Device for heat dissipation and heat recovery of bottom of anode plate

Abstract

The invention provides a device for heat dissipation and heat recovery at the bottom of an anode plate, which is characterized in that a heat dissipation plate is mounted at the bottom of an anode tank and corresponds to an anode plate positioned at the top of the anode tank; based on a heat conduction mode, the anode plate is cooled through the cooling plate; the cooling liquid flow channel is arranged on the heat dissipation plate, and cooling liquid is arranged in the cooling liquid flow channel; based on a heat convection mode, the anode plates are cooled through cooling liquid; the cooling liquid box body is used for containing cooling liquid; the cooling liquid pipeline is connected with the cooling liquid flow channel and the cooling liquid box body to form a circulation loop; the mechanical pump is arranged at the cooling liquid pipeline and provides power for the cooling liquid to flow in the cooling liquid pipeline and the cooling liquid flow channel; the heat exchanger is installed on the cooling liquid pipeline and recovers heat of cooling liquid. Heat conduction and heat convection combined heat dissipation is carried out through the heat dissipation plate, and the temperature of the anode plate (anode groove) can be efficiently reduced, so that the loss of a noble metal coating on the surface of the anode plate is reduced, and the maintenance cost of key parts is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of lithium battery copper foil production, and in particular to a device for heat dissipation and heat recovery at the bottom of an anode plate. Background Art

[0002] During the electrolysis of copper foil, a large amount of Joule heat will be generated when current passes through the electrolyte. Moreover, the Joule heat increases with the increase of the applied current. This also means that the greater the production current, the higher the surface temperature of the anode plate in direct contact with the electrolyte will be. In particular, when the contact between the anode plate and the anode tank is poor, the interface resistance will increase. After the current passes, the heat generated will also rise sharply. Along with this, the temperature of the anode plate will increase significantly. As the service temperature increases, the reaction on the surface of the anode plate will become more intense, the side reactions will increase, and the loss of the precious metal coating on its surface will also increase. In addition, the flowing electrolyte will continuously flush the surface of the anode plate. Long-term flushing will cause the loss of the coating on the surface of the anode plate, and the increase in temperature will undoubtedly aggravate this flushing loss. Therefore, the temperature control of the anode plate is a very important issue.

[0003] In the process of temperature control of the anode plate, there are mainly two aspects involved: one is the control of temperature rise; the other is the control of temperature drop. For the former, the temperature rise caused by the current flowing through the electrolyte is inevitable, and the physical laws related to electrothermal generation cannot be violated. At present, in order to improve production efficiency, it is necessary to increase the production current. Then, the control of temperature rise mainly depends on the adjustment of electrolyte resistance, electrical connection joints and interface resistance. For example, the interface resistance can be reduced by improving the interface contact between the anode plate and the anode tank. For the latter, the temperature drop is mainly carried out in the form of heat transfer. On the one hand, the electrolyte is in direct contact with the anode plate. When the electrolyte temperature is lower than that of the anode plate, the heat of the anode plate can be transferred to the electrolyte. The circulating electrolyte can take away the heat in the anode plate. On the other hand, the anode plate is in direct contact with the anode tank, and the heat of the anode plate can be directly transferred to the anode tank, and finally dissipated through the surrounding air. Therefore, in the temperature reduction control, the direct way is to reduce the temperature of the electrolyte or the anode tank. The reduction of the electrolyte temperature is limited because it is closely related to the electrolytic reaction, the crystallization of the copper sulfate pipeline, etc. As for the temperature of the anode tank, there is a lot of room for optimization. At present, the anode tank is in direct contact with the air and mainly dissipates heat through air convection. This heat dissipation method has low heat dissipation efficiency, especially under natural air convection, it is difficult to reduce the temperature of the anode plate in a short time. In addition, under the air convection heat dissipation method, the dissipated heat is difficult to recover and reuse. Therefore, in the production process, anode plate heat dissipation and heat recovery is an urgent problem to be solved. Summary of the invention

[0004] In view of the defects in the prior art, an object of the present invention is to provide a device for heat dissipation and heat recovery at the bottom of an anode plate.

