Main control board heat dissipation device, air conditioning system and method

Abstract

The invention relates to the technical field of air conditioners, and provides a main control board heat dissipation device, an air conditioner system and a method, the heat dissipation device comprises a main heat dissipation assembly, an auxiliary heat dissipation assembly and a heat conduction component, the main heat dissipation assembly comprises a main heat dissipation substrate and a semiconductor refrigeration unit, and the semiconductor refrigeration unit is embedded in the main heat dissipation substrate; the auxiliary heat dissipation assembly comprises an auxiliary heat dissipation substrate, a water absorption module and a water flow channel, the auxiliary heat dissipation substrate is provided with a containing cavity, the water absorption module is arranged in the containing cavity, and the water flow channel is formed in the auxiliary heat dissipation substrate and the water absorption module; the heat conduction part is connected between the hot end of the main heat dissipation substrate and the auxiliary heat dissipation substrate. The cold end of the main heat dissipation substrate is in contact with the main control board, so that the temperature of the main control board can be quickly reduced; and the condensate water enters the water flow channel in the auxiliary heat dissipation substrate through the water inlet to be absorbed by the water absorption module, and the heat transferred to the water absorption module evaporates the condensate water absorbed by the water absorption module into the environment, so that the heat dissipation efficiency of the main heat dissipation substrate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning, and in particular to a main control board heat dissipation device, an air conditioning system and a method. Background Art

[0002] Air conditioning systems play an indispensable role in modern society and are widely used in various environments to provide people with comfortable temperature regulation. Whether in hot summer or cold winter, air conditioning systems not only improve the comfort of living and working spaces, but also play a key role in maintaining specific environmental conditions in commercial, industrial and medical facilities. Air conditioning systems can significantly improve people's health and work efficiency by precisely controlling indoor temperature, humidity and air quality. Air conditioning systems usually include key components such as compressors, condensers, expansion valves and evaporators.

[0003] In the prior art, when the air conditioning system is operated in a high temperature environment in summer, the outdoor environment temperature is too high and the ventilation of the air conditioning system installation location is not smooth, resulting in a higher local environment temperature of the system. In order to ensure normal operation and prevent the pressure ratio from being too high, the compressor automatically enters the low frequency limit protection state.

[0004] However, when the compressor is in the low-frequency limited frequency protection state, it often runs at a higher frequency, causing the local temperature of the system's computer board (i.e., the main control board) to be too high, which can easily cause the system to shut down for protection. Summary of the invention

[0005] The present invention provides a main control board heat dissipation device, an air conditioning system and a method, which are used to solve the defect in the prior art that the local temperature of the main control board is too high and easily causes the system to shut down for protection, and can quickly remove the local heat of the main control board.

[0006] The present invention provides a main control board heat dissipation device, comprising: The main heat dissipation component comprises a main heat dissipation substrate and a semiconductor refrigeration unit, wherein the semiconductor refrigeration unit is embedded in the main heat dissipation substrate, and the cold end of the main heat dissipation substrate is used to contact with the main control board; An auxiliary heat dissipation component, comprising an auxiliary heat dissipation substrate, a water absorption module and a water flow channel, wherein the auxiliary heat dissipation substrate is configured with a receiving cavity, the water absorption module is arranged in the receiving cavity, the water flow channel is opened in the auxiliary heat dissipation substrate and the water absorption module, and the auxiliary heat dissipation substrate is provided with a water inlet communicated with the water flow channel; The heat-conducting component is connected between the hot end of the main heat-dissipating substrate and the auxiliary heat-dissipating substrate.

[0007] According to a main control board heat dissipation device provided by the present invention, the accommodating cavity is a cavity with openings at both ends, at least one surface of the auxiliary heat dissipation substrate is provided with a heat dissipation plate, the heat dissipation plate is made of water-absorbing material, and the heat dissipation plate is in contact with the water absorption module.

[0008] According to a main control board heat dissipation device provided by the present invention, the heat-conducting component includes a heat-conducting rib and a water-absorbing layer arranged on the surface of the heat-conducting rib, the water-absorbing layer is in contact with the heat dissipation plate at one end close to the auxiliary heat dissipation substrate, and there is a preset distance between the water-absorbing layer and the main heat dissipation substrate at one end away from the auxiliary heat dissipation substrate.

[0009] According to a main control board heat dissipation device provided by the present invention, the auxiliary heat dissipation substrate is provided with a water outlet communicated with the water flow channel.

