Cooling system

Abstract

The invention discloses a cooling system. The cooling system is used for cooling a rack system. The cooling system includes a rack system, a plurality of heat exchangers, and a liquid distribution subsystem. A plurality of heat exchangers are vertically disposed below the rack system with a primary heat exchanger disposed adjacent a forward portion of the rack system and a secondary heat exchanger disposed adjacent a rearward portion of the rack system. The liquid distribution subsystem includes: one or more supply tubes disposed between the primary heat exchanger and the secondary heat exchanger, the one or more supply tubes delivering a cooling fluid to the plurality of heat exchangers, where the cooling fluid is heated by the plurality of heat exchangers; one or more return tubes, the one or more return tubes collecting the heated cooling fluid from the plurality of heat exchangers; and a manifold coupled to the one or more supply tubes and the one or more return tubes, where the manifold is configured to distribute cooling fluid throughout the rack system.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 539,262, filed on September 19, 2023, under 35 U.S.C. §119(e), which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates generally to cooling systems for electronic equipment, and more particularly, to cooling systems capable of managing the temperature of high power density computer racks. Background Art

[0004] The rapid advancement of high-performance computing technologies, including areas such as artificial intelligence (AI) and machine learning (ML), has ushered in an era where computer racks are experiencing extreme power density levels. These advanced systems can generate a large amount of heat, creating the need for powerful and innovative cooling solutions to maintain optimal performance and prevent heat-related problems. In response to these challenges, cooling components have become critical components within the data center, tasked with the difficult task of dissipating heat effectively and reliably. The continued evolution of cooling technology for high-power density computer racks reflects the ongoing effort to strike a complex balance between performance, energy efficiency, and space considerations, driving the continued development of cutting-edge cooling solutions.

[0005] Therefore, a need exists for improved cooling systems for dissipating heat generated by high performance computing technology. Summary of the invention

[0006] According to one or more illustrative embodiments of the present disclosure, a cooling system is disclosed. In one illustrative embodiment, the cooling system includes a rack system. In another illustrative embodiment, the cooling system includes a plurality of heat exchangers arranged vertically below the rack system, wherein a primary heat exchanger among the plurality of heat exchangers is disposed adjacent to a front portion of the rack system, and a secondary heat exchanger among the plurality of heat exchangers is disposed adjacent to a rear portion of the rack system. In another illustrative embodiment, the cooling system includes a liquid distribution subsystem. In another illustrative embodiment, the liquid distribution subsystem includes one or more supply pipes disposed between the primary heat exchanger and the secondary heat exchanger and configured to deliver a cooling fluid to the plurality of heat exchangers, wherein the cooling fluid is heated by the plurality of heat exchangers. In another illustrative embodiment, the liquid distribution subsystem includes one or more return pipes configured to collect heated cooling fluid from the plurality of heat exchangers. In another illustrative embodiment, a liquid distribution subsystem includes a manifold coupled to at least one of the one or more supply tubes and the one or more return tubes, wherein the manifold is configured to distribute cooling fluid throughout the rack system.

[0007] According to one or more illustrative embodiments of the present disclosure, a cooling system is disclosed. In one illustrative embodiment, the cooling system includes a rack system. In another illustrative embodiment, the cooling system includes a plurality of heat exchangers arranged vertically below the rack system, wherein a primary heat exchanger among the plurality of heat exchangers is disposed adjacent to a front portion of the rack system, and a secondary heat exchanger among the plurality of heat exchangers is disposed adjacent to a rear portion of the rack system. In another illustrative embodiment, the cooling system includes a liquid distribution subsystem. In another illustrative embodiment, the liquid distribution subsystem includes one or more supply pipes disposed between the primary heat exchanger and the secondary heat exchanger and configured to deliver a cooling fluid to the plurality of heat exchangers, wherein the cooling fluid is heated by the plurality of heat exchangers. In another illustrative embodiment, the liquid distribution subsystem includes one or more return pipes configured to collect heated cooling fluid from the plurality of heat exchangers. In another illustrative embodiment, the liquid distribution subsystem includes a manifold coupled to at least one of the one or more supply tubes and the one or more return tubes, wherein the manifold is configured to distribute the cooling fluid throughout the rack system. In another illustrative embodiment, the liquid distribution subsystem includes one or more liquid pumps disposed within the rack system, the one or more liquid pumps being configured to communicate with the plurality of heat exchangers.

