Semiconductor multifunctional cutting-off automation equipment and control method thereof

Abstract

The invention relates to semiconductor multifunctional cutting-off automation equipment and a control method thereof, and belongs to the technical field of automatic machining equipment, the semiconductor multifunctional cutting-off automation equipment comprises a feeding assembly, a discharging assembly, a pre-tooling assembly and a cutting assembly, and the feeding assembly comprises a feeding trolley and a feeding part; the pre-tooling assembly comprises a tooling base, a multi-station turnover mechanism is arranged on the tooling base, a horizontal turnover surface is arranged on the multi-station turnover mechanism, at least two material transferring seats are arranged on the turnover surface at the same time, one material transferring seat is used for receiving bars transferred from the loading trolley by the loading part, and the other material transferring seat is matched with the cutting assembly; the discharging assembly comprises a discharging trolley and a discharging part. The discharging part is used for transferring the bars treated by the cutting assembly to a discharging trolley; by arranging the feeding assembly, the discharging assembly, the pre-tool assembly and the cutting assembly, the problem that the automation degree of semiconductor bar cutting is low is solved.

Description

Technical Field

[0001] The invention relates to the technical field of automated processing equipment, in particular to a semiconductor multifunctional cutting automated equipment and a control method thereof. Background Art

[0002] After the rod is drawn through the single crystal furnace, it is long and tapered at the head and tail. In the cutting process, the head and tail will be cut off first and then cut into multiple short rods, and the physical properties (including), CO content and electrical properties of the short rods entering the next square opening process are guaranteed to meet the requirements.

[0003] The existing process of bar cutting is as follows: after the bar is pulled out of the single crystal furnace, the staff observes whether the crystal line of the bar is broken, and measures the effective diameter and effective length of the bar with a caliper to detect the physical properties of the bar, and marks each section with a scriber at the position where there are defects at the head and tail, the position of the sample, and the position where the short bar is cut. Then, the cutting machine removes the head and tail of the bar according to the scribed points, cuts out disc-shaped samples, and cuts the remaining length of the bar into multiple short bars. In the process of bar turnover, the traditional turnover method is often a simple loading and unloading operation, lacking an efficient and stable turnover mechanism, resulting in low efficiency of automated production, and in the handling link, manual handling is not only inefficient, but also difficult to ensure the accuracy of each handling position, and is prone to operational errors. Summary of the invention

[0004] In order to solve the problems in the related art, the present invention provides a semiconductor multifunctional cutting automation device, which solves the problem of low automation level of semiconductor cutting operation.

[0005] In order to solve the above problems, the following technical solutions are provided:

[0006] A semiconductor multifunctional cutting automation equipment of the present invention comprises a loading component, a unloading component, a pre-tooling component and a cutting component, wherein the loading component comprises a loading trolley and a loading part; the pre-tooling component comprises a tooling base, and a multi-station turnover mechanism is arranged on the tooling base, wherein the multi-station turnover mechanism has a horizontal turnover surface on the top, and the turnover surface has at least two flow material seats at the same time, one flow material seat is used to receive the rod material from the loading trolley of the loading part, and the other flow material seat cooperates with the cutting component; the unloading component comprises a unloading trolley and a unloading part; the unloading part transfers the rod material processed by the cutting component to the unloading trolley.

[0007] The above technical scheme is adopted: by setting up a loading component, a unloading component, a pre-tooling component and a cutting component, the foundation of the semiconductor bar cutting automatic production line is ensured, and the loading component is used to realize automatic supply of bar materials, thereby avoiding the low efficiency and inaccuracy of manual loading; the multi-station turnover mechanism in the pre-tooling component is used to realize the processing of bar materials and the continuous conversion of bar materials to be processed, so that the placement and cutting operations of bar materials are carried out simultaneously, thereby improving the overall operation continuity and work efficiency of the equipment; the unloading component is used to ensure the automatic output and collection of bar materials after cutting, thereby reducing the manual handling links, reducing the labor intensity and improving the stability of product circulation.

[0008] It also includes a sampling component, which includes a sampling part and a sample box used in the working area of ​​the sampling part. The sampling part runs the bar sample processed by the cutting component to the sample box; the sampling part includes a mechanical arm connected to the unloading bracket, and the claw end of the mechanical arm uses a suction cup to grab the sample.

[0009] The above technical solution is adopted: the added sampling component is used to realize the ability of the equipment to automatically sample during the cutting process. The sampling part can accurately obtain the cut bar sample and transfer it to the sample box, so that the detection and truncation processes are carried out alternately. There is no need to perform a separate sampling operation after the truncation is completed, which greatly simplifies the process flow, reduces the turnaround time and material handling between processes, improves the overall production efficiency, and ensures the timeliness and accuracy of sample acquisition, which is conducive to timely discovering quality problems in the production process and making adjustments, and enhances the effectiveness and reliability of product quality control; the sampling part adopts a combined structure of a robotic arm and a suction cup, which can accurately locate the position of the bar sample in three-dimensional space, and the suction cup uses the principle of negative pressure adsorption to gently and stably grasp the sample, avoiding damage or deformation to the sample caused by traditional mechanical clamping methods.