[0010] According to a main control board heat dissipation device provided by the present invention, the main heat dissipation component includes a plurality of semiconductor refrigeration units, each of the semiconductor refrigeration unit includes at least one semiconductor refrigeration plate, and a controller is arranged on the main heat dissipation substrate. The controller controls the operation of at least one semiconductor refrigeration unit based on the current temperature of the main control board.

[0011] According to a main control board heat dissipation device provided by the present invention, a heat conducting plate is provided on at least one surface of the main heat dissipation substrate.

[0012] The present invention further provides an air conditioning system, comprising a main control board and any one of the main control board heat dissipation devices described above, wherein the cold end of the main heat dissipation substrate is in contact with the main control board.

[0013] According to an air conditioning system provided by the present invention, the water inlet of the water flow channel is connected to a condensate drain pipe.

[0014] The present invention also provides a main control board heat dissipation method, comprising the following steps: Based on the current temperature of the main control board, the corresponding semiconductor refrigeration unit is controlled to work so that the heat of the main control board is transferred to the water absorption module through the heat conduction component; Condensed water enters the water flow channel through the water inlet and is absorbed by the water absorption module; The heat transferred to the water absorption module evaporates the condensed water absorbed by the water absorption module into the environment.

[0015] According to a main control board heat dissipation method provided by the present invention, the control of the corresponding semiconductor refrigeration unit based on the current temperature of the main control board includes: When the current temperature of the main control board is greater than or equal to a first threshold temperature and less than a second threshold temperature, controlling at least one semiconductor refrigeration unit to operate; When the current temperature of the main control board is greater than or equal to a second threshold temperature, at least two semiconductor refrigeration units are controlled to operate; and the second threshold temperature is greater than the first threshold temperature.

[0016] The main control board heat dissipation device and air-conditioning system provided by the present invention are in contact with the main control board through the cold end of the main heat dissipation substrate. The temperature difference between the main control board and the cold end of the main heat dissipation substrate is large, and the temperature of the main control board can be quickly reduced to avoid the problem of system shutdown protection caused by excessive temperature of the main control board; and the auxiliary heat dissipation substrate is connected to the hot end of the main heat dissipation substrate through a heat-conducting component, and condensed water enters the internal water flow channel of the auxiliary heat dissipation substrate through the water inlet and is absorbed by the water absorption module. The heat transferred to the water absorption module evaporates the condensed water absorbed by the water absorption module into the environment, and the evaporation phase change process of the condensed water can take away a large amount of heat, thereby significantly improving the heat dissipation efficiency of the main heat dissipation substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the main structure of the main control board heat dissipation device provided by the present invention.

[0019] Figure 2 It is a lateral structural schematic diagram of the main control board heat dissipation device provided by the present invention.

[0020] Figure 3 It is a structural schematic diagram of the main heat dissipation component provided by the present invention.

[0021] Figure 4 It is a structural schematic diagram of the auxiliary heat dissipation component provided by the present invention.

[0022] Figure 5 This is one of the flow diagrams of the main control board heat dissipation method provided by the present invention.

[0023] Figure 6 This is the second flow chart of the main control board heat dissipation method provided by the present invention.

[0024] Reference numerals: 10. Main heat dissipation component; 11. Main heat dissipation substrate; 12. Semiconductor refrigeration unit; 120. Semiconductor refrigeration sheet; 121. First semiconductor refrigeration unit; 122. Second semiconductor refrigeration unit; 123. Third semiconductor refrigeration unit; 13. Water inlet; 14. Water outlet; 15. Controller; 16. Heat conduction plate; 20. Auxiliary heat dissipation component; 21. Auxiliary heat dissipation substrate; 211. Accommodation cavity; 22. Water absorption module; 23. Water flow channel; 24. Heat dissipation plate; 30. Heat-conducting component; 31. Heat-conducting fins; 32. Water-absorbing layer. DETAILED DESCRIPTION

[0025] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0028] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0030] Combine the following Figure 1-Figure 4 The main control board heat dissipation device of the present invention is described.

[0031] The embodiment of the first aspect of the present invention provides a main control board heat dissipation device, such as Figure 1 , Figure 2 and Figure 4 As shown, the main control board heat dissipation device includes a main heat dissipation component 10 , an auxiliary heat dissipation component 20 , and a heat conduction component 30 disposed between the main heat dissipation component 10 and the auxiliary heat dissipation component 20 .

