Light field generation method, device and equipment suitable for laser cutting of curved edges of transparent materials

Abstract

The present invention provides a light field generation method, device and equipment suitable for laser cutting of curved edges of transparent materials. The method comprises: obtaining a target light field, an initial light field, a transformation matrix and an aberration compensation phase, wherein the transformation matrix characterizes the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; using the transformation matrix and a target algorithm, forward propagating the initial light field to obtain a focused light field, wherein the focused light field is a light field distribution formed in a focusing space; using a preset weighting algorithm, weighting the focused light field to obtain an updated focused light field; using an inverse transformation matrix and an inverse algorithm of the target algorithm, back propagating the updated focused light field to obtain an updated light field; and generating a cutting light field based on the updated light field and the aberration compensation phase when the standard deviation of the updated light field and the target light field meets a preset condition, so as to perform laser cutting on the material to be processed.

Description

Technical Field

[0001] The present invention relates to the technical field of material cutting, and more specifically to a light field generation method, device and equipment suitable for laser cutting of arc-shaped edges of transparent materials. Background Art

[0002] In the field of modern manufacturing and processing, transparent materials are increasingly used in a variety of industries, including optical components, display panels, etc. However, traditional mechanical processing technology often faces many challenges when processing transparent materials, including poor cutting quality, low processing efficiency, and insufficient control accuracy of cutting edges.

[0003] With the rapid development of laser technology, high-energy lasers are used to focus on the inside of materials to form a modified layer, and transparent hard materials are cut by controlling crack extension. However, there are problems such as difficulty in controlling cracks and limited cutting ability. These problems not only affect the appearance quality of the finished product, but also limit the application of transparent materials in precision processing. Summary of the invention

[0004] In view of the above problems, the present invention provides a light field generation method, device and equipment suitable for laser cutting of curved edges of transparent materials.

[0005] According to a first aspect of the present invention, there is provided a method for generating a light field suitable for laser cutting of curved edges of transparent materials, comprising: obtaining a target light field, an initial light field, a transformation matrix and an aberration compensation phase, wherein the transformation matrix characterizes the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; using the transformation matrix and a target algorithm, forward propagating the initial light field to obtain a focused light field, wherein the focused light field is a light field distribution formed in a focusing space; using a preset weighting algorithm, weighting the focused light field to obtain an updated focused light field; using an inverse transformation matrix and an inverse algorithm of the target algorithm, back propagating the updated focused light field to obtain an updated light field; and generating a cutting light field based on the updated light field and the aberration compensation phase when the standard deviation of the updated light field and the target light field meets a preset condition, so as to perform laser cutting on the material to be processed.

[0006] According to an embodiment of the present invention, the method is applied to a light field cutting device, which includes a lens and a modulator, and the transformation matrix is ​​obtained by the following method: obtaining the focal length of the lens, the resolution of the modulator, the refractive index of the processing environment, and the refractive index of the material to be processed; determining a two-dimensional sampling grid based on the resolution of the modulator and the target light field, the two-dimensional sampling grid being the light field distribution formed by the target light field on the entrance pupil plane; determining a first deflection matrix and a second deflection matrix based on the focal length of the lens, the first deflection matrix characterizing the propagation characteristics of the light beam from the entrance pupil plane to the apodization plane, and the second deflection matrix characterizing the propagation characteristics of the light beam after passing through the lens; determining a Fresnel matrix based on the resolution of the modulator, the refractive index of the processing environment, and the refractive index of the material to be processed; determining a mapping matrix based on the focal length of the lens, the refractive index of the material to be processed, and the two-dimensional sampling grid, the mapping matrix characterizing the mapping of the two-dimensional sampling grid to a three-dimensional grid on the k-domain Ewald sphere; and calculating the transformation matrix based on the first deflection matrix, the second deflection matrix, the Fresnel matrix, and the mapping matrix.

[0007] According to an embodiment of the present invention, the method further comprises: determining a three-dimensional sampling grid in the focus space based on the resolution of the modulator and the target light field.

[0008] According to an embodiment of the present invention, the target algorithm includes a chirped Z algorithm, and the transformation matrix and the target algorithm are used to perform forward propagation calculation on the initial light field to obtain a focused light field, including: using the transformation matrix to determine a spherical light field based on the initial light field, and the spherical light field is located on the k-domain Ewald sphere; using the chirped Z algorithm to determine the focused light field based on the spherical light field and the spectral characteristics of the initial light field.

[0009] According to an embodiment of the present invention, the above-mentioned method of weighting the focused light field using a preset weighting algorithm to obtain an updated focused light field includes: decomposing the focused light field to obtain an amplitude and a target phase; using a preset weighting algorithm to weight the amplitude to obtain an iterative amplitude; and synthesizing the iterative amplitude and the target phase to obtain an updated focused light field.

[0010] According to an embodiment of the present invention, the method further includes: when the standard deviation of the updated light field and the target light field does not meet a preset condition, updating the initial light field based on the updated light field, and returning to execute the step of performing forward propagation calculation on the initial light field using the transformation matrix and the target algorithm to obtain a focused light field.

