A heat dissipation structure based on three-dimensional heterogeneous and heterogeneous integrated radio frequency microsystem

Abstract

The present invention belongs to the field of radio frequency microsystem integration technology, and specifically relates to a heat dissipation structure based on a three-dimensional heterogeneous heterogeneous integrated radio frequency microsystem, which includes a packaging box and a heat dissipation component installed on the side wall of the packaging box, the heat dissipation component includes a U-shaped air duct and a fan, a plurality of packaging modules are installed inside the packaging box, and each packaging module is installed between two ports of the U-shaped air duct, a plurality of packaging modules are connected through BGA solder balls, fans are installed inside the two ports of the U-shaped air duct, and a packaging cover is provided on the top of the packaging box. Each packaging module in the present invention is installed between the two ports of the U-shaped air duct, and when each module inside the packaging box is working, the fan inside the U-shaped air duct drives the gas at the top of the packaging module to circulate to the bottom of the packaging module, thereby accelerating the gas flow between each packaging module, and achieving the effect of uniform heat dissipation of each packaging module while ensuring that the packaging box is sealed.

Description

Technical Field

[0001] The present invention belongs to the technical field of radio frequency microsystem integration, and in particular relates to a heat dissipation structure based on a three-dimensional heterogeneous heterogeneous integrated radio frequency microsystem. Background Art

[0002] As an advanced integrated packaging technology under the trend of system miniaturization, RF microsystem integration technology has become a major basic technology that leads equipment development and promotes electronic technology innovation. It is an important technical platform that supports the transformation of electronic information equipment capabilities in the fields of sensing and communications.

[0003] POP (Package on Package) is one of the most mainstream 3D packaging technologies. POP is composed of a top-layer packaging module, several middle-layer packaging modules and a bottom-layer packaging module in a stacked form. In order to ensure the stability of each module and prevent external dust and moisture from entering each module, the 3D package is generally a closed structure. The 3D packaged RF microsystem will generate a lot of heat during use, so it is necessary to cool the 3D packaged RF microsystem.

[0004] There are two heat dissipation methods for module packages in the prior art: heat sink technology and microfluidic technology. Heat sink technology uses a heat sink made of a material with high thermal conductivity to quickly absorb and conduct heat; microfluidic technology constructs a micron-level fluid channel inside the substrate to directly transport cooling liquid to the vicinity of the heat source to reduce the operating temperature of the device. However, the sealed cavity inside the three-dimensional package is a cube, and both heat sink technology and microfluidic technology are difficult to ensure regional heat dissipation between modules under the sealed structure of the package, which can easily lead to serious heat accumulation in the area where the modules are stacked, which is not conducive to the stable operation of the device. Summary of the invention

[0005] The purpose of the present invention is to provide a heat dissipation structure based on a three-dimensional heterogeneous heterogeneous integrated radio frequency microsystem to address the deficiencies in the prior art and to solve the technical problems in the prior art.

[0006] The objective of the present invention can be achieved through the following technical scheme: a heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem, which includes a packaging box and a heat dissipation component installed on the side wall of the packaging box, the heat dissipation component includes a U-shaped air duct and a fan, a plurality of packaging modules are installed inside the packaging box, and each packaging module is installed between two ports of the U-shaped air duct, the plurality of packaging modules are connected through BGA solder balls, fans are installed inside the two ports of the U-shaped air duct, and a packaging cover is installed on the top of the packaging box.

[0007] As a further optimization or improvement of this solution, the heat dissipation assembly also includes a ball groove and a liquid cooling ring. A ball groove is opened near the two ports of the U-shaped air duct. The liquid cooling ring is rotatably connected to the ball groove. The liquid cooling ring is connected to the fan through a branch pipe.

[0008] As a further optimization or improvement of the present solution, a rotating groove is provided in the ball groove, a rotating block is installed on the liquid cooling ring, and the rotating block is rotatably matched with the rotating groove.

[0009] As a further optimization or improvement of the present solution, an installation groove is provided on the inner wall of the packaging box, and a plurality of packaging modules are installed in the installation groove.

[0010] As a further optimization or improvement of the present scheme, an adjustment component is installed between the U-shaped air ducts, and the adjustment component includes an adjustment box and a diaphragm. The diaphragm divides the adjustment box into a transmission chamber and a sealing chamber. The sealing chamber is connected to the installation groove. A connecting shaft is slidably installed in the transmission chamber. A rotating rod is rotatably connected on the connecting shaft. The rotating rod is connected to the liquid cooling ring through a magnetic plate. A roller is rotatably installed on the adjustment box. The rotating rod passes through the roller and slidably cooperates with the roller. The diaphragm is connected to the connecting shaft through a connecting block.

[0011] As a further optimization or improvement of the present solution, a transverse groove is provided in the regulating box, and the connecting shaft is slidably matched with the transverse groove.

