Packaging structure of heat dissipation type integrated circuit chip

Abstract

The invention discloses a heat dissipation type integrated circuit chip packaging structure, and relates to the field of chip packaging, the heat dissipation type integrated circuit chip packaging structure comprises an upper packaging plate, a chip packaging plate and a heat dissipation packaging plate which are sequentially assembled together from top to bottom, the top of the chip packaging plate is provided with a chip groove, the chip groove is used for embedding a chip, the top of the heat dissipation packaging plate is provided with a heat dissipation groove, and the heat dissipation groove is used for embedding the chip into the chip groove. The heat dissipation grooves are filled with paraffin, the pin positions of the chip are connected with one ends of the pins through wires, installation grooves are formed in the positions, corresponding to the pins, of the chip packaging plate in a penetrating mode, leading-out grooves are formed in the inner side walls of the heat dissipation grooves and penetrate through the outer side wall of the heat dissipation packaging plate, and each installation groove is correspondingly provided with one leading-out groove. The other end of each pin penetrates through the corresponding mounting groove and the corresponding lead-out groove to be arranged outside the heat dissipation packaging plate, the paraffin phase-change material absorbs heat generated by the chip through heat absorption and melting, and therefore the chip packaging structure can dissipate heat automatically, and the continuous working time of the chip is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a packaging structure of a heat dissipation type integrated circuit chip. Background Art

[0002] The inside of a chip is usually composed of many precision circuits. If these precision circuits are directly exposed to the air, they will be corroded by impurities, bad gases and water vapor in the air, resulting in a decrease in the electrical performance of the circuits. Chip packaging technology is a process technology that can wrap the precision circuits inside the chip to prevent them from contacting the outside world, which can effectively protect the precision circuits inside the chip. In the field of chip packaging technology, chips are usually packaged in a cavity formed by a packaging shell to protect the precision circuit inside the chip. However, after the chip is packaged, the chip is completely sealed by the packaging shell. Part of the heat generated by the chip is first transferred through the cavity medium in the packaging shell, and then transferred from the cavity medium to the packaging shell and then to the outside through the packaging shell, resulting in poor heat dissipation of the packaged chip. All of them need to be equipped with heat dissipation equipment later. After the integrated circuit chip package is connected to the circuit, a water cooling equipment will be installed on the upper surface of the integrated circuit chip package. The coolant is circulated by a water pump to drive the heat generated by the chip. However, the heat dissipation area of ​​this method is small, and the heat at the bottom of the chip package will continue to rise, resulting in poor heat dissipation capacity of the entire chip package. After the chip temperature exceeds the safety temperature, it is necessary to shut down and wait for the chip to cool down. The low heat dissipation capacity leads to a short working time of the chip and great limitations. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a packaging structure of a heat dissipation integrated circuit chip to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: A packaging structure of a heat-dissipating integrated circuit chip, comprising an upper packaging board, a chip packaging board and a heat-dissipating packaging board assembled together in sequence from top to bottom, a chip slot being provided on the top of the chip packaging board, the chip slot being used to implant the chip, a heat-dissipating slot being provided on the top of the heat-dissipating packaging board, the heat-dissipating slot being filled with paraffin, the pins of the chip being connected to one end of the pins through a wire, a mounting slot being provided through the position of the chip packaging board corresponding to the pins, a lead-out slot being provided on the inner side wall of the heat-dissipating slot, the lead-out slot passing through the outer side wall of the heat-dissipating packaging board, each of the mounting slots corresponding to one lead-out slot being provided, and the other end of the pin passing through the mounting slot and the lead-out slot being arranged outside the heat-dissipating packaging board.

[0005] Furthermore, the pin adopts a split structure, and the pin includes a chip connecting pin and a lead-out pin. One end of the chip connecting pin is located in the chip packaging board to connect the chip, and the other end passes through the mounting groove and extends into the heat dissipation groove. One end of the lead-out pin passes through the lead-out groove to connect to the other end of the chip connecting pin.

