Microphone and electronic device

Abstract

The invention discloses a microphone and electronic equipment, and relates to the technical field of microphones, the microphone comprises a substrate, a shell, a chip assembly and an electronic component, the substrate comprises a top layer, a first conductive layer, an insulating layer and a second conductive layer which are sequentially arranged along a first direction; the first direction is the direction along the thickness of the substrate; the shell covers the substrate, the shell and the substrate define an accommodating cavity, and the substrate is provided with a pickup hole communicated with the accommodating cavity; the chip assembly comprises a pickup module and a signal processing module which are in signal connection, and the pickup module is located in the accommodating cavity; the electronic component is electrically connected with the signal processing module; the electronic component is embedded in the insulating layer, and the two ends of the electronic component are electrically connected with the first conductive layer and the second conductive layer respectively. The electronic component is embedded in the insulating layer between the first conductive layer and the second conductive layer, so that the specification of the electronic component can be flexibly selected, the thickness of the substrate is not additionally increased, and the selectable specification of the electronic component is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of microphones, and in particular to a microphone and an electronic device. Background Art

[0002] The capacitors and resistors in the electronic components of existing MEMS microphones are generally arranged in the form of flat capacitors and flat resistors. For example, the design of flat capacitors and flat resistors is adopted on the substrate. This design is limited by the development trend of lightweight and thin substrate design. Thinner capacitors are usually used for laying to avoid the increase of the overall thickness of the substrate due to the increase of capacitor thickness. Then, the thinner the capacitor, the greater the capacitance will be, which leads to the limitation of capacitor specification selection. Only capacitors with larger capacitance can be selected. Similarly, the design of flat resistors will also be limited by the development trend of lightweight and thin substrate design. Only thinner resistors can be selected, which leads to the limitation of resistor specification selection. Summary of the invention

[0003] The main purpose of the present invention is to provide a microphone and an electronic device, aiming to solve the technical problem of limited selection of electronic component specifications in the related art.

[0004] To achieve the above object, the microphone provided by the present invention comprises:

[0005] A substrate, the substrate comprising a top layer, a first conductive layer, an insulating layer, and a second conductive layer arranged in sequence along a first direction; the first direction is a direction along the thickness of the substrate;

[0006] A shell, the shell is covered on the substrate and forms a receiving cavity with the substrate, and the substrate is provided with a sound pickup hole connected to the receiving cavity;

[0007] A chip assembly, the chip assembly comprising a signal-connected sound pickup module and a signal processing module, the sound pickup module being located in the accommodating cavity;

[0008] An electronic component, wherein the electronic component is electrically connected to the signal processing module; the electronic component is buried in the insulating layer, and two ends of the electronic component are electrically connected to the first conductive layer and the second conductive layer respectively; wherein the electronic component includes at least one of a capacitor or a resistor.

[0009] In one embodiment, the microphone also includes a conductive component, which includes a first conductive member and a second conductive member buried in the insulating layer, wherein two ends of the first conductive member are respectively connected to the first conductive layer and one end of the electronic component; two ends of the second conductive member are respectively connected to the second conductive layer and the other end of the electronic component.

[0010] In one embodiment, the electronic component includes a body and a first copper pin and a second copper pin arranged at both ends of the body, the first conductive layer includes a first copper foil layer, the second conductive layer includes a second copper foil layer, the first conductive member includes a first copper column, the second conductive member includes a second copper column, the two ends of the first copper column are respectively connected to the first copper foil layer and the first copper pin, and the two ends of the second copper column are respectively connected to the second copper foil layer and the second copper pin.

[0011] In one embodiment, the surface of the first copper pin is plated with a first nickel-gold layer;

[0012] And / or, the surface of the second copper pin is plated with a second nickel-gold layer.

[0013] In one embodiment, the length direction of the electronic component is arranged parallel to the first direction;

[0014] Alternatively, the length direction of the electronic component is arranged perpendicular to the first direction.

[0015] In one embodiment, the signal processing module is located in the accommodating cavity, and the sound pickup module and the signal processing module are both arranged on the top layer;

[0016] The top layer is provided with a pad, the microphone further comprises a first gold wire, and the signal processing module is electrically connected to the first conductive layer through the first gold wire and the pad;

[0017] And / or, the microphone further includes a second gold wire, and the signal processing module is electrically connected to the sound pickup module via the second gold wire.

[0018] In one embodiment, the substrate also includes a third conductive layer and a fourth conductive layer, the insulating layer includes a first layer, a second layer and a third layer, the first conductive layer, the first layer, the third conductive layer, the second layer, the fourth conductive layer, the third layer and the second conductive layer are stacked in sequence along the first direction, and the third conductive layer and the fourth conductive layer are respectively provided with a first avoidance hole and a second avoidance hole for avoiding the electronic components.