[0012] As a further optimization or improvement of the present solution, a liquid inlet and a liquid outlet are installed on the top of the liquid cooling ring, and a liquid filling cavity is opened in the liquid cooling ring.

[0013] Beneficial effects of the present invention:

[0014] (1) Each packaging module in the present invention is installed between the two ports of the U-shaped air duct. When each module inside the packaging box is working, the fan inside the U-shaped air duct drives the gas at the top of the packaging module to circulate to the bottom of the packaging module, thereby accelerating the gas flow between each packaging module, ensuring that the packaging box is sealed and achieving the effect of uniform heat dissipation for each packaging module.

[0015] (2) During installation, the present invention fixes the adapter plate of the packaging module in the installation groove so that the adapter plate blocks the sealing cavity. At this time, the sealing cavity forms a closed cavity. When the adapter plate generates severe heat during operation, the gas inside the sealing cavity expands and drives the diaphragm to bulge. At this time, the diaphragm pushes the connecting shaft to move through the connecting block. During the movement, the connecting shaft drives the rotating rod to rotate. The rotating rod drives the liquid cooling ring to rotate in the ball groove through the magnetic suction plate, so that the fan in the liquid cooling ring is aligned with the adapter plate. At this time, the gas will circulate along the two ends of the adapter plate of the packaging module, so that the gas can concentrate on dissipating heat on the adapter plate, thereby improving the uniformity of heat dissipation of the packaging module, making the overall temperature of the packaging module balanced, and improving the working efficiency of the devices and the adapter plate on the packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 It is an exploded view of the overall structure of the present invention.

[0019] Figure 3 Schematic diagram of the internal structure of the packaging box.

[0020] Figure 4 for Figure 3 Schematic diagram of the A part structure.

[0021] Figure 5 It is a schematic diagram of the plane structure of the adjustment component.

[0022] Figure 6 Schematic diagram of the location of the installation groove and the sealing cavity.

[0023] Figure 7 It is a schematic diagram of the three-dimensional structure of the adjustment component.

[0024] Figure 8 Schematic diagram of the liquid cooling ring and ball groove.

[0025] Fig. 9 This is a schematic diagram of the branch pipe and fan connection.

[0026] Fig.10 Schematic diagram of the structure of the liquid-filled cavity inside the liquid cooling ring.

[0027] The following are marked in the figure: 1. packaging box; 2. heat dissipation component; 21. U-shaped air duct; 22. ball groove; 23. liquid cooling ring; 24. fan; 25. rotating block; 26. rotating groove; 27. branch pipe; 28. liquid filling chamber; 29. ​​liquid inlet; 210. liquid outlet; 3. BGA solder ball; 4. packaging module; 5. cover; 6. mounting groove; 7. adjustment component; 71. adjustment box; 72. diaphragm; 73. transmission chamber; 74. sealing chamber; 75. connecting block; 76. connecting shaft; 77. horizontal groove; 78. rotating rod; 79. magnetic plate; 710. rotating roller. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 4 A heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem includes a packaging box 1 and a heat dissipation component 2 installed on the side wall of the packaging box 1, the heat dissipation component 2 includes a U-shaped air duct 21 and a fan 24, a plurality of packaging modules 4 are installed inside the packaging box 1, and each packaging module 4 is installed between two ports of the U-shaped air duct 21, the plurality of packaging modules 4 are connected through BGA solder balls 3, fans 24 are installed inside the two ports of the U-shaped air duct 21, and a packaging cover 5 is installed on the top of the packaging box 1.

[0030] Specifically, a rotating groove 26 is provided in the ball groove 22, and a rotating block 25 is installed on the liquid cooling ring 23, and the rotating block 25 is rotatably matched with the rotating groove 26. It should be noted that the liquid cooling ring 23 and the fan 24 therein can rotate in the ball groove 22.

[0031] It should be noted that each packaging module 4 is installed between the two ports of the U-shaped air duct 21. When the modules inside the packaging box 1 are working, the fan 24 inside the U-shaped air duct 21 drives the gas at the top of the packaging module 4 to circulate to the bottom of the packaging module 4, thereby accelerating the gas flow between the packaging modules 4, thereby achieving the effect of uniform heat dissipation for each packaging module 4.

[0032] See also Figure 6 and Figure 8 The heat dissipation component 2 also includes a ball groove 22 and a liquid cooling ring 23. The ball groove 22 is opened near the two end portions of the U-shaped air duct 21. The liquid cooling ring 23 is rotatably connected to the ball groove 22. The liquid cooling ring 23 is connected to the fan 24 through a branch pipe 27.

[0033] It should be noted that the liquid cooling ring 23 is filled with coolant. When the liquid cooling ring 23 is working, the fan 24 drives the gas at the top of the packaging module 4 to circulate to the bottom of the packaging module 4. At this time, the coolant in the liquid cooling ring 23 will cool the gas passing through the U-shaped air duct 21, thereby improving the heat dissipation efficiency of each packaging module 4 for uniform heat dissipation.

