Shell assembly and electronic equipment

Abstract

The invention relates to a shell assembly and electronic equipment. The shell assembly comprises a shell provided with an accommodating space; the waterproof isolation piece is provided with an air duct communicated with the exterior of the shell, the waterproof isolation piece is arranged on the shell, and the air duct and the containing space are subjected to waterproof isolation; the heat dissipation mechanism comprises a driving part, a transmission part and a fan element, the driving part is arranged in the containing space, the fan element is arranged in the air channel, and the transmission part penetrates through the waterproof isolation part and is connected to the driving part and the fan element; the driving piece can drive the fan element to move relative to the waterproof isolation piece through the transmission piece so that airflow can be generated in the air channel. According to the shell assembly, the waterproof performance of the shell assembly can be improved while the heat dissipation of the components in the accommodating space is realized.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a shell component and an electronic device. Background Art

[0002] Smartphones, tablet computers, e-readers and other electronic devices are usually equipped with circuit boards, chips and other functional devices. Functional devices are prone to heat up during operation. If the temperature is too high, it is easy to cause the performance or service life of the electronic device to decrease. Therefore, electronic devices are usually equipped with heat dissipation mechanisms to dissipate heat from functional devices and suppress the increase in temperature. However, the setting of heat dissipation mechanisms in traditional electronic devices is likely to cause the waterproof performance of electronic devices to decrease, affecting the structural reliability of electronic devices. Summary of the invention

[0003] The embodiments of the present application provide a shell assembly and an electronic device to solve the problem that the provision of a heat dissipation mechanism easily leads to a decrease in the waterproof performance of the electronic device.

[0004] A shell assembly, comprising:

[0005] A housing is provided with a containing space;

[0006] A waterproof isolator is provided with an air duct connected to the outside of the shell, the waterproof isolator is provided on the shell, and the air duct and the accommodating space are waterproofly isolated; and,

[0007] The heat dissipation mechanism includes a driving member, a transmission member and a fan element, wherein the driving member is arranged in the accommodating space, the fan element is arranged in the air duct, the transmission member passes through the waterproof isolation member and is connected to the driving member and the fan element, and the driving member can drive the fan element to move relative to the waterproof isolation member through the transmission member to generate airflow in the air duct.

[0008] An electronic device comprises a shell assembly as described in any of the above embodiments.

[0009] The shell assembly is provided with the driving member and the fan element of the heat dissipation mechanism in the accommodating space and the air duct respectively. The fan element can generate airflow in the air duct under the drive of the driving member, thereby taking away the heat conducted from the accommodating space to the waterproof isolation member, and providing heat dissipation for the components in the accommodating space. At the same time, the waterproof isolation between the accommodating space and the air duct can achieve heat dissipation for the components in the accommodating space, and the setting of the air duct is not easy to affect the waterproof performance of the accommodating space. The driving member can also be effectively waterproofed, which is conducive to improving the waterproof performance of the shell assembly. In addition, the fan element can be cleaned by washing the air duct, solving the problem of dust accumulation in the fan element affecting the heat dissipation efficiency, and the cleaning process of the fan element is not easy to affect the accommodating space and the driving member. Furthermore, the driving member and the fan element are arranged in different spaces, and the fan element can occupy a larger space in the air duct. Compared with integrating the driving member and the fan element in the same space, it is conducive to making the fan element's blade area larger, thereby helping to improve the heat dissipation performance of the shell assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 Schematic diagram of the structure of electronic equipment in some embodiments.

[0012] Figure 2 Schematic diagram of the structure of the shell assembly in some embodiments.

[0013] Figure 3 Schematic diagram of the structure of the shell assembly in some other embodiments.

[0014] Figure 4 Schematic diagrams of the structures of shell components in some other embodiments.

[0015] Figure 5 This is a schematic diagram of the structure in which the electronic device further includes other components in some embodiments.

