Electronic device

Abstract

The invention provides an electronic device. The electronic equipment comprises a heating device, a heat conduction piece, an air duct, a radiator and a fan. The heat conduction piece is in heat conduction connection with the heating device; the radiator is located in the air channel, the radiator is connected to the heat conduction piece in a heat conduction mode, the radiator comprises a plurality of heat dissipation parts, and the fan is located in the air channel and used for guiding heat of the heat dissipation parts out of the electronic equipment. The electronic equipment provided by the embodiment of the invention has a relatively good heat dissipation effect on the heating device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] With the development of technology, mobile phones and other electronic devices are becoming more and more popular and more powerful. The requirements for heat dissipation of electronic devices are also getting higher and higher. However, the heat dissipation of electronic devices in related technologies is not good. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising:

[0004] Heating device;

[0005] A heat conducting member, the heat conducting member being thermally connected to the heat generating device;

[0006] Air duct;

[0007] a heat sink, the heat sink being located in the air duct and being thermally connected to the heat conducting member, the heat sink comprising a plurality of heat dissipating parts; and

[0008] A fan is located in the air duct and is used to export heat from the multiple heat dissipation parts to the outside of the electronic device.

[0009] In summary, the electronic device provided in the embodiment of the present application includes a heating device, a heat conductor, an air duct, a radiator and a fan. The heat of the heating device is transferred to the air duct via the heat conductor, and then to the multiple heat dissipation parts of the radiator located in the air duct. The fan is located in the air duct, and is used to quickly discharge the heat of the multiple heat dissipation parts of the radiator located in the air duct to the outside of the air duct, taking away the heat of the heat dissipation parts, thereby achieving the effect of quickly dissipating the heat of the heating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application;

[0012] Figure 2 For one embodiment Figure 1 A schematic projection diagram of some components of an electronic device;

[0013] Figure 3 for Figure 2 A schematic cross-sectional view of the electronic device shown along line II;

[0014] Figure 4 For one embodiment Figure 2 A schematic cross-sectional view of the electronic device along line II-II;

[0015] Figure 5 for Figure 4 Detailed identification diagrams in cross-sectional schematics of electronic equipment;

[0016] Figure 6 A schematic diagram of a radiator provided in one embodiment of the present application;

[0017] Figure 7 A schematic diagram of a heat sink provided in another embodiment of the present application;

[0018] Figure 8 For another embodiment Figure 2 A schematic cross-sectional view of the electronic device along line II-II;

[0019] Fig. 9 A schematic diagram of a heat sink provided in yet another embodiment of the present application;

[0020] Fig.10 A schematic diagram of a heat sink provided in yet another embodiment of the present application;

[0021] Fig.11 For another embodiment Figure 1 A schematic projection diagram of some components of an electronic device;

[0022] Fig.12 for Fig.11 A schematic cross-sectional view of the electronic device shown along line III-III;

[0023] Fig.13 for Fig.11 A schematic cross-sectional view of an electronic device along line IV-IV;

[0024] Fig.14 for Figure 2 A cross-sectional view of an electronic device along line II-II provided in another embodiment;

[0025] Fig.15 for Fig.11 A cross-sectional view of an electronic device along line IV-IV provided in another embodiment;

[0026] Fig.16 For another embodiment Figure 1 A schematic projection diagram of some components of an electronic device;

[0027] Fig.17 for Fig.10 Schematic diagram of some structures in ;

[0028] Fig.18 A schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0029] Fig.19 A partial structural schematic diagram of an electronic device provided in another embodiment of the present application;

[0030] Fig. 20 A partial structural schematic diagram of an electronic device provided in yet another embodiment of the present application;

[0031] Fig.21 A three-dimensional schematic diagram of an electronic device from one viewing angle provided by another embodiment of the present application;

[0032] Fig. 22 for Fig.21 A three-dimensional schematic diagram of an electronic device from another perspective provided in;

[0033] Fig.23 A three-dimensional schematic diagram of an electronic device under one viewing angle provided by yet another embodiment of the present application;

[0034] Fig.24 for Fig.23 The enlarged schematic diagram of point A in the middle;

[0035] Fig.25 for Fig.23 A three-dimensional schematic diagram of an electronic device from another perspective provided in;

[0036] Fig.26 for Fig.25 A magnified schematic diagram of point B in the middle. DETAILED DESCRIPTION

[0037] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0038] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0039] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0040] The present application provides an electronic device 1, which can be, but is not limited to, a mobile phone, a watch, a tablet computer, a laptop computer, and the like. The present application takes the mobile phone as an example for illustration and description, which should not be construed as a limitation on the present application. Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application; Figure 2 For one embodiment Figure 1 A schematic projection diagram of some components of an electronic device; Figure 3 for Figure 2 A schematic cross-sectional view of the electronic device shown along line II; Figure 4 For one embodiment Figure 2 The electronic device 1 includes a heating device 10, a heat conducting member 210, a heat sink 220, an air duct 50 and a fan 260a.

[0041] In one embodiment, the heating device 10 is a functional device that generates heat in the electronic device 1. The heating device 10 is also called a heat source. The heating device 10 may be, but is not limited to, a system on chip (SOC), a camera, or the like. The present application does not limit the heating device 10. When the functional device is working, heat is generated. If the heat is not dissipated in time, the temperature of the functional device is too high, which may cause damage to the functional device or make the functional device unable to perform the corresponding function well. In addition, when the temperature of the functional device is too high, it may also cause adverse effects on other components around the functional device.

[0042] In the schematic diagram of this embodiment, the heating device 10 is located on the circuit board 110, and the heating device 10 is connected to the heat conductive member 210 through the heat conductive connecting member 120. It can be understood that these should not be construed as limitations on the implementation of this application.

[0043] The heat sink 220 is used to dissipate heat from the heating device 10 to reduce the heat of the heating device 10 , thereby enabling the heating device 10 to work normally and reducing the adverse effects of the heating device 10 on other components around the heating element 10 .

[0044] The heat conductive member 210 is thermally connected to the heat generating device 10. Specifically, the heat conductive member 210 can receive the heat generated by the heat generating device 10. In other words, the heat generated by the heat generating device 10 can be transferred to the heat conductive member 210.

[0045] In one embodiment, the heat conductor 210 covers the heating device 10. In other words, the orthographic projection of the heating device 10 falls within the area where the heat conductor 210 is located. Since the heat conductor 210 covers the heating device 10, the heat conductor 210 has a larger heat dissipation surface, and can quickly conduct the heat emitted by the heating device 10 to improve the heat dissipation effect of the heating device 10, and further make the electronic device 1 have a better heat dissipation effect. In another embodiment, the heat conductor 210 does not cover the heating device 10. It is sufficient as long as the heat conductor 210 is thermally connected to the heating device 10.

[0046] In one embodiment, the heat conductor 210 includes one or more sub-heat conductors. The sub-heat conductor includes one or more of a vapor chamber (VC), a graphite sheet, a graphene sheet, a liquid cooling sheet, and a heat-conducting metal sheet. In the schematic diagram of the present embodiment, the heat conductor 210 includes two sub-heat conductors that are stacked as an example for illustration, which can be understood that it should not be understood as a limitation on the embodiment of the present application. In the present embodiment, the two sub-heat conductors are a vapor chamber and a graphite sheet, respectively. In other words, in the present embodiment, the heat conductor 210 includes a vapor chamber and a graphite sheet that are stacked. For the convenience of description, the two heat conductors are named the first sub-heat conductor 211 and the second sub-heat conductor 212, respectively, and the first sub-heat conductor 211 and the second sub-heat conductor 212 are stacked.