[0005] According to one aspect of the present invention, there is provided a device for heat dissipation and heat recovery at the bottom of an anode plate, comprising:

[0006] A heat sink, wherein a plurality of the heat sinks are installed at the bottom of the anode tank, and one heat sink corresponds to an anode plate located at the top of the anode tank; the heat sink dissipates heat from the anode plate by heat conduction;

[0007] A coolant flow channel, the coolant flow channel is arranged on the heat dissipation plate, and a coolant is arranged inside the coolant; the coolant dissipates heat from the anode plate by heat convection;

[0008] A coolant tank, wherein the coolant tank is used to contain coolant;

[0009] A coolant pipeline, wherein the coolant pipeline connects the coolant flow channel and the coolant tank to form a circulation loop;

[0010] A mechanical pump, the mechanical pump is arranged at the coolant pipeline and provides power for the coolant to flow in the coolant pipeline and the coolant flow channel;

[0011] A heat exchanger is installed on the coolant pipeline to recover the heat of the coolant.

[0012] Preferably, the heat sink has one or more of the following features:

[0013] - the length direction of the heat dissipation plate is parallel to the central axis of the anode tank;

[0014] - the heat dissipation plate is an arc-shaped plate, which fits the bottom of the anode tank;

[0015] - The heat sink is provided with a plurality of through holes, the distribution of the through holes being consistent with the studs of the anode plate. During installation, the studs on the back of the anode plate pass through the through holes on the heat sink.

[0016] Preferably, the heat sink is fixed to the bottom of the anode tank by one or more buckles, wherein the buckle spans across the heat sink and has both ends fixed to the conductive copper plate at the bottom of the anode tank.

[0017] Preferably, insulating heat dissipation gaskets are installed between the heat dissipation plate and the anode tank, and between the heat dissipation plate and the buckle plate to ensure that the heat dissipation plate is not conductive to the circuit.

[0018] Preferably, the coolant flow channel is arranged along the length direction of the heat sink to form a square wave shape;

[0019] The cross-sectional shape of the cooling liquid flow channel is a square, and the distance from the bottom of the cooling flow channel to the bottom surface of the heat sink is between 1 mm and 4 mm.

[0020] Preferably, a sealing groove is provided in the heat sink, and the sealing groove is located on the coolant flow channel. The sealing groove is arranged along the coolant flow channel and also forms a square wave shape; a metal sealing strip is fixed in the sealing groove by soldering, and the metal sealing strip seals the coolant in the coolant flow channel.

[0021] Preferably, the coolant pipeline is divided into three levels according to the pipe diameter, namely, branch inlet and outlet pipelines, main inlet and outlet pipelines, and system main inlet and outlet pipelines, wherein:

[0022] The branch inlet and outlet pipes are respectively connected to the inlet and outlet of the coolant flow channel on the heat sink;

[0023] The main inlet and outlet pipes are respectively connected to all the branch inlet and outlet pipes;

[0024] The system main inlet and outlet pipes are connected to the main inlet and outlet pipes respectively, and lead into the coolant tank;

[0025] The coolant pipes at each stage distribute the coolant in the coolant box to the heat sink step by step, and then collect the coolant step by step and finally flow into the coolant box to achieve a circulating flow.

[0026] Preferably, valves are provided on the system main inlet pipeline and the main inlet pipeline respectively, for adjusting the flow rate of the coolant in the coolant flow channel in stages.

[0027] Preferably, exhaust valves are provided on the main inlet and outlet pipes, and the air in the pipes is discharged through the exhaust valves to ensure smooth flow of the coolant.

[0028] Preferably, one side of the heat exchanger is connected to the coolant pipe, and the other side is connected to the boiler pipe; the heat exchanger transfers the heat collected from the heat sink in the coolant pipe to the cooling water in the boiler pipe.

