency of the mainboard assembly 104. In addition, the second heat sink 140 may be connected to the first heat sink 106, so that not only the heat emitted by the mainboard assembly 104 may be dissipated through the second heat sink 140, but also, when the heat emitted by the first side of the mainboard assembly 104 and the second side of the mainboard assembly 104 are different, the heat may be conducted through the connection between the first heat sink 106 and the second heat sink 140, thereby achieving heat balance between the first heat sink 106 and the second heat sink 140, thereby improving the heat dissipation efficiency.

[0032] Furthermore, the electronic device 100 further includes an active heat dissipation module 108, which is disposed on the mainboard assembly 104, and the first heat dissipation plate 106 or the second heat dissipation plate 140 covers the active heat dissipation module 108. By providing the active heat dissipation module 108, the active heat dissipation module 108 can realize active heat dissipation during operation, that is, realize active heat dissipation of the first heat dissipation plate 106 or the second heat dissipation plate 140, so that the first heat dissipation plate 106 or the second heat dissipation plate 140 does not only rely on natural convection between the first heat dissipation plate 106 or the second heat dissipation plate 140 and the surrounding air, but can improve the convection effect between the first heat dissipation plate 106 or the second heat dissipation plate 140 and the surrounding air, thereby realizing active heat dissipation of the first heat dissipation plate 106 or the second heat dissipation plate 140 and improving heat dissipation efficiency.

[0033] Exemplarily, the active heat dissipation module 108 can realize active heat dissipation of the first heat dissipation plate 106 or the second heat dissipation plate 140 by driving the gas. Specifically, during the operation of the electronic device 100, the first heat dissipation plate 106 and the second heat dissipation plate 140 can absorb the heat generated by the mainboard assembly 104, and then the first heat dissipation plate 106 and the second heat dissipation plate 140 exchange heat with the air around themselves to exchange their own heat to the surrounding air. At this time, the gas is driven by the active heat dissipation module 108 to drive the high-temperature air around the first heat dissipation plate 106 or the second heat dissipation plate 140 to the outside of the housing 102, and the low-temperature air outside the housing 102 is driven to the first heat dissipation plate 106. This can effectively improve the heat exchange efficiency between the first heat dissipation plate 106 or the second heat dissipation plate 140 and the surrounding air, thereby improving the heat dissipation efficiency of the electronic device 100. That is, through the setting of the active heat dissipation module 108, active circulation of gas around the first heat dissipation plate 106 can be achieved without relying on natural convection between the first heat dissipation plate 106 or the second heat dissipation plate 140 and the surrounding air, thereby achieving active heat dissipation of the electronic device 100 and effectively improving the heat dissipation efficiency of the electronic device 100.

[0034] In addition, it should be noted that by setting up an active heat dissipation module 108, not only can the air around the first heat dissipation plate 106 or the second heat dissipation plate 140 be driven, but also the air around the mainboard assembly 104 can be driven, so that the mainboard assembly 104 can also improve the heat exchange efficiency with the surrounding air, further improving the heat dissipation effect of the mainboard assembly 104.

[0035] The electronic device 100 of the embodiment of the present application, by respectively setting the first heat sink 106 and the second heat sink 140 on the first side of the mainboard assembly 104 and the second side of the mainboard assembly 104, and connecting the first heat sink 106 and the second heat sink 140, can not only increase the heat dissipation area of ​​the mainboard assembly 104, but also realize the heat dissipation of the heat emitted by the mainboard assembly 104 on both sides of the mainboard assembly 104, and can also conduct the heat through the connection between the first heat sink 106 and the second heat sink 140 when the heat emitted by the first side of the mainboard assembly 104 and the second side of the mainboard assembly 104 are different, thereby improving the heat dissipation efficiency. At the same time, by setting the active heat dissipation module 108, the first heat sink 106 or the second heat sink 140 can be actively dissipated, instead of relying solely on the natural convection between the first heat sink 106 or the second heat sink 140 and the surrounding air, and can also realize the active heat dissipation of the mainboard assembly 104, further improving the heat dissipation effect of the mainboard assembly 104.

