Metal hot pressing process and equipment and storage medium

Abstract

The invention relates to a metal hot pressing technology and equipment and a storage medium. The technology comprises the following steps that S1, a metal material is preheated; s2, a higher compression ratio is achieved by pre-compressing the metal material at a preset temperature; s3, performing multi-stage hot pressing by using a mold with a specific microstructure pattern under a high-temperature condition, accurately controlling the pressure and the temperature in each stage, and gradually forming a required chip structure; and S4, after the chip structure is formed, carrying out cooling demolding operation. Through the self-adaptive temperature control system and the precision pressure adjusting system, the temperature, the pressure and the time in the metal hot-pressing process are accurately controlled, cracks of a metal layer, poor contact and even chip damage which are possibly caused by unstable temperature and pressure are reduced, and the performance and the reliability of the chip are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a metal hot pressing process, equipment and storage medium. Background Art

[0002] With the rapid development of information technology, the demand for integrated circuits (ICs) and chips in electronic devices continues to grow. Especially in the field of semiconductor manufacturing, the size of chips continues to shrink, the performance continues to improve, and the requirements for materials and processes are becoming more stringent. In order to meet the requirements of modern chips for high performance, high reliability and ultra-miniaturization, metal connection technology in the chip manufacturing process, especially metal hot pressing technology, plays an increasingly important role.

[0003] The metal hot pressing process is a process method that uses plastic deformation of metal materials under high temperature and high pressure to achieve miniaturized structures. It is widely used in chip packaging, connection, and other microelectronic product manufacturing processes. In the chip packaging process, metal materials are usually used to connect the chip to the external circuit board to ensure good conductivity and mechanical strength. However, the precise control of temperature, pressure and time in the metal hot pressing process is still a key factor affecting product quality. Unstable temperature and pressure may cause cracks in the metal layer, poor contact, and even damage to the chip, which in turn affects the performance and reliability of the chip.

[0004] Traditional metal hot pressing processes rely on manual operation or a single automated control system, which often makes it difficult to accurately control the temperature and pressure during the hot pressing process, especially in the chip manufacturing process with high precision requirements. In order to solve these problems, the industry needs a more intelligent and precisely controlled metal hot pressing technology to ensure the quality of metal connections, thereby improving the production yield and stability of chips.

[0005] At present, some advanced hot pressing technologies use feedback adjustment mechanisms of temperature and pressure, but they still face problems such as control instability, high complexity, and insufficient control system response speed under high temperature environments. In addition, there are many types of metal materials, and the differences in thermal expansion coefficients, thermal conductivity and other properties of different metal materials during hot pressing also require hot pressing processes to have higher adaptability and flexibility.

[0006] Therefore, there is an urgent need for an innovative metal hot pressing process that can accurately adjust the temperature and pressure through an intelligent control system to overcome the limitations of traditional technology and ensure that the hot pressing process can be carried out efficiently, stably and accurately under different metal materials and complex process conditions, thereby improving the quality and efficiency of chip production. Summary of the invention

[0007] The main purpose of the present invention is to provide a metal hot pressing process, equipment and storage medium, aiming to monitor and control the temperature and pressure of metal materials during the metal hot pressing process to improve the quality of the hot pressed metal.

[0008] To achieve the above object, the present invention provides a metal hot pressing process, comprising the following steps:

[0009] S1. Preheating of metal materials;

[0010] S2, achieve a higher compression rate by pre-compressing the metal material at a preset temperature;

[0011] The preset temperature is dynamically adjusted by an adaptive temperature control system, including an advanced adaptive temperature control system, which automatically adjusts the temperature based on real-time data during the process and the response characteristics of the metal powder at high temperature, and accurately adjusts the temperature, with the temperature adjustment range ranging from 450°C to 750°C;

[0012] S3, using a mold with a specific microstructure pattern to perform multi-stage hot pressing under high temperature conditions, with pressure and temperature precisely controlled at each stage to gradually form the desired chip structure;

[0013] S4. After the chip structure is formed, cooling and demolding operations are performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted by the adaptive temperature control system according to the selected metal material type to control the demolding time.

