Ventilation and heat dissipation device for electronic component
By designing a ventilation and heat dissipation device for electronic components including fins, blowers and current coupons, the problems of cumbersome maintenance and fixed heat dissipation structure of electronic components in the prior art are solved, and efficient and flexible heat dissipation effects are achieved, and the requirements of dust and waterproofing are met.
Patent Information
- Application Number
- CN202510020179.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-03-21
AI Technical Summary
The radiator of existing electronic components is installed inside the electrical case, and the maintenance and replacement are cumbersome, and the heat dissipation structure is fixed, so it cannot be adjusted according to the needs of different power modules, resulting in the electronic components with different heat dissipation levels not reaching the best heat dissipation effect.
An electronic component ventilation and heat dissipation device is designed, including end caps, electronic components and heat dissipation components. The end cover can form a closed chamber, and the electronic component is arranged in the chamber. The heat dissipation assembly includes fins, a blower and a flow-sharing plate. The heat in the chamber is taken away by the airflow, achieving efficient heat dissipation, and the air flow is adjusted according to the heat generation of different electronic components through the adjustment device.
It realizes efficient heat dissipation, simplifies the maintenance and replacement process, can be adjusted according to the heat generation of different electronic components, improves the flexibility and breadth of heat dissipation effects, and ensures the dust-proof and waterproof requirements of electronic components.
Smart Images
Figure CN119677065A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of heat dissipation devices, and in particular relates to a ventilation and heat dissipation device for electronic components. Background Art
[0002] The performance of electronic products is becoming more and more powerful, which leads to the continuous improvement of the integration and power of electronic components such as chips on internal circuit boards. Therefore, the power consumption and heat generation during operation have increased dramatically. According to statistics, material failure of electronic components caused by heat concentration accounts for 70% to 80% of the total failure rate. Thermal management technology is a key factor to consider for electronic products. Therefore, it is necessary to strengthen the thermal control of electronic components. The problem of efficient heat dissipation of electronic components is affected by the principles of heat transfer and fluid mechanics. There are many ways to dissipate heat for electronic components, including natural heat dissipation and forced heat dissipation. The most common way is to use a radiator to force heat dissipation of electronic components.
[0003] Heat dissipation of electrical devices is to control the operating temperature of electronic equipment, thereby ensuring its working temperature and safety. The existing heat sinks of electronic components on the market are all installed on the inside of the electrical shell. When the heat sink is maintained or replaced, the electrical shell must be opened before operation, which is cumbersome and inconvenient. In addition, the heat dissipation structure is relatively fixed and cannot be adjusted according to the heat dissipation requirements of different power modules, so that electronic components with different heat dissipation cannot achieve the best heat dissipation effect. Summary of the invention
[0004] In view of the shortcomings of the prior art, the present invention provides a ventilation and heat dissipation device for electronic components, with the aim of providing a ventilation and heat dissipation device for electronic components that is efficient and easy to maintain and replace, and the heat dissipation device can be adjusted according to the heat generation of different electronic components, thereby improving the breadth and flexibility of application of the ventilation and heat dissipation device for electronic components.
[0005] In order to achieve the above-mentioned purpose, the present invention provides a ventilation and heat dissipation device for electronic components, including end covers, the end covers including a first end cover and a second end cover; the first end cover and the second end cover are fixedly connected to form a closed chamber; an electronic component, the electronic component is arranged in the closed chamber formed by the first end cover and the second end cover; the electronic component includes a circuit board and components; the components are arranged on the circuit board; a heat dissipation component, the heat dissipation component includes fins, a blower and a flow equalizing plate; the fins are arranged on the outer surface of the second end cover; the blower is arranged on the outer surface of the second end cover; the flow equalizing plate is arranged in the closed chamber formed by the first end cover and the second end cover; the flow equalizing plate is fixed on the circuit board.
[0006] A ventilation and heat dissipation device for electronic components includes an end cover, an electronic component and a heat dissipation component. The end cover includes a first end cover and a second end cover. The two can form a closed chamber, and the electronic component is arranged in the closed chamber. Heat is generated during the use of the electronic component. The accumulation of heat is not conducive to the use of the electronic component and will cause it to fail. The heat dissipation component can process the generated heat to achieve the effect of heat dissipation. The heat dissipation component includes fins, a blower and a flow equalizer. The fins are the main components for heat dissipation; the blower can generate airflow, which first passes through the fins for heat dissipation, and then enters the closed chamber formed by the first end cover and the second end cover, taking away the heat generated by the electronic component in the closed chamber to achieve heat dissipation; the flow equalizer is fixed on the circuit board. After entering the closed chamber formed by the first end cover and the second end cover, the airflow must first pass through the flow equalizer, and the flow equalizer can ensure uniform heat dissipation of the entire electronic component.
