Vertical electroplating equipment

Abstract

The vertical electroplating equipment comprises an anode unit, an electroplating bath, a cathode unit, a driving mechanism and a power supply, the anode unit is jointly composed of a plurality of anode assemblies, and the anode assemblies are distributed at intervals or continuously in the preset direction to form the anode unit; each anode assembly comprises an anode piece extending in a preset direction; the anode unit is arranged in the electroplating bath, and the electroplating bath is further filled with electroplating liquid; the cathode unit is configured to mount a to-be-electroplated part; the driving mechanism is configured to push the cathode unit to move in the anode unit; the power supply anode is connected with the anode unit, and the power supply cathode is connected with the cathode unit. The driving mechanism pushes the cathode unit to move in the anode unit and drives the to-be-electroplated part installed in the cathode unit to move in the anode unit, so that the to-be-electroplated part can move in the electroplating liquid, and the electroplating efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to a vertical electroplating device. Background Art

[0002] According to the orientation of the workpiece during electroplating, the electroplating process can be divided into horizontal electroplating and vertical electroplating. In vertical electroplating, the workpiece is immersed in the electroplating solution in a vertical state through a mounting part. The workpiece is electrically connected to the negative pole of the power supply to form a cathode unit. The anode unit is installed in the electroplating tank and electrically connected to the positive pole of the power supply. Under the action of the electric field, the cations in the electroplating solution will be freed to the vicinity of the workpiece to be electroplated and form a coating on the workpiece to be electroplated.

[0003] In existing vertical electroplating equipment, the parts to be plated generally remain stationary during the electroplating process, and the uniformity of electroplating is ensured by the flow of the electroplating solution, resulting in low electroplating efficiency. The parts to be plated are not produced in an assembly line manner, and the production efficiency is low.

[0004] In order to improve the efficiency of electroplating and production, the applicant improved the structure of the vertical electroplating equipment so that the parts to be electroplated can move in the electroplating solution. However, the applicant encountered the following technical difficulties: how to drive the parts to be electroplated to move stably in the electroplating solution, including how to reduce the swing amplitude of the parts to be electroplated during the movement or avoid the swing of the parts to be electroplated during the movement, how to reduce the risk of falling and fragmentation of the parts to be electroplated during the movement; how to drive the parts to be electroplated that are continuously fed to move in the electroplating solution; how to energize the parts to be electroplated during the movement; how to ensure the uniformity of electroplating.

[0005] The anode unit uses a fixed anode component, which is not easy to install and disassemble. The distance between the anode component and the workpiece to be electroplated cannot be adjusted, and it is not convenient to adjust the electroplating effect by changing the distance between the anode component and the workpiece to be electroplated. Secondly, during the electroplating process, in order to improve the electroplating effect, it is necessary to spray the refluxed electroplating solution or the newly added electroplating solution into the electroplating solution near the workpiece to be electroplated through a spraying device. The existing spraying device is generally arranged on one side or both sides of the workpiece to be electroplated, which will make it impossible to reduce the distance between the anode component and the workpiece to be electroplated, affecting the electroplating effect.

[0006] The pipelines of the vertical electroplating equipment are generally arranged beside the electroplating tank body, occupying a certain area, thereby increasing the area occupied by the entire vertical electroplating equipment, making it necessary to improve the structure of the vertical electroplating equipment.

[0007] Therefore, it is urgent to design a vertical electroplating equipment to solve at least one of the above technical problems. Summary of the invention

[0008] The purpose of this application is to provide a vertical electroplating device to at least solve one of the problems in the background technology.

[0009] To achieve the above objectives, the present application provides a vertical electroplating device, comprising:

[0010] An anode unit, wherein the anode unit is composed of a plurality of anode assemblies, wherein the plurality of anode assemblies are distributed at intervals or continuously along a preset direction to form the anode unit; each anode assembly comprises an anode member extending along the preset direction;

[0011] An electroplating tank, wherein the anode unit is disposed in the electroplating tank, and the electroplating tank is also filled with an electroplating solution;

[0012] a cathode unit, the cathode unit being configured to mount a workpiece to be electroplated;

[0013] a driving mechanism configured to push the cathode unit to move in the anode unit;

[0014] A power supply, wherein the positive electrode of the power supply is connected to the anode unit, and the negative electrode of the power supply is connected to the cathode unit.

[0015] In some embodiments, when each of the anode assemblies includes two anode members, there is a certain distance between the two anode members to form an anode channel, and a plurality of the anode channels are connected to form an electroplating channel.

[0016] In some embodiments, the vertical electroplating apparatus further comprises:

[0017] An anode base, wherein a liquid passage and a mounting groove are provided on the anode base, wherein the mounting grooves are provided on both sides of the liquid passage, and the anode member is installed in the mounting grooves;

[0018] A liquid circulation mechanism, connected to the electroplating tank, configured to drive the electroplating liquid to circulate to form a liquid loop;

[0019] A liquid supply component, used for delivering electroplating liquid into the electroplating channel;

[0020] The liquid circulation mechanism is connected to the liquid supply component, and the liquid supply component is connected to the liquid passage to transport the electroplating liquid into the electroplating channel.

[0021] In some embodiments, a first partition is horizontally arranged in the electroplating tank, and the electroplating tank is divided into an electroplating sub-tank and a liquid supply tank by the first partition, and the electroplating sub-tank is located above the liquid supply tank;

[0022] The anode unit is arranged in the electroplating sub-tank, a liquid supply component is arranged in the liquid supply bin, and the electroplating liquid is transported to the electroplating sub-tank through the liquid supply component.

[0023] In some embodiments, the liquid supply assembly includes at least a shunt tube;

[0024] The flow divider is connected to the liquid circulation mechanism through the flow equalizer assembly, and the flow equalizer assembly includes a liquid supply pipe and a flow equalizer, and the two ends of the liquid supply pipe are connected to the flow equalizer and the liquid circulation mechanism respectively, and the liquid supply pipe is connected to the middle position of the flow equalizer in the length direction, and the two ends of the flow equalizer are equidistantly extended in a direction away from the center point with the connection point of the liquid supply pipe as the center point;

[0025] One end of the flow divider is arranged on the flow equalizer and communicated with the flow equalizer, and the other end is communicated with the electroplating channel to transport the electroplating solution into the electroplating channel.

[0026] In some embodiments, the liquid supply assembly further comprises a jet pipe, the jet pipe comprising a jet main pipe and a jet branch pipe, one end of the jet main pipe is connected to the liquid circulation mechanism, and the other end is connected to the jet branch pipe;

[0027] The jet branch pipe is provided with a nozzle, and the nozzle is connected with the electroplating sub-tank;

[0028] The first partition plate is provided with a plurality of liquid supply ports, and the liquid passage corresponds to the position of at least one of the liquid supply ports;

[0029] The number of the liquid supply ports and the nozzles located under the same electroplating channel is equal and their positions correspond to each other. The nozzles are connected to the electroplating channel through the liquid supply ports so that the electroplating liquid flows into the liquid passage through the jet pipe.

[0030] In some embodiments, the liquid circulation mechanism comprises at least a liquid storage tank, a circulation pump and a circulation pipeline;

[0031] The circulation pipeline includes a circulation liquid inlet pipe and a circulation liquid outlet pipe, the liquid supply pipe and the jet pipe are both connected to the circulation liquid outlet pipe, and the circulation liquid outlet pipe is connected to the liquid outlet of the liquid storage barrel;

[0032] A second partition is also provided in the electroplating tank, and the electroplating tank is divided into an electroplating sub-tank, a liquid supply tank and a liquid storage tank from top to bottom in sequence by the first partition and the second partition arranged horizontally, and the liquid storage tank is located below the liquid supply tank and is independent of the liquid supply tank;

[0033] The electroplating sub-tank has a circulation tank connected to the liquid storage tank, and the circulation tank is independent of the liquid supply tank;

[0034] One end of the circulating liquid inlet pipe is connected to the circulating pump, and the other end is connected to the liquid storage tank, and the circulating pump is connected to the liquid storage tank;

[0035] A filter is provided at one end of the circulating liquid inlet pipe connected to the liquid storage tank. The filter is located in the liquid storage tank. A plurality of filter holes are provided on the filter. The electroplating liquid in the electroplating sub-tank flows through the circulating tank, the liquid storage tank, the filter and the circulating liquid inlet pipe in sequence and enters the liquid storage barrel.

[0036] In some embodiments, the cathode unit includes a conductive component and a mounting component;

[0037] The mounting assembly at least comprises a cathode support frame and a cathode connecting rod, wherein the cathode support frame is used to mount the workpiece to be electroplated, and the cathode support frame is mounted on the cathode connecting rod;

[0038] The conductive assembly at least includes a conductive block, a substrate is provided along the length of the electroplating tank, a conductive strip is provided on the substrate, the conductive block is connected to the end of the cathode connecting rod, and the conductive block is in contact with the conductive strip;

[0039] Among them, the workpiece to be electroplated is electrically connected to the conductive block through a conductive wire, and the negative pole of the power supply is electrically connected to the conductive strip; when the driving mechanism pushes the cathode unit and the cathode unit moves along the length of the electroplating tank, the conductive block transmits the electrical energy obtained by contacting the conductive strip to the workpiece to be electroplated.

[0040] In some embodiments, the cathode support frame includes a support frame body and a carrier frame body, the support frame body is connected to the carrier frame body, the carrier frame body has a bearing slot, and the bearing slot can be used for the installation of the electroplated parts;

[0041] The orthographic projection area of ​​the bearing groove on a preset vertical plane is larger than the orthographic projection area of ​​the workpiece to be electroplated on the same preset vertical plane;

[0042] A plurality of bearing blocks are arranged in the bearing tank, and the plurality of bearing blocks are arranged along the inner wall of the bearing tank. When the workpiece to be electroplated is installed in the bearing tank, the bearing blocks contact the edge of the workpiece to be electroplated to support the workpiece to be electroplated;

[0043] The cathode support frame is provided with a fifth baffle and a sixth baffle. When the workpiece to be electroplated is installed in the supporting groove, the fifth baffle corresponds to the lower edge position of the workpiece to be electroplated, and the sixth baffle corresponds to the upper edge position of the workpiece to be electroplated.

[0044] In some embodiments, the support frame has a first support portion and a second support portion, both ends of the first support portion are respectively connected to two second support portions, and the second support portion extends to both sides away from one end of the first support portion and is connected to the support frame;

[0045] The cathode connecting rod is provided with a connecting rod supporting groove for mounting the first supporting part;

[0046] Two support blocks are arranged on the first support portion, and the distance between the two support blocks is adapted to the width of the cathode connecting rod, so that the cathode connecting rod can be inserted between the two support blocks to limit the movement range of the cathode support frame.

[0047] In some embodiments, the driving mechanism comprises at least a driving bracket, a transmission member, a driving source and a pushing member;

[0048] The transmission member is rotatably disposed on the driving bracket, the pushing member is connected to the transmission member, and the driving source is disposed on the driving bracket and connected to the transmission member to drive the transmission member to drive the pushing member to cyclically rotate;

[0049] When the pusher rotates to the top of the electroplating tank, it contacts the cathode connecting rod and pushes it to move along the length of the electroplating tank.

[0050] In some embodiments, the transmission member rotates in a circular motion on the driving bracket in an elliptical trajectory, the driving source includes a transmission wheel and a motor, the motor and the transmission wheel are respectively arranged on two sides of the driving bracket, the transmission member is sleeved on the transmission wheel, and the output shaft of the motor passes through the driving bracket and is connected to the transmission wheel to drive the transmission wheel to drive the transmission member to rotate.

[0051] In some embodiments, the transmission member disposed on the driving bracket performs cyclic rotation in the vertical direction, and the transmission member has two horizontal movement areas and two rotation areas when cyclically rotating, and the two horizontal movement areas are respectively at a first height and a second height, the distance between the first height and the electroplating tank is L1, the distance between the second height and the electroplating tank is L2, and L1<L2; when the pushing member is at the first height, the end of the pushing member away from the transmission member can contact the cathode connecting rod, and the pushing member applies a thrust to the cathode connecting rod under the drive of the transmission member, so that the cathode connecting rod moves with the pushing member; when the pushing member is at the second height, the end of the pushing member away from the transmission member can be out of contact with the cathode connecting rod;

[0052] The pushing member includes a pushing base and a pushing rod, the pushing base is connected to the transmission member, one end of the pushing rod is arranged on the pushing base, and the other end extends away from the pushing base to the middle part of the cathode connecting rod;

[0053] The push rod and the push base are connected by a rotation in the vertical direction to adjust the height of the push rod;

[0054] The push rod is provided with a push plate;

[0055] The push plate and the cathode connecting rod are provided with magnetic attraction structures that cooperate with each other.

[0056] The advantages of the vertical electroplating equipment in the embodiment of the present application include: the cathode unit is pushed to move in the anode unit by the driving mechanism, and the parts to be electroplated installed in the cathode unit are driven to move in the anode unit, so that the parts to be electroplated can move in the electroplating solution, thereby improving the electroplating efficiency. In addition, the liquid circulation mechanism can drive the electroplating solution to circulate, which can replenish the concentration loss of the electroplating solution around the parts to be electroplated, further improve the electroplating efficiency, and is conducive to the uniformity of electroplating. In addition, the pushing member circulates and can circulate and push multiple cathode units that are continuously fed, so as to realize the continuous production of the parts to be electroplated, thereby improving the production efficiency. In addition, in the vertical electroplating equipment, the electroplating tank is divided into electroplating sub-tanks, liquid supply tanks and liquid storage tanks from top to bottom in sequence, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0058] Figure 1 is a schematic structural diagram of an anode assembly in one embodiment provided in the present application;

[0059] Figure 2 is a schematic structural diagram of an anode assembly in one embodiment provided in the present application;

[0060] Figure 3 is a schematic structural diagram of an anode assembly in one embodiment provided in the present application;

[0061] Figure 4 is a schematic structural diagram of an anode assembly in another embodiment provided in the present application;

[0062] Figure 5 is a schematic structural diagram of an anode assembly in another embodiment provided in the present application;

[0063] Figure 6 is a schematic structural diagram of an anode assembly in another embodiment provided in the present application;

[0064] Figure 7 is a schematic structural diagram of an anode assembly in another embodiment provided in the present application;

[0065] Figure 8 is a schematic structural diagram of an anode assembly in another embodiment provided in the present application;

[0066] Fig. 9 is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0067] Fig.10 is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0068] Fig.11 is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0069] Fig.12 is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0070] Fig.13 yes Fig.12 A partial enlarged view of part A;

[0071] Fig.14 yes Fig.12 A partial enlarged view of part B;

[0072] Fig.15 yes Fig.12 A partial enlarged view of part C in the middle;

[0073] Fig.16 yes Fig.12 A partial enlarged view of part D in the middle;

[0074] Fig.17 is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0075] Fig.18 yes Fig.17 A partial enlarged view of part E in the middle;

[0076] Fig.19 yes Fig.17 A partial enlarged view of part F in the middle;

[0077] Fig. 20 yes Fig.17 A partial enlarged view of the middle G part;

[0078] Fig.21 This is a schematic diagram of power connection of a vertical electroplating device in one embodiment provided by the present application;

[0079] Fig. 22 This is a schematic diagram of the structure of a liquid supply component in one embodiment provided in the present application;

[0080] Fig.23 is a structural schematic diagram of a liquid supply component in another embodiment provided in the present application;

[0081] Fig.24 is a schematic diagram of the flow direction of the electroplating solution in one embodiment provided in the present application;

[0082] Fig.25 It is a control logic diagram of a vertical electroplating device and a schematic diagram of a temperature control component in one embodiment provided by the present application;

[0083] Fig.26 is a schematic structural diagram of a driving mechanism in one embodiment provided in the present application;

[0084] Fig. 27 This is a schematic diagram of the structure of the driving mechanism and the cathode unit in one embodiment provided by the present application;

[0085] Fig.28 yes Fig. 27 A partial enlarged view of the middle H section;

[0086] Fig.29 This is a schematic diagram of the structure of an installation component in an embodiment provided by the present application;

[0087] Fig.30 This is a schematic diagram of the structure of an installation component in an embodiment provided by the present application;

[0088] Fig.31 It is a structural schematic diagram of an installation component in an implementation manner provided by the present application.