[0034] It should be noted that the liquid cooling ring 23 is connected to the branch pipe 27. When the coolant inside the liquid cooling ring 23 flows into the branch pipe 27, the branch pipe 27 can cool the fan 24 to prevent the heat generated by the motor of the fan 24 in the working state from affecting the heat dissipation effect of the packaging module 4.

[0035] See also Figure 3-Figure 8An adjusting assembly 7 is installed between the U-shaped air duct 21, and the adjusting assembly 7 includes an adjusting box 71 and a diaphragm 72. The diaphragm 72 divides the adjusting box 71 into a transmission chamber 73 and a sealing chamber 74. The sealing chamber 74 is communicated with the mounting groove 6. A connecting shaft 76 is slidably installed in the transmission chamber 73. A rotating rod 78 is rotatably connected on the connecting shaft 76. The rotating rod 78 is connected to the liquid cooling ring 23 through a magnetic plate 79. A rotating roller 710 is rotatably installed on the adjusting box 71. The rotating rod 78 penetrates the rotating roller 710 and slidably cooperates with the rotating roller 710. The diaphragm 72 is connected to the connecting shaft 76 through a connecting block 75.

[0036] Specifically, a mounting groove 6 is provided on the inner wall of the packaging box 1 , and a plurality of packaging modules 4 are installed in the mounting groove 6 .

[0037] It should be noted that the packaging module 4 includes an adapter board and the devices thereon. When the packaging module 4 is in operation, the adapter board and the devices thereon will generate heat together. The function of the adapter board is to vertically connect several packaging modules 4 through the BGA solder balls 3. In the initial state, see Figure 3 and Figure 6 The fan 24 in the liquid cooling ring 23 is aimed at the devices on the packaging module 4. The liquid cooling ring 23 drives the gas on the top of the packaging module 4 to flow toward the bottom of the packaging module 4 through the U-shaped air duct 21. The flowing gas mainly dissipates heat for the devices on the packaging module 4.

[0038] When the number of stacked packaging modules 4 is large, the transmission frequency of the adapter board will increase, so the working temperature of the adapter board will change significantly. Therefore, the heat dissipation of the adapter board needs to be considered. If the adapter board is not cooled in time, the connection structure between the packaging modules 4 and the packaging modules 4 will easily burn out, resulting in disconnection between the packaging modules 4 and the packaging modules 4.

[0039] During installation, the present invention fixes the adapter plate of the packaging module 4 in the installation groove 6, so that the adapter plate blocks the sealing cavity 74. At this time, the sealing cavity 74 forms a closed cavity. When the adapter plate is working and heating, the gas inside the sealing cavity 74 expands and drives the diaphragm 72 to bulge, so that the diaphragm 72 pushes the connecting shaft 76 to move through the connecting block 75. The connecting shaft 76 drives the rotating rod 78 to rotate during the movement. The rotating rod 78 drives the liquid cooling ring 23 to rotate in the ball groove 22 through the magnetic plate 79, so that the fan 24 in the liquid cooling ring 23 is aligned with the adapter plate. At this time, the gas will circulate along the two ends of the adapter plate of the packaging module 4, concentrate the heat dissipation of the adapter plate, improve the heat dissipation uniformity of the packaging module 4, make the overall temperature of the packaging module 4 balanced, and improve the working efficiency of the devices and adapter plates on the packaging module 4. The present invention adjusts the direction of the fan 24 according to the heating state of the packaging module 4, so that the fan 24 can dissipate the heat of the adapter plate and the device respectively, thereby ensuring the uniformity of the heat dissipation of the packaging module 4. The fan 24 can dissipate heat for a large number of packaging modules 4 packaging bodies.

[0040] It should be noted that the U-shaped air duct 21 is made of non-magnetic metal, and the liquid cooling ring 23 is made of magnetic metal. Therefore, the magnetic attraction plate 79 can attract the liquid cooling ring 23 through the ball groove 22 .

[0041] See also Figure 5 A transverse groove 77 is provided in the regulating box 71 , and the connecting shaft 76 is slidably matched with the transverse groove 77 .

[0042] It should be noted that see Figure 5 The transverse groove 77 is a horizontal groove. When the diaphragm 72 is raised, the diaphragm 72 will drive the connecting shaft 76 to move horizontally through the connecting block 75. At this time, the connecting shaft 76 drives the rotating rod 78 to rotate. At the same time, the magnetic plate 79 will slide along the outer wall of the ball groove 22. Since the magnetic plate 79 and the liquid cooling ring 23 are attracted to each other, the sliding of the magnetic plate 79 will drive the liquid cooling ring 23 to rotate, thereby adjusting the direction of the fan 24.

