Water-cooling built-in integrated capacitor

Abstract

The invention relates to the technical field of capacitors, in particular to a water-cooling built-in integrated capacitor, which comprises a capacitor box body, a box cover, a plurality of core bodies, a heat conduction separation bracket, a busbar stack row and a plurality of groups of water-cooling heat dissipation assemblies, and is characterized in that the heat conduction separation bracket is mounted in the capacitor box body and divides the internal space of the capacitor box body into an upper chamber and a lower chamber; the multiple core bodies are arranged in the lower cavity in a longitudinal and transverse array mode, the lower surface of the water-cooling heat dissipation assembly is attached to and installed on the heat conduction separation support at intervals, the busbar stacking row is attached to and installed on the upper surface of the water-cooling heat dissipation assembly, the busbar stacking row is electrically connected with the multiple core bodies which are connected in series and in parallel, and the box cover is buckled to an opening of the capacitor box body. According to the water-cooling built-in integrated capacitor, heat generated by the core body during working is indirectly transmitted to the water-cooling heat dissipation assembly through the heat conduction separation support, heat generated by busbar stacking during working is directly transmitted to the water-cooling heat dissipation assembly, the heat is discharged, the heat dissipation effect is better, the stability of the capacitor is improved, and the service life of the capacitor is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of capacitors, and in particular to a water-cooled built-in integrated capacitor. Background Art

[0002] Capacitors play an important role in tuning, bypassing, coupling, filtering and other circuits. The working temperature of the capacitor will directly affect the performance and life of the capacitor. If the temperature of the capacitor is too high during operation, the performance and life of the electrolytic capacitor depend on its working temperature. If the working environment temperature of the electrolytic capacitor is too high, the performance of the capacitor will be greatly affected, and even its life will end. Especially in the field of wind power generation, in addition to the high performance requirements of the capacitor, the heat dissipation requirements of the product are even more stringent.

[0003] For example, a Chinese patent with application number: 202311667516.7 discloses a capacitor, including multiple capacitor cores, a first busbar and a second busbar, the first busbar including a first welding portion, the first welding portion being connected to the first end surfaces of the multiple capacitor cores; the second busbar including a connecting portion, the connecting portion being stacked with the first welding portion and an insulating medium layer being provided at the stacking portion to insulate the connecting portion and the first welding portion between the positive and negative electrodes, the two sides of the connecting portion extending to form a second welding portion, the second welding portion being connected to the second end surfaces of the multiple capacitor cores.

[0004] With respect to the above-mentioned related technologies, the inventor believes that there are the following technical defects that need to be improved: During operation, not only the capacitor core will generate more heat, but the busbar will also generate some heat. Common integrated capacitors generally have some heat dissipation structures designed for the capacitor core. Often, such conventional heat dissipation structures and heat dissipation methods cannot take into account the heat generated by the busbar. Overall, the heat dissipation effect is not good enough, and the stability and service life of the capacitor need to be improved. Summary of the invention

[0005] The present application provides a water-cooled built-in integrated capacitor to improve the following technical problems: Common integrated capacitors usually have some heat dissipation structures designed for the capacitor core. Often, such conventional heat dissipation structures and heat dissipation methods cannot take into account the heat generated by the busbar. Overall, the heat dissipation effect is not good enough, and the stability and service life of the capacitor need to be improved.

[0006] The present application provides a water-cooled built-in integrated capacitor, which adopts the following technical solution: A water-cooled built-in integrated capacitor comprises a capacitor box, a box cover, a plurality of cores, a heat-conducting partition bracket, a busbar stack and a plurality of water-cooled heat dissipation components, wherein the heat-conducting partition bracket is installed inside the capacitor box and divides the internal space of the capacitor box into an upper chamber and a lower chamber, a plurality of the cores are arranged in a vertical and horizontal array in the lower chamber, the water-cooled heat dissipation component as a whole presents a flattened plate-like structure, the lower surface of the water-cooled heat dissipation component is adhered to and installed on the heat-conducting partition bracket at intervals and is located in the upper chamber, the busbar stack is adhered to and installed on the upper surface of the water-cooled heat dissipation component, the busbar stack is electrically connected to a plurality of the cores connected in series and parallel, a plurality of wiring terminals are arranged on opposite sides of the busbar stack, holes for the wiring terminals to extend out are arranged on opposite sides of the box cover, and the box cover is buckled at the opening of the capacitor box.