[0036] Exemplarily, a temperature detection device may be provided on the mainboard assembly 104 of the electronic device 100. Through the temperature detection device, the temperature inside the housing 102 may be detected. The control chip of the electronic device 100 may control the operation of the active heat dissipation module 108 according to the temperature detected by the temperature detection device. For example, when the temperature detected by the temperature detection device exceeds the temperature threshold, the control chip of the electronic device 100 may control the operation of the active heat dissipation module 108 to drive the high-temperature air inside the housing 102 to the outside of the housing 102. At the same time, since negative pressure is formed inside the housing 102, the low-temperature air outside the housing 102 may enter the housing 102, thereby reducing the air temperature around the first heat dissipation plate 106 or the second heat dissipation plate 140, thereby improving the heat dissipation efficiency of the mainboard assembly 104.

[0037] In some embodiments of the present application, Figure 6 Shows Figure 1 The structural diagram of the first heat sink, the second heat sink and the third heat sink is shown in FIG. Figure 6 As shown, the electronic device 100 also includes a third heat sink 142, which is arranged on the third side of the mainboard assembly 104, and the third side is a side connected to both the first side and the second side. The first end of the third heat sink 142 is connected to the first heat sink 106, and the second end of the third heat sink 142 is connected to the second heat sink 140.

[0038] In the embodiment of the present application, the first heat sink 106 and the second heat sink 140 can be connected through the third heat sink 142, and heat transfer is achieved through the third heat sink 142. Specifically, the third heat sink 142 is arranged on the third side of the mainboard assembly 104, one end of the third heat sink 142 is connected to the first heat sink 106, and the other end of the third heat sink 142 is connected to the second heat sink 140. The third heat sink 142 and the first heat sink 106, and the third heat sink 142 and the second heat sink 140 can be connected through thermal conductive gel, so as to ensure the heat transfer efficiency between the third heat sink 142 and the first heat sink 106, and between the third heat sink 142 and the second heat sink 140. The third heat sink 142 can be made of technical materials into a bent shape to achieve connection with the first heat sink 106 and the second heat sink 140. Alternatively, the third heat sink 142 can also be made of flexible materials such as polyimide.

[0039] Exemplarily, when the first heat sink 106 covers the active heat dissipation module 108, through the provision of the third heat sink 142, when the second heat sink 140 absorbs the heat of the mainboard assembly 104, the heat can be transferred to the first heat sink 106 through the second heat sink 140 and the third heat sink 142 in sequence, and then under the action of the active heat dissipation module 108, the heat is quickly transferred to the outside of the housing 102 of the electronic device 100. That is, by connecting the second heat sink 140 with the first heat sink 106 through the third heat sink 142, the heat dissipation function of the active heat dissipation module 108 can be fully utilized to quickly transfer the heat on the second heat sink 140 to the first heat sink 106, and then to the outside of the housing 102, so as to further improve the heat dissipation efficiency of the electronic device 100.

[0040] In some embodiments of the present application, Figure 7 Shows Figure 1 One of the structural schematic diagrams of the first heat sink and the second heat sink; Figure 8 Shows Figure 1 The second structural schematic diagram of the first heat sink and the second heat sink, as shown in FIG. Figure 7 and Figure 8 As shown, the first heat dissipation plate 106 and / or the second heat dissipation plate 140 has a sub-heat dissipation plate 154 on the third side, and the third side is a side connected to both the first side and the second side. The first heat dissipation plate 106 and the second heat dissipation plate 140 are connected through the sub-heat dissipation plate 154.

[0041] In the embodiment of the present application, the first heat sink 106 and the second heat sink 140 can be connected to each other through a sub-heat sink 154 disposed on the first heat sink 106 and / or the second heat sink 140. Specifically, the sub-heat sink 154 can be disposed on the first heat sink 106, and the sub-heat sink 154 can be disposed in a bent shape so that the sub-heat sink 154 can be connected to the second heat sink 140. Figure 7 As shown, the sub-heat sink 154 may be disposed on the second heat sink 140 , and the sub-heat sink 154 may be disposed in a bent shape so that the sub-heat sink 154 can be connected to the first heat sink 106 .

