Phase change liquid cooling plate and phase change liquid cooling system

Abstract

According to the phase change liquid cooling plate and the phase change liquid cooling system, the phase change liquid cooling plate adopts the phase change refrigerant, the principle that the phase change refrigerant absorbs a large amount of latent heat in the phase change process of changing the liquid state into the gas state is utilized, heat is more effectively taken away, higher heat transfer efficiency is achieved, the requirement for rapid heat dissipation is met, and the situation that the performance and the service life are affected due to the fact that the temperature of equipment is too high is avoided. Specifically, the liquid refrigerant directly acts on the heat exchange inner wall close to the external heat source in a spraying mode through the multiple nozzles which are evenly distributed, the contact area between the refrigerant and the heat source is increased, and the heat transfer efficiency is improved. In addition, parameters such as arrangement of refrigerant channels, distribution of nozzles, injection pressure and the like can be adjusted according to actual requirements so as to meet different heat source and heat dissipation requirements.

Description

Technical Field

[0001] The present application relates to the technical field of liquid cooling plates, and in particular to a phase change liquid cooling plate and a phase change liquid cooling system. Background Art

[0002] With the development of technology and the promotion of the market, the demand for thermal management is increasing in the fields of energy storage, data centers, electric vehicles, medical equipment, aerospace, industry, etc., and the temperature control of key equipment, batteries, and electronic components during operation is becoming more and more important.

[0003] Key equipment, batteries, and electronic components generate heat during operation and require proper cooling to achieve optimal performance. In order to keep key equipment, batteries, and electronic components running at an ideal temperature, air cooling and cold plate liquid cooling are currently commonly used.

[0004] Liquid cold plates can effectively transfer heat from heat sources to coolants through their high thermal conductivity and high specific heat capacity, and eventually discharge the heat out of the system, thereby reducing the operating temperature of key equipment, batteries, and electronic components during operation, thereby improving work efficiency.

[0005] Currently, most of the liquid cooling plates on the market use non-phase change liquid cooling, which has a built-in fluid flow channel. The liquid in the flow channel exchanges heat with the surface of the liquid cooling plate in contact with the heat source, thereby taking away the heat. Non-phase change liquid cooling mainly relies on the flow of coolant and convection heat transfer to remove heat, and its heat transfer efficiency is affected by many factors such as the thermal conductivity of the coolant, flow rate, and flow channel design. In scenarios such as high-density data centers, non-phase change liquid cooling may not meet the needs of rapid heat dissipation, resulting in excessive equipment temperature, affecting performance and life. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a phase change liquid cooling plate and a phase change liquid cooling system to solve the problem that the existing liquid cooling plate has low heat transfer efficiency and may not meet the demand for rapid heat dissipation, resulting in excessive equipment temperature and affecting performance and life.

[0007] A phase change liquid cooling plate provided in an embodiment of the present application includes: a hollow plate body and a refrigerant channel;

[0008] The refrigerant channel is laid in the cooling cavity of the hollow plate;

[0009] The refrigerant channel is used to connect to an external compressor through a refrigerant inlet of the hollow plate;

[0010] The cooling cavity is used to connect to an external liquid storage tank through a refrigerant outlet of the hollow plate;

[0011] A plurality of nozzles are arranged on the refrigerant channel; the plurality of nozzles are oriented toward the direction of the external heat source;

[0012] The liquid refrigerant in the external liquid storage tank enters the refrigerant channel through the refrigerant inlet; the liquid refrigerant in the refrigerant channel is sprayed onto the heat exchange inner wall near the external heat source in the hollow plate body through the nozzle, absorbs the heat of the external heat source, vaporizes to obtain gaseous refrigerant, and fills the cooling cavity with the gaseous refrigerant; the gaseous refrigerant in the cooling cavity enters the external compressor through the refrigerant outlet.

[0013] In the above technical solution, the phase change liquid cooling plate adopts phase change refrigerant, and utilizes the principle that the phase change refrigerant absorbs a large amount of latent heat during the phase change process from liquid to gas, so as to take away heat more effectively, have higher heat transfer efficiency, meet the needs of rapid heat dissipation, and avoid the equipment temperature being too high to affect performance and life. Specifically, through multiple nozzles arranged evenly, the liquid refrigerant acts directly on the inner wall of the heat exchange close to the external heat source in the form of a spray, which increases the contact area between the refrigerant and the heat source and improves the heat transfer efficiency. In addition, the arrangement of the refrigerant channel, the distribution of the nozzles, and the injection pressure and other parameters can be adjusted according to actual needs to adapt to different heat sources and heat dissipation requirements.