[0016] Reference numerals:

[0017] 10. Electronic device; 11. Display screen; 20. Shell assembly; 21. Shell; 211. Accommodating space; 212. Air outlet; 213. Hole structure; 22. Circuit board; 23. Functional device; 24. Waterproof isolation member; 241. Air duct; 251. Driving member; 252. Transmission member; 2521. First transmission structure; 2522. Second transmission structure; 26. Fan element; 27. Heat conducting member; 28. Heat dissipating member; 291. Temperature sensing member; 292. Control member. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0019] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0020] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0021] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0022] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0023] (1) Satellite phone or cellular phone;

[0024] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0025] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0026] (4) conventional laptop and / or handheld receivers;

[0027] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0028] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of the electronic device 10 in some embodiments, Figure 2 Schematic diagram of the structure of the shell assembly 20 in some embodiments. The electronic device 10 provided in the present application includes but is not limited to a smart phone, a tablet computer, an e-reader, etc. In the following embodiments, a smart phone is taken as an example. The electronic device 10 includes a shell assembly 20 and a display screen 11. The shell 21 of the shell assembly 20 is a structural member of the electronic device 10. The shell 21 has a front side and a back side arranged opposite to each other. The display screen 11 is arranged on the front side of the shell 21. The electronic device 10 may also include any applicable components such as a microphone, a speaker, a power supply, an antenna, etc. arranged in the shell 21 to realize the corresponding functions, which will not be repeated here.

[0029] In some embodiments, a accommodating space 211 is provided in the shell 21, and the shell assembly 20 also includes a circuit board 22 and a functional device 23 accommodated in the accommodating space 211. The circuit board 22 includes but is not limited to a printed circuit board (PCB), etc. The functional device 23 can be arranged on the circuit board 22 and electrically connected to the circuit board 22, or arranged outside the circuit board 22. The functional device 23 can be any applicable component that is prone to heat during operation, such as a processor (CPU), a graphics processing unit (GPU), a power amplifier (PA) or various chips arranged on the circuit board 22. The functional device 23 can also be any applicable component that is prone to heat during operation, such as a battery, a camera module, a wireless charging receiving coil, etc., which are arranged outside the circuit board 22 in the electronic device 10.

[0030] Further, in some embodiments, the shell assembly 20 further includes a waterproof isolator 24 and a heat dissipation mechanism, wherein the waterproof isolator 24 is provided with an air duct 241 connected to the outside of the housing 21, and the waterproof isolator 24 is provided on the housing 21, and the air duct 241 and the accommodating space 211 are waterproofly isolated. The heat dissipation mechanism includes a driving member 251, a transmission member 252, and a fan element 26, wherein the driving member 251 is provided in the accommodating space 211, and the fan element 26 is provided in the air duct 241, and the transmission member 252 penetrates the waterproof isolator 24, and the part of the transmission member 252 located in the accommodating space 211 is connected to the driving member 251, and the part of the transmission member 252 located in the air duct 241 is connected to the fan element 26. The driving member 251 can drive the fan element 26 to move relative to the waterproof isolator 24 in the air duct 241 through the transmission member 252, for example, to rotate relative to the waterproof isolator 24, so that airflow is generated in the air duct 241. The driving member 251 includes but is not limited to any applicable motor such as a DC brushless motor and a flat micro motor. The transmission member 252 may include a transmission shaft, a gear, etc., as long as the output power of the driving member 251 can be converted into the rotation of the fan element 26. The fan element 26 may include a plurality of blades arranged at intervals along the circumference. Driven by the transmission member 252, the plurality of blades of the fan element 26 can rotate around the axis to generate airflow. The material of the fan element 26 includes but is not limited to any applicable waterproof material such as acrylonitrile-butadiene-styrene copolymer (ABS), polycarbonate (PC) or polyetheretherketone (PEEK). The material of the waterproof isolation member 24 includes but is not limited to any applicable waterproof material such as acrylonitrile-butadiene-styrene copolymer (ABS), polycarbonate (PC), etc.

