Multi-band laser confocal silicon carbide crystal ingot processing equipment and processing method

Through the multi-band laser confocal technology and the swing mechanism of the B-axis module, the problem that existing laser processing technology is difficult to efficiently process silicon carbide ingots with large thickness and high hardness is solved, and efficient, low-cost, and low-energy loss laser cutting is achieved, improving processing quality and accuracy.

CN119658158AActive Publication Date: 2025-03-21GUANGZHOU SANYI LASER TECH CO LTD
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Patent Information

Application Number
CN202411841647.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-05-23
Filing Date
2024-12-13
Publication Date
2025-03-21
Estimated Expiration
2044-12-13

AI Technical Summary

Technical Problem

The existing laser processing technology is difficult to meet the efficient processing needs of silicon carbide ingots with large thickness and high hardness. In addition, conventional laser cutting has the problem of side inclination caused by conical laser beams. Water-conducting laser technology has problems such as high equipment cost, large laser energy loss, and slow cutting speed.

Method used

The multi-band laser confocal technology is adopted, through the coupling of the first laser and the second laser, combined with the swing mechanism of the B-axis module, the ingot to be processed swings in the vertical direction, eliminating the cutting influence of the conical laser beam on the side, and achieving cylindrical processing that is completely perpendicular to the side and the bottom surface.

Benefits of technology

It improves the efficiency and quality of laser processing, realizes efficient cutting of silicon carbide ingots with large thickness and high hardness, reduces equipment costs and energy losses, avoids the occurrence of microcracks inside the material, and improves processing accuracy and adaptability.

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Abstract

The invention relates to a multi-band laser confocal silicon carbide crystal ingot processing device and method, the multi-band laser confocal silicon carbide crystal ingot processing device comprises an objective table and a laser assembly, the laser assembly comprises a first laser, a second laser, a first reflecting mirror, a second reflecting mirror and a laser focusing mirror, the second wavelength laser and the second wavelength laser reflected by the second reflector and emitted by the second laser device are output in a common light path mode, and a to-be-machined crystal ingot on the objective table is machined through the laser focus lens; the objective table comprises an X-axis moving module, a Y-axis moving module, a C-axis module and a B-axis module, the C-axis module is used for driving the to-be-machined crystal ingot to rotate around the vertical center axis of the to-be-machined crystal ingot, and the B-axis module is used for driving the to-be-machined crystal ingot to swing in the vertical plane. The device can improve the laser processing efficiency, can cut the cylindrical crystal ingot, is simple in structure, easy to operate and control, low in cost and particularly suitable for cutting the silicon carbide crystal ingot with large thickness, high hardness and high precision.
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