[0014] In some optional embodiments, the refrigerant outlet and the refrigerant inlet are arranged on the side of the hollow plate body, and the refrigerant outlet is above the refrigerant inlet.

[0015] In the above technical solution, liquid refrigerant enters the refrigerant channel of the phase change liquid cooling plate from a lower refrigerant inlet, and the liquid refrigerant in the refrigerant channel is sprayed onto the inner wall of the heat exchange through a nozzle. The liquid refrigerant vaporizes to obtain a gaseous refrigerant. The vaporized gaseous refrigerant rises in the cooling cavity and is discharged through a higher refrigerant outlet. This rising airflow not only helps to take away the heat, but also forms a convection effect in the hollow plate body, thereby promoting the uniform distribution and dissipation of heat.

[0016] In some optional embodiments, the plurality of nozzles on the refrigerant channel are evenly arranged, and the plurality of nozzles include a first nozzle and a second nozzle;

[0017] The diameter of the second nozzle is larger than that of the first nozzle; wherein the distance between the second nozzle and the refrigerant inlet is larger than the distance between the first nozzle and the refrigerant inlet.

[0018] In the above technical solution, the closer the nozzle is to the refrigerant inlet on the refrigerant channel, the greater its injection pressure and the faster its injection speed; while, the farther the nozzle is from the refrigerant inlet on the refrigerant channel, the smaller its injection pressure and the slower its injection speed. In this embodiment, the nozzles farther from the refrigerant inlet on the refrigerant channel are set with larger calibers, and the nozzles closer to the refrigerant inlet on the refrigerant channel are set with smaller calibers, so that the refrigerant flow rate sprayed by each nozzle is the same or similar, so as to achieve the effect of uniform heat dissipation, thereby avoiding temperature differences.

[0019] In some optional embodiments, a vertical distance between the second nozzle and the inner wall of the heat exchange chamber is smaller than a vertical distance between the first nozzle and the inner wall of the heat exchange chamber.

[0020] In the above technical solution, the closer the nozzle is to the refrigerant inlet on the refrigerant channel, the greater its injection pressure, and the smaller the nozzle diameter, the easier it is for the nozzle to spray liquid refrigerant onto the inner wall of the heat exchange. If the distance between the nozzle and the inner wall of the heat exchange is too close, it will cause damage to the inner wall of the heat exchange during long-term use. The farther the nozzle is from the refrigerant inlet on the refrigerant channel, the smaller its injection pressure, and the larger the nozzle diameter. If the distance between the nozzle and the inner wall of the heat exchange is too far, it is impossible to spray liquid refrigerant onto the inner wall of the heat exchange, or only a small part of the liquid refrigerant can be sprayed onto the inner wall of the heat exchange, which will lead to a decrease in heat exchange efficiency. Therefore, in this embodiment, the closer the nozzle is to the refrigerant inlet on the refrigerant channel, the farther its distance from the inner wall of the heat exchange is, and the closer the nozzle is to the inner wall of the heat exchange is, so as to improve the heat exchange efficiency and avoid the damage to the inner wall of the heat exchange caused by the high-pressure spraying of liquid refrigerant.

[0021] In some optional embodiments, a total flow control valve is provided at the refrigerant inlet;

[0022] The total flow control valve is connected to a controller, and the controller is also connected to a temperature sensor on an external heat source. The controller is used to obtain the temperature of the external heat source and adjust the opening of the total flow control valve according to the temperature.

[0023] In the above technical solution, if the temperature of the external heat source is low and the flow rate of the liquid refrigerant is too large, the liquid refrigerant cannot be completely vaporized, which will cause the liquid refrigerant to accumulate at the bottom of the cooling chamber. If the temperature of the external heat source is high and the flow rate of the liquid refrigerant is small, it is difficult to meet the demand for rapid heat dissipation. Therefore, in this embodiment, a total flow control valve is set at the refrigerant inlet, a temperature sensor is used to monitor the temperature of the heat source, and then a controller is used to adjust the opening of the total flow control valve according to the temperature of the heat source, that is: the higher the temperature of the heat source, the larger the opening of the total flow control valve; the lower the temperature of the heat source, the smaller the opening of the total flow control valve. While meeting the demand for rapid heat dissipation, this embodiment also avoids the accumulation of liquid refrigerant at the bottom of the cooling chamber.

[0024] In some optional embodiments, the nozzle opening of the nozzle is circular.

[0025] In some optional embodiments, the refrigerant channel is a circular pipe.

[0026] In the above technical solution, the refrigerant channel is configured as a circular pipe to reduce the resistance of the flow channel.