[0031] In the shell assembly 20, the driving member 251 and the fan element 26 of the heat dissipation mechanism are respectively arranged in the accommodating space 211 and the air duct 241. The fan element 26 can generate airflow in the air duct 241 under the drive of the driving member 251, thereby taking away the heat conducted from the accommodating space 211 to the waterproof isolation member 24, for example, taking away the heat generated by the functional device 23 during operation and conducted to the waterproof isolation member 24, thereby providing heat dissipation for components such as the functional device 23 in the accommodating space 211. At the same time, the waterproof isolation between the accommodating space 211 and the air duct 241 can achieve heat dissipation for components such as the functional device 23 in the accommodating space 211, while preventing external moisture and dust from easily entering the accommodating space 211. In other words, the arrangement of the air duct 241 is not likely to affect the waterproof performance of the accommodating space 211, and the driving member 251 can also be effectively protected from water and dust, which is conducive to improving the waterproof and dustproof performance of the shell assembly 20. In addition, the fan element 26 can be cleaned by washing the air duct 241 with water, solving the problem of dust accumulation on the fan element 26 affecting the heat dissipation efficiency. During the cleaning process of the fan element 26, water is not easy to flow into the accommodating space 211, and is not easy to affect the accommodating space 211 and the driving member 251, thereby improving the structure, performance reliability, and waterproof and dustproof performance of the shell assembly 20. Furthermore, by arranging the driving member 251 and the fan element 26 in different spaces, the fan element 26 can occupy a larger space in the air duct 241, which is beneficial to making the fan blade area of ​​the fan element 26 larger than integrating the driving member 251 and the fan element 26 in the same space, thereby improving the heat dissipation performance of the shell assembly 20.

[0032] refer to Figure 2 As shown, in some embodiments, the driving member 251 is disposed on the circuit board 22 and electrically connected to the circuit board 22. By separating the fan element 26 of the heat dissipation mechanism and the driving member 251, the driving member 251 is disposed in the accommodating space 211, so that the driving member 251 can be integrated on the circuit board 22, and the driving member 251 can be powered and controlled through the circuits on the circuit board 22, which is beneficial to compressing the space occupied by the driving member 251 and improving the structural compactness of the shell assembly 20.

[0033] In some embodiments, the shell assembly 20 further includes a heat conductive member 27, which is disposed in the accommodating space 211, and the two opposite sides of the heat conductive member 27 are in thermal contact with the waterproof isolation member 24 and the functional device 23 respectively. The heat conductive member 27 includes but is not limited to any applicable element with good thermal conductivity such as thermal conductive gel and graphite sheet, and the heat conductive member 27 can also be any applicable heat conductive element such as a heat spreader, and the heat conductive member 27 can improve the efficiency of heat generated by the functional device 23 being transferred to the waterproof isolation member 24, thereby improving the heat dissipation efficiency of the heat dissipation mechanism for the functional device 23.

[0034] In some embodiments, the driving member 251 is disposed on the side of the circuit board 22 facing the waterproof isolating member 24, the functional device 23 is disposed on the side of the circuit board 22 facing the waterproof isolating member 24 and is electrically connected to the circuit board 22, and the heat conducting member 27 is located between the functional device 23 and the waterproof isolating member 24. Thus, the spatial layout of each component in the housing 21 can be reasonably arranged, which is conducive to improving the structural compactness of the housing assembly 20, compressing the size of the housing assembly 20, and also facilitating the assembly and matching relationship of each component.