[0019] In one embodiment, a receiving groove is provided on the top of the substrate, the sound pickup hole is provided on the bottom wall of the receiving groove, and the microphone further includes a support plate and a waterproof breathable membrane covering the sound pickup hole; the support plate cover is arranged on the notch of the receiving groove, the sound pickup module and the signal processing module are both arranged on the side of the support plate away from the substrate, and the support plate is provided with a connecting hole connected to the receiving groove.

[0020] In one embodiment, the substrate also includes a third conductive layer and a fourth conductive layer, the insulating layer includes a first layer, a second layer and a third layer, the first conductive layer, the first layer, the third conductive layer, the second layer, the fourth conductive layer, the third layer and the second conductive layer are stacked in sequence along the first direction, and the third conductive layer and the fourth conductive layer are respectively provided with a first avoidance hole and a second avoidance hole for avoiding the electronic components.

[0021] In one embodiment, the signal processing module includes an ASIC chip and a sensor chip, and the electronic components are electrically connected to the ASIC chip;

[0022] The ASIC chip is buried in the second layer, one end of the ASIC chip is electrically connected to the third conductive layer, and the other end of the ASIC chip is electrically connected to the fourth conductive layer; the ASIC chip and the electronic components are spaced apart along a second direction, and the first direction is perpendicular to the second direction;

[0023] And / or, the sensor chip is buried in the second layer, one end of the sensor chip is electrically connected to the third conductive layer, and the other end of the sensor chip is electrically connected to the fourth conductive layer; the sensor chip and the electronic components are spaced apart along a second direction, and the first direction is perpendicular to the second direction.

[0024] In one embodiment, a receiving groove is provided on the top of the substrate, the sound pickup hole is provided on the bottom wall of the receiving groove, and the microphone further includes a waterproof breathable membrane, which covers the sound pickup hole; the waterproof breathable membrane and the electronic components are arranged at intervals along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0025] The present invention also provides a microphone, comprising:

[0026] substrate;

[0027] A shell, the shell is covered on the substrate and forms a receiving cavity with the substrate, and the substrate is provided with a sound pickup hole connected to the receiving cavity;

[0028] A chip assembly, the chip assembly comprising a sound pickup module and a signal processing module connected by signals, the sound pickup module and the signal processing module are both located in the accommodating cavity;

[0029] An electronic component, wherein the electronic component is electrically connected to the signal processing module, the electronic component is located in the accommodating cavity, and the electronic component is arranged on the substrate; wherein the electronic component includes at least one of a capacitor or a resistor.

[0030] In one embodiment, the electronic component includes a capacitor, which includes an alloy body, a protective layer and two electrodes, the alloy body includes a main body and ends arranged at both ends of the main body, each of the electrodes includes a copper-plated electrode, a nickel-plated electrode and a tin-plated electrode, the protective layer is arranged around the periphery of the main body, the electrodes are arranged one-to-one with the ends, and the periphery of each of the ends is surrounded by the copper-plated electrode, the nickel-plated electrode and the tin-plated electrode in sequence from the inside to the outside.

[0031] The present invention further provides an electronic device, comprising the above-mentioned microphone.

[0032] The technical solution of the present invention buries the electronic components in the insulating layer between the first conductive layer and the second conductive layer, so that the specifications of the electronic components can be flexibly selected within the capacity of the insulating layer without additionally increasing the thickness of the substrate. Taking capacitors and resistors as an example, this arrangement increases the selectable specifications of capacitors and resistors. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0034] Figure 1 A schematic cross-sectional view of an embodiment of a microphone provided by the present invention in which electronic components are arranged on the top of a substrate;

[0035] Figure 2 A schematic cross-sectional view of another embodiment of the microphone provided by the present invention in which electronic components are arranged on the top of the substrate;

[0036] Figure 3 A schematic cross-sectional view of an embodiment of a microphone provided by the present invention in which electronic components are buried in an insulating layer;

[0037] Figure 4 for Figure 3 Schematic diagram of the structure of the middle part;

[0038] Figure 5 A schematic cross-sectional view of another embodiment of the microphone provided by the present invention in which electronic components are buried in an insulating layer;

[0039] Figure 6 for Figure 5 Schematic diagram of the structure of the middle part;

[0040] Figure 7A schematic cross-sectional view of an embodiment of the microphone provided by the present invention in which a chip assembly is arranged on a support plate;

[0041] Figure 8 A schematic cross-sectional view of an embodiment of a microphone provided by the present invention in which a signal processing module is buried in an insulating layer;

[0042] Fig. 9 A schematic cross-sectional view of a capacitor according to an embodiment of the present invention.