[0089] Reference numerals:

[0090] 10-anode assembly; 101-anode base; 1011-liquid passage; 1012-mounting slot; 102-anode piece; 103-conductive copper strip; 104-fixing rod; 105-first baffle; 106-baffle slot; 107-second baffle; 1071-drainage port; 108-third baffle; 109-fourth baffle; 110-overflow plate; 111-overflow slot; 112-anode channel; 113-electroplating channel;

[0091] 20-Parts to be plated;

[0092] 30-plating tank; 301-first baffle; 302-second baffle; 303-plating sub-tank; 304-liquid supply tank; 305-liquid storage tank; 306-circulation tank; 307-circulation baffle;

[0093] 40-cathode unit; 401-conductive assembly; 4011-conductive block; 40111-conductive fixing seat; 4012-conductive strip; 4013-substrate; 4014-conductive connecting rod; 4015-guide roller; 4016-roller mounting seat; 4017-guide protrusion; 402-mounting assembly; 4021-cathode support frame; 40211-support frame body; 40212-first support part; 40213-second support part; 40214-support block; 40215-carrying frame body; 40216-carrying slot; 40217-carrying block; 40218-carrying area; 4023-fifth baffle; 4024-sixth baffle; 4025-cathode connecting rod;

[0094] 50-driving mechanism; 501-driving bracket; 5011-slide rail; 502-transmission member; 503-driving source; 5031-transmission wheel; 5032-motor; 504-pushing member; 5041-pushing base; 5042-pushing roller; 5043-pushing rod; 5044-pushing plate;

[0095] 60-power supply;

[0096] 70-liquid circulation mechanism; 701-liquid storage barrel; 702-circulation pipeline; 7021-circulation liquid inlet pipe; 7022-circulation liquid outlet pipe; 703-filter; 7031-filter hole;

[0097] 80-liquid supply assembly; 801-diverter pipe; 802-liquid supply pipe; 8021-liquid supply main pipe; 8022-liquid supply branch pipe; 803-flow equalizer pipe; 804-jet main pipe; 805-jet branch pipe; 806-nozzle pipe; 90-controller; 91-liquid level sensor; 92-flow sensor; 93-temperature sensor; 94-regulating valve; 95-solenoid valve;

[0098] 100-temperature control component; 1001-heat exchanger; 1002-liquid supply barrel; 1003-first heat exchange pipeline; 1004-second heat exchange pipeline; 1005-third heat exchange pipeline; 1006-fourth heat exchange pipeline. DETAILED DESCRIPTION

[0099] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in the present application to represent spatial relative positions are used to describe the relationship between a unit or feature as shown in the accompanying drawings relative to another unit or feature for the purpose of convenience of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "below" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0100] In addition, the terms "installed", "set", "provided with", "connected", "sliding connection", "fixed", and "socketed" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. When the term "connection" is used for the connection between a pipeline and other components, it is judged according to the scenario. The pipeline and the other components may be in a state of connection, that is, in some scenarios, the connection between the pipeline and the other components also means that the pipeline is connected with the other components.

[0101] In the embodiment of the present application, an anode assembly with an adjustable anode part position and a vertical electroplating device including the anode assembly are provided. The anode assembly includes an anode base and an anode part. By providing a liquid passage and a mounting groove on the anode base, the liquid passage is used to spray the electroplating liquid, and the mounting groove is used to install the anode part. The position of the liquid passage partially or completely overlaps with the processing position. When working, the electroplating liquid can be sprayed below the part to be electroplated, avoiding the need to provide a spraying device on one side or both sides of the part to be electroplated, so that the distance between the anode part and the part to be electroplated can be further reduced, which can improve the electroplating effect. Under the premise of the same electroplating tank width, more anode parts can be arranged to achieve electroplating of more parts to be electroplated, thereby improving the electroplating efficiency. On the other hand, if there are multiple mounting grooves on the same side of the processing position, the distances between the multiple mounting grooves on the same side of the processing position and the liquid passage are set to increase in sequence, so that the anode part can be installed in the mounting groove at the corresponding position according to the needs, thereby adjusting the distance between the processing position and the mounting groove. Since the position of the liquid passage partially or completely overlaps with the processing position, when the part to be electroplated is located directly above the liquid passage station and the anode part is installed in the mounting groove, the distance between the processing position and the mounting groove is the distance between the anode part and the part to be electroplated, thereby effectively improving the position adjustment efficiency of the anode part and improving the electroplating effect of the part to be electroplated. Among them, when the processing position is electroplated, the area covered by the positive projection of the part to be electroplated on the anode base, or the area covered by the positive projection on the preset horizontal plane. Its function is to mark a reference position to facilitate the installation of other components.

[0102] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0103] The anode assembly 10 provided in the embodiment of the present application is used to provide electroplating metal for the electroplating equipment, and to carry the electroplating metal so that it can be stably installed in the electroplating equipment. When the electroplating equipment is in working state, the electroplating metal will ionize cations into the electroplating solution and flow to the workpiece 20 to be electroplated, and a layer of metal film will be attached to the entire area or part of the surface of the workpiece 20 to be electroplated. Among them, the workpiece 20 to be electroplated can be a product that needs to be given some special physical properties or decorative features, such as PCB boards, solar cells, silicon wafers and chips, etc.; for another example, the electroplating metal can be an insoluble anode, which is made by coating a precious metal oxide coating with high electrochemical catalytic performance on a titanium substrate (mesh, plate, strip, tube, etc.), or the electroplating metal is a soluble anode, which can dissolve into cations and enter the solution.

[0104] Please refer to Figure 1-Figure 8 , an anode assembly 10, comprising at least an anode base 101 and an anode member 102, wherein a liquid passage 1011 and a mounting groove 1012 are provided on the anode base 101, wherein the mounting groove 1012 is configured for mounting the anode member 102. The mounting groove 1012 extends along a preset direction, and the anode member 102 in the mounting groove 1012 also extends along a preset direction. When the workpiece 20 to be electroplated is located on one side of the anode member 102, under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed by the anode member 102 and the cations in the electroplating solution itself will be enriched on the surface of the workpiece 20 to be electroplated, and deposited to form a metal coating. A liquid passage 1011 is provided on the anode base 101, wherein the liquid passage 1011 is configured for allowing the electroplating solution to flow, wherein the position of the liquid passage 1011 partially or completely overlaps with the processing position. See Figure 4 When single-sided electroplating is performed on the workpiece 20 to be electroplated, the number of the mounting grooves 1012 can be set to one, and the mounting grooves 1012 can be located on one side of the processing position. The anode member 102 is mounted in the mounting groove 1012. Specifically, the bottom of the anode member 102 is mounted in the mounting groove 1012. The surface to be electroplated of the workpiece 20 to be electroplated is relatively arranged with the anode member 102, that is, the orthographic projection area of ​​the workpiece 20 to be electroplated on the preset vertical plane partially or completely overlaps with the orthographic projection area of ​​the anode member 102 on the same preset vertical plane. When the workpiece 20 to be electroplated is moved to the top of the liquid passage 1011 manually or automatically, or is suspended above the liquid passage 1011, the plating liquid flows through the liquid passage 1011 to the surface to be electroplated and the anode member. 102, and under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed by the anode member 102, or the cations in the electroplating solution itself, are enriched on the surface of the workpiece 20 to be electroplated, and deposited to form a metal coating to complete the single-sided electroplating of the workpiece 20 to be electroplated. Compared with the structure in which the anode base 101 is not provided with the liquid passage 1011, the opening of the liquid passage 1011 can make the plating solution flow through the liquid passage 1011 to the surface to be electroplated and the anode member 102. In addition, the plating solution flowing in through the liquid passage 1011 can use a plating solution with a higher cation concentration. The cation concentration of the plating solution may decrease after long-term use, resulting in uneven thickness of the coating deposited on the surface of the workpiece 20 to be electroplated. Alternatively, see Figure 1-Figure 3 , Figure 4-Figure 8The number of mounting grooves 1012 is two or more, and the multiple mounting grooves 1012 are distributed on both sides of the processing position based on the processing position. The distances between the multiple mounting grooves 1012 on the same side of the processing position and the processing position increase successively, and the distance between any two mounting grooves 1012 located on both sides of the processing position is greater than the thickness of the part 20 to be electroplated. When the number of mounting grooves 1012 is an integer multiple of two, the plurality of mounting grooves 1012 are evenly arranged on both sides of the processing position with the processing position as the center, and the distances between the plurality of mounting grooves 1012 on the same side of the processing position and the processing position increase successively, so that after the anode component 102 is installed in the mounting groove 1012, the workpiece 20 to be electroplated can be moved to the top of the liquid passage 1011 manually or automatically, or suspended above the liquid passage 1011, so that when the plating liquid flows out through the liquid passage 1011, it can flow between the surface to be electroplated and the anode component 102, and under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed by the anode component 102, or the cations in the electrolyte itself, are enriched on the surfaces of both sides of the workpiece 20 to be electroplated, and deposited to form a metal coating to complete the double-sided electroplating of the workpiece 20 to be electroplated.

[0105] When the number of the mounting grooves 1012 is odd, the distribution of the even number of the mounting grooves 1012 is the same as when the number is an integer multiple of two, and the remaining mounting groove 1012 can be arranged on any side of the liquid passage 1011. For example, when the number of the mounting grooves 1012 is three, two of the mounting grooves 1012 are respectively arranged on both sides of the liquid passage 1011, and the remaining mounting groove 1012 is arranged on any side of the liquid passage 1011, that is, when only one mounting groove 1012 is arranged on one side of the liquid passage 1011, two mounting grooves 1012 must be arranged on the other side.

[0106] In practical applications, when the number of anode components 102 is one and the number of mounting slots 1012 is two or more, the anode component 102 is installed in any mounting slot 1012. Specifically, when the number of anode components 102 is one, only one side of the workpiece 20 to be plated can be plated. At this time, there is no directional restriction on the installation of the anode component 102, that is, the anode component 102 can be placed on any side of the liquid passage 1011, and the workpiece 20 to be plated needs to be arranged with its surface to be plated facing the anode component 102. For example, when the workpiece 20 to be plated adopts suspended static electroplating, and the anode component 102 is installed in the mounting slot 1012 located on the left side of the liquid passage 1011, the surface to be plated of the workpiece 20 to be plated needs to face the left side of the liquid passage 1011 and be arranged opposite to the anode component 102 (that is, the orthographic projection area of ​​the surface to be plated on the preset vertical plane partially or completely overlaps with the orthographic projection area of ​​the anode components 102103 on the same preset vertical plane). When the number of anode components 102 is two and the number of mounting grooves 1012 is two or more, the two anode components 102 are respectively mounted in any two mounting grooves 1012 located on both sides of the liquid passage 1011. Specifically, when the number of anode components 102 is set to two, the workpiece 20 to be plated is double-sided plated. To achieve double-sided plated, it is necessary to ensure that the two anode components 102 are respectively mounted in the mounting grooves 1012 located on both sides of the liquid passage 1011, so that the two surfaces to be plated of the workpiece 20 to be plated correspond to the two anode components 102 respectively.

[0107] If single-sided electroplating is performed on the workpiece 20 to be electroplated, only one anode member 102 can be selected, and single-sided electroplating of the workpiece 20 to be electroplated can be achieved using one anode member 102. When more than one anode member 102 is provided, the multiple anode members 102 are located on the same side or the multiple anode members 102 are respectively located on both sides of the workpiece 20 to be electroplated. This has less impact on the electroplating effect of the workpiece 20 to be electroplated than when only one anode member 102 is provided, while the electroplating cost and efficiency will be improved. For example, when multiple anode components 102 are located on the same side (i.e., multiple anode components 102 are all installed in multiple installation grooves 1012 located on one side of the liquid passage 1011), the plating solution flowing out through the liquid passage 1011 only contacts the anode component 102 closest to the surface to be plated, and the cations electrolyzed from the remaining anode components 102 are difficult to be freed to the surface to be plated; when multiple anode components 102 are respectively located on both sides of the liquid passage 1011, the plating solution flowing out through the liquid passage 1011 will contact the two surfaces to be plated and the corresponding anode components 102 at the same time, so that cations will be deposited on both sides of the component 20 to be plated. However, most of the cations deposited on the surface to be plated come from the anode component 102 closest to it, and the cations electrolyzed from the remaining anode components 102 are free in the plating solution or deposited on the surface not to be plated. That is to say, when the anode member 102 is connected to the positive pole of the power supply 60, the anode members 102 immersed in the electroplating solution will undergo electrolysis in the electric field. Even if only one anode member 102 provides metal cations to the member 20 to be electroplated, all the anode members 102 will be consumed during the electroplating process, thereby increasing the cost of electroplating and reducing the electroplating efficiency due to the installation of excess anode members 102.

[0108] Accordingly, if double-sided electroplating is performed on the workpiece 20 to be electroplated, only two anode components 102 can be selected, and two anode components 102 are used to respectively perform electroplating on the two surfaces to be electroplated of the workpiece 20 to be electroplated. If the number of anode components 102 exceeds two, the remaining anode components 102 need to be installed on one side of the above-mentioned two anode components 102. During the electroplating process, the plating liquid flowing out through the liquid channel 1011 only contacts the anode component 102 closest to the surface to be electroplated. The anode component 102 far away from the workpiece 20 to be electroplated will increase the cost of electroplating.

[0109] It can be seen from this that when single-sided electroplating is performed on the electroplated part 20, an anode base 101 with only a single mounting groove 1012 can be selected, and an anode base 101 with multiple mounting grooves 1012 can also be selected. The anode part 102 can be installed in any mounting groove 1012. When double-sided electroplating is performed on the electroplated part 20, only an anode base 101 with multiple mounting grooves 1012 can be selected, and the two anode parts 102 need to be installed in the mounting grooves 1012 on both sides of the liquid channel 1011 respectively.