[0027] In some optional embodiments, the nozzle is provided with a flow control valve and a flow sensor; the flow sensor is used to detect a unit flow Fi passing through the flow control valve; wherein i=1, 2, 3, ..., n, and n is the total number of nozzles;

[0028] A total flow sensor is also provided at the refrigerant inlet;

[0029] The total flow sensor is used to detect the unit flow F0 passing through the total flow control valve;

[0030] The flow sensor, total flow sensor and flow control valve are all connected to the controller; the controller is also used to:

[0031] The expected unit flow rate F' of each nozzle is determined according to F0; and Fi = F' by controlling the opening of the flow control valve.

[0032] Specifically, if the temperature of the external heat source rises, the controller controls the opening of the total flow valve to increase, thereby increasing the unit flow F0 passing through the total flow control valve; the expected unit flow F' of each nozzle is determined based on the unit flow F0 passing through the total flow control valve. Since F0 increases, F' also increases, and the controller controls the opening of the flow control valve of each nozzle to increase, so that the unit flow Fi passing through the flow control valve increases to F'.

[0033] If the temperature of the external heat source decreases, the controller controls the opening of the total flow valve to decrease, thereby reducing the unit flow F0 passing through the total flow control valve; the expected unit flow F' of each nozzle is determined based on the unit flow F0 passing through the total flow control valve. Since F0 decreases, F' also decreases accordingly. The controller controls the opening of the flow control valve of each nozzle to decrease, so that the unit flow Fi passing through the flow control valve is reduced to F'.

[0034] Therefore, the solution of this embodiment can adjust the opening of the total flow control valve and each nozzle flow control valve in real time according to the temperature change of the external heat source. This dynamic response mechanism ensures that the cooling system can quickly adapt to the change of the heat source temperature, thereby maintaining high heat exchange efficiency. In addition, by accurately controlling the flow rate of each nozzle to the desired unit flow rate, the cooling effect at each nozzle is ensured to be more uniform, preventing equipment damage or performance degradation due to local overheating.

[0035] In some optional embodiments, external heat sources are provided above and below the hollow plate;

[0036] One external heat source is connected to the top plate of the hollow plate body through an insulating layer and a heat-conducting layer, and another external heat source is connected to the bottom plate of the hollow plate body through an insulating layer and a heat-conducting layer; the bottom surface of the top plate and the top surface of the bottom plate are both heat exchange inner walls.

[0037] In some optional embodiments, an external heat source is disposed above the hollow plate;

[0038] The external heat source is connected to the top plate of the hollow plate body through an insulating layer and a heat-conducting layer, and the bottom surface of the top plate is a heat exchange inner wall.

[0039] In the above technical solution, the phase change liquid cooling plate is arranged below the heat source, for example, the phase change liquid cooling plate is arranged in a base or tray for supporting key equipment, batteries or electronic components.

[0040] In some optional embodiments, an external heat source is disposed below the hollow plate;

[0041] The external heat source is connected to the bottom plate of the hollow plate body through an insulating layer and a heat-conducting layer, and the top surface of the bottom plate is a heat exchange inner wall.

[0042] In the above technical solution, the phase change liquid cooling plate is arranged above the heat source, for example, the phase change liquid cooling plate is arranged in the top cover of a cabinet for accommodating key equipment, batteries or electronic components.

[0043] A phase change liquid cooling system provided in an embodiment of the present application includes: a condenser, a liquid storage tank, a compressor, and a phase change liquid cooling plate as described in any one of the above;

[0044] The liquid refrigerant in the liquid storage tank enters the refrigerant channel of the phase change liquid cooling plate through the refrigerant inlet of the phase change liquid cooling plate; the liquid refrigerant in the refrigerant channel is sprayed onto the heat exchange inner wall of the phase change liquid cooling plate close to the external heat source through the nozzle, absorbs the heat of the external heat source, and vaporizes to obtain gaseous refrigerant, so that the gaseous refrigerant fills the cooling cavity of the phase change liquid cooling plate; the gaseous refrigerant in the cooling cavity enters the compressor through the refrigerant outlet of the phase change liquid cooling plate; the compressor compresses the gaseous refrigerant and sends it to the condenser; the condenser liquefies the high-temperature and high-pressure gaseous refrigerant into liquid refrigerant and sends it to the liquid storage tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic diagram of the structure of a phase change liquid cooling plate provided in the first embodiment of the present application;

[0047] Figure 2 A schematic cross-sectional view of a phase change liquid cooling plate provided in the first embodiment of the present application;

[0048] Figure 3A schematic diagram of a phase change liquid cooling plate structure provided in the second embodiment of the present application;

[0049] Figure 4 A schematic diagram of a phase change liquid cooling plate structure provided in the third embodiment of the present application;

[0050] Figure 5 A schematic diagram of a phase change liquid cooling plate structure provided in the fourth embodiment of the present application;

[0051] Figure 6 A schematic diagram of a phase change liquid cooling plate structure provided in the fifth embodiment of the present application;

[0052] Figure 7 A functional module diagram of a phase change liquid cooling system provided in an embodiment of the present application.