[0010] The multi-station turnover mechanism includes a conveyor belt, a portion of which is located below the cutting assembly, and flow material seats are evenly arranged on the conveyor belt. The upper surface of the conveyor belt serves as a turnover surface. When a flow material seat cooperates with the cutting assembly, at least two flow material seats exist on the turnover surface at the same time.

[0011] The above technical solution is adopted: the multi-station turnover mechanism is equipped with a conveyor belt and evenly distributed flow material seats, which improves the turnover efficiency and stability of the bar material between each station. The conveyor belt is used as the turnover surface to ensure the smooth transmission of the bar material in the horizontal direction. When a flow material seat is under the cutting component for cutting operation, other flow material seats can load, unload or wait in an orderly manner on the conveyor belt, making the entire production process more compact and smooth, reducing the idle time of equipment and material waiting time, improving the comprehensive utilization rate of equipment and production rhythm, and effectively solving the problems of low efficiency and inflexible station switching in the traditional bar turnover method, and further improving the working efficiency and stability of semiconductor bar cutting automation equipment.

[0012] The edges of the tooling base away from the loading car are fixedly connected to the enclosure, and two roller shafts are rotatably arranged between the two parallel enclosures. Rollers are arranged on the two roller shafts to cover the conveyor belt; a worm gear is fixedly installed at one end of one roller shaft, and a worm motor is installed on the other enclosure, and the worm end of the worm motor is meshed with the worm gear.

[0013] The above technical solution is adopted: by setting a worm gear motor to drive the conveyor belt, a stable power transmission is provided for the conveyor belt. Since the worm gear mechanism has the characteristics of large transmission ratio and good self-locking property, it can accurately control the start and stop and running speed of the conveyor belt, thereby ensuring the positioning accuracy and movement smoothness of the circulating material seat on the conveyor belt. In the process of semiconductor bar cutting, this precise drive control can effectively avoid bar processing errors caused by unstable conveyor belt speed or material seat positioning deviation, improve cutting accuracy and product quality, and also reduce the probability of equipment failure due to unstable power transmission, improve the reliability and stability of equipment operation, and solve the needs of automation equipment for precise power transmission and stable operation control.

[0014] A positioning assembly is also provided below the cutting assembly, and the flow material seat located below the cutting assembly stops the bar material in the working area of ​​the cutting assembly through the positioning assembly.

[0015] By adopting the above technical solution: the alignment component below the cutting component can accurately position the bar on the flow material seat located in the cutting area. In the semiconductor bar cutting process, the cutting accuracy directly affects the quality and performance of the product. The alignment component can accurately fix the bar in the working area of ​​the cutting component to ensure that each cutting operation can be performed at the predetermined position, effectively reducing the cutting error caused by the position deviation of the bar, improving the dimensional accuracy and consistency of the product, and solving the problem of unstable product quality caused by inaccurate bar positioning in the traditional cutting process, which provides a guarantee for the product quality of semiconductor bar cutting.

[0016] The flow material seat includes a first section and a second section which are symmetrically arranged. The first section and the second section have the same structure and are respectively fixedly connected to the surface of the conveyor belt. A V-shaped opening is formed between the first section and the second section to support the rod material.

[0017] The above technical solution is adopted: the flow material seat with a symmetrical V-shaped opening can adapt to bars of different diameters, provide stable and reliable support during the turnover and cutting of the bars, effectively prevent the bars from rolling or shifting, and ensure the position stability of the bars during the processing. Secondly, the symmetrical and separated two-part structure makes the force distribution more uniform on the one hand, reducing the situation where the bars are subjected to excessive local force. In addition, in order to reduce damage to the conveyor belt, the separation structure greatly reduces the belt surface width occupied by the flow material seat, improves the stability of the coordination between the conveyor belt and the flow material seat, and reduces the risk of the surface of the conveyor belt being easily stretched when turning corners, further improving the safety and reliability of the bars during the circulation and processing, while meeting the problem that traditional material seats are difficult to adapt to bars of different sizes and have insufficient support stability.

[0018] The first section and the second section both include an L-shaped bracket and a material seat body, the material seat body is slidably arranged on the L-shaped opening of the L-shaped bracket, the bottom of the L-shaped bracket is fixedly connected to the surface of the conveyor belt, and a slope is provided on the top of the material seat body; a nut block is fixedly connected to the bracket, a stopper is fixedly connected to the material seat body, a screw rod is matched with the nut block, and one end of the screw rod is matched with the stopper.

[0019] The above technical solution is adopted: the first section and the second section of the flow material seat both adopt an adjustable structure, that is, the sliding setting of the material seat body on the L-shaped bracket and the adjustment mechanism composed of a screw, a nut block, and a stop block, thereby greatly improving the adaptability of the material seat to bars of different sizes. By rotating the screw, the position of the material seat body can be accurately adjusted, thereby changing the size of the V-shaped opening to adapt to bars of different diameters.