[0110] In an achievable implementation, the distances between the plurality of mounting grooves 1012 located on the same side of the liquid passage 1011 and the liquid passage 1011 can be increased in order in equal proportion. For example, when there are four mounting grooves 1012, two mounting grooves 1012 will be respectively arranged on both sides of the liquid passage 1011, and among the four mounting grooves 1012 respectively located on both sides of the liquid passage 1011, the distances between the liquid passage 1011 and the two mounting grooves 1012 closest thereto are both S1, in cm, and the distances between the liquid passage 1011 and the two mounting grooves 1012 farthest therefrom are both 2S1, in cm.

[0111] Accordingly, the distances between the plurality of mounting grooves 1012 located on the same side of the liquid passage 1011 and the liquid passage 1011 may be sequentially increased in non-uniform proportion. For example, among the four mounting grooves 1012 located on both sides of the liquid passage 1011, the distances between the liquid passage 1011 and the two mounting grooves 1012 closest thereto are both S1, in cm, the distances between the liquid passage 1011 and the two mounting grooves 1012 farthest therefrom are both S2, in cm, the distance between the two mounting grooves 1012 located on the same side is S2-S1, and S2-S1≠S1.

[0112] In practical applications, the installation position of the anode member 102 can be determined by the results of a pre-test. Specifically, the anode member 102 can be sequentially installed in a plurality of installation slots 1012 located on the same side of the liquid passage 1011, and the electroplating effects of the workpiece 20 to be electroplated when the anode member 102 is installed in different positions can be compared, thereby inferring the best installation position of the anode member 102. Among them, when single-sided electroplating is performed on the electroplated component 20, only the electroplating effect of the surface to be electroplated can be considered. If the anode component 102 is installed on an anode base 101 with only a single mounting groove 1012, the electroplating effect when the anode component 102 is installed in the mounting groove 1012 of the anode base 101 can be compared with the electroplating effect when the anode component 102 is installed in the anode base 101 with multiple mounting grooves 1012 (the anode component 102 is installed in the mounting grooves 1012 at multiple different positions for testing respectively, and the electroplating effects are compared one by one). If the anode component 102 is installed on an anode base 101 with multiple mounting grooves 1012, it is only necessary to compare the electroplating effects when the anode component 102 is installed in different mounting grooves 1012. When double-sided electroplating is performed on the workpiece 20 to be electroplated, the distances between the two anode parts 102 and the liquid passage 1011 can be selected to be equal or unequal as needed. If the distances between the two anode parts 102 and the liquid passage 1011 are equal, the same electroplating effect will be produced. If the distances between the two anode parts 102 and the liquid passage 1011 are unequal, different electroplating effects will be presented on both sides of the workpiece 20 to be electroplated.

[0113] For example, when the number of the mounting slot 1012 is one, see Figure 4 The anode component 102 is installed in the mounting groove 1012 for testing. If the electroplating effect of the component 20 to be electroplated does not meet the pre-set qualified standards, the anode assembly 10 is replaced. The distance between the mounting groove 1012 and the liquid channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the mounting groove 1012 and the liquid channel 1011 in the anode assembly 10 before replacement.

[0114] When the number of mounting slots 1012 is two, see Figure 5 The two anode components 102 can be respectively installed in the installation grooves 1012 located on both sides of the liquid flow channel 1011 for testing. If the electroplating effect of the electroplated component 20 does not meet the pre-set qualified standards, the anode assembly 10 is replaced. The distance between the installation groove 1012 and the liquid flow channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the installation groove 1012 and the liquid flow channel 1011 in the anode assembly 10 before replacement.

[0115] When the number of the mounting slots 1012 is more than two and is an integer multiple of two, for example, when the number of the mounting slots 1012 is four, see Figure 6 The two installation grooves 1012 close to the liquid passage 1011 are respectively the first groove body and the second groove body, and the two installation grooves 1012 away from the liquid passage 1011 are respectively the third groove body and the fourth groove body, wherein the first groove body and the third groove body are located on the same side, and the second groove body and the fourth groove body are located on the same side. Specifically, the two anode components 102 can be installed in any of the following ways:

[0116] (1) Two anode members 102 are respectively installed in the first tank body and the second tank body;

[0117] (2) Two anode members 102 are respectively installed in the first tank body and the fourth tank body;

[0118] (3) Two anode members 102 are respectively installed in the third tank body and the fourth tank body;

[0119] (4) The two anode members 102 are respectively installed in the third tank body and the second tank body.

[0120] When the two anode components 102 are installed in the first and third ways, the electroplating effects on both sides of the component 20 to be electroplated are the same. When the two anode components 102 are installed in the second and fourth ways, the electroplating effects on both sides of the component 20 to be electroplated are different.

[0121] When the number of the mounting slots 1012 is more than two and is an odd number, for example, when the number of the mounting slots 1012 is set to five, see Figure 7There are two mounting grooves 1012 located on one side of the liquid passage 1011, namely the first groove body and the third groove body, and there are three mounting grooves 1012 located on the other side of the liquid passage 1011, namely the second groove body, the fourth groove body and the fifth groove body. Specifically, the two anode members 102 can be installed in any of the following ways:

[0122] (1) Two anode members 102 are respectively installed in the first tank body and the second tank body;

[0123] (2) Two anode members 102 are respectively installed in the first tank body and the fourth tank body;

[0124] (3) Two anode members 102 are respectively installed in the first tank body and the fifth tank body;

[0125] (4) Two anode members 102 are installed in the third tank body and the second tank body respectively;

[0126] (5) Two anode members 102 are respectively installed in the third tank body and the fourth tank body;

[0127] (6) The two anode members 102 are respectively installed in the third tank body and the fifth tank body.

[0128] When the two anode components 102 are installed using the (1) and (5) methods, the electroplating effects on both sides of the component 20 to be electroplated are the same. When the two anode components 102 are installed using the (2), (3), (4) and (6) methods, the electroplating effects on both sides of the component 20 to be electroplated are different.

[0129] Preferably, the distance between the mounting groove 1012 and the liquid passage 1011 (equivalent to the distance between the anode member 102 and the member to be plated 20 during electroplating) is 40 mm, 70 mm and 100 mm from near to far, and the number of the mounting grooves 1012 is six, see Figure 1-Figure 3 , Figure 8 , that is, the distance between the installation groove 1012 closest to the liquid passage 1011 and the liquid passage 1011 is 40 mm, and the distance between two adjacent installation grooves 1012 located on the same side of the liquid passage 1011 is 30 mm. In this embodiment, the two anode members 102 have nine installation methods, and the specific installation methods and test methods can refer to the installation methods and test methods used when the number of the above-mentioned installation grooves 1012 is an integer multiple of two.

[0130] It should be noted that the two anode members 102 are arranged in parallel, with their center points on the same horizontal line, and the orthographic projection areas of the two anode members 102 on the same preset vertical plane are the same. Thus, after the anode members 102 are installed in the installation slots 1012, the projection areas of the workpiece 20 to be plated corresponding to the two anode members 102 on the same preset vertical plane are the same, so that all areas or corresponding areas on both sides of the workpiece 20 to be plated can be plated at the same time.

[0131] In an achievable implementation, the anode member 102 is connected to the conductive copper strip 103, and the conductive copper strip 103 is connected to the positive pole of the power source 60. In this way, the conductive copper strip 103 can deliver the positive current to the anode member 102, so that the anode member 102 can be electrolyzed in the electroplating solution. The conductive copper strip 103 is disposed on a fixing rod 104, and the fixing rod 104 is connected to the electroplating equipment.

[0132] In one possible implementation, see Figure 1-Figure 8 The anode assembly 10 further includes a baffle subassembly, which includes at least a first baffle 105. A baffle groove 106 for installing the first baffle 105 is provided on the anode base 101. The baffle groove 106 is located between the liquid passage 1011 and the mounting groove 1012 adjacent thereto. When the first baffle 105 is installed in the baffle groove 106, the first baffle 105 corresponds to the lower edge position of the anode member 102. Specifically, the anode base 101 having only one mounting groove 1012 can only mount one anode member 102, and only one first baffle 105 for shielding the lower edge of the anode member 102 is required. The anode base 101 having two or more mounting grooves 1012 can perform single-sided or double-sided electroplating on the electroplated member 20, and two baffle grooves 106 are required. When double-sided electroplating is performed on the workpiece 20 to be electroplated, the anode parts 102 are installed on both sides of the liquid channel 1011. Since the distance between the baffle groove 106 and the liquid channel 1011 is smaller than the distance between the mounting groove 1012 and the liquid channel 1011, the anode part 102 is installed in any mounting groove 1012, and the first baffle 105 is located between the anode part 102 and the workpiece 20 to be electroplated, thereby being able to cover the lower edge of the anode part 102.

[0133] Further, when the first baffle 105 is installed in the baffle groove 106 and the anode member 102 is installed in the mounting groove 1012, the upper surface of the first baffle 105 is higher than the lower surface of the anode member 102, so that the first baffle 105 can cover a part of the anode member 102. Specifically, the part of the first baffle 105 located in the baffle groove 106 is covered by the baffle groove 106 body, and the part of the anode member 102 located in the mounting groove 1012 is covered by the mounting groove 1012 body. It is necessary to ensure that the part of the first baffle 105 exposed from the baffle groove 106 can cover the edge part of the anode member 102 exposed from the mounting groove 1012.

[0134] It should be noted that the lower edge area of ​​the anode member 102 can be preset. Due to the edge effect of the anode member 102 itself (i.e., during electroplating, the electric lines tend to concentrate on the sharp corners and edges of the anode member 102, so that the current density on the sharp corners and edges of the anode member 102 is relatively large), in order to prevent the electric lines flowing through the anode member 102 to the edge portion of the to-be-plated part 20 from being too concentrated, a shielding member can be provided at the edge portion of the anode member 102, so that the electric lines located in the lower edge area of ​​the anode member 102 need to bypass the first baffle 105 when extending to the to-be-plated part 20. It can be inferred that the distance that the electric lines located in the lower edge area of ​​the anode member 102 extend to the to-be-plated part 20 will be greater than the distance that the electric lines located in the central area of ​​the anode member 102 move to the to-be-plated part 20. In this way, the electric lines can be evenly distributed on the surface to be electroplated, thereby reducing the influence of uneven plating caused by the edge effect of the anode member 102.

[0135] Assume that the area of ​​the first baffle 105 exposed from the baffle groove 106 is A, in cm 2 The preset lower edge area of ​​the anode member 102 is B, in cm 2 In order to achieve a better shielding effect, the orthographic projection of the partial area of ​​the first baffle 105 that exposes the baffle groove 106 on the anode member 102 can cover the preset lower edge area of ​​the anode member 102, that is, the orthographic projection area of ​​the partial area of ​​the first baffle 105 that exposes the baffle groove 106 on the anode member 102 is larger than B, thereby shielding the lower edge area of ​​the anode member 102. Under the condition that the exposed part of the first baffle 105 can shield the lower edge area of ​​the anode member 102, the depth of the baffle groove 106 and the depth of the mounting groove 1012 are not limited here. When the first baffle 105 and the anode member 102 are arranged parallel and facing each other, the area of ​​the partial area of ​​the first baffle 105 that exposes the baffle groove 106 is larger than the preset lower edge area of ​​the anode member 102.

[0136] In an achievable embodiment, the baffle subassembly further includes a second baffle 107, one end of which is connected to the conductive copper strip 103, and the other end of which extends from the top of the workpiece 20 to be electroplated toward the bottom thereof until the upper edge of the anode piece 102 is shielded. Specifically, the second baffle 107 and the conductive copper strip 103 are both provided with connection holes that can be matched with the same bolt to achieve the connection between the second baffle 107 and the conductive copper strip 103. To ensure that the second baffle 107 can shield the upper edge of the anode piece 102, the second baffle 107 needs to be arranged above the anode piece 102, that is, the conductive copper strip 103 and the fixing rod 104 on which the conductive copper strip 103 is installed are both located above the anode piece 102, that is, the second baffle 107 can also be connected in coordination with the fixing rod 104.

[0137] Further, the free end of the second baffle 107 extends downward to the extent that it can shield the upper edge area of ​​the anode member 102. Accordingly, the upper edge area of ​​the anode member 102 can be preset. If the preset upper edge area of ​​the anode member 102 is C, in cm 2 In order to achieve a better shielding effect, the orthographic projection of the downwardly extending area of ​​the bottom of the second baffle 107 on the anode member 102 can cover the upper edge area of ​​the anode member 102, thereby shielding the upper edge area of ​​the anode member 102. When the electric force lines located in the upper edge area of ​​the anode member 102 extend to the workpiece 20 to be electroplated, they need to bypass the second baffle 107. It can be inferred that the distance that the electric force lines located in the upper edge area of ​​the anode member 102 extend to the workpiece 20 to be electroplated will be greater than the distance that the electric force lines located in the central area of ​​the anode member 102 extend to the workpiece 20 to be electroplated.

[0138] In an achievable embodiment, the baffle subassembly further includes a third baffle 108, one end of which is disposed on the second baffle 107 and is located between the second baffle 107 and the anode member 102. If the distance between the upper edge region of the anode member 102 and the second baffle 107 is too large, the shielding effect of the second baffle 107 on the edge electric lines will be reduced. Furthermore, there is a certain distance between the second baffle 107 and the anode member 102 on the side close to the anode member 102, and the distance is greater than or equal to the thickness of the third baffle 108.

[0139] In an achievable embodiment, the baffle subassembly further includes a fourth baffle 109, one end of which is disposed on the first baffle 105, and the other end of which extends in the direction of the anode member 102 adjacent thereto. The principle is the same as that of the third baffle 108. If the distance between the lower edge region of the anode member 102 and the first baffle 105 is too large, the shielding effect of the first baffle 105 on the edge electric lines will be reduced. Furthermore, there is a certain distance between the first baffle 105 and the anode member 102 on the side close to the anode member 102, and the distance is greater than or equal to the thickness of the fourth baffle 109.

[0140] Furthermore, the fourth baffle 109 is detachably connected to the first baffle 105. Specifically, when there are more than two mounting grooves 1012, the anode member 102 can be placed in the mounting groove 1012 far away from the liquid passage 1011, and the baffle groove 106 is arranged between the liquid passage 1011 and the mounting groove 1012 adjacent thereto. In this case, the distance between the first baffle 105 and the anode member 102 will change, and the maximum value of the distance between the first baffle 105 and the anode member 102 is positively correlated with the number of mounting grooves 1012. The more the number of mounting grooves 1012 located on the same side of the liquid passage 1011 is, the greater the distance between the liquid passage 1011 and the farthest mounting groove 1012 is. Therefore, in the case where the installation position of the anode member 102 is uncertain, in order to ensure that the fourth baffle 109 can always fill the distance between the first baffle 105 and the anode member 102, the fourth baffle 109 can be connected in a detachable manner, and when the installation position of the anode member 102 is changed, the fourth baffle 109 of different lengths can be replaced in time. Among them, the detachable connection method can be a threaded connection, a snap connection, etc., and the present application does not limit the detachable connection method as long as the fourth baffle 109 connected to the first baffle 105 can be repeatedly replaced.