[0053] Icon: 1-heat source, 2-hollow plate, 3-refrigerant channel, 4-nozzle, 5-refrigerant inlet, 6-refrigerant outlet, 7-cooling chamber. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0055] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of a phase change liquid cooling plate provided in the first embodiment of the present application includes: a hollow plate body 2 and a refrigerant channel 3.

[0056] Among them, the refrigerant channel 3 is laid in the cooling cavity 7 of the hollow plate body 2; the refrigerant channel 3 is used to be connected to an external compressor through the refrigerant inlet 5 of the hollow plate body 2; the cooling cavity 7 is used to be connected to an external liquid storage tank through the refrigerant outlet 6 of the hollow plate body 2; a plurality of nozzles 4 are evenly arranged on the refrigerant channel 3; and the plurality of nozzles 4 are facing the direction of the external heat source 1.

[0057] The liquid refrigerant in the external liquid storage tank enters the refrigerant channel 3 through the refrigerant inlet 5; the liquid refrigerant in the refrigerant channel 3 is sprayed onto the heat exchange inner wall of the hollow plate body 2 close to the external heat source 1 through the nozzle 4, absorbs the heat of the external heat source 1, vaporizes to obtain gaseous refrigerant, and fills the cooling cavity 7 with the gaseous refrigerant; the gaseous refrigerant in the cooling cavity 7 enters the external compressor through the refrigerant outlet 6.

[0058] In the embodiment of the present application, the phase change liquid cooling plate adopts a phase change refrigerant, which utilizes the principle that the phase change refrigerant absorbs a large amount of latent heat during the phase change process from liquid to gas, so as to more effectively remove heat and have a higher heat transfer efficiency, meet the needs of rapid heat dissipation, and avoid the equipment temperature being too high to affect performance and life. Specifically, through a plurality of uniformly arranged nozzles 4, the liquid refrigerant acts directly on the inner wall of the heat exchange close to the external heat source 1 in the form of a spray, thereby increasing the contact area between the refrigerant and the heat source 1 and improving the heat transfer efficiency. In addition, the arrangement of the refrigerant channel 3, the distribution of the nozzle 4, and the injection pressure and other parameters can be adjusted according to actual needs to adapt to different heat sources 1 and heat dissipation requirements.

[0059] In some optional embodiments, the nozzles 4 on the refrigerant channel 3 can also be arranged according to the heat partition of the external heat source 1, and the nozzles 4 are set at the corresponding positions of the heat concentration areas of the external heat source 1 to achieve the purpose of targeted local rapid cooling.

[0060] In addition, in a scenario where the heat concentration area of ​​the external heat source 1 may change at any time, the multiple nozzles 4 on the refrigerant channel 3 can also be evenly arranged, and the corresponding nozzles 4 can be opened according to the area where local cooling is required.

[0061] Please refer to Figure 2 , Figure 2 A cross-sectional schematic diagram of a phase change liquid cooling plate provided in the first embodiment of the present application. The refrigerant channel 3 of this embodiment branches into four branch channels after the refrigerant inlet 5, and a nozzle 4 is arranged at a certain interval on each branch channel.

[0062] In some optional embodiments, the refrigerant outlet 6 and the refrigerant inlet 5 are arranged on the side of the hollow plate body 2 , and the refrigerant outlet 6 is above the refrigerant inlet 5 .

[0063] In the embodiment of the present application, liquid refrigerant enters the refrigerant channel 3 of the phase change liquid cooling plate from the lower refrigerant inlet 5, the liquid refrigerant in the refrigerant channel 3 is sprayed onto the inner wall of the heat exchange through the nozzle 4, the liquid refrigerant is vaporized to obtain gaseous refrigerant, the vaporized gaseous refrigerant rises in the cooling cavity 7, and is discharged through the higher refrigerant outlet 6. This rising airflow not only helps to take away the heat, but also forms a convection effect in the hollow plate body 2, thereby promoting the uniform distribution and dissipation of heat.

[0064] In some optional embodiments, the refrigerant outlet 6 may also be disposed in the top plate of the hollow plate body 2 .