[0006] Furthermore, the chip connecting pin comprises a long side, a vertical side and a short side, the two ends of the vertical side are respectively connected to the long side and the short side by an arc transition, a pin hole is provided at one end of the short side away from the vertical side, the chip connecting pin and the lead-out pin are both Z-shaped, a pin is fixed at one end of the lead-out pin close to the short side, the diameter of the pin gradually increases in the direction close to the lead-out pin, and the pin is interference fit in the pin hole.

[0007] Furthermore, a pin mounting groove is provided on the side wall of the heat dissipation groove, each pin corresponds to a pin mounting groove, the pin mounting groove passes through the top of the heat dissipation packaging board, the lead-out groove is connected to the pin mounting groove, the chip connecting pin is connected to the lead-out pin in the pin mounting groove, and a plurality of strip grooves are provided on the top of the chip packaging board, the plurality of strip grooves correspond one-to-one to the plurality of pins, and the two ends of the strip groove are respectively connected to the mounting groove and the chip groove.

[0008] Furthermore, a first elastic block is provided at the bottom of the pin installation groove, a side wall of the first elastic block is flush with the inner wall of the heat dissipation groove, and the short side and one end of the lead pin are both in contact with the top surface of the first elastic block.

[0009] Furthermore, an installation gap is formed between the vertical edge and the inner side wall of the pin mounting groove, and a second sealing block is arranged in the installation gap. The second sealing block passes through the mounting groove, and the top surface of the second sealing block is located above the top surface of the chip packaging board. The upper packaging board and the chip packaging board are assembled to squeeze the second sealing block to produce compression deformation, so as to make the second sealing block interference fit in the mounting groove and the pin mounting groove.

[0010] Furthermore, mounting posts are fixed at the four corners of the bottom of the upper packaging board, and through holes are formed in the chip packaging board and the heat dissipation packaging board at positions corresponding to the mounting posts. A threaded hole is formed at one end of the mounting post away from the upper packaging board, and the mounting post is inserted into the through hole of the heat dissipation packaging board. Screws are provided at the four through holes at the bottom of the heat dissipation packaging board, and the screw bodies of the screws are threadedly connected in the threaded holes.

[0011] Furthermore, four countersunk holes are opened at the bottom of the heat dissipation packaging plate, and the four countersunk holes are coaxially arranged with the four through holes. The diameter of the countersunk holes is larger than the diameter of the through holes. A sealing ring is arranged in the countersunk holes. The head of the screw is located in the countersunk holes and squeezes the sealing ring to cause deformation.

[0012] Furthermore, a first sealing ring is fixed to the bottom of the upper packaging plate, a first annular groove is opened on the top of the chip packaging plate around the chip groove, and the first sealing ring is interference fit in the first annular groove, a second sealing ring is fixed to the bottom of the chip packaging plate, a second annular groove is opened on the top of the heat dissipation packaging plate around the heat dissipation groove, and the second sealing ring is interference fit in the second annular groove.

[0013] Furthermore, a plurality of heat dissipation slots are provided at the bottom of the heat dissipation packaging plate, and the heat dissipation slots are arranged to penetrate in a horizontal direction.

[0014] The beneficial effects of the present invention are: 1. Fill the chip packaging structure with paraffin phase change material. The paraffin phase change material acts under the chip and absorbs the heat generated by the chip by melting it to make the chip packaging structure dissipate heat by itself, thus extending the continuous working time of the chip.

[0015] 2. The pins pass through the heat dissipation slot and the lead-out slot, so that the pins are in contact with the paraffin phase change material, so that the heat of the chip can be transferred through the pins to the paraffin phase change material to be absorbed, thereby improving the heat dissipation effect.