[0029] Compared with the prior art, the embodiments of the present invention have at least one of the following beneficial effects:

[0030] The device for heat dissipation and heat recovery at the bottom of the anode plate in the embodiment of the present invention can effectively reduce the temperature of the anode plate (anode tank) by combining heat conduction and heat convection through the heat dissipation plate, thereby reducing the loss of precious metal coating on the surface of the anode plate and reducing the maintenance cost of key components.

[0031] In the device for heat dissipation and heat recovery at the bottom of the anode plate in the embodiment of the present invention, after heat transfer, the temperature of the liquid in the heat dissipation plate is increased and sent to the hot water boiler for waste heat utilization, which can reduce the use of natural gas and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0033] Figure 1 It is a schematic diagram of the installation of the device for dissipating heat and recovering heat from the bottom of the anode plate and the anode plate in one embodiment of the present invention;

[0034] Figure 2 It is a schematic diagram of the installation of the heat dissipation plate of the device for heat dissipation and heat recovery at the bottom of the anode plate in a preferred embodiment of the present invention;

[0035] Figure 3 is a cross-sectional view of the overall structure of a heat sink in a preferred embodiment of the present invention;

[0036] Figure 4 It is a whole anode tank heat dissipation and heat recovery system in a preferred embodiment of the present invention.

[0037] Among them, 11-first anode plate; 12-second anode plate; 13-third anode plate; 14-fourth anode plate; 15-fifth anode plate; 16-sixth anode plate; 17-seventh anode plate; 18-eighth anode plate; 19-ninth anode plate; 110-tenth anode plate; 111-eleventh anode plate; 112-twelfth anode plate; 113-thirteenth anode plate; 114-fourteenth anode plate; 115-fifteenth anode plate; 116-sixteenth anode plate; 117-seventeenth anode plate; 118-eighteenth anode plate; 2-anode tank; 31-first conductive copper plate; 32-second conductive copper plate; 33 - third conductive copper plate; 34 - fourth conductive copper plate; 35 - fifth conductive copper plate; 36 - sixth conductive copper plate; 37 - seventh conductive copper plate; 38 - eighth conductive copper plate; 39 - ninth conductive copper plate; 310 - tenth conductive copper plate; 311 - eleventh conductive copper plate; 312 - twelfth conductive copper plate; 313 - thirteenth conductive copper plate; 314 - fourteenth conductive copper plate; 315 - fifteenth conductive copper plate; 316 - sixteenth conductive copper plate; 41 - first heat sink; 42 - second heat sink; 43 - third heat sink; 44 - fourth heat sink; 45 - fifth heat sink; 46 - sixth heat sink; 47 - seventh heat sink heat plate; 48-eighth heat plate; 49-ninth heat plate; 410-tenth heat plate; 411-eleventh heat plate; 412-twelfth heat plate; 413-thirteenth heat plate; 414-fourteenth heat plate; 415-fifteenth heat plate; 416-sixteenth heat plate; 417-seventeenth heat plate; 418-eighteenth heat plate; 2101-anode plate stud nut; 311-conductive plate fixing bolt; 321-conductive plate fixing bolt; 4210-heat plate through hole; 4220-heat plate coolant inlet; 4230-heat plate coolant outlet; 4240-inlet pipe; 4250- Outlet pipe; 4260-buckle; 4270-total inlet pipe; 4280-total outlet pipe; 4290-total inlet pipe valve; 42100-total inlet pipe exhaust valve; 42101-total outlet pipe exhaust valve; 4201-heat sink shell; 4202-sealing strip; 4203-coolant flow channel; 4204-arc bottom surface of heat sink; 4205-sealing groove; 51-system total inlet pipe; 52-heat sink module; 53-system total outlet pipe; 54-boiler pipe; 55-heat exchanger; 56-coolant; 57-coolant tank; 58-mechanical pump; 59-system total inlet valve. DETAILED DESCRIPTION

