Silicon material cleaning method, system and device, storage medium and electronic equipment

Abstract

The invention discloses a silicon material cleaning method, a silicon material cleaning system, a silicon material cleaning device, a storage medium and electronic equipment, and the silicon material cleaning method comprises the following steps: receiving information of materials, preprocessing the materials, and arranging and placing the materials in a material carrying basket; the material carrying basket is conveyed to a first cleaning area, cleaning time parameters and temperature parameters are set, and materials in the material carrying basket are soaked; after the time parameter is reached, the materials in the material carrying basket are moved to a second cleaning area to be washed; the material soaking box is designed to soak and clean materials in the material carrying box, and the temperature and soaking time of a cleaning reagent on the inner side are monitored, so that the materials can be cleaned more accurately and timely, the functions of automatic heating, timing, information transmission and the like are realized, and the circulation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon cleaning equipment, and in particular to a silicon material cleaning method, system, cleaning device, storage medium and electronic equipment. Background Art

[0002] During the process of single crystal silicon pulling and machining, various silicon materials that cannot be directly used in the subsequent production process are generated, including the edge skin, head and tail, reverse cut rod, etc. of the single crystal, which need to be cleaned and reused in the furnace. This part of silicon material is usually called recycled material or circulating material. The surface of the recycled material is contaminated with cutting silicon powder, environmental dust, water stains and oil stains, and some surfaces are slightly oxidized.

[0003] The cleaning of silicon materials in the industry mainly includes two steps: pre-cleaning and surface etching. Pre-cleaning mainly uses pure water flushing + brush rolling to wash away silicon powder and other particles on the surface. There are many kinds of wet etching solutions for silicon surface. The main principle is to first oxidize the surface of silicon with an oxidant solution, and then dissolve the surface oxide in the solution through chemical reaction.

[0004] Based on the above process, the cleaning equipment currently used in the photovoltaic industry is mainly manual acid corrosion and fully automatic pickling machines. The cleaning equipment is bulky, with a single device weighing about 35 tons and low cleaning capacity. It is necessary to manually adjust the proportion of cleaning reagents to achieve the corresponding temperature, pH value and soaking time, etc. The labor intensity is high, the capacity of a single device is about 12 tons / day, and the production efficiency is low. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a silicon material cleaning method, system, cleaning device, storage medium and electronic equipment.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: a silicon material cleaning method, comprising:

[0007] S1: receiving the information of materials, pre-processing the materials, and arranging and placing the materials in the loading basket;

[0008] S2: transporting the material basket to the first cleaning area, setting the cleaning time parameters and temperature parameters, and soaking the material in the material basket;

[0009] S3: After the time parameter is reached, the material in the loading basket is moved to the second cleaning area for washing.

[0010] As a further description of the above technical solution: in step S1, it also includes:

[0011] S11: receiving input material information, and identifying the model, product code or performance parameter of the material according to the information;

[0012] S12: After scrubbing the materials, the materials are classified according to the information and placed in a loading basket according to the conveying order.

[0013] As a further description of the above technical solution: in step S2, it also includes:

[0014] S21: moving the material basket and the material to the inner side of the first cleaning area, and adding a cleaning agent so that the cleaning agent submerges the material;

[0015] S22: Setting temperature parameters to heat and stir the cleaning reagent.

[0016] As a further description of the above technical solution: in step S3, it also includes:

[0017] S31: After the set time is reached, a warning signal is sent, and the loading basket is controlled to move out of the first cleaning area and hover above the first cleaning area;

[0018] S32: The loading basket is transported to the second cleaning area for high-pressure washing and drying, and then transported out of the second cleaning area after completion.

[0019] As a further description of the above technical solution: the time parameter is 0-99 min, and the temperature parameter is 20-50°C.

[0020] Also included is a silicon material cleaning control system, which is applicable to the cleaning method described in any one of the above technical solutions, including:

[0021] A conveying module is used to convey materials and a loading basket, convey the materials into the loading basket, and convey the loading basket to the first cleaning area and the second cleaning area in sequence;

[0022] A timing module, for setting time parameters and controlling the soaking time of the loading basket in the first cleaning zone;

[0023] A heating module is used to set temperature parameters and control the temperature of the cleaning reagent in the first cleaning area;

[0024] The control module controls the conveying module to convey and clean the loading basket according to the time parameter and the temperature parameter.