[0042] In addition, if Figure 8 As shown, sub-heat sinks 154 can be provided on both the first heat sink 106 and the second heat sink 140, and the two sub-heat sinks 154 are located on the third side of the first heat sink 106 and the second heat sink 140, wherein the third side is a side connected to both the first side of the mainboard assembly 104 and the second side of the mainboard assembly 104, that is, the two sub-heat sinks 154 are located on the third side of the mainboard assembly 104 at the same time, to ensure that the two sub-heat sinks 154 can be connected to each other, thereby realizing the connection between the first heat sink 106 and the second heat sink 140.

[0043] In some embodiments of the present application, Figure 3 Shows Figure 1 One of the structural diagrams of the active heat dissipation module in FIG. Figure 3 As shown, the active heat dissipation module 108 includes: a shell 156, a first heat dissipation plate 106 or a second heat dissipation plate 140 covering a first surface 158 of the shell 156; a fan 118, the fan 118 is arranged in the shell 156, and the shell 156 has a first through hole 150 and a second through hole 112, the first through hole 150 is located on the first surface 158, and the second through hole 112 is located on the second surface 160 of the shell 156, and the second surface 160 is a surface connected to the first surface 158.

[0044] In the embodiment of the present application, the active heat dissipation module 108 may include a housing 156 and a fan 118 disposed in the housing 156, wherein the first heat dissipation plate 106 or the second heat dissipation plate 140 covers the first surface 158 of the housing 156, so that the first heat dissipation plate 106 or the second heat dissipation plate 140 is actively dissipated by the active heat dissipation module 108. Further, by disposing the fan 118, it is possible to drive the gas, thereby driving the air around the first heat dissipation plate 106 or the second heat dissipation plate 140, and then actively dissipating the first heat dissipation plate 106 or the second heat dissipation plate 140.

[0045] Further, the housing 156 has a first through hole 150 and a second through hole 112, wherein the first through hole 150 is located on the first surface 158 of the housing 156, the second through hole 112 is located on the second surface 160 of the housing 156, and the second surface 160 is a surface connected to the first surface 158. That is, the first through hole 150 and the second through hole 112 can be located on the two side walls of the housing 156 respectively, and according to the specific shape of the active heat dissipation module 108, there can be an angle of 0 to 90 degrees between the first surface 158 and the second surface 160. In this way, the normal flow of gas can be ensured by the setting of the first through hole 150 and the second through hole 112, that is, during the rotation of the fan 118, the gas can enter through the first through hole 150, and then flow out from the second through hole 112 under the drive of the fan 118, so as to realize the flow of gas. At the same time, the first through hole 150 is set on the first surface 158 of the outer shell 156, and the first heat sink 106 or the second heat sink 140 covers the first surface 158 of the outer shell 156. In this way, when the fan 118 rotates, the high-temperature air around the first heat sink 106 or the second heat sink 140 can be taken away through the first through hole 150 to improve the heat dissipation efficiency of the first heat sink 106 or the second heat sink 140, thereby realizing active heat dissipation of the first heat sink 106 or the second heat sink 140.

[0046] In addition, in some embodiments, a diaphragm made of piezoelectric material can be used instead of the fan 118 to drive the gas. Specifically, the diaphragm can be located inside the housing 156 and attached to the housing 156. When the temperature inside the housing 102 is too high, the control chip of the mainboard assembly 104 can control the diaphragm to be energized. When current passes through the diaphragm, the diaphragm will deform based on the characteristics of the piezoelectric material. By controlling the size of the current in the diaphragm, the diaphragm can produce a piston-like movement inside the housing 156, thereby driving the air flow inside the housing 156.