[0016] 3. In order to prevent the paraffin phase change material from creeping into the chip slot along the pins after melting, a second elastic block is provided to seal the mounting slot to prevent the paraffin phase change material from entering the chip slot, thereby protecting the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The invention discloses an explosion-proof packaging structure of a heat dissipation integrated circuit chip Figure 1 ; Figure 2 The invention discloses an explosion-proof packaging structure of a heat dissipation integrated circuit chip Figure 2 ; Figure 3 It is a structural schematic diagram of a heat dissipation packaging plate in a packaging structure of a heat dissipation integrated circuit chip of the present invention; Figure 4 A top view of a packaging structure of a heat dissipation integrated circuit chip of the present invention; Figure 5 for Figure 4 Middle AA section view; Figure 6 for Figure 5 Enlarged view of point A in the middle; Figure 7 for Figure 4 Middle BB section view; Figure 8 for Figure 7 Enlarged view of point B in the middle; In the figure, 1-upper packaging plate, 2-chip packaging plate, 3-heat dissipation packaging plate, 4-chip slot, 5-heat dissipation slot, 6-chip, 7-pin, 8-mounting slot, 9-lead-out slot, 10-chip connecting pin, 11-lead-out pin, 12-long side, 13-vertical side, 14-short side, 15-pin hole, 16-pin, 17-pin mounting slot, 18-strip slot, 19-first elastic block, 20-second sealing block, 21-mounting column, 22-through hole, 23-threaded hole, 24-screw, 25-countersunk hole, 26-sealing ring, 27-first sealing ring, 28-first annular groove, 29-second sealing ring, 30-second annular groove, 31-heat dissipation trough. DETAILED DESCRIPTION

[0018] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0019] Embodiment 1: Figures 1 to 8As shown, a packaging structure of a heat dissipation integrated circuit chip comprises an upper packaging board 1, a chip packaging board 2 and a heat dissipation packaging board 3 which are assembled together in sequence from top to bottom. A chip slot 4 is provided on the top of the chip packaging board 2, and the chip slot 4 is used to implant a chip 6. A heat dissipation slot 5 is provided on the top of the heat dissipation packaging board 3, and the heat dissipation slot 5 is filled with paraffin. The pin of the chip 6 is connected to one end of a pin 7 through a wire. A mounting slot 8 is provided through the position corresponding to the pin 7 on the chip packaging board 2, and a lead-out slot 9 is provided on the inner side wall of the heat dissipation slot 5, and the lead-out slot 9 passes through the heat dissipation slot 5. The outer wall of the packaging board 3, each mounting groove 8 is correspondingly provided with a lead-out groove 9, the other end of the pin 7 passes through the mounting groove 8 and the lead-out groove 9 and is arranged outside the heat dissipation packaging board 3, and the chip packaging structure is set as a three-layer split structure, which is convenient for the installation of the chip and the filling of the paraffin phase change material. According to the size of the heat dissipation groove 5, matching solid paraffin is made, the solid paraffin is placed in the heat dissipation groove 5, and the chip 6 is installed in the chip groove 4. Through the setting of the chip groove 4, the distance between the chip 6 and the paraffin is greatly reduced, so that the paraffin can be effectively placed close to the chip. The chip 6 is then heated to the touch screen by the heat dissipation device 10, and then the heat dissipation device 10 is connected to the chip 6 by the heat dissipation device 10. The ...

[0020] Furthermore, if Figures 1 to 3 As shown, a plurality of heat dissipation slots 31 are provided at the bottom of the heat dissipation package plate 3, and the heat dissipation slots 31 are arranged to penetrate in the horizontal direction. After the traditional chip package is welded to the circuit board, the bottom surface of the chip package contacts the circuit board, resulting in that the heat cannot be discharged in time. Since a heat dissipation fan is separately installed in the server, the wind in the server is in a flowing state. By providing the heat dissipation slots 31, the wind can flow between the heat dissipation package plate 3 and the circuit board, and can take away the heat, thereby further improving the heat dissipation performance of the chip package.