[0025] Also included is a silicon material cleaning device, which is applicable to the cleaning method and control system described in any one of the above technical solutions, including:

[0026] truss;

[0027] The truss is provided with a manipulator to clamp and transport the materials and the loading basket;

[0028] A foam box is arranged below the truss, and the loading basket is placed in the foam box. The foam box is provided with a partition, and a plurality of through holes are opened on the partition. A stirring device, a heating device and a PH detection device are arranged on the inner bottom surface of the foam box. The foam box is also provided with a valve and a control panel.

[0029] As a further description of the above technical solution: the loading basket includes a plurality of racks arranged in the transverse and longitudinal directions, so that the loading basket forms a plurality of cavities, and the loading basket is also provided with a plurality of push rods to push the material for transportation.

[0030] It also includes a computer-readable storage medium storing a computer program for running the cleaning method, wherein the computer program enables a computer to execute the cleaning method as described in any one of the above technical solutions.

[0031] Also included is an electronic device, comprising:

[0032] one or more processors; memory; and

[0033] One or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the programs include programs for executing the cleaning method described in any one of the above technical solutions.

[0034] The above technical solution has the following advantages or beneficial effects:

[0035] 1. By designing a soaking box to soak and clean the materials in the loading box, and by monitoring the temperature and soaking time of the cleaning reagent inside, the materials can be cleaned more accurately and timely, realizing functions such as automatic heating, timing, and information transmission, thereby improving circulation efficiency.

[0036] 2. By designing a loading basket to hold materials and using a robot and a push rod for transportation, the manual operation part is optimized and the cleaning efficiency is improved. The cleaning capacity of a single machine can reach 35 tons / day. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The process of the cleaning method proposed by the present invention Figure 1 ;

[0038] Figure 2 The process of the cleaning method proposed by the present invention Figure 2 ;

[0039] Figure 3 The process of the cleaning method proposed by the present invention Figure 3 ;

[0040] Figure 4The process of the cleaning method proposed by the present invention Figure 4 ;

[0041] Figure 5 It is a structural schematic diagram of the control system proposed by the present invention;

[0042] Figure 6 This is a schematic diagram of the structure of the cleaning device proposed by the present invention;

[0043] Figure 7 It is a schematic diagram of the structure of the loading basket in the present invention.

[0044] Legend:

[0045] 1. Truss; 2. Loading basket; 21. Push rod; 3. Foaming box; 4. Partition; 5. Stirring device; 6. Heating device; 7. Valve; 8. Control panel; 9. PH detection device; 10. Conveying module; 11. Timing module; 12. Heating module; 13. Control module. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] Reference Figure 1 , an embodiment of the present invention provides: a silicon material cleaning method, comprising:

[0048] S1: receiving the information of materials, pre-processing the materials, and arranging and placing the materials in the loading basket;

[0049] S2: transporting the loading basket to the first cleaning area, setting the cleaning time parameters and temperature parameters, and soaking the materials in the loading basket;

[0050] S3: After the time parameter is reached, the material in the loading basket is moved to the second cleaning area for washing.

[0051] In this embodiment, the materials are pre-treated and cleaned according to their information and then classified and arranged. The pre-cleaning is the existing method of using pure water to flush and brush to roll away silicon powder and other particles on the surface. After completion, they are placed in a loading basket. The first cleaning area is a foaming box, and the second cleaning area is a high-pressure flushing device. The loading basket is grabbed and transported to the first cleaning area by a truss and a manipulator, and the material in the loading basket is soaked and cleaned. The temperature parameters and time parameters in the foaming box are set by a control system, the temperature and soaking time of the material in the cleaning agent are controlled, and the pH value of the cleaning agent is detected to achieve automatic detection and adjustment to meet the cleaning requirements of the material. After cleaning, the loading basket is grabbed by a manipulator, suspended for draining, and then transported to the inside of the second cleaning area. Residual cleaning agents are removed by high-pressure flushing and dried. After completion, the materials in the loading basket are pushed out of the loading basket by a push rod for subsequent recycling. The materials are single crystal edge skins, heads and tails, and reverse-cut rods after silicon material processing.