[0011] According to an embodiment of the present invention, the inverse algorithm of the target algorithm includes an inverse chirp Z algorithm, and the inverse transformation matrix and the inverse algorithm of the target algorithm are used to perform reverse propagation calculation on the updated focused light field to obtain an updated light field, including: using the inverse chirp Z algorithm to determine an updated spherical light field based on the updated focused light field, and the updated spherical light field is located on the k-domain Ewald sphere; using the inverse transformation matrix to determine an updated entrance pupil light field based on the spectral characteristics of the updated spherical light field and the initial light field, and the updated entrance pupil light field is located on the entrance pupil plane; decomposing the updated entrance pupil light field to obtain the phase of the X-direction polarization component; synthesizing the phase of the X-direction polarization component and the amplitude of the initial light field to obtain the updated light field.

[0012] According to an embodiment of the present invention, the aberration compensation phase is obtained by the following method:

[0013] The processing depth of the material to be processed and the processing light wave number in the processing environment are obtained; and the aberration compensation phase is determined based on the processing depth, the processing light wave number, the refractive index of the processing environment and the refractive index of the material to be processed.

[0014] The second aspect of the present invention provides a light field generating device suitable for laser cutting of curved edges of transparent materials, comprising: an acquisition module, used to acquire a target light field, an initial light field, a transformation matrix and an aberration compensation phase, wherein the transformation matrix characterizes the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; a forward propagation module, used to use the transformation matrix and the target algorithm to perform forward propagation calculations on the initial light field to obtain a focused light field, wherein the focused light field is a light field distribution formed in a focused space; a weighting module, used to use a preset weighting algorithm to weight the focused light field to obtain an updated focused light field; a reverse propagation module, used to use an inverse transformation matrix and an inverse algorithm of the target algorithm to perform reverse propagation calculations on the updated focused light field to obtain an updated light field; and a cutting module, used to generate a cutting light field based on the updated light field and the aberration compensation phase when the standard deviation of the updated light field and the target light field meets a preset condition, so as to perform laser cutting on the material to be processed.

[0015] A third aspect of the present invention provides an electronic device, comprising: one or more processors; a memory for storing one or more computer programs, wherein the one or more processors execute the one or more computer programs to implement the steps of the above method.

[0016] The fourth aspect of the present invention further provides a computer-readable storage medium on which a computer program or instruction is stored, and the steps of the above method are implemented when the above computer program or instruction is executed by a processor.

[0017] The fifth aspect of the present invention also provides a computer program product, including a computer program or instructions, which implement the steps of the above method when executed by a processor.

[0018] According to an embodiment of the present invention, the initial light field is forward propagated by utilizing a transformation matrix and a target algorithm, the focused light field is weighted and back-propagated in the focusing space to obtain an updated light field, and a cutting light field is generated by updating the light field and the phase difference compensation phase to perform laser cutting on the material to be processed, so that the laser cutting contour edge can be designed, and there is no need to guide cracks during cutting, thereby reducing the workload and improving the cutting efficiency; the aberration distortion caused by the focused light spot inside the material is improved by introducing the aberration compensation phase, thereby improving the cutting accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above contents and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

[0020] Figure 1 A diagram showing an application scenario of a light field generation method and device suitable for laser cutting of arc edges of transparent materials according to an embodiment of the present invention is shown.

[0021] Figure 2 A flow chart of a light field generation method suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown.

[0022] Figure 3 A schematic diagram of a target light field according to an embodiment of the present invention is shown.

[0023] Figure 4 A holographic schematic diagram of a cut light field according to an embodiment of the present invention is shown.

[0024] Figure 5 A schematic diagram of an aberration compensation phase according to an embodiment of the present invention is shown.

[0025] Figure 6 A structural block diagram of a light field generating device suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown.

[0026] Figure 7 A block diagram of an electronic device suitable for implementing a light field generation method suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0027] Below, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of embodiments of the present invention. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of concepts of the present invention.

[0028] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0029] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0030] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0031] With the advancement of science and technology and the growth of industrial demand, the application of transparent materials in modern manufacturing and processing has become increasingly widespread. They play a vital role in many key fields such as optical components, display panels, lighting equipment, automotive industry and construction industry. The unique optical properties of these materials make them an indispensable component for achieving high-performance and high-definition displays, precise optical instruments and efficient lighting systems. However, despite the broad application prospects of transparent materials. However, traditional mechanical processing technology often faces many challenges when processing transparent materials, including poor cutting quality, low processing efficiency and insufficient control accuracy of cutting edges. With the rapid development of laser technology, high-energy lasers are used to focus on the inside of the material to form a modified layer, and the cutting of transparent hard materials is achieved by controlling the extension of cracks, but there are problems such as difficult crack control and single cutting ability. These problems not only affect the appearance quality of the finished product, but also limit the application of transparent materials in precision processing.

[0032] An embodiment of the present invention provides a light field generation method suitable for laser cutting of curved edges of transparent materials, comprising: obtaining a target light field, an initial light field, a transformation matrix and an aberration compensation phase, wherein the transformation matrix characterizes the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; using the transformation matrix and a target algorithm, forward propagating the initial light field to obtain a focused light field, wherein the focused light field is a light field distribution formed in a focused space; using a preset weighting algorithm, weighting the focused light field to obtain an updated focused light field; using an inverse transformation matrix and an inverse algorithm of the target algorithm, back propagating the updated focused light field to obtain an updated light field; and generating a cutting light field based on the updated light field and the aberration compensation phase when the standard deviation of the updated light field and the target light field meets a preset condition, so as to perform laser cutting on the material to be processed.