[0038] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several variations and improvements may be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0039] In one embodiment of the present invention, Figure 1 As shown, a device for heat dissipation and heat recovery at the bottom of the anode plate is provided, comprising: a heat sink, a coolant flow channel, a coolant box 57, a coolant pipeline, a mechanical pump 58 and a heat exchanger 55. A plurality of heat sinks are used to be installed at the bottom of the anode plate, one heat sink corresponds to an anode plate located at the top of the anode tank, and the anode plate is cooled by heat conduction; the coolant flow channel is arranged on the heat sink, and coolant is arranged inside, and the anode plate is cooled by heat convection; the coolant box is used to hold the coolant; the coolant pipeline connects the coolant flow channel and the coolant box to form a circulation loop; the mechanical pump is arranged at the coolant pipeline to provide power for the coolant to flow in the coolant pipeline and the coolant flow channel; the heat exchanger is installed on the coolant pipeline to recover the heat of the coolant.

[0040] The device in the above embodiment can effectively reduce the temperature of the anode plate and solve the problem of excessive temperature of the anode plate after power is supplied, thereby reducing the loss of the precious metal coating on the surface of the anode plate and effectively extending the service life of the anode plate.

[0041] In order to obtain a better heat conduction effect between solids, in a preferred embodiment of the present invention, Figure 1 and Figure 2 As shown, for 18 anode plates (respectively the first anode plate 11, the second anode plate 12, the third anode plate 13 ... the eighteenth anode plate 118), 18 heat sinks (respectively the first heat sink 41, the second heat sink 42, the third heat sink 43 ... the eighteenth heat sink 418) are used, which are arranged in parallel and tightly fitted on the bottom of the anode tank 2, and the length direction of the heat sink is parallel to the central axis of the anode tank 2. The installation position of each heat sink corresponds to the position of an anode plate, with the anode tank 2 in between. The 18 heat sinks are evenly arranged on the bottom of the entire anode tank 2. In other embodiments, other numbers of anode plates and heat sinks may also be used.

[0042] In order to obtain a better heat dissipation effect, in a specific embodiment, the heat sink is made of stainless steel, and each heat sink 41 is 12 mm thick and weighs about 20 kg. Of course, in other embodiments, the heat sink can also be made of any material of pure copper, pure aluminum, copper alloy or aluminum alloy.

[0043] Due to space limitations, installing a heat sink support frame at the bottom of the anode tank 2 requires significant modifications and is relatively complicated. Therefore, in a preferred embodiment of the present invention, a clip 4260 is used to tightly clip the heat sink to the bottom of the anode tank 2. Both ends of the clip 4260 are fastened to the conductive copper plate 31 at the bottom of the anode tank 2 by bolts 311.

[0044] In a specific embodiment, each heat sink has 13 buckles 4260. This means that each buckle 4260 needs to bear a gravity of about 15 N. This load is within the load-bearing range of the buckle, and can ensure the stability of the heat sink.

[0045] In order to ensure the safety of the operation process and prevent the current from flowing through the metal heat sink and affecting the heat loss of the current, in a preferred embodiment of the present invention, a layer of silicone with uniform thickness is added between the heat sink and the anode tank 2. On the one hand, it is insulated to prevent the current from flowing from the anode tank 2 into the heat sink; on the other hand, it ensures that there is a high heat conduction efficiency between the anode tank 2 and the heat sink, and the heat of the anode tank 2 can be efficiently transferred to the heat sink, thereby achieving rapid heat dissipation. Similarly, a layer of silicone is also added between the buckle 4260 and the heat sink 41, and its function is the same as that of the silicone between the heat sink and the anode tank.

[0046] In order to improve the heat dissipation efficiency, in a preferred embodiment of the present invention, a plurality of through holes 4210 are provided on the heat dissipation plate, and the distribution of the through holes just matches the distribution of the anode plate stud nuts 2101. Adding a plurality of through holes on the heat dissipation plate is equivalent to increasing the surface area of ​​the heat dissipation plate, and the area for heat exchange with the outside world is increased, which is conducive to accelerating heat dissipation.