[0014] Furthermore, the advanced adaptive temperature control system adjustment system includes being equipped with a high-sensitivity temperature sensor, wherein a plurality of the temperature sensors are provided and installed at different positions near the workpiece, and the area responsible for each temperature sensor is divided; the advanced adaptive temperature control system is also equipped with a monitoring screen, and a screen segmentation unit is provided in the monitoring screen, and the screen segmentation unit divides the above-mentioned divided area to obtain multiple imaging areas, and the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor.

[0015] Furthermore, the pressure and duration of the hot pressing stage are optimized according to the physical properties of the metal powder and the expected microstructural characteristics, and the pressure adjustment range is from 150 to 600 MPa. The precise adjustment of the pressure is achieved through a high-precision pressure regulation system, which can automatically adjust the pressure according to the compression stage and the type of metal powder used.

[0016] Furthermore, the pressure regulation system includes a high-precision pressure sensor, which is arranged in the area divided by each temperature sensor. The pressure regulation system is combined with the temperature control system to operate and adjust the pressure and temperature according to real-time feedback from the high-precision pressure sensor and the high-sensitivity temperature sensor.

[0017] Furthermore, the mold with a specific microstructure pattern includes a dynamic mode that self-adjusts under high pressure, and the dynamic mode allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programmed particles to the mold material.

[0018] Furthermore, the response characteristics of metal powders at high temperatures are specifically the physical and chemical behaviors of metal powders under specific temperature conditions, including thermal stability, reaction rate, and thermal conductivity. The adaptive temperature control system detects and controls the response characteristics of metal powders at high temperatures through corresponding sensors and in combination with the following formula:

[0019]

[0020] Where α is the coefficient of thermal expansion, L0 is the initial length, dL is the change in length, and dT is the change in temperature;

[0021]

[0022] where r is the reaction rate, κ is the rate constant, and E a is the activation energy, R is the gas constant, and T is the absolute temperature;

[0023] λ=λ0·(1+β·(T+T0))

[0024] Where λ is the thermal conductivity of the material, λ0 is the thermal conductivity at the reference temperature, β is the temperature-dependent adjustment coefficient, T is the current temperature of the material, and T0 is the reference temperature.

[0025] Furthermore, the preheating of the metal is to generate eddy currents inside the metal to generate heat through a high-frequency electromagnetic field; the temperature of the preheating of the metal is adjusted by an adaptive temperature control system, and the adaptive temperature control system can preset the metal material as well as the preheating temperature and duration in advance.

[0026] The present invention also provides a metal hot pressing device, comprising:

[0027] Heating unit: heats the metal material. The heating temperature, frequency and duration are adjustable. At the same time, it can also generate eddy currents inside the metal through high-frequency electromagnetic fields to preheat the metal.

[0028] Temperature control unit: The temperature control unit is equipped with an adaptive temperature control system and is electrically connected to the heating unit. The temperature control unit obtains the basic information and physical properties of the material by presetting the metal material, calculates the response characteristics of the metal powder under high temperature, and monitors the temperature of the material during the preheating and heating stages of the metal through the temperature sensor, and controls the heating temperature of the heating unit;

[0029] Hot pressing unit: The hot pressing unit is used to perform hot pressing of metal materials, including a pressure regulating system. The pressure regulating system is data-connected with the temperature control unit, and the pressure of the hot pressing stage is controlled in combination with the temperature inside the metal material, and the pressure is monitored through a pressure sensor.

[0030] Mold with specific microstructure pattern: The mold is capable of self-adjusting in a dynamic mode under high pressure, which allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programming particles to the mold material.

[0031] The present invention also provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above-mentioned metal hot pressing process when executing the computer program.