[0033] Figure 1 A diagram showing an application scenario of a light field generation method and device suitable for laser cutting of arc edges of transparent materials according to an embodiment of the present invention is shown.

[0034] like Figure 1 As shown, the application scenario 100 according to this embodiment may include a laser 101, a spatial light modulator 102, a first lens group 103, an aperture 104, a second lens group 105, a reflector 106, a lens 107, a material to be processed 108, a precision shift stage 109, a lamp 110, a camera 111, a network 112, and a server 113. The network 112 is used to provide a medium for a communication link between the spatial light modulator 102, the camera 111, and the server 113. The network 112 may include various connection types, such as wired, wireless communication links, or optical fiber cables, etc.

[0035] The laser 101 may be a picosecond laser, and the main wavelength may be set to 800 nm; the physical resolution of the spatial light modulator 102 may be 12.5 um; the first lens group 103 and the second lens group 105 may be 4F lens groups; the magnification of the lens 107 may be 20X, the focal length may be 9 mm, the numerical aperture may be 0.45, and the working distance may be 3 mm; the material of the material to be processed 108 may be glass;

[0036] The lamp 110 may be a halogen lamp; the camera 111 may be a CCD (Charge-Coupled Device) camera.

[0037] The server 113 may be a server that provides various services, and the background management server may analyze and process the received data such as user requests.

[0038] It should be noted that the light field generation method for laser cutting of curved edges of transparent materials provided in the embodiment of the present invention can generally be executed by the server 113. Accordingly, the light field generation device for laser cutting of curved edges of transparent materials provided in the embodiment of the present invention can generally be arranged in the server 113. The light field generation method for laser cutting of curved edges of transparent materials provided in the embodiment of the present invention can also be executed by a server or server cluster that is different from the server 113 and can communicate with the spatial light modulator 102, the camera 111 and / or the server 113. Accordingly, the light field generation device for laser cutting of curved edges of transparent materials provided in the embodiment of the present invention can also be arranged in a server or server cluster that is different from the server 113 and can communicate with the spatial light modulator 102, the camera 111 and / or the server 113.

[0039] It should be understood that Figure 1 The number of networks and servers in the embodiment is only for illustration. Any number of networks and servers may be provided as required.

[0040] The following will be based on Figure 1 The scene described by Figure 2~Figure 5 The light field generation method suitable for laser cutting of arc edges of transparent materials according to an embodiment of the present invention is described in detail.

[0041] Figure 2 A flow chart of a light field generation method suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown.

[0042] like Figure 2 As shown, the light field generation method suitable for laser cutting of arc-shaped edges of transparent materials in this embodiment includes operations S210 to S250.

[0043] In operation S210, a target light field, an initial light field, a transformation matrix, and an aberration compensation phase are acquired.

[0044] Among them, the transformation matrix represents the characteristics of the beam propagation transformation from the initial light field from the processing environment to the material to be processed.

[0045] According to an embodiment of the present invention, the target light field is distributed in an arc-shaped dot matrix along the propagation direction of the laser.

[0046] Figure 3 A schematic diagram of a target light field according to an embodiment of the present invention is shown.

[0047] like Figure 3 As shown, the target light field is an arc-shaped focus array subdivided into 100 points, the light field intensity of the laser beam is relatively high, the internal processing depth of the material to be processed is 275um, the arc spacing of each point is π / 150, and the dot array height is 550um.

[0048] According to an embodiment of the present invention, the target light field may also be an arc-shaped focus array subdivided into 50 points, and the present invention does not impose any limitation on this.

[0049] The initial light field can be determined by the following formula (1).

[0050] (1)

[0051] in, is the initial light field, A0 is the Gaussian amplitude distribution of the incident light, is the initial secondary phase.

[0052] According to the embodiment of the present invention, in the above formula (1), it is assumed that the polarization direction of the initial light field is the X direction.

[0053] In operation S220, a forward propagation calculation is performed on the initial light field using the transformation matrix and the target algorithm to obtain a focused light field.

[0054] Among them, the focused light field is the light field distribution formed in the focused space.

[0055] For ease of understanding, the terms involved in the present invention will be explained in detail below.

[0056] Focused light field: usually refers to a light field in an optical system that is focused to a specific point or small area by a lens or other focusing element.

[0057] According to an embodiment of the present invention, the target algorithm may be, for example, a traditional Fourier algorithm or a Chirped Z algorithm, and the present invention does not limit this.

[0058] In operation S230, the focused light field is weighted by using a preset weighting algorithm to obtain an updated focused light field.

[0059] In operation S240, the updated focused light field is back-propagated by using the inverse transformation matrix and the inverse algorithm of the target algorithm to obtain an updated light field.

[0060] According to an embodiment of the present invention, the inverse transformation matrix is ​​an inverse matrix corresponding to the transformation matrix.

[0061] In operation S250, when the standard deviation of the updated light field and the target light field meets a preset condition, a cutting light field is generated based on the updated light field and the aberration compensation phase to perform laser cutting on the material to be processed.