[0035] In some embodiments, the waterproof isolator 24 is disposed in the housing 21 and is sealed and connected to the housing 21 through sealing elements such as waterproof gaskets. The inner side of the waterproof isolator 24 and the housing 21 are surrounded to form an air duct 241. The housing 21 is provided with an air outlet 212. The end opening of the waterproof isolator 24 is opposite to the air outlet 212, so that the air duct 241 is connected to the outside of the housing 21. The outer side of the waterproof isolator 24 and the housing 21 are surrounded to form a receiving space 211. Therefore, the heat dissipation mechanism is disposed in the housing 21 as a whole, which will not increase the size of the shell assembly 20, which is conducive to improving the structural compactness of the shell assembly 20, compressing the size of the shell assembly 20, and also helps to simplify the assembly and cooperation between the fan element 26, the transmission member 252 and the driving member 251. The sealing connection between the waterproof isolation member 24 and the shell 21 may also adopt any other suitable mechanical seal or labyrinth seal. Of course, in other embodiments, the waterproof isolation member 24 may also be arranged outside the shell 21, and the transmission member 252 may pass through the shell 21 and the waterproof isolation member 24 to extend into the air duct 241 of the waterproof isolation member 24.

[0036] Combination Figure 1 and Figure 2 As shown, in some embodiments, the air outlet 212 is disposed on the peripheral side of the housing 21. In other embodiments, the air outlet 212 may also be disposed on the back side or other positions of the housing 21. The specific design may be based on the position layout of the functional components 23 and the heat dissipation requirements. Figure 3 As shown, it can be understood that the shell 21 can also be provided with other hole structures 213 connected to the air duct 241. When the fan element 26 rotates in the air duct 241, it can drive the external air flow to flow into the air duct 241 from one of the air outlet 212 and the hole structure 213, drive the heat conducted from the functional device 23 to the waterproof isolation member 24, and then flow out of the air duct 241 from the other of the air outlet 212 and the hole structure 213, thereby realizing the heat dissipation of the functional device 23.

[0037] In the present application, the type of the fan element 26 is not limited, and can be specifically designed according to the structural arrangement and heat dissipation requirements of the air duct 241. The fan element 26 may include a plurality of blades that are sequentially spaced and interconnected in the circumferential direction, and the driving member 251 and the transmission member 252 can drive the fan element 26 to rotate around a direction parallel to the thickness of the shell 21, for example, around an extension direction perpendicular to the air duct 241, so that airflow is generated in the air duct 241. In other embodiments, when the air outlet 212 is approximately perpendicular to the axis of the hole structure 213, the fan element 26 can also be an axial flow fan, a centrifugal fan or any other suitable fan that can change the direction of the airflow, which can adapt to the spatial layout of the air outlet 212 and the hole structure 213, and the spatial layout of the shell assembly 20, and is also conducive to increasing the airflow velocity, thereby improving the heat dissipation efficiency of the functional device 23. The direction of the airflow in the air duct 241 is not limited, and can be specifically designed according to the type and direction of the fan element 26. For example, when the fan element 26 rotates, the direction of the airflow in the air duct 241 can be directed from the air outlet 212 to the hole structure 213, or from the hole structure 213 to the air outlet 212, as long as it can take away the heat conducted to the waterproof isolation component 24 to dissipate the heat of the functional device 23.

[0038] Please see again Figure 2 In some embodiments, the shell assembly 20 further includes a heat spreader 28, which is disposed on the waterproof isolator 24 and located in the air duct 241. The heat spreader 28 includes, but is not limited to, a heat spreader plate, etc. The provision of the heat spreader 28 can increase the heat dissipation area of ​​the shell assembly 20, and at the same time, improve the heat diffusion efficiency by means of phase change, so that the heat can be quickly diffused on the heat spreader 28, thereby improving the heat dissipation efficiency when the airflow passes through the heat spreader 28. In some embodiments, the heat spreader 28 is attached to the inner wall surface of the waterproof isolator 24 facing the air duct 241, and the multiple inner wall surfaces of the waterproof isolator 24 can be attached with the heat spreader 28 to maximize the heat dissipation efficiency. The heat spreader 28 can also be attached only to the inner wall surface of the waterproof isolator 24 facing away from the heat conductor 27, so that the heat spreader 28 is close to the functional device 23, and can quickly and effectively absorb and diffuse the heat conducted from the functional device 23, thereby improving the heat dissipation efficiency.