[0032] The main heat dissipation component 10 includes a main heat dissipation substrate 11 and a semiconductor refrigeration unit 12. The semiconductor refrigeration unit 12 is embedded in the main heat dissipation substrate 11. The cold end of the main heat dissipation substrate 11 is used to contact the main control board; the auxiliary heat dissipation component 20 includes an auxiliary heat dissipation substrate 21, a water absorption module 22 and a water flow channel 23. The auxiliary heat dissipation substrate 21 is configured with a accommodating cavity 211. The water absorption module 22 is arranged in the accommodating cavity 211. The water flow channel 23 is opened in the auxiliary heat dissipation substrate 21 and the water absorption module 22. The auxiliary heat dissipation substrate 21 is opened with a water inlet 13 connected to the water flow channel 23; the heat conductive component 30 is connected between the hot end of the main heat dissipation substrate 11 and the auxiliary heat dissipation substrate 21.

[0033] It can be understood that the cold end of the main heat dissipation substrate 11 is attached to the main control board, the hot end of the main heat dissipation substrate 11 is connected to one end of the heat-conducting component 30, and the auxiliary heat dissipation substrate 21 is connected to the other end of the heat-conducting component 30. The main heat dissipation substrate 11 is used to dissipate heat for the main control board, and the heat-conducting component 30 and the auxiliary heat dissipation assembly 20 are used to dissipate heat for the main heat dissipation substrate 11. After the semiconductor refrigeration unit 12 on the main heat dissipation substrate 11 is powered on, the cold end of the main heat dissipation substrate 11 is attached to the heat dissipation side of the main control board. The temperature difference between the main control board and the cold end of the main heat dissipation substrate 11 is large, which can quickly reduce the temperature of the main control board. The heat of the main control board is transferred to the water absorption module 22 of the auxiliary heat dissipation assembly 20 through the heat-conducting component 30; at the same time, the condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 through the water inlet 13 and is absorbed by the water absorption module 22. The heat transferred to the water absorption module 22 evaporates the condensed water absorbed by the water absorption module 22 into the environment. The evaporation phase change process of the condensed water can take away a large amount of heat, which can more efficiently dissipate heat for the main heat dissipation substrate 11.

[0034] The main control board heat dissipation device provided in the embodiment of the present invention contacts the main control board through the cold end of the main heat dissipation substrate 11. The temperature difference between the main control board and the cold end of the main heat dissipation substrate 11 is large, which can quickly reduce the temperature of the main control board and avoid the problem of system shutdown protection caused by excessive temperature of the main control board; and the auxiliary heat dissipation substrate 21 is connected to the hot end of the main heat dissipation substrate 11 through the heat conducting component 30, and the condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 through the water inlet 13 and is absorbed by the water absorption module 22. The heat transferred to the water absorption module 22 evaporates the condensed water absorbed by the water absorption module 22 into the environment. The evaporation phase change process of the condensed water can take away a large amount of heat, thereby significantly improving the heat dissipation efficiency of the main heat dissipation substrate 11.

[0035] It should be noted that the existing refrigerant loop is used to locally dissipate heat for the computer board. According to the flow direction of the refrigerant, the refrigerant flow path passes through the computer board, and the temperature of the refrigerant flowing through is lower than the temperature of the computer board, thereby locally cooling the computer board. However, to dissipate heat for the computer board through the refrigerant loop, it is necessary to add a refrigerant pipeline that cooperates with the computer board in the refrigerant loop, which increases the complexity of the pipeline and the system, has higher requirements for the space outside the air-conditioning system, and increases the risk of refrigerant leakage. In addition, after the refrigerant absorbs the heat of the computer board, it affects the entire cycle process, and when operating under different environmental conditions of cooling and heating, it affects the stability of system performance. In this embodiment, the heat dissipation of the computer board can be achieved through the main heat dissipation component 10, the auxiliary heat dissipation component 20 and the heat-conducting component 30, without the need to add pipelines, and thus will not affect the refrigerant loop and the system.

[0036] In one embodiment of the present invention, Figure 3As shown, the main heat dissipation component 10 includes a plurality of semiconductor refrigeration units 12 , each semiconductor refrigeration unit 12 includes at least one semiconductor refrigeration plate 120 , and a controller 15 is disposed on the main heat dissipation substrate 11 , and the controller 15 is used to control the start and stop of the semiconductor refrigeration unit 12 .