[0062] According to an embodiment of the present invention, the above-mentioned preset condition may be, for example, less than a preset value or a standard deviation within a certain interval, and the present invention does not limit this.

[0063] Figure 4A holographic schematic diagram of a cut light field according to an embodiment of the present invention is shown.

[0064] like Figure 4 As shown, the grayscale change in the figure represents the change in the intensity of the light wave. The generated cutting light field can be sent to the above-mentioned spatial light modulator 102, so as to modulate the corresponding light field to cut the material to be processed. The cutting light field is a light field close to the above-mentioned target light field, which forms an arc-shaped focus array in the material to be processed to cut the material to be processed.

[0065] According to an embodiment of the present invention, the initial light field is forward propagated by utilizing a transformation matrix and a target algorithm, the focused light field is weighted and back-propagated in the focusing space to obtain an updated light field, and a cutting light field is generated by updating the light field and the phase difference compensation phase to perform laser cutting on the material to be processed, so that the laser cutting contour edge can be designed, and there is no need to guide cracks during cutting, thereby reducing the workload and improving the cutting efficiency; the aberration distortion caused by the focused light spot inside the material is improved by introducing the aberration compensation phase, thereby improving the cutting accuracy.

[0066] According to an embodiment of the present invention, the above method is applied to a light field cutting device, which includes a lens and a modulator, and the transformation matrix is ​​obtained by the following method: obtaining the focal length of the lens, the resolution of the modulator, the refractive index of the processing environment, and the refractive index of the material to be processed; determining a two-dimensional sampling grid based on the resolution of the modulator and the target light field, and the two-dimensional sampling grid is the light field distribution formed by the target light field on the entrance pupil plane; determining a first deflection matrix and a second deflection matrix based on the focal length of the lens, the first deflection matrix characterizing the propagation characteristics of the light beam from the entrance pupil plane to the apodization plane, and the second deflection matrix characterizing the propagation characteristics of the light beam after passing through the lens; determining a Fresnel matrix based on the resolution of the modulator, the refractive index of the processing environment, and the refractive index of the material to be processed; determining a mapping matrix based on the focal length of the lens, the refractive index of the material to be processed, and the two-dimensional sampling grid, and the mapping matrix characterizes the mapping of the two-dimensional sampling grid to the three-dimensional grid on the k-domain Ewald sphere; and calculating the transformation matrix based on the first deflection matrix, the second deflection matrix, the Fresnel matrix, and the mapping matrix.

[0067] For example, when the resolution of the spatial light modulator 102 is 12.5um, the focal length of the lens is 9mm, the processing environment is air, the corresponding refractive index is 1, and the refractive index of the material to be processed is 1.51, the generated two-dimensional sampling network has a sampling spacing of 12.5um, a physical diameter of 8.1mm, and a circular grid with a pixel diameter of 648.

[0068] The above transformation matrix can be obtained according to the following formula (2).

[0069]

[0070] Among them, G is the transformation matrix, D is the first deflection matrix, which characterizes the propagation characteristics of the light beam from the entrance pupil plane to the apodization plane, T is the Fresnel matrix, D' is the second deflection matrix, which characterizes the propagation characteristics of the light beam after passing through the lens, and M is the mapping matrix.

[0071] According to an embodiment of the present invention, mapping a two-dimensional sampling grid to a three-dimensional grid needs to satisfy the following requirements: , , ,in, is the coordinate in the two-dimensional sampling grid The corresponding spherical coordinates in the material to be processed satisfy , ,in is the focal length of the lens, is the refractive index of the material to be processed, and k2 represents the wave number of the processing light in the processing environment.

[0072] According to an embodiment of the present invention, by determining the first deflection matrix and the second deflection matrix, the propagation path of the light beam on the entrance pupil plane, the tracking plane and after passing through the lens can be accurately calculated, and by combining the Fresnel matrix and the mapping matrix, the two-dimensional sampling grid can be mapped to a three-dimensional grid on the k-domain Ewald sphere, thereby accurately controlling the focus and distribution of the light beam, improving the efficiency of material processing, and reducing processing time.

[0073] According to an embodiment of the present invention, the method further includes: determining a three-dimensional sampling grid in the focus space based on the resolution of the modulator and the target light field.

[0074] For example, when the resolution of the spatial light modulator 102 is 12.5 um and the target light field is Figure 3 In the case of the light field shown, the three-dimensional sampling grid can be a rectangular grid with a sampling spacing of 1um, a length of 200um, a width of 100um, and a height of 600um that can cover the target light field. The present invention does not limit the shape and size of the three-dimensional sampling grid and the two-dimensional sampling grid.

[0075] According to an embodiment of the present invention, the above-mentioned target algorithm includes a chirped Z algorithm, and a transformation matrix and a target algorithm are used to perform forward propagation calculation on the initial light field to obtain a focused light field, including: using the transformation matrix to determine a spherical light field based on the initial light field, and the spherical light field is located on the k-domain Ewald sphere; using the chirped Z algorithm to determine the focused light field based on the spectral characteristics of the spherical light field and the initial light field.

[0076] The spherical light field can be calculated by the following formula (3).

