Non-filling lamination forming method for embedded cavity of chip device

Abstract

The invention discloses a non-filling lamination forming method for an embedded cavity of a chip device, belongs to the technical field of non-filling lamination forming, is used for a multilayer ceramic chip device, and comprises the following steps: manufacturing a stainless steel cavity cover plate and a soft rubber film according to the size requirement of the embedded cavity; placing an upper functional layer of the chip device on a lamination table, and laminating the stacked multi-layer structure by using a whole-surface cover plate to obtain a first module; stacking a lower functional layer and a middle cavity layer of the chip device on a lamination table in sequence, and laminating the stacked multi-layer structure by using a stainless steel cavity cover plate and a soft rubber film to obtain a second module; the first module and the second module are stacked in sequence and then laminated, and the chip device with the embedded cavity is obtained. The non-filling process is adopted for forming, sacrificial materials do not need to be filled, and the method has the advantages of low cost, short processing period, high efficiency, high quality and the like.

Description

Technical Field

[0001] The invention relates to a non-filling lamination molding method for a buried cavity in a chip-type device, belonging to the technical field of non-filling lamination molding of chip-type devices. Background Art

[0002] The manufacturing of the cavity of the chip device is adopted according to different application fields and usage requirements. In the current public technology, the cavity thickness is ≤0.05mm, and the carbon paste is generally printed on the surface of the multilayer ceramic by screen printing technology, and the cavity manufacturing can be completed by lamination, cutting, sintering and other processes; for the buried cavity with a cavity thickness of ≤0.3mm, carbon sacrificial materials are often filled in the cavity, which play a supporting role in the lamination process to ensure the quality and precision of the cavity molding. During the sintering process, the sacrificial material burns and volatilizes to form a cavity. However, the mismatch of carbon sacrificial materials in the lamination and sintering process will lead to cavity cracks, delamination and other failures. Especially for cavities with a thickness greater than 0.3mm, it is difficult to select suitable carbon materials, adjust the carbon material composite production method, and sintering curves, and the test cycle is long and the processing is complicated. In addition, there is currently no public method for non-filled hot pressing to form buried cavities in China. Summary of the invention

[0003] The purpose of the present invention is to provide a non-filling lamination molding method for a buried cavity in a chip device, and the buried cavity of the chip device is prepared by a non-filling process. The non-filling process molding method refers to a multilayer ceramic hot pressing molding process in which the buried cavity can be directly hot pressed without filling with sacrificial materials, and the cavity molding quality and molding accuracy can be guaranteed.

[0004] In order to achieve the above objectives / solve the above technical problems, the present invention is implemented by adopting the following technical solutions.

[0005] The present invention provides a non-filling lamination molding method for a buried cavity in a chip device, the method is used for hot pressing molding of a chip device, the chip device structure layer comprises an upper functional layer, an intermediate cavity layer and a lower functional layer; The method comprises the following steps: Make stainless steel cavity cover and soft rubber mold according to the size requirements of the embedded cavity; Stacking the upper functional layer of the chip device on a stacking table, and laminating the stacked multilayer structure using a whole cover plate to obtain a first module; The lower functional layer and the middle cavity layer of the chip device, the soft adhesive film, and the stainless steel cavity cover plate are stacked in sequence on a stacking table, and the stacked multilayer structure is laminated using the entire cover plate, and the soft adhesive film and the stainless steel cavity cover plate are removed to obtain a second module containing a cavity structure; The first module and the second module are sequentially stacked on a stacking table, and the two stacked modules are laminated using a whole cover plate to obtain a chip device with an embedded cavity.

[0006] Furthermore, the method for manufacturing the soft adhesive film according to the size requirements of the embedded cavity includes: A stainless steel mold and a stainless steel base are manufactured according to the size requirements of the embedded cavity, and the stainless steel mold and the stainless steel base are provided with first positioning holes corresponding to the positions; The stainless steel mold sleeve is placed on the stainless steel base according to the position of the first positioning hole to form a stainless steel assembly; Mix the glue and curing agent in a certain proportion and inject them into the stainless steel plate assembly; The stainless steel parts containing the mixed solution are placed in an oven, and the mixed solution is dried at 60-80° C. for 1-2 hours to obtain a soft adhesive film.

[0007] Furthermore, the soft adhesive film is a membrane-like structure with a downward protrusion in the middle, and the protrusion thickness of the soft adhesive film is 20-40 μm lower than the height of the middle cavity layer.