[0021] Embodiment 2: The conventional pin shape is a Z-shape. This structure cannot allow the pin to pass from the mounting groove 8 into the heat dissipation groove 5 and then pass out from the lead-out groove 9. Therefore, based on the embodiment 1, as shown in FIG. Figures 1 to 6 As shown, pin 7 adopts a split structure, and pin 7 includes a chip connecting pin 10 and a lead pin 11. One end of the chip connecting pin 10 is located in the chip packaging board 2 to connect the chip 6, and the other end passes through the mounting groove 8 to extend into the heat dissipation groove 5. One end of the lead pin 11 penetrates from the lead groove 9 to connect the other end of the chip connecting pin 10. Pin 7 is set to a split structure, which is convenient for assembling pin 7 on the chip packaging board 2 and the heat dissipation packaging board 3, so that pin 7 can smoothly contact the paraffin phase change material. The chip connecting pin 10 penetrates from the mounting groove 8 into the heat dissipation groove 5. The chip connecting pin 10 is used to connect the chip 6, and then the lead pin 11 is penetrated into the heat dissipation groove 5 through the lead groove 9, and then the chip connecting pin 10 is connected to the lead pin 11 to form pin 7, so that pin 7 can smoothly contact the paraffin phase change material for heat transfer without affecting the assembly of pin 7.

[0022] Furthermore, if Figures 1 to 6 As shown, the chip connection pin 10 includes a long side 12, a vertical side 13 and a short side 14. The two ends of the vertical side 13 are connected to the long side 12 and the short side 14 by arc transition. The end of the short side 14 away from the vertical side 13 is provided with a pin hole 15. The chip connection pin 10 and the lead pin 11 are both in a Z-shape. The end of the lead pin 11 close to the short side 14 is fixed with a pin 16. The diameter of the pin 16 gradually increases in the direction close to the lead pin 11. The pin 16 is interference fit in the pin hole 15. The vertical side 13 carries the short side 14 through the installation groove 8, and then the long side 12 is connected to the chip 6 through a wire. The pins of the chip 6 are assembled together, or directly soldered to the pins of the chip 6, and then the upper packaging board 1, the chip packaging board 2 and the heat dissipation packaging board 3 are assembled together, and finally the lead pin 11 is assembled, and the end of the lead pin 11 with the plug pin 16 is inserted from the lead-out groove 9. After the lead pin 11 is assembled in place, the plug pin 16 is inserted into the plug pin hole 15. The conical setting of the plug pin 16 enables the plug pin 16 to be inserted into the pin hole 15 within the error range, and the conical surface enables the plug pin 16 to be deformed and fit into the pin hole 15 with interference fit, thereby completing the connection between the chip connection pin 10 and the lead pin 11, and realizing the heat dissipation assembly of the pin 7.

[0023] Embodiment 3: Based on Embodiment 2, Figures 1 to 6As shown, the side wall of the heat dissipation slot 5 is provided with a pin mounting slot 17, each pin 7 corresponds to a pin mounting slot 17, the pin mounting slot 17 passes through the top of the heat dissipation packaging board 3, the lead-out slot 9 is connected to the pin mounting slot 17, the chip connection pin 10 is connected to the lead-out pin 11 in the pin mounting slot 17, and the top of the chip packaging board 2 is provided with a plurality of strip grooves 18, the plurality of strip grooves 18 correspond to the plurality of pins 7 one by one, and the two ends of the strip groove 18 are respectively connected to the mounting slot 8 and the chip slot 4. In order to facilitate the production of the paraffin standard parts, the shape of the heat dissipation slot 5 is rectangular, and the pin mounting slot 17 is provided on the side wall of the heat dissipation slot 5 so that the pin 7 passes through The pin 7 is inserted into the pin mounting groove 17 to contact the paraffin phase change material, and the paraffin is made into a rectangular shape and matches the size of the heat dissipation groove 5, which facilitates the production of the paraffin phase change material so that it can be implanted in the heat dissipation groove 5 and the pin 7 can contact the side of the paraffin phase change material. The standardized paraffin phase change material can also make the solid paraffin phase change material contact the bottom surface of the chip packaging board 2 to achieve better heat transfer; the setting of the strip groove 18 enables the long side 12 of the chip connecting pin 10 to be embedded in the chip packaging board 2, ensuring that the chip packaging board 2 and the heat dissipation packaging board 3 can be well fitted together, ensuring that the sealing performance of the chip package is not affected.