[0077] (3)

[0078] in, is the spherical light field, G is the transformation matrix, is the initial light field.

[0079] The focused light field can be calculated using the following formula (4).

[0080] (4)

[0081] in, To focus the light field, Indicates the use of the Chirp Z algorithm for forward propagation calculation, is the spherical light field, represent The decomposed components in the X direction, E ky Represents E k The decomposed components in the Y direction, E kz Represents E k The decomposed components in the Z direction, A x , A y , A z represents the complex starting point of the chirp Z transform in the X, Y, and Z directions, respectively, W x , W y , W z It represents the complex point spacing of the chirp Z transform in the X, Y, and Z directions respectively.

[0082] According to an embodiment of the present invention, the focused light field and the three-dimensional sampling grid may be used as the frequency domain matrix and the spatial domain matrix of the chirped Z transform respectively to complete the forward propagation of the initial light field.

[0083] According to an embodiment of the present invention, A can be adjusted according to the state of the focused light field. x , A y , A z and W x , W y , W z The value of .

[0084] According to an embodiment of the present invention, the light field can be converted into a representation in the complex frequency domain through the chirped Z transform, which can greatly reduce the demand for computer memory and performance. Compared with the fast Fourier transform method, the computer memory usage is reduced by about 10 times and the iteration speed is increased by about 100 times.

[0085] According to an embodiment of the present invention, the method of weighting the focused light field using a preset weighting algorithm to obtain an updated focused light field includes: decomposing the focused light field to obtain an amplitude and a target phase; weighting the amplitude using a preset weighting algorithm to obtain an iterative amplitude; and synthesizing the iterative amplitude and the target phase to obtain an updated focused light field.

[0086] According to the embodiment of the present invention, the amplitude and phase may be decomposed by calculating the polar coordinate representation of the complex number, or by using algorithms such as Fourier transform, and the present invention does not impose any limitation on this.

[0087] The above preset weighting algorithm can be expressed by the following formula (5).

[0088] (5)

[0089] Among them, W j represents the weight matrix at the jth iteration, W j-1 represents the weight matrix in the j-1th iteration, I2 j is the reconstructed intensity of the focused light field at the jth iteration, I 2e is the distribution of the target light field, is the weight coefficient.

[0090] According to the embodiments of the present invention, generally speaking, The larger the value, the faster the iteration converges. >0.5, the iteration process will oscillate. =0.5 can ensure the iterative convergence and speed up the convergence, but it can also be set in the range of (0,1) according to the situation. Choose a reasonable value.

[0091] The updated focused light field can be calculated using the following formula (6).

[0092] (6)

[0093] in, Indicates updating the focused light field, represents the iteration amplitude, represents a unit vector in the complex plane.

[0094] According to an embodiment of the present invention, when the standard deviation of the updated light field and the target light field does not meet the preset conditions, the initial light field is updated based on the updated light field, and the step of performing forward propagation calculation on the initial light field using the transformation matrix and the target algorithm to obtain the focused light field is returned to be executed.

[0095] According to an embodiment of the present invention, the inverse algorithm of the above-mentioned target algorithm includes an inverse chirp Z algorithm, and the updated focused light field is back-propagated and calculated using the inverse transformation matrix and the inverse algorithm of the target algorithm to obtain an updated light field, including: using the inverse chirp Z algorithm to determine an updated spherical light field based on the updated focused light field, and the updated spherical light field is located on the k-domain Ewald sphere; using the inverse transformation matrix to determine an updated entrance pupil light field based on the spectral characteristics of the updated spherical light field and the initial light field, and the updated entrance pupil light field is located on the entrance pupil plane; decomposing the updated entrance pupil light field to obtain the phase of the X-direction polarization component; synthesizing based on the phase of the X-direction polarization component and the amplitude of the initial light field to obtain the updated light field.

[0096] The updated spherical light field can be calculated using the following formula (7).

[0097] (7)

[0098] in, represents the update of the spherical light field, represents the updated focused light field, E' 2x represents the decomposition component of E'2 in the X direction, E' 2y represents the decomposition component of E'2 in the Y direction, E' 2z represents the decomposed components of E'2 in the Z direction, iCZT_3D represents the back propagation of the updated focused light field calculated by the inverse chirp Z algorithm, and W x * W x The complex conjugate of y * W y The complex conjugate of z * W z The complex conjugate of .

[0099] The updated entrance pupil light field can be calculated using the following formula (8).

[0100] (8)

[0101] in, represents the update of the spherical light field, G -1 represents the inverse transformation matrix, Indicates updating the entrance pupil light field.

[0102] According to an embodiment of the present invention, the phase of the X-direction polarization component in the entrance pupil light field may be updated. The polarization components in the Y and Z directions are kept as 0 and synthesized with the amplitude of the initial light field to update the initial light field. The iteration is repeated until the standard deviation of the updated light field and the target light field meets the preset conditions.

[0103] According to an embodiment of the present invention, the above-mentioned aberration compensation phase is obtained by the following method: obtaining the processing depth of the material to be processed and the processing light wave number in the processing environment; determining the aberration compensation phase based on the processing depth, the processing light wave number, the refractive index of the processing environment and the refractive index of the material to be processed.