[0020] The loading and unloading parts are both provided with a handling unit, and the handling unit includes a column, two sides of the column are fixedly provided with longitudinal slide rails, and the two longitudinal slide rails are slidably connected with a U-shaped slide seat, and a first motor is fixedly provided on the U-shaped slide seat, and the output shaft of the first motor passes through the U-shaped slide seat and is fixedly provided with a transmission gear, and a transmission rack meshing with the transmission gear is longitudinally provided on a side of the column away from the longitudinal slide rail; a support seat is installed at the bottom of the column, and a third motor is fixedly connected to one side of the support seat, and a double-threaded screw rod is fixedly connected to the output shaft of the third motor, and a bearing seat is fixedly connected to the bottom of the support seat and both ends of the double-threaded screw rod are rotatably mounted on the bearing seat; two clamping jaws are symmetrically connected to the threads of the double-threaded screw rod, and a Both are provided with a V-shaped seat for clamping the rod material, and two guide slide rails are fixedly provided at the bottom of the support seat, and the guide slide rails are located on both sides of the clamping jaw, and the clamping jaw is provided with a first slider and is slidably installed on the guide slide rails through the first slider; a second slider is provided on two parallel outer facades of the U-shaped slide seat, and a second motor is installed on the second slider, and the output end of the second motor is connected to a traveling gear, a loading bracket is provided in the loading assembly, and a unloading bracket is provided in the unloading assembly, in the loading assembly, a first guide rail connected with the second slider is provided on the loading bracket, and a first rack meshing with the traveling gear is provided on the first guide rail, and in the unloading assembly, a second guide rail connected with the second slider is provided on the unloading bracket, and a second rack meshing with the traveling gear is provided on the second guide rail.

[0021] The above technical solution is adopted: the handling units in the loading and unloading parts adopt the same multi-axis motion structure, which realizes the high-precision and high-efficiency transportation of the bar in the three-dimensional space. The first motor can drive the transmission gear and the transmission rack to cooperate, control the movement accuracy of the U-shaped slide on the longitudinal slide rail, and realize the position adjustment of the bar in the vertical direction; the second motor drives the walking gear to engage with the guide rack to control the movement accuracy of the U-shaped slide in the horizontal lateral direction; and the third motor drives the double-threaded lead screw to rotate, driving the opening and closing movement of the clamp on the guide slide rail, which can realize the stable grasping and release of the bar, thereby solving the problem that traditional manual handling or simple mechanical handling is difficult to meet the high-precision and high-efficiency requirements of semiconductor manufacturing, and provides a key guarantee for the stable operation and efficient production of semiconductor bar cutting automation equipment.

[0022] A semiconductor multifunctional truncation automatic control system comprises a loading module, a cutting module, an unloading module and a system control module, wherein the loading module is used for loading rods, the cutting module comprises a slicing process module and a segmenting process module for slicing or segmenting the rods, the unloading module is used for sampling or unloading the sliced ​​or segmented rods, the system control module is used for sending control signals to the loading module, the cutting module and the unloading module to coordinate their actions and to interlock the loading module, the cutting module and the unloading module, the system control module, the loading module, the cutting module and the unloading module are communicatively connected, the loading module, the cutting module and the unloading module are interlocked, and the slicing process module and the segmenting process module are interlocked.

[0023] A semiconductor multifunctional cutoff automatic control method, the specific steps include:

[0024] S1, the loading part transports the bar material from the loading car to a circulating material seat on the turnover surface;

[0025] S2, start the multi-station turnover mechanism, the turnover surface drives the flow material seat with the bar material to run to the working area of ​​the cutting component, and at the same time, a new flow material seat appears on the turnover surface close to the loading car and the new flow material seat is in an idle state;

[0026] S3, the cutting assembly cuts the bar into sections, and the unloading part transports the section-cut bar to the unloading vehicle;

[0027] S3.1. While executing step S3, the loading unit transports the new bar material to the new flow material seat described in step S2;

[0028] S3.2, during the execution of step S3, the unloading component and the sampling component can work alternately. When sampling, the robotic arm adsorbs the suction cup on one end of the bar material, the cutting component slices the bar material, and the robotic arm places the sample in the sample box through the suction cup;

[0029] S4. When the bar material is cut into sections, the flow material seat in the working area of ​​the cutting component is in an idle state. At this time, the multi-station turnover mechanism is started again to make the turnover surface move the new bar material on the flow material seat into the working area of ​​the cutting component, and new flow material seats continue to appear on the turnover surface close to the loading car. Then, repeat the above step S3 to realize the automatic cutting operation of the bar material.

[0030] In summary, the present application includes at least one of the following beneficial technical effects:

[0031] 1. In the present invention, by setting a feeding component, a feeding component, a pre-tooling component and a cutting component, the foundation of the semiconductor bar cutting automatic production line is ensured, and the feeding component is used to realize the automatic supply of the bar, thereby avoiding the low efficiency and inaccuracy of manual feeding; the multi-station turnover mechanism in the pre-tooling component is used to realize the processing of the bar and the continuous conversion of the bar to be processed, so that the placement and cutting operations of the bar are carried out simultaneously, thereby improving the overall operation continuity and work efficiency of the equipment; the use of the feeding component ensures the automatic output and collection of the bar after cutting, reduces the manual handling link, reduces the labor intensity and improves the stability of product circulation.