[0052] Reference Figure 2 , in step S1, further comprising:

[0053] S11: receiving input material information, and identifying the material model, product code or performance parameter according to the information;

[0054] S12: After scrubbing the materials, the materials are classified according to the information and placed in the loading basket according to the conveying order.

[0055] In this embodiment, the operator inputs the material information on the control panel 8, determines whether the material model is edge skin, head and tail or reverse cut stick, etc., controls the robot to clamp the cut and squared material, and transmits it to the pre-treatment cleaning machine. The cleaning machine automatically cleans and wipes the material. After completion, the material is clamped and conveyed according to the product number, and the same type of materials are arranged in the loading basket according to the conveying order.

[0056] Reference Figure 3 , in step S2, further comprising:

[0057] S21: moving the loading basket and the material to the inner side of the first cleaning area, and adding a cleaning agent so that the cleaning agent submerges the material;

[0058] S22: Setting temperature parameters to heat and stir the cleaning reagent.

[0059] In this embodiment, the material basket and the material inside are clamped and transported to the inside of the first cleaning area by a truss and a manipulator, and a cleaning agent is added to the inside of the first cleaning area according to the information of the material, and the temperature parameters are set, and the cleaning agent is heated and stirred to make the cleaning agent evenly heated. The time for the material in the material basket to soak in the cleaning agent is controlled by the set time parameters. The cleaning agent dissolves the surface oxide of the material. The commonly used silicon etching solution is a nitric acid + hydrofluoric acid system, in which nitric acid is used as an oxidant and hydrofluoric acid is used as a complexing agent. On the one hand, silicon dioxide is generated on the surface of silicon through the action of the oxidant and silicon, and on the other hand, a soluble complex is generated through the action of hydrofluoric acid on the complexing agent of silicon dioxide, thereby completing the corrosion process of silicon, so it is necessary to control the soaking time.

[0060] The time parameter is 0-99min, and the temperature parameter is 20-50℃.

[0061] In this embodiment, the silicon material cleaning reagent (to clean the metal ions on the surface of the silicon material that may affect the electrical properties of the product) is added to 1-2 cm above the silicon material, and the liquid is stopped after the silicon material is immersed. The temperature is raised to 20-50°C, preferably 35°C, and the soaking time is set to ≥30min.

[0062] During the soaking process, the stirring device 5 is started to stir the cleaning agent to make the temperature change more uniform and to make the cleaning agent flow and clean the surface of the material.

[0063] Reference Figure 4 , in step S3, further comprising:

[0064] S31: After the set time is reached, a warning signal is sent, and the loading basket is controlled to move out of the first cleaning area and hover above the first cleaning area;

[0065] S32: The loading basket is transported to the second cleaning area for high-pressure washing and drying, and then transported out of the second cleaning area after completion.

[0066] In this embodiment, when the set time parameter is reached, a warning signal is sent to the control panel 8, prompting the completion of the immersion cleaning, and the robot is controlled to grab the loading basket for lifting, and hover above the first cleaning area for 10-30 seconds, so that the cleaning reagents on the loading basket and the material fall back to the first cleaning area, and then the loading basket is transported to the second cleaning area, and the cleaning reagents remaining on the loading basket and the material are high-pressure rinsed and dried. After completion, the loading basket is transported out of the second cleaning area, and the dried edge and skin materials are transported to the crusher by the conveyor line for crushing and loading into the basket, and then transported to the preparation area for stacking, waiting for feeding.

[0067] Reference Figure 5, and also includes an embodiment of a silicon material cleaning control system, the control system is applicable to any cleaning method in the above technical solution, including:

[0068] The conveying module 10 conveys the material and the loading basket, conveys the material into the loading basket, and conveys the loading basket to the first cleaning area and the second cleaning area in sequence;

[0069] A timing module 11, which sets time parameters and controls the soaking time of the loading basket in the first cleaning zone;

[0070] The heating module 12 sets the temperature parameters to control the temperature of the cleaning reagent in the first cleaning area;

[0071] The control module 13 controls the conveying module to convey and clean the loading basket according to the time parameters and the temperature parameters.