[0043] Description of Figure Numbers:

[0044] 100. Microphone; 1. Substrate; 11. Top layer; 12. First conductive layer; 13. Insulating layer; 131. First layer; 132. Second layer; 133. Third layer; 14. Second conductive layer; 15. Third conductive layer; 151. First avoidance hole; 16. Fourth conductive layer; 161. Second avoidance hole; 17. Pickup hole; 18. Accommodation groove; 2. Shell; 21. Accommodation cavity; 3. Chip assembly; 31. Pickup module; 32. Signal processing module; 4. Electronic components; 41. Capacitor; 411. Alloy body; 412. Protective layer; 413. Electrode; 4131. Copper-plated electrode; 4132. Nickel-plated electrode; 4133. Tin-plated electrode; 5. First gold wire; 6. Second gold wire; 7. Support plate; 71. Connecting hole; 8. Waterproof and breathable membrane; 9. Conductive assembly; 91. First conductive member; 92. Second conductive member.

[0045] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0048] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0049] The capacitors and resistors in the electronic components of existing MEMS microphones are generally arranged in the form of flat capacitors and flat resistors. For example, the design of flat capacitors and flat resistors is adopted on the substrate. This design is limited by the development trend of lightweight and thin substrate design. Thinner capacitors are usually used for laying to avoid the increase of the overall thickness of the substrate due to the increase of capacitor thickness. Then, the thinner the capacitor, the greater the capacitance will be, which leads to the limitation of capacitor specification selection. Only capacitors with larger capacitance can be selected. Similarly, the design of flat resistors will also be limited by the development trend of lightweight and thin substrate design. Only thinner resistors can be selected, which leads to the limitation of resistor specification selection.

[0050] The inventors have found that the existing capacitors and resistors are generally arranged in a flat form. For example, there are a first copper layer, a first insulating layer, and a second copper layer on the substrate, which are arranged in sequence along the thickness direction of the substrate. If a solution of flattening the capacitors and resistors in the substrate is adopted, it is necessary to additionally stack a capacitor layer, a second insulating layer, a resistor layer, and a third insulating layer in sequence between the first insulating layer and the second conductive layer. The capacitor is flattened on the capacitor layer, and the capacitor layer is electrically connected to the first conductive layer by means of copper pillars so that the capacitor can be electrically connected to the ASIC chip arranged above the substrate. It can be seen from this that the existing solution of flattening capacitors and resistors will cause the substrate to add four layers of structures, namely, a capacitor layer, a second insulating layer, a resistor layer, and a third insulating layer, on the original basis, resulting in an increase in the thickness of the substrate. In order to adapt to the development trend of thinning substrates, the thickness of each layer can only be reduced, resulting in the existing capacitor layer can only flatten capacitors with thinner thickness. According to the basic formula of capacitor C=∈×S / d, C is the capacitance value, ∈ is the dielectric constant, S is the electrode area, and d is the dielectric thickness. From this formula, we can see that the capacitance value is inversely proportional to the dielectric thickness, that is, the smaller the dielectric thickness, the larger the capacitance value. This means that the thinner the capacitor, the larger the capacitance value. The larger the capacitance value, the easier it is for the capacitor to be broken down. This is because the working principle of the capacitor is to use the electric field between the conductor plates to store charge. When the intensity of the electric field reaches the breakdown electric field intensity of the insulating medium between the conductor plates, the capacitor will lose its insulation ability, and the current between the conductor plates will increase rapidly, causing the capacitor to break down. Capacitors with large capacitance values ​​are more likely to reach their breakdown voltage, making them more likely to be broken down and short-circuited. After the capacitor is broken down, it will expand and contract due to heat and cold, causing the resistor on the surface of the substrate to easily break and open the circuit; however, even if the design can increase the capacitance value by making the capacitor thinner, its capacitance value is still relatively small. The capacitance of the capacitor set on the capacitor layer is generally less than 100pF, and the resistor set on the resistor layer is generally less than 50 ohms. There are fewer specifications to choose from, which leads to the fact that in circuit design, only capacitors and resistors of these specifications can be selected, resulting in poor selection flexibility, making it difficult for the circuit to select capacitors and resistors of appropriate specifications to design a suitable filter circuit, which leads to poor radiation resistance and ESD (Electrostatic Discharge) resistance of the entire circuit.

[0051] The present invention provides a microphone, aiming to solve the technical problem of limited selection of electronic components specifications in the related art.

[0052] See also Figure 3 , Figure 5 and Figure 7In one embodiment of the present invention, the microphone 100 includes a substrate 1, a shell 2, a chip assembly 3 and an electronic component 4, the substrate 1 includes a top layer 11, a first conductive layer 12, an insulating layer 13 and a second conductive layer 14 arranged in sequence along a first direction; the first direction is a direction along the thickness of the substrate 1; the shell 2 is covered on the substrate 1 and forms a receiving cavity 21 with the substrate 1, and the substrate 1 is provided with a pickup hole 17 connected to the receiving cavity 21; the chip assembly 3 includes a signal-connected pickup module 31 and a signal processing module 32, and the pickup module 31 is located in the receiving cavity 21; the electronic component 4 is electrically connected to the signal processing module 32; the electronic component 4 is buried in the insulating layer 13, and the two ends of the electronic component 4 are electrically connected to the first conductive layer 12 and the second conductive layer 14 respectively, wherein the electronic component 4 includes at least one of a capacitor or a resistor.