[0047] The temperature averaging plate may be, but is not limited to, a stainless steel temperature averaging plate, a copper temperature averaging plate, a stainless steel composite copper temperature averaging plate, or an aluminum composite copper temperature averaging plate. The heat conductive metal sheet may include, but is not limited to, a copper sheet or an aluminum sheet.

[0048] In the electronic device 1 provided in the embodiment of the present application, the heat sink 220 is thermally connected to the heat conductor 210, and the heat conductor 210 can transfer heat to the heat sink 220 to further improve the heat dissipation effect of the heating device 10, thereby improving the heat dissipation effect of the electronic device 1. The connection relationship between the heat sink 220 and the heat conductor 210 will be described in detail later.

[0049] Furthermore, in the electronic device 1 provided in the embodiment of the present application, the heat conductor 210 covers the radiator 220. In other words, the orthographic projection of the heat conductor 210 falls into the area where the heat conductor 210 is located. Therefore, the heat conductor 210 has a large heat dissipation surface, which can quickly conduct the heat emitted by the heating device 10 to improve the heat dissipation effect of the heating device 10, and further make the electronic device 1 have a better heat dissipation effect. In other embodiments, the heat conductor 210 may not cover the radiator 220. It is sufficient as long as the radiator 220 is thermally connected to the heat conductor 210.

[0050] In one embodiment, when the heat conductive member 210 and the heating device 10 are disposed on the same side of the middle frame 30, or when the heat conductive member 210 and the heating device 10 are disposed on different sides of the middle frame 30, and the middle frame 30 has a through hole, the electronic device 1 further includes a heat conductive connector. The heat conductive member 210 is connected to the heating device 10 via the heat conductive connector.

[0051] The thermally conductive connector may include but is not limited to one or more of a thermal interface connector and a thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, a thermally conductive gel, a thermally conductive silicone grease, and a liquid metal. In another embodiment, the thermally conductive connector may also be a combination of a conventional foam and a thermal interface material, for example, the gaps in the conventional foam are filled with a thermally conductive gel, a thermally conductive silicone grease, or a liquid metal.

[0052] The electronic device 1 includes a heat-conducting connector, and the heat-conducting component 210 is connected to the heating device 10 via the heat-conducting connector, so that the heat generated by the heating device 10 can be quickly transferred to the heat-conducting component 210 via the heat-conducting connector, thereby improving the heat dissipation effect of the electronic device 1.

[0053] In summary, the electronic device 1 provided in the embodiment of the present application includes a heating device 10, a heat conductor 210 and a heat sink 220. The heat conductor 210 is conductively connected to the heating device 10, so that the heat generated by the heating device 10 can be conducted out through the heat conductor 210 to dissipate the heat of the heating device 10.

[0054] In one embodiment, the heat conductive member 210 covers the heating device 10, so the heat conductive member 210 has a large heat dissipation area and can quickly conduct the heat generated by the heating device 10 to improve the heat dissipation effect of the heating device 10. Further, the electronic device 1 also includes a heat sink 220, which is thermally connected to the heat conductive member 210, and the heat conductive member 210 can transfer heat to the heat sink 220 to further improve the heat dissipation effect of the heating device 10.

[0055] In the electronic device 1 provided in one embodiment, the heat conductor 210 covers the heat sink 220. Therefore, the heat conductor 210 has a larger heat dissipation surface and can quickly conduct the heat generated by the heating device 10 to improve the heat dissipation effect of the heating device 10, further enabling the electronic device 1 to have a better heat dissipation effect.

[0056] Furthermore, the heat sink 220 is located in the air duct 50. The heat sink 220 is thermally connected to the heat conducting member 210. The structure of the heat sink 220 is described above and will not be described again. The fan 260a is located in the air duct 50 and is used to heat the plurality of heat dissipating parts 222 (see Figure 6 , Figure 7 , Fig. 9 and Fig.10 ) is exported to the outside of the electronic device 1. In this embodiment, the fan 260a includes the first fan 260 and the second fan 270 as an example for illustration, which is understandable and should not be construed as limiting the electronic device 1 provided in the embodiment of the present application.

[0057] The air duct 50 is a passage for air circulation in the electronic device 1. The heat of the heating device 10 is transferred to the air duct 50 via the heat conducting member 210, and is transferred to the multiple heat dissipation parts 222 of the heat sink 220 located in the air duct 50. The fan 260a is located in the air duct 50, and the fan 260a is used to draw air into the air duct 50. The air drawn into the air duct 50 passes through the multiple heat dissipation parts 222 of the heat sink 220 to take away the heat of the heat dissipation parts 222, thereby achieving the effect of heat dissipation of the heating device 10; and / or, the fan 260a is used to discharge the air in the air duct 50 to the outside of the air duct 50. When the fan 260a discharges the air in the air duct 50 to the outside of the air duct 50, it takes away the heat of the heat dissipation parts 222, thereby achieving the effect of heat dissipation of the heating device 10.

[0058] It can be seen that in the electronic device 1 provided in the embodiment of the present application, the heat of the heating device 10 can be transferred to the heat dissipation portion 222 of the radiator 220 via the heat conductor 210, the radiator 220 and the fan 260a are both located in the air duct 50, and the fan 260a can inhale air into the air duct 50; and / or be used to discharge the air in the air duct 50 to the outside of the air duct 50 to take away the heat of the heat dissipation portion 222, thereby achieving the effect of heat dissipation of the heating device 10. In addition, since the radiator 220 and the fan 260a are both located in the air duct 50, the thickness of the electronic device 1 can be made thinner to a certain extent.

[0059] See also Figures 1 to 4 Also see Figure 5 , Figure 5 for Figure 4 Detail identification diagram in the cross-sectional schematic diagram of the electronic device. In this embodiment, the electronic device 1 includes a middle frame 30. The middle frame 30 has a first bearing surface 30a and a second bearing surface 30b opposite to each other. The heating device 10 is located on one side of the first bearing surface 30a, and the heat conductor 210 is located on one side of the second bearing surface 30b. The orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heating device 10 on the second bearing surface 30b.

[0060] Generally speaking, the middle frame 30 of the electronic device 1 includes metal, such as aluminum-magnesium alloy. The middle frame 30 constitutes at least part of the ground electrode in the electronic device 1. The middle frame 30 is used to carry components of the electronic device 1, such as the heating component 10.

[0061] In one embodiment, the electronic device 1 includes a display screen 80 and a back cover 90 in addition to the middle frame 30. In this embodiment, the first bearing surface 30a of the middle frame 30 is the surface of the middle frame 30 facing the back cover 90, and the second bearing surface 30b of the middle frame 30 is the surface of the middle frame 30 facing the display screen 80. In other embodiments, the first bearing surface 30a of the middle frame 30 is the surface of the middle frame 30 facing the display screen 80, and correspondingly, the second bearing surface 30b of the middle frame 30 is the surface of the middle frame 30 facing the back cover 90. When the middle frame 30 is applied to the electronic device 1 in the embodiment of the present application, the relative positions of the first bearing surface 30a and the second bearing surface 30b relative to the display screen 80 and the back cover 90 of the electronic device 1 are not limited, as long as the middle frame 30 has the first bearing surface 30a and the second bearing surface 30b disposed opposite to each other. In one embodiment, the first bearing surface 30a is parallel or approximately parallel to the second bearing surface 30b.