[0007] In an achievable technical solution of the present application, the water-cooled heat dissipation component includes a water-cooling pipe and a plurality of heat dissipation plates arranged in a curved and circuitous manner, a water inlet and a water outlet are respectively arranged at both ends of the water-cooling pipe, the heat dissipation plate is fixedly connected to the water-cooling pipe, the water-cooling pipe is adhered to the heat-conductive partition bracket and is thermally connected, a plurality of heat dissipation plates are arranged in parallel and spaced apart, the lower surface of the heat dissipation plate is adhered to the upper surface of the water-cooled heat dissipation component, the upper surface of the heat dissipation plate is adhered to the lower surface of the busbar stack, and the side surface of the capacitor box body is provided with a first notch adapted to the extension of the water inlet and a second notch adapted to the extension of the water outlet.

[0008] In an achievable technical solution of the present application, the multiple heat dissipation plates include a U-shaped card plate with an opening facing downward, a U-shaped patch plate is provided on one side of the U-shaped card plate, a bottom patch plate is provided on the bottom of the other side of the U-shaped card plate, the U-shaped patch plate opening is facing the side away from the bottom patch plate, and a circular arc U-groove adapted to be clamped and fit the outer peripheral wall of the water-cooling tube is provided in the U-shaped card plate, and the depth of the circular arc U-groove is equal to the outer diameter of the water-cooling tube.

[0009] In an achievable technical solution of the present application, the upper surface of the U-shaped pasting plate is flush with the top surface of the U-shaped cardboard, and the lower surface of the U-shaped pasting plate is flush with the lower surface of the bottom pasting plate.

[0010] In an achievable technical solution of the present application, the multiple heat dissipation plates include a U-shaped card plate arranged with its opening facing downward, a U-shaped patch plate is provided on each side of the U-shaped card plate, the two U-shaped card plates are symmetrically arranged with their openings arranged horizontally back to back, and a circular arc U-groove is provided in the U-shaped card plate for fitting and fitting the outer wall of the water-cooling tube, and the depth of the circular arc U-groove is equal to the outer diameter of the water-cooling tube.

[0011] In an achievable technical solution of the present application, the upper surfaces of the two U-shaped pasting plates are flush with the top surface of the U-shaped cardboard, and the lower surfaces of the two U-shaped pasting plates are flush with the lower surface of the U-shaped cardboard.

[0012] In an achievable technical solution of the present application, the water inlet and the water outlet are located on the same side of the capacitor box, and the side where the water inlet and the water outlet are located is inconsistent with the side where the terminal is located.

[0013] In an achievable technical solution of the present application, the heat-conducting separation bracket includes a plurality of T-shaped support portions fixed to the inner bottom of the capacitor box body and a heat-conducting plate, the T-shaped support portions are located in the gaps between some adjacent core bodies, and the heat-conducting plate is fixed to the plurality of T-shaped support portions by bolts and arranged horizontally.

[0014] In an achievable technical solution of the present application, a first hole is stamped on the heat conducting plate and bent to form a vertically arranged baffle, and the baffle is used to block and fix the water cooling tube along the length direction of the water cooling tube.

[0015] In an achievable technical solution of the present application, a second hole is stamped on the heat conducting plate and bent to form an S-shaped elastic clamp, a clamping gap is formed between the S-shaped elastic clamp and the upper surface of the heat conducting plate, and the bottom of one end of the heat dissipation plate is inserted and clamped in the clamping gap.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: During operation, a large amount of heat generated by the core is indirectly transferred to the water-cooled heat dissipation component through the heat-conducting separation bracket. During operation, part of the heat generated by the busbar stack is directly transferred to the water-cooled heat dissipation component through contact. Under the premise that the circulating cooling medium (which can be coolant or other compressed gas) is passed through the water-cooled heat dissipation component, the flowing cooling medium takes away the temperature generated by the capacitor, so that the capacitor ambient temperature reaches a balanced state, with better heat dissipation effect, and significantly improves the stability and service life of the capacitor; The upper chamber formed by the thermally conductive partition bracket and the stacked busbars can be used to install and fix the water-cooled heat dissipation components with a flat plate structure. The overall structure is simple, compact and stable, which facilitates the integration of capacitors into small-volume products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the structure of the water-cooled built-in integrated capacitor of Example 1 of the present application.

[0019] Figure 2 It is an exploded diagram of the water-cooled built-in integrated capacitor of the first embodiment of the present application.

[0020] Figure 3 It is a schematic diagram of the structure of the heat dissipation plate and the heat conduction plate in Example 1 of the present application.

[0021] Figure 4 It is a structural schematic diagram of the heat sink in the second embodiment of the present application.