[0047] In a specific implementation, each heat sink is 1380 mm long and 150 mm wide. On the heat sink, a through hole 4210 is opened every 100 mm, and the size of each through hole is 40 mm. During installation, the anode plate stud nut 2101 can pass through the through hole 4210 on the heat sink. In addition, the heat sink has a certain curvature in its width direction, and after installation, the arc bottom surface 4204 of the heat sink can be closely attached to the bottom of the anode tank 2, so that the interface heat conduction efficiency is maximized.

[0048] In the above embodiment, the heat of the electrode plate is transferred to the heat sink by heat conduction, and the unique structural design of the heat sink has good heat dissipation performance and can effectively reduce the temperature of the anode plate (anode tank).

[0049] In addition to the heat conduction method in the above embodiment to dissipate heat from the anode plate, another heat transfer method (heat convection) can also be used to dissipate heat from the anode plate. Therefore, in a preferred embodiment of the present invention, Figure 3As shown, the heat sink has grooves inside that serve as flow channels 4203 for the coolant. The flow channels 4203 are arranged along the length of the heat sink as a whole. The arrangement shape of the flow channels 4203 is similar to a square wave, and the flow channels 4203 avoid the through holes 4210 on the heat sink. The coolant flows in a direction parallel to the anode plate, causing the heat of the anode plate to change. That is, the coolant flows horizontally, causing the anode plate to reduce heat in the vertical direction and in the tangential direction.

[0050] In some specific embodiments, the cross-sectional shape of the flow channel 4203 is a square with a side length of 4 mm, and the distance from the bottom of the flow channel 4203 to the arc-shaped bottom surface 4204 of the heat sink is 1-4 mm. Under the premise of ensuring that the distance range can be machined and anti-corrosion, the wall thickness of the liquid flow channel is as thin as possible, so that the liquid can quickly take away the heat of the anode plate close to the heat sink. In some specific embodiments, the distance from the bottom of the flow channel 4203 to the arc-shaped bottom surface 4204 of the heat sink is 3 mm.

[0051] In order to ensure that the coolant in the flow channel does not overflow, in a preferred embodiment, a sealing groove 4205 is required to be opened above the flow channel 4203. The arrangement of the sealing groove 4205 in the length direction of the heat sink 41 is consistent with the arrangement of the flow channel 4203, and both are square wave shapes. And in the vertical direction, the center line of the cross section of the sealing groove 4205 and the center line of the flow channel 4203 are collinear. A metal sealing strip 4202 of matching size is placed in the sealing groove 4205. The metal sealing strip 4202 is fixed in the sealing groove by welding to play a sealing role. In this embodiment, the coolant flow channel is designed as a structure combining a sealing groove and a sealing strip. On the one hand, it is to prevent the coolant from overflowing. On the other hand, the coolant flow channel can be designed into a matching geometric channel according to the anode plate structure to achieve a good heat dissipation effect.

[0052] In some specific embodiments, the cross-sectional shape of the sealing groove 4205 is a rectangle, with a length of 30 mm and a height of 5 mm.

[0053] Since the heat sink 41, the sealing strip 4202, etc. are long strips and have a relatively small thickness, high-temperature welding will cause the heat sink 41 to deform as a whole, which will affect the fit between the heat sink 41 and the bottom of the anode tank 2 and the heat dissipation effect. Therefore, in some specific embodiments, the welding material is solder with a low melting point, which can be used for low-temperature welding, will not cause large thermal deformation to the heat sink, and can also provide a good sealing effect on the heat sink.

[0054] The cross section of the flow channel 4203 in the above embodiment is square, which is convenient for grooving, but not conducive to connecting external pipelines. The tubular liquid inlet and outlet need to be connected to the two ends of the flow channel 4203 in order to better connect to the external pipeline. If the liquid inlet 4220 and the liquid outlet 4230 are set at both ends of the heat sink 41, it is not convenient to arrange the pipeline on the one hand, and it is not conducive to connection processing on the other hand. Therefore, in a preferred embodiment, holes are punched at positions near the two ends of the sealing strip 4202, with a hole diameter of 10 mm and a hole depth of 5 mm. The flow channel is directly below the hole. The hole is processed into a threaded hole, and the liquid inlet 4220 and the liquid outlet 4230 can be directly screwed onto the threaded hole. The original square flow channel inlet and outlet at the left and right ends are sealed by soldering.