[0062] In this embodiment, the heating device 10 is disposed on one side of the first bearing surface 30a, and the heat conductive member 210 is located on one side of the second bearing surface 30b. In other words, the heat conductive member 210 and the heating device 10 are respectively disposed on opposite sides of the middle frame 30.

[0063] The orthographic projection of the heat conducting member 210 on the second bearing surface 30b covers the orthographic projection of the heating device 10 on the second bearing surface 30b, which can also be regarded as the orthographic projection of the heat conducting member 210 on the middle frame 30 covering the orthographic projection of the heating device 10 on the middle frame 30. The orthographic projection of the heat conducting member 210 on the second bearing surface 30b covers the orthographic projection of the heating device 10 on the second bearing surface 30b, so the heat conducting member 210 has a large heat dissipation area, and can quickly conduct the heat generated by the heating device 10 to improve the heat dissipation effect of the heating device 10.

[0064] Please read further Figure 5 The middle frame 30 has a first receiving hole 30c. The first receiving hole 30c passes through the first bearing surface 30a and the second bearing surface 30b. At least a portion of the heat sink 220 is located in the first receiving hole 30c, and the heat sink 220 is connected to the heat conductive member 210, and the orthographic projection of the heat conductive member 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b.

[0065] In this embodiment, the middle frame 30 has the first receiving hole 30c, and at least part of the heat sink 220 is located in the first receiving hole 30c. On the one hand, the first receiving hole 30c of the middle frame 30 can be used to reduce the volume of the electronic device 1 or facilitate the layout of other devices of the electronic device 1; on the other hand, the middle frame 30 has the first receiving hole 30c, and at least part of the heat sink 220 is located in the first receiving hole 30c, and the heat sink 220 can be connected to the heat conductive member 210. The heat conduction performance between the heat sink 220 and the heat conductive member 210 is good, which is conducive to improving the heat dissipation effect of the heating device 10. In addition, at least part of the heat sink 220 is located in the first receiving hole 30c, so that the thickness of the electronic device 1 can be thinner.

[0066] Further, the orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b, which can also be regarded as the orthographic projection of the heat conductor 210 on the middle frame 30 covering the orthographic projection of the heat sink 220 on the middle frame 30. The orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b, so the heat conductor 210 has a large heat dissipation area, and can quickly conduct the heat generated by the heating device 10 to improve the heat dissipation effect of the heating device 10.

[0067] For further information, please refer to Figure 5 The electronic device 1 further includes a first connector 240. The first connector 240 is used to connect the heat sink 220 and the heat conductor 210.

[0068] The first connecting member 240 is used to connect the heat sink 220 and the heat conducting member 210 . In other words, the heat sink 220 is connected to the heat conducting member 210 via the first connecting member 240 .

[0069] The first connector 240 may include but is not limited to one or more of a thermal interface connector and a thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, a thermally conductive gel, a thermally conductive silicone grease, and a liquid metal. In another embodiment, the first connector 240 may also be a combination of a conventional foam and a thermal interface material, for example, the gaps in the conventional foam are filled with a thermally conductive gel, a thermally conductive silicone grease, or a liquid metal. In another embodiment, the first connector 240 is also a double-sided adhesive, or may be a connector formed by a process such as soldering.

[0070] When the electronic device 1 includes the first connector 240 , the heat conductor 210 is connected to the heat sink 220 via the first connector 240 , so that the heat of the heat conductor 210 can be quickly transferred to the heat sink 220 via the first connector 240 , thereby improving the heat dissipation effect of the electronic device 1 .

[0071] It can be understood that when the electronic device 1 includes the first connecting member 240 and the thermally conductive connecting member, the materials of the first connecting member 240 and the thermally conductive connecting member may be the same or different.

[0072] The electronic device 1 includes a first connector 240 , and the heat conductor 210 is connected to the heat sink 220 via the first connector 240 , so that the heat of the heat conductor 210 can be quickly transferred to the heat sink 220 via the first connector 240 , thereby improving the heat dissipation effect of the electronic device 1 .

[0073] See also Figure 6 and Figure 7 , Figure 6 A schematic diagram of a radiator provided in one embodiment of the present application; Figure 7 A schematic diagram of a heat sink provided in another embodiment of the present application. In this embodiment, the heat sink 220 includes a substrate 221 and a heat dissipation portion 222. The substrate 221 is connected to the heat conducting member 210 via the first connecting member 240. The heat dissipation portion 222 is connected to the substrate 221, and the heat dissipation portion 222 is located on a side of the substrate 221 away from the heat conducting member 210.

[0074] In this embodiment, the substrate 221 of the heat sink 220 may include but is not limited to aluminum, copper, graphite, and a highly thermally conductive polymer. The heat dissipation portion 222 may include but is not limited to aluminum, copper, graphite, and a highly thermally conductive polymer. The material of the heat dissipation portion 222 may be the same as or different from that of the substrate 221, which is not limited here.

[0075] The heat sink 220 provided in the embodiment of the present application includes a substrate 221 and a heat dissipation portion 222. The substrate 221 is connected to the heat conductive member 210 via the first connecting member 240. The substrate 221 and the heat conductive member 210 have a large contact area, so that the heat conductive member 210 can quickly transfer heat to the substrate 221.

[0076] The heat dissipation part 222 may be connected to the substrate 221 in a manner that is, but not limited to, an integral structure of the heat dissipation part 222 and the substrate 221; or, the heat dissipation part 222 and the substrate 221 are connected via other components. The heat dissipation part 222 is connected to the substrate 221, and the heat dissipation part 222 is located on a side of the substrate 221 away from the heat conductive member 210, so that the heat dissipation part 222 can transfer the heat transferred from the substrate 221 to the heat dissipation part 222 in a direction away from the heat conductive member 210, thereby further improving the heat dissipation effect on the heating device 10.

[0077] Please read further Figure 6The heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, the heat dissipation sub-portions 2221 extend along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2. Therefore, a heat dissipation channel extending along the first direction D1 can be formed between two adjacent heat dissipation sub-portions 2221. The heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, the heat dissipation sub-portions 2221 extend along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2. In this way, the heat dissipation portion 222 can form a plurality of heat dissipation channels extending along the first direction D1 and arranged at intervals along the second direction D2. In this way, the heat dissipation effect of the heating device 10 can be improved.

[0078] In this embodiment, the shape of the heat dissipation sub-portion 2221 is a flat sheet. In other embodiments, the shape of the heat dissipation sub-portion 2221 may also be similar to a sheet, or a sheet with multiple curved segments, or an irregular shape. The electronic device 1 provided in the embodiment of the present application does not limit the shape of the heat dissipation sub-portion 2221.

[0079] It should be noted that the intervals between two adjacent heat dissipation sub-portions 2221 in the second direction D2 may be equal or unequal, and this application does not limit this. In one embodiment, the first direction D1 is perpendicular to the second direction D2.

[0080] Please read further Figure 7 The heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221 , and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1 and at intervals along the second direction D2 .

[0081] In this embodiment, the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2, so the heat sink 220 can form a heat dissipation channel along the first direction D1, can also form a heat dissipation channel along the second direction D2, and can form a heat dissipation channel along any direction between the first direction D1 and the second direction D2. In other words, the heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1, and can form a heat dissipation channel in any direction by being arranged at intervals along the second direction D2.

[0082] The structure of the heat dissipation portion 222 of the electronic device 1 provided in the embodiment of the present application can enable the radiator 220 to form a heat dissipation channel in any direction and have a small wind resistance in any direction, so that the radiator 220 can be applied to more scenarios and the heat dissipation component has a better heat dissipation effect on the heating device 10.