[0032] 2. A sampling component is set up to realize the ability of automatic sampling during the cutting process. The sampling part can accurately obtain the cut bar sample and transfer it to the sample box, so that the detection and truncation processes are carried out alternately. There is no need to perform a separate sampling operation after the truncation is completed. This greatly simplifies the process flow, reduces the turnaround time and material handling between processes, improves the overall production efficiency, and ensures the timeliness and accuracy of sample acquisition, which is conducive to timely discovery of quality problems in the production process and adjustment, and enhances the effectiveness and reliability of product quality control. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein:

[0034] Figure 1 is a structural diagram of a semiconductor multifunctional cutting automation device provided in Example 1;

[0035] Figure 2 is a structural diagram of the pre-tooling assembly provided in Example 1;

[0036] Figure 3 is a cross-sectional view of the pre-tooling assembly provided in Example 1;

[0037] Figure 4 is a structural diagram of a transport unit in a loading assembly provided in Example 1;

[0038] Figure 5 yes Figure 4 A magnified view of part A;

[0039] Figure 6 is a schematic diagram of a flow material seat provided in Example 2;

[0040] Figure 7 It is a state schematic diagram of the control method provided by the present invention;

[0041] Figure 8 is another state schematic diagram of the control method provided by the present invention;

[0042] Fig. 9 It is a system block diagram of the semiconductor multifunctional cutoff automatic control system provided by the present invention;

[0043] Fig.10 yes Figure 6 Another state diagram of .

[0044] Figure numerals: 1, loading car; 2, tooling base; 201, enclosure; 202, conveyor belt; 203, circulation material seat; 2031, material seat body; 20311, ramp; 2032, guide rib; 2033, L-shaped bracket; 2034, nut block; 2035, stopper; 2036, screw; 204, roller shaft; 205, roller; 206, worm motor; 207, worm gear; 208, support plate; 3, loading bracket; 301, first guide rail; 4, unloading car; 5, Alignment assembly; 6. Unloading bracket; 7. Cutting assembly; 8. Handling unit; 801. Column; 802. U-shaped slide; 803. First motor; 804. Second slide; 805. Second motor; 806. First rack; 807. Support seat; 808. Third motor; 809. Double-threaded screw; 810. Bearing seat; 811. Clamp; 8111. First slide; 8112. V-block; 812. Guide rail; 9. Robot arm; 901. Suction cup; 10. Rod. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] A semiconductor multifunctional cutting automation device according to a first embodiment, such as Figures 1 to 6As shown, it includes a loading component, a unloading component, a pre-tooling component and a cutting component 7, the loading component includes a loading trolley 1 and a loading part; the pre-tooling component includes a tooling base 2, and a multi-station turnover mechanism is provided on the tooling base 2, and the multi-station turnover mechanism has a horizontal turnover surface on the top, and the turnover surface has at least two flow material seats 203 at the same time, one flow material seat 203 is used to receive the rod material 10 running from the loading trolley 1 of the loading part, and the other flow material seat 203 cooperates with the cutting component 7; the unloading component includes a unloading trolley 4 and a unloading part; the unloading part transfers the rod material 10 processed by the cutting component 7 to the unloading trolley 4. By setting up a loading component, a unloading component, a pre-tooling component and a cutting component 7, the foundation of the automated production line for cutting the semiconductor rods 10 is ensured, and the loading component is used to realize automatic supply of the rods 10, thereby avoiding the low efficiency and inaccuracy of manual loading; the multi-station turnover mechanism in the pre-tooling component is used to realize the processing of the rods 10 and the continuous conversion of the rods 10 to be processed, so that the placement and cutting operations of the rods 10 are carried out simultaneously, thereby improving the overall operation continuity and work efficiency of the equipment; the use of the unloading component ensures the automatic output and collection of the rods 10 after cutting, reduces the manual handling links, reduces the labor intensity and improves the stability of product circulation.

[0047] A positioning component 5 is also provided below the cutting component 7, and the flow material holder 203 located below the cutting component 7 stops the bar 10 in the working area of ​​the cutting component 7 through the positioning component 5. The positioning component 5 below the cutting component 7 can accurately position the bar 10 on the flow material holder 203 located in the cutting area. In the truncation process of the semiconductor bar 10, the cutting accuracy directly affects the quality and performance of the product. The positioning component 5 can accurately fix the bar 10 in the working area of ​​the cutting component 7, ensuring that each cutting operation can be performed at a predetermined position, effectively reducing the cutting error caused by the position deviation of the bar 10, improving the dimensional accuracy and consistency of the product, solving the problem of unstable product quality caused by inaccurate positioning of the bar 10 in the traditional cutting process, and providing a guarantee for the product quality after the semiconductor bar 10 is truncation.

[0048] In addition, the present embodiment also includes a sampling assembly, which includes a sampling part and a sample box used in the working area of ​​the sampling part, and the sampling part transfers the sample of the bar material 10 processed by the cutting component 7 to the sample box. The added sampling assembly enables the equipment to automatically sample during the cutting process. The sampling part can accurately obtain the sample of the bar material 10 after cutting and transfer it to the sample box, so that the detection and truncation processes are carried out alternately, and there is no need to perform a separate sampling operation after the truncation is completed, which greatly simplifies the process flow, reduces the turnaround time and material handling between processes, improves the overall production efficiency, and also ensures the timeliness and accuracy of sample acquisition, which is conducive to timely discovery of quality problems in the production process and adjustment, and enhances the effectiveness and reliability of product quality control.