[0141] Different from the above-mentioned method of using the fourth baffle 109 to fill the distance between the anode member 102 and the first baffle 105, in another feasible embodiment, a plurality of baffle grooves 106 are provided on the anode base 101, and the number of the baffle grooves 106 and the mounting grooves 1012 are equal and arranged at intervals. Specifically, one baffle groove 106 and one mounting groove 1012 together form a lower shielding group, and in one lower shielding group, the baffle groove 106 is located on the side close to the liquid passage 1011. For example, the number of the mounting grooves 1012 is four, and they are evenly distributed on both sides of the liquid passage 1011, that is, there are two lower shielding groups on both sides of the liquid passage 1011, and in the lower shielding group located on the left side of the liquid passage 1011, the baffle groove 106 is located on the side close to the liquid passage 1011, which is equivalent to the right side of the lower shielding group, and the mounting groove 1012 is located on the side away from the liquid passage 1011, which is equivalent to the left side of the lower shielding group. In this embodiment, the distance between the first baffle plate 105 and the anode member 102 is equal to the distance between the mounting groove 1012 and the baffle groove 106. If in a lower shielding group, the mounting groove 1012 is connected to the baffle groove 106, then after the anode member 102 and the first baffle plate 105 are respectively installed in the mounting groove 1012 and the baffle groove 106, the anode member 102 and the first baffle plate 105 are in a fitted state. If in a lower shielding group, the mounting groove 1012 and the baffle groove 106 are separated by the anode base 101, the smaller the width of the anode base 101 between the mounting groove 1012 and the baffle groove 106, the better the shielding effect of the first baffle plate 105 on the electric line located at the lower edge of the anode member 102.

[0142] In one possible implementation, see Figure 1-Figure 8 The anode assembly 10 also includes an overflow plate 110. An overflow groove 111 for installing the overflow plate 110 is opened on the anode base 101. The overflow groove 111 is located on the side of the installation groove 1012 away from the liquid passage 1011. The orthographic projection area of ​​the overflow plate 110 on a preset vertical plane is larger than the orthographic projection area of ​​the anode member 102 on the same preset vertical plane. Since the titanium base of the anode member 102 can be a mesh or other structure having spaces connecting the two sides of the anode member 102, in order to prevent the electroplating solution flowing in from the liquid passage 1011 from directly flowing in a direction away from the workpiece 20 to be electroplated by the structure of the anode member 102 and no longer flowing through the workpiece 20 to be electroplated, so that the cations are subjected to the flow resistance in the opposite direction to the direction close to the workpiece 20 to be electroplated and cannot be gathered on the surface of the workpiece 20 to be electroplated, the overflow groove 111 where the overflow plate 110 is installed is arranged on the side of the installation groove 1012 away from the liquid passage 1011, that is, the electroplating solution cannot flow to the side of the anode member 102 away from the liquid passage 1011. In other words, the electroplating solution flowing out of the liquid passage 1011 can only flow along the height direction of the workpiece 20 to be electroplated and the overflow plate 110 when the left and right sides are blocked by the overflow plate 110 and the workpiece 20 to be electroplated respectively. In this way, the electroplating solution can continue to contact with the workpiece 20 to be electroplated during the flow process, and the cations will also be freed to the surface of the workpiece 20 to be electroplated.

[0143] In a feasible implementation, a drainage port 1071 is provided on the second baffle 107 , and the drainage port 1071 is located above the anode component 102 , so that the plating liquid flowing in from the liquid passage 1011 flows through the component to be plated 20 and flows toward the drainage port 1071 . If the second baffle 107 is not provided with a drainage port 1071, when the second baffle 107 blocks the upper edge of the anode component 102, the plating liquid will flow into the top of the second baffle 107 along the height of the component 20 to be plated after flowing in from the liquid passage 1011, and then diffuse. However, when the upper surface of the plating tank 30 is flush with the upper surface of the anode assembly 10, after the plating liquid flows to the top of the second baffle 107, it will flow out of the plating tank 30 because it is too close to the side wall of the plating tank 30. When the flow rate of the plating liquid flowing in through the liquid passage 1011 is too fast, the plating liquid cannot diffuse to both sides, and the liquid level height when it flows to the top of the anode assembly 10 will be greater than the anode assembly 10, and there is a possibility of generating splashes or flowing out of the plating tank 30 when falling.

[0144] Accordingly, in order to ensure that the flow area of ​​the electroplating solution can completely cover the surface to be plated of the workpiece 20 to be plated, so that the cations can be freed to the surface of the surface to be plated, thereby achieving a uniform electroplating effect, the drainage port 1071 should also be located above the workpiece 20 to be plated. Since the specific position of the workpiece 20 to be plated cannot be determined when it is being plated in motion (i.e., not in suspension electroplating), the top position of the workpiece 20 to be plated when it is moving can be tested in advance, and the drainage port 1071 can be always located above it by adjusting its height, thereby avoiding uneven electroplating.

[0145] In this embodiment, there should be enough space above the anode member 102 to allow the electroplating solution to flow out from the drainage port 1071. Specifically, since the bottom of the second baffle 107 is a free end, the top is a fixed end, and the fixed end is connected to the conductive copper strip 103 and / or the fixed rod 104, that is, the conductive copper strip 103 and the fixed rod 104 are both located above the anode member 102, so that the second baffle 107 can block the upper edge of the anode member 102 when extending downward. When the conductive copper strip 103, the fixed rod 104 and the anode member 102 are all located on the same side of the second baffle 107, the conductive copper strip 103 and the fixed rod 104 are both located above the anode member 102, and there is a certain distance between them and the anode member 102, forming a drainage channel, and the drainage channel is connected to the drainage port 1071. In this way, after the electroplating liquid flows in through the liquid channel 1011 , it moves along the height direction of the anode component 102 and the workpiece 20 to be electroplated, flows to the drainage port 1071 , and then enters the drainage channel through the drainage port 1071 .

[0146] In practical applications, in order to ensure the stability of the anode assembly 10 during the electroplating process, after the anode member 102 is inserted into the mounting groove 1011, the anode base 101 can be threadedly connected to the anode member 102 by bolts to further improve the installation stability of the anode plate 102. At the same time, the second baffle 107 and the fixing rod 104, and the anode base 101 and the electroplating equipment are all threadedly connected. In this way, the impact of water flow and the like on the anode assembly 10 and its components during the electroplating process can be reduced, thereby ensuring the stable progress of the electroplating work. Under the condition of ensuring that the anode base 101 and the electroplating equipment, and the various components of the anode assembly 10 can be stably connected and easy to replace, other detachable connection methods can also be used, and this application is not limited here.

[0147] In one embodiment disclosed in the present application, a vertical electroplating device is also provided. Figure 9-Figure 30 The vertical electroplating device includes the anode assembly 10 in the above-mentioned embodiment. The vertical electroplating device is used to electroplate the object 20 to be electroplated, so that a metal film is attached to the entire area or a part of the area on the surface of the object 20 to be electroplated.

[0148] In this embodiment, reference Figure 9-Figure 21, the vertical electroplating equipment also includes an anode unit, an electroplating tank 30, a cathode unit 40, a driving mechanism 50, a power supply 60 and a liquid circulation mechanism 70. Specifically, the anode assembly 10 is arranged in the electroplating tank 30, and a plurality of anode assemblies 10 together constitute the anode unit; in the working state, the electroplating tank 30 is also filled with a plating solution, and the anode part 102 in the anode assembly 10 is immersed in the plating solution to ensure the normal flow of cations during the electroplating process; the cathode unit 40 is configured to install the workpiece 20 to be electroplated; the driving mechanism 50 is configured to push the cathode unit 40 to move in the anode unit. If the anode assembly 10 includes only one anode part 102, when the cathode unit 40 moves in the anode unit, the workpiece 20 to be electroplated is located on one side of the anode part 102, and the cations ionized by the anode part 102 The cations ionized by the anode component 102 will be freed and deposited on the surface of the workpiece 20 to be plated, so that the workpiece 20 to be plated can be plated on one side. If the anode assembly 10 includes two anode components 102, when the cathode unit 40 moves in the anode unit, the workpiece 20 to be plated is located between the two anode components 102, and the cations ionized by the anode component 102 will be freed and deposited on the surface of the workpiece 20 to be plated, so that the workpiece 20 to be plated can be plated on both sides. The positive pole of the power supply 60 is connected to the anode assembly 10, and the negative pole of the power supply 60 is connected to the cathode unit 40, thereby forming an electric field loop. The liquid circulation mechanism 70 is connected to the plating tank 30 and is configured to drive the plating solution to circulate to form a liquid loop. In practical applications, see Figure 9-11 In order to ensure the overall stability of the vertical electroplating equipment, the electroplating tank 30, the driving mechanism 50 and the liquid circulation mechanism 70 are all connected to the frame. In the above, the driving mechanism 50 drives the cathode unit 40 to move in the anode unit, and drives the workpiece 20 to be electroplated installed in the cathode unit 40 to move in the anode unit, so that the workpiece 20 to be electroplated can move in the electroplating liquid, thereby improving the electroplating efficiency. In addition, the liquid circulation mechanism 70 can drive the electroplating liquid to circulate, which can supplement the concentration loss of the electroplating liquid around the workpiece 20 to be electroplated, further improving the electroplating efficiency, and is beneficial to the uniformity of electroplating.

[0149] In one possible implementation, see Figure 9-11, a plurality of anode assemblies 10 are arranged in the electroplating tank 30, and the plurality of anode assemblies 10 are distributed at intervals or continuously along a preset direction to form an anode unit, and the anode parts 102 on the plurality of anode assemblies 10 in the anode unit all extend along the preset direction, or each anode assembly 10 includes an anode part 102 extending along the preset direction, and preferably, the anode parts 102 on the same side of the plurality of anode assemblies 10 belonging to the same anode unit are arranged in the same plane. The preset direction is the moving direction of the workpiece 20 to be electroplated in the electroplating tank 30. In this way, when each anode assembly 10 belonging to the same anode unit includes two anode parts 102, there is a certain distance between the two anode parts 102, and an anode channel 112 is formed, and the plurality of anode channels 112 are connected to form an electroplating channel 113. Since the width of the liquid passage 1011 in the anode assembly 10 is greater than the thickness of the workpiece 20 to be plated, and the two anode members 102 are located on both sides of the liquid passage 1011, the width of the anode channel 112 formed must be greater than the thickness of the workpiece 20 to be plated, so that the workpiece 20 to be plated can move in the anode channel 112. When the workpiece 20 to be plated moves along its length in the electroplating channel 113, the ionized cations of the two anode members 102 will be respectively freed to the surface to be plated near it. Since the workpiece 20 to be plated in this embodiment is continuously moved in a vertical state for electroplating, this electroplating method belongs to vertical continuous electroplating, which can ensure that the workpiece 20 to be plated can be uniformly plated in the entire electroplating tank 30, thereby obtaining a uniform coating thickness.

[0150] In practical applications, a plurality of electroplating channels 113 are arranged in parallel in the electroplating tank 30, so that a plurality of parts to be electroplated 20 can be electroplated in the electroplating tank 30 at the same time, so as to realize continuous and efficient production. If only one electroplating channel 113 is provided, a method of continuous electroplating in sequence can be adopted. Specifically, after the part to be electroplated 20 moves into the anode channel 112, the two anode parts 102 will electroplate the two sides of the part to be electroplated 20 respectively, that is, even if the distance between the two anode parts 102 is large enough, in the case of double-sided electroplating of the part to be electroplated 20, the anode channel 112 can only provide one part to be electroplated 20 to pass through at a time, therefore, a plurality of parts to be electroplated 20 need to intermittently enter the electroplating channel 113 in sequence, and under the condition that the parts to be electroplated 20 do not affect each other, the smaller the interval time between two adjacent parts to be electroplated 20 entering the electroplating channel 113, the higher the electroplating efficiency. If a plurality of electroplating channels 113 are provided at the same time, a method of parallel and continuous electroplating of a plurality of parts to be electroplated 20 can be adopted. Specifically, multiple pieces to be plated 20 can be installed simultaneously through the cathode unit 40. The multiple pieces to be plated 20 installed are parallel to each other and the number is equal to the number of the electroplating channels 113, so that the multiple pieces to be plated 20 can enter the electroplating channel 113 for electroplating at the same time. In this way, it is only necessary to install multiple groups of pieces to be plated 20 on the cathode unit 40 at the same time. The multiple pieces to be plated 20 located in the same cathode unit 40 are a group, and the multiple groups of pieces to be plated 20 enter the electroplating channel 113 in sequence and intermittently. Since the multiple electroplating channels 113 are independent of each other, when multiple electroplating channels 113 are set, for a single electroplating channel 113, the way in which the pieces to be plated 20 enter is the same as when only one electroplating channel 113 is set. Compared with the single installation, the parallel installation of multiple pieces to be plated 20 can reduce the space occupied by the installation components, and the parallel movement of multiple pieces to be plated 20 is convenient for management and adjustment of the interval time. It can be seen that providing a plurality of electroplating channels 113 in the electroplating tank 30 can effectively improve the electroplating efficiency of the vertical electroplating equipment.

[0151] In one possible implementation, see Fig.12 , Fig.17 , Fig.24 , a first partition 301 is horizontally arranged in the electroplating tank 30, and the electroplating tank 30 is divided into an electroplating sub-tank 303 and a liquid supply tank 304 by the first partition 301, and the electroplating sub-tank 303 is located above the liquid supply tank 304. Among them, the anode assembly 10 is arranged in the electroplating sub-tank 303, and a liquid supply assembly 80 is arranged in the liquid supply tank 304, and the electroplating liquid is transported to the electroplating sub-tank 303 through the liquid supply assembly 80. Specifically, by horizontally arranging the first partition 301, the electroplating tank 30 is divided into two parts, the upper and lower parts, and the liquid supply tank 304 located at the lower part can accurately supply liquid to the anode assembly 10 in the electroplating sub-tank 303 through the liquid supply assembly 80.

[0152] If the first partition 301 is set vertically, the range of the electroplating sub-tank 303 in the horizontal direction will be reduced. Since the workpiece 20 to be electroplated needs to be moved by the driving mechanism 50, the anode assembly 10 cannot be arranged in a multi-layer structure in the vertical direction. Therefore, reducing the range of the electroplating sub-tank 303 in the horizontal direction will reduce the number of anode assemblies 10, thereby changing the length or number of anode channels 112, affecting the electroplating quality and reducing the electroplating efficiency. If the number of anode assemblies 10 is to remain unchanged, it is necessary to expand the space of the electroplating tank 30 in the horizontal direction, thereby increasing the volume and occupied space of the vertical electroplating equipment, thereby increasing the production cost of the vertical electroplating equipment.

[0153] In addition, when the first partition 301 is vertically arranged, the electroplating tank 30 will be divided into two parts, the liquid supply tank 304 and the electroplating sub-tank 303 are arranged adjacent to each other in the horizontal direction. When the liquid supply tank 304 transports the plating liquid to the electroplating sub-tank 303 through the liquid supply assembly 80, the plating liquid can only enter the electroplating sub-tank 303 from the horizontal direction, and the liquid passage 1011 is opened on the anode base 101, which is equivalent to limiting the transport direction of the plating liquid, so that the plating liquid needs to enter the electroplating sub-tank 303 from the vertical direction. Therefore, when the first partition 301 is vertically arranged, the liquid supply tank 304 cannot accurately supply liquid to the anode assembly 10 in the electroplating sub-tank 303.