[0083] In this embodiment, the heat dissipation sub-portion 2221 is shaped like a needle. It is understandable that in other embodiments, the heat dissipation sub-portion 2221 may be shaped like a needle, a column, or a column. The present application does not limit the shape of the sub-heat sink.

[0084] The heat sink 220 in the electronic device 1 provided in the embodiment of the present application has a structural arrangement of the heat dissipation portion 222 that can form a heat dissipation channel. When the heat dissipation channel is parallel or approximately parallel to the airflow, the wind resistance when the air flows through the heat sink 220 can be reduced.

[0085] Please also read Figure 8 , Figure 8 For another embodiment Figure 2 The heat sink 220 includes a heat dissipation portion 222. The heat dissipation portion 222 is connected to the heat conducting member 210 through the first connecting member 240.

[0086] In this embodiment, the heat dissipation part 222 may include but is not limited to aluminum, copper, graphite, and a high thermal conductivity polymer. The heat sink 220 does not include a substrate 221, and the heat dissipation part 222 is connected to the thermal conductive member 210 via a first connecting member 240. In this embodiment, the heat dissipation part 222 of the heat sink 220 can refer to Figure 6 and Figure 7 The heat dissipation portion 222 shown in FIG.

[0087] Please read further Fig. 9 and Fig.10 , Fig. 9 A schematic diagram of a heat sink provided in yet another embodiment of the present application; Fig.10 A schematic diagram of a heat sink provided for another embodiment of the present application. The heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, the heat dissipation sub-portions 2221 extend along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2. Therefore, a heat dissipation channel extending along the first direction D1 can be formed between two adjacent heat dissipation sub-portions 2221. The heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, the heat dissipation sub-portions 2221 extend along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2. In this way, the heat dissipation portion 222 can form a plurality of heat dissipation channels extending along the first direction D1 and arranged at intervals along the second direction D2. In this way, the heat dissipation effect of the heating device 10 can be improved.

[0088] In this embodiment, the shape of the heat dissipation sub-portion 2221 is a flat sheet. In other embodiments, the shape of the heat dissipation sub-portion 2221 may also be similar to a sheet, or a sheet with multiple curved segments, or an irregular shape. The electronic device 1 provided in the embodiment of the present application does not limit the shape of the heat dissipation sub-portion 2221.

[0089] It should be noted that the intervals between two adjacent heat dissipation sub-portions 2221 in the second direction D2 may be equal or unequal, and this application does not limit this. In one embodiment, the first direction D1 is perpendicular to the second direction D2.

[0090] Please read further Fig.10 , the heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1, and are arranged at intervals along the second direction D2. In this embodiment, the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the second direction D2, so that the heat sink 220 can form a heat dissipation channel along the first direction D1, and can also form a heat dissipation channel along the second direction D2, and can form a heat dissipation channel along any direction between the first direction D1 and the second direction D2. In other words, the heat dissipation portion 222 includes a plurality of heat dissipation sub-portions 2221, and the plurality of heat dissipation sub-portions 2221 are arranged at intervals along the first direction D1, and can form a heat dissipation channel in any direction by being arranged at intervals along the second direction D2.

[0091] The structure of the heat dissipation portion 222 of the electronic device 1 provided in the embodiment of the present application can enable the radiator 220 to form a heat dissipation channel in any direction and have a small wind resistance in any direction, so that the radiator 220 can be applied to more scenarios and the heat dissipation component has a better heat dissipation effect on the heating device 10.

[0092] In this embodiment, the heat dissipation sub-portion 2221 is shaped like a needle. It is understandable that in other embodiments, the heat dissipation sub-portion 2221 may be shaped like a needle, a column, or a column. The present application does not limit the shape of the sub-heat sink.

[0093] See also Fig.11 , Fig.12 and Fig.13 , Fig.11 For another embodiment Figure 1 A schematic projection diagram of some components of an electronic device; Fig.12 for Fig.11 A schematic cross-sectional view of the electronic device shown along line III-III; Fig.13 for Fig.11A schematic cross-sectional view of an electronic device along line IV-IV. In this embodiment, the electronic device 1 includes a middle frame 30. The middle frame 30 has a first bearing surface 30a and a second bearing surface 30b opposite to each other. The heating device 10 is located on one side of the first bearing surface 30a, and the heat conductor 210 is located on one side of the second bearing surface 30b. The orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heating device 10 on the second bearing surface 30b.

[0094] Furthermore, in this embodiment, the heat sink 220 is located on one side of the first bearing surface 30a of the middle frame 30, and the orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b.

[0095] In this embodiment, the heating device 10 is located on one side of the first bearing surface 30a, the heat conducting member 210 is located on one side of the second bearing surface 30b, and the heat sink 220 is located on one side of the first bearing surface 30a; in other words, the heating device 10 and the heat sink 220 are located on the same side of the middle frame 30, and the heat conducting member 210 and the heating device 10 are located on opposite sides of the middle frame 30. In this embodiment, the heat sink 220 is connected to the heat conducting member 210 through the middle frame 30.

[0096] In this embodiment, the heating device 10 is located on one side of the first bearing surface 30a, the heat conductor 210 is located on one side of the second bearing surface 30b, and the heat sink 220 is located on one side of the first bearing surface 30a. Therefore, no through hole is required in the middle frame 30, thereby saving the preparation cost and process of the middle frame 30.

[0097] The orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b, which can also be regarded as the orthographic projection of the heat conductor 210 on the middle frame 30 covering the orthographic projection of the heat sink 220 on the middle frame 30. The orthographic projection of the heat conductor 210 on the second bearing surface 30b covers the orthographic projection of the heat sink 220 on the second bearing surface 30b, so the heat conductor 210 has a large heat dissipation area, and can quickly conduct the heat generated by the heating device 10 to improve the heat dissipation effect of the heating device 10.

[0098] For further information, please refer to Fig.11 , Fig.12 and Fig.13 The electronic device 1 further includes a second connector 250. The second connector 250 is used to connect the heat sink 220 and the middle frame 30.

[0099] The second connecting member 250 is used to connect the heat sink 220 and the middle frame 30 . In other words, the heat sink 220 is connected to the middle frame 30 via the second connecting member 250 .

[0100] The second connector 250 may include but is not limited to one or more of a thermal interface connector and a thermally conductive foam. The thermal interface connector is made of a thermal interface material (TIM). The thermal interface connector includes one or more of a thermal pad, a thermally conductive gel, a thermally conductive silicone grease, and a liquid metal. In another embodiment, the second connector 250 may also be a combination of a conventional foam and a thermal interface material, for example, the gaps in the conventional foam are filled with a thermally conductive gel, a thermally conductive silicone grease, or a liquid metal. In another embodiment, the second connector 250 is also a double-sided adhesive, or may be a connector formed by a process such as soldering.

[0101] The electronic device 1 includes a second connecting member 250 , and the middle frame 30 is connected to the radiator 220 via the second connecting member 250 , so that the heat of the heat conductor 210 is quickly transferred to the radiator 220 via the middle frame 30 and the second connecting member 250 , thereby improving the heat dissipation effect of the electronic device 1 .

[0102] It can be understood that when the electronic device 1 includes the second connecting member 250 and the thermally conductive connecting member, the materials of the second connecting member 250 and the thermally conductive connecting member may be the same or different.