[0065] In some optional embodiments, the plurality of nozzles 4 include a first nozzle 4 and a second nozzle 4. The diameter of the second nozzle 4 is larger than that of the first nozzle 4; wherein the distance between the second nozzle 4 and the refrigerant inlet 5 is larger than that between the first nozzle 4 and the refrigerant inlet 5.

[0066] In the embodiment of the present application, in addition to the first nozzle and the second nozzle, there may be other nozzles. In short, the closer the nozzle 4 is to the refrigerant inlet 5 on the refrigerant channel 3, the greater its injection pressure and the faster its injection speed; and the farther the nozzle 4 is from the refrigerant inlet 5 on the refrigerant channel 3, the smaller its injection pressure and the slower its injection speed. In this embodiment, the nozzle 4 farther from the refrigerant inlet 5 on the refrigerant channel 3 is set with a larger diameter, and the nozzle 4 closer to the refrigerant inlet 5 on the refrigerant channel 3 is set with a smaller diameter, so that the refrigerant flow rate sprayed by each nozzle 4 is the same or similar, so as to achieve the effect of uniform heat dissipation, thereby avoiding temperature differences.

[0067] In some optional embodiments, a vertical distance between the second nozzle 4 and the inner wall of the heat exchange chamber is smaller than a vertical distance between the first nozzle 4 and the inner wall of the heat exchange chamber.

[0068] In the embodiment of the present application, the closer the nozzle 4 is to the refrigerant inlet 5 on the refrigerant channel 3, the greater its injection pressure, and the smaller the nozzle 4 caliber, the easier it is for the nozzle 4 to spray the liquid refrigerant onto the inner wall of the heat exchange. If the nozzle 4 is too close to the inner wall of the heat exchange, it will cause loss to the inner wall of the heat exchange during long-term use. The farther the nozzle 4 is from the refrigerant inlet 5 on the refrigerant channel 3, the smaller its injection pressure, and the larger the nozzle 4 caliber, if the nozzle 4 is too far away from the inner wall of the heat exchange, it is impossible to spray the liquid refrigerant onto the inner wall of the heat exchange, or only a small part of the liquid refrigerant can be sprayed onto the inner wall of the heat exchange, which will lead to a decrease in heat exchange efficiency. Therefore, in this embodiment, the closer the nozzle 4 is to the refrigerant inlet 5 on the refrigerant channel 3, the farther its distance from the inner wall of the heat exchange, and the closer the nozzle 4 is to the inner wall of the heat exchange, the better the heat exchange efficiency, and the loss of the heat exchange inner wall caused by the high-pressure spray of liquid refrigerant is avoided.

[0069] In some optional embodiments, a total flow control valve is provided at the refrigerant inlet 5; the total flow control valve is connected to a controller, and the controller is also connected to a temperature sensor on the external heat source 1, and the controller is used to: obtain the temperature of the external heat source 1, and adjust the opening of the total flow control valve according to the temperature.

[0070] In the embodiment of the present application, if the temperature of the external heat source 1 is low and the flow rate of the liquid refrigerant is too large, the liquid refrigerant cannot be completely vaporized, which will cause the liquid refrigerant to accumulate at the bottom of the cooling chamber 7. If the temperature of the external heat source 1 is high and the flow rate of the liquid refrigerant is small, it is difficult to meet the demand for rapid heat dissipation. Therefore, in this embodiment, a total flow control valve is set at the refrigerant inlet 5, a temperature sensor is used to monitor the temperature of the heat source 1, and then a controller is used to adjust the opening of the total flow control valve according to the temperature of the heat source 1, that is: the higher the temperature of the heat source 1, the larger the opening of the total flow control valve; the lower the temperature of the heat source 1, the smaller the opening of the total flow control valve. While meeting the demand for rapid heat dissipation, this embodiment also avoids the accumulation of liquid refrigerant at the bottom of the cooling chamber 7.

[0071] In some optional embodiments, the nozzle is provided with a flow control valve and a flow sensor; the flow sensor is used to detect a unit flow Fi passing through the flow control valve; wherein i=1, 2, 3, ..., n, and n is the total number of nozzles;

[0072] A total flow sensor is also provided at the refrigerant inlet;

[0073] The total flow sensor is used to detect the unit flow F0 passing through the total flow control valve;

[0074] The flow sensor, total flow sensor and flow control valve are all connected to the controller; the controller is also used to:

[0075] Determine the expected unit flow F' of each nozzle based on F0; control the opening of the flow control valve to make Fi = F'; if Fi is greater than F', control the opening of the flow control valve of the i-th nozzle to decrease; if Fi is less than F', control the opening of the flow control valve of the i-th nozzle to increase.