[0049] Specifically, Figure 1 As shown, the sampling part includes a mechanical arm 9 connected to the unloading bracket 6, and the claw end of the mechanical arm 9 uses a suction cup 901 to grab the sample. The sampling part adopts a combined structure of the mechanical arm 9 and the suction cup 901, which can accurately locate the position of the sample of the bar material 10 in three-dimensional space, and the suction cup 901 uses the negative pressure adsorption principle to gently and stably grab the sample, avoiding the damage or deformation of the sample that may be caused by the traditional mechanical clamping method.

[0050] like Figure 2 As shown, the multi-station turnover mechanism includes a conveyor belt 202, a portion of which is located below the cutting assembly 7, and flow material seats 203 are evenly arranged on the conveyor belt 202. The upper surface of the conveyor belt 202 serves as a turnover surface. When one flow material seat 203 cooperates with the cutting assembly 7, at least two flow material seats 203 can exist on the turnover surface at the same time, that is, when the rod 10 is being cut, there is at least another flow material seat 203 on the turnover surface for placing the next rod 10.

[0051] like Figure 3As shown, in order to improve the supporting strength of the conveyor belt 202, a support plate 208 can be set on the lower side of the turnover surface to ensure that the turnover surface has sufficient supporting strength when the bar 10 on the turnover surface is being cut; therefore, this embodiment improves the turnover efficiency and stability of the bar 10 between each station by having a conveyor belt 202 and evenly distributed flow material seats 203 in the multi-station turnover mechanism. The conveyor belt 202 is used as the turnover surface to ensure the smooth transmission of the bar 10 in the horizontal direction. When a flow material seat 203 is under the cutting component 7 for cutting operation, other flow material seats 203 can load, unload or wait in an orderly manner on the conveyor belt 202, making the entire production process more compact and smooth, reducing the idle time of equipment and material waiting time, improving the comprehensive utilization rate of equipment and production rhythm, and effectively solving the problems of low efficiency and inflexible station switching in the traditional bar 10 turnover method, and further improving the working efficiency and stability of the semiconductor bar 10 cutting automation equipment.

[0052] Furthermore, combined with Figure 2 and Figure 3 As shown, the edge of the tooling base 2 away from the loading vehicle 1 is fixedly connected to the enclosure 201, and two roller shafts 204 are rotatably arranged between the two parallel enclosures 201, and rollers 205 are arranged on the two roller shafts 204 to sleeve the conveyor belt 202; a worm gear 207 is fixedly installed at one end of one roller shaft 204, and a worm motor 206 is installed on the other enclosure 201, and the worm end of the worm motor 206 is meshed with the worm gear 207; by setting the worm gear 207 and the worm motor 206 to drive the conveyor belt 202, a stable power transmission is provided for the conveyor belt 202, because the worm gear 207 and the worm mechanism have a large transmission ratio and self-locking performance. The conveyor belt 202 has good characteristics and can accurately control the start and stop and the running speed of the conveyor belt 202, thereby ensuring the positioning accuracy and movement smoothness of the flow material holder 203 on the conveyor belt 202. In the process of cutting and processing the semiconductor bar 10, this precise drive control can effectively avoid the processing error of the bar 10 caused by the unstable speed of the conveyor belt 202 or the positioning deviation of the material holder, thereby improving the cutting accuracy and product quality, and at the same time reducing the probability of equipment failure due to unstable power transmission, thereby improving the reliability and stability of the equipment operation, and solving the needs of automated equipment for precise power transmission and stable operation control.

[0053] like Figure 3As shown, the flow material seat 203 includes a first section and a second section which are symmetrically arranged. The first section and the second section have the same structure and are respectively fixedly connected to the surface of the conveyor belt 202 . A V-shaped opening is formed between the first section and the second section to support the rod material 10 . The flow material seat 203 with a symmetrical V-shaped opening can adapt to bars 10 of different diameters, provide stable and reliable support during the circulation and cutting of the bar 10, effectively prevent the bar 10 from rolling or deflecting, and ensure the position stability of the bar 10 during the processing. Secondly, the symmetrical and separated two-part structure makes the force distribution more uniform on the one hand, reduces the situation where the bar 10 is subjected to excessive local force. In addition, in order to reduce damage to the conveyor belt 202, the separation structure greatly reduces the belt surface width occupied by the flow material seat 203, improves the stability of the cooperation between the conveyor belt 202 and the flow material seat 203, and reduces the risk of the surface of the conveyor belt 202 being easily scratched when turning a corner, further improving the safety and reliability of the bar 10 during the circulation and processing, while meeting the problem that traditional material seats are difficult to adapt to bars 10 of different sizes and have insufficient support stability.