[0103] The electronic device 1 includes a second connecting member 250, and the middle frame 30 is connected to the radiator 220 via the second connecting member 250, so that the heat of the heat conductor 210 is quickly transmitted to the radiator 220 via the middle frame 30 and the second connecting member 250, thereby improving the heat dissipation effect of the electronic device 1.

[0104] Combination Figures 11 to 13 In one embodiment, please refer to Figure 6 and Figure 7 The heat sink 220 includes a substrate 221 and a heat dissipation portion 222. The substrate 221 is connected to the middle frame 30 through the second connection member 250. The heat dissipation portion 222 is connected to the substrate 221, and the heat dissipation portion 222 is located on a side of the substrate 221 away from the middle frame 30.

[0105] In this embodiment, the substrate 221 of the heat sink 220 may include but is not limited to aluminum, copper, graphite, and a highly thermally conductive polymer. The heat dissipation portion 222 may include but is not limited to aluminum, copper, graphite, and a highly thermally conductive polymer. The material of the heat dissipation portion 222 may be the same as or different from that of the substrate 221, which is not limited here.

[0106] The heat sink 220 provided in the embodiment of the present application includes a substrate 221 and a heat dissipation portion 222 . The substrate 221 is connected to the middle frame 30 via the second connecting member 250 . The substrate 221 and the middle frame 30 have a large contact area, so that the middle frame 30 can quickly transfer heat to the substrate 221 .

[0107] The heat dissipation portion 222 may be connected to the substrate 221 in a manner that is, but not limited to, an integral structure of the heat dissipation portion 222 and the substrate 221; or, the heat dissipation portion 222 and the substrate 221 are connected via other components. The heat dissipation portion 222 is connected to the substrate 221, and the heat dissipation portion 222 is located on a side of the substrate 221 away from the middle frame 30, so that the heat dissipation portion 222 can transfer the heat transferred from the substrate 221 to the heat dissipation portion 222 in a direction away from the middle frame 30, thereby further improving the heat dissipation effect on the heating device 10.

[0108] In one embodiment, the structure of the heat sink 220 is shown in FIG. Figure 6 and Figure 7 The description will not be repeated here.

[0109] Combination Figures 11 to 13 In the embodiment described above, in one embodiment, the heat sink 220 includes a heat dissipation portion 222 . The heat dissipation portion 222 is connected to the middle frame 30 through the second connection member 250 .

[0110] In this embodiment, the heat dissipation portion 222 may include but is not limited to aluminum, copper, graphite, and a high thermal conductivity polymer. The heat sink 220 does not include a substrate 221, and the heat dissipation portion 222 is connected to the thermal conductive member 210 via a second connecting member 250. In this embodiment, the heat dissipation portion 222 of the heat sink 220 can refer to Fig. 9 and Fig.10 The heat dissipation portion 222 shown in FIG. 1 is not described in detail here.

[0111] See also Fig.14 and Fig.15 , Fig.14 for Figure 2 A cross-sectional view of an electronic device along line II-II provided in another embodiment; Fig.15 for Fig.11Another embodiment of the present invention provides a cross-sectional view of an electronic device along line IV-IV. In this embodiment, the fan 260a is thermally connected to the heat conducting member 210. The specific manner in which the fan 260a is thermally connected to the heat conducting member 210 is described as follows.

[0112] exist Fig.14 The cross-sectional view of the electronic device 1 is shown in FIG. Figure 4 The cross-sectional views of the electronic device 1 shown are substantially the same. Fig.15 The cross-sectional view of the electronic device 1 is shown in FIG. Fig.13 The cross-sectional views of the electronic device 1 shown are substantially the same; the difference is that in Fig.14 and Fig.15 In the illustrated embodiment, the middle frame 30 has a second receiving hole. The second receiving hole passes through the first bearing surface 30a and the second bearing surface 30b, and at least a portion of the fan 260a is located in the second receiving hole. The electronic device 1 also includes a third connecting member 280. The third connecting member 280 is thermally connected to the fan 260a and the heat conducting member 210. In the present embodiment, the fan 260a includes a first fan 260 and a second fan 270 as an example for illustration. Accordingly, the second receiving hole includes two, one of which is marked as a second receiving hole 30d, and the other second receiving hole is marked as a second receiving hole 30e. The first fan 260 is received in the second receiving hole 30d, and the second fan 270 is received in the second receiving hole 30e.

[0113] In the schematic diagram of this embodiment, the third connecting member 280 and the first connecting member 240 are taken as an example to illustrate the integral structure. It can be understood that in other embodiments, the third connecting member 280 and the first connecting member 240 may also be non-integrated structures.

[0114] The third connector 280 may include but is not limited to one or more of a thermal interface connector and a thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, a thermally conductive gel, a thermally conductive silicone grease, and a liquid metal. In another embodiment, the third connector 280 may also be a combination of a conventional foam and a thermal interface material, for example, the gaps in the conventional foam are filled with a thermally conductive gel, a thermally conductive silicone grease, or a liquid metal. In another embodiment, the third connector 280 is also a double-sided adhesive, or may be a connector formed by processes such as brazing.

[0115] In this embodiment, the third connecting member 280 is thermally connected to the fan 260 a and the heat conducting member 210 , so as to further improve the heat dissipation effect of the fan 260 a on the heating device 10 .

[0116] See also Fig.16 and Fig.17 , Fig.16 For another embodiment Figure 1 A schematic projection diagram of some components of an electronic device; Fig.17 for Fig.10 Schematic diagram of some structures in . The electronic device 1 has an air duct 50 and a fan 260a, wherein the radiator 220 is located in the air duct 50. The radiator 220 is thermally connected to the heat conductor 210. Please refer to the previous description for the structure of the radiator 220, which will not be repeated here. The fan is located in the air duct 50, and is used to export the heat of the multiple heat dissipation parts 222 of the radiator 220 to the outside of the electronic device 1.

[0117] In one embodiment, the heat conducting member 210 covers at least a portion of the air duct 50 .

[0118] The air duct 50 is a channel for air circulation in the electronic device 1. In one embodiment, the air duct 50 is a channel formed by a separate shell in the electronic device 1. In other embodiments, the air duct 50 is a channel formed when other devices in the electronic device 1 are arranged. When the air duct 50 is a channel formed when other devices in the electronic device 1 are arranged, it is not necessary to form the channel by a separate shell, which is helpful to reduce the weight of the electronic device 1. The present application does not limit the type of the air duct 50 of the electronic device 1.

[0119] In the schematic diagram of this embodiment, the heat conductive member 210 covers part of the air duct 50 for illustration, which is understandable and should not be construed as limiting the electronic device 1 provided in the embodiment of the present application. In other embodiments, the heat conductive member 210 may completely cover the air duct 50.

[0120] The heat conducting member 210 covers at least a portion of the air duct 50 . In other words, the orthographic projection of the heat conducting member 210 falls within the area where the heat conducting member 210 is located.

[0121] When the electronic device 1 includes a middle frame 30 , the heat conductor 210 covers at least a portion of the air duct 50 so that the orthographic projection of at least a portion of the air duct 50 on the middle frame 30 falls within the range of the orthographic projection of the heat conductor 210 on the middle frame 30 .

[0122] The heat sink 220 is located in the air duct 50 , so the airflow transmitted in the air duct 50 can take away the heat of the heat sink 220 , further improving the heat dissipation effect on the heating device 10 .

[0123] In this embodiment, the heat conductor 210 covers at least a portion of the air duct 50 , so that the heat transferred from the heat conductor 210 to the heat sink 220 can be carried away by the airflow transmitted in the air duct 50 , further improving the heat dissipation effect on the heating device 10 .