[0008] Furthermore, the stainless steel cavity cover plate is a plate-like structure, and a cavity groove is arranged in the middle of the stainless steel cavity cover plate, and the cavity groove is used to cooperate with the soft adhesive film to form a cavity structure to ensure that the cavity is formed flat after the first lamination of the cavity, and second positioning holes are arranged around the stainless steel cavity cover plate, and the second positioning holes are used for stacking alignment.

[0009] Furthermore, the thickness of the stainless steel cavity cover plate is 0.03-0.05 mm, and the length and width of the cavity groove are 30-50 μm smaller than the length and width of the embedded cavity.

[0010] Furthermore, the stacked multilayer structure is laminated using the whole cover plate and the cavity cover plate to obtain the first module and the second module. The lamination conditions are: lamination pressure range is 3000-4000psi, lamination temperature range is 75-85℃, and lamination time range is 20-30min.

[0011] Furthermore, when the two stacked modules are laminated using the entire cover plate, the lamination conditions are as follows: the lamination pressure ranges from 300 to 500 psi, the lamination temperature ranges from 75 to 85° C., and the lamination time ranges from 5 to 10 min.

[0012] Furthermore, the lower functional layer and the middle cavity layer of the chip-type oxygen sensor are stacked in sequence with the soft adhesive film and the stainless steel cavity cover plate on a stacking table, wherein a polyester film is provided between the lower functional layer and the stacking table.

[0013] Furthermore, after the first module is laminated for the first time and the lamination glue is printed on the contact surface with the middle cavity layer, the first module and the second module are sequentially stacked on the lamination table for the second lamination.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention proposes a non-filling lamination molding method for a buried cavity in a chip device, which adopts a two-time lamination method to ensure the close bonding between the structural layers, the cavity molding quality and the molding accuracy. During the lamination process, the present invention uses a whole-surface cover plate to laminate the multi-layer structure of the chip device, and uses a stainless steel cavity cover plate and a soft adhesive film corresponding to the cavity to participate in the lamination process of the middle cavity layer. On the one hand, it ensures the lamination bonding and lamination flatness of the first molding of the first module / second module, and ensures the flatness of the second lamination molding of the first module and the second module. On the other hand, it is conducive to the lamination bonding of the first molding of the second module, forming a high-quality buried cavity structure, and achieving the effect of non-filling hot pressing molding of the buried cavity.

[0015] The present invention can be used for non-filled hot pressing forming of buried cavities in chip devices, and is particularly suitable for cavities with large sizes and high depths; compared with the traditional cavity filling forming method, the forming method can make up for the disadvantages of the existing filling process forming process, such as complex filling material processing technology, high processing difficulty, poor quality, high sintering matching difficulty, and long sintering cycle. The forming process is simple, material saving, and low processing difficulty. It avoids the problems of high processing difficulty of sacrificial materials and mismatch with green porcelain sintering, and can be used for mass production to improve production efficiency. In addition, the method for forming buried cavities is also conducive to the processing of the side walls of the cavity layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the steps of a non-filling lamination molding method for buried cavities in a chip device provided by an embodiment of the present invention; Figure 2 Shown is a schematic diagram of the functional layer structure of a chip device; Figure 3 The figure shows a schematic diagram of the lamination structure of the second module in an embodiment of the present invention; Figure 4 The figure shows a schematic diagram of the lamination structure of the second module and the first module in an embodiment of the present invention; Figure 5 The figure shows a schematic diagram of the combined structure of the stainless steel cavity cover plate and the soft adhesive film in an embodiment of the present invention; In the figure, 1-upper functional layer, 2-middle cavity layer, 3-lower functional layer, 4-whole cover plate, 5-stacking table, 6-stainless steel cavity cover plate, 7-soft rubber mold, 8-cavity groove. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solution of the present invention, rather than limitations on the technical solution of the present invention. The embodiments of the present invention and the technical features in the embodiments may be combined with each other unless there is a conflict.

[0018] This embodiment introduces a non-filling lamination molding method for an embedded cavity in a chip device. The method is universal and can be used for the embedded cavity molding of various chip devices. The chip device structural layer includes an upper functional layer 1, an intermediate cavity layer 2 and a lower functional layer 3. The embedded cavity in the intermediate cavity layer has the characteristics of large size, large aspect ratio and high molding difficulty. The present invention prepares the embedded cavity by a non-filling molding method, which can make up for the disadvantages of the existing filling process molding process, such as complex filling material processing technology, high processing difficulty, poor quality, high sintering matching difficulty and long sintering cycle.