[0032] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned metal hot pressing process are implemented.

[0033] The metal hot pressing, equipment and storage medium provided by the present invention have the following beneficial effects:

[0034] (1) The present invention uses an adaptive temperature control system and a high-precision pressure regulation system to precisely control the temperature, pressure and time in the metal hot pressing process, thereby reducing temperature and pressure instability that may cause cracks in the metal layer, poor contact, and even chip damage, thereby improving chip performance and reliability.

[0035] (2) Through the preheating of the metal, eddy currents are generated inside the metal through a high-frequency electromagnetic field to generate heat; the temperature of the metal preheating is adjusted through an adaptive temperature control system. The adaptive temperature control system can preset the metal material and the preheating temperature and duration in advance, thereby improving the plasticity of the metal material, reducing the hardening of the material, and ensuring better formability and forming quality.

[0036] (3) By pre-compressing metal materials to achieve a higher compression ratio, their density and mechanical properties can be significantly enhanced, material uniformity can be improved and defects can be reduced, while formability and machinability can be improved, material usage and cost can be reduced, and environmental sustainability can be enhanced.

[0037] (4) By using a mold with a specific microstructure pattern for hot pressing, the mold is able to self-adjust to a dynamic mode under high pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programmed particles to the mold material. Using a self-adjusting mold with shape memory alloys and programmed particles for hot pressing can significantly improve the accuracy and efficiency of the manufacturing process. Under the action of pressure and heat, this mold can automatically adjust its shape and size according to the preset pattern, ensuring the product size is accurate, reducing material waste, and adapting to complex and changing design requirements. In addition, the self-adjustment function also helps to optimize the distribution of heat and force, improve production consistency and process repeatability, thereby meeting the stringent requirements of modern industry for high-performance materials and precision components.

[0038] (5) During the cooling and demolding stage, the adaptive temperature control system can select the type of metal material, dynamically adjust the demolding temperature through the adaptive temperature control system according to the selected metal material type, and control the demolding time. Proper cooling can optimize the crystal structure of the metal, reduce internal stress and cracks caused by rapid temperature changes, and ensure close contact between the metal layer and the substrate and excellent electrical properties. A reasonable cooling process can also effectively prevent deformation caused by uneven thermal expansion, improve the mechanical strength and thermal stability of the chip package, and reduce the risk of material failure. In addition, precise control of cooling time and temperature can improve the consistency of the production process, reduce the defect rate, optimize the yield rate, thereby improving production efficiency and reducing costs. This precise cooling control not only adapts to a variety of metal materials and meets the strict quality and reliability requirements of high-end chips, but also significantly improves the long-term performance and reliability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram of a metal hot pressing process in one embodiment of the present invention;

[0040] Figure 2 is a structural block diagram of a metal hot pressing device in one embodiment of the present invention;

[0041] Figure 3 It is a schematic block diagram of the structure of a computer device according to an embodiment of the present invention.

[0042] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0044] Reference Figure 1, is a schematic diagram of a metal hot pressing process proposed by the present invention, comprising the following steps:

[0045] S1. Preheating of metal materials;

[0046] S2, achieve a higher compression rate by pre-compressing the metal material at a preset temperature;

[0047] The preset temperature is dynamically adjusted by an adaptive temperature control system, including an advanced adaptive temperature control system, which automatically adjusts the temperature based on real-time data during the process and the response characteristics of the metal powder at high temperature, and accurately adjusts the temperature, with the temperature adjustment range ranging from 450°C to 750°C;

[0048] The temperature is controlled between 450℃ and 750℃, which has the following advantages:

[0049] Promote metal bonding: In this temperature range, metal bonding agents (such as low melting point metals or alloys such as tin and silver) will melt to form a uniform liquid layer, which helps to form a strong metal bond between the two chip surfaces. This temperature is higher than the melting point of these metals, but it is enough to ensure effective bonding without damaging the chip infrastructure.