[0024] Embodiment 4: Since the solid shape of the paraffin phase change material matches the heat dissipation slot 5, it can well contact the bottom surface of the chip packaging board 2. However, the volume of the paraffin phase change material will increase after absorbing heat and liquefying, resulting in squeezing the chip packaging board 2 and the heat dissipation packaging board 3, which is easy to cause deformation or damage to the chip package body. Therefore, based on the embodiment 3, as shown in FIG. Figures 1 to 6 As shown, a first elastic block 19 is provided at the bottom of the pin mounting groove 17, and the side wall of the first elastic block 19 is flush with the inner wall of the heat dissipation groove 5, the short side 14 and one end of the lead pin 11 are both in contact with the top surface of the first elastic block 19, and the vertical side 13 of the chip connecting pin 10 does not extend to the bottom of the pin mounting groove 17, so that a buffer space is left between the short side 14 and the bottom of the pin mounting groove 17, and the first elastic block 19 is installed in the buffer space. When the volume of the liquefied paraffin phase change material increases, the first elastic block 19 will be squeezed to deform, so that the liquefied paraffin flows into the pin mounting groove 17, thereby adapting to the volume change of the paraffin phase change material. In the process of the paraffin phase change material changing from liquid to solid, the paraffin phase change material is shaped under the reaction force of the first elastic block 19, so that it returns to the heat dissipation groove 5, ensuring that the solid paraffin phase change material can still contact the chip packaging board 2 to dissipate heat to the chip, so that the chip package has excellent heat dissipation capacity.

[0025] Embodiment 5: Due to the setting of the mounting groove 8 and the pin 7 being provided for connecting the short side 14, there is a gap between the vertical side 13 and the mounting groove 8, and the water vapor of the liquefied paraffin phase change material will enter the chip groove 4 through this gap. Therefore, based on the embodiment 4, as Figures 1 to 6As shown, an installation gap is formed between the vertical side 13 and the inner side wall of the pin mounting groove 17, and a second sealing block 20 is arranged in the installation gap. The second sealing block 20 passes through the mounting groove 8, and the top surface of the second sealing block 20 is located above the top surface of the chip packaging board 2. The upper packaging board 1 and the chip packaging board 2 are assembled and squeezed to squeeze the second sealing block 20 to produce compression deformation, which is used to make the second sealing block 20 interference fit in the mounting groove 8 and the pin mounting groove 17. After the chip connecting pin 10 is installed on the chip packaging board 2, the second sealing block 20 is inserted into the mounting groove 8, and then the chip packaging board 2 and the heat dissipation packaging board 3 are attached together, and the second sealing block 20 is squeezed downward again to make the second sealing block 20 contact the short side 14, so that the second sealing block 20 is assembled in place. Then, the upper packaging plate 1 is attached to the chip packaging plate 2 to complete the assembly. The upper packaging plate 1 and the second sealing block 20 work together to fix the position of the chip connecting pin 10. Finally, the lead pin 11 is inserted from the lead-out groove 9 to connect the chip connecting pin 10 to complete the assembly of the entire chip package. The mounting groove 8 is sealed by the second sealing block 20 to ensure that water vapor does not enter the chip groove 4 and affect the use of the chip 6. At the same time, the first elastic block 19 is squeezed by the liquefied paraffin and will be deformed and tightly attached to the side wall of the pin mounting groove 17. The second sealing block 20 itself is an interference fit and will also be tightly attached to the side wall of the pin mounting groove 17, so that the lead-out groove 9 can be well sealed, so that the liquefied paraffin phase change material will not overflow from the lead-out groove 9, thereby ensuring the stability of the structure.