[0055] The coolant box contains coolant. In order to circulate the coolant, the coolant pipeline is divided into three levels according to the pipe diameter; they are branch inlet and outlet pipelines (inlet pipeline 4240, outlet pipeline 4250), total inlet and outlet pipelines (total inlet pipeline 4270, total outlet pipeline 4280) and system total inlet and outlet pipelines (system total inlet pipeline 51, system total outlet pipeline 53). Through the coolant pipelines at each level, the coolant in the coolant box is diverted step by step to heat dissipation, and then collected step by step and finally flows into the coolant box to achieve circulation. Specifically, the coolant of each heat sink is connected through the inlet pipeline 4270, the total inlet pipeline 4270 and the system total inlet pipeline 51, and one end of the system total inlet pipeline 51 is connected to the coolant box 57. The coolant of each heat sink is connected through the outlet pipeline 4250, the total outlet pipeline 4280 and the system total outlet pipeline 53, and one end of the system total outlet pipeline 53 is connected to the coolant box 57.

[0056] In a preferred implementation, a circulation process of the coolant is provided, specifically: first, the mechanical pump 58 draws the coolant 56 from the coolant tank 57 and distributes it to each heat sink through the main inlet pipe 4270; then it is diverted to each heat sink 41 through the inlet pipe 4240 to cool the anode tank 2 (anode plate 11); thereafter, the coolant 56 is collected from the outlet pipe 4250 to the main outlet pipe 4280, and then collected to the system main outlet pipe 53, and finally returns to the coolant tank 57.

[0057] In order to achieve adjustable flow, in a preferred embodiment, a valve 4290 is provided on the pipe 4270 of the total inlet pipe, which can control the size of the liquid inlet flow of each heat sink. Therefore, the size of the total inlet pipe valve 4290 can be adjusted according to the temperature of the anode tank 2 of each machine. In addition, a valve 59 is also provided on the system total inlet pipe 51 to adjust the total flow in the system pipe. In addition, a total inlet pipe exhaust valve 42100 and a total outlet pipe exhaust valve 42101 are respectively provided on the total inlet pipe 4270 and the total outlet pipe 4280 of each heat dissipation device to discharge the gas in the pipe.

[0058] The coolant from the system main outlet pipe 53 has a lot of heat. If it is directly returned to the coolant tank 57 without cooling, it will affect the cooling effect of the next round of coolant circulation. Figure 4 As shown, a heat exchanger 55 is installed on the system's total outlet pipe 53. After the coolant 56 passes through the heat sink, it will absorb heat and the temperature will rise accordingly. One side of the heat exchanger 55 is the system's total outlet pipe 53, and the other side is the boiler pipe 54. Through the heat exchanger 55, the heat of all the anode tanks 2 in the system can be collected and transferred to the pure water in the boiler pipe 54. After absorbing heat, the temperature of the pure water in the boiler pipe will increase. The heated pure water can be transported to a hot water boiler, and then heated to the temperature required for production for use. In this way, compared with heating pure water at room temperature, the amount of gas can be greatly saved. Through this system, the utilization of the waste heat at the bottom of the anode tank 2 is also realized.

[0059] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0060] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various modifications or variations within the scope of the claims, which does not affect the essence of the present invention. The above preferred features can be used in any combination without conflicting with each other.