[0022] Description of reference numerals: 1. capacitor box; 11. first notch; 12. second notch; 2. Box cover; 21. Holes; 3. Core; 4. heat-conducting partition bracket; 41. T-shaped support portion; 42. heat-conducting plate; 421. baffle plate; 422. S-shaped elastic clamping plate; 5. Busbar stacking; 51. Terminals; 6. Water-cooled heat dissipation assembly; 61. Water-cooling pipe; 62. Heat dissipation plate; 621. U-shaped card plate; 622. U-shaped plate; 623. Bottom plate; 63. Water inlet; 64. Water outlet. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] The following is combined with Figure 1-4 This application is described in further detail.

[0028] Embodiment 1 of the present application discloses a water-cooled built-in integrated capacitor. Figure 1-3 The water-cooled built-in integrated capacitor includes a capacitor box body 1, a box cover 2, multiple cores 3, a thermally conductive partition bracket 4, a busbar stack 5 and multiple groups of water-cooled heat dissipation components 6. The thermally conductive partition bracket 4 is installed inside the capacitor box body 1 and divides the internal space of the capacitor box body 1 into an upper chamber and a lower chamber. Multiple cores 3 are arranged in a vertical and horizontal array in the lower chamber. The water-cooled heat dissipation component 6 as a whole presents a flat plate structure. The lower surface of the water-cooled heat dissipation component 6 is attached to and installed on the thermally conductive partition bracket 4 at intervals and is located in the upper chamber. The busbar stack 5 is attached to the upper surface of the water-cooled heat dissipation component 6. The busbar stack 5 is electrically connected to the multiple cores 3 connected in series and parallel. Multiple wiring terminals 51 are arranged on opposite sides of the busbar stack 5, and holes 21 for the wiring terminals 51 to extend out are arranged on opposite sides of the box cover 2. The box cover 2 is buckled at the opening of the capacitor box body 1.

[0029] In this embodiment, the water-cooling heat dissipation component 6 includes a water-cooling tube 61 and a plurality of heat dissipation plates 62 arranged in a curved and circuitous manner, and one water-cooling tube 61 corresponds to four heat dissipation plates 62, a water inlet 63 and a water outlet 64 are respectively provided at both ends of the water-cooling tube 61, the heat dissipation plate 62 is fixedly connected to the water-cooling tube 61, the water-cooling tube 61 is attached to the heat-conducting partition bracket 4 and is heat-conductingly connected, the plurality of heat dissipation plates 62 are arranged in parallel and spaced apart, the lower surface of the heat dissipation plate 62 is attached to the upper surface of the water-cooling heat dissipation component 6, the upper surface of the heat dissipation plate 62 is attached to the lower surface of the busbar stack 5, and the side surface of the capacitor box body 1 is provided with a first notch 11 adapted to extend out of the water inlet 63 and a second notch 12 adapted to extend out of the water outlet 64.

[0030] In the water-cooled heat dissipation component 6 designed as above, the cooling medium in the water-cooling tube 61 can enter and exit through the water inlet 63 and the water outlet 64, and the heat sink 62 will be firmly clamped in the upper chamber by the busbar stack 5 and the heat-conducting partition bracket 4. Not only can heat be quickly conducted between the heat sink 62 and the water-cooling tube 61, but the heat sink 62 also has a good fixing effect on the water-cooling tube 61, effectively preventing the structure from shaking.

[0031] In order to improve the heat conduction efficiency and the stability of the heat sink 62 after being clamped, the plurality of heat sinks 62 include a U-shaped card plate 621 with an opening facing downward, a U-shaped plate 622 is provided on one side of the U-shaped card plate 621, a bottom plate 623 is provided on the other side of the bottom of the U-shaped card plate 621, the U-shaped plate 622 is opened toward the side away from the bottom plate 623, and a circular arc U groove is provided inside the U-shaped card plate 621 to fit the outer peripheral wall of the water cooling tube 61, and the depth of the circular arc U groove is equal to the outer diameter of the water cooling tube 61. The upper surface of the U-shaped plate 622 is flush with the top surface of the U-shaped card plate 621, and the lower surface of the U-shaped plate 622 is flush with the lower surface of the bottom plate 623.

[0032] The design of the U-shaped mounting plate 622 and the bottom mounting plate 623 provides a larger contact area between the busbar stack 5 and the heat-conducting partition bracket 4 to accelerate heat transfer.

[0033] In this embodiment, in order to facilitate the connection of external water inlet and outlet pipes and facilitate the layout of pipelines, the water inlet 63 and the water outlet 64 are located on the same side of the capacitor box body 1, and the side where the water inlet 63 and the water outlet 64 are located is inconsistent with the side where the terminal 51 is located, thereby effectively separating the water interface and the electrical interface, which is safer.