[0007] Furthermore, the second end cover includes a side cover and a bottom cover; the side cover and the bottom cover are integrally connected; the bottom cover is fixedly connected to the circuit board; the fin includes a first fin and a second fin; the first fin is arranged on the side cover; and the second fin is arranged on the bottom cover.
[0008] The fins include a first fin and a second fin. The first fin is arranged on the side cover of the second end cover. The airflow generated by the blower will first pass through the first fin for heat dissipation before entering the closed chamber formed by the first end cover and the second end cover, and then enter the closed chamber. The second fin is arranged on the bottom cover of the second end cover, and the bottom cover is fixedly connected to the circuit board. The heat generated by the electronic components will be transferred to the bottom cover of the second end cover, and the second fin can play a heat dissipation function.
[0009] Furthermore, an air inlet and an air outlet are provided on the side cover.
[0010] An air inlet and an air outlet are provided on the side cover. The airflow generated by the blower enters the closed chamber formed by the first end cover and the second end cover from the air inlet, and is discharged into the air from the air outlet after taking away the heat generated by the electronic components in the closed chamber.
[0011] Furthermore, the heat dissipation component also includes a connecting pipeline; the connecting pipeline includes an air pipe, an air intake pipeline and an exhaust pipeline; one end of the air pipe is connected to the output end of the blower, and the other end is connected to the air intake pipeline; the air intake pipeline passes through the first fin; one end of the air intake pipeline is connected to the air pipe, and the other end is connected to the air inlet; the exhaust pipeline passes through the second fin; the exhaust pipeline is connected to the air outlet.
[0012] The heat dissipation component also includes connecting pipelines, which are the main components for realizing air circulation. The connecting pipelines include air pipes, air intake pipes and exhaust pipes. The airflow generated by the blower first flows to the air pipe, and then flows from the air pipe to the air intake pipe. The air intake pipe is connected to the air inlet. The airflow enters the closed chamber formed by the first end cover and the second end cover. After taking away the heat generated by the electronic components in the closed chamber, the airflow is discharged from the air outlet to the exhaust pipe, and then flows through the exhaust pipe and flows into the air.
[0013] Furthermore, one side of the flow balancing plate close to the air inlet is an inclined surface; a plurality of through holes are arranged on the inclined surface of the flow balancing plate; and the plurality of through holes are arranged perpendicular to the inclined surface of the flow balancing plate.
[0014] There are multiple through holes on the inclined surface of the flow equalizing plate. After the airflow enters from the air inlet, it passes through the multiple through holes on the inclined surface of the flow equalizing plate and flows to the electronic component, which can evenly dissipate heat for the entire electronic component.
[0015] Furthermore, heat-conducting glue is provided between the circuit board and the bottom cover.
[0016] A thermal conductive adhesive is provided between the circuit board and the bottom cover. The thermal conductive adhesive has good thermal conductivity and can transfer the heat on the circuit board to the bottom cover and dissipate the heat through the second fins.
[0017] Furthermore, a sealing gasket is provided between the first end cover and the second end cover.
[0018] A sealing gasket is provided between the first end cover and the second end cover. The sealing gasket can ensure that the closed chamber formed by the first end cover and the second end cover is dust-free and water-free, meeting the dustproof and waterproof requirements of the electronic components so that the electronic components can be used normally. At the same time, it can also ensure that the airflow of the blower will not leak after entering the closed chamber, which is beneficial to heat dissipation.
[0019] Furthermore, the blower is connected with an adjusting device.
[0020] The blower is connected with an adjusting device, which can adjust the air flow rate generated by the blower according to the heat generated by different electronic components, thereby improving the wide application and flexibility of the electronic component ventilation and heat dissipation device.
[0021] Furthermore, a signal feedback interface is provided on the outer surface of the first end cover.
[0022] The signal feedback interface can be connected to the signal feedback component, and the working condition of the electronic components can be adjusted according to the output condition.