[0124] In another embodiment, the heat conducting member 210 does not cover the air duct 50. The present application does not limit whether the heat conducting member 210 covers the air duct 50.

[0125] In summary, an electronic device 1 provided in one embodiment of the present application includes a heating device 10, a heat conducting member 210, an air duct 50, a heat sink 220, and a fan 260a. The heat conducting member 210 is thermally connected to the heating device 10. The heat sink 220 is located in the air duct 50, and the heat sink 220 is thermally connected to the heat conducting member 210, and the heat sink 220 includes a plurality of heat dissipating portions 222. The fan 260a is located in the air duct 50, and is used to quickly export the heat of the plurality of heat dissipating portions 222 to the outside of the electronic device 1.

[0126] The heat of the heating device 10 is transferred to the air duct 50 via the heat conducting member 210, and then to the plurality of heat dissipating parts 222 of the heat sink 220 located in the air duct 50. The fan 260a is located in the air duct 50, and is used to draw air into the air duct 50. The air drawn into the air duct 50 passes through the plurality of heat dissipating parts 222 of the heat sink 220 to take away the heat of the heat dissipating parts 222, thereby achieving the effect of heat dissipation for the heating device 10; and / or, the fan 260a is used to discharge the air in the air duct 50 to the outside of the air duct 50. When the fan 260a discharges the air in the air duct 50 to the outside of the air duct 50, it takes away the heat of the heat dissipating parts 222, thereby achieving the effect of heat dissipation for the heating device 10.

[0127] It can be seen that in the electronic device 1 provided in the embodiment of the present application, the heat of the heating device 10 can be transferred to the heat dissipation portion 222 of the radiator 220 via the heat conductor 210, the radiator 220 and the fan 260a are both located in the air duct 50, and the fan 260a can inhale air into the air duct 50; and / or be used to discharge the air in the air duct 50 to the outside of the air duct 50 to take away the heat of the heat dissipation portion 222, thereby achieving the effect of heat dissipation of the heating device 10. In addition, since the radiator 220 and the fan 260a are both located in the air duct 50, the thickness of the electronic device 1 can be made thinner to a certain extent.

[0128] Next, the air duct 50 and the fan 260a in the electronic device 1 provided in the embodiment of the present application are introduced in detail.

[0129] Please continue reading Fig.16 and Fig.17 In this embodiment, the air duct 50 has an air inlet 50a and an air outlet 50b. The radiator 220 is located between the air inlet 50a and the air outlet 50b. The fan 260a also includes a first fan 260 and a second fan 270. The first fan 260 is located in the air duct 50 and is arranged corresponding to the air inlet 50a. The second fan 270 is located in the air duct 50 and is arranged corresponding to the air outlet 50b.

[0130] The air duct 50 has an air inlet 50a and an air outlet 50b. Air can enter the air duct 50 through the air inlet 50a, pass through the radiator 220, and be discharged from the air outlet 50b. When the air passes through the radiator 220, it will take away the heat of the radiator 220, so that the temperature of the radiator 220 is reduced, thereby improving the heat dissipation effect of the heating device 10.

[0131] The first fan 260 may be, but is not limited to, a micro centrifugal fan, a piezoelectric fan, or an axial flow fan, etc., as long as it can actively move air from one side to the other side.

[0132] The first fan 260 is located in the air duct 50 and is disposed corresponding to the air inlet 50a. The first fan 260 is used to draw outside air into the air duct 50 through the air inlet 50a. In one embodiment, the first fan 260 is used to draw outside air into the air duct 50 through the air inlet 50a and blow it to the heat sink 220. In this way, the heat dissipation effect of the heating device 10 can be further improved.

[0133] The second fan 270 may be, but is not limited to, a micro centrifugal fan, a piezoelectric fan, or an axial flow fan, etc., as long as it can actively move air from one side to the other side. The type of the second fan 270 may be the same as that of the first fan 260, or may be different from that of the first fan 260, which is not limited in this embodiment.

[0134] The second fan 270 is located in the air duct 50 and is disposed corresponding to the air outlet 50 b. The second fan 270 is used to discharge the air in the air duct 50 through the air outlet 50 b to outside the air duct 50 , such as to an environment outside the electronic device 1 .

[0135] In this embodiment, the fan 260a further includes a first fan 260 and a second fan 270 . When the first fan 260 and the second fan 270 are in operation, active heat dissipation of the heating device 10 can be achieved, thereby further improving the heat dissipation effect of the heating device 10 .

[0136] In addition, in one embodiment, the first fan 260 can be connected to the middle frame 30 through a heat transfer connector, so as to be connected to the heat conductor 210 through the middle frame 30, so as to further improve the heat dissipation effect of the heating device 10. The heat transfer connector can be, but is not limited to, a double-sided adhesive, a heat conductive gel, a heat conductive pad, a liquid metal, and other materials that can improve the interface thermal resistance.

[0137] In another embodiment, the second fan 270 can be connected to the middle frame 30 through a heat transfer connector, so as to be connected to the heat conductor 210 through the middle frame 30, so as to further improve the heat dissipation effect of the heat generating device 10. The heat transfer connector can be, but is not limited to, a double-sided adhesive, a heat conductive gel, a heat conductive pad, a liquid metal, and other materials that can improve the interface thermal resistance. The type of the heat transfer connector connecting the second fan 270 and the heat transfer connector connecting the first fan 260 can be the same or different.

[0138] In this embodiment, the fan 260 a further includes a first fan 260 and a second fan 270 , thereby improving the active heat dissipation effect of the electronic device 1 .

[0139] In one embodiment, the first fan 260 is used to draw outside air into the air duct 50 and blow it to the heat sink 220. Correspondingly, the second fan 270 is used to discharge the air in the air duct 50 through the air outlet 50b.

[0140] In this embodiment, the air duct 50 has an air inlet 50a and an air outlet 50b, and the radiator 220 is located in the air duct 50 and between the air inlet 50a and the air outlet 50b. The first fan 260 is located in the air duct 50 and is arranged corresponding to the air inlet 50a. The first fan 260 is used to suck the outside air into the air duct 50 and blow it to the radiator 220. The second fan 270 is located in the air duct 50 and is arranged corresponding to the air outlet 50b. The second fan 270 is used to discharge the air in the air duct 50 through the air outlet 50b.

[0141] Therefore, in the electronic device 1 provided in the embodiment of the present application, the cooperation of the first fan 260, the radiator 220 and the second fan 270 can quickly take away the heat of the radiator 220, so that the temperature of the radiator 220 is reduced, thereby improving the heat dissipation effect of the heating device 10.

[0142] exist Fig.16 and Fig.17 In the drawings, the fan 260a includes two fans, the first fan 260 and the second fan 270, for example. In other words, the electronic device 1 includes two fans. It can be understood that in other embodiments, the number of fans included in the electronic device 1 may be greater than two. In other words, the electronic device 1 provided in the embodiment of the present application includes a plurality of fans, wherein the plurality refers to greater than or equal to 2. The plurality of fans can be connected in parallel, in series, or in series + in parallel to further improve the heat dissipation effect.

[0143] Next, the shapes of the air ducts 50 and the number of fans of different forms in the electronic device 1 provided in the embodiment of the present application are introduced in detail.

[0144] For further information, please refer to Fig.16 and Fig.17 In this embodiment, the heat conductive member 210 also covers the first fan 260 and the second fan 270 .