[0047] In some embodiments of the present application, Figure 4 Shows Figure 1 The second structural diagram of the active heat dissipation module is as follows: Figure 3 and Figure 4 As shown, the fan 118 has an air inlet 162 and an air outlet 164, the air inlet 162 is opposite to the first through hole 150, and the air outlet 164 is connected to the second through hole 112 to form an air outlet channel, and the shell 156 also includes a closed silencer chamber 124, the closed silencer chamber 124 has an air inlet hole 126, and the air inlet hole 126 is connected to the air outlet channel, and the closed silencer chamber 124 is used to reduce the noise emitted by the fan 118.

[0048] In the embodiment of the present application, the fan 118 may include an air inlet 162 and an air outlet 164. When the fan 118 rotates, it can drive the gas to enter from the air inlet 162 and flow out through the air outlet 164 to achieve the driving of the gas. The air inlet 162 is opposite to the first through hole 150 of the housing 156, so as to suck in the high-temperature air around the first heat sink 106 or the second heat sink 140. The air outlet 164 of the fan 118 is connected to the second through hole 112 of the housing 156 to form an air outlet channel, so that the gas can flow out through the air outlet channel, that is, the high-temperature air around the first heat sink 106 or the second heat sink 140 flows out through the first through hole 150, the fan 118 and the second through hole 112 in sequence, so as to achieve active heat dissipation of the first heat sink 106 or the second heat sink 140.

[0049] Furthermore, the housing 156 may also include a sealed silencer chamber 124. By setting the sealed silencer chamber 124, the noise generated during the operation of the active heat dissipation module 108, that is, during the rotation of the fan 118, can be silenced, thereby reducing the noise of the active heat dissipation module 108 and improving the user experience of the electronic device 100.

[0050] The sealed silencer cavity 124 has an air inlet 126, and the air inlet 126 is connected to the air outlet channel. That is, the sealed silencer cavity 124 can achieve a silencer function based on the principle of the Helmholtz resonance cavity. Specifically, based on the Helmholtz calculation formula:

[0051]

[0052] The volume of the closed silencing chamber 124 and the size of the air inlet 126 can be calculated according to the frequency of the noise. Specifically, v is the volume of the closed silencing chamber 124, f is the frequency of the noise, C is the speed of the sound wave, which can be specifically taken as m / s. When the shape of the air inlet 126 is cylindrical, the air inlet 126 is intercepted along the axis perpendicular to the air inlet 126, A is the cross-sectional area of ​​the air inlet 126, and L is the length of the air inlet 126. Exemplarily, when the frequency of the noise emitted by the fan 118 is 0 Hz and the shape of the air inlet 126 is cylindrical, the volume of the closed silencing chamber 124 can be calculated by the above formula to be approximately .8mm 3 The length of the air inlet hole 126 is 3 mm. The air inlet hole 126 is intercepted along the axis perpendicular to the air inlet hole 126, and the cross-sectional area of ​​the air inlet hole 126 is 2.25 mm. 2 .

[0053] In addition, a sound-absorbing material disposed on the inner wall of the housing 156, or a microporous plate disposed on the housing 156, or an active silencer disposed in the housing 156 may be used to silence the noise generated during the operation of the active heat dissipation module 108.

[0054] In some embodiments of the present application, Figure 3 As shown, the housing 156 includes a first housing 110 and a second housing 114 , and the first housing 110 and the second housing 114 are connected by a sealant 148 so that the first housing 110 and the second housing 114 enclose a sealed space.

[0055] In the embodiment of the present application, the shell 156 may include a first shell 110 and a second shell 114, and the second shell 114 covers the first shell 110. The first shell 110 and the second shell 114 may be connected by a sealant 148, so that the first shell 110 and the second shell 114 can be enclosed into a closed space, and the fan 118 can be arranged in the closed space.

[0056] The first through hole 150 and the second through hole 112 may be both disposed on the first housing 110, or both disposed on the second housing 114. Alternatively, the first through hole 150 and the second through hole 112 may be disposed on the first housing 110 and the second housing 114, respectively. Alternatively, the first through hole 150 or the second through hole 112 may be formed between the first housing 110 and the second housing 114. During the rotation of the fan 118, the high-temperature air around the first heat sink 106 or the second heat sink 140 may be sucked into the enclosed space from the first through hole 150, and discharged from the enclosed space from the second through hole 112, so as to realize active heat dissipation of the first heat sink 106 or the second heat sink 140.