[0154] In one possible implementation, see Fig.12 , Fig.15 , Fig.16The liquid supply assembly 80 at least includes a shunt pipe 801, one end of which is connected to the liquid circulation mechanism 70, and the other end of which passes through the first partition plate 301 and is connected to the electroplating sub-tank 303, so as to transport the electroplating solution into the electroplating channel 113. The number of shunt pipes 801 will be equal to the number of the electroplating channels 113, or the number of the anode assemblies 10. If the number of shunt pipes 801 will be equal to the number of the electroplating channels 113, the shunt pipe 801 will be connected to the liquid passage 1011 of any anode assembly 10 in the electroplating channel 113, and transport the electroplating solution to the anode channel 112 of the anode assembly 10. After the electroplating solution flows out through the liquid channel 1011, it will first flow to the drainage port 1071. When the amount of the electroplating solution is sufficient, part of the electroplating solution will diffuse to the remaining anode channels 112. In this way, one electroplating channel 113 can transport the electroplating solution through only one shunt pipe 801. If the number of shunt tubes 801 and anode assemblies 10 is equal, the shunt tubes 801 correspond to the liquid passages 1011 one by one, and the shunt tubes 801 deliver the electroplating solution obtained from the liquid circulation mechanism 70 to the corresponding anode assembly 10. The electroplating channel 113 is supplied with liquid only through one shunt tube 801, which can facilitate the control of the shunt tube 801 when there are multiple electroplating channels 113 in the electroplating tank 30, and simplifies the pipeline structure and reduces the occupied space of the liquid supply assembly 80. The electroplating channel 113 is supplied with liquid through multiple shunt tubes 801 at the same time, which can evenly supply liquid to multiple anode assemblies 10 at the same time.

[0155] Further, see Fig. 22 The flow divider 801 is connected to the liquid circulation mechanism 70 through a flow equalizer assembly, and the flow equalizer assembly includes a liquid supply pipe 802 and a flow equalizer pipe 803. The two ends of the liquid supply pipe 802 are connected to the flow equalizer pipe 803 and the liquid circulation mechanism 70 respectively. The liquid supply pipe 802 is connected to the middle position of the length direction of the flow equalizer pipe 803 and extends equidistantly in the direction away from the center point. Among them, one end of the flow divider 801 is set on the flow equalizer pipe 803 and is connected to the flow equalizer pipe 803, and the other end is connected to the electroplating channel 113. Specifically, when the liquid supply pipe 802 transports the plating liquid to the uniform flow tube 803, the plating liquid enters the uniform flow tube 803 from the middle of the uniform flow tube 803, and first diffuses to the two ends of the uniform flow tube 803. Since the ends of the uniform flow tube 803 are in a closed state, the liquid level of the plating liquid will rise evenly after flowing to the ends of the uniform flow tube 803. That is to say, when there are multiple diversion tubes 801, the plating liquid will enter multiple diversion tubes 801 at the same time through the uniform flow tube 803.

[0156] Different from the above-mentioned method of supplying liquid to the shunt pipe 801 through the flow equalizing component, in an achievable implementation, see Fig.23, the shunt pipe 801 is connected to the liquid circulation mechanism 70 through the liquid supply pipe 802, the liquid supply pipe 802 includes a liquid supply main pipe 8021 and a liquid supply branch pipe 8022, the two ends of the liquid supply main pipe 8021 are respectively connected to the liquid circulation mechanism 70 and the liquid supply branch pipe 8022, one end of the shunt pipe 801 is arranged on the liquid supply branch pipe 8022 and is connected to the liquid supply branch pipe 8022, and the other end is connected to the electroplating channel 113. In this way, the electroplating liquid flowing out of the liquid circulation mechanism 70 will flow through the liquid supply main pipe 8021, the liquid supply branch pipe 8022, and the shunt pipe 801 in sequence until it flows into the electroplating channel 113. In this embodiment, the plurality of shunt pipes 801 can be distributed based on the distance between the electroplating channel 113 and the liquid supply branch pipe 8022. Specifically, the connecting point between the liquid supply branch pipe 8022 and the liquid supply main pipe 8021 is taken as the starting point, and the shunt pipes 801 with gradually decreasing lengths are connected in sequence, and the length of the shunt pipe 801 is positively correlated with the distance between the electroplating channel 113 and the liquid supply branch pipe 8022, that is, the farther the distance between the electroplating channel 113 and the liquid supply branch pipe 8022 is, the longer the shunt pipe 801 is required to connect it with the liquid supply branch pipe 8022. In other words, the electroplating liquid flowing into the liquid supply branch pipe 8022 through the liquid supply main pipe 8021 will sequentially enter the shunt pipes 801 with distances from it from near to far, and the lengths of these shunt pipes 801 are gradually reduced, so that the difference in the time points of the electroplating liquid flowing into the multiple electroplating channels 113 is small.

[0157] In one possible implementation, see Fig.15 , Fig.16 The liquid supply assembly 80 further includes a jet pipe 806, which includes a jet main pipe 804 and a jet branch pipe 805. One end of the jet main pipe 804 is connected to the liquid circulation mechanism 70, and the other end extends to the bottom of the electroplating channel 113 and is connected to the jet branch pipe 805. Both ends of the jet branch pipe 805 extend away from the jet main pipe 804 until the length of the jet branch pipe 805 is equal to that of the electroplating channel 113. A plurality of nozzles are arranged on the jet branch pipe 805, and the nozzles are connected to the electroplating sub-tank 303. Specifically, when there are multiple electroplating channels 113, the jet pipe 806 is connected to the liquid circulation mechanism 70 through a liquid replenishing pipe, wherein the function and structure of the liquid replenishing pipe are the same as those of the above-mentioned liquid supply pipe 802, that is, the electroplating liquid in the liquid circulation mechanism 70 is simultaneously transported to multiple jet pipes 806 by using the liquid replenishing pipe.

[0158] In this embodiment, one jet branch pipe 805 corresponds to one electroplating channel 113, and liquid is supplied to the electroplating channel 113 through a plurality of nozzles arranged thereon. The number of nozzles is equal to the number of anode assemblies 10, and corresponds one by one to the liquid passages 1011 of the anode assemblies 10. In order to allow multiple anode assemblies 10 in the same electroplating channel 113 to be uniformly supplied with liquid, the jet main pipe 804 is connected to the middle position of the length direction of the jet branch pipe 805, so that the electroplating liquid level in the jet branch pipe 805 can rise uniformly and enter the nozzle.

[0159] Further, a plurality of liquid supply ports are provided on the first partition plate 301, and the liquid passage 1011 corresponds to the position of at least one liquid supply port. Specifically, the number of liquid supply ports is greater than or equal to the number of liquid passages 1011. When the number of liquid supply ports is equal to the number of liquid passages 1011, the anode base 101 can be installed according to the positions of the liquid supply ports to ensure that the liquid passages 1011 correspond to the positions of the liquid supply ports after installation. When the number of liquid supply ports is greater than the number of liquid passages 1011, the installation position of each anode base 101 can be adjusted as needed, and it is only necessary to ensure that the liquid passage 1011 corresponds to the position of at least one liquid supply port, or the liquid passage 1011 of each anode base 101 can correspond to the positions of more than one liquid supply port to increase the amount of electroplating liquid entering the anode channel 112.

[0160] The number of liquid supply ports and nozzles under the same electroplating channel 113 is equal, and the positions correspond to each other. The nozzles are connected to the electroplating channel 113 through the liquid supply ports, so that the electroplating liquid flows into the liquid passage 1011 through the jet pipe 806. When the number of liquid supply ports under a liquid passage 1011 is greater than the number of nozzles, it can be blocked. If the electroplating sub-tank 303 is connected to the liquid supply bin 304 through the liquid supply port or other openings, the consumption of electroplating liquid during electroplating of the vertical electroplating equipment will increase, and blocking the liquid supply port will increase the cost of the blocking components and labor costs, and reduce the electroplating efficiency.

[0161] In one possible implementation, see Fig.11 , Fig.12 , Fig.25, the liquid circulation mechanism 70 at least includes a liquid storage barrel 701, a circulation pump and a circulation pipeline 702. Specifically, the circulation pipeline 702 includes a circulation liquid inlet pipe 7021 and a circulation liquid outlet pipe 7022, and the liquid supply pipe 802 and the jet pipe 806 are both connected to the circulation liquid inlet pipe 7021; one end of the circulation liquid inlet pipe 7021 is connected to the circulation pump, and the other end is connected to the electroplating tank 30 (such as the liquid storage tank 305 below), and the circulation pump is connected to the liquid storage barrel 701; the electroplating tank 30 is also provided with a second partition 302, and the first partition 301 and the second partition 305 are arranged horizontally. 2. The electroplating tank 30 is divided into an electroplating sub-tank 303, a liquid supply tank 304 and a liquid storage tank 305 from top to bottom. The liquid storage tank 305 is located below the liquid supply tank 304 and is independent of the liquid supply tank 304. The circulating liquid outlet pipe 7022 is connected to the liquid storage tank 305, and the circulating liquid outlet pipe 7022 is connected to the liquid inlet of the liquid storage barrel 701. The electroplating sub-tank 303 has a circulation tank 306 connected to the liquid storage tank 305, and the circulation tank 306 is independent of the liquid supply tank 304. Preferably, the liquid storage barrel 701 has a filtering function and can filter impurities in the electroplating solution.

[0162] See also Fig.12 , Fig.17 , Fig.24 By horizontally arranging the first partition 301 and the second partition 302, the electroplating tank 30 is divided into an electroplating sub-tank 303, a liquid supply tank 304 and a liquid storage tank 305 from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved. In addition, the existing electroplating equipment directly pumps the plating liquid in the plating sub-tank 303 when circulating the plating liquid. This method is prone to insufficient liquid in the plating sub-tank 303 due to reasons such as the circulating pump rotating too fast. However, in the present application, a circulating pump is used to pump the plating liquid in the liquid storage tank 305. The plating liquid in the liquid storage tank 305 is the plating liquid that overflows the plating sub-tank 303, that is, the overflowing plating liquid is the excess plating liquid in the plating sub-tank 303. The remaining plating liquid in the plating sub-tank 303 can still complete the electroplating of the to-be-plated component 20. In this way, circulating the plating liquid in the liquid storage tank 305 can reduce the impact of the circulating plating liquid on the electroplating work.

[0163] Among them, see Fig.24 Both sides of the first partition 301 and the second partition 302 are connected to the inner wall of the electroplating tank 30. A circulation partition 307 is provided at at least one end of the first partition 301, and there is a certain distance between the circulation partition 307 and the inner wall of the electroplating tank 30. The bottom of the circulation partition 307 extends downward until it is connected to the end of the second partition 302, thereby forming a circulation tank 306. That is, when the liquid level in the electroplating sub-tank 303 exceeds the height of the circulation partition 307, it will enter the circulation tank 306 and flow into the liquid storage tank 305.

[0164] In actual application, the plating solution flows into the plating sub-tank 303 through the circulating liquid inlet pipe 7021. When the plating solution in the plating tank 30 is excessive, it will overflow into the circulating tank 306 and flow into the liquid storage tank 305 through the circulating tank 306. The plating solution in the liquid storage tank 305 enters the liquid storage barrel 701 through the circulating liquid outlet pipe 7022 under the suction force of the circulating pump. In this way, one cycle of the plating solution can be completed.

[0165] In this embodiment, the plating solution can enter the plating sub-tank 303 through the shunt pipe 801 and / or the jet pipe 806, and the flow direction of the plating solution can be controlled by setting a three-way valve or a regulating valve 94. When the three-way valve is set, the water inlet of the three-way valve is connected to the circulating liquid inlet pipe 7021, the first water outlet of the three-way valve is connected to the shunt pipe 801, and the second water outlet is connected to the jet pipe 806. Since the shunt pipe 801 transports a large amount of plating liquid to the plating channel 113 through a pipeline and then distributes it, during the startup or operation of the vertical electroplating equipment, when a large amount of liquid replenishment is needed in the plating sub-tank 303, the first water outlet can be opened and the second water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the shunt pipe 801, and the plating liquid flows into the plating channel 113 through the shunt pipe 801, while the jet pipe 806 replenishes the anode assembly 10 separately through multiple nozzles. When the plating liquid in the plating sub-tank 303 is sufficient and in a stable operation state, the second water outlet can be opened and the first water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the jet pipe 806, and the plating liquid flows into the corresponding liquid channel 1011 through the nozzle. Since the three-way valve can only open one of its two water outlets, in order to realize that the plating liquid can flow into the electroplating sub-tank 303 through the shunt pipe 801 and the jet pipe 806 at the same time, a regulating valve 94 can also be set on the shunt pipe 801 and the jet pipe 806. Specifically, one end of the circulating liquid inlet pipe 7021 is connected to the liquid outlet of the liquid storage barrel 701, and the other end is provided with a three-way joint, and the other two interfaces of the three-way joint are respectively connected to the shunt pipe 801 and the jet pipe 806. When the amount of plating liquid in the electroplating sub-tank 303 is sufficient, one of the regulating valves 94 can be selected to be opened, so that the plating liquid in the liquid storage barrel 701 flows into the electroplating sub-tank 303 through the shunt pipe 801 or the jet pipe 806. When the amount of plating liquid in the electroplating tank 30 is insufficient, the two regulating valves 94 can be selected to be opened at the same time to replenish the electroplating sub-tank 303 with a large amount of liquid. Among them, when the shunt tube 801 and the jet tube 806 simultaneously transport the plating liquid to the electroplating tank 30, since the nozzle directly replenishes the liquid flow channel 1011, the shunt tube 801 is connected with other parts of the electroplating sub-tank 303. For example, when the anode base 101 of the anode assembly 10 has a plurality of mounting grooves 1012, a plurality of mounting grooves 1012 in an anode assembly 10 that are away from the liquid flow channel 1011 and have no anode component 102 installed will form a plating liquid flow area, and the plating liquid flow areas of two adjacent anode assemblies 10 will be connected. At this time, the shunt tube 801 can replenish the plating liquid flow area, thereby increasing the amount of plating liquid in the electroplating tank 30.

[0166] In one possible implementation, see Fig.25, a liquid level sensor 91 is provided in the electroplating tank 30, and the liquid level sensor 91 is located in the electroplating sub-tank 303 to monitor the amount of electroplating liquid in the electroplating sub-tank 303. Specifically, the vertical electroplating equipment also includes a controller 90, and there is a communication line (wired or wireless communication line) between the liquid level sensor 91 and the controller 90, and the controller 90 can receive the signal sent by the liquid level sensor 91, and then obtain the real-time liquid level in the electroplating sub-tank 303. Before the vertical electroplating equipment is used, the liquid level threshold range of the liquid level sensor 91 can be pre-set to control the amount of electroplating liquid in the electroplating sub-tank 303. When the electroplating liquid level in the electroplating sub-tank 303 is not within the set liquid level threshold range, the liquid level sensor 91 can be fed back to the controller 90 via the above-mentioned communication line, and then the controller 90 issues a reminder in the form of sound, light and electricity. In addition, the controller 90 is also electrically connected to the circulation pump and the regulating valve 94 so that the controller 90 can control the outlet valve opening of the circulation pump and the opening and closing of the regulating valve 94 when the plating liquid level in the plating sub-tank 303 is not within the set liquid level threshold range.