[0034] In this embodiment, the heat-conducting separation bracket 4 includes a plurality of T-shaped support portions 41 fixed to the bottom of the capacitor box body 1 and a heat-conducting plate 42. The T-shaped support portions 41 are located in the gaps between some adjacent cores 3. The heat-conducting plate 42 is fixed to the plurality of T-shaped support portions 41 by bolts and arranged horizontally.

[0035] The heat conducting partition bracket 4 designed above is not only simple in structure and firm and stable, convenient for installing and fixing the water cooling and heat dissipation assembly 6, but also conducive to collecting a large amount of heat generated by the conductive core 3 when working. The water cooling pipe 61 is a metal water pipe with good thermal conductivity, and the heat dissipation plate 62 and the heat conducting plate 42 are aluminum plates or copper plates, so that they have good thermal conductivity and heat dissipation effects.

[0036] In this embodiment, in order to prevent the water-cooling pipe 61 from shaking randomly in the upper chamber, a first hole is stamped on the heat conduction plate 42 and bent to form a vertically arranged baffle 421. The baffle 421 is used to block and fix the water-cooling pipe 61 along the length direction of the water-cooling pipe 61, and the baffle 421 also has a certain positioning effect when installing the water-cooling heat dissipation component 6.

[0037] In this embodiment, in order to prevent the heat sink 62 from shaking randomly in the upper chamber, a second hole is stamped on the heat conducting plate 42 and bent to form an S-shaped elastic clamp 422, and a clamping gap is formed between the S-shaped elastic clamp 422 and the upper surface of the heat conducting plate 42, and the bottom of one end of the heat sink 62 is inserted and clamped in the clamping gap.

[0038] The beneficial technical effects of the water-cooled built-in integrated capacitor of the embodiment of the present application are roughly as follows: During operation, a large amount of heat generated by the core 3 is indirectly transferred to the water-cooled heat dissipation component 6 through the heat-conducting partition bracket 4. During operation, part of the heat generated by the busbar stack 5 is directly transferred to the water-cooled heat dissipation component 6 by contact. Under the premise that the circulating cooling medium (which can be coolant or other compressed gas) is passed through the water-cooled heat dissipation component 6, the heat can be quickly discharged, which has a better heat dissipation effect and significantly improves the stability and service life of the capacitor; The upper chamber formed by the heat-conducting partition bracket 4 and the busbar stack 5 can be used to install and fix the water-cooled heat dissipation component 6 with a flat plate structure. The overall structure is simple, compact and stable, which facilitates the integration of capacitors into small-volume products.

[0039] Embodiment 2 of the present application discloses a water-cooled built-in integrated capacitor. Figure 2 and Figure 4 , which is different from the first embodiment in that: The multiple heat sinks 62 include a U-shaped card plate 621 arranged with its opening facing downward, and a U-shaped patch plate 622 is provided on both sides of the U-shaped card plate 621 respectively. The two U-shaped card plates 621 are symmetrically arranged with their openings arranged horizontally back to back. A circular arc U-groove is provided in the U-shaped card plate 621 for fitting and fitting the outer wall of the water-cooling tube 61. The depth of the circular arc U-groove is equal to the outer diameter of the water-cooling tube 61, wherein the upper surfaces of the two U-shaped patches 622 are flush with the top surface of the U-shaped card plate 621, and the lower surfaces of the two U-shaped patches 622 are flush with the lower surface of the U-shaped card plate 621.

[0040] The heat sink 62 of the above design also has a larger contact area with the busbar stack 5 and the heat-conducting partition bracket 4 to accelerate heat transfer, and the structure is also simple and stable.

[0041] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A water-cooled built-in integrated capacitor, characterized in that: The invention comprises a capacitor box body (1), a box cover (2), a plurality of core bodies (3), a heat-conducting partition bracket (4), a busbar stack (5) and a plurality of water-cooling heat dissipation components (6), wherein the heat-conducting partition bracket (4) is installed inside the capacitor box body (1) and divides the internal space of the capacitor box body (1) into an upper chamber and a lower chamber, a plurality of the core bodies (3) are arranged in a vertical and horizontal array in the lower chamber, and the water-cooling heat dissipation components (6) are overall in a flat plate-like structure, and the lower surface of the water-cooling heat dissipation components (6) is in contact with the upper chamber. The busbar stack (5) is installed at intervals on the heat-conducting partition bracket (4) and is located in the upper chamber. The busbar stack (5) is installed in close contact with the upper surface of the water-cooling heat dissipation component (6). The busbar stack (5) is electrically connected to the multiple cores (3) connected in series and parallel. The busbar stack (5) is provided with multiple wiring terminals (51) on opposite sides. The box cover (2) is provided with holes (21) on opposite sides for the wiring terminals (51) to extend out. The box cover (2) is buckled on the opening of the capacitor box body (1).

