Ceramic chip circuit board insulativity testing device and testing method thereof

Abstract

The invention belongs to the technical field of circuit board testing, and discloses a ceramic chip circuit board insulativity testing device and a testing method thereof.The ceramic chip circuit board insulativity testing device comprises a detection table and a testing mechanism, an adaptation opening is formed in the top of the detection table, a lifting supporting part is arranged in the adaptation opening in a sleeved mode, and a composite processing assembly is fixedly arranged at the top of the detection table; and one end of the composite processing assembly is located in the adaptive port. Through cooperation of the composite processing assembly, the air supply assembly, the lifting supporting part and the clamping assembly, clamping and suspension processing of the placed circuit board are achieved, the bottom and the top of the circuit board have enough operation space after the circuit board is positioned, and a second air spraying pipe and a first air spraying pipe which are distributed up and down rotate synchronously, so that the circuit board is not prone to falling off. The pressure air is blown out, the upper surface and the lower surface of the circuit board before testing are blown and cleaned in cooperation with blowing treatment of the upper surface and the lower surface, the blowing area is large, the cleaning effect is good, and the situation that residual particles affect the connection testing effect is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board testing, and in particular relates to a ceramic circuit board insulation testing device and a testing method thereof. Background Art

[0002] Ceramic circuit board is a substrate for electronic components. It is made of ceramic materials and has excellent electrical properties, thermal conductivity and mechanical strength. Its structure usually includes multiple layers and components. The ceramic circuit board insulation test device is mainly used to detect the electrical insulation performance of ceramic materials to ensure that the ceramic circuit board will not cause short circuit or equipment damage due to insulation failure in actual application.

[0003] In the prior art, the ceramic circuit board insulation test device usually places the ceramic circuit board stably on the work surface during the test operation, and connects the test connection terminal to the circuit board by firmly plugging it, and performs the test operation on the circuit board in conjunction with the test instrument to achieve insulation detection. However, during the actual test process, the circuit board is affected by surface dust and impurities, which affects the contact quality of the connection contact surface, causing unstable test data, and in multiple groups of test operations, the circuit board experiences local heating, which further affects the test quality, greatly reduces the test accuracy, and has a poor use effect. Summary of the invention

[0004] The object of the present invention is to provide a ceramic circuit board insulation testing device and a testing method thereof to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a ceramic circuit board insulation test device and a test method thereof, comprising a test platform and a test mechanism, the top of the test platform is provided with an adapter port, the interior of the adapter port is sleeved with a lifting support part, the top of the test platform is fixedly provided with a composite processing component, one end of the composite processing component is located in the adapter port, and the other end is located above the adapter port, the back of the test platform is fixedly provided with an air supply component, the air supply component inputs pressurized air into the composite processing component, clamping components are provided on both sides of the top of the test platform, a compression component is fixedly provided inside the adapter port, an intermediate tube is fixedly connected between the compression component and the clamping component, the compression component controls the movement of the clamping component, the composite processing component comprises an air jet pipe 1, an air jet pipe 2, a side pipe, a side shaft, a gear 1 and a support plate, the outer surfaces of the air jet pipe 1 and the air jet pipe 2 are provided with surrounding air outlet holes, the air jet pipe 1 is rotatably sleeved in the adapter port, and the air jet pipe 2 is rotatably located above the adapter port.

[0006] Preferably, the lifting support part includes a movable platform, a base plate, an electric push rod and an adapter groove, the movable platform is movably sleeved in the adapter mouth, the base plate is fixedly connected in the adapter mouth, the electric push rod is fixedly installed on the top surface of the base plate, the movable end of the electric push rod is fixedly connected to the movable platform, and the adapter groove is opened on the top of the movable platform.

[0007] Preferably, a slide groove is provided on the top of the detection platform, the slide groove is located on both sides of the adapter port and is communicated with the adapter port, and sleeve holes are provided on both sides of the detection platform.

[0008] Preferably, the left ends of the jet pipe one and the jet pipe two are fixedly connected to and communicated with the side pipe, the right ends of the jet pipe one and the jet pipe two are fixedly connected to the side shaft, the side pipes and the side shaft at both ends of the jet pipe one are rotatably sleeved in the detection table, the side pipes and the side shaft at both ends of the jet pipe two are rotatably sleeved with the support plate, the support plate is fixedly connected to the top of the detection table, the gear one is fixedly sleeved on the outer surface of the side shaft, and the two sets of gears one are meshed with each other.