[0037] Among them, each semiconductor refrigeration plate 120 is composed of multiple pairs of P and N type semiconductors. Based on the Peltier effect, after power is turned on, the movement of electrons produces a heat release and endothermic effect at both ends of the P and N type semiconductors, so that the two ends of the semiconductor refrigeration plate can quickly form an environment with low temperature on one side and high temperature on the other side, and the temperature difference is large. In this way, the characteristics of rapid cooling and heating on both sides of the semiconductor refrigeration plate 120 are utilized to increase the local heat dissipation capacity of the electric control board under high temperature conditions.

[0038] It is understandable that a plurality of semiconductor refrigeration units 12 are provided on the main heat dissipation substrate 11, and the controller 15 can control the start and stop of each semiconductor refrigeration unit 12. When the main control board is cooled, at least one semiconductor refrigeration unit 12 can be controlled to work based on the current temperature of the main control board to achieve effective heat dissipation of the main control board. It should be noted here that the higher the temperature of the main control board, the more semiconductor refrigeration units 12 are in working state, that is, the more semiconductor refrigeration sheets 120 are.

[0039] It should be noted that the present embodiment utilizes the main heat dissipation assembly 10 to dissipate heat from the main control board, and the semiconductor refrigeration unit 12 in the main heat dissipation assembly 10 utilizes the semiconductor refrigeration sheet 120, which can achieve efficient heat transfer in a relatively small volume. Since the semiconductor refrigeration sheet 120 is small in volume and light in weight, the heat dissipation device of the present embodiment has a small structure and can be more easily integrated into the existing air conditioning system without significantly changing the structure of the external unit. In addition, the installation position can be flexibly adjusted as needed to optimize the heat dissipation effect.

[0040] For example, the main heat dissipation component 10 includes three semiconductor refrigeration units 12, namely a first semiconductor refrigeration unit 121, a second semiconductor refrigeration unit 122 and a third semiconductor refrigeration unit 123; the controller 15 is embedded in the middle of the main heat dissipation substrate 11, the first semiconductor refrigeration unit 121 includes two semiconductor refrigeration plates 120, and is arranged on both sides of the controller 15 along the first direction; the second semiconductor refrigeration unit 122 includes two parts, and is arranged on both sides of the first semiconductor refrigeration unit 121 along the second direction, each part of the second semiconductor refrigeration unit 122 includes two semiconductor refrigeration plates 120, and is arranged on both sides of the controller 15 along the first direction; the third semiconductor refrigeration unit 123 includes two parts, and is arranged on both sides of the second semiconductor refrigeration unit 122 along the second direction, each part of the third semiconductor refrigeration unit 123 includes four semiconductor refrigeration plates 120, and the four semiconductor refrigeration plates 120 are arranged at intervals along the first direction; wherein the second direction is perpendicular to the first direction.

[0041] The controller 15 obtains the current temperature of the main control board, and controls the first semiconductor refrigeration unit 121 to work when the current temperature of the main control board is greater than or equal to the first threshold temperature and less than the second threshold temperature; controls the first semiconductor refrigeration unit 121 and the second semiconductor refrigeration unit 122 to work when the current temperature of the main control board is greater than or equal to the second threshold temperature and less than the third threshold temperature; controls the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 to work when the current temperature of the main control board is greater than or equal to the third threshold temperature; wherein the first threshold temperature is less than the second threshold temperature, and the second threshold temperature is less than the third threshold temperature. It should be noted that when the current temperature of the main control board is less than the first threshold temperature, it means that the temperature of the main control board is low, and there is no need to dissipate heat and cool the main control board, so the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 are all stopped.

[0042] It should be noted that the number of semiconductor refrigeration units 12 can also be two, four or more, and the specific number can be reasonably determined based on the heat dissipation requirements of the main control board; in addition, the number of semiconductor refrigeration plates 120 of multiple semiconductor refrigeration units 12 can be the same or different.

[0043] Furthermore, each semiconductor refrigeration unit 12 forms an independent circuit, which is connected to a circuit contact, and the circuit contact includes multiple contacts. By connecting different contacts through the controller 15, one circuit can work alone or multiple circuits can work together, thereby achieving precise control of the temperature of different circuit areas.