[0104] According to the embodiment of the present invention, the aberration compensation phase can be calculated by the following formula (9): .

[0105] (9)

[0106] Wherein, d is the processing depth inside the material, n1 is the refractive index of the processing environment, n2 is the refractive index of the material to be processed, k2 represents the wave number of the processing light in the processing environment, θ1 can be expressed by the following formula (10), and θ2 can be expressed by the following formula (11).

[0107] (10)

[0108] (11)

[0109] Where (x'0, y'0) is the coordinate in the two-dimensional sampling grid, θ1 represents the incident angle of the light in the processing environment, and θ2 represents the refraction angle of the light in the material to be processed.

[0110] Figure 5 A schematic diagram of an aberration compensation phase according to an embodiment of the present invention is shown.

[0111] like Figure 5 As shown, the aberration compensation phase presents an annular phase distribution, which is usually used to correct spherical aberration. The annular area indicates a gradual increase in phase. This design can make the light at the edge of the light field have an additional phase delay relative to the central light, thereby achieving refocusing of the light at the focal point.

[0112] According to an embodiment of the present invention, by acquiring the processing depth of the processing material and the processing light wave number in the processing environment, and determining the aberration compensation phase based on the processing depth, the processing light wave number, the refractive index of the processing environment and the refractive index of the material to be processed, the corresponding aberration compensation phase can be determined for different processing conditions and material properties, thereby optimizing the propagation path of the light wave, reducing aberrations, reducing the aberration distortion of the focused light spot inside the material, and improving the imaging quality and processing accuracy.

[0113] Based on the above-mentioned light field generation method suitable for laser cutting of curved edges of transparent materials, the present invention also provides a light field generation device suitable for laser cutting of curved edges of transparent materials. Figure 6 The device is described in detail.

[0114] Figure 6 A structural block diagram of a light field generating device suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown.

[0115] like Figure 6 As shown, the light field generating device 600 of this embodiment suitable for laser cutting of arc-shaped edges of transparent materials includes an acquisition module 610 , a forward propagation module 620 , a weighting module 630 , a reverse propagation module 640 and a cutting module 650 .

[0116] The acquisition module 610 is used to acquire the target light field, the initial light field, the transformation matrix and the aberration compensation phase, wherein the transformation matrix represents the light beam propagation transformation characteristics of the initial light field from the processing environment to the material to be processed. In one embodiment, the acquisition module 610 can be used to perform the operation S210 described above, which will not be repeated here.

[0117] The forward propagation module 620 is used to use the transformation matrix and the target algorithm to perform forward propagation calculation on the initial light field to obtain a focused light field, where the focused light field is a light field distribution formed in the focused space. In one embodiment, the forward propagation module 620 can be used to perform the operation S220 described above, which will not be repeated here.

[0118] The weighting module 630 is used to weight the focused light field using a preset weighting algorithm to obtain an updated focused light field. In one embodiment, the weighting module 630 can be used to perform the operation S230 described above, which will not be described in detail herein.

[0119] The back propagation module 640 is used to perform back propagation calculation on the updated focused light field using the inverse transformation matrix and the inverse algorithm of the target algorithm to obtain the updated light field. In one embodiment, the back propagation module 640 can be used to perform the operation S240 described above, which will not be described in detail here.

[0120] The cutting module 650 is used to generate a cutting light field based on the updated light field and the aberration compensation phase to perform laser cutting on the material to be processed when the standard deviation of the updated light field and the target light field meets a preset condition. In one embodiment, the cutting module 650 can be used to perform the operation S250 described above, which will not be repeated here.

[0121] According to an embodiment of the present invention, any multiple modules among the acquisition module 610, the forward propagation module 620, the weighting module 630, the reverse propagation module 640 and the cutting module 650 can be combined in one module for implementation, or any one of the modules can be split into multiple modules. Alternatively, at least part of the functions of one or more of these modules can be combined with at least part of the functions of other modules and implemented in one module. According to an embodiment of the present invention, at least one of the acquisition module 610, the forward propagation module 620, the weighting module 630, the reverse propagation module 640 and the cutting module 650 can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application specific integrated circuit (ASIC), or can be implemented by hardware or firmware such as any other reasonable way of integrating or packaging the circuit, or implemented in any one of the three implementation methods of software, hardware and firmware or in any appropriate combination of any of them. Alternatively, at least one of the acquisition module 610, the forward propagation module 620, the weighting module 630, the back propagation module 640 and the cutting module 650 can be at least partially implemented as a computer program module, and when the computer program module is executed, the corresponding function can be performed.

[0122] Figure 7 A block diagram of an electronic device suitable for implementing a light field generation method suitable for laser cutting of arc-shaped edges of transparent materials according to an embodiment of the present invention is shown.

[0123] like Figure 7 As shown, the electronic device 700 according to an embodiment of the present invention includes a processor 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a storage part 708 to a random access memory (RAM) 703. The processor 701 may include, for example, a general-purpose microprocessor (such as a CPU), an instruction set processor and / or a related chipset and / or a special-purpose microprocessor (for example, an application-specific integrated circuit (ASIC)), etc. The processor 701 may also include an onboard memory for caching purposes. The processor 701 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present invention.