[0053] Among them, the electronic component 4 is buried in the insulating layer 13. For the convenience of explanation, the electronic component 4 is explained by taking the capacitor 41 as an example; the thickness of the existing capacitor 41 is limited by the design trend of thinning PCB and the circuit stability (reducing the risk of the capacitor 41 being broken down). The former requires that the thickness of the existing flat capacitor 41 cannot be too large, otherwise it will cause the PCB thickness to increase, and the latter requires that the thickness of the existing flat capacitor 41 cannot be too small, otherwise it will easily be broken down, resulting in reduced circuit stability. Therefore, the existing capacitor 41 is limited by the thickness and cannot be flexibly selected, resulting in limited optional specifications of the capacitor 41; in this embodiment, since the capacitor 41 is buried in the insulating layer 13, the long side of the capacitor 41 can extend along the length direction, width direction or thickness direction of the insulating layer 13, so that the length of the capacitor 41 can be increased or decreased along the thickness direction of the insulating layer 13, and the width of the capacitor 41 can be increased or decreased along the thickness direction of the insulating layer 13. 13, and the thickness of the capacitor 41 can increase or decrease along the width direction of the insulating layer 13. For example, the selection of the capacitor 41 can be flexibly selected as long as it is within the accommodation range of the insulating layer 13. Because when the thickness of the insulating layer 13 remains unchanged, the change in the thickness of the capacitor 41 buried in the insulating layer 13 will not cause the overall thickness of the substrate 1 to increase. Therefore, the thickness of the capacitor 41 of this embodiment can be flexibly increased or decreased under the condition that the insulating layer 13 can accommodate it, thereby greatly increasing the specifications of the capacitor 41 that can be selected. With the increase in the optional specifications of the capacitor 41, the capacitance range of the capacitor 41 that can be selected is also effectively increased, that is, a capacitor 41 with a larger or smaller capacitance 41 value can be selected, so that the capacitor 41 can better adapt to the circuit design, thereby enhancing the flexibility of the circuit design and the circuit's radiation resistance and ESD resistance. Among them, the electronic components 4 also include resistors, and the resistors are buried in the insulating layer 13. The beneficial effect is similar to that of burying the capacitor 41 in the insulating layer 13. It can also effectively increase the optional specifications of the resistors. At the same time, it can also better adapt to the circuit design, so that the circuit can better select resistors of appropriate specifications according to needs, thereby increasing the circuit's radiation resistance and ESD resistance.

[0054] It should be noted that the electronic component 4 is buried in the insulating layer 13, wherein the electronic component 4 takes the capacitor 41 as an example. The capacitor 41 buried in the insulating layer 13 does not increase the thickness of the circuit board. Compared with the PCB in the existing design, when the thickness of the first conductive layer 12 is equal to the thickness of the first copper layer, the thickness of the insulating layer 13 is equal to the thickness of the first insulating layer, and the thickness of the second conductive layer 14 is equal to the thickness of the second copper layer, the existing PCB design also has an additional capacitor 41 layer and a second insulating layer, which makes its thickness definitely greater than the thickness of the substrate 1 of this embodiment. Therefore, in this embodiment, the thickness of the substrate 1 is effectively reduced by burying the electronic component 4 in the insulating layer 13.

[0055] It should also be noted that, taking the electronic component 4 as the capacitor 41 as an example, the pressing of the existing PCB also requires the additional arrangement of the capacitor 41 layer and the second insulating layer, that is, compared with the substrate 1 of the present embodiment, the pressing of the existing PCB has an additional pressing step of the capacitor 41 layer and the second insulating layer. However, since the electronic component 4 of the substrate 1 of the present embodiment is buried in the insulating layer 13, there is no need for the additional capacitor 41 layer and the second insulating layer. Therefore, the step of introducing the capacitor 41 layer and the second insulating layer during the pressing process of the substrate 1 is omitted, thereby simplifying the manufacturing process of the substrate 1.

[0056] It is also necessary to explain that, compared with setting the capacitor 41 and the resistor on the top surface of the substrate 1, since the electronic component 4 of this embodiment is buried in the insulating layer 13, the substrate 1 does not need to set up additional areas for the capacitor 41 and the resistor, so that the length and / or width dimensions of the substrate 1 can be reduced, thereby reducing the size of the substrate 1; if the size of the substrate 1 remains unchanged, since the capacitor 41 and the resistor are missing from the accommodating cavity 21, the accommodating cavity 21 has more space occupied by the original capacitor 41 and the resistor, thereby increasing the volume of the back cavity of the microphone 100, and effectively improving the signal-to-noise ratio of the microphone 100. The back cavity is a cavity located on the back side of the diaphragm of the MEMS chip, which can also be called a back cavity.

[0057] It should be noted that the sound pickup module 31 and the signal processing module 32 can both be arranged on the substrate 1 , the sound pickup module 31 and the signal processing module 32 can also be arranged on the inner wall of the shell 2 , and the signal processing module 32 can also be stacked on top of the sound pickup module 31 .