[0008] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only and are not necessarily limitations of the invention as claimed. The accompanying drawings, which are incorporated into and constitute a part of this specification, illustrate various embodiments of the invention and, together with the general description, are used to explain the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Many advantages of the present disclosure may be better understood by those skilled in the art by referring to the accompanying drawings, in which:

[0010] Figure 1 illustrates a front view of a cooling system integrated below a rack system in a data center according to one or more embodiments of the present disclosure;

[0011] Figure 2 illustrates a front view of a cooling system integrated below one of the racks in a rack system according to one or more embodiments of the present disclosure;

[0012] Figure 3 illustrates a perspective view of a liquid distribution subsystem positioned below one or more racks according to one or more embodiments of the present disclosure;

[0013] Figure 4 A perspective view illustrating an arrangement of a plurality of heat exchangers of a cooling system according to one or more embodiments of the present disclosure;

[0014] Figure 5 illustrates a schematic diagram of a primary heat exchanger and a secondary heat exchanger connected in parallel according to one embodiment of the present disclosure; and

[0015] Figure 6 A conceptual diagram of a primary heat exchanger and a secondary heat exchanger connected in series according to another embodiment of the present disclosure is illustrated. DETAILED DESCRIPTION

[0016] The present disclosure has been specifically shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are considered to be illustrative rather than restrictive. It should be apparent to those of ordinary skill in the art that various changes and modifications may be made in form and detail without departing from the spirit and scope of the present disclosure.

[0017] Reference will now be made in detail to the disclosed subject matter, which is illustrated in the accompanying drawings.

[0018] In general, high-power density computer systems such as high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) are becoming more and more common, driven by advances in fields such as artificial intelligence and machine learning. These high-performance computing systems generate a lot of heat during operation while providing excellent computing power. Therefore, effective cooling solutions are needed to ensure the continued performance, life, and reliability of such systems.

[0019] Current cooling solutions for HPC racks typically rely on an approach that combines separate cooling systems for both liquid-based and air-based approaches. This separate arrangement not only introduces unnecessary complexity, but also significantly prolongs the installation process. In addition, the arrays of air cooling equipment used in these configurations result in a wasteful allocation of valuable data center space.

[0020] Therefore, embodiments of the present disclosure relate to a cooling system that seamlessly integrates air cooling technology and liquid cooling technology specifically designed for high-density computer racks. The integrated cooling system can effectively utilize the space within the elevated base plate that is traditionally reserved for liquid cooling pipe layout to accommodate a comprehensive cooling assembly. The cooling system can feature a combination of supply and return pipes for both liquid cooling and air cooling, an active liquid-to-air heat exchanger with an integrated fan, and an optional passive liquid-to-air heat exchanger. The entire assembly can be pre-assembled and installed under the computer rack, thereby facilitating rapid deployment and significantly reducing the overall construction time of the data center. By combining the two cooling methods into the same infrastructure, the solution maximizes cooling efficiency and simplifies maintenance and expansion of the data center.

[0021] Figures 1 to 6 A cooling system according to one or more embodiments of the present disclosure is illustrated.

[0022] Figure 1 and Figure 2 Illustrated is a front view of a cooling system 100 integrated below a rack system 102 within a data center in accordance with one or more embodiments of the present disclosure.

[0023] In some embodiments, the cooling system 100 includes at least one of a rack system 102, a liquid distribution subsystem 104, and a plurality of heat exchangers 106 (e.g., a primary heat exchanger 106a and a secondary heat exchanger 106b) disposed below the rack system 102. For example, the rack system 102 can serve as a backbone of the cooling system 100, thereby facilitating seamless transportation, handling, and installation of the liquid distribution subsystem 104 and the plurality of heat exchangers 106 into the rack system 102. As another example, the rack system 102 can include a support structure.

[0024] In some embodiments, the cooling system 100 includes one or more liquid pumps 206 (eg, Figure 2 ). For example, the liquid pumps 206 can be configured to supply liquid to the manifolds 110 within each rack of the rack system 102, thereby enhancing overall efficiency and reducing the need for additional external pumping facilities for the system 100. It should be noted herein that such integration can help simplify the installation process and minimize the space required for additional cooling equipment.