[0072] In this embodiment, the conveying module 10 controls the robot to move along the truss, conveys the loading basket and the material, and moves them to the first cleaning area and the second cleaning area for cleaning.

[0073] Reference Figure 6-Figure 7 , also includes an embodiment of a silicon material cleaning device, the cleaning device is suitable for any one of the cleaning methods and control systems in the above technical solutions, including: a truss 1; a manipulator is arranged on the truss 1 to clamp and convey the material and the loading basket 2; a foaming box 3 is arranged below the truss 1, the loading basket 2 is placed in the foaming box 3, the foaming box 3 is provided with a partition 4, the partition 4 is provided with a plurality of through holes, the inner bottom surface of the foaming box 3 is provided with a stirring device 5, a heating device 6 and a PH detection device 9, and the foaming box 3 is also provided with a valve 7 and a control panel 8.

[0074] In this embodiment, the truss 1 is arranged above the foaming box 3, and the manipulator is arranged on the truss 1 and moves along the truss 1. The loading basket 2 is clamped by the manipulator, and the loading basket 2 and the material are transported to the top of the foaming box 3 and placed on the partition 4. The cleaning reagent is added to immerse 1-2 cm above the material. The heating temperature of the cleaning reagent and the soaking time of the material are set by the control panel 8. The cleaning reagent is heated and stirred by controlling the stirring device 5 and the heating device 6 to clean the material. A valve 7 is also provided on the foaming box 3 to discharge the cleaning reagent after cleaning and replace the reacted cleaning reagent. The pH value of the cleaning reagent is detected by the PH detection device 9. After cleaning a certain amount of material, the pH value of the cleaning reagent changes, and it is detected whether the cleaning reagent needs to be replaced.

[0075] Specifically, the loading basket 2 includes a plurality of racks arranged in the transverse and longitudinal directions, so that the loading basket 2 forms a plurality of cavities. The loading basket 2 is also provided with a plurality of push rods 21 to push the materials for transportation.

[0076] In this embodiment, the loading basket 2 is formed by a plurality of racks staggered horizontally and vertically, and a plurality of volume cavities are formed on the inner side. The volume cavities are connected to the outside and are used to place materials. A push rod 21 is arranged around the loading basket 2, and one end extends into the volume cavity. The material inside the volume cavity is pushed out by the push rod 21.

[0077] Also included is a computer-readable storage medium storing a computer program for running the cleaning method, wherein the computer program causes a computer to perform the following steps:

[0078] S1: receiving the information of materials, pre-processing the materials, and arranging and placing the materials in the loading basket;

[0079] S2: transporting the loading basket to the first cleaning area, setting the cleaning time parameters and temperature parameters, and soaking the materials in the loading basket;

[0080] S3: After the time parameter is reached, the material in the loading basket is moved to the second cleaning area for washing.

[0081] Among them, the computer-readable storage medium can be a computer storage medium or a communication medium. The communication medium includes any medium that facilitates the transmission of a computer program from one place to another. The computer storage medium can be any available medium that can be accessed by a general-purpose or special-purpose computer. For example, a computer-readable storage medium is coupled to a processor so that the processor can read information from the computer-readable storage medium and write information to the computer-readable storage medium. Of course, the computer-readable storage medium can also be a component of the processor. The processor and the computer-readable storage medium can be located in an application-specific integrated circuit (ASIC). In addition, the ASIC can be located in a user device. Of course, the processor and the computer-readable storage medium can also exist in a communication device as discrete components.

[0082] Specifically, the computer-readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0083] Also included is an electronic device, comprising:

[0084] one or more processors; memory; and

[0085] One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by one or more processors, the programs comprising steps for performing the following steps:

[0086] S1: receiving the information of materials, pre-processing the materials, and arranging and placing the materials in the loading basket;

[0087] S2: transporting the loading basket to the first cleaning area, setting the cleaning time parameters and temperature parameters, and soaking the materials in the loading basket;

[0088] S3: After the time parameter is reached, the material in the loading basket is moved to the second cleaning area for washing.