[0058] See also Figures 3 to 8In one embodiment, the microphone 100 further includes a conductive component 9, which includes a first conductive member 91 and a second conductive member 92 buried in the insulating layer 13, wherein two ends of the first conductive member 91 are respectively connected to the first conductive layer 12 and one end of the electronic component 4; and two ends of the second conductive member 92 are respectively connected to the second conductive layer 14 and the other end of the electronic component 4. By providing the first conductive member 91 and the second conductive member 92 buried in the insulating layer 13, and connecting the first conductive member 91 and the second conductive member 92 to the two ends of the electronic component 4 respectively, the first conductive layer 12 can be electrically connected to one end of the electronic component 4 through the first conductive member 91, and similarly, the second conductive layer 14 can be electrically connected to the other end of the electronic component 4 through the second conductive member 92.

[0059] In one embodiment, the electronic component 4 includes a body and a first copper pin and a second copper pin disposed at both ends of the body, the first conductive layer 12 includes a first copper foil layer, the second conductive layer 14 includes a second copper foil layer, the first conductive member 91 includes a first copper column, the second conductive member 92 includes a second copper column, the two ends of the first copper column are respectively connected to the first copper foil layer and the first copper pin, and the two ends of the second copper column are respectively connected to the second copper foil layer and the second copper pin. By providing the first copper pin, the first copper pin can be better connected to the first copper column, and by providing the second copper pin, the second copper pin can be better connected to the second copper column.

[0060] In one embodiment, a first nickel-gold layer is plated on the surface of the first copper pin; by plating the first nickel-gold layer on the surface of the first copper pin, the corrosion resistance of the first copper pin is effectively improved.

[0061] In one embodiment, a second nickel-gold layer is plated on the surface of the second copper pin. By plating the second nickel-gold layer on the surface of the second copper pin, the corrosion resistance of the second copper pin is effectively improved.

[0062] See also Figure 5 and Figure 6 In one embodiment, the length direction of the electronic component 4 is arranged parallel to the first direction; that is, the electronic component 4 can be placed vertically to adapt to the scene with vertical installation requirements; wherein, the vertically placed electronic component 4 can effectively reduce the length dimensions of the first copper column and the second copper column compared to the horizontally placed electronic component 4.

[0063] See also Figure 3 and Figure 4 In one embodiment, the length direction of the electronic component 4 is perpendicular to the first direction. That is, the electronic component 4 can be placed horizontally to adapt to the scene where horizontal installation is required; wherein, the horizontally placed electronic component 4 can effectively reduce the thickness of the substrate 1 compared with the vertically placed electronic component 4.

[0064] Among them, the electronic components 4 are buried in the insulating layer 13, and the electronic components 4 can be placed vertically or horizontally, which increases the flexibility of the arrangement of the electronic components 4, so that the position and placement angle of the electronic components 4 can be flexibly selected according to the circuit design. It should be noted that the electronic components 4 are buried in the insulating layer 13 using the Fan-Out process. Among them, the Fan-Out process is an advanced semiconductor packaging technology, which is mainly used to increase the I / O density of the chip, reduce the package size, and improve the electrical performance. The Fan-Out process solves the contradiction between the reduction of chip size and the increase in the number of I / O points in traditional packaging technology by performing more I / O wiring outside the boundary of the chip.

[0065] See also Figure 3 and Figure 5 In one embodiment, the signal processing module 32 is located in the accommodating cavity 21, and the sound pickup module 31 and the signal processing module 32 are both arranged on the top layer 11; the top layer 11 is provided with a pad, and the microphone 100 further includes a first gold wire 5, and the signal processing module 32 is electrically connected to the first conductive layer 12 through the first gold wire 5 and the pad; and / or, the microphone 100 further includes a second gold wire 6, and the signal processing module 32 is electrically connected to the sound pickup module 31 through the second gold wire 6. By providing the first gold wire 5, the electrical connection between the signal processing module 32 and the first conductive layer 12 is achieved, and then the electrical connection with the electronic component 4 is achieved; by providing the second gold wire 6, the electrical connection between the signal processing module 32 and the sound pickup module 31 is achieved.

[0066] See also Figure 7 In one embodiment, the substrate 1 further includes a third conductive layer 15 and a fourth conductive layer 16, the insulating layer 13 includes a first layer 131, a second layer 132 and a third layer 133, the first conductive layer 12, the first layer 131, the third conductive layer 15, the second layer 132, the fourth conductive layer 16, the third layer 133 and the second conductive layer 14 are sequentially stacked along the first direction, and the third conductive layer 15 and the fourth conductive layer 16 are respectively provided with a first avoidance hole 151 and a second avoidance hole 161 for avoiding the electronic components 4. The third conductive layer 15 and the fourth conductive layer 16 are provided to enrich the circuit layout of the substrate 1 so as to realize the design of complex circuits, the first avoidance hole 151 is provided to avoid the electronic components 4 so that the electronic components 4 are not connected to the third conductive layer 15, and the second avoidance hole 161 is provided to avoid the electronic components 4 so that the electronic components 4 are not connected to the fourth conductive layer 16. It should be noted that the electronic components 4 can be located in any layer of the first layer 131, the second layer 132 and the third layer 133, or in any two adjacent layers, or the first layer 131, the second layer 132 and the third layer 133 can all be provided with electronic components 4, and there is no limitation here.