[0023] Furthermore, an input power interface is provided on the outer surface of the first end cover; and an output power interface is provided on the outer surface of the bottom cover.
[0024] The input power interface can connect the electronic components to the power supply to provide an energy source for the electronic components to start working; the output power interface can connect the electronic components to other electrical appliances to enable the electronic components to serve as controllers for other electrical appliances.
[0025] Beneficial Effects 1. The electronic component ventilation and heat dissipation device of the present invention is provided with a blower, fins and thermally conductive adhesive, which can achieve efficient heat dissipation; 2. In the electronic component ventilation and heat dissipation device of the present invention, a plurality of through holes perpendicular to the inclined surface are provided on the inclined surface of the current equalizing plate to ensure uniform heat dissipation of the entire electronic component; 3. In the electronic component ventilation and heat dissipation device of the present invention, the blower is arranged on the outer surface of the second end cover and is connected to the air inlet pipeline on the second end cover through the air pipe, which is convenient for maintenance and replacement; 4. In the electronic component ventilation and heat dissipation device of the present invention, the blower can be adjusted according to the heat generation of different electronic components, thereby improving the wide application and flexibility of the electronic component ventilation and heat dissipation device; 5. In the electronic component ventilation and heat dissipation device of the present invention, a sealing gasket is provided between the first end cover and the second end cover, the air inlet pipe is sealed and connected to the air pipe, and the exhaust pipe is a multi-section curved surface, which effectively ensures the dust and water proof requirements inside the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a structural schematic diagram of a ventilation and heat dissipation device for electronic components; Figure 2 It is a cross-sectional view of a ventilation and heat dissipation device for electronic components; Figure 3 This is a rear view of the ventilation and heat dissipation device for electronic components; Figure 4 This is a bottom view of the ventilation and heat dissipation device for electronic components.
[0027] In the accompanying drawings: 11, first end cover; 12, second end cover; 13, sealing gasket; 14, signal feedback interface; 15, input power interface; 16, output power interface; 21, circuit board; 22, components; 23, thermal conductive adhesive; 31, fin; 32, blower; 33, flow equalizing plate; 34, connecting pipeline; 121, side cover; 122, bottom cover; 311, first fin; 312, second fin; 331, through hole; 341, air pipe; 342, air inlet pipeline; 343, exhaust pipeline; 1211, air inlet; 1212, air outlet. DETAILED DESCRIPTION
[0028] Example 1 like Figure 1 and Figure 2The electronic component ventilation and heat dissipation device shown in the figure includes end covers, which include a first end cover 11 and a second end cover 12; the first end cover 11 and the second end cover 12 are fixedly connected by a circumferential circle of bolts to form a closed chamber; an electronic component, which is arranged in the closed chamber formed by the first end cover 11 and the second end cover 12; the electronic component includes a circuit board 21 and components 22; the components 22 include chips, capacitors, and resistors, which are arranged on the circuit board 21; a heat dissipation component, which includes fins 31, a blower 32 and a current equalizing plate 33; the fins 31 are arranged on the outer surface of the second end cover 12; the blower 32 is arranged on the outer surface of the second end cover 12; the current equalizing plate 33 is arranged in the closed chamber formed by the first end cover 11 and the second end cover 12; the current equalizing plate 33 is vertically fixed on the circuit board 21.
[0029] A ventilation and heat dissipation device for electronic components includes an end cover, an electronic component and a heat dissipation component. The end cover includes a first end cover 11 and a second end cover 12, which can form a closed chamber, and the electronic component is arranged in the closed chamber. Heat is generated during the use of the electronic component. The accumulation of heat is not conducive to the use of the electronic component and will cause it to fail. The heat dissipation component can process the generated heat to achieve the effect of heat dissipation. The heat dissipation component includes fins 31, a blower 32 and a flow equalizer 33. The fins 31 are the main components for heat dissipation; the blower 32 can generate airflow, which first passes through the fins 31 for heat dissipation, and then enters the closed chamber formed by the first end cover 11 and the second end cover 12, taking away the heat generated by the electronic component in the closed chamber to achieve heat dissipation; the flow equalizer 33 is fixed on the circuit board 21. After entering the closed chamber formed by the first end cover 11 and the second end cover 12, the airflow must first pass through the flow equalizer 33, and the flow equalizer 33 can ensure uniform heat dissipation of the entire electronic component.