[0054] like Figure 4 and 5As shown, the loading and unloading parts of this embodiment are both provided with a handling unit 8, and the handling unit 8 includes a column 801, and longitudinal slide rails are fixedly provided on both sides of the column 801, and the two longitudinal slide rails are slidably connected with a U-shaped slide seat 802, and a first motor 803 is fixedly provided on the U-shaped slide seat 802, and the output shaft of the first motor 803 passes through the U-shaped slide seat 802 and is fixedly provided with a transmission gear, and a transmission rack meshing with the transmission gear is longitudinally provided on a side of the column 801 away from the longitudinal slide rail; a support seat 807 is installed at the bottom of the column 801, and a third motor 808 is fixedly connected to one side of the support seat 807, and a double-threaded screw rod 809 is fixedly connected to the output shaft of the third motor 808, and a bearing seat 810 is fixedly connected to the bottom of the support seat 807, and both ends of the double-threaded screw rod 809 are rotatably installed on the bearing seat 810; two clamping jaws 811 are symmetrically connected to the threads of the double-threaded screw rod 809, and there is a gap between the two clamping jaws 811 V-shaped seats for clamping the bar 10 are provided on the inner walls, and two guide rails 812 are fixedly provided at the bottom of the support seat 807. The guide rails 812 are located on both sides of the clamping jaw 811, and the clamping jaw 811 is provided with a first slider 8111 and is slidably installed on the guide rails 812 through the first slider 8111; second sliders 804 are provided on two parallel facades of the U-shaped slide 802, and a second motor 805 is installed on the second slider 804, and a traveling gear is connected to the output end of the second motor 805. A loading bracket 3 is provided in the loading assembly, and a unloading bracket 6 is provided in the unloading assembly. In the loading assembly, a first guide rail 301 connected to the second slider 804 is provided on the loading bracket 3, and a first rack 806 meshing with the traveling gear is provided on the first guide rail 301; in the unloading assembly, a second guide rail connected to the second slider 804 is provided on the unloading bracket 6, and a second rack meshing with the traveling gear is provided on the second guide rail. The handling units 8 in the loading and unloading parts adopt the same multi-axis motion structure, which realizes the high-precision and high-efficiency transportation of the bar 10 in three-dimensional space. The first motor 803 can drive the transmission gear and the transmission rack to cooperate, control the movement accuracy of the U-shaped slide 802 on the longitudinal slide rail, and realize the position adjustment of the bar 10 in the vertical direction; the second motor 805 drives the walking gear to engage with the guide rack to control the movement accuracy of the U-shaped slide 802 in the horizontal lateral direction; and the third motor 808 drives the double-threaded screw 809 to rotate, driving the opening and closing movement of the clamp 811 on the guide slide rail 812, which can realize the stable grasping and release of the bar 10, thereby solving the problem that traditional manual handling or simple mechanical handling is difficult to meet the high-precision and high-efficiency requirements of semiconductor manufacturing, and provides a key guarantee for the stable operation and efficient production of semiconductor bar 10 cutting automation equipment.

[0055] A semiconductor multifunctional cutting automation device according to a second embodiment, such as Figure 6 and 10As shown, compared with the first embodiment, in this embodiment, the first section and the second section of the flow material seat 203 adopt the same structure and both include an L-shaped bracket 2033 and a material seat body 2031. The material seat body 2031 is slidably arranged on the L-shaped opening of the L-shaped bracket 2033. The bottom of the L-shaped bracket 2033 is fixedly connected to the surface of the conveyor belt 202. A slope 20311 is provided on the top of the material seat body 2031. A nut block 2034 is fixedly connected to the bracket, a stopper 2035 is fixedly connected to the material seat body 2031, a screw rod 2036 is matched with the nut block 2034, and one end of the screw rod 2036 is matched with the stopper 2035. The first section and the second section of the flow material holder 203 both adopt an adjustable structure, i.e., the sliding setting of the material holder body 2031 on the L-shaped bracket 2033 and the adjustment mechanism formed by the screw 2036, the nut block 2034, and the stop block 2035, thereby greatly improving the adaptability of the material holder to rods 10 of different sizes. By rotating the screw 2036, the position of the material holder body 2031 can be accurately adjusted, thereby changing the size of the V-shaped opening to adapt to rods 10 of different diameters.

[0056] As an example, Figure 6 As shown, the bottom of the material seat body 2031 has a guide rib 2032, and a guide groove adapted to the guide rib 2032 is set on the horizontal end surface of the L-shaped bracket 2033, and a sliding fit is formed between the material seat body 2031 and the L-shaped bracket 2033 through the guide rib 2032 and the guide groove.

[0057] like Fig. 9 As shown, the present invention includes a semiconductor multifunctional truncation automatic control system, including a loading module, a cutting module, a unloading module and a system control module. The loading module is used to load the rod material. The cutting module includes a slicing process module and a segmenting process module for slicing or segmenting the rod material. The unloading module is used to sample or unload the sliced ​​or segmented rod material. The system control module is used to send control signals to the loading module, the cutting module and the unloading module to coordinate the actions and interlock the loading module, the cutting module and the unloading module. The system control module, the loading module, the cutting module and the unloading module are connected in communication. The loading module, the cutting module and the unloading module are interlocked with each other, and the slicing process module and the segmenting process module are interlocked with each other. The loading module includes a loading manipulator for clamping the silicon rod and a driving module for driving the loading manipulator; the unloading module also includes a unloading manipulator and a sheet-taking robot, and the unloading manipulator and the sheet-taking robot are interlocked with each other.