[0067] In one embodiment, a receiving groove 18 is provided at the top of the substrate 1, and a sound pickup hole 17 is provided at the bottom wall of the receiving groove 18. The microphone 100 further includes a waterproof breathable membrane 8 and a support plate 7. The waterproof breathable membrane 8 covers the sound pickup hole 17. The support plate 7 covers the notch of the receiving groove 18. The sound pickup module 31 and the signal processing module 32 are both provided on the side of the support plate 7 away from the substrate 1. The support plate 7 is provided with a connecting hole 71 connected to the receiving groove 18. The supporting plate 7 is provided to provide reliable support for the sound pickup module 31 and the signal processing module 32, and the waterproof breathable membrane 8 is provided to increase the waterproof performance of the microphone 100. It should be noted that the connecting hole 71 can be provided toward the sound pickup module 31; the connecting hole 71 can also be arranged in a staggered manner with the sound pickup module 31, that is, the connecting hole 71 is connected to the receiving groove 18 and the receiving cavity 21 respectively.

[0068] See also Figure 7 and Figure 8In one embodiment, the substrate 1 further includes a third conductive layer 15 and a fourth conductive layer 16, the insulating layer 13 includes a first layer 131, a second layer 132 and a third layer 133, the first conductive layer 12, the first layer 131, the third conductive layer 15, the second layer 132, the fourth conductive layer 16, the third layer 133 and the second conductive layer 14 are stacked in sequence along a first direction, and the third conductive layer 15 and the fourth conductive layer 16 are respectively provided with a first avoidance hole 151 and a second avoidance hole 161 for avoiding the electronic component 4; the signal processing module 32 includes an ASIC chip and a sensor chip, and the electronic component 4 Both are electrically connected to the ASIC chip; the ASIC chip is buried in the second layer 132, one end of the ASIC chip is electrically connected to the third conductive layer 15, and the other end of the ASIC chip is electrically connected to the fourth conductive layer 16; the ASIC chip and the electronic component 4 are spaced apart along the second direction, and the first direction is perpendicular to the second direction; and / or, the sensor chip is buried in the second layer 132, one end of the sensor chip is electrically connected to the third conductive layer 15, and the other end of the sensor chip is electrically connected to the fourth conductive layer 16; the sensor chip and the electronic component 4 are spaced apart along the second direction, and the first direction is perpendicular to the second direction. In the traditional design of flattened capacitors 41 and resistors, if the ASIC chip and / or sensor chip are buried in the second layer 132, and then the capacitors 41 and resistors are flattened, it is difficult to implement on the one hand, and on the other hand, the thickness of the substrate 1 will be greatly increased, which does not conform to the development trend of lightweight. In this embodiment, since the electronic components 4 of this embodiment are buried in the insulating layer 13, the thickness of the substrate 1 will not increase, so it can better adapt to the design of burying the ASIC chip and / or sensor chip in the second layer 132. Compared with the flattened capacitors 41 and resistors, this design effectively reduces the thickness of the substrate 1, thereby reducing the microphone. 100; and the ASIC chip and / or the sensor chip are buried in the second layer 132, the area originally used to place the ASIC chip and the sensor chip can be omitted, so that the length and width dimensions of the substrate 1 can be reduced, and then the length and width dimensions of the microphone 100 can be reduced; compared with the solution of setting the ASIC chip and the sensor chip on the top of the substrate 1, this embodiment buries the ASIC chip and / or the sensor chip in the second layer 132, if the length and width dimensions of the substrate 1 are not reduced, it is equivalent to expanding the volume of the back cavity, thereby improving the acoustic performance signal-to-noise ratio of the microphone 100.

[0069] In one embodiment, a receiving groove 18 is provided on the top of the substrate 1, and a sound pickup hole 17 is provided on the bottom wall of the receiving groove 18. The microphone 100 further includes a waterproof breathable membrane 8, which covers the sound pickup hole 17. The waterproof breathable membrane 8 and the electronic components 4 are arranged in a spaced relationship along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other. The waterproof performance of the microphone 100 is effectively increased by providing the waterproof breathable membrane 8. It should be noted that the first direction is Figure 7 The up and down directions shown, the second direction is Figure 8 The front and rear directions shown are Fig. 9 Left and right directions shown.