2. The water-cooled built-in integrated capacitor according to claim 1, characterized in that: The water-cooling heat dissipation component (6) comprises a water-cooling tube (61) and a plurality of heat dissipation plates (62) arranged in a curved manner, the two ends of the water-cooling tube (61) are respectively provided with a water inlet (63) and a water outlet (64), the heat dissipation plate (62) is fixedly connected to the water-cooling tube (61), the water-cooling tube (61) is attached to the heat-conducting partition bracket (4) and is heat-conductingly connected, the plurality of heat dissipation plates (62) are arranged in parallel and spaced apart, the lower surface of the heat dissipation plate (62) is attached to the upper surface of the water-cooling heat dissipation component (6), the upper surface of the heat dissipation plate (62) is attached to the lower surface of the busbar stack (5), and the side surface of the capacitor box body (1) is provided with a first notch (11) adapted to extend from the water inlet (63) and a second notch (12) adapted to extend from the water outlet (64).

3. The water-cooled built-in integrated capacitor according to claim 2, characterized in that: The plurality of heat dissipation plates (62) include a U-shaped card plate (621) arranged with its opening facing downwards, a U-shaped pasting plate (622) being provided on one side of the U-shaped card plate (621), a bottom pasting plate (623) being provided at the bottom of the other side of the U-shaped card plate (621), the U-shaped pasting plate (622) opening being directed towards a side away from the bottom pasting plate (623), an arc U-groove being provided in the U-shaped card plate (621) for fitting and fitting the outer peripheral wall of the water cooling tube (61), the depth of the arc U-groove being equal to the outer diameter of the water cooling tube (61).

4. The water-cooled built-in integrated capacitor according to claim 3, characterized in that: The upper surface of the U-shaped pasting plate (622) is flush with the top surface of the U-shaped cardboard (621), and the lower surface of the U-shaped pasting plate (622) is flush with the lower surface of the bottom pasting plate (623).

5. The water-cooled built-in integrated capacitor according to claim 2, characterized in that: The plurality of heat dissipation plates (62) include a U-shaped card plate (621) arranged with its opening facing downwards, a U-shaped pasting plate (622) is respectively arranged on both sides of the U-shaped card plate (621), the two U-shaped card plates (621) are symmetrically arranged with their openings arranged horizontally and facing back to back, and a circular arc U groove is arranged inside the U-shaped card plate (621) for fitting and fitting the outer peripheral wall of the water cooling tube (61), and the depth of the circular arc U groove is equal to the outer diameter of the water cooling tube (61).

6. The water-cooled built-in integrated capacitor according to claim 5, characterized in that: The upper surfaces of the two U-shaped pasting plates (622) are flush with the top surface of the U-shaped cardboard (621), and the lower surfaces of the two U-shaped pasting plates (622) are flush with the lower surface of the U-shaped cardboard (621).

7. The water-cooled built-in integrated capacitor according to claim 2, characterized in that: The water inlet (63) and the water outlet (64) are located on the same side of the capacitor case (1), and the sides where the water inlet (63) and the water outlet (64) are located are inconsistent with the side where the wiring terminal (51) is located.

8. The water-cooled built-in integrated capacitor according to claim 2, characterized in that: The heat-conducting separation bracket (4) comprises a plurality of T-shaped support portions (41) fixed to the inner bottom of the capacitor box body (1) and a heat-conducting plate (42); the T-shaped support portions (41) are located in the gaps between some adjacent core bodies (3); and the heat-conducting plate (42) is fixed to the plurality of T-shaped support portions (41) by bolts and arranged horizontally.

9. The water-cooled built-in integrated capacitor according to claim 8, characterized in that: The heat conducting plate (42) is stamped with a first hole and bent to form a vertically arranged baffle (421); the baffle (421) is used to block and fix the water cooling tube (61) along the length direction of the water cooling tube (61).

10. The water-cooled built-in integrated capacitor according to claim 8, characterized in that: A second hole is punched and formed on the heat conducting plate (42) and an S-shaped elastic clamp (422) is formed by bending, a clamping gap is formed between the S-shaped elastic clamp (422) and the upper surface of the heat conducting plate (42), and the bottom of one end of the heat dissipation plate (62) is inserted and clamped in the clamping gap.

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