[0025] In some embodiments, the rack system 102 can be configured to accommodate a plurality of other equipment, such as, but not limited to, one or more liquid pumps 206, one or more liquid pumps 206 integrated with a plurality of heat exchangers 106, and / or one or more auxiliary racks. For example, one or more liquid pumps 206 can be integrated within the support structure. The liquid pumps 206 can be configured to supply liquid to the manifolds 110 within each rack of the rack system 102, thereby enhancing overall efficiency and reducing the need for additional external pumping facilities for the system 100. It should be noted herein that such integration can help simplify the installation process and minimize the space required for additional cooling equipment.

[0026] Reference Figure 2 In some embodiments, the rack system 102 may include a frame and may be formed of a rigid material including at least one of metal, plastic, or a composite material. Additionally, one or more raised floor sections or tiles may be integrated between adjacent rows of racks within the rack system 102 to increase the efficiency of the system. Furthermore, one or more air grilles 202 may be positioned directly in front of and behind each rack of the rack system 102 to enhance air flow and cooling performance. It should also be noted that one or more air deflectors 204 may be installed on the rack system 102 in response to a need for directional air flow.

[0027] In some embodiments, the cooling system 100 includes various configurations of heat exchangers 106 to accommodate specific cooling requirements. For example, the system 100 can include configurations such as passive-passive heat exchangers, active-passive heat exchangers, and active-active heat exchangers 106. The primary heat exchanger 106a, which can be passive, can include only heat exchanger coils. This flexibility allows the system 100 to adapt to varying heat loads, thereby providing optimal cooling performance based on the specific needs of the data center 101.

[0028] In some embodiments, the system 100 can include a blank panel 112 to further enhance cooling efficiency and air flow management. For example, the blank panel 112 can be positioned between the top surface of each rack in the rack system 102 and the ceiling. This configuration can allow for the creation of different cold aisles and hot aisles, thereby allowing for more precise thermal control. As another example, one or more rows of racks in the rack system 102 can be arranged so that a cold aisle or a hot aisle can exist between two rows of rack systems 102 and / or between a row of rack systems 102 and a wall surface.

[0029] It should be noted herein that in the context of the cooling system 100, the terms "hot aisle" and "cold aisle" may refer to different temperature controlled zones within a data center that help manage air flow and cooling efficiency. For example, a "cold aisle" may be defined as an area where the temperature is maintained within a lower range to supply cooling air to the front of the rack system 102. The cold aisle temperature may be maintained at a temperature below, for example, 25 degrees Celsius, with an ideal operating range between 18 degrees Celsius and, for example, 22 degrees Celsius. These are merely examples, and thus the temperatures may vary. Alternatively, the cold aisle may be slightly cooler than the hot aisle.

[0030] In contrast, a "hot aisle" may refer to an area with a higher temperature due to warm air being exhausted from the rear portion of the rack system 102. For example, depending on the specific cooling requirements and configuration of the data center, the hot aisle temperature may range between, for example, 30 degrees Celsius and, for example, 45 degrees Celsius. These temperature ranges for the hot aisle and cold aisle are exemplary and may vary based on specific environmental conditions, equipment requirements, and data center design. The cooling system 100 is designed to accommodate these temperature ranges, thereby ensuring reliable and efficient operation of the equipment housed within the rack system 102.

[0031] In situations where additional heat transfer capacity is not required, the passive heat exchanger may be omitted. Such omission may further simplify the system 100 and reduce installation time and cost without compromising overall cooling efficiency for certain applications.

[0032] Now refer to Figure 3 , the cooling system 100 may include a liquid distribution subsystem 104, which may include one or more liquid distribution manifolds 110. For example, at least one of the one or more manifolds 110 may be configured to directly supply the plurality of heat exchangers 106, while at least another of the one or more manifolds 110 may be configured to supply manifolds 110 within each rack of the rack system 102. The manifold 110 under each backplane may be designed to include one or more tubes 302 (e.g., a supply tube 502 and a return tube 504, such as Figure 5As shown), the one or more tubes 302 are equipped with the necessary framework to regulate at least one of the liquid flow, pressure or temperature.