[0124] In RAM 703, various programs and data required for the operation of electronic device 700 are stored. Processor 701, ROM 702 and RAM 703 are connected to each other via bus 704. Processor 701 performs various operations of the method flow according to the embodiment of the present invention by executing the programs in ROM 702 and / or RAM 703. It should be noted that the program can also be stored in one or more memories other than ROM 702 and RAM 703. Processor 701 can also perform various operations of the method flow according to the embodiment of the present invention by executing the programs stored in the one or more memories.

[0125] According to an embodiment of the present invention, the electronic device 700 may further include an input / output (I / O) interface 705, which is also connected to the bus 704. The electronic device 700 may further include one or more of the following components connected to the input / output (I / O) interface 705: an input portion 706 including a keyboard, a mouse, etc.; an output portion 707 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 708 including a hard disk, etc.; and a communication portion 709 including a network interface card such as a LAN card, a modem, etc. The communication portion 709 performs communication processing via a network such as the Internet. A drive 710 is also connected to the input / output (I / O) interface 705 as needed. A removable medium 711, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 710 as needed, so that a computer program read therefrom is installed into the storage portion 708 as needed.

[0126] The present invention also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiment; or may exist independently without being assembled into the device / apparatus / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the method according to the embodiment of the present invention is implemented.

[0127] According to an embodiment of the present invention, the computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, it may include but is not limited to: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present invention, the computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, an apparatus or a device. For example, according to an embodiment of the present invention, the computer-readable storage medium may include the ROM 702 and / or RAM 703 described above and / or one or more memories other than ROM 702 and RAM 703.

[0128] The embodiment of the present invention also includes a computer program product, which includes a computer program, and the computer program includes a program code for executing the method shown in the flowchart. When the computer program product is run in a computer system, the program code is used to enable the computer system to implement the light field generation method suitable for laser cutting of curved edges of transparent materials provided by the embodiment of the present invention.

[0129] The computer program executes the above functions defined in the system / device of the embodiment of the present invention when it is executed by the processor 701. According to the embodiment of the present invention, the system, device, module, unit, etc. described above can be implemented by a computer program module.

[0130] In one embodiment, the computer program may rely on tangible storage media such as optical storage devices, magnetic storage devices, etc. In another embodiment, the computer program may also be transmitted and distributed in the form of signals on a network medium, and downloaded and installed through the communication part 709, and / or installed from the removable medium 711. The program code contained in the computer program may be transmitted using any appropriate network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0131] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 709, and / or installed from the removable medium 711. When the computer program is executed by the processor 701, the above functions defined in the system of the embodiment of the present invention are performed. According to the embodiment of the present invention, the system, device, means, module, unit, etc. described above can be implemented by a computer program module.

[0132] According to an embodiment of the present invention, the program code for executing the computer program provided by the embodiment of the present invention can be written in any combination of one or more programming languages. Specifically, these computing programs can be implemented using high-level process and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, Java, C++, python, "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on the remote computing device, or entirely on the remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., using an Internet service provider to connect through the Internet).

[0133] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a module, a program segment, or a part of a code, and the above-mentioned module, program segment, or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0134] It will be appreciated by those skilled in the art that the features described in the various embodiments of the present invention may be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, without departing from the spirit and teachings of the present invention, the features described in the various embodiments of the present invention may be combined and / or combined in various ways. All of these combinations and / or combinations fall within the scope of the present invention.

[0135] The embodiments of the present invention are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present invention. Although each embodiment is described above, it does not mean that the measures in each embodiment cannot be used in combination advantageously. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. A light field generation method suitable for laser cutting of arc-shaped edges of transparent materials, characterized in that: The method comprises: Acquire a target light field, an initial light field, a transformation matrix, and an aberration compensation phase, wherein the transformation matrix represents the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; Using the transformation matrix and the target algorithm, forward propagation calculation is performed on the initial light field to obtain a focused light field, where the focused light field is a light field distribution formed in a focused space; Using a preset weighting algorithm, weighting the focused light field to obtain an updated focused light field; Using an inverse transformation matrix and an inverse algorithm of the target algorithm, the updated focused light field is back-propagated to obtain an updated light field; When a standard deviation of the updated light field and the target light field meets a preset condition, generating a cutting light field based on the updated light field and the aberration compensation phase to perform laser cutting on the material to be processed; The method is applied to a light field cutting device, the light field cutting device includes a lens and a modulator, and the transformation matrix is ​​obtained by the following method: Obtaining the focal length of the lens, the resolution of the modulator, the refractive index of the processing environment, and the refractive index of the material to be processed; Determine a two-dimensional sampling grid based on the resolution of the modulator and the target light field, wherein the two-dimensional sampling grid is a light field distribution formed by the target light field on an entrance pupil plane; Determining a first deflection matrix and a second deflection matrix based on the focal length of the lens, wherein the first deflection matrix represents propagation characteristics of the light beam from the entrance pupil plane to the apodization plane, and the second deflection matrix represents propagation characteristics of the light beam after passing through the lens; Determining a Fresnel matrix based on a resolution of the modulator, a refractive index of the processing environment, and a refractive index of the material to be processed; Determine a mapping matrix based on the focal length of the lens, the refractive index of the material to be processed and the two-dimensional sampling grid, wherein the mapping matrix represents the mapping of the two-dimensional sampling grid to a three-dimensional grid on a k-domain Ewald sphere; The transformation matrix is ​​calculated based on the first deflection matrix, the second deflection matrix, the Fresnel matrix and the mapping matrix.