[0076] Specifically, if the temperature of the external heat source rises, the controller controls the opening of the total flow valve to increase, thereby increasing the unit flow F0 passing through the total flow control valve; the expected unit flow F' of each nozzle is determined based on the unit flow F0 passing through the total flow control valve. Since F0 increases, F' also increases, and the controller controls the opening of the flow control valve of each nozzle to increase, so that the unit flow Fi passing through the flow control valve increases to F'.

[0077] If the temperature of the external heat source decreases, the controller controls the opening of the total flow valve to decrease, thereby reducing the unit flow F0 passing through the total flow control valve; the expected unit flow F' of each nozzle is determined based on the unit flow F0 passing through the total flow control valve. Since F0 decreases, F' also decreases accordingly. The controller controls the opening of the flow control valve of each nozzle to decrease, so that the unit flow Fi passing through the flow control valve is reduced to F'.

[0078] Therefore, the solution of this embodiment can adjust the opening of the total flow control valve and each nozzle flow control valve in real time according to the temperature change of the external heat source. This dynamic response mechanism ensures that the cooling system can quickly adapt to the change of the heat source temperature, thereby maintaining high heat exchange efficiency. In addition, by accurately controlling the flow rate of each nozzle to the desired unit flow rate, the cooling effect at each nozzle is ensured to be more uniform, preventing equipment damage or performance degradation due to local overheating.

[0079] In some optional embodiments, the nozzle opening of the nozzle 4 is circular.

[0080] In some optional embodiments, the refrigerant channel 3 is a circular pipe.

[0081] In the embodiment of the present application, the refrigerant channel 3 is configured as a circular pipe to reduce the resistance of the flow channel.

[0082] In other embodiments, the nozzle opening of the nozzle 4 may also be rectangular, elliptical, etc., and the refrigerant channel may also be a square pipe, an elliptical pipe, etc.

[0083] In some optional embodiments, an external heat source 1 is disposed above the hollow plate body 2; the external heat source 1 is connected to the top plate of the hollow plate body 2 via an insulating layer and a heat-conducting layer, and the bottom surface of the top plate is a heat exchange inner wall.

[0084] In an embodiment of the present application, the phase-change liquid cooling plate is disposed below the heat source 1 , for example, the phase-change liquid cooling plate is disposed in a base or tray for supporting key equipment, batteries or electronic components.

[0085] Please refer to Figure 3 , Figure 3 A schematic diagram of a phase change liquid cooling plate structure provided in the second embodiment of the present application. The difference between the second embodiment and the first embodiment is that:

[0086] In this embodiment, an external heat source 1 is arranged below the hollow plate 2; the external heat source 1 is connected to the bottom plate of the hollow plate 2 through an insulating layer and a heat-conducting layer, and the top surface of the bottom plate is a heat exchange inner wall. A plurality of nozzles 4 are arranged on the lower surface of the refrigerant channel 3, and these nozzles 4 spray liquid refrigerant downward.

[0087] In an embodiment of the present application, the phase-change liquid cooling plate is arranged above the heat source 1, for example, the phase-change liquid cooling plate is arranged in the top cover of a cabinet for accommodating key equipment, batteries or electronic components.

[0088] Please refer to Figure 4 , Figure 4 A schematic diagram of a phase change liquid cooling plate structure provided in the third embodiment of the present application. The difference between the third embodiment and the first embodiment is that:

[0089] In this embodiment, an external heat source 1 can be arranged above and below the hollow plate body 2. The upper external heat source 1 is connected to the top plate of the hollow plate body 2 through an insulating layer and a heat-conducting layer, and the bottom surface of the top plate is a heat exchange inner wall. The lower external heat source 1 is also connected to the bottom plate of the hollow plate body 2 through an insulating layer and a heat-conducting layer, and the top surface of the bottom plate also serves as a heat exchange inner wall. Nozzles 4 are arranged on both the upper and lower surfaces of the refrigerant channel 3 of this embodiment.

[0090] In the embodiment of the present application, the phase change liquid cooling plate can be arranged above the heat source 1, below the heat source 1, or between the upper and lower heat sources 1. When the phase change liquid cooling plate is arranged above the heat source 1, although there is no heat source 1 above the phase change liquid cooling plate, since the hollow plate body 2 adopts heat conductive material, the liquid refrigerant sprayed from the nozzle 4 arranged on the upper surface of the refrigerant channel 3 can also play a role in absorbing heat. Similarly, when the phase change liquid cooling plate is arranged below the heat source 1, although there is no heat source 1 below the phase change liquid cooling plate, since the hollow plate body 2 adopts heat conductive material, the liquid refrigerant sprayed from the nozzle 4 on the lower surface of the refrigerant channel 3 can also play a role in absorbing heat.