[0019] Taking a chip device containing a large-sized buried cavity (length: 55-60 mm, width: 1.0-2.0 mm, thickness: 0.4-0.6 mm) as an example, the method of the present invention mainly includes the following steps: Step A: manufacturing a stainless steel cavity cover plate 6 and a soft rubber mold 7 according to the size requirements of the embedded cavity, wherein the size requirements of the embedded cavity mainly include length, width, and thickness (depth).

[0020] The stainless steel cavity cover plate is a plate-like structure, and its main function is to be placed on the layer structure that needs to embed the cavity, leaving cavity space, and assisting in the preparation of the embedded cavity. A cavity groove 8 is set in the middle of the stainless steel cavity cover plate, and the cavity groove is used to place the raised part of the soft adhesive film, and cooperate with the soft adhesive film to form a cavity structure, which can ensure that the cavity is flat. Second positioning holes are set around the stainless steel cavity cover plate. During the lamination process, the lamination is aligned through the second positioning holes to put the stainless steel cavity cover plate in the correct position.

[0021] In the embodiment of the present invention, the thickness of the stainless steel cavity cover plate is 0.03-0.05 mm, the cavity size of the stainless steel cavity cover plate is designed to be 30-50 μm smaller than the actual cavity design size, and the reduced length and width are the same, ensuring uniform force on the edge of the cavity.

[0022] The soft adhesive film is made according to the size and thickness of the embedded cavity. It is used to avoid cavity deformation during lamination and ensure cavity forming accuracy. The convex thickness of the soft adhesive film is 20-40μm lower than the thickness of the embedded cavity in the middle layer.

[0023] In an embodiment of the present invention, a method for manufacturing a soft plastic mold according to the embedded cavity size requirements includes: (1) A stainless steel mold and a stainless steel base are manufactured according to the size requirements of the embedded cavity, and first positioning holes corresponding to the positions are set on the stainless steel mold and the stainless steel base.

[0024] (2) The stainless steel mold sleeve is placed on the stainless steel base according to the position of the first positioning hole to form a stainless steel assembly. The hollow portion of the stainless steel assembly is the space required for the soft film.

[0025] (3) Mix the silicone and curing agent in a certain proportion and inject them into the stainless steel plate assembly, then cover with a stainless steel cover and compact it.

[0026] (4) The stainless steel parts containing the mixed solution are placed in an oven and dried at 60-80°C for 1-2 hours to obtain a soft film after the mixed solution is dried.

[0027] When making an embedded cavity of the same size, the soft adhesive film can be reused, has a long service life, does not need to be remade each time, and has a low cost.

[0028] Step B: stack the upper functional layers of the chip device in sequence on the stacking table 5, and laminate the stacked multi-layer structure using the entire cover plate 4 to obtain a first module. In practical applications, the upper functional layer can be divided into a multi-layer structure according to specific functional requirements. For example, the upper functional layer of the chip oxygen sensor includes a heating layer and a blank layer.

[0029] A full-surface polyester film is placed between the upper functional layer and the lamination table, and a full-surface polyester film is also placed between the upper functional layer and the full-surface cover plate. The polyester film can prevent the upper functional layer from sticking to the lamination table / full-surface cover plate during the lamination process.

[0030] Step C: stack the soft adhesive film, the stainless steel cavity cover plate, the middle cavity layer and the lower functional layer of the chip device in sequence on a stacking table, and laminate the stacked multilayer structure using the entire cover plate. After removing the soft adhesive film and the stainless steel cavity cover plate, a second module containing a cavity structure is obtained.

[0031] The lamination sequence of the second module is as follows: Figure 3 As shown, in order to avoid direct contact between the soft adhesive film and the raw porcelain and to avoid contamination, a full-surface polyester film is provided between the stainless steel cavity cover plate and the cavity layer, and between the lower functional layer and the lamination table.

[0032] Step D: stack the first module and the second module on a stacking table in sequence, and laminate the two stacked modules using a whole cover plate to obtain a chip device with a buried cavity, such as Figure 4 Before lamination, a laminating glue having a composition close to that of raw porcelain is firstly printed on the surface of the first module close to the middle cavity layer, and then the first module and the second module are stacked and laminated to ensure that the first module and the second module are laminated for the second time under a relatively small lamination pressure.

[0033] In step B and step C, the lamination conditions are: lamination pressure ranges from 3000 to 4000 psi, lamination temperature ranges from 75 to 85° C., and lamination time ranges from 20 to 30 min.

[0034] In step D, the lamination conditions are: lamination pressure ranges from 300 to 500 psi, lamination temperature ranges from 75 to 85° C., and lamination time ranges from 5 to 10 min.