[0058] By separately setting up a loading module, a cutting module and a unloading module, and having a separate control module to control the loading module, the cutting module and the unloading module respectively, and communicating and transmitting data between them, the processing of the bar material can be more accurate. The three control modules are controlled by the control system module, thereby coordinating the actions between the three modules, and interlocking is achieved between the three modules, which effectively reduces the possibility of accidents in the process of processing the bar material. Multiple sensors and limit devices are set in the loading module, the cutting module and the unloading module, and soft protection is set in the system control module, which can ensure the safety of equipment and system from multiple directions and angles.

[0059] The present invention also includes a semiconductor multifunctional cutoff automatic control method, the specific steps are as follows:

[0060] S1, the loading unit transports the bar material 10 from the loading vehicle 1 to a flow material seat 203 on the turnover surface;

[0061] S2, start the multi-station turnover mechanism, the turnover surface drives the circulation material seat 203 with the bar material 10 to run to the working area of ​​the cutting assembly 7, and at the same time, a new circulation material seat 203 appears on the turnover surface close to the loading vehicle 1 and the new circulation material seat 203 is in an idle state;

[0062] S3, the cutting assembly 7 cuts the bar 10 into sections, and the unloading part transports the section-cut bar 10 to the unloading vehicle 4;

[0063] S3.1. While executing step S3, the loading unit transports the new bar material 10 to the new flow material seat 203 described in step S2;

[0064] S3.2, during the execution of step S3, the unloading assembly and the sampling assembly can work alternately. When sampling, the robot arm 9 adsorbs the suction cup 901 on one end of the bar 10, the cutting assembly 7 slices the bar 10, and the robot arm 9 places the sample in the sample box through the suction cup 901;

[0065] S4. When the bar 10 is cut into sections, the flow material seat 203 in the working area of ​​the cutting component 7 is in an idle state. At this time, the multi-station turnover mechanism is started again to make the turnover surface move the new bar 10 on the flow material seat 203 into the working area of ​​the cutting component 7, and new flow material seats 203 continue to appear on the turnover surface near the loading car 1. Then, repeat the above step S3 to realize the automatic cutting operation of the bar 10.

[0066] like Figure 7 and 8As shown, in step S3, while the cutting assembly 7 is cutting the bar 10 in sections, the loading part can load the new bar 10 (step S3.1), and the unloading assembly and the sampling assembly can also work alternately (step S3.2). This multi-task parallel setting greatly improves the overall operating efficiency of the equipment and reduces the idle waiting time in the production process. In contrast, the traditional single-threaded operation mode may require unloading and loading preparations after the cutting is completed, while this method can make each process closely connected through reasonable process arrangement, fully utilize the operating time of the equipment, and improve the output per unit time.

[0067] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A semiconductor multifunctional cutting automation device, comprising a loading component, a unloading component, a pre-tooling component and a cutting component (7), characterized in that: The feeding assembly comprises a feeding vehicle (1) and a feeding portion; The pre-tooling assembly comprises a tooling base (2), a multi-station turnover mechanism is provided on the tooling base (2), the multi-station turnover mechanism has a horizontal turnover surface, the turnover surface has at least two flow material seats (203), one flow material seat (203) is used to receive the bar material (10) running from the loading vehicle (1) of the loading part, and the other flow material seat (203) cooperates with the cutting assembly (7); The unloading component comprises an unloading trolley (4) and an unloading part; the unloading part transfers the bar material (10) processed by the cutting component (7) to the unloading trolley (4).

2. A semiconductor multifunctional cutting automation equipment according to claim 1, characterized in that: It also includes a sampling component, the sampling component includes a sampling part and a sample box used in the working area of ​​the sampling part, the sampling part runs the bar material (10) sample processed by the cutting component (7) to the sample box; the sampling part includes a mechanical arm (9) connected to the unloading bracket (6), and the claw end of the mechanical arm (9) uses a suction cup (901) to grab the sample.

3. A semiconductor multifunctional cutting automation equipment according to claim 2, characterized in that: The multi-station turnover mechanism comprises a conveyor belt (202), a portion of which is located below the cutting assembly (7), and flow material seats (203) are evenly arranged on the conveyor belt (202). The upper surface of the conveyor belt (202) serves as a turnover surface. When a flow material seat (203) cooperates with the cutting assembly (7), at least two flow material seats (203) exist on the turnover surface at the same time.

4. The semiconductor multifunctional cutting automation equipment according to claim 3, characterized in that: The edges of the tooling base (2) away from the loading vehicle (1) are fixedly connected to the enclosure (201), and two roller shafts (204) are rotatably arranged between the two parallel enclosures (201), and rollers (205) are arranged on the two roller shafts (204) to sleeve the conveyor belt (202); a worm gear (207) is fixedly installed at one end of one roller shaft (204), and a worm motor (206) is installed on the other enclosure (201), and the worm end of the worm motor (206) is meshed with the worm gear (207).

5. The semiconductor multifunctional cutting automation equipment according to claim 3, characterized in that: A positioning component (5) is also provided below the cutting component (7), and a flow material seat (203) located below the cutting component (7) stops the bar material (10) within the working area of ​​the cutting component (7) through the positioning component (5).