[0091] Please refer to Figure 5 , Figure 5 A schematic diagram of a phase change liquid cooling plate structure provided in the fourth embodiment of the present application. The fourth embodiment differs from the first embodiment in that:

[0092] The phase change liquid cold plate of this embodiment is placed vertically next to the heat source 1. As shown in the figure, the external heat source 1 on the left is connected to the left large panel of the hollow plate body 2 through an insulating layer and a heat conductive layer, and the back of the left large panel is the heat exchange inner wall. A plurality of nozzles 4 are arranged on the left surface of the refrigerant channel 3, and these nozzles 4 spray liquid refrigerant to the left.

[0093] In the embodiment of the present application, the refrigerant inlet 5 is arranged on the non-contact surface of the upper part of the phase change liquid cooling plate to avoid too low pressure of the top nozzle 4. Among them, the non-contact surface is the surface of the phase change liquid cooling plate that does not contact the heat source 1, including the top surface, the right large surface, and the front and rear side surfaces of the phase change liquid cooling plate. The refrigerant outlet 6 of this embodiment is also arranged on the non-contact surface of the upper part of the phase change liquid cooling plate.

[0094] Please refer to Figure 6 , Figure 6 A schematic diagram of a phase change liquid cooling plate structure provided in the fifth embodiment of the present application;

[0095] The phase change liquid cooling plate of this embodiment is placed vertically next to the heat source 1, and the external heat source 1 can be set on both the left and right sides of the phase change liquid cooling plate. The external heat source 1 on the left side is connected to the large panel on the left side of the hollow plate body 2 through an insulating layer and a heat conductive layer, and the back of the large panel on the left side is the inner wall of the heat exchange. The external heat source 1 on the right side is also connected to the large panel on the right side of the hollow plate body 2 through an insulating layer and a heat conductive layer, and the back of the large panel on the right side also serves as the inner wall of the heat exchange. Nozzles 4 are provided on the left and right surfaces of the refrigerant channel 3 of this embodiment. The nozzle 4 on the left surface of the refrigerant channel 3 sprays liquid refrigerant to the left, mainly for heat exchange with the heat source 1 on the left. The nozzle 4 on the right surface of the refrigerant channel 3 sprays liquid refrigerant to the right, mainly for heat exchange with the heat source 1 on the right.

[0096] In the embodiment of the present application, the phase change liquid cooling plate can be arranged on the right side of the heat source 1, or on the left side of the heat source 1, or between the left and right heat sources 1. When the phase change liquid cooling plate is arranged on the right side of the heat source 1, although there is no heat source 1 on the left side of the phase change liquid cooling plate, since the hollow plate body 2 adopts heat conductive material, the liquid refrigerant sprayed from the nozzle 4 arranged on the right side surface of the refrigerant channel 3 can also play a role in absorbing heat. Similarly, when the phase change liquid cooling plate is arranged on the left side of the heat source 1, although there is no heat source 1 on the right side of the phase change liquid cooling plate, since the hollow plate body 2 adopts heat conductive material, the liquid refrigerant sprayed from the nozzle 4 on the right side surface of the refrigerant channel 3 can also play a role in absorbing heat.

[0097] Please refer to Figure 7 , Figure 7 A functional module diagram of a phase change liquid cooling system provided in an embodiment of the present application, the system includes: a condenser, a liquid storage tank, a compressor and a phase change liquid cooling plate as any of the above items.

[0098] Among them, the liquid refrigerant in the liquid storage tank enters the refrigerant channel 3 of the phase change liquid cooling plate through the refrigerant inlet 5 of the phase change liquid cooling plate; the liquid refrigerant in the refrigerant channel 3 is sprayed onto the heat exchange inner wall of the phase change liquid cooling plate close to the external heat source 1 through the nozzle 4, absorbs the heat of the external heat source 1, and vaporizes to obtain gaseous refrigerant, so that the gaseous refrigerant fills the cooling cavity 7 of the phase change liquid cooling plate; the gaseous refrigerant in the cooling cavity 7 enters the compressor through the refrigerant outlet 6 of the phase change liquid cooling plate; the compressor compresses the gaseous refrigerant and sends it to the condenser; the condenser liquefies the high-temperature and high-pressure gaseous refrigerant into liquid refrigerant and sends it to the liquid storage tank.