[0044] Specifically, the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 are respectively recorded as the first circuit, the second circuit and the third circuit, and the circuit contacts include the first contact, the second contact and the third contact; according to the temperature of the main control board, the different circuits of the semiconductor refrigeration plate 120 in the main heat dissipation substrate 11 are started and stopped, and the controller 15 has different actions by monitoring different temperatures of the main control board; specifically, when the current temperature of the main control board is less than the first threshold temperature, the controller 15 does not act, and the main heat dissipation substrate 11 is not powered on; when the current temperature of the main control board is greater than or equal to the first threshold temperature and When the current temperature of the main control board is greater than or equal to the second threshold temperature and less than the third threshold temperature, the controller 15 is connected to the second contact, and the first semiconductor refrigeration unit 121 and the second semiconductor refrigeration unit 122 in the main heat dissipation substrate 11 work simultaneously; when the current temperature of the main control board is greater than or equal to the third threshold temperature, the controller 15 is connected to the third contact, and the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 in the main heat dissipation substrate 11 work simultaneously. It should be noted here that the circuit contact may also include at least one of the fourth contact, the fifth contact, the sixth contact, and the seventh contact; the controller 15 is connected to the fourth contact, and the first semiconductor refrigeration unit 121 and the third semiconductor refrigeration unit 123 in the main heat dissipation substrate 11 work simultaneously; the controller 15 is connected to the fifth contact, and the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 in the main heat dissipation substrate 11 work simultaneously; the controller 15 is connected to the sixth contact, and the second semiconductor refrigeration unit 122 in the main heat dissipation substrate 11 works; the controller 15 is connected to the seventh contact, and the third semiconductor refrigeration unit 123 in the main heat dissipation substrate 11 works. In other embodiments, the circuit contact may include at least one of the first contact, the second contact, the third contact, the fourth contact, the fifth contact, the sixth contact, and the seventh contact.

[0045] The main control board heat dissipation device provided in the embodiment of the present invention controls the operation of the semiconductor refrigeration unit 12 according to the current temperature of the main control board, so as to realize the temperature monitoring and intelligent adjustment of the main control board to adapt to different environmental conditions and user needs.

[0046] In one embodiment of the present invention, Figure 2 As shown, at least one surface of the main heat dissipation substrate 11 is provided with a heat conducting plate 16. Specifically, the upper surface and the lower surface of the main heat dissipation substrate 11 are both covered with the heat conducting plate 16, so that when multiple semiconductor cooling plates 120 work simultaneously, the temperature of both sides (cold end and hot end) of the main heat dissipation substrate 11 is uniform.

[0047] In one embodiment of the present invention, Figure 2 and Figure 4 As shown, the auxiliary heat dissipation substrate 21 is a hollow substrate, and the accommodating cavity 211 is a cavity with openings at both ends. A water absorption module 22 made of a water-absorbing material is arranged in the accommodating cavity 211, and a heat dissipation plate 24 is arranged on the surface of the auxiliary heat dissipation substrate 21. The heat dissipation plate 24 is made of a water-absorbing material and is in contact with the water absorption module 22.

[0048] It can be understood that the condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 from the water inlet 13, is absorbed by the water absorption module 22, and gradually expands toward the heat dissipation plate 24 attached to the surface of the auxiliary heat dissipation substrate 21, so that the heat dissipation plate 24 is saturated with water. The heat can evaporate the condensed water adsorbed in the heat dissipation plate 24 into the environment, thereby more efficiently dissipating the heat for the main heat dissipation substrate 11.

[0049] In this embodiment, the auxiliary heat dissipation substrate 21 is a hollow substrate, and the accommodating cavity 211 is arranged along the length direction of the auxiliary heat dissipation substrate 21. The water-absorbing material is evenly attached to the lower surface of the auxiliary heat dissipation substrate 21 to form a heat dissipation plate 24 on the lower surface of the auxiliary heat dissipation substrate 21; and the water-absorbing material is arranged in the cavity in the middle of the auxiliary heat dissipation substrate 21 to form a water-absorbing module 22 in the cavity of the auxiliary heat dissipation substrate 21; and then the water-absorbing material is evenly attached to the upper surface of the auxiliary heat dissipation substrate 21 to form a heat dissipation plate 24 on the upper surface of the auxiliary heat dissipation substrate 21. Of course, in other embodiments, the water-absorbing module 22 can also be prepared with a water-absorbing material first, and then embedded in the accommodating cavity 211 of the auxiliary heat dissipation substrate 21.

[0050] In one embodiment of the present invention, Figure 1 and Figure 2 As shown, the heat-conducting component 30 includes a plurality of heat-conducting elements arranged at intervals, one end of the heat-conducting element is connected to the hot end of the main heat-dissipating substrate 11 , and the other end of the heat-conducting element is connected to the auxiliary heat-dissipating substrate 21 .