[0145] In this embodiment, the heat conductive member 210 covers the heat conductive member 210 and also covers the first fan 260 and the second fan 270, so that the heat transmitted from the heat conductive member 210 to the radiator 220 can be quickly taken away by the airflow transmitted in the air duct 50 through the joint action of the first fan 260, the second fan 270 and the radiator 220 in the air duct 50, thereby further improving the heat dissipation effect of the heat generating device 10. It can be understood that in other embodiments, the heat conductive member 210 may not cover the first fan 260 and the second fan 270. This application does not limit whether the heat conductive member 210 covers the first fan 260 and the second fan 270.

[0146] See also Fig.18 , Fig.18A schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application. In this embodiment, the air duct 50 has two air inlets 50a and one air outlet 50b. The fan 260a of the electronic device 1 includes two first fans 260 and a second fan 270. The air duct 50 has a first sub-channel 510 and a second sub-channel 520. The first sub-channel 510 has one of the two air inlets 50a, and the first sub-channel 510 also has the air outlet 50b. One end of the second sub-channel 520 has the other of the two air inlets 50a, and the other end of the second sub-channel 520 is connected to the first sub-channel 510.

[0147] In this embodiment, the fan 260 a of the electronic device 1 includes two first fans 260 , so the airflow entering the air duct 50 through the air inlet 50 a can be increased, thereby improving the heat dissipation effect on the heating device 10 .

[0148] In this embodiment, the heat sink 220 is located in the first sub-channel 510 , and the airflow from the two first fans 260 entering the air duct 50 through the air inlet 50 a can pass through the heat sink 220 , thereby improving the heat dissipation effect on the heating device 10 .

[0149] For convenience, Fig.18 The dotted line with an arrow in the figure indicates the direction of the airflow. It can be understood that the direction of the airflow shown in the figure is only a schematic diagram and should not be understood as a limitation on the embodiments of the present application.

[0150] See also Fig.19 , Fig.19 A schematic diagram of a partial structure of an electronic device provided in another embodiment of the present application. In this embodiment, the air duct 50 has a first sub-channel 510, a second sub-channel 520 and a third sub-channel 530. One end of the first sub-channel 510 has the air inlet 50a. One end of the second sub-channel 520 is connected to the other end of the first sub-channel 510 in a bent manner. One end of the third sub-channel 530 is connected to the other end of the second sub-channel 520 in a bent manner, and the third sub-channel 530 and the first sub-channel 510 are respectively located on opposite sides of the second sub-channel 520, and the other end of the third sub-channel 530 has the air outlet 50b.

[0151] In this embodiment, the structural design of the air duct 50 can enable the air duct 50 to adapt to the layout of other components in the electronic device 1 .

[0152] In this embodiment, the heat sink 220 is located in the third sub-channel 530. The heat dissipated by the heat sink 220 can be quickly discharged from the air duct 50 via the second fan 270, thereby having a good heat dissipation effect on the heating device 10.

[0153] See also Fig. 20 , Fig. 20 A partial structural diagram of an electronic device provided for another embodiment of the present application. In this embodiment, the air duct 50 has a first sub-channel 510, a second sub-channel 520 and a third sub-channel 530. One end of the first sub-channel 510 has the air inlet 50a. One end of the second sub-channel 520 is connected to one end of the first sub-channel 510 by bending. One end of the third sub-channel 530 is connected to the other end of the second sub-channel 520 by bending, and the third sub-channel 530 and the first sub-channel 510 are respectively located on the same side of the second sub-channel 520, and the other end of the third sub-channel 530 has the air outlet 50b.

[0154] In this embodiment, the structural design of the air duct 50 can enable the air duct 50 to adapt to the layout of other components in the electronic device 1. In this embodiment, the heat sink 220 is located in the second sub-channel 520.

[0155] The heat transfer path of the heating device 10 of the electronic device 1 provided in the embodiment of the present application is described as follows: When the heating device 10 is working, the heat generated by the heating device 10 is transferred to the heat conducting member 210, and is rapidly diffused through the heat conducting member 210, and part of the heat is transferred to the radiator 220 and dissipated through the radiator 220.

[0156] When the fan 260a of the electronic device 1 further includes a first fan 260 and a second fan 270, the first fan 260 and the second fan 270 blow air to the radiator 220 when in operation, and the air blowing through the radiator 220 is convected to the environment.

[0157] See also Fig.21 and Fig. 22 , Fig.21 A three-dimensional schematic diagram of an electronic device from one viewing angle provided by another embodiment of the present application; Fig. 22 for Fig.21 . The electronic device 1 further includes a frame 60. The frame 60 has a first through hole 60a and a second through hole 60b. The first through hole 60a is connected to the outside of the electronic device 1 and the air inlet 50a of the air duct 50. The second through hole 60b is connected to the outside of the electronic device 1 and the air outlet 50b of the air duct 50.

[0158] In this embodiment, the frame 60 is the frame 60 of the middle frame 30 in the electronic device 1. In other embodiments, the frame 60 may also be the frame 60 of the back cover 90 in the electronic device 1, which is not limited in this application.

[0159] The frame 60 has a first through hole 60a and a second through hole 60b, the first through hole 60a is connected to the outside of the electronic device 1 and the air inlet 50a of the air duct 50, and the second through hole 60b is connected to the outside of the electronic device 1 and the air outlet 50b of the air duct 50; therefore, the outside air can enter the air inlet 50a of the air duct 50 through the first through hole 60a, and the air in the air duct 50 can be discharged into the environment through the air outlet 50b of the air duct 50 and the second through hole 60b.

[0160] See also Fig.23 , Fig.24 , Fig.25 and Fig.26 , Fig.23 A three-dimensional schematic diagram of an electronic device under one viewing angle provided by yet another embodiment of the present application; Fig.24 for Fig.23 The enlarged schematic diagram of point A in the middle; Fig.25 for Fig.23 A three-dimensional schematic diagram of an electronic device from another perspective provided in; Fig.26 for Fig.25 In one embodiment, the electronic device 1 further comprises a first button 710, and correspondingly, the frame 60 comprises a first button hole 60c. The first button 710 is received in the first button hole 60c. The first button hole 60c constitutes the first through hole 60a.

[0161] In this embodiment, the first button hole 60c is reused as the first through hole 60a connected to the air inlet 50a of the air duct 50. Therefore, it is possible to avoid opening too many through holes on the frame 60 of the electronic device 1, thereby improving the appearance of the electronic device 1 and improving the waterproof reliability of the electronic device 1.

[0162] Furthermore, in one embodiment, the electronic device 1 further has a second button 720, and correspondingly, the frame 60 has a second button hole 60d. The second button 720 is received in the second button hole 60d. The second button hole 60d constitutes the second through hole 60b.

[0163] In this embodiment, the second button hole 60d is reused as the second through hole 60b connected to the air outlet 50b of the air duct 50. Therefore, it is possible to avoid opening too many through holes on the frame 60 of the electronic device 1, thereby improving the appearance of the electronic device 1 and improving the waterproof reliability of the electronic device 1.

[0164] In this embodiment, the first button hole 60c is reused as the first through hole 60a, and the second button hole 60d is reused as the second through hole 60b as an example for illustration. It is sufficient as long as at least one of the first button hole 60c is reused as the first through hole 60a and the second button hole 60d is reused as the second through hole 60b.

[0165] Further, the extension direction of the radiator 220 is along the lateral direction of the electronic device 1, or is approximately along the lateral direction of the electronic device 1. The extension direction of the radiator 220 is along the lateral direction of the electronic device 1, that is, the extension direction of the radiator 220 is the extension direction of the short side of the electronic device 1.