[0050] Avoid thermal stress and deformation: Keeping the maximum temperature in this range below 750°C can prevent the chip from generating thermal stress or thermal deformation due to excessive temperature. Excessive temperature may damage the delicate circuits on the chip and affect performance.

[0051] Improve production efficiency and quality control: This temperature range can speed up the melting and solidification process of the metal bonder while ensuring that the chip maintains good physical and chemical stability during heating and cooling, which is critical for precise control of the production process.

[0052] S3, using a mold with a specific microstructure pattern to perform multi-stage hot pressing under high temperature conditions, with pressure and temperature precisely controlled at each stage to gradually form the desired chip structure;

[0053] S4. After the chip structure is formed, cooling and demolding operations are performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted by the adaptive temperature control system according to the selected metal material type to control the demolding time.

[0054] The advanced adaptive temperature control system adjustment system includes being equipped with a high-sensitivity temperature sensor, wherein a plurality of the temperature sensors are provided and installed at different positions near the workpiece, and the area responsible for each temperature sensor is divided; the advanced adaptive temperature control system is also equipped with a monitoring screen, and a screen segmentation unit is provided in the monitoring screen, and the screen segmentation unit segments the above-mentioned divided area to obtain a plurality of imaging areas, and the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor.

[0055] During the specific implementation process, temperature sensors are arranged at multiple different positions near the workpiece, and a monitoring screen is arranged outside the hot pressing equipment. The monitoring screen can also pre-set the advanced adaptive temperature control system, such as the specific material of the metal, the heating time, etc. The adaptive temperature control system can be connected to the Internet. When the specific material of the metal is preset, the physical properties of the material are searched on the Internet, and the specific heating temperature and time of the metal material are calculated; at the same time, during the hot pressing stage, the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor, which can be specifically presented through a time-temperature table. If the temperature exceeds or is lower than expected, the system can also alarm and record.

[0056] The pressure and duration of the hot pressing stage are optimized according to the physical properties of the metal powder and the expected microstructural characteristics. The pressure adjustment range is from 150 to 600 MPa. The precise adjustment of the pressure is achieved through a high-precision pressure regulation system that can automatically adjust the pressure according to the compression stage and the type of metal powder used.

[0057] The pressure adjustment range is from 150 to 600 MPa for the following reasons:

[0058] Ensure good metal layer contact and bonding: During the metal hot pressing process, appropriate pressure can ensure close contact between chips and their metal layers, avoiding the formation of air bubbles and other defects, which is crucial for the unimpeded transmission of electrical signals.

[0059] Controlling metal flow and distribution: This pressure range can control the flow of molten metal so that it is evenly distributed on the contact surface to form a uniform metal bonding layer, which is crucial to improving the mechanical strength and electrical conductivity of the joint surface.

[0060] Adapt to the needs of different chip sizes and materials: Chips of different sizes and materials may require different pressures to achieve the best bonding effect. The pressure range of 150 to 600MPa is sufficient to cover the production needs of various types of chips while avoiding chip damage caused by excessive pressure.

[0061] Taken together, these temperature and pressure settings are designed to optimize the metal hot pressing process in chip production and meet the stringent requirements of high-precision electronic products for connection quality.

[0062] The pressure regulation system includes a high-precision pressure sensor, which is arranged in each area divided by the temperature sensor. The pressure regulation system is combined with the temperature control system to operate, and the pressure and temperature are adjusted according to the real-time feedback of the high-precision pressure sensor and the high-sensitivity temperature sensor. During implementation, the pressure sensor can adopt a piezoelectric pressure sensor. The electric pressure sensor can measure the pressure by utilizing the property of the material to generate electric charge when subjected to force. It is often used to measure dynamic pressure changes and transmit the measurement data to the corresponding imaging area. The data displayed in each imaging area corresponds to the pressure data of the area responsible for a high-precision pressure sensor, which can be presented specifically through a time pressure meter. If the pressure exceeds or falls below expectations, the system can also alarm and record.