[0039] In some embodiments, the projections of the driving member 251 and the fan element 26 on a plane perpendicular to the axis of the driving member 251, for example, on a plane perpendicular to the thickness direction of the shell assembly 20, are offset. Such a setting can adapt to the spatial layout of components such as the functional device 23 in the shell assembly 20 and compress the occupied space of the shell assembly 20.

[0040] Further, in some embodiments, the fan element 26 is located at one end of the air duct 241 away from the air outlet 212, so that the airflow generated by the fan element 26 can fully flow through the air duct 241 and increase the airflow velocity, thereby improving the heat dissipation efficiency. The heat conductor 27 is arranged in the accommodating space 211 and is opposite to the end of the waterproof isolation member 24 away from the air outlet 212. The position of the heat conductor 27 corresponds to the position of the fan element 26, and the projections of the heat conductor 27 and the fan element 26 on the waterproof isolation member 24 at least partially overlap. It can be understood that the wind speed is greater at the position closer to the fan element 26 in the air duct 241. In this way, the heat conducted by the functional device 23 through the heat conductor 27 can be more directly and fully taken away by the airflow generated by the fan element 26, thereby improving the heat dissipation efficiency of the functional device 23. The dislocation of the driving member 251 and the fan element 26 can also adapt to the spatial layout of the functional device 23 and the corresponding positions of the heat conductor 27 and the fan element 26, which is conducive to taking into account both heat dissipation efficiency and structural compactness.

[0041] There is no limit to the way to achieve the dislocation between the fan element 26 and the driving member 251. In some embodiments, the driving member 252 includes a first transmission structure 2521 and a second transmission structure 2522. Both ends of the first transmission structure 2521 are transmission-connected to the output shaft of the driving member 251 and the second transmission structure 2522. The output shaft of the driving member 251 can rotate around an axis, and the axis of the driving member 251 can be parallel to the thickness direction of the shell assembly 20. The first transmission structure 2521 can rotate around a direction perpendicular to the axis of the driving member 251 under the drive of the driving member 251, and the second transmission structure 2522 can rotate around an axis parallel to the driving member 251 under the drive of the first transmission structure 2521 under the drive of the driving member 251. The second transmission structure 2522 is disposed in the waterproof isolation member 24 and connected to the fan element 26 to drive the fan element 26 to rotate. The first transmission structure 2521 may include a transmission shaft extending in a direction perpendicular to the thickness of the shell assembly 20, and the second transmission structure 2522 may include a transmission shaft extending in a direction parallel to the thickness of the shell assembly 20. The output shaft of the driving member 251, the first transmission structure 2521 and the second transmission structure 2522 may be connected by any suitable transmission elements such as gears to achieve switching of the corresponding rotation direction.

[0042] Of course, reference Figure 4 As shown, in other embodiments, the positions of the fan element 26 and the driving member 251 can also be arranged relative to each other, the output shaft of the driving member 251, or other shaft structures connected to the output shaft of the driving member 251 can directly pass through the waterproof isolation member 24, and the position of the heat conducting member 27 can be offset from the fan element 26. Such an arrangement can simplify the difficulty and cost of setting the heat dissipation mechanism.

[0043] In some embodiments, the waterproof isolating member 24 is provided with a through hole, and the transmission member 252 is rotatably inserted into the through hole. The shell assembly 20 also includes a waterproof shaft sealing structure (not shown in the figure), which is provided at the through hole to seal the gap between the transmission member 252 and the waterproof shaft sealing structure. Performing a waterproof shaft sealing treatment on the position where the transmission member 252 is inserted into the waterproof isolating member 24 can improve the waterproof performance of the waterproof isolating member 24 at the through hole where the transmission member 252 is inserted, and prevent the liquid in the air duct 241 from entering the accommodating space 211 from between the transmission member 252 and the waterproof isolating member 24, which is conducive to further improving the waterproof sealing performance of the shell assembly 20 and the electronic device 10. The waterproof shaft sealing structure includes but is not limited to a rubber sealing ring, or a mechanical sealing structure composed of a static ring, a dynamic ring, a spring and other components, or a filler such as asbestos rope and graphite braid, as long as it can improve the waterproof sealing performance between the transmission member 252 and the waterproof isolating member 24.