[0051] Furthermore, the heat conducting member adopts a heat conducting fin 31, and a water absorbing layer 32 is arranged on the surface of the heat conducting fin 31. The end of the water absorbing layer 32 close to the auxiliary heat dissipation substrate 21 contacts the heat dissipation plate 24, and the end of the water absorbing layer 32 away from the auxiliary heat dissipation substrate 21 has a preset distance from the main heat dissipation substrate 11.

[0052] It can be understood that the main heat dissipation substrate 11 and the auxiliary heat dissipation substrate 21 are connected by the heat-conducting ribs 31, and the water-absorbing material is evenly attached to the lower surface of the heat-conducting ribs 31 to form a water-absorbing layer 32 on the lower surface of the heat-conducting ribs 31. The condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 from the water inlet 13, is absorbed by the water-absorbing module 22, and gradually expands toward the heat dissipation plates 24 attached to the surfaces of both sides of the water-absorbing module 22, so that the heat dissipation plates 24 are saturated with water, and the water-absorbing layer 32 on the surface of the heat-conducting ribs 31 expands through the heat dissipation plates 24, so that the water-absorbing material attached to the surface of the auxiliary heat dissipation substrate 21 and the surface of the heat-conducting ribs 31 is saturated with water, and the heat transferred to the main heat dissipation substrate 11 evaporates the condensed water adsorbed by the water-absorbing material into the environment, thereby improving the heat dissipation efficiency of the main heat dissipation substrate 11.

[0053] It should be noted that the existing semiconductor cooling chip 120 heat dissipation cannot accurately control the number of operations, and the heat at the hot end of the semiconductor cooling chip 120 is not easy to dissipate. However, this embodiment can control the number of operations of the semiconductor cooling chip 120 according to the current temperature of the main control board, and quickly dissipate the heat at the hot end of the semiconductor cooling chip 120 through the auxiliary heat dissipation component 20 and the heat conduction component 30.

[0054] In one embodiment of the present invention, Figure 4 As shown, the auxiliary heat dissipation substrate 21 is provided with a water outlet 14 connected to the water flow channel 23 so that when the water absorbing material (water absorbing module 22, heat dissipation plate 24, water absorbing layer 32) is saturated with water, excess condensed water can be discharged through the water outlet 14.

[0055] Specifically, the length direction of the auxiliary heat dissipation substrate 21 is the same as the length direction of the water absorption module 22, the water flow channel 23 is arranged along the length direction of the water absorption module 22, the auxiliary heat dissipation substrate 21 and the water absorption module 22 have through holes from left to right as the water flow channel 23, and the auxiliary heat dissipation substrate 21 is provided with a water inlet 13 connected to the water flow channel 23 on one side along the length direction, and the auxiliary heat dissipation substrate 21 is provided with a water outlet 14 on the other side along the length direction. Preferably, the water inlet 13 is connected to the indoor condenser drain pipe.

[0056] During the actual working process, heat is transferred from the main control board to the lower end (hot end) of the main heat dissipation substrate 11, and further dissipated through the heat conducting fins 31 and the auxiliary heat dissipation substrate 21. Condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 from the water inlet 13, is absorbed by the water absorption module 22, and gradually expands to the heat dissipation plates 24 attached to the surfaces of the water absorption module 22 on both sides, so that the heat dissipation plates 24 are saturated with water, and the water absorption layer 32 on the surface of the heat conducting fins 31 is expanded through the heat dissipation plates 24, so that the water-absorbing material attached to the surface of the auxiliary heat dissipation substrate 21 and the surface of the heat conducting fins 31 is saturated with water. The heat can evaporate the condensed water adsorbed in the water-absorbing material into the environment, and is taken away by forced convection heat exchange by an external fan. A large amount of heat can be taken away during the evaporation phase change of the condensed water, which is helpful for the heat dissipation of the main heat dissipation substrate 11. When the water-absorbing material is saturated with water, the excess condensed water is discharged through the water outlet 14.

[0057] It should be noted that the auxiliary heat dissipation substrate 21 is far away from the main heat dissipation substrate 11 and the main control board. The condensed water in the auxiliary heat dissipation substrate 21 does not pose a threat to the safety of the main control board circuit. At the same time, after the water-absorbing material is saturated with water, the excess condensed water is discharged through the water outlet 14, which will not pose a threat to the main control board circuit.

[0058] An embodiment of the second aspect of the present invention provides an air conditioning system, which includes a main control board and a main control board heat dissipation device provided by any of the above embodiments, wherein the cold end of the main heat dissipation substrate 11 is in contact with the main control board.