6. A semiconductor multifunctional cutting automation equipment according to claim 4 or 5, characterized in that: The flow material seat (203) comprises a first section and a second section which are symmetrically arranged. The first section and the second section have the same structure and are each fixedly connected to the surface of the conveyor belt (202). A V-shaped opening is formed between the first section and the second section to support the rod material (10).

7. The semiconductor multifunctional cutting automation equipment according to claim 6, characterized in that: The first section and the second section both comprise an L-shaped bracket (2033) and a material holder body (2031); the material holder body (2031) is slidably arranged on the L-shaped opening of the L-shaped bracket (2033); the bottom of the L-shaped bracket (2033) is fixedly connected to the surface of the conveyor belt (202); a slope (20311) is provided on the top of the material holder body (2031); a nut block (2034) is fixedly connected to the bracket; a stopper (2035) is fixedly connected to the material holder body (2031); a screw rod (2036) is matched with the nut block (2034); one end of the screw rod (2036) is matched with the stopper (2035).

8. The semiconductor multifunctional cutting automation equipment according to claim 7, characterized in that: The loading and unloading parts are both provided with a transport unit (8), the transport unit (8) comprising a column (801), longitudinal slide rails are fixedly arranged on both sides of the column (801), the two longitudinal slide rails are slidably connected with a U-shaped slide seat (802), a first motor (803) is fixedly arranged on the U-shaped slide seat (802), the output shaft of the first motor (803) passes through the U-shaped slide seat (802) and is fixedly provided with a transmission gear, and a transmission rack meshing with the transmission gear is longitudinally arranged on a side of the column (801) away from the longitudinal slide rail The bottom of the column (801) is provided with a support seat (807), one side of the support seat (807) is fixedly connected to a third motor (808), the output shaft of the third motor (808) is fixedly connected to a double-threaded screw (809), the bottom of the support seat (807) is fixedly connected to a bearing seat (810), and both ends of the double-threaded screw (809) are rotatably mounted on the bearing seat (810); the double-threaded screw (809) is symmetrically connected to two clamping jaws (811), and the inner portion between the two clamping jaws (811) is fixedly connected to the bearing seat (810). The wall is provided with a V-shaped seat for clamping the rod (10), and two guide slide rails (812) are fixedly provided at the bottom of the support seat (807), and the guide slide rails (812) are located on both sides of the clamping jaw (811), and the clamping jaw (811) is provided with a first slider (8111) and is slidably installed on the guide slide rail (812) through the first slider (8111); the two parallel facades of the U-shaped slide seat (802) are provided with a second slider (804), and the second slider (804) is installed with a second motor (805), and the second motor The output end of the machine (805) is connected to a traveling gear, a loading bracket (3) is provided in the loading component, and a unloading bracket (6) is provided in the unloading component. In the loading component, a first guide rail (301) connected to a second slider (804) is provided on the loading bracket (3), and a first rack (806) meshing with the traveling gear is provided on the first guide rail (301). In the unloading component, a second guide rail connected to the second slider (804) is provided on the unloading bracket (6), and a second rack meshing with the traveling gear is provided on the second guide rail.

9. A semiconductor multifunctional cut-off automatic control system, using the semiconductor multifunctional cut-off automatic device according to claim 8, characterized in that: It includes a loading module, a cutting module, a unloading module and a system control module. The loading module is used to load the rods. The cutting module includes a slicing process module and a segmenting process module for slicing or segmenting the rods. The unloading module is used to sample or unload the sliced ​​or segmented rods. The system control module is used to send control signals to the loading module, the cutting module and the unloading module to coordinate their actions and to interlock the loading module, the cutting module and the unloading module. The system control module, the loading module, the cutting module and the unloading module are communicatively connected. The loading module, the cutting module and the unloading module are interlocked with each other, and the slicing process module and the segmenting process module are interlocked with each other. The loading module includes a loading robot for clamping the silicon rods and a driving module for driving the loading robot. The unloading module also includes an unloading robot and a sheet-taking robot. The unloading robot and the sheet-taking robot are interlocked with each other.

10. A semiconductor multifunctional cutoff automatic control method as claimed in claim 8, characterized in that: The specific steps include: S1, the loading part transports the bar material from the loading car to a circulating material seat on the turnover surface; S2, start the multi-station turnover mechanism, the turnover surface drives the flow material seat with the bar material to run to the working area of ​​the cutting component, and at the same time, a new flow material seat appears on the turnover surface close to the loading car and the new flow material seat is in an idle state; S3, the cutting assembly cuts the bar into sections, and the unloading part transports the section-cut bar to the unloading vehicle; S3.

1. While executing step S3, the loading unit transports the new bar material to the new flow material seat described in step S2; S3.2, during the execution of step S3, the unloading component and the sampling component can work alternately. When sampling, the robotic arm adsorbs the suction cup on one end of the bar material, the cutting component slices the bar material, and the robotic arm places the sample in the sample box through the suction cup; S4. When the bar material is cut into sections, the flow material seat in the working area of ​​the cutting component is in an idle state. At this time, the multi-station turnover mechanism is started again to make the turnover surface move the new bar material on the flow material seat into the working area of ​​the cutting component, and new flow material seats continue to appear on the turnover surface close to the loading car. Then, repeat the above step S3 to realize the automatic cutting operation of the bar material.

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