[0070] In one embodiment, the electronic component 4 includes a capacitor 41 and a resistor, and both the capacitor 41 and the resistor are electrically connected to the signal processing module 32. By selecting capacitors 41 and resistors of appropriate specifications, a suitable filter circuit can be designed to enhance the anti-interference and anti-ESD performance of the circuit.

[0071] See also Figure 1 and Figure 2 The present invention also proposes a microphone 100, including a substrate 1, a shell 2, a chip assembly 3 and an electronic component 4, the shell 2 is covered on the substrate 1 and forms a receiving cavity 21 with the substrate 1, and the substrate 1 is provided with a pickup hole 17 connected to the receiving cavity 21; the chip assembly 3 includes a signal-connected pickup module 31 and a signal processing module 32, and the pickup module 31 and the signal processing module 32 are both located in the receiving cavity 21; the electronic component 4 is electrically connected to the signal processing module 32, the electronic component 4 is located in the receiving cavity 21, and the electronic component 4 is arranged on the substrate 1; the electronic component 4 includes at least one of a capacitor or a resistor. By arranging the electronic component 4 on the top of the substrate 1, the size of the electronic component 4 will not affect the thickness of the substrate 1, thereby increasing the available specifications of the electronic component 4. Taking the capacitor 41 and the resistor as examples, there are many available specifications of the capacitor 41, and the range of the capacitance 41 value of the available capacitor 41 will also increase accordingly. There are many available specifications of the resistor, and the range of the resistance value of the available resistor will also increase accordingly. By selecting capacitors 41 and resistors of appropriate specifications to design a suitable filter circuit, the anti-interference and anti-ESD performance of the circuit is enhanced. In addition, compared with the flat capacitors 41 and resistors, since the electronic component 4 of this embodiment is arranged on the top of the substrate 1, that is, the surface layer of the substrate 1, it is easier to perform relevant inspections on the electronic component 4, such as inspecting the appearance, patch position, connection status, etc. of the electronic component 4.

[0072] It should be noted that, taking the electronic component 4 as the capacitor 41 as an example, the pressing of the existing PCB also requires the additional arrangement of the capacitor 41 layer and the second insulating layer, that is, compared with the substrate 1 of the present embodiment, the pressing of the existing PCB has an additional pressing process of the capacitor 41 layer and the second insulating layer, while the electronic component 4 of the present embodiment is directly arranged on the top of the substrate 1, and does not involve the additional capacitor 41 layer and the second insulating layer. Therefore, the process of introducing the capacitor 41 layer and the second insulating layer of the substrate 1 during the pressing process is omitted, thereby simplifying the manufacturing process of the substrate 1.

[0073] It should also be noted that the electronic component 4 can be soldered to the substrate 1 or bonded to the substrate 1 by conductive adhesive, which is not limited here.

[0074] See also Figure 1 , Figure 2 and Fig. 9 In one embodiment, the electronic component 4 includes a capacitor 41, which includes an alloy body 411, a protective layer 412 and two electrodes 413. The alloy body 411 includes a main body and ends disposed at both ends of the main body. Each electrode 413 includes a copper-plated electrode 4131, a nickel-plated electrode 4132 and a tin-plated electrode 4133. The protective layer 412 is disposed around the periphery of the main body. The electrodes 413 are disposed one by one corresponding to the ends. The periphery of each end is surrounded by a copper-plated electrode 4131, a nickel-plated electrode 4132 and a tin-plated electrode 4133 in sequence from the inside to the outside. The capacitor 41 is soldered to the substrate 1 through the tin-plated electrode 4133.

[0075] According to an embodiment of the present invention, the signal processing module 32 includes an ASIC chip, the sound pickup module 31 includes a MEMS chip, the ASIC chip is electrically connected to the pads on the substrate 1 through gold wires, and the ASIC chip is also electrically connected to the MEMS chip through gold wires.

[0076] The present invention further provides an electronic device, which includes the microphone 100 described above. Since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0077] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A microphone, characterized in that: include: A substrate, the substrate comprising a top layer, a first conductive layer, an insulating layer, and a second conductive layer arranged in sequence along a first direction; the first direction is a direction along the thickness of the substrate; A shell, the shell is covered on the substrate and forms a receiving cavity with the substrate, and the substrate is provided with a sound pickup hole connected to the receiving cavity; A chip assembly, the chip assembly comprising a signal-connected sound pickup module and a signal processing module, the sound pickup module being located in the accommodating cavity; An electronic component, wherein the electronic component is electrically connected to the signal processing module; the electronic component is buried in the insulating layer, and two ends of the electronic component are electrically connected to the first conductive layer and the second conductive layer respectively; wherein the electronic component includes at least one of a capacitor or a resistor.

2. The microphone according to claim 1, wherein: The microphone also includes a conductive component, which includes a first conductive member and a second conductive member buried in the insulating layer, wherein two ends of the first conductive member are respectively connected to the first conductive layer and one end of the electronic component; two ends of the second conductive member are respectively connected to the second conductive layer and the other end of the electronic component.