[0059] It can be understood that the main control board heat dissipation device controls the operation of the corresponding semiconductor refrigeration unit 12 based on the current temperature of the main control board, so that the heat of the main control board is transferred to the water absorption module 22 through the heat conduction component 30; the condensed water enters the water flow channel 23 through the water inlet 13 and is absorbed by the water absorption module 22; the heat transferred to the water absorption module 22 evaporates the condensed water absorbed by the water absorption module 22 into the environment, so as to dissipate the heat of the auxiliary heat dissipation substrate 21, thereby realizing rapid cooling of the main control board and avoiding the problem of system shutdown protection caused by excessive temperature of the main control board.

[0060] Furthermore, the air conditioning system includes a condensate drain pipe, which is used to drain the condensate generated by the evaporator. During the air conditioning refrigeration process, the moisture in the air will condense into water droplets when it is cold on the surface of the evaporator (cooling coil), and these water droplets will then gather to form condensate. At present, in order to prevent the condensate from accumulating inside the air conditioner or leaking into the room, it is guided out and discharged to an appropriate place through a condensate drain pipe. The water inlet 13 of the water flow channel 23 of this embodiment is connected to the condensate drain pipe, and the heat dissipation of the auxiliary heat dissipation substrate 21 utilizes the condensate drain pipe of the original air conditioning system, which reduces the cost; and the main control board heat dissipation device of this embodiment can be directly adapted to the existing air conditioning system, avoiding complex modification projects and reducing installation costs.

[0061] Based on the main control board heat dissipation device provided in any of the above embodiments, the embodiment of the third aspect of the present invention proposes a main control board heat dissipation method, such as Figure 5 As shown, the method comprises the following steps: Step 100 : Based on the current temperature of the main control board, the corresponding semiconductor refrigeration unit 12 is controlled to operate so that the heat of the main control board is transferred to the water absorption module 22 through the heat conduction component 30 .

[0062] Step 200 : Condensed water enters the water flow channel 23 through the water inlet 13 and is absorbed by the water absorption module 22 .

[0063] Step 300: The heat transferred to the water absorption module 22 evaporates the condensed water absorbed by the water absorption module 22 into the environment.

[0064] It can be understood that the cold end of the main heat dissipation substrate 11 is attached to the main control board, the hot end of the main heat dissipation substrate 11 is connected to one end of the heat-conducting component 30, and the auxiliary heat dissipation substrate 21 is connected to the other end of the heat-conducting component 30. The main heat dissipation substrate 11 is mainly used to dissipate heat for the main control board, and the heat-conducting component 30 and the auxiliary heat dissipation assembly 20 are used to dissipate heat for the main heat dissipation substrate 11. After the semiconductor refrigeration unit 12 on the main heat dissipation substrate 11 is powered on, the cold end of the main heat dissipation substrate 11 is attached to the heat dissipation side of the main control board. The temperature difference between the main control board and the cold end of the main heat dissipation substrate 11 is large, which can quickly reduce the temperature of the main control board, and the heat of the main control board is transferred to the water absorption module 22 through the heat-conducting component 30; at the same time, the condensed water enters the internal water flow channel 23 of the auxiliary heat dissipation substrate 21 through the water inlet 13, and is absorbed by the water absorption module 22. The heat transferred to the water absorption module 22 evaporates the condensed water absorbed by the water absorption module 22 into the environment. The evaporation phase change process of the condensed water can take away a large amount of heat, which can more efficiently dissipate the heat for the main heat dissipation substrate 11.

[0065] Optional, such as Figure 6 As shown, step 100, based on the current temperature of the main control board, controls the corresponding semiconductor refrigeration unit 12 to work, which may specifically include the following steps: Step 110 : When the current temperature of the main control board is greater than or equal to the first threshold temperature and less than the second threshold temperature, control at least one semiconductor refrigeration unit 12 to operate.

[0066] Step 120 , when the current temperature of the main control board is greater than or equal to a second threshold temperature, control at least two semiconductor refrigeration units 12 to operate; the second threshold temperature is greater than the first threshold temperature.

[0067] It can be understood that a plurality of semiconductor refrigeration units 12 are arranged on the main heat dissipation substrate 11, and the controller 15 can control the start and stop of each semiconductor refrigeration unit 12. When the main control board is cooled, at least one semiconductor refrigeration unit 12 can be controlled to work based on the current temperature of the main control board to achieve effective heat dissipation of the main control board; wherein, the higher the temperature of the main control board, the more semiconductor refrigeration units 12 are in working state.