[0057] ; In some embodiments of the present application, Figure 5 Shows Figure 1 The structural diagram of the middle and rear cover is as follows: Figure 1 and Figure 5 As shown, the housing 102 includes a back cover 130 , which is stacked with the mainboard assembly 104 , wherein the first heat sink 106 is connected to a side of the back cover 130 facing the mainboard assembly 104 .

[0058] In the embodiment of the present application, the housing 102 of the electronic device 100 may include a back cover 130, and the first heat sink 106 is connected to the side of the back cover 130 facing the mainboard assembly 104. Specifically, the first heat sink 106 may be attached to the back cover 130. By attaching the first heat sink 106 to the back cover 130 of the electronic device 100, heat exchange can be achieved between the back cover 130 and the first heat sink 106, thereby further improving the heat dissipation efficiency of the first heat sink 106.

[0059] It is understandable that the housing 102 of the electronic device 100 generally further includes a frame 152, and the edge of the back cover 130 is connected to the edge of the frame 152, so as to form a storage space between the frame 152 and the back cover 130, so as to achieve the storage and protection of the mainboard assembly 104, the battery and other electrical components of the electronic device 100. Among them, the back cover 130 generally covers one side of the mainboard assembly 104 of the electronic device 100, and the area of ​​the back cover 130 is relatively large, and the contact area between the back cover 130 and the external air is relatively large, so the heat exchange efficiency between the back cover 130 and the external air is relatively high, so that the heat dissipation effect of the electronic device 100 can be further improved.

[0060] In some embodiments of the present application, Figure 5 As shown, the back cover 130 includes: a supporting layer 132 facing the mainboard assembly 104, the first heat sink 106 being connected to the supporting layer 132; a heat dissipation layer 134 being arranged on the side of the supporting layer 132 away from the mainboard assembly 104; and a decorative layer 136 being arranged on the side of the heat dissipation layer 134 away from the supporting layer 132.

[0061] In an embodiment of the present application, the back cover 130 of the electronic device 100 may include a supporting layer 132, a heat dissipation layer 134 and a decorative layer 136, wherein the supporting layer 132 faces the mainboard assembly 104, and the first heat dissipation plate 106 is connected to the supporting layer 132. Specifically, the first heat dissipation plate 106 can be attached to the supporting layer 132. Through the supporting layer 132, the overall structure of the back cover 130 can be supported to ensure the stability of the structure of the back cover 130, thereby protecting the mainboard assembly 104 and other components inside the shell 102.

[0062] Furthermore, the heat dissipation layer 134 is disposed on the side of the support layer 132 away from the mainboard assembly 104. By disposing the heat dissipation layer 134, the heat dissipation performance of the back cover 130 can be further improved. That is, after the heat absorbed by the first heat sink 106 is transferred to the heat dissipation layer 134 through the support layer 132, the heat dissipation efficiency can be improved based on the higher thermal conductivity of the heat dissipation layer 134, thereby further improving the overall heat dissipation efficiency of the electronic device 100.

[0063] Furthermore, the decoration layer 136 is disposed on a side of the heat dissipation layer 134 away from the support layer 132 . By disposing the decoration layer 136 , the appearance quality of the electronic device 100 can be improved and the user experience can be enhanced.

[0064] In some embodiments of the present application, Figure 5 As shown, the support layer 132 is provided with a plurality of first hollow portions 138 , and a portion of the first heat dissipation plate 106 is connected to the heat dissipation layer 134 via the plurality of first hollow portions 138 .

[0065] In the embodiment of the present application, a plurality of first hollow portions 138 may be provided on the support layer 132, so that a portion of the first heat sink 106 can be connected to the heat sink layer 134 through the plurality of first hollow portions 138, thereby achieving rapid transfer of heat from the first heat sink 106 to the heat sink layer 134, that is, accelerating the heat transfer speed, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0066] In some embodiments of the present application, the heat dissipation layer 134 includes a hydrogel material layer.