[0063] In S3, a mold with a specific microstructure pattern includes a dynamic mode that self-adjusts under high pressure. The dynamic mode allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programmed particles to the mold material. A mold with a specific microstructure pattern is used for multi-stage hot pressing. The pressure and temperature are precisely controlled in each stage to gradually form the desired chip structure.

[0064] Using self-adjusting dies for hot pressing, especially those incorporating shape memory alloys and programmed particles, can provide the following benefits:

[0065] Precise control of product size and shape: This type of mold can automatically fine-tune its shape and size according to a preset pattern under pressure, providing higher precision of the finished product. This is especially important for high-precision manufacturing industries that require strict dimensional control, such as aerospace and precision engineering.

[0066] Improved production efficiency and consistency: With self-adjusting molds, the need for manual mold adjustments and subsequent corrections can be reduced, thereby speeding up the production process and improving product consistency.

[0067] Reduced material waste: Self-adjusting dies can precisely control the flow and distribution of materials, reducing over-compression and material loss, thereby reducing costs and improving material use efficiency.

[0068] Adapt to complex and changing design requirements: This technology allows flexible adjustment of the mold during the production process, so that a single mold can be used to produce a variety of different products, enhancing the flexibility of the production line and its ability to adapt to different market needs.

[0069] Enhanced process repeatability: Since the mold can self-adjust to fit the preset microstructure pattern, it can ensure that the same high quality standards are achieved every time production is carried out, improving the repeatability and reliability of the entire manufacturing process.

[0070] Optimize heat and force distribution: The application of shape memory alloys and programmed particles allows the mold to distribute pressure and heat more evenly throughout the hot pressing process, which helps improve the overall performance and quality of the product.

[0071] Regarding the response characteristics of metal powders at high temperatures mentioned in S2, specifically the physical and chemical behaviors of metal powders under specific temperature conditions, these characteristics include:

[0072] Thermal stability: describes the ability of metal powder to maintain its structure and properties in a high temperature environment. Materials with poor thermal stability may experience structural deformation or performance degradation.

[0073] Phase changes: Metal powders may undergo a phase change when they reach a certain temperature, such as changing from solid to liquid, or undergoing a change in crystal structure.

[0074] Oxidation: At high temperatures, some metal powders may react with oxygen in the air to form oxides. This oxidation process can affect the mechanical properties and chemical stability of the material.

[0075] Sintering behavior: Sintering is a common process in powder metallurgy that involves heating metal powder at high temperatures to promote diffusion and bonding between particles. Sintering behavior is affected by the particle size, shape, temperature and holding time of the powder.

[0076] Thermal conductivity and thermal expansion: The thermal conductivity and thermal expansion coefficient of metal powder at high temperature are also important physical properties. They affect the stability and integrity of the material during heat treatment. The adaptive temperature control system detects and controls the response characteristics of some metal powders at high temperatures through corresponding sensors and combined with the following formula:

[0077] 1. Thermal expansion coefficient

[0078]

[0079] Where α is the coefficient of thermal expansion, L0 is the initial length, dL is the change in length, and dT is the change in temperature;

[0080] 2. Oxidation rate

[0081]

[0082] where r is the reaction rate, κ is the rate constant, and E a is the activation energy, R is the gas constant, and T is the absolute temperature;

[0083] 3. Sintering model

[0084]

[0085] Where ΔL is the shrinkage rate, L0 is the initial length, L t is the length after sintering, t is the sintering time, K and n are constants determined experimentally. This formula is used to predict the dimensional change during sintering.

[0086] 4. Relationship between thermal conductivity and temperature

[0087] λ=λ0·(1+β·(T+T0))

[0088] Where λ is the thermal conductivity of the material, λ0 is the thermal conductivity at the reference temperature, β is the temperature-dependent adjustment coefficient, T is the current temperature of the material, and T0 is the reference temperature.