[0167] For example, assuming that the liquid level threshold range of the liquid level sensor 91 is H1, and the plating liquid level of the plating sub-tank 303 is H2, when H2

[0168] Further, see Fig.25 Flow sensors 92 are provided on the shunt pipe 801 and the jet pipe 806 for real-time monitoring of the flow rate of the electroplating solution flowing into the electroplating sub-tank 303. Specifically, the flow sensor 92 is electrically connected to the controller 90, and the controller 90 can receive the signal sent by the flow sensor 92, and then obtain the real-time flow rate in the shunt pipe 801 and the jet pipe 806. Before the vertical electroplating equipment is used, the flow threshold range of the flow sensor 92 can be pre-set to monitor the amount of electroplating solution flowing into the electroplating sub-tank 303 through the shunt pipe 801 and the jet pipe 806 in real time. The controller 90 can obtain the signal of the flow sensor 92 and control the opening of the regulating valve 94 according to the signal to control the flow rate of the electroplating solution in the shunt pipe 801 and the jet pipe 806.​

[0169] In a feasible embodiment, the liquid storage barrel 701 contains the original solution of the electroplating solution. Since the cation concentration of the electroplating solution in the electroplating sub-tank 303 will be reduced compared with the original solution after long-term use, it will be returned to the liquid storage barrel 701 to mix with the original solution and precipitate, so that the cation concentration of the electroplating solution that returns to the electroplating sub-tank 303 through the liquid storage barrel 701 will increase. In order to ensure that the cation concentration in the electroplating solution that flows back into the electroplating sub-tank 303 increases, the operation and maintenance personnel need to regularly replenish the original solution of the electroplating solution into the liquid storage barrel 701. If the electroplating solution that flows out of the liquid channel 1011 to the surface of the workpiece 20 to be electroplated is not mixed with the original solution, but the electroplating solution in the electroplating sub-tank 303 is recycled, after a certain period of time, the cation concentration reaching the surface of the workpiece 20 to be electroplated may gradually decrease, so that a coating of sufficient thickness cannot be formed on the surface of the workpiece 20 to be electroplated.

[0170] In one possible implementation, see Fig.25 A temperature sensor 93 is provided in the electroplating tank 30, and the temperature sensor 93 is located in the electroplating sub-tank 303. The temperature sensor 93 is electrically connected to the controller 90, and the controller 90 can receive the signal sent by the temperature sensor 93, and then obtain the real-time temperature of the electroplating sub-tank 303. In the electroplating production process, the temperature of the electroplating solution will change due to the heat generated during processing or the change of room temperature. However, when the temperature of the electroplating solution does not meet the process requirements, it will have a great impact on the firmness, uniformity, flatness and surface finish of the surface coating of the produced electroplated product.

[0171] Therefore, in one implementation, the vertical electroplating equipment further includes a temperature control component 100. Specifically, the temperature control component 100 includes a heat exchanger 1001, a liquid supply barrel 1002, a temperature control pump, and a heat exchange pipe. The liquid outlet of the liquid supply barrel 1002 is connected to the first heat exchange pipe 1003, and is communicated with the first liquid inlet of the heat exchanger 1001 through the first heat exchange pipe 1003. The first liquid outlet of the heat exchanger 1001 is connected to the second heat exchange pipe 1004, and is communicated with the liquid inlet of the liquid supply barrel 1002 through the second heat exchange pipe 1004, so as to form a temperature control component 1001 composed of the first heat exchange pipe 1003, the second heat exchange pipe 1004, the liquid supply barrel 1002, and the heat exchanger 1001. The heat exchange liquid flows in the first loop; the heat exchange outlet of the liquid storage barrel 701 is connected to the third heat exchange pipe 1005, and communicates with the second liquid inlet of the heat exchanger 1001 through the third heat exchange pipe 1005; the second liquid outlet of the heat exchanger 1001 is connected to the fourth heat exchange pipe 1006, and communicates with the heat exchange inlet of the liquid storage barrel 701 through the fourth heat exchange pipe 1006, so as to form a second loop composed of the third heat exchange pipe 1005, the fourth heat exchange pipe 1006, the liquid storage barrel 701 and the heat exchanger 1001, and the electroplating liquid flows in the second loop. There are two temperature control pumps, which are respectively arranged on the first loop and the second loop, so that the heat exchange liquid flowing out of the liquid supply barrel 1002 circulates in the first loop, and the electroplating liquid circulates in the second loop. The circulating plating liquid exchanges heat with the heat exchange liquid through the heat exchanger 1001. The plating liquid after heat exchange flows into the liquid storage barrel 701, and then enters the plating sub-tank 303 through the circulating liquid inlet pipe 7021 to complete the regulation of the plating liquid temperature in the plating sub-tank 303.

[0172] In practical applications, the above scheme uses a plate heat exchanger to exchange liquid heat. Specifically, the plating liquid enters the flow channel of the plate heat exchanger through the second loop, and the heat exchange liquid enters another flow channel of the plate heat exchanger through the first loop. Heat is transferred through the temperature difference between the two liquids. After the heat exchange, the plating liquid and the heat exchange liquid enter the second loop and the first loop respectively, so that the temperature of the plating liquid flowing into the liquid storage barrel 701 through the plate heat exchanger is lower than the temperature of the plating liquid flowing out of the liquid storage barrel 701, or the temperature of the plating liquid flowing into the liquid storage barrel 701 through the plate heat exchanger is higher than the temperature of the plating liquid flowing out of the liquid storage barrel 701.

[0173] In this embodiment, see Fig.25, a solenoid valve 95 is provided on the third heat exchange pipe 1005, and the controller 90 is electrically connected to the solenoid valve 95 and the temperature control pump, and controls the opening and closing of the solenoid valve 95 and the temperature control pump according to the real-time temperature of the electroplating sub-tank 303 obtained, so as to adjust the temperature of the electroplating liquid in the electroplating sub-tank 303. For example, assuming that the preset temperature range of the electroplating liquid in the electroplating sub-tank 303 is T2-T1, when the heat generated by electroplating is too high, or the temperature in the electroplating workshop is too high, the actual temperature of the current electroplating liquid obtained by the temperature sensor 93 is T3, and T3 is greater than the highest value T1 in the working temperature range. In order to make the temperature of the electroplating liquid in the electroplating sub-tank 303 within the preset temperature range, after receiving the signal from the temperature sensor 93, the controller 90 controls the solenoid valve 95 and the temperature control pump to open, so that the electroplating liquid in the liquid storage barrel 701 enters the second loop and exchanges with the heat exchange liquid. The heat is exchanged and refluxed into the liquid storage barrel 701. In order to cool down the electroplating liquid in the electroplating sub-tank 303, the liquid contained in the liquid supply barrel 1002 is a cooling liquid. In this way, after the electroplating liquid exchanges heat with the cooling liquid, the temperature of the electroplating liquid flowing into the liquid storage barrel 701 will be lower than the temperature of the electroplating liquid flowing out of the liquid storage barrel 701. After the cooled electroplating liquid is continuously transported to the electroplating sub-tank 303, the temperature of the electroplating liquid in the electroplating sub-tank 303 can be reduced to T4, and T2<T4≤T1<T3, until T2<T4<T1, the controller 90 is The solenoid valve 95 and the temperature control pump can be controlled to be closed; accordingly, when the temperature in the electroplating workshop is too low, the actual temperature of the current electroplating solution obtained by the temperature sensor 93 is T5, and T5 is less than the lowest value T2 in the working temperature range. In order to make the temperature of the electroplating solution in the electroplating sub-tank 303 within the preset temperature range, the controller 90 controls the solenoid valve 95 and the temperature control pump to be opened after receiving the signal from the temperature sensor 93, so that the electroplating solution in the liquid storage barrel 701 enters the second loop, exchanges heat with the heat exchange liquid, and flows back to the liquid storage barrel 701. The plating liquid in the plating sub-tank 303 is heated. At this time, the liquid in the liquid supply barrel 1002 is hot water with a temperature higher than that of the plating liquid. In this way, after the plating liquid exchanges heat with the hot water, the temperature of the plating liquid flowing into the liquid storage barrel 701 will be higher than the temperature of the plating liquid flowing out of the liquid storage barrel 701. After the heated plating liquid is continuously transported to the plating sub-tank 303, the temperature of the plating liquid in the plating sub-tank 303 can be increased to T6, and T5<T2≤T6<T1, until T2<T6<T1, the controller 90 can control the solenoid valve 95 and the temperature control pump to close.

[0174] In order to prevent the impurities generated during the electroplating process from affecting the electroplating quality of the electroplated part 20, in an achievable implementation, see Fig.11 , Fig.12 , Fig.15The vertical electroplating equipment further includes a filter 703, which is arranged on the electroplating solution circulation loop to filter the electroplating solution for circulation. Specifically, a filter 703 is arranged at one end of the circulating liquid outlet pipe 7022 connected to the liquid storage tank 305, and the filter 703 is located in the liquid storage tank 305. The filter 703 is provided with a plurality of filter holes 7031. The electroplating solution in the electroplating sub-tank 303 flows through the circulation tank 306, the liquid storage tank 305, the filter 703 and the circulating liquid outlet pipe 7022 in sequence, and enters the liquid storage barrel 701. Since the liquid storage tank 305 is independently arranged, when the electroplating solution does not flow back, the impurities will be filtered and retained in the liquid storage tank 305, so that the electroplating solution transported to the electroplating sub-tank 303 by the liquid storage barrel 701 does not contain impurities.

[0175] Furthermore, a plurality of filter holes 7031 are evenly arranged on the side wall of the filter 703. If the filter holes 7031 are arranged on the upper surface of the filter 703, under the suction force of the circulation pump, the electroplating solution located on the surface of the liquid storage tank 305 is subjected to less resistance and will flow to the filter 703 faster. Since the amount of electroplating solution overflowing from the electroplating sub-tank 303 is limited, the electroplating solution in the liquid storage tank 305 cannot be replenished in time, so that the liquid storage tank 305 forms a negative pressure area above the filter holes 7031, and the negative pressure area will drive the electroplating solution around it to accelerate the flow, and the electroplating solution near the edge of the liquid storage tank 305 moves toward the negative pressure area and rotates to form a vortex. Therefore, in order to avoid the above phenomenon, the filter 703 evenly arranges a plurality of filter holes 7031 on its side wall, so that the electroplating solution in the liquid storage tank 305 can continuously and stably flow into the circulation outlet pipe 7022.

[0176] Furthermore, a filter 703 is provided on the circulating liquid inlet pipe 7021 to prevent the electroplating solution flowing into the electroplating sub-tank 303 from containing impurities, thereby affecting the electroplating effect. It should be noted that in order to prevent the filter hole 7031 of the filter 703 from being blocked by impurities after long-term use, the operation and maintenance personnel can regularly remove the filter 703 for cleaning or replacement.

[0177] In a feasible embodiment, in order to prevent leakage of the plating liquid in the plating tank 30, the parts where the circulating liquid inlet pipe 7021, the diversion pipe 801 and the jet pipe 806 are connected to the plating tank 30 are all provided with sealing rings. The sealing rings can be made of rubber material and use their own elasticity to seal the gap between the pipe and the plating tank 30.

[0178] In one possible implementation, see Figure 12-14 , Figure 17-Figure 19 , Figure 27-Figure 31, the cathode unit 40 includes a conductive component 401 and a mounting component 402. Specifically, the mounting component 402 includes at least a cathode support frame 4021 and a cathode connecting rod 4025, the workpiece 20 to be electroplated is mounted in the cathode support frame 4021, and the cathode support frame 4021 is mounted on the cathode connecting rod 4025; the conductive component 401 includes at least a conductive block 4011, a substrate 4013 is provided along the length of the electroplating tank 30, a conductive strip 4012 is provided on the substrate 4013, and the conductive strip 4012 extends along the length direction of the electroplating tank 30, and the conductive block 4011 is connected to the end of the cathode connecting rod 4025 (directly or indirectly connected). ), and the conductive block 4011 is in contact with the conductive strip 4012; wherein, the substrate 4013 and the mounting assembly 402 are both insulators, the conductive block 4011, the conductive strip 4012 and the conductive wire are all conductors, the workpiece 20 to be electroplated is electrically connected to the conductive block 4011 through the conductive wire, the conductive strip 4012 is electrically connected to the negative pole of the power supply 60, when the driving mechanism 50 pushes the cathode unit 40, and the cathode unit 40 moves along the length of the electroplating tank 30, the conductive block 4011 transmits the current obtained by its contact with the conductive strip 4012 to the workpiece 20 to be electroplated.

[0179] In this embodiment, see Figure 27-Figure 31 The cathode support frame 4021 includes a support frame body 40211 and a carrier frame body 40215, wherein the support frame body 40211 is connected to the carrier frame body 40215, and the carrier frame body 40215 has a bearing slot 40216, and the bearing slot 40216 can be used to install the electroplated part 20. Among them, the support frame body 40211 has a first support portion 40212 and a second support portion 40213, and the two ends of the first support portion 40212 are respectively connected to the two second support portions 40213, and the second support portion 40213 extends to both sides away from one end of the first support portion 40212 and is connected to the carrier frame body 40215. Preferably, when the distance between one end of the two second support portions 40213 and each other is greater than the width of the support frame 40215, the inner wall of the second support portion 40213 is connected to the outer wall of the support frame 40215; when the distance between one end of the two second support portions 40213 and each other is equal to the width of the support frame 40215, the bottom of the second support portion 40213 is connected to the top of the support frame 40215; when the distance between one end of the two second support portions 40213 and each other is less than the width of the support frame 40215, the outer wall of the second support portion 40213 is connected to the inner wall of the support frame 40215.

[0180] Furthermore, a connecting rod support groove for mounting the first support portion 40212 is provided on the cathode connecting rod 4025. The number of the connecting rod support grooves is less than or equal to the number of the electroplating channels 113, and the distance between two adjacent connecting rod support grooves is equal to the distance between the liquid passages 1011 in two adjacent electroplating channels 113, so that a plurality of parts 20 to be electroplated can simultaneously enter the electroplating channels 113 corresponding to their positions and move over the liquid passages 1011 of the anode assembly 10. In order to ensure that the support frame 40211 does not shake due to inertia or other reasons during the movement, so that the plating of the parts 20 to be electroplated is uneven, threaded holes are provided on the first support portion 40212 and the connecting rod support groove, and the two threaded holes are matched with the same bolt, so that the cathode support frame 4021 and the cathode connecting rod 4025 can be threadedly connected.