[0099] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0100] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0101] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0102] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0103] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A phase change liquid cooling plate, characterized in that: include: Hollow plate and refrigerant channel; The refrigerant channel is laid in the cooling cavity of the hollow plate body; The refrigerant channel is used to connect to an external compressor through the refrigerant inlet of the hollow plate; The cooling cavity is used to be connected to an external liquid storage tank through the refrigerant outlet of the hollow plate; A plurality of nozzles are arranged on the refrigerant channel; the plurality of nozzles are oriented toward the external heat source; The liquid refrigerant in the external liquid storage tank enters the refrigerant channel through the refrigerant inlet; the liquid refrigerant in the refrigerant channel is sprayed onto the heat exchange inner wall of the hollow plate body close to the external heat source through the nozzle, absorbs the heat of the external heat source, and vaporizes to obtain gaseous refrigerant, and the gaseous refrigerant enters the external compressor through the refrigerant outlet.

2. The phase change liquid cooling plate according to claim 1, characterized in that: The refrigerant outlet and the refrigerant inlet are arranged on the side of the hollow plate body, and the refrigerant outlet is above the refrigerant inlet.

3. The phase change liquid cooling plate according to claim 1, characterized in that: The plurality of nozzles are evenly arranged on the refrigerant channel; The plurality of nozzles include a first nozzle and a second nozzle; The diameter of the second nozzle is larger than that of the first nozzle; wherein the distance between the second nozzle and the refrigerant inlet is larger than the distance between the first nozzle and the refrigerant inlet.

4. The phase change liquid cooling plate according to claim 3, characterized in that: A vertical distance between the second nozzle and the heat exchange inner wall is smaller than a vertical distance between the first nozzle and the heat exchange inner wall.

5. The phase change liquid cooling plate according to claim 1, characterized in that: The refrigerant inlet is provided with a total flow control valve; The total flow control valve is connected to a controller, and the controller is also connected to a temperature sensor on an external heat source. The controller is used to obtain the temperature of the external heat source and adjust the opening of the total flow control valve according to the temperature.

6. The phase change liquid cooling plate according to claim 5, characterized in that: The nozzle is provided with a flow control valve and a flow sensor; the flow sensor is used to detect the unit flow Fi passing through the flow control valve; wherein i=1, 2, 3, ..., n, and n is the total number of nozzles; The refrigerant inlet is also provided with a total flow sensor; The total flow sensor is used to detect the unit flow F0 passing through the total flow control valve; The flow sensor, the total flow sensor and the flow control valve are all connected to a controller; the controller is also used for: The desired unit flow rate F' of each nozzle is determined according to F0; and Fi = F' by controlling the opening of the flow control valve.

7. The phase change liquid cooling plate according to claim 1, characterized in that: External heat sources are arranged above and below the hollow plate; One external heat source is connected to the top plate of the hollow plate body through an insulating layer and a heat-conducting layer, and another external heat source is connected to the bottom plate of the hollow plate body through an insulating layer and a heat-conducting layer; the bottom surface of the top plate and the top surface of the bottom plate are both the heat exchange inner walls.

8. The phase change liquid cooling plate according to claim 1, characterized in that: An external heat source is arranged above the hollow plate; The external heat source is connected to the top plate of the hollow plate body through an insulating layer and a heat-conducting layer, and the bottom surface of the top plate is the heat exchange inner wall.

9. The phase change liquid cooling plate according to claim 1, characterized in that: An external heat source is arranged below the hollow plate; The external heat source is connected to the bottom plate of the hollow plate body through an insulating layer and a heat-conducting layer, and the top surface of the bottom plate is the heat exchange inner wall.

10. A phase change liquid cooling system, characterized in that: include: A condenser, a liquid storage tank, a compressor, and a phase change liquid cooling plate as claimed in any one of claims 1 to 9; The liquid refrigerant in the liquid storage tank enters the refrigerant channel of the phase change liquid cooling plate through the refrigerant inlet of the phase change liquid cooling plate; the liquid refrigerant in the refrigerant channel is sprayed onto the heat exchange inner wall of the phase change liquid cooling plate close to the external heat source through a nozzle, absorbs the heat of the external heat source, and vaporizes to obtain gaseous refrigerant, so that the gaseous refrigerant fills the cooling cavity of the phase change liquid cooling plate; the gaseous refrigerant in the cooling cavity enters the compressor through the refrigerant outlet of the phase change liquid cooling plate; the compressor compresses the gaseous refrigerant and sends it to the condenser; the condenser liquefies the gaseous refrigerant into liquid refrigerant and sends it to the liquid storage tank.

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