[0043] See also Fig.10 A liquid inlet 29 and a liquid outlet 210 are installed on the top of the liquid cooling ring 23, and a liquid filling cavity 28 is opened in the liquid cooling ring 23.

[0044] It should be noted that the liquid cooling ring 23 is connected to a circulation pump, wherein the circulation pump drives the cooling liquid to enter the liquid filling cavity 28 through the liquid inlet 29 and then output from the liquid filling cavity 28 through the liquid outlet 210 .

[0045] The implementation principle of the present invention is:

[0046] During installation of the present invention, each packaging module 4 is installed between two ports of the U-shaped air duct 21, and the adapter plate of the packaging module 4 is fixedly installed in the installation groove 6, so that the adapter plate blocks the sealing cavity 74, and the sealing cavity 74 forms a closed cavity.

[0047] When each module inside the packaging box 1 is working, the fan 24 drives the gas on the top of the packaging module 4 to circulate through the U-shaped air duct 21 to the bottom of the packaging module 4, thereby accelerating the gas flow between each packaging module 4, and achieving the effect of uniform heat dissipation of each packaging module 4. Since the fan 24 in the liquid cooling ring 23 is aimed at the components on the packaging module 4, the flowing gas mainly dissipates heat for the components on the packaging module 4.

[0048] When the adapter plate on the packaging module 4 generates severe heat during operation, the expansion of the gas inside the sealing cavity 74 drives the diaphragm 72 to bulge, so that the diaphragm 72 pushes the connecting shaft 76 to move through the connecting block 75. The connecting shaft 76 drives the rotating rod 78 to rotate during the movement. The rotating rod 78 drives the liquid cooling ring 23 to rotate in the ball groove 22 through the magnetic plate 79, so that the fan 24 in the liquid cooling ring 23 is aligned with the adapter plate. At this time, the gas will circulate along the two ends of the adapter plate of the packaging module 4, concentrate the heat dissipation on the adapter plate, improve the heat dissipation uniformity of the packaging module 4, balance the overall temperature of the packaging module 4, and improve the working efficiency of the devices and the adapter plate on the packaging module 4.

[0049] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem, characterized in that: The invention comprises a packaging box (1) and a heat dissipation component (2) mounted on a side wall of the packaging box (1), the heat dissipation component (2) comprising a U-shaped air duct (21) and a fan (24), a plurality of packaging modules (4) are mounted inside the packaging box (1), and each packaging module (4) is mounted between two ports of the U-shaped air duct (21), the plurality of packaging modules (4) are connected via BGA solder balls (3), a fan (24) is mounted inside the two ports of the U-shaped air duct (21), and a packaging cover (5) is mounted on the top of the packaging box (1); An adjusting component (7) is installed between the U-shaped air ducts (21), the adjusting component (7) comprising an adjusting box (71) and a diaphragm (72), the diaphragm (72) dividing the adjusting box (71) into a transmission chamber (73) and a sealing chamber (74), the sealing chamber (74) being in communication with the installation groove (6), a connecting shaft (76) being slidably installed in the transmission chamber (73), a rotating rod (78) being rotatably connected on the connecting shaft (76), the rotating rod (78) being connected to the liquid cooling ring (23) via a magnetic attraction plate (79), a rotating roller (710) being rotatably installed on the adjusting box (71), the rotating rod (78) penetrating the rotating roller (710) and slidably cooperating with the rotating roller (710), and the diaphragm (72) being connected to the connecting shaft (76) via a connecting block (75); A transverse groove (77) is provided in the regulating box (71), and the connecting shaft (76) is slidably engaged with the transverse groove (77).

2. According to claim 1, a heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem is characterized in that: The heat dissipation component (2) further comprises a ball groove (22) and a liquid cooling ring (23); the ball groove (22) is provided near two ports of the U-shaped air duct (21); the liquid cooling ring (23) is rotatably connected to the ball groove (22); and the liquid cooling ring (23) is connected to the fan (24) via a branch pipe (27).

3. The heat dissipation structure based on a three-dimensional heterogeneous heterogeneous integrated radio frequency microsystem according to claim 2, characterized in that: A rotating groove (26) is provided in the ball groove (22), a rotating block (25) is mounted on the liquid cooling ring (23), and the rotating block (25) is rotatably matched with the rotating groove (26).

4. The heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem according to claim 1, characterized in that: An installation groove (6) is provided on the inner wall of the packaging box (1), and a plurality of packaging modules (4) are installed in the installation groove (6).

5. The heat dissipation structure based on a three-dimensional heterogeneous heterogeneous integrated radio frequency microsystem according to claim 3, characterized in that: A liquid inlet (29) and a liquid outlet (210) are installed on the top of the liquid cooling ring (23), and a liquid filling cavity (28) is provided in the liquid cooling ring (23).

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