[0030] The second end cover 12 includes a side cover 121 and a bottom cover 122; the side cover 121 and the bottom cover 122 are integrally connected; the bottom cover 122 is fixedly connected to the circuit board 21 by bolts; the fin 31 includes a first fin 311 and a second fin 312; the first fin 311 is arranged on the side cover 121; the second fin 312 is arranged on the bottom cover 122.
[0031] The fins 31 include a first fin 311 and a second fin 312. The first fin 311 is disposed on the side cover 121 of the second end cover 12. The airflow generated by the blower 32 will first pass through the first fin 311 for heat dissipation before entering the closed chamber formed by the first end cover 11 and the second end cover 12, and then enter the closed chamber. The second fin 312 is disposed on the bottom cover 122 of the second end cover 12, and the bottom cover 122 is fixedly connected to the circuit board 21. The heat generated by the electronic components will be transferred to the bottom cover 122 of the second end cover 12, and the second fin 312 can play a heat dissipation function.
[0032] like Figure 3 As shown, the side cover 121 is provided with an air inlet 1211 and an air outlet 1212 , and the air inlet 1211 and the air outlet 1212 are circular holes.
[0033] The side cover 121 is provided with an air inlet 1211 and an air outlet 1212. The airflow generated by the blower 32 enters the closed chamber formed by the first end cover 11 and the second end cover 12 from the air inlet 1211, and is discharged into the air from the air outlet 1212 after taking away the heat generated by the electronic components in the closed chamber.
[0034] like Figure 1 As shown, the heat dissipation component also includes a connecting pipe 34; the connecting pipe 34 is a circular pipe, including an air pipe 341, an air intake pipe 342 and an exhaust pipe 343; one end of the air pipe 341 is connected to the output end of the blower 32, and the other end is connected to the air intake pipe 342; the air intake pipe 342 passes through the first fin 311; one end of the air intake pipe 342 is sealed and connected to the air pipe 341, and the other end is connected to the air inlet 1211; the exhaust pipe 343 passes through the second fin 312; the exhaust pipe 343 is a multi-section curved surface; the exhaust pipe 343 is connected to the air outlet 1212.
[0035] The heat dissipation assembly also includes a connecting pipe 34, which is the main component for realizing air circulation. The connecting pipe 34 includes an air pipe 341, an air intake pipe 342 and an exhaust pipe 343. The airflow generated by the blower 32 first flows to the air pipe 341, and then flows from the air pipe 341 to the air intake pipe 342. The air intake pipe 342 is connected to the air inlet 1211. The airflow enters the closed chamber formed by the first end cover 11 and the second end cover 12. After taking away the heat generated by the electronic components in the closed chamber, the airflow is discharged from the air outlet 1212 to the exhaust pipe 343, and then flows through the exhaust pipe 343 and flows into the air.
[0036] like Figure 2 As shown, one side of the flow balancing plate 33 close to the air inlet 1211 is an inclined surface; a plurality of through holes 331 are provided on the inclined surface of the flow balancing plate 33; the plurality of through holes 331 are circular holes; and the plurality of through holes 331 are arranged perpendicular to the inclined surface of the flow balancing plate 33.
[0037] A plurality of through holes 331 are provided on the inclined surface of the flow equalizing plate 33. After the airflow enters from the air inlet 1211, it passes through the plurality of through holes 311 on the inclined surface of the flow equalizing plate 33 and flows toward the electronic component, so that the heat of the entire electronic component can be evenly dissipated.
[0038] A heat-conducting adhesive 23 is disposed between the circuit board 21 and the bottom cover 122 .
[0039] A heat-conducting adhesive 23 is provided between the circuit board 21 and the bottom cover 122 . The heat-conducting adhesive 23 has good heat-conducting performance and can transfer the heat on the circuit board 21 to the bottom cover 122 and dissipate the heat through the second fins 312 .
[0040] like Figure 4 As shown, a sealing gasket 13 is provided between the first end cover 11 and the second end cover 12 .
[0041] A sealing gasket 13 is provided between the first end cover 11 and the second end cover 12. The sealing gasket 13 can ensure that the closed chamber formed by the first end cover 11 and the second end cover 12 is dust-free and water-free, meeting the dustproof and waterproof requirements of the electronic components so that the electronic components can be used normally. At the same time, it can also ensure that the airflow of the blower 32 will not leak after entering the closed chamber, which is beneficial to heat dissipation.