[0026] Embodiment 6: Based on Embodiment 5, Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, mounting posts 21 are fixed to the four corners of the bottom of the upper packaging board 1, and through holes 22 are provided on the chip packaging board 2 and the heat dissipation packaging board 3 at positions corresponding to the mounting posts 21. A threaded hole 23 is provided at one end of the mounting post 21 away from the upper packaging board 1, and the mounting post 21 penetrates into the through hole 22 of the heat dissipation packaging board 3. Screws 24 are provided at the four through holes 22 at the bottom of the heat dissipation packaging board 3, and the screw body of the screw 24 is threadedly connected in the threaded hole 23. Four countersunk holes 25 are provided at the bottom of the heat dissipation packaging board 3, and the four countersunk holes 25 are coaxially arranged one by one with the four through holes 22. The diameter of the countersunk hole 25 is larger than the diameter of the through hole 22. A sealing ring 26 is arranged in the countersunk hole 25. The head of the screw 24 is located in the countersunk hole 25 and squeezes the sealing ring 26 to produce deformation. The mounting column 21 of the upper packaging board 1 is sequentially passed through the through holes 22 of the chip packaging board 2 and the heat dissipation packaging board 3, and then the screw 24 is connected to the threaded hole 23 of the mounting column 21. After the screw 24 is tightened, the sealing ring 26 is squeezed to produce deformation, and the through hole 22 is sealed by the sealing ring 26, so that the upper packaging board 1, the chip packaging board 2 and the heat dissipation packaging board 3 are sealed and assembled together.

[0027] Embodiment 7: Based on Embodiment 6, Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, a first sealing ring 27 is fixed at the bottom of the upper packaging board 1, a first annular groove 28 is opened at the top of the chip packaging board 2 around the chip groove 4, and the first sealing ring 27 is interference-fitted in the first annular groove 28, a second sealing ring 29 is fixed at the bottom of the chip packaging board 2, a second annular groove 30 is opened at the top of the heat dissipation packaging board 3 around the heat dissipation groove 5, and the second sealing ring 29 is interference-fitted in the second annular groove 30, the axial length of the first sealing ring 27 is greater than the axial length of the first annular groove 28, and the axial length of the second sealing ring 29 is greater than the axial length of the second annular groove 30. When the upper packaging board 1, the chip packaging board 2 and the heat dissipation packaging board 3 are assembled, the first sealing ring 27 will be squeezed and interference-fitted in the first annular groove 28 to eliminate the gap between the upper packaging board 1 and the chip packaging board 2, and the second sealing ring 29 will be squeezed and interference-fitted in the second annular groove 30 to eliminate the gap between the chip packaging board 2 and the heat dissipation packaging board 3, thereby improving the sealing performance of the entire chip package.

Claims

1. A packaging structure of a heat dissipation integrated circuit chip, characterized in that: The invention comprises an upper packaging plate (1), a chip packaging plate (2) and a heat dissipation packaging plate (3) which are assembled together in sequence from top to bottom. The top of the chip packaging plate (2) is provided with a chip slot (4), the chip slot (4) is used to implant a chip (6), the top of the heat dissipation packaging plate (3) is provided with a heat dissipation slot (5), the heat dissipation slot (5) is filled with paraffin, the pin of the chip (6) is connected to one end of a pin (7) through a wire, a mounting slot (8) is provided through the position corresponding to the pin (7) on the chip packaging plate (2), the inner side wall of the heat dissipation slot (5) is provided with a lead-out slot (9), the lead-out slot (9) passes through the outer side wall of the heat dissipation packaging plate (3), each of the mounting slots (8) is provided with a corresponding lead-out slot (9), and the other end of the pin (7) passes through the mounting slot (8) and the lead-out slot (9) and is arranged outside the heat dissipation packaging plate (3).

2. The packaging structure of a heat dissipation integrated circuit chip according to claim 1, characterized in that: The pin (7) adopts a split structure, and the pin (7) comprises a chip connection pin (10) and a lead pin (11), one end of the chip connection pin (10) is located in the chip packaging board (2) and connected to the chip (6), and the other end passes through the installation groove (8) and extends into the heat dissipation groove (5), and one end of the lead pin (11) passes through the lead groove (9) and is connected to the other end of the chip connection pin (10).