[0181] For further information, see Figure 27-Figure 31 , a support block 40214 is also provided on the first support portion 40212, one end of the support block 40214 is provided on the first support portion 40212, and the other end extends in the direction of the support frame body 40215. When the first support portion 40212 is installed in the connecting rod support groove, the support block 40214 contacts the cathode connecting rod 4025. If only one support block 40214 is provided, in order to prevent the support frame body 40211 from shaking due to inertia during movement, the support block 40214 is located on the same side of the moving direction. For example, when the moving direction is the right side, the support block 40214 is provided on the right side of the first support portion 40212. When the cathode connecting rod 4025 moves to the right, the cathode support frame 4021 can limit its right side movement range through the support block 40214, thereby reducing the shaking probability and shaking amplitude of the support block 40214. If two support blocks 40214 are provided, the distance between the two support blocks 40214 is slightly greater than or equal to the width of the cathode connecting rod 4025, so that when the first support portion 40212 is installed in the connecting rod support groove, the two support blocks 40214 are respectively located on both sides of the cathode connecting rod 4025, that is, the distance between the two support blocks 40214 is adapted to the width of the cathode connecting rod 4025, so that the cathode connecting rod 4025 can be inserted between the two support blocks 40214. When the cathode connecting rod 4025 moves, the cathode support frame 4021 can limit its moving range through the support blocks 40214, thereby reducing the shaking probability and shaking amplitude of the support blocks 40214.

[0182] It should be noted that the orthographic projection area of ​​the bearing groove 40216 on the preset vertical plane is greater than or equal to the orthographic projection area of ​​the workpiece 20 to be electroplated on the same preset vertical plane, so that the workpiece 20 to be electroplated can be installed in the bearing groove 40216. When the orthographic projection area of ​​the bearing groove 40216 on the preset vertical plane is equal to the orthographic projection area of ​​the workpiece 20 to be electroplated on the same preset vertical plane, the inner wall of the bearing groove 40216 will wear the outer edge of the workpiece 20 to be electroplated, and when the orthographic projection area of ​​the bearing groove 40216 on the preset vertical plane is greater than the orthographic projection area of ​​the workpiece 20 to be electroplated on the same preset vertical plane, the workpiece 20 to be electroplated will fall or shift due to unstable installation.

[0183] In order to solve the problem of unstable installation of the above-mentioned electroplated part 20, in an achievable implementation, see Figure 27-Figure 31 , a plurality of bearing blocks 40217 are arranged in the bearing groove 40216, and the bearing blocks 40217 are used to reduce the distance between the inner wall of the bearing groove 40216 and the workpiece 20 to be electroplated, so as to support the workpiece 20 to be electroplated. Specifically, a plurality of bearing blocks 40217 are arranged along the inner wall of the bearing groove 40216 to achieve multi-directional support of the workpiece 20 to be electroplated. Further, an opening is provided on the bearing block 40217, so that when the edge of the workpiece 20 to be electroplated is installed in the opening, the moving range of the workpiece 20 to be electroplated can be limited by the side wall of the opening, so as to prevent the workpiece 20 to be electroplated from shaking and falling significantly during the movement. Furthermore, the opening can be set to a structure in which the width gradually decreases from top to bottom, so as to guide the workpiece 20 to be electroplated during the process of installing it in the bearing groove 40216, and to reduce the gap between the workpiece 20 to be electroplated and the side wall of the opening. It should be noted that, while ensuring that the workpiece 20 to be electroplated can be stably installed in the supporting groove 40216, the opening of the supporting block 40217 can adopt any shape, such as V-shape or X-shape, etc., and the present application does not impose any limitation on this.

[0184] Different from the above-mentioned method of setting an opening on the bearing block 40217, in another feasible embodiment, a plurality of bearing block groups are set in the bearing groove 40216, and each bearing block group includes two bearing blocks 40217, and the plurality of bearing block groups are set along the inner wall of the bearing groove 40216. Specifically, there is a certain gap between the two bearing blocks 40217 to form a bearing area 40218 for mounting the workpiece 20 to be electroplated. Among them, the width of the bearing area 40218 is greater than the thickness of the workpiece 20 to be electroplated. If the two bearing blocks 40217 are close to each other and are inclined in opposite directions, the bearing area 40218 is in a V-shaped structure, achieving the same effect as the above-mentioned V-shaped opening.

[0185] In one possible implementation, see Figure 27-Figure 31, the cathode support frame 4021 is provided with a fifth baffle 4023 and a sixth baffle 4024. When the workpiece 20 to be plated is installed in the bearing slot 40216, the fifth baffle 4023 corresponds to the lower edge position of the workpiece 20 to be plated, and the sixth baffle 4024 corresponds to the upper edge position of the workpiece 20 to be plated. Specifically, the fifth baffle 4023 and the sixth baffle 4024 are provided on the bearing frame body 40215. When the workpiece 20 to be plated is plated on one side, the fifth baffle 4023 and the sixth baffle 4024 can be provided only on one side of the bearing frame body 40215, so that the fifth baffle 4023 and the sixth baffle 4024 can shield the lower edge and the upper edge of the same side of the workpiece 20 to be plated. When double-sided electroplating is performed on the workpiece 20 to be electroplated, a fifth baffle 4023 and a sixth baffle 4024 are provided on both sides of the carrier body 40215. The two fifth baffles 4023 located on both sides of the carrier body 40215 are positioned correspondingly, and the two sixth baffles 4024 located on both sides of the carrier body 40215 are positioned correspondingly, so that the two fifth baffles 4023 can simultaneously block the lower edges of both sides of the workpiece 20 to be electroplated, and the two sixth baffles 4024 can simultaneously block the upper edges of both sides of the workpiece 20 to be electroplated. Among them, the fifth baffle 4023 and the sixth baffle 4024 are both detachably connected to the supporting frame 40215. When the sixth baffle 4024 is provided on both sides of the supporting frame 40215, since the first support portion 40212 is located directly above the supporting groove 40216, the workpiece 20 to be electroplated cannot be placed from directly above the supporting groove 40216. The sixth baffle 4024 on one side can be removed, and the workpiece 20 to be electroplated can be placed into the supporting groove 40216 through the gap.

[0186] Due to the edge effect of the workpiece 20 to be plated, the electric lines are easily concentrated on the sharp corners and edges of the workpiece 20 to be plated, so that the current density on the sharp corners and edges of the workpiece 20 to be plated is relatively large. When the lower edge and the upper edge of the workpiece 20 to be plated are covered by the fifth baffle 4023 and the sixth baffle 4024 respectively, the plating solution needs to flow to the central part of the surface to be plated first, and then diffuse to the edge part through the central part, so that the distance of the electric lines extending to the edge position of the workpiece 20 to be plated is greater than the distance of the electric lines extending to the center position of the workpiece 20 to be plated. In this way, the distribution of the electric lines on the surface to be plated can be uniform, thereby reducing the influence of the uneven coating caused by the edge effect of the workpiece 20 to be plated. When the plating solution flows to the workpiece 20 to be plated through the anode part 102, the edge effect of the anode part 102 can be weakened first by the first baffle 105 and the second baffle 107, and then the edge effect of the workpiece 20 to be plated can be weakened by the fifth baffle 4023 and the sixth baffle 4024. In this way, the electric lines of force distributed on the workpiece 20 to be electroplated can be made uniform, thereby achieving the purpose of uniform plating thickness of the workpiece 20 to be electroplated.

[0187] Among them, the edge area of ​​the workpiece 20 to be electroplated can be determined in advance. In the case where the fifth baffle 4023 and the sixth baffle 4024 are not set, the workpiece 20 to be electroplated is directly electroplated, and the electroplated workpiece 20 to be electroplated is evenly divided into N electroplating areas, and the thickness of the plating layer in each electroplating area is measured, so as to reversely infer the distribution of the electric field lines of the workpiece 20 to be electroplated, thereby determining the upper edge and lower edge areas of the workpiece 20 to be electroplated, balancing the distribution of the electric field lines of the workpiece 20 to be electroplated, and effectively improving the uniformity of electroplating.

[0188] In practical applications, see Fig.21 , a conductive wire is connected to the workpiece 20 to be plated, and the other end of the conductive wire is connected to the conductive block 4011, so as to transmit the negative current obtained by the conductive block 4011 to the workpiece 20 to be plated. Specifically, the number of the conductive wire is at least one, and the end away from the workpiece 20 to be plated extends along the cathode connecting rod 4025 to the conductive block 4011. Further, the conductive wire can be a flexible material or a hard material, and the conductive wire of the flexible material can be made of copper foil tape, metal foil tape or other components with good conductive properties, which is not limited in the present application.

[0189] Furthermore, a mounting rod is provided on the carrier body 40215, and a wire clamp is provided on the support body 40211, and the wire clamp can install the conductive wire and the mounting rod together. When the cathode connecting rod 4025 moves, the conductive wire is easy to shake under the influence of the airflow, and the position of part of the conductive wire is fixed by the wire clamp, which can reduce the shaking range and amplitude of the conductive wire, thereby improving the connection stability of the conductive wire.

[0190] In one possible implementation, see Figure 12-14 , Figure 17-Figure 19 , Fig. 27 , Fig.28 The conductive assembly 401 further includes a conductive connecting rod 4014, one end of which is connected to the end of the cathode connecting rod 4025, and the other end of which extends in a direction away from the cathode connecting rod 4025. The conductive block 4011 is disposed on the conductive connecting rod 4014. Specifically, the conductive block 4011 is connected to the conductive connecting rod 4014 through a conductive fixing seat 40111. In order to ensure that the negative current can be stably transmitted, after the conductive fixing seat 40111 is connected to the conductive connecting rod 4014, it should be ensured that the conductive block 4011 is in contact with the conductive strip 4012.

[0191] In one possible implementation, see Figure 12-14 , Figure 17-Figure 19 , Fig. 27 , Fig.28The conductive component 401 further includes a guide roller 4015, which is rotatably arranged on a roller mounting seat 4016, and the roller mounting seat 4016 is connected to the cathode connecting rod 4025. A roller moving groove is arranged on the substrate 4013 along the length direction, and the guide roller 4015 is located in the roller moving groove and moves along the roller moving groove. By arranging the roller moving groove and the guide roller 4015, the friction resistance between the conductive connecting rod 4014 and the substrate 4013 is reduced, and the movement of the cathode connecting rod 4025 is more convenient. In a modified embodiment, the number of guide rollers 4015 is two, and the two guide rollers 4015 are arranged on the same rotating shaft, and the rotating shaft is rotatably connected to the roller mounting seat 4016. The central axes of the two guide rollers 4015 coincide with the rotating shaft, and there is a certain distance between the two guide rollers 4015. Under this structure, the base plate 4013 is provided with a guide protrusion 4017, which extends along the movement direction of the driving mechanism 50, and the guide protrusion 4017 is located between the two guide rollers 4015 to guide the movement of the cathode connecting rod 4025. In a modified embodiment, when a guide groove is provided on the guide roller 4015, the guide protrusion 4017 is inserted into the guide groove, so that the guide roller 4015 can move along the guide protrusion 4017. Further, the two coaxial guide rollers 4015 are a group, and a group of guide rollers 4015 is provided on both sides of the roller mounting seat 4016. Furthermore, guide rollers 4015 are provided at both ends of the cathode connecting rod 4025. By guiding both ends of the cathode connecting rod 4025 at the same time, the cathode connecting rod 4025 can be stably moved.

[0192] In one possible implementation, see Figure 9-12 , Fig.17 , Fig. 20 , Fig.26 , Fig. 27, the driving mechanism 50 at least includes a driving bracket 501, a transmission member 502, a driving source 503 and a pushing member 504. Specifically, the transmission member 502 is rotatably arranged on the driving bracket 501, the pushing member 504 is connected to the transmission member 502, and the driving source 503 is arranged on the driving bracket 501 and connected to the transmission member 502, so as to drive the transmission member 502 to drive the pushing member 504 to cyclically rotate; when the pushing member 504 rotates to the top of the electroplating tank 30, it contacts the cathode connecting rod 4025 and pushes it to move along the length direction of the electroplating tank 30. The pushing member 504 cyclically rotates, and can cyclically push the multiple cathode units 40 that are continuously loaded, so as to realize the continuous production of the parts 20 to be electroplated, thereby improving the production efficiency. The transmission member 502 adopts a mechanical transmission structure capable of realizing rotation, such as a belt, a chain, etc. The transmission member 502 circulates and rotates on the driving bracket 501 in an elliptical trajectory. The driving source 503 includes a transmission wheel 5031 and a motor 5032. The motor 5032 and the transmission wheel 5031 are respectively arranged on both sides of the driving bracket 501. The transmission member 502 is sleeved on the transmission wheel 5031. The output shaft of the motor 5032 passes through the driving bracket 501 and is connected to the transmission wheel 5031 to drive the transmission wheel 5031 to drive the transmission member 502 to rotate. It should be noted that the transmission member 502 and the transmission wheel 5031 should adopt components that can match each other in structure. For example, when the transmission member 502 adopts a belt, the transmission wheel 5031 adopts a pulley that can match the belt. When the transmission member 502 adopts a chain, the transmission wheel 5031 adopts a sprocket that can match the chain.

[0193] In this embodiment, the driving bracket 501 adopts a vertically arranged structure, and the transmission member 502 arranged on the driving bracket 501 performs circular rotation in the vertical direction. The transmission member 502 has two horizontal movement areas and two rotation areas when circularly rotating. In the case of vertical rotation, the two horizontal movement areas are at different heights, that is, the transmission position is divided into a first height and a second height, the distance between the first height and the electroplating tank 30 is L1, the distance between the second height and the electroplating tank 30 is L2, and L1<L2. When the pusher 504 is at the first height, the pusher 504 is located above the electroplating tank 30, and the end away from the transmission member 502 can contact the cathode connecting rod 4025. The pusher 504 applies a thrust to the cathode connecting rod 4025 under the drive of the transmission member 502, so that the cathode connecting rod 4025 moves with the pusher 504 until the pusher 504 leaves the first height and turns to the second height. When the pusher 504 is at the second height, the pusher 504 is located above the cathode connecting rod 4025, and the end of the pusher 504 away from the transmission member 502 is out of contact with the cathode connecting rod 4025. At this time, the pusher 504 originally at the second height rotates to the first height and contacts the cathode connecting rod 4025. In this way, under the cyclic rotation of the transmission member 502, the multiple pushers 504 connected thereto can repeatedly reach the position of the first height, push the cathode connecting rod 4025, and thus realize the sequential driving of the multiple cathode units 40 of continuous loading. The pushing member 504 and the cathode connecting rod 4025 are in contact connection, so that the pushing member 504 can rotate cyclically following the transmission member 502 .