[0044] Please see again Figure 2 As shown, in some embodiments, the shell assembly 20 further includes a temperature sensing element 291 and a control element 292 disposed in the accommodating space 211. The control element 292 is communicatively connected to the temperature sensing element 291 and the driving member 251, and is used to control the output power of the driving member 251 according to the temperature sensed by the temperature sensing element 291. The temperature sensing element 291 is disposed at a position of the circuit board 22 adjacent to the functional device 23 and is electrically connected to the circuit board 22. The temperature sensing element 291 is used to sense the temperature near the functional device 23. The control element 292 is disposed on the circuit board 22 and is electrically connected to the circuit board 22. The control element 292 may be a processor disposed on the circuit board 22, or a chip disposed on the circuit board 22 specifically used to control the output power of the driving member 251. The temperature sensing element 291, the control element 292 and the driving member 251 can realize mutual communication and control through the circuit on the circuit board 22. In some embodiments, the heat dissipation mechanism can also cooperate with other heat dissipation structures provided in the electronic device 10, for example, increasing the output power of the driver 251 when the temperature at other locations is higher, and reducing the output power of the driver 251 when the heat dissipation power of other heat dissipation structures is larger, thereby maintaining the overall temperature stability of the electronic device 10 while taking into account the reduction of power consumption.

[0045] Specifically, in some embodiments, when the temperature sensed by the temperature sensing element 291 is greater than a preset value or increases, the control element 292 controls the output power of the driver 251 to increase, and when the temperature sensed by the temperature sensing element 291 is less than a preset value or decreases, the control element 292 controls the output power of the driver 251 to decrease. It can be understood that when the temperature of the functional device 23 is high, by increasing the output power of the driver 251, the rotation speed of the fan element 26 can be increased, thereby increasing the air flow velocity in the air duct 241, improving the heat dissipation efficiency of the heat dissipation mechanism for the functional device 23, and adapting to the heat dissipation requirements when the temperature is high. When the temperature of the functional device 23 is low, by reducing the output power of the driver 251, the rotation speed of the fan element 26 can be reduced, and the noise generated when the driver 251 and the fan element 26 rotate can be reduced, so that the heat dissipation effect and noise control can be balanced according to the heating condition of the functional device 23, thereby improving the user experience.

[0046] It should be noted that the output power of the driver 251 can be divided into at least two grades. When the temperature sensed by the temperature sensing element 291 is higher than the preset value, the output power is adjusted to a higher grade. When the sensed temperature is lower than the preset value, the output power is adjusted to a lower grade. The preset value can be designed according to the output power range and the heat dissipation requirements, which is not limited in this application. Of course, the control element 292 can also be provided with a plurality of preset values, and the output power is divided into a plurality of grades. The intervals between different preset values ​​correspond to different grades to adapt to more different heat dissipation scenarios. In other embodiments, the output power of the driver 251 can also be gradually controlled, and the output power is controlled to gradually increase as the temperature sensed by the temperature sensing element 291 gradually increases, and vice versa.

[0047] refer to Figure 5 , Figure 5 The electronic device 10 is a schematic diagram of the structure of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Figure 5 The structure of the electronic device 10 shown in the figure does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or less components than those shown in the figure, or combine certain components, or arrange the components differently.

[0048] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0049] The memory 502 can be used to store applications and data. The applications stored in the memory 502 contain executable codes. The applications can form various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0050] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0051] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light-emitting diode (OLED, Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Figure 5 In the embodiment, the touch-sensitive surface and the display panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0052] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 10, they will not be repeated here.

[0053] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10.