3. The packaging structure of a heat dissipation integrated circuit chip according to claim 2, characterized in that: The chip connection pin (10) comprises a long side (12), a vertical side (13) and a short side (14); the two ends of the vertical side (13) are connected to the long side (12) and the short side (14) by arc transition; one end of the short side (14) away from the vertical side (13) is provided with a pin hole (15); the chip connection pin (10) and the lead pin (11) are both Z-shaped; one end of the lead pin (11) close to the short side (14) is fixed with a pin (16); the diameter of the pin (16) gradually increases in a direction close to the lead pin (11); and the pin (16) is interference-fitted into the pin hole (15).

4. The packaging structure of a heat dissipation integrated circuit chip according to claim 3, characterized in that: The side wall of the heat dissipation slot (5) is provided with a pin mounting slot (17), each pin (7) corresponds to a pin mounting slot (17), the pin mounting slot (17) passes through the top of the heat dissipation packaging plate (3), the lead-out slot (9) is connected to the pin mounting slot (17), the chip connection pin (10) is connected to the lead-out pin (11) in the pin mounting slot (17), and the top of the chip packaging plate (2) is provided with a plurality of strip grooves (18), the plurality of strip grooves (18) correspond one-to-one to the plurality of pins (7), and the two ends of the strip groove (18) are respectively connected to the mounting slot (8) and the chip slot (4).

5. The packaging structure of a heat dissipation integrated circuit chip according to claim 4, characterized in that: A first elastic block (19) is provided at the bottom of the pin installation groove (17); the side wall of the first elastic block (19) is flush with the inner side wall of the heat dissipation groove (5); and the short side (14) and one end of the lead pin (11) are both in contact with the top surface of the first elastic block (19).

6. The packaging structure of a heat dissipation integrated circuit chip according to claim 5, characterized in that: An installation gap is formed between the vertical edge (13) and the inner side wall of the pin installation groove (17), and a second sealing block (20) is arranged in the installation gap. The second sealing block (20) passes through the installation groove (8), and the top surface of the second sealing block (20) is located above the top surface of the chip packaging board (2). The upper packaging board (1) and the chip packaging board (2) are assembled to squeeze the second sealing block (20) to generate compression deformation, so as to make the second sealing block (20) interference fit in the installation groove (8) and the pin installation groove (17).

7. The packaging structure of a heat dissipation integrated circuit chip according to claim 1, characterized in that: The four corners of the bottom of the upper packaging plate (1) are fixed with mounting posts (21); the chip packaging plate (2) and the heat dissipation packaging plate (3) are provided with through holes (22) at positions corresponding to the mounting posts (21); a threaded hole (23) is provided at one end of the mounting post (21) away from the upper packaging plate (1); the mounting post (21) penetrates into the through hole (22) of the heat dissipation packaging plate (3); screws (24) are provided at the four through holes (22) at the bottom of the heat dissipation packaging plate (3); the screw body of the screw (24) is threadedly connected in the threaded hole (23).

8. The packaging structure of a heat dissipation integrated circuit chip according to claim 7, characterized in that: Four countersunk holes (25) are provided at the bottom of the heat dissipation packaging plate (3); the four countersunk holes (25) are coaxially arranged with the four through holes (22); the diameter of the countersunk holes (25) is larger than the diameter of the through holes (22); a sealing ring (26) is provided in the countersunk hole (25); the head of the screw (24) is located in the countersunk hole (25) and squeezes the sealing ring (26) to generate deformation.

9. The heat dissipation integrated circuit chip packaging structure according to claim 1, characterized in that: A first sealing ring (27) is fixed at the bottom of the upper packaging plate (1), a first annular groove (28) is provided at the top of the chip packaging plate (2) around the chip groove (4), and the first sealing ring (27) is interference fit in the first annular groove (28), a second sealing ring (29) is fixed at the bottom of the chip packaging plate (2), a second annular groove (30) is provided at the top of the heat dissipation packaging plate (3) around the heat dissipation groove (5), and the second sealing ring (29) is interference fit in the second annular groove (30).

10. The heat dissipation integrated circuit chip packaging structure according to claim 1, characterized in that: A plurality of heat dissipation slots (31) are provided at the bottom of the heat dissipation packaging plate (3), and the heat dissipation slots (31) are arranged to penetrate in a horizontal direction.

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