[0166] The extension direction of the heat sink 220 is along the lateral direction of the electronic device 1. On the one hand, it can enable the heat of the heating device 10 to be transferred to the environment outside the electronic device 1 via a relatively short path. On the other hand, it can avoid the adverse effect of the long heat dissipation path of the heating device 10 on the layout of other devices of the electronic device 1.

[0167] In summary, the electronic device 1 provided in the embodiment of the present application includes a heat conductor 210 and a heat sink 220 , so that the heat of the heating device 10 (also called a heat source) can be quickly conducted.

[0168] When the fan 260a of the electronic device 1 further includes a first fan 260 and a second fan 270, the electronic device 1 includes a heat conductor 210 and a heat sink 220, so that the heat of the heating device 10 (also referred to as a heat source) can be quickly transferred to a position adjacent to the first fan 260 and the second fan 270. The first fan 260 and the second fan 270 act on the heat sink 220, and also enhance the effect of convective heat transfer.

[0169] Furthermore, in one embodiment, when the electronic device 1 includes a plurality of fans, the plurality of fans of the electronic device 1 can be connected in parallel, in series, or in series + parallel to further improve the heat dissipation effect, which can effectively increase the air volume or overcome the wind resistance impedance of the system.

[0170] Furthermore, in one embodiment, the electronic device 1 also includes a first connector 240, which is used to connect the heat sink 220 and the heat conductor 210; the electronic device 1 also includes a second connector 250, which is used to connect the heat sink 220 and the middle frame 30; the first fan 260 can be connected to the middle frame 30 through a heat transfer connector; the second fan 270 can be connected to the middle frame 30 through a heat transfer connector; in this way, the heat transfer effect of the heat transfer path can be further improved.

[0171] The fan 260a of the electronic device 1 provided in one embodiment of the present application includes a first fan 260 and a second fan 270. Therefore, the electronic device 1 is an electronic device for active heat dissipation (also called an active heat dissipation system). Efficient heat transfer is achieved through the heat transfer path of the heating device 10 - heat conductor 210 - radiator 220 - first fan 260 + second fan 270.

[0172] The electronic device 1 provided in the embodiment of the present application has lower thermal resistance when dissipating heat from the heating element 10 , higher convection heat transfer coefficient, and more significant heat dissipation and cooling effect.

[0173] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: Heating device; A heat conducting member, the heat conducting member being thermally connected to the heat generating device; Air duct; a heat sink, the heat sink being located in the air duct and being thermally connected to the heat conducting member, the heat sink comprising a plurality of heat dissipating parts; and A fan is located in the air duct and is used to export heat from the multiple heat dissipation parts to the outside of the electronic device.

2. The electronic device according to claim 1, wherein: The air duct has an air inlet and an air outlet, and the radiator is located between the air inlet and the air outlet; The fan comprises: a first fan, the first fan being located in the air duct and arranged corresponding to the air inlet, the first fan being used to draw outside air into the air duct and blow it to the radiator; and The second fan is located in the air duct and is arranged corresponding to the air outlet, and the second fan is used to discharge the air in the air duct through the air outlet.

3. The electronic device according to claim 2, characterized in that: The air duct has two air inlets and one air outlet, and the fan includes two first fans and one second fan; the air duct has: A first sub-channel, wherein the first sub-channel has one of the two air inlets, the first sub-channel also has the air outlet, and the radiator is located in the first sub-channel; and A second sub-channel, wherein one end of the second sub-channel has the other of the two air inlets, and the other end of the second sub-channel is connected to the first sub-channel.

4. The electronic device according to claim 2, characterized in that: The air duct has: a first sub-channel, wherein one end of the first sub-channel has the air inlet; a second sub-channel, one end of the second sub-channel being bent and connected to the other end of the first sub-channel; and A third sub-channel, one end of the third sub-channel is bent and connected to the other end of the second sub-channel, and the third sub-channel and the first sub-channel are respectively located on two opposite sides of the second sub-channel, the other end of the third sub-channel has the air outlet, and the radiator is located in the third sub-channel.

5. The electronic device according to claim 2, characterized in that: The air duct has: a first sub-channel, wherein one end of the first sub-channel has the air inlet; a second sub-channel, one end of the second sub-channel is bent and connected to one end of the first sub-channel, and the heat sink is located in the second sub-channel; and A third sub-channel, one end of the third sub-channel is bent and connected to the other end of the second sub-channel, and the third sub-channel and the first sub-channel are respectively located on the same side of the second sub-channel, and the other end of the third sub-channel has the air outlet.

6. The electronic device according to claim 2, characterized in that: The electronic device further comprises: A border, the border having: A first through hole, wherein the first through hole is connected to the outside of the electronic device and the air inlet of the air duct; and A second through hole is connected to the outside of the electronic device and the air outlet of the air duct.

7. The electronic device according to claim 1, wherein: The electronic device comprises: A middle frame, the middle frame having a first bearing surface and a second bearing surface opposite to each other; The heating device is located on one side of the first bearing surface, and the heat conducting member is located on one side of the second bearing surface.

8. The electronic device according to claim 7, characterized in that: The middle frame has a first receiving hole, and the first receiving hole passes through the first bearing surface and the second bearing surface; At least a portion of the heat sink is located in the first receiving hole, and the heat sink is connected to the heat conducting member.

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises: A first connecting member is used for thermally connecting the heat sink and the heat conducting member.

10. The electronic device according to claim 9, characterized in that: The radiator comprises: a substrate connected to the heat conducting member through the first connecting member; and The heat dissipation portion is connected to the substrate and is located at a side of the substrate away from the heat conducting member.

11. The electronic device according to claim 9, characterized in that: The heat dissipation portion is connected to the heat conducting member through the first connecting member.

12. The electronic device according to claim 10 or 11, characterized in that: The heat dissipation portion includes a plurality of heat dissipation sub-portions, the heat dissipation sub-portions extend along a first direction, and the plurality of heat dissipation sub-portions are arranged at intervals along a second direction; Alternatively, the heat dissipation portion includes a plurality of heat dissipation sub-portions, and the plurality of heat dissipation sub-portions are arranged at intervals along the first direction and at intervals along the second direction.

13. The electronic device according to claim 7, characterized in that: The heat sink is located on one side of the first bearing surface of the middle frame, and the orthographic projection of the heat conducting member on the second bearing surface covers the orthographic projection of the heat sink on the second bearing surface.

14. The electronic device according to claim 13, characterized in that: The electronic device further comprises: A second connecting member, wherein the second connecting member is used for thermally connecting the heat sink and the middle frame.

15. The electronic device according to claim 14, characterized in that: The radiator comprises: a substrate, wherein the substrate is connected to the middle frame through the second connecting member; and A heat dissipation portion is connected to the substrate and is located at a side of the substrate away from the middle frame.

16. The electronic device according to claim 14, characterized in that: The radiator comprises: A heat dissipation portion is connected to the middle frame through the second connecting member.

17. The electronic device according to claim 7, characterized in that: The middle frame has a second receiving hole, the second receiving hole passes through the first bearing surface and the second bearing surface, and at least a part of the fan is located in the second receiving hole; the electronic device also includes: A third connecting member is provided, and the third connecting member is thermally connected to the fan and the heat conducting member.

18. The electronic device according to claim 1, wherein: The heat conducting member is heat-conductingly connected to at least a portion of the air duct.

Images