[0089] These formulas provide the basis for quantifying and predicting the properties of metal powders at high temperatures, allowing the system to design more accurate heat treatment and sintering processes.

[0090] Regarding the preheating of metal mentioned in S1, eddy currents are generated inside the metal through a high-frequency electromagnetic field to generate heat. The specific process is that in a high-frequency electromagnetic field, when the alternating electromagnetic field passes through a conductive material (metal material), a closed current loop will be induced inside the material, which is called eddy current. The generation of eddy currents is related to Faraday's law of electromagnetic induction, that is, changes in the electromagnetic field will generate electromotive force in the conductor and cause the flow of current. The existence of eddy currents will cause the electrical energy inside the metal to be converted into thermal energy. This is due to the resistance characteristics of the metal. When the current flows through the metal, it will encounter resistance, thereby generating heat; the current for preheating the metal is adjusted through the adaptive temperature control system, thereby adjusting the preheating temperature; before implementation, the adaptive temperature control system can also preset the metal material and the preheating temperature and duration in advance.

[0091] Reference Figure 2 The embodiment of the present invention further provides a metal hot pressing device, comprising:

[0092] Heating unit: heats the metal material. The heating temperature, frequency and duration are adjustable. At the same time, it can also generate eddy currents inside the metal through high-frequency electromagnetic fields to preheat the metal.

[0093] Temperature control unit: The temperature control unit is equipped with an adaptive temperature control system and is electrically connected to the heating unit. The temperature control unit obtains the basic information and physical properties of the material by presetting the metal material, calculates the response characteristics of the metal powder under high temperature, and monitors the temperature of the material during the preheating and heating stages of the metal through the temperature sensor, and controls the heating temperature of the heating unit;

[0094] Hot pressing unit: The hot pressing unit is used to perform hot pressing of metal materials, including a pressure regulating system. The pressure regulating system is data-connected with the temperature control unit, and the pressure of the hot pressing stage is controlled in combination with the temperature inside the metal material, and the pressure is monitored through a pressure sensor.

[0095] Mold with specific microstructure pattern: The mold is capable of self-adjusting in a dynamic mode under high pressure, which allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programming particles to the mold material.

[0096] Reference Figure 3 In an embodiment of the present invention, a computer device is also provided. The computer device may be a server, and its internal structure may be as follows: Figure 3 As shown. The computer device includes a processor, a memory, a display screen, an input device, a network interface and a database connected through a system bus. Among them, the processor designed by the computer is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the corresponding data in this embodiment. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the above method is implemented.

[0097] Those skilled in the art will understand that Figure 3 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present invention, and does not constitute a limitation on the computer device to which the solution of the present invention is applied.

[0098] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, the above method is implemented. It can be understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0099] In summary,

[0100] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided by the present invention and used in the embodiments can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double-speed data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM.

[0101] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0102] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A metal hot pressing process, characterized in that: The method comprises: S1. Preheating of metal materials; S2, achieve a higher compression rate by pre-compressing the metal material at a preset temperature; The preset temperature is dynamically adjusted by an adaptive temperature control system, including an advanced adaptive temperature control system, which automatically adjusts the temperature based on real-time data during the process and the response characteristics of the metal powder at high temperature, and accurately adjusts the temperature, with the temperature adjustment range ranging from 450°C to 750°C; S3, using a mold with a specific microstructure pattern to perform multi-stage hot pressing under high temperature conditions, with pressure and temperature precisely controlled at each stage to gradually form the desired chip structure; S4. After the chip structure is formed, cooling and demolding operations are performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted by the adaptive temperature control system according to the selected metal material type to control the demolding time.