Claims

1. A device for heat dissipation and heat recovery at the bottom of an anode plate, characterized in that: include: A heat sink, wherein a plurality of the heat sinks are installed at the bottom of the anode tank, and one heat sink corresponds to one anode plate located at the top of the anode tank; The heat sink dissipates heat from the anode plate by heat conduction; A coolant flow channel, the coolant flow channel is arranged on the heat dissipation plate, and a coolant is arranged inside the coolant; the coolant dissipates heat from the anode plate by heat convection; A coolant tank, wherein the coolant tank is used to contain coolant; A coolant pipeline, wherein the coolant pipeline connects the coolant flow channel and the coolant tank to form a circulation loop; A mechanical pump, the mechanical pump is arranged at the coolant pipeline and provides power for the coolant to flow in the coolant pipeline and the coolant flow channel; A heat exchanger is installed on the coolant pipeline to recover the heat of the coolant.

2. The device for heat dissipation and heat recovery at the bottom of the anode plate according to claim 1, characterized in that: The heat sink has one or more of the following features: - the length direction of the heat dissipation plate is parallel to the central axis of the anode tank; - the heat dissipation plate is an arc-shaped plate, which fits the bottom of the anode tank; - The heat sink is provided with a plurality of through holes, the distribution of the through holes being consistent with the studs of the anode plate. During installation, the studs on the back of the anode plate pass through the through holes on the heat sink.

3. The device for heat dissipation and heat recovery at the bottom of the anode plate according to claim 2, characterized in that: The heat sink is fixed to the bottom of the anode tank by one or more buckles, wherein the buckles span the heat sink and have both ends fixed to the conductive copper plate at the bottom of the anode tank.

4. The device for heat dissipation and heat recovery at the bottom of the anode plate according to claim 3, characterized in that: Insulating heat dissipation gaskets are installed between the heat dissipation plate and the anode tank, and between the heat dissipation plate and the buckle plate to ensure that the heat dissipation plate is not conductive to the circuit.

5. The device for heat dissipation and heat recovery at the bottom of an anode plate according to claim 1, characterized in that: The coolant flow channel is arranged along the length direction of the heat sink to form a square wave shape; The cross-sectional shape of the cooling liquid flow channel is a square, and the distance from the bottom of the cooling flow channel to the bottom surface of the heat sink is between 1 mm and 4 mm.

6. The device for heat dissipation and heat recovery at the bottom of the anode plate according to claim 5, characterized in that: A sealing groove is provided in the heat sink, and the sealing groove is located on the coolant flow channel. The sealing groove is arranged along the coolant flow channel and also forms a square wave shape. A metal sealing strip is fixed in the sealing groove by soldering, and the metal sealing strip seals the coolant in the coolant flow channel.

7. The device for heat dissipation and heat recovery at the bottom of an anode plate according to claim 1, characterized in that: The coolant pipeline is divided into three levels according to the pipe diameter, namely, branch inlet and outlet pipelines, main inlet and outlet pipelines, and system main inlet and outlet pipelines, wherein: The branch inlet and outlet pipes are respectively connected to the inlet and outlet of the coolant flow channel on the heat sink; The main inlet and outlet pipes are respectively connected to all the branch inlet and outlet pipes; The system main inlet and outlet pipes are connected to the main inlet and outlet pipes respectively, and lead into the coolant tank; The coolant pipes at each stage distribute the coolant in the coolant box to the heat sink step by step, and then collect the coolant step by step and finally flow into the coolant box to achieve a circulating flow.

8. The device for heat dissipation and heat recovery at the bottom of the anode plate according to claim 7, characterized in that: Valves are respectively arranged on the system main inlet pipeline and the main inlet pipeline for regulating the flow rate of the coolant in the coolant flow channel in stages.

9. The device for heat dissipation and heat recovery at the bottom of an anode plate according to claim 7, characterized in that: Exhaust valves are provided on the main inlet and outlet pipelines, and the air in the pipelines is discharged through the exhaust valves to ensure smooth flow of the coolant.

10. The device for heat dissipation and heat recovery at the bottom of an anode plate according to claim 1, characterized in that: One side of the heat exchanger is connected to the coolant pipe, and the other side is connected to the boiler pipe. The heat exchanger transfers the heat collected from the heat sink in the coolant pipe to the cooling water in the boiler pipe.

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