[0033] Figure 4 The arrangement of multiple heat exchangers 106 within the system 100 is illustrated. Each row of rack systems 102 is equipped with multiple heat exchangers 106, which are positioned below both the front portion and the rear portion of each rack within the rack system 102. The multiple heat exchangers 106 are configured to provide a high degree of versatility. For example, the multiple heat exchangers 106 may include at least one primary heat exchanger 106a and at least one secondary heat exchanger 106b, which may be used based on specific cooling requirements. In some embodiments, at least one primary heat exchanger 106a may be configured as an active system, characterized by a heat exchanger coil coupled to a fan. In other embodiments, the secondary heat exchanger 106b may be configured as a passive counterpart that includes only a heat exchanger coil. For example, when additional heat transfer capacity is not required, the passive heat exchanger 106 may be omitted. It should be noted herein that various combinations of primary and secondary heat exchangers 106 are possible, thereby providing adaptability to varying heat loads. Combinations may include, but are not limited to, passive-passive heat exchangers, active-passive heat exchangers, and / or configurations featuring one active heat exchanger and one passive heat exchanger.

[0034] It should be noted herein that the plurality of heat exchangers 106 and corresponding distribution may include, but is not limited to, any specific cooling technology, such as a chilled water system and / or directional expansion through refrigerant lines.

[0035] In some embodiments, the system 100 can be designed to optimize air flow and thermal management. For example, cool air (e.g., below 25 degrees Celsius) can be directed toward the front of each rack within the rack system 102 through one or more air grilles 202 in the raised floor portion, while hot air (e.g., between 30 degrees Celsius and 45 degrees Celsius) is efficiently extracted from the rear portion of each rack within the rack system 102 through one or more additional grilles 202. It should be noted herein that the presence of a raised floor is not mandatory, and the system 100 remains fully functional even without the raised floor.

[0036] It should be further noted herein that the raised floor portion, while not mandatory, can significantly improve the efficiency of the cooling system 100. For example, the raised floor can allow for efficient routing of both liquid cooling pipes and air cooling pipes as well as the integration of air grilles 202 to ensure optimal air flow management. Cool air can be directed toward the front of each rack within the rack system 102 through the air grilles 202, while hot air is extracted from the rear, thereby ensuring a consistent and efficient cooling cycle. In some configurations, based on the layout of the data center 101, air deflectors 204 can be installed to more precisely direct the air flow.

[0037] Figure 5 An example of a configuration of the system 100 employing a plurality of heat exchangers 106 connected to a liquid distribution manifold 110 in a parallel arrangement is shown.

[0038] In an embodiment, one or more supply pipes 502 and return pipes 504 of the cooling system 100 play a key role in managing the distribution and return of cooling fluids within a high-density computer rack, respectively. For example, one or more supply pipes 502 can be configured to deliver cooling fluids to various components of the cooling system 100, including but not limited to multiple heat exchangers 106 and manifold 110. In addition, one or more supply pipes 502 can be configured to fluidly couple the manifold 110 to the primary heat exchanger 106a and the secondary heat exchanger 106b at the same time. Therefore, the cooling fluid can be evenly distributed to the inlet 116a of the primary heat exchanger 106a and the inlet 116c of the secondary heat exchanger 106b, respectively. After passing through each heat exchanger, the heated cooling fluid can leave through outlets 116b and 116d and return to the manifold 110 via one or more return pipes 504.

[0039] In an embodiment, in a parallel configuration, one or more supply tubes 502 may be bent at an angle of approximately 90 degrees to facilitate even distribution of cooling fluid across both the primary heat exchanger 106a and the secondary heat exchanger 106b. This configuration may allow each heat exchanger 106a, 106b to operate independently, thereby enabling selective engagement based on the cooling requirements of the rack system 102. Depending on the specific cooling requirements, one or more tubes 502, 504 may also support a combination of active and passive heat exchangers.

[0040] It should be noted herein that one or more monitoring devices 506 may also be installed along one or more supply pipes 502 to ensure that flow, temperature, and pressure remain at optimal levels. For example, one or more monitoring devices 506 may include one or more flow control valves positioned along one or more supply pipes 502, the one or more flow control valves helping to regulate the flow of the cooling fluid. One or more monitoring devices 506 may also include one or more pressure regulators for maintaining a consistent pressure within one or more supply pipes 502, thereby preventing potential damage caused by pressure fluctuations. One or more monitoring devices 506 may also include one or more temperature sensors for monitoring the temperature of the cooling fluid as it travels through one or more supply pipes 502, thereby providing real-time data to the control system for optimal thermal management.