[0068] For example, the main heat dissipation component 10 includes three semiconductor refrigeration units 12, namely a first semiconductor refrigeration unit 121, a second semiconductor refrigeration unit 122 and a third semiconductor refrigeration unit 123; the controller 15 obtains the current temperature of the main control board. When the current temperature of the main control board is less than the first threshold temperature, it indicates that the temperature of the main control board is low and there is no need to dissipate heat and cool the main control board, so the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 are all stopped; when the current temperature of the main control board is greater than or equal to the first threshold temperature and less than the second threshold temperature, the first semiconductor refrigeration unit 121 is controlled to work; when the current temperature of the main control board is greater than or equal to the second threshold temperature and less than the third threshold temperature, the first semiconductor refrigeration unit 121 and the second semiconductor refrigeration unit 122 are controlled to work; when the current temperature of the main control board is greater than or equal to the third threshold temperature, the first semiconductor refrigeration unit 121, the second semiconductor refrigeration unit 122 and the third semiconductor refrigeration unit 123 are controlled to work; wherein, the first threshold temperature is less than the second threshold temperature, and the second threshold temperature is less than the third threshold temperature.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A main control board heat dissipation device, characterized in that: include: The main heat dissipation component comprises a main heat dissipation substrate and a semiconductor refrigeration unit, wherein the semiconductor refrigeration unit is embedded in the main heat dissipation substrate, and the cold end of the main heat dissipation substrate is used to contact with the main control board; An auxiliary heat dissipation component, comprising an auxiliary heat dissipation substrate, a water absorption module and a water flow channel, wherein the auxiliary heat dissipation substrate is configured with a receiving cavity, the water absorption module is arranged in the receiving cavity, the water flow channel is opened in the auxiliary heat dissipation substrate and the water absorption module, and the auxiliary heat dissipation substrate is provided with a water inlet communicated with the water flow channel; The heat-conducting component is connected between the hot end of the main heat-dissipating substrate and the auxiliary heat-dissipating substrate.

2. The main control board heat dissipation device according to claim 1, characterized in that: The accommodating cavity is a cavity with openings at both ends. A heat dissipation plate is provided on at least one surface of the auxiliary heat dissipation substrate. The heat dissipation plate is made of a water-absorbing material and is in contact with the water absorption module.

3. The main control board heat dissipation device according to claim 2, characterized in that: The heat conduction component includes heat conduction fins and a water absorption layer arranged on the surface of the heat conduction fins, the water absorption layer is in contact with the heat dissipation plate at one end close to the auxiliary heat dissipation substrate, and there is a preset distance between the water absorption layer and the main heat dissipation substrate at one end away from the auxiliary heat dissipation substrate.

4. The main control board heat dissipation device according to claim 1, characterized in that: The auxiliary heat dissipation substrate is provided with a water outlet communicated with the water flow channel.

5. The main control board heat dissipation device according to any one of claims 1 to 4, characterized in that: The main heat dissipation component includes a plurality of semiconductor refrigeration units, each of which includes at least one semiconductor refrigeration plate. A controller is provided on the main heat dissipation substrate, and the controller controls the operation of at least one semiconductor refrigeration unit based on the current temperature of the main control board.

6. The main control board heat dissipation device according to claim 5, characterized in that: At least one surface of the main heat dissipation substrate is provided with a heat conduction plate.

7. An air conditioning system, characterized in that: It comprises a main control board and the main control board heat dissipation device according to any one of claims 1 to 6, wherein the cold end of the main heat dissipation substrate is in contact with the main control board.

8. The air conditioning system according to claim 7, characterized in that: The water inlet of the water flow channel is connected to the condensed water drain pipe.

9. A main control board heat dissipation method, characterized in that: include: Based on the current temperature of the main control board, the corresponding semiconductor refrigeration unit is controlled to work so that the heat of the main control board is transferred to the water absorption module through the heat conduction component; Condensed water enters the water flow channel through the water inlet and is absorbed by the water absorption module; The heat transferred to the water absorption module evaporates the condensed water absorbed by the water absorption module into the environment.

10. The main control board heat dissipation method according to claim 9, characterized in that: The method of controlling the operation of the corresponding semiconductor refrigeration unit based on the current temperature of the main control board includes: When the current temperature of the main control board is greater than or equal to a first threshold temperature and less than a second threshold temperature, controlling at least one semiconductor refrigeration unit to operate; When the current temperature of the main control board is greater than or equal to a second threshold temperature, at least two semiconductor refrigeration units are controlled to operate; and the second threshold temperature is greater than the first threshold temperature.

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