2. The method according to claim 1, characterized in that The method further comprises: A three-dimensional sampling grid in the focus space is determined based on the resolution of the modulator and the target light field.

3. The method according to claim 2, characterized in that The target algorithm includes a chirp Z algorithm, and the use of the transformation matrix and the target algorithm to perform forward propagation calculation on the initial light field to obtain a focused light field includes: Determine a spherical light field based on the initial light field using the transformation matrix, wherein the spherical light field is located on the k-domain Ewald sphere; The focused light field is determined based on the frequency spectrum characteristics of the spherical light field and the initial light field by using the Chirp-Z algorithm.

4. The method according to claim 3, characterized in that The step of weighting the focused light field using a preset weighting algorithm to obtain an updated focused light field includes: Decomposing the focused light field to obtain an amplitude and a target phase; Using the preset weighting algorithm, weighting the amplitude to obtain an iterative amplitude; The iterative amplitude and the target phase are synthesized to obtain the updated focused light field.

5. The method according to claim 1, characterized in that The method further comprises: When the standard deviation of the updated light field and the target light field does not meet the preset condition, the initial light field is updated based on the updated light field, and the step of performing forward propagation calculation on the initial light field using the transformation matrix and the target algorithm to obtain the focused light field is returned to be executed.

6. The method according to claim 4, characterized in that The inverse algorithm of the target algorithm includes an inverse chirp Z algorithm, and the inverse transformation matrix and the inverse algorithm of the target algorithm are used to perform back propagation calculation on the updated focused light field to obtain an updated light field, including: Determining an updated spherical light field based on the updated focused light field using the inverse chirp Z algorithm, wherein the updated spherical light field is located on the k-domain Ewald sphere; Determining an updated entrance pupil light field based on the frequency spectrum characteristics of the updated spherical light field and the initial light field by using the inverse transformation matrix, wherein the updated entrance pupil light field is located on the entrance pupil plane; Decomposing the updated entrance pupil light field to obtain the phase of the X-direction polarization component; The updated light field is obtained by synthesizing the phase of the X-direction polarization component and the amplitude of the initial light field.

7. The method according to claim 1, characterized in that The aberration compensation phase is obtained by the following method: Acquire the processing depth of the material to be processed and the processing light wave number in the processing environment; The aberration compensation phase is determined based on the processing depth, the processing light wave number, the refractive index of the processing environment and the refractive index of the material to be processed.

8. A light field generating device suitable for laser cutting of arc-shaped edges of transparent materials, characterized in that: The device comprises: An acquisition module, used to acquire a target light field, an initial light field, a transformation matrix and an aberration compensation phase, wherein the transformation matrix represents the light beam propagation transformation characteristics of the initial light field from a processing environment to a material to be processed; A forward propagation module, used to use the transformation matrix and the target algorithm to perform forward propagation calculation on the initial light field to obtain a focused light field, where the focused light field is a light field distribution formed in a focused space; A weighting module, used to weight the focused light field using a preset weighting algorithm to obtain an updated focused light field; A back propagation module, used to perform back propagation calculation on the updated focused light field using an inverse transformation matrix and an inverse algorithm of the target algorithm to obtain an updated light field; A cutting module, configured to generate a cutting light field based on the updated light field and the aberration compensation phase to perform laser cutting on the material to be processed when a standard deviation between the updated light field and the target light field meets a preset condition; The device is mounted on a light field cutting device, the light field cutting device includes a lens and a modulator, and the device also includes: A second acquisition module is used to acquire the focal length of the lens, the resolution of the modulator, the refractive index of the processing environment and the refractive index of the material to be processed; A two-dimensional sampling grid determination module, used to determine a two-dimensional sampling grid based on the resolution of the modulator and the target light field, wherein the two-dimensional sampling grid is a light field distribution formed by the target light field on an entrance pupil plane; a deflection matrix determination module, configured to determine a first deflection matrix and a second deflection matrix based on the focal length of the lens, wherein the first deflection matrix represents propagation characteristics of the light beam from the entrance pupil plane to the apodization plane, and the second deflection matrix represents propagation characteristics of the light beam after passing through the lens; A Fresnel matrix determination module, configured to determine the Fresnel matrix based on the resolution of the modulator, the refractive index of the processing environment and the refractive index of the material to be processed; A three-dimensional grid determination module, used to determine a mapping matrix based on the focal length of the lens, the refractive index of the material to be processed and the two-dimensional sampling grid, wherein the mapping matrix represents the mapping of the two-dimensional sampling grid to the three-dimensional grid on the k-domain Ewald sphere; A transformation matrix calculation module is used to calculate the transformation matrix based on the first deflection matrix, the second deflection matrix, the Fresnel matrix and the mapping matrix.

9. An electronic device, comprising: one or more processors; a memory for storing one or more computer programs, It is characterized in that the one or more processors execute the one or more computer programs to implement the steps of the method according to any one of claims 1 to 7.

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