[0041] It should also be noted herein that the one or more return pipes 504 may include one or more monitoring devices 508 configured to regulate at least one of liquid flow, pressure, or temperature. The one or more monitoring devices 508 may include one or more flow meters for measuring the rate at which fluid is returned, the one or more flow meters providing data to help balance the system 100. The one or more monitoring devices 508 may also include one or more check valves for preventing backflow, thereby ensuring that the cooling fluid moves in the correct direction through the one or more return pipes 504. The one or more monitoring devices 508 may also include one or more temperature and pressure sensors for continuously monitoring conditions within the one or more return pipes 504, thereby ensuring that the system 100 is operating within safe and effective parameters.

[0042] on the other hand, Figure 6 A configuration of the system 100 is shown that employs a plurality of heat exchangers 106 connected in a series arrangement to a liquid distribution manifold 110. The type of connection may be determined by the particular operating conditions encountered in the system 100.

[0043] In an embodiment, one or more supply pipes 502 are configured to couple the manifold 110 fluid to the primary heat exchanger 106a via the inlet 116a. After passing through the primary heat exchanger 106a, the heated cooling fluid can leave through the outlet 116b of the primary heat exchanger 106a. Then, the heated fluid is directed through one or more supply pipes 502, which are designated as the pipeline 502 or the pipeline 504 connected between the outlet 116b of the primary heat exchanger 106a and the inlet 116c of the secondary heat exchanger 106b according to a specific configuration. The cooling fluid then enters the secondary heat exchanger 106b, in which the cooling fluid undergoes additional cooling. Finally, the cooled fluid leaves the secondary heat exchanger 106b through the outlet 116d of the secondary heat exchanger 106b, and returns to the manifold 110 via one or more return pipes 504.

[0044] In an embodiment, the one or more supply tubes 502 and the one or more return tubes 504 are strategically bent at angles ranging between 45 and 90 degrees, depending on the space constraints and the specific configuration of the rack system 102. For example, the bends of the one or more supply tubes 502 and the one or more return tubes 504 ensure smooth fluid flow and efficient use of space, thereby minimizing turbulence and maintaining a consistent flow rate. In addition, a monitoring device 506 can be installed along the one or more supply tubes 502 and the one or more return tubes 504 to regulate the temperature and pressure of the cooling fluid as it flows into and out of the primary heat exchanger 106a and the secondary heat exchanger 106b.

[0045] It should be noted herein that the series configuration can maximize heat transfer efficiency by allowing the cooling fluid to cool gradually as it flows through the two heat exchangers 106. The series arrangement is suitable for situations where a higher degree of cooling is required or where the cooling load is uneven and needs to be managed sequentially. Calculating the angles and bends in the one or more supply pipes 502 and return pipes 504, respectively, to minimize turbulence and maintain a steady flow rate is critical to ensuring consistent cooling performance.

[0046] It should be noted that although Figure 5 and Figure 6 The parallel configuration and series configuration shown in are exemplary embodiments, but the present invention is not limited to these specific arrangements. Other possible configurations can be implemented depending on the specific cooling requirements and space constraints of the data center. For example, changes in the angles of the respective bends in one or more supply pipes 502 and return pipes 504, the use of additional monitoring devices 506, or the integration of supplemental cooling components can be used to optimize the performance of the cooling system 100 in various situations.

[0047] In an embodiment, the cooling system 100 presents a unique approach by combining cooling equipment and facilities, primarily liquid coolant pipes, within a single unified assembly. This design helps simplify manufacturing and installation, significantly reducing both time and space requirements. This design greatly reduces installation time compared to traditional cooling systems, resulting in reduced data center build time and improved space utilization. This ultimately translates into more available space for individual computer racks of the rack system 102, or the possibility of reducing the size of the data center facility while maintaining optimal cooling performance.

[0048] Those skilled in the art will recognize that, for conceptual clarity, the components (e.g., operations), devices, objects, and discussions accompanying them described herein are used as examples, and various configuration modifications are contemplated. Therefore, as used herein, the specific examples set forth and the accompanying discussions are intended to represent their more general categories. In general, the use of any specific example is intended to represent its category, and the non-inclusion of specific components (e.g., operations), devices, and objects should not be considered limiting.

[0049] The following description is provided to enable one of ordinary skill in the art to make and use the present invention as provided in the context of a particular application and its requirements. As used herein, directional terms such as "top", "bottom", "above", "below", "upper", "upward", "lower", "under", and "downward" are intended to provide relative positions for descriptive purposes and are not intended to specify an absolute reference system. Various modifications to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the specific embodiments shown and described, but should be given the widest scope consistent with the principles and novel features disclosed herein.