[0067] In the embodiment of the present application, the heat dissipation layer 134 may include a hydrogel material layer, that is, the heat dissipation layer 134 may be made of a hydrogel material. It is understandable that the hydrogel material has a unique thermal response characteristic, that is, it absorbs water at low temperatures and releases water at high temperatures. This characteristic enables the hydrogel material to absorb and store water at low temperatures, and after absorbing the heat transferred by the first heat dissipation plate 106, it can take away the heat transferred by the first heat dissipation plate 106 through the evaporation process, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0068] In some embodiments of the present application, the decoration layer 136 is provided with a plurality of second hollow portions (not shown in the figure), and a portion of the heat dissipation layer 134 is opposite to the second hollow portions.

[0069] In the embodiment of the present application, a plurality of second hollow portions may be provided on the decorative layer 136, so that part of the heat dissipation layer 134 can be opposite to the second hollow portions, that is, part of the heat dissipation layer 134 can be directly in contact with the outside air. In this way, after the heat dissipation layer absorbs the heat, the heat can be transferred to the air outside the decorative layer 136 through the plurality of second hollow portions on the decorative layer 136, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0070] In addition, the decoration layer 136 can be made of leather material to improve the user's feel when using the electronic device 100.

[0071] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0072] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: case; A mainboard assembly is disposed in the housing; A first heat dissipation plate, covering a first side of the mainboard assembly; A second heat sink covers the second side of the mainboard assembly, and the first heat sink is connected to the second heat sink; An active heat dissipation module is arranged on the mainboard assembly, and the first heat dissipation plate or the second heat dissipation plate covers the active heat dissipation module.

2. The electronic device according to claim 1, characterized in that: It also includes a third heat sink, which is arranged on the third side of the mainboard assembly, and the third side is a side connected to both the first side and the second side. The first end of the third heat sink is connected to the first heat sink, and the second end of the third heat sink is connected to the second heat sink.

3. The electronic device according to claim 1, characterized in that: The first heat dissipation plate and / or the second heat dissipation plate has a sub-heat dissipation plate on a third side, the third side being a side connected to both the first side and the second side, and the first heat dissipation plate and the second heat dissipation plate are connected via the sub-heat dissipation plate.

4. The electronic device according to claim 1, characterized in that: The active heat dissipation module comprises: A housing, wherein the first heat dissipation plate or the second heat dissipation plate covers a first surface of the housing; A fan is arranged in the housing, the housing has a first through hole and a second through hole, the first through hole is located on the first surface, the second through hole is located on the second surface of the housing, and the second surface is a surface connected to the first surface.

5. The electronic device according to claim 4, characterized in that: The fan has an air inlet and an air outlet, the air inlet is opposite to the first through hole, and the air outlet is connected to the second through hole to form an air outlet channel. The shell also includes a closed silencing chamber, which has an air inlet, and the air inlet is connected to the air outlet channel. The closed silencing chamber is used to reduce the noise emitted by the fan.

6. The electronic device according to claim 5, characterized in that: The housing comprises a first housing and a second housing, and the first housing and the second housing are connected by a sealant so that the first housing and the second housing enclose a sealed space.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The housing comprises: A back cover is stacked with the mainboard assembly, wherein the first heat sink is connected to a side of the back cover facing the mainboard assembly.

8. The electronic device according to claim 7, characterized in that: The back cover comprises: A supporting layer, facing the mainboard assembly, wherein the first heat sink is connected to the supporting layer; A heat dissipation layer is arranged on a side of the support layer away from the mainboard assembly; The decorative layer is arranged on a side of the heat dissipation layer away from the supporting layer.

9. The electronic device according to claim 8, characterized in that: The support layer is provided with a plurality of first hollow portions, and part of the first heat dissipation plates is connected to the heat dissipation layer through the plurality of first hollow portions.

10. The electronic device according to claim 8, characterized in that: The decoration layer is provided with a plurality of second hollow portions, and a portion of the heat dissipation layer is opposite to the second hollow portions.

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