[0089] Memory is used to store computer programs. The memory may include high-speed random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk memory, and may also be a USB flash drive, a mobile hard disk, a read-only memory, a disk or an optical disk.

[0090] A processor is used to execute a computer program stored in a memory to implement the cleaning method in the above embodiment. The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor can be a microprocessor or the processor can be any conventional processor, etc. The steps of the method disclosed in the invention can be directly embodied as being executed by a hardware processor, or executed by a combination of hardware and software modules in the processor.

[0091] Optionally, the memory can be independent or integrated with the processor.

[0092] When the memory is a device independent of the processor, the electronic device may further include a bus. The bus is used to connect the memory and the processor. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, and the like.

[0093] It should be noted that, through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform. Based on such an understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiment. In this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such process, method, article or device. Without more constraints, an element defined by the phrase "comprising a..." does not exclude the existence of other identical elements in the process, method, article or apparatus comprising the element.

[0094] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for cleaning silicon material, characterized in that: include: S1: receiving the information of materials, pre-processing the materials, and arranging and placing the materials in the loading basket; S2: transporting the material basket to the first cleaning area, setting the cleaning time parameters and temperature parameters, and soaking the material in the material basket; S3: After the time parameter is reached, the material in the loading basket is moved to the second cleaning area for washing.

2. The cleaning method according to claim 1, characterized in that: In step S1, it also includes: S11: receiving input material information, and identifying the model, product code or performance parameter of the material according to the information; S12: After scrubbing the materials, the materials are classified according to the information and placed in a loading basket according to the conveying order.

3. The cleaning method according to claim 1, characterized in that: In step S2, it also includes: S21: moving the material basket and the material to the inner side of the first cleaning area, and adding a cleaning agent so that the cleaning agent submerges the material; S22: Setting temperature parameters to heat and stir the cleaning reagent.

4. The cleaning method according to claim 1, characterized in that: In step S3, it also includes: S31: After the set time is reached, a warning signal is sent, and the loading basket is controlled to move out of the first cleaning area and hover above the first cleaning area; S32: The loading basket is transported to the second cleaning area for high-pressure washing and drying, and then transported out of the second cleaning area after completion.

5. The cleaning method according to claim 1, characterized in that: The time parameter is 0-99 min, and the temperature parameter is 20-50° C.

6. A silicon material cleaning control system, characterized in that: The control system is applicable to the cleaning method according to any one of claims 1 to 5, including: A conveying module is used to convey materials and a loading basket, convey the materials into the loading basket, and convey the loading basket to the first cleaning area and the second cleaning area in sequence; A timing module, for setting time parameters and controlling the soaking time of the loading basket in the first cleaning zone; A heating module is used to set temperature parameters and control the temperature of the cleaning reagent in the first cleaning area; The control module controls the conveying module to convey and clean the loading basket according to the time parameter and the temperature parameter.

7. A silicon material cleaning device, characterized in that: The cleaning device is applicable to the cleaning method described in any one of claims 1 to 5 and the control system described in claim 6, comprising: Truss (1); The truss (1) is provided with a robot for gripping and conveying materials and a loading basket (2); A foam box (3) is arranged below the truss (1), and the loading basket (2) is placed in the foam box (3). The foam box (3) is provided with a partition (4), and a plurality of through holes are opened on the partition (4). A stirring device (5), a heating device (6) and a pH detection device (9) are arranged on the inner bottom surface of the foam box (3). The foam box (3) is also provided with a valve (7) and a control panel (8).

8. The cleaning device according to claim 7, characterized in that: The loading basket (2) comprises a plurality of frames arranged in the transverse and longitudinal directions, so that the loading basket (2) forms a plurality of cavities. The loading basket (2) is also provided with a plurality of push rods (21) to push the material for transportation.

9. A computer-readable storage medium, characterized in that: The computer stores a computer program for running the cleaning method, wherein the computer program enables the computer to execute the cleaning method according to any one of claims 1 to 5.

10. An electronic device, characterized in that: include: one or more processors; Memory; as well as One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, the programs comprising instructions for executing the cleaning method according to any one of claims 1 to 5.

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