[0035] The method of the present invention adopts a two-time lamination method (the first lamination corresponds to step B and step C, and the second lamination corresponds to step D). This lamination design method can ensure the close bonding between the structural layers, the cavity molding quality and molding accuracy. During the lamination process, the present invention uses a whole-surface cover plate for lamination to ensure the lamination bonding and lamination flatness of the first module / second module for the first molding, and to ensure the flatness of the second lamination of the first module and the second module. The present invention uses a stainless steel cavity cover plate corresponding to the cavity and a soft film for lamination, which is conducive to achieving the lamination bonding of the second module for the first molding, and improving the lamination flatness and cavity molding quality.

[0036] The present invention adopts non-filling process molding, does not need to fill sacrificial materials, saves materials, has a short processing cycle, mature and stable process, simple operation, can be used for mass production, improves production efficiency, and can make up for the disadvantages of the existing filling process molding process, such as complex filling material processing technology, high processing difficulty, poor quality, high sintering matching difficulty, and long sintering cycle. At the same time, the non-filling molding method is particularly suitable for large-size embedded cavity molding, and its advantages are particularly reflected in low cost, low process difficulty and high finished product quality; in addition, the method of molding the embedded cavity is also conducive to the processing of the cavity layer side wall.

[0037] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0038] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0039] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0040] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0041] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, which all fall within the protection of the present invention.

Claims

1. A non-filling lamination method for embedding a cavity in a chip device, characterized in that: The chip device structure layer includes an upper functional layer, an intermediate cavity layer and a lower functional layer; The method comprises the following steps: Stainless steel cavity cover and soft film are made according to the size requirements of the embedded cavity; Stacking the functional layers on the chip device on a stacking table, and laminating the stacked multilayer structure using a whole cover plate to obtain a first module; The lower functional layer and the middle cavity layer of the chip device are stacked on a stacking table in sequence with the soft adhesive film and the stainless steel cavity cover plate, and the stacked multilayer structure is laminated using the entire cover plate, and after removing the soft adhesive film and the stainless steel cavity cover plate, a second module containing a cavity structure is obtained; The first module and the second module are sequentially stacked on a stacking table, and the two stacked modules are laminated using a whole cover plate to obtain a chip device with an embedded cavity.

2. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: Methods for making soft adhesive films according to the embedded cavity size requirements include: A stainless steel mold and a stainless steel base are manufactured according to the size requirements of the embedded cavity, and the stainless steel mold and the stainless steel base are provided with first positioning holes corresponding to the positions; The stainless steel mold sleeve is placed on the stainless steel base according to the position of the first positioning hole to form a stainless steel assembly; Mix the glue and curing agent in a certain proportion and inject them into the stainless steel plate assembly; The stainless steel parts containing the mixed solution are placed in an oven, and the mixed solution is dried to obtain a soft adhesive film.

3. The non-filling lamination molding method for buried cavities in chip devices according to claim 2, characterized in that: The soft adhesive film is a film-like structure with a downward protrusion in the middle, and the protrusion thickness of the soft adhesive film is 20-40 μm.

4. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: The stainless steel cavity cover plate is a plate-like structure, a cavity groove is arranged in the middle of the stainless steel cavity cover plate, the cavity groove is used to cooperate with the soft adhesive film to form a cavity structure, and second positioning holes are arranged around the stainless steel cavity cover plate, the second positioning holes are used for lamination alignment.

5. The non-filling lamination molding method for buried cavities in chip devices according to claim 4, characterized in that: The thickness of the stainless steel cavity cover plate is 0.03-0.05 mm, and the length and width of the cavity groove are 30-50 μm smaller than the length and width of the embedded cavity.

6. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: The stacked multilayer structure is laminated using the entire cover plate to obtain the first module and the second module. The lamination conditions are: lamination pressure range is 3000-4000psi, lamination temperature range is 75-85°C, and lamination time range is 20-30min.

7. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: When the two stacked modules are laminated using the entire cover plate, the lamination conditions are as follows: the lamination pressure ranges from 300 to 500 psi, the lamination temperature ranges from 75 to 85° C., and the lamination time ranges from 5 to 10 min.

8. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: The lower functional layer and the middle cavity layer of the chip device, the soft adhesive film and the stainless steel cavity cover plate are stacked in sequence on a stacking table, wherein a polyester film is provided between the lower functional layer and the stacking table.

9. The non-filling lamination molding method for buried cavities in chip devices according to claim 1, characterized in that: After the first module is laminated for the first time, after the lamination glue is printed on the contact surface with the middle cavity layer, the first module and the second module are sequentially stacked on the lamination table for the second lamination.

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