2. The metal hot pressing process according to claim 1, characterized in that: The advanced adaptive temperature control system adjustment system includes being equipped with a high-sensitivity temperature sensor, wherein a plurality of the temperature sensors are provided and installed at different positions near the workpiece, and the area responsible for each temperature sensor is divided; the advanced adaptive temperature control system is also equipped with a monitoring screen, and a screen segmentation unit is provided in the monitoring screen, and the screen segmentation unit segments the above-mentioned divided area to obtain a plurality of imaging areas, and the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor.

3. The metal hot pressing process according to claim 2, characterized in that: The pressure and duration of the hot pressing stage are optimized according to the physical properties of the metal powder and the expected microstructural characteristics. The pressure adjustment range is from 150 to 600 MPa. The precise adjustment of the pressure is achieved through a high-precision pressure regulation system, which can automatically adjust the pressure according to the compression stage and the type of metal powder used.

4. The metal hot pressing process according to claim 3, characterized in that: The pressure regulation system includes a high-precision pressure sensor, which is arranged in each area divided by the temperature sensor. The pressure regulation system is combined with the temperature control system to operate and adjust the pressure and temperature according to real-time feedback from the high-precision pressure sensor and the high-sensitivity temperature sensor.

5. The metal hot pressing process according to claim 1, characterized in that: The mold with a specific microstructure pattern includes a dynamic mode that self-adjusts under high pressure, and the dynamic mode allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programmed particles to the mold material.

6. The metal hot pressing process according to claim 1, characterized in that: The response characteristics of metal powders at high temperatures refer to the physical and chemical behaviors of metal powders under specific temperature conditions, including thermal stability, reaction rate, and thermal conductivity. The adaptive temperature control system detects and controls the response characteristics of metal powders at high temperatures through corresponding sensors and in combination with the following formula: Where α is the coefficient of thermal expansion, L0 is the initial length, dL is the change in length, and dT is the change in temperature; where r is the reaction rate, κ is the rate constant, and E a is the activation energy, R is the gas constant, and T is the absolute temperature; λ=λ0·(1+β·(T+T0)) Where λ is the thermal conductivity of the material, λ0 is the thermal conductivity at the reference temperature, β is the temperature-dependent adjustment coefficient, T is the current temperature of the material, and T0 is the reference temperature.

7. The metal hot pressing process according to claim 1, characterized in that: The preheating of the metal is to generate eddy currents inside the metal to generate heat through a high-frequency electromagnetic field; the temperature of the preheating of the metal is adjusted by an adaptive temperature control system, and the adaptive temperature control system can preset the metal material and the preheating temperature and duration in advance.

8. A metal hot pressing device, characterized in that: include: Heating unit: heats the metal material. The heating temperature, frequency and duration are adjustable. At the same time, it can also generate eddy currents inside the metal through high-frequency electromagnetic fields to preheat the metal. Temperature control unit: The temperature control unit is equipped with an adaptive temperature control system and is electrically connected to the heating unit. The temperature control unit obtains the basic information and physical properties of the material by presetting the metal material, calculates the response characteristics of the metal powder under high temperature, and monitors the temperature of the material during the preheating and heating stages of the metal through the temperature sensor, and controls the heating temperature of the heating unit; Hot pressing unit: The hot pressing unit is used to perform hot pressing of metal materials, including a pressure regulating system. The pressure regulating system is data-connected with the temperature control unit, and the pressure of the hot pressing stage is controlled in combination with the temperature inside the metal material, and the pressure is monitored through a pressure sensor. Mold with specific microstructure pattern: The mold is capable of self-adjusting in a dynamic mode under high pressure, which allows the mold to fine-tune its shape and size according to a preset pattern under pressure. This self-adjustment capability is achieved by adding specific shape memory alloys and programming particles to the mold material.

9. A computer device comprising a memory and a processor, wherein a computer program is stored in the memory, wherein: When the processor executes the computer program, the steps of the metal hot pressing process according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the metal hot pressing process according to any one of claims 1 to 7 are implemented.

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