[0050] Regarding the use of substantially any plural and / or singular terms herein, those skilled in the art can appropriately convert the plural to the singular and / or the singular to the plural according to the context and / or application. For the sake of clarity, various singular / plural transformations are not explicitly set forth herein.

[0051] The subject matter described herein sometimes illustrates different components contained in or connected to other components.It should be understood that the architecture depicted in this way is only an example, and many other architectures that realize the same function can actually be implemented.In a conceptual sense, the arrangement of any components that realize the same function is effectively "associated" to achieve the desired function.Therefore, any two components that are combined to realize a specific function herein can be regarded as "associated" with each other, so that the desired function is achieved, regardless of the architecture or intermediate components.Similarly, any two components so associated can also be regarded as "connected" or "connected" to each other to achieve the desired function, and any two components that can be so associated can also be regarded as "able to connect" to each other to achieve the desired function.Specific examples that can be connected include but are not limited to components that can be physically matched and / or physically interacted and / or components that can be wirelessly interacted and / or wirelessly interacted and / or components that can be logically interacted and / or components that can be logically interacted.

[0052] In addition, it should be understood that the present invention is defined by the appended claims. Those skilled in the art will understand that, in general, the terms used herein and especially in the appended claims (e.g., the body of the appended claims) are generally intended to be used as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to", the term "having" should be interpreted as "having at least", the term "including" should be interpreted as "including but not limited to", etc.). Those skilled in the art will also understand that if a specific number of an introduced claim recitation is intended, such intent will be explicitly stated in the claim, and in the absence of such a statement, such intent does not exist. For example, to aid understanding, the following appended claims may include the use of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, even when the same claim includes the introductory phrases "one or more" or "at least one" and an indefinite article such as "a" or "an" (e.g., "a" and / or "an" should be interpreted as meaning "at least one" or "one or more"), the use of such phrases should not be interpreted as implying that a claim recitation introduced by the indefinite article "a" or "an" limits any particular claim containing such introduced claim recitation to an invention containing only one such recitation; the same applies to the use of definite articles used to introduce claim recitations. In addition, even if a specific number of introduced claim recitations is explicitly recited, those skilled in the art will recognize that such recitation should generally be interpreted as indicating at least the recited number (e.g., the unmodified recitation of "two recitations" in the absence of other modifiers generally means at least two recitations or two or more recitations). Furthermore, in those cases where phrases similar to “at least one of A, B, and C, etc.” are used, such constructions are generally intended to mean the meaning of the phrase as would be understood by a person skilled in the art (e.g., “a system having at least one of A, B, and C” would include, but are not limited to, systems having A alone, B alone, C alone, both A and B, both A and C, both B and C, and / or both A, B, and C, etc.). In those cases where phrases similar to “at least one of A, B, or C, etc.” are used, such constructions are generally intended to mean the meaning of the phrase as would be understood by a person skilled in the art (e.g., “a system having at least one of A, B, or C” would include, but are not limited to, systems having A alone, B alone, C alone, both A and B, both A and C, both B and C, and / or both A, B, and C, etc.).Those skilled in the art will also understand that any transitional words and / or phrases that actually present two or more alternative terms, whether in the specification, claims or drawings, should be understood to be intended to include the possibility of one of the terms, any of the terms, or both of the terms. For example, the phrase "A or B" will be understood to include the possibility of "A" or "B" or "A and B".

[0053] It is believed that many of the advantages of the present disclosure and its attendant advantages will be appreciated from the foregoing description, and it will be apparent that various changes may be made to the form, structure and arrangement of the components without departing from the disclosed subject matter or sacrificing all of its material advantages. The forms described are merely illustrative, and the appended claims are intended to cover and include such changes. Furthermore, it should be understood that the invention is defined by the appended claims.

Claims

1. A cooling system, comprising: Rack systems; a plurality of heat exchangers arranged vertically below the rack system, wherein primary ones of the plurality of heat exchangers are disposed adjacent to a front portion of the rack system and secondary ones of the plurality of heat exchangers are disposed adjacent to a rear portion of the rack system; and A liquid distribution subsystem, the liquid distribution subsystem comprising: one or more supply tubes disposed between the primary heat exchanger and the secondary heat exchanger and configured to deliver a cooling fluid to the plurality of heat exchangers, wherein the cooling fluid is heated by the plurality of heat exchangers; one or more return tubes configured to collect heated cooling fluid from the plurality of heat exchangers; and A manifold is coupled to at least one of the one or more supply tubes and the one or more return tubes, wherein the manifold is configured to distribute the cooling fluid throughout the rack system.