3. The microphone according to claim 2, characterized in that The electronic component includes a body and a first copper pin and a second copper pin arranged at two ends of the body, the first conductive layer includes a first copper foil layer, the second conductive layer includes a second copper foil layer, the first conductive member includes a first copper column, the second conductive member includes a second copper column, the two ends of the first copper column are respectively connected to the first copper foil layer and the first copper pin, and the two ends of the second copper column are respectively connected to the second copper foil layer and the second copper pin.

4. The microphone according to claim 3, characterized in that The surface of the first copper pin is plated with a first nickel-gold layer; And / or, the surface of the second copper pin is plated with a second nickel-gold layer.

5. The microphone according to claim 2, characterized in that The length direction of the electronic component is arranged parallel to the first direction; Alternatively, the length direction of the electronic component is arranged perpendicular to the first direction.

6. The microphone according to any one of claims 1 to 5, characterized in that The signal processing module is located in the accommodating cavity, and the sound pickup module and the signal processing module are both arranged on the top layer; The top layer is provided with a pad, the microphone further comprises a first gold wire, and the signal processing module is electrically connected to the first conductive layer through the first gold wire and the pad; And / or, the microphone further includes a second gold wire, and the signal processing module is electrically connected to the sound pickup module via the second gold wire.

7. The microphone according to claim 6, characterized in that The substrate also includes a third conductive layer and a fourth conductive layer, the insulating layer includes a first layer, a second layer and a third layer, the first conductive layer, the first layer, the third conductive layer, the second layer, the fourth conductive layer, the third layer and the second conductive layer are stacked in sequence along the first direction, and the third conductive layer and the fourth conductive layer are respectively provided with a first avoidance hole and a second avoidance hole for avoiding the electronic components.

8. The microphone according to claim 6, characterized in that A receiving groove is provided on the top of the substrate, and the sound pickup hole is provided on the bottom wall of the receiving groove. The microphone also includes a support plate and a waterproof and breathable membrane covering the sound pickup hole; the support plate cover is arranged on the notch of the receiving groove, the sound pickup module and the signal processing module are both arranged on the side of the support plate away from the substrate, and the support plate is provided with a connecting hole connected to the receiving groove.

9. The microphone according to any one of claims 1 to 5, characterized in that The substrate also includes a third conductive layer and a fourth conductive layer, the insulating layer includes a first layer, a second layer and a third layer, the first conductive layer, the first layer, the third conductive layer, the second layer, the fourth conductive layer, the third layer and the second conductive layer are stacked in sequence along the first direction, and the third conductive layer and the fourth conductive layer are respectively provided with a first avoidance hole and a second avoidance hole for avoiding the electronic components.

10. The microphone according to claim 9, characterized in that The signal processing module includes an ASIC chip and a sensor chip, and the electronic components are electrically connected to the ASIC chip; The ASIC chip is buried in the second layer, one end of the ASIC chip is electrically connected to the third conductive layer, and the other end of the ASIC chip is electrically connected to the fourth conductive layer; the ASIC chip and the electronic components are spaced apart along a second direction, and the first direction is perpendicular to the second direction; And / or, the sensor chip is buried in the second layer, one end of the sensor chip is electrically connected to the third conductive layer, and the other end of the sensor chip is electrically connected to the fourth conductive layer; the sensor chip and the electronic components are spaced apart along a second direction, and the first direction is perpendicular to the second direction.

11. The microphone according to claim 9, characterized in that A receiving groove is provided on the top of the substrate, and the sound pickup hole is provided on the bottom wall of the receiving groove. The microphone also includes a waterproof breathable membrane, and the waterproof breathable membrane covers the sound pickup hole. The waterproof breathable membrane and the electronic components are arranged at intervals along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

12. A microphone, characterized in that: include: substrate; A shell, the shell is covered on the substrate and forms a receiving cavity with the substrate, and the substrate is provided with a sound pickup hole connected to the receiving cavity; A chip assembly, the chip assembly comprising a sound pickup module and a signal processing module connected by signals, the sound pickup module and the signal processing module are both located in the accommodating cavity; An electronic component, wherein the electronic component is electrically connected to the signal processing module, the electronic component is located in the accommodating cavity, and the electronic component is arranged on the substrate; wherein the electronic component includes at least one of a capacitor or a resistor.

13. The microphone according to claim 12, wherein: The electronic component includes a capacitor, which includes an alloy body, a protective layer and two electrodes. The alloy body includes a main body and ends arranged at both ends of the main body. Each of the electrodes includes a copper-plated electrode, a nickel-plated electrode and a tin-plated electrode. The protective layer is arranged around the periphery of the main body. The electrodes are arranged in a one-to-one correspondence with the ends. The periphery of each of the ends is surrounded by the copper-plated electrode, the nickel-plated electrode and the tin-plated electrode in sequence from the inside to the outside.

14. An electronic device, characterized in that: The electronic device comprises a housing and the microphone according to any one of claims 1 to 13.

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