[0194] Different from the above-mentioned structure in which the driving bracket 501 is vertically arranged, in a feasible implementation manner, the driving bracket 501 adopts a horizontally arranged structure, and the transmission member 502 arranged on the driving bracket 501 performs circular rotation in the horizontal direction. The transmission member 502 has two horizontal movement areas and two rotation areas when circularly rotating. In the case of horizontal rotation, the two horizontal movement areas have different distances from the electroplating tank 30, that is, the transmission position is divided into a first width and a second width, the distance between the first width and the electroplating tank 30 is L3, the distance between the second width and the electroplating tank 30 is L4, and L3<L4. When the pusher 504 rotates to the first width, the pusher 504 is located at one side of the electroplating tank 30, and the end away from the transmission member 502 can contact the cathode connecting rod 4025. The pusher 504 applies a thrust to the cathode connecting rod 4025 under the drive of the transmission member 502, so that the cathode connecting rod 4025 moves with the pusher 504 until the pusher 504 leaves the first width and turns to the second width. When the pusher 504 is in the second width, the pusher 504 is located at the side of the first width away from the electroplating tank 30. At this time, the pusher 504 originally in the second width rotates to the first width and contacts the cathode connecting rod 4025. In this way, under the cyclic rotation of the transmission member 502, the multiple pushers 504 connected thereto can be repeatedly cycled to the position of the first width to push the cathode connecting rod 4025, thereby realizing the continuous driving of the cathode unit 40.

[0195] Compared with the structure of the horizontally arranged driving bracket 501, the structure of the vertically arranged driving bracket 501 can reduce the footprint of the vertical electroplating equipment; and compared with the structure of the vertically arranged driving bracket 501, the structure of the horizontally arranged driving bracket 501 can improve the stability of the transmission member 502 during rotation.

[0196] In one possible implementation, see Figure 12-14 , Figure 17-Figure 19 , Fig. 27 , Fig.28The push member 504 includes a push base 5041 and a push rod 5043. The push base 5041 is connected to the transmission member 502. One end of the push rod 5043 is arranged on the push base 5041, and the other end extends in a direction away from the push base 5041. In order to enable the cathode connecting rod 4025 to move smoothly, the end away from the push base 5041 can extend to the middle of the cathode connecting rod 4025, so that the force of the cathode connecting rod 4025 is balanced. Among them, the push rod 5043 can be connected to the push base 5041 by a vertical rotation, so that when the transmission member 502 is fixed, the height of the push rod 5043 can be adjusted to make it cooperate with multiple types of cathode units 40. In practical applications, the rotation range of the push rod 5043 needs to be limited in advance. If the rotation range of the push rod 5043 is too large, it will cause mutual interference between the push rods 5043 at different heights and affect the movement of the cathode connecting rod 4025. Therefore, preferably, the rotation angle of the push rod 5042 is less than 30°.

[0197] Furthermore, a push plate 5044 is provided on the push rod 5043, and the push plate 5044 is used to increase the contact area between the push member 504 and the cathode connecting rod 4025, thereby increasing the force application area of ​​the push member 504, so that the cathode connecting rod 4025 can move smoothly. Furthermore, in order to ensure that the contact position between the push plate 5044 and the cathode connecting rod 4025 is accurate and does not deviate, the push plate 5044 and the cathode connecting rod 4025 can be provided with a magnetic attraction structure or an adhesive structure that can cooperate with each other. For example, if the first magnetic component and the second magnetic component are respectively provided on the pushing plate 5044 and the cathode connecting rod 4025, and the magnetism of the first magnetic component and the second magnetic component are opposite, when the pushing plate 5044 contacts the cathode connecting rod 4025, the two can be magnetically connected through the cooperation of the first magnetic component and the second magnetic component to improve the stability during the movement. When the pushing plate 5044 rotates away from the cathode connecting rod 4025, the first magnetic component and the second magnetic component are separated due to the large distance, and the pushing plate 5044 rotates again to the other end of the electroplating tank 30 to contact the un-electroplated cathode unit 40.

[0198] In one possible implementation, see Figure 12-14 , Figure 17-Figure 19 , Fig. 27 , Fig.28The driving bracket 501 is also provided with a slide rail 5011, which is an elliptical track and is located outside the transmission member 502. Since the transmission member 502 rotates in an elliptical track, the orthographic projection area of ​​the elliptical area with the slide rail 5011 as the circumference on the preset vertical plane is larger than the orthographic projection area of ​​the elliptical area with the transmission member 502 as the circumference on the same preset vertical plane. A plurality of pushing rollers 5042 are provided on the pushing base 5041, and the plurality of pushing rollers 5042 are all in contact with the slide rail 5011. When the driving source 503 drives the transmission member 502 to rotate, the transmission member 502 drives the push base 5041 to perform circular rotation on the driving bracket 501. When the push base 5041 rotates, it will drive the push roller 5042 to perform circular motion. Since the push roller 5042 is in contact with the slide rail 5011, the push base 5041 rotates along the transmission member 502 in an elliptical orbit, and the push roller 5042 rotates along the elliptical orbit of the slide rail 5011 in an elliptical orbit. Among them, the push roller 5042 can rotate along the inner circumference of the slide rail 5011, and can also rotate along the outer circumference of the slide rail 5011.

[0199] It should be noted that when the vertical electroplating equipment includes a driving mechanism 50, the vertical electroplating equipment adopts a dynamic electroplating method to plate the workpiece 20 to be electroplated. When the vertical electroplating equipment adopts a static electroplating method to plate the workpiece 20 to be electroplated, the vertical electroplating equipment can only use a fixed bracket to install the workpiece 20 to be electroplated, and there is no need to set up the driving mechanism 50 and the cathode unit 40, so that the workpiece 20 to be electroplated can be placed statically in the electroplating tank 30 for electroplating.

[0200] The vertical electroplating equipment provided in the embodiment of the present application utilizes a driving mechanism 50 to push the cathode unit 40 through the anode assembly 10 to achieve vertical continuous electroplating of the workpiece 20 to be electroplated. When the workpiece 20 to be electroplated has different distances from the anode parts 102 on both sides, different electroplating effects can be formed on different surfaces to be electroplated. In addition, in the vertical electroplating equipment, the electroplating tank 30 is divided into electroplating sub-tanks 303, liquid supply tanks 304 and liquid storage tanks 305 from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved.

[0201] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A vertical electroplating device, characterized in that: include: An anode unit, wherein the anode unit is composed of a plurality of anode assemblies, wherein the plurality of anode assemblies are distributed at intervals or continuously along a preset direction to form the anode unit; each anode assembly comprises an anode member extending along the preset direction; An electroplating tank, wherein the anode unit is disposed in the electroplating tank, and the electroplating tank is also filled with an electroplating solution; a cathode unit, the cathode unit being configured to mount a workpiece to be electroplated; a driving mechanism configured to push the cathode unit to move in the anode unit; A power supply, wherein the positive electrode of the power supply is connected to the anode unit, and the negative electrode of the power supply is connected to the cathode unit.

2. The vertical electroplating equipment according to claim 1, characterized in that: When each of the anode assemblies includes two anode members, there is a certain distance between the two anode members to form an anode channel, and a plurality of the anode channels are connected to form an electroplating channel.

3. The vertical electroplating equipment according to claim 2, characterized in that: Also includes: An anode base, wherein a liquid passage and a mounting groove are provided on the anode base, wherein the mounting grooves are provided on both sides of the liquid passage, and the anode member is installed in the mounting grooves; A liquid circulation mechanism, connected to the electroplating tank, configured to drive the electroplating liquid to circulate to form a liquid loop; A liquid supply component, used for delivering electroplating liquid into the electroplating channel; The liquid circulation mechanism is connected to the liquid supply component, and the liquid supply component is connected to the liquid passage to transport the electroplating liquid into the electroplating channel.

4. The vertical electroplating equipment according to claim 3, characterized in that: A first partition is horizontally arranged in the electroplating tank, and the electroplating tank is divided into an electroplating sub-tank and a liquid supply tank by the first partition, and the electroplating sub-tank is located above the liquid supply tank; The anode unit is arranged in the electroplating sub-tank, a liquid supply component is arranged in the liquid supply bin, and the electroplating liquid is transported to the electroplating sub-tank through the liquid supply component.

5. The vertical electroplating equipment according to claim 4, characterized in that: The liquid supply assembly at least includes a shunt pipe; The flow divider is connected to the liquid circulation mechanism through the flow equalizer assembly, and the flow equalizer assembly includes a liquid supply pipe and a flow equalizer, and the two ends of the liquid supply pipe are connected to the flow equalizer and the liquid circulation mechanism respectively, and the liquid supply pipe is connected to the middle position of the flow equalizer in the length direction, and the two ends of the flow equalizer are equidistantly extended in a direction away from the center point with the connection point of the liquid supply pipe as the center point; One end of the flow divider is arranged on the flow equalizer and communicated with the flow equalizer, and the other end is communicated with the electroplating channel to transport the electroplating solution into the electroplating channel.

6. The vertical electroplating equipment according to claim 4, characterized in that: The liquid supply assembly further comprises a jet pipe, which comprises a jet main pipe and a jet branch pipe, one end of the jet main pipe is connected to the liquid circulation mechanism, and the other end is connected to the jet branch pipe; The jet branch pipe is provided with a nozzle, and the nozzle is connected with the electroplating sub-tank; The first partition plate is provided with a plurality of liquid supply ports, and the liquid passage corresponds to the position of at least one of the liquid supply ports; The number of the liquid supply ports and the nozzles located below the same electroplating channel is equal and their positions correspond to each other. The nozzles are connected to the electroplating channel through the liquid supply ports so that the electroplating liquid flows into the liquid passage through the jet pipe.

7. The vertical electroplating equipment according to claim 4, characterized in that: The liquid circulation mechanism at least comprises a liquid storage tank, a circulation pump and a circulation pipeline; The circulation pipeline includes a circulation liquid inlet pipe and a circulation liquid outlet pipe, the liquid supply pipe and the jet pipe are both connected to the circulation liquid outlet pipe, and the circulation liquid outlet pipe is connected to the liquid outlet of the liquid storage barrel; A second partition is also provided in the electroplating tank, and the electroplating tank is divided into an electroplating sub-tank, a liquid supply tank and a liquid storage tank from top to bottom in sequence by the first partition and the second partition arranged horizontally, and the liquid storage tank is located below the liquid supply tank and is independent of the liquid supply tank; The electroplating sub-tank has a circulation tank connected to the liquid storage tank, and the circulation tank is independent of the liquid supply tank; One end of the circulating liquid inlet pipe is connected to the circulating pump, and the other end is connected to the liquid storage tank, and the circulating pump is connected to the liquid storage tank; A filter is provided at one end of the circulating liquid inlet pipe connected to the liquid storage tank. The filter is located in the liquid storage tank. A plurality of filter holes are provided on the filter. The electroplating liquid in the electroplating sub-tank flows through the circulating tank, the liquid storage tank, the filter and the circulating liquid inlet pipe in sequence and enters the liquid storage barrel.

8. The vertical electroplating equipment according to any one of claims 1 to 7, characterized in that: The cathode unit includes a conductive component and a mounting component; The mounting assembly at least comprises a cathode support frame and a cathode connecting rod, wherein the cathode support frame is used to mount the workpiece to be electroplated, and the cathode support frame is mounted on the cathode connecting rod; The conductive assembly at least includes a conductive block, a substrate is provided along the length of the electroplating tank, a conductive strip is provided on the substrate, the conductive block is connected to the end of the cathode connecting rod, and the conductive block is in contact with the conductive strip; Among them, the workpiece to be electroplated is electrically connected to the conductive block through a conductive wire, and the negative pole of the power supply is electrically connected to the conductive strip; when the driving mechanism pushes the cathode unit and the cathode unit moves along the length of the electroplating tank, the conductive block transmits the electrical energy obtained by contacting the conductive strip to the workpiece to be electroplated.

9. The vertical electroplating equipment according to claim 8, characterized in that: The cathode support frame comprises a support frame body and a bearing frame body, wherein the support frame body is connected to the bearing frame body, the bearing frame body has a bearing slot, and the bearing slot can be used for installing the electroplated parts; The orthographic projection area of ​​the bearing groove on a preset vertical plane is larger than the orthographic projection area of ​​the workpiece to be electroplated on the same preset vertical plane; A plurality of bearing blocks are arranged in the bearing tank, and the plurality of bearing blocks are arranged along the inner wall of the bearing tank. When the workpiece to be electroplated is installed in the bearing tank, the bearing blocks contact the edge of the workpiece to be electroplated to support the workpiece to be electroplated; The cathode support frame is provided with a fifth baffle and a sixth baffle. When the workpiece to be electroplated is installed in the supporting groove, the fifth baffle corresponds to the lower edge position of the workpiece to be electroplated, and the sixth baffle corresponds to the upper edge position of the workpiece to be electroplated.

10. The vertical electroplating equipment according to claim 9, characterized in that: The support frame body has a first support portion and a second support portion, two ends of the first support portion are respectively connected to two second support portions, and one end of the second support portion is away from the first support portion and extends to both sides respectively, and is connected to the support frame body; The cathode connecting rod is provided with a connecting rod supporting groove for mounting the first supporting part; Two support blocks are arranged on the first support portion, and the distance between the two support blocks is adapted to the width of the cathode connecting rod, so that the cathode connecting rod can be inserted between the two support blocks to limit the movement range of the cathode support frame.

11. The vertical electroplating equipment according to claim 8, characterized in that: The driving mechanism at least includes a driving bracket, a transmission member, a driving source and a pushing member; The transmission member is rotatably disposed on the driving bracket, the pushing member is connected to the transmission member, and the driving source is disposed on the driving bracket and connected to the transmission member to drive the transmission member to drive the pushing member to cyclically rotate; When the pusher rotates to the top of the electroplating tank, it contacts the cathode connecting rod and pushes it to move along the length of the electroplating tank.

12. The vertical electroplating equipment according to claim 11, characterized in that: The transmission member circulates and rotates on the driving bracket in an elliptical trajectory. The driving source includes a transmission wheel and a motor. The motor and the transmission wheel are respectively arranged on two sides of the driving bracket. The transmission member is sleeved on the transmission wheel. The output shaft of the motor passes through the driving bracket and is connected to the transmission wheel to drive the transmission wheel to drive the transmission member to rotate.

13. The vertical electroplating equipment according to claim 11, characterized in that: The transmission member arranged on the driving bracket performs circular rotation in the vertical direction, and the transmission member has two horizontal movement areas and two rotation areas when cyclically rotating, and the two horizontal movement areas are respectively at a first height and a second height, the distance between the first height and the electroplating tank is L1, the distance between the second height and the electroplating tank is L2, and L1<L2; when the pushing member is at the first height, the end of the pushing member away from the transmission member can contact the cathode connecting rod, and the pushing member applies a thrust to the cathode connecting rod under the drive of the transmission member, so that the cathode connecting rod moves with the pushing member; when the pushing member is at the second height, the end of the pushing member away from the transmission member can be out of contact with the cathode connecting rod; The pushing member includes a pushing base and a pushing rod, the pushing base is connected to the transmission member, one end of the pushing rod is arranged on the pushing base, and the other end extends away from the pushing base to the middle part of the cathode connecting rod; The push rod and the push base are connected by a rotation in the vertical direction to adjust the height of the push rod; The push rod is provided with a push plate; The push plate and the cathode connecting rod are provided with magnetic attraction structures that cooperate with each other.

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