2. The cooling system according to claim 1, wherein: The one or more supply tubes and the one or more return tubes are arranged laterally and longitudinally relative to the rack system to provide support for the vertical arrangement of the plurality of heat exchangers.

3. The cooling system according to claim 1, wherein: The rack system includes a raised floor portion configured to direct cool air to the front portion of the rack system and direct hot air out of the rear portion of the rack system through one or more air grilles in the raised floor portion.

4. The cooling system according to claim 3, wherein: The one or more air grilles are disposed on opposite sides of the rack system to direct air flow.

5. The cooling system according to claim 1, wherein: The primary heat exchanger of the plurality of heat exchangers comprises an active heat exchanger including one or more fans and a heat exchanger coil.

6. The cooling system according to claim 1, wherein: The secondary heat exchanger of the plurality of heat exchangers comprises a passive heat exchanger including a heat exchanger coil.

7. The cooling system according to claim 5, wherein: The one or more fans of the primary heat exchanger are configured to face outwardly to direct air flow across the heat exchanger coil.

8. The cooling system of claim 1, further comprising one or more liquid pumps disposed within the rack system, the one or more liquid pumps being configured to communicate with the plurality of heat exchangers.

9. The cooling system according to claim 8, wherein: The one or more liquid pumps are configured to distribute the cooling fluid to the manifolds within the rack system.

10. The cooling system according to claim 1, wherein: The rack system also includes one or more air directors configured to direct air flow.

11. A cooling system comprising: Rack systems; a plurality of heat exchangers arranged vertically below the rack system, wherein primary ones of the plurality of heat exchangers are disposed adjacent to a front portion of the rack system and secondary ones of the plurality of heat exchangers are disposed adjacent to a rear portion of the rack system; and A liquid distribution subsystem, the liquid distribution subsystem comprising: one or more supply tubes disposed between the primary heat exchanger and the secondary heat exchanger and configured to deliver a cooling fluid to the plurality of heat exchangers, wherein the cooling fluid is heated by the plurality of heat exchangers; one or more return tubes configured to collect heated cooling fluid from the plurality of heat exchangers; a manifold coupled to at least one of the one or more supply tubes and the one or more return tubes, wherein the manifold is configured to distribute the cooling fluid throughout the rack system; and One or more liquid pumps are disposed within the rack system and are configured to communicate with the plurality of heat exchangers.

12. The cooling system according to claim 11, wherein: The one or more supply tubes and the one or more return tubes are arranged laterally and longitudinally relative to the rack system to provide support for the vertical arrangement of the plurality of heat exchangers.

13. The cooling system according to claim 11, wherein: The rack system includes a raised floor portion configured to direct cool air to the front portion of the rack system and direct hot air out of the rear portion of the rack system through one or more air grilles in the raised floor portion.

14. The cooling system according to claim 13, wherein: The one or more air grilles are disposed on opposite sides of the rack system to direct air flow.

15. The cooling system according to claim 11, wherein: The primary heat exchanger of the plurality of heat exchangers comprises an active heat exchanger including one or more fans and a heat exchanger coil.

16. The cooling system according to claim 11, wherein: The secondary heat exchanger of the plurality of heat exchangers comprises a passive heat exchanger including a heat exchanger coil.

17. The cooling system according to claim 15, wherein: The one or more fans of the primary heat exchanger are configured to face outwardly to direct air flow across the heat exchanger coil.

18. The cooling system according to claim 11, wherein: The primary heat exchanger and the secondary heat exchanger are connected to the manifold in a parallel configuration such that the cooling fluid is distributed to the primary heat exchanger and the secondary heat exchanger simultaneously.

19. The cooling system according to claim 11, wherein: The primary heat exchanger and the secondary heat exchanger are connected to the manifold in a series configuration such that the cooling fluid flows sequentially through the primary heat exchanger and then through the secondary heat exchanger.

20. The cooling system of claim 11, wherein: The one or more supply tubes and the one or more return tubes are each in communication with a monitoring system configured to regulate at least one of liquid flow, pressure, or temperature.

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