[0042] The blower 32 is connected with a regulating device.
[0043] The blower 32 is connected to a regulating device, which can adjust the air flow generated by the blower 32 according to the heat generated by different electronic components, thereby improving the wide application and flexibility of the electronic component ventilation and heat dissipation device.
[0044] like Figure 3 As shown, a signal feedback interface 14 is provided on the outer surface of the first end cover 11 .
[0045] The signal feedback interface 14 can be connected to a signal feedback component, and the working condition of the electronic component can be adjusted according to the output condition.
[0046] like Figure 1 and Figure 3 As shown, an input power interface 15 is provided on the outer surface of the first end cover 11 ; an output power interface 16 is provided on the outer surface of the bottom cover 122 .
[0047] The input power interface 15 can connect the electronic components to the power supply to provide an energy source for the electronic components to start working; the output power interface 16 can connect the electronic components to other electrical appliances to enable the electronic components to serve as controllers for other electrical appliances.
Claims
1. A ventilation and heat dissipation device for electronic components, characterized in that: include: An end cover, the end cover comprising a first end cover (11) and a second end cover (12); the first end cover (11) and the second end cover (12) are fixedly connected to form a closed chamber; An electronic component, the electronic component being arranged in a sealed chamber formed by a first end cover (11) and a second end cover (12); the electronic component comprising a circuit board (21) and a component (22); the component (22) being arranged on the circuit board (21); A heat dissipation assembly, the heat dissipation assembly comprising fins (31), a blower (32) and a flow equalizing plate (33); the fins (31) are arranged on the outer surface of the second end cover (12); the blower (32) is arranged on the outer surface of the second end cover (12); the flow equalizing plate (33) is arranged in a closed chamber formed by the first end cover (11) and the second end cover (12); and the flow equalizing plate (33) is fixed on the circuit board (21).
2. The electronic component ventilation and heat dissipation device according to claim 1, characterized in that: The second end cover (12) comprises a side cover (121) and a bottom cover (122); the side cover (121) and the bottom cover (122) are integrally connected; the bottom cover (122) is fixedly connected to the circuit board (21); the fin (31) comprises a first fin (311) and a second fin (312); the first fin (311) is arranged on the side cover (121); and the second fin (312) is arranged on the bottom cover (122).
3. The electronic component ventilation and heat dissipation device according to claim 2, characterized in that: The side cover (121) is provided with an air inlet (1211) and an air outlet (1212).
4. The electronic component ventilation and heat dissipation device according to claim 3, characterized in that: The heat dissipation assembly further comprises a connecting pipeline (34); the connecting pipeline (34) comprises an air pipe (341), an air intake pipeline (342) and an exhaust pipeline (343); one end of the air pipe (341) is connected to the output end of the blower (32), and the other end is connected to the air intake pipeline (342); the air intake pipeline (342) passes through the first fin (311); one end of the air intake pipeline (342) is connected to the air pipe (341), and the other end is connected to the air intake port (1211); the exhaust pipeline (343) passes through the second fin (312); and the exhaust pipeline (343) is connected to the air outlet (1212).
5. The electronic component ventilation and heat dissipation device according to claim 3, characterized in that: The side of the flow balancing plate (33) close to the air inlet (1211) is an inclined surface; a plurality of through holes (331) are provided on the inclined surface of the flow balancing plate (33); and the plurality of through holes (331) are arranged perpendicular to the inclined surface of the flow balancing plate (33).
6. The electronic component ventilation and heat dissipation device according to claim 2, characterized in that: A heat-conducting adhesive (23) is provided between the circuit board (21) and the bottom cover (122).
7. The electronic component ventilation and heat dissipation device according to claim 1, characterized in that: A sealing gasket (13) is provided between the first end cover (11) and the second end cover (12).
8. The electronic component ventilation and heat dissipation device according to claim 1, characterized in that: The blower (32) is connected to a regulating device.
9. The electronic component ventilation and heat dissipation device according to claim 1, characterized in that: A signal feedback interface (14) is provided on the outer surface of the first end cover (11).
10. The electronic component ventilation and heat dissipation device according to claim 2, characterized in that: An input power interface (15) is provided on the outer surface of the first end cover (11); and an output power interface (16) is provided on the outer surface of the bottom cover (122).