[0054] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Figure 5 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0055] The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0056] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0057] although Figure 5 Not shown, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0058] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A shell assembly, characterized in that: include: A housing is provided with a containing space; A waterproof isolating member, provided with an air duct connected to the outside of the housing, the waterproof isolating member is arranged on the housing, and the air duct and the accommodating space are waterproofly isolated; and, The heat dissipation mechanism includes a driving member, a transmission member and a fan element, wherein the driving member is arranged in the accommodating space, the fan element is arranged in the air duct, the transmission member passes through the waterproof isolation member and is connected to the driving member and the fan element, and the driving member can drive the fan element to move relative to the waterproof isolation member through the transmission member to generate airflow in the air duct.

2. The shell assembly according to claim 1, characterized in that The shell assembly further includes a circuit board, which is disposed in the accommodating space, and the driving member is disposed on the circuit board and electrically connected to the circuit board.

3. The shell assembly according to claim 1, characterized in that The shell assembly further includes a functional device and a heat-conducting member, wherein the functional device and the heat-conducting member are arranged in the accommodating space, and the heat-conducting member is in thermal contact with the waterproof isolation member and the functional device.

4. The shell assembly according to claim 3, characterized in that The shell assembly also includes a circuit board, the driving component is arranged on the side of the circuit board facing the waterproof isolation component, the functional component is arranged on the side of the circuit board facing the waterproof isolation component and is electrically connected to the circuit board, and the heat conductive component is located between the functional component and the waterproof isolation component.

5. The shell assembly according to claim 1, characterized in that The shell assembly also includes a heat spreading element, which is arranged on the waterproof isolation member and located in the air duct.

6. The shell assembly according to claim 5, characterized in that The heat-spreading element is attached to the inner wall surface of the waterproof isolation component facing the air duct.

7. The shell assembly according to claim 1, characterized in that The waterproof isolation member is arranged in the shell and is sealed with the shell. The inner side of the waterproof isolation member and the shell are arranged to form the air duct. The shell is provided with an air outlet. The end opening of the waterproof isolation member is opposite to the air outlet so that the air duct is connected to the outside of the shell. The outer side of the waterproof isolation member and the shell are arranged to form the accommodating space.

8. The shell assembly according to claim 1, characterized in that The projections of the driving member and the fan element on a plane perpendicular to the axis of the driving member are offset.

9. The shell assembly according to claim 8, characterized in that The transmission member includes a first transmission structure and a second transmission structure, both ends of the first transmission structure are transmission-connected to the driving member and the second transmission structure, the output shaft of the driving member can rotate around an axis, the first transmission structure can rotate around a direction perpendicular to the axis of the driving member under the drive of the driving member, the second transmission structure can rotate around the axis of the driving member under the drive of the driving member, and the second transmission structure is penetrated by the waterproof isolation member and connected to the fan element.

10. The shell assembly according to claim 8, characterized in that The air duct is connected to the outside of the shell through an air outlet on the shell, and the fan element is located at one end of the air duct away from the air outlet.

11. The shell assembly according to claim 10, characterized in that The shell assembly also includes a functional device and a heat conductor. The heat conductor is arranged in the accommodating space and opposite to the end of the waterproof isolation member away from the air outlet. The heat conductor is arranged between the functional device and the waterproof isolation member. The heat conductor at least partially overlaps with the projection of the fan element on the waterproof isolation member.

12. The shell assembly according to claim 1, characterized in that The waterproof isolation member is provided with a through hole, and the transmission member is rotatably inserted into the through hole. The shell assembly also includes a waterproof shaft sealing structure, which is arranged at the through hole to seal the gap between the transmission member and the waterproof shaft sealing structure.

13. The shell assembly according to claim 1, characterized in that The shell assembly also includes a temperature sensing element and a control element arranged in the accommodating space, the control element being communicatively connected to the temperature sensing element and the driving member, and being used to control the output power of the driving member according to the temperature sensed by the temperature sensing element, wherein when the temperature sensed by the temperature sensing element is greater than a preset value or increases, the control element controls the output power of the driving member to increase, and when the temperature sensed by the temperature sensing element is less than a preset value or decreases, the control element controls the output power of the driving member to decrease.

14. An electronic device, characterized in that: Comprising a shell assembly as described in any one of claims 1-13.

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