[0009] Preferably, a power unit is fixedly provided on the front side of the test bench, and the power unit includes a rotating motor and gear 2. The rotating motor controls the rotation of gear 2 sleeved on the output shaft, gear 2 is meshed and connected with gear 1, and the testing mechanism is fixed on both sides of the top of the test bench.

[0010] Preferably, the air supply assembly includes an air pump and a connecting sleeve, the connecting sleeve is connected to the air outlet end of the air pump, and the connecting sleeve is connected to the two groups of side pipes.

[0011] Preferably, the clamping assembly includes a push rod, a push plate, an elastic clamping pad, a distribution sleeve and a spring. The push plate is slidably sleeved in the slide groove, one end of the push rod is fixedly connected to the push plate, and the other end is movably sleeved in the sleeve hole, the elastic clamping pad is fixedly connected to the front side of the push plate, the distribution sleeve is fixedly connected to the side of the detection table and communicated with the sleeve hole, one end of the spring is fixed in the distribution sleeve, and the other end is fixedly connected to the push rod.

[0012] Preferably, the compression assembly includes a connecting sleeve, an intermediate frame, a sleeve rod, a piston plate and a second spring. The connecting sleeve is fixedly connected to the top of the intermediate frame and is connected to the interior of the intermediate frame. The two ends of the intermediate frame are respectively fixedly connected and connected to the intermediate tubes on both sides. The sleeve rod is movably sleeved on the top of the connecting sleeve. The piston plate is movably sleeved inside the connecting sleeve and fixedly connected to the inner end of the sleeve rod. One end of the second spring is fixed in the connecting sleeve, and the other end is fixedly connected to the piston plate. The sleeve rod is located on the moving path of the movable platform.

[0013] A testing method for a ceramic circuit board insulation testing device comprises the following testing steps:

[0014] Step 1: Place the circuit board to be tested on the top of the lifting support part, start the lifting support part, and as the movable table moves downward, push the compression assembly downward, so that the compression assembly further squeezes the lubricating oil filled inside into the sleeve hole through the middle tube, so that the clamping assemblies on both sides move close synchronously, and quickly clamp and fix the circuit board on the top of the lifting support part;

[0015] Step 2: The circuit board is then clamped and fixed and placed in the air, and the power unit is started, which drives the composite processing assembly to rotate. The first jet pipe in the composite processing assembly rotates below the circuit board, and the second jet pipe rotates above the circuit board.

[0016] Step 3: Start the air supply component, input the pressurized air into the composite processing component, and the first jet pipe rotates the pressurized air and sprays it toward the bottom of the circuit board for cleaning, and the second jet pipe rotates the pressurized air and sprays it toward the top of the circuit board for cleaning, and the dust removal on the bottom of the circuit board is completed;

[0017] Step 4: Hold the external terminal so that one end of the terminal is electrically connected to the test mechanism and the other end is electrically connected to the clamped circuit board. Start the test. During the test, the circuit board is purged from top to bottom to reduce the surface temperature and complete the test.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The present invention realizes the clamping and suspension processing of the circuit board after placement by utilizing the coordinated effects of the composite processing component, the air supply component, the lifting support part, and the clamping component, so that the circuit board has sufficient operating space at the bottom and the top after positioning, and the air jet pipe 2 and the air jet pipe 1 distributed up and down, under synchronous rotation, blow out the pressurized air, and cooperate with the upper and lower purging processing to purge and clean the upper and lower surfaces of the circuit board before testing, with a large purging area and good cleaning effect, avoiding residual particles from affecting the connection test effect.

[0020] 2. The present invention utilizes the synchronous purge effect of the upper and lower surfaces again. During the actual test process, by maintaining a continuous and stable purge process, the circuit board under power-on test is cooled to avoid rapid damage in the event of overheating and to promptly handle the overheating problem.

[0021] 3. The present invention utilizes the cooperation between the lifting support part and the clamping assembly and the linkage compression effect of the compression assembly. When the bottom space of the circuit board is moved down to open, the hydraulic pressure in the compression assembly is simultaneously utilized to achieve synchronous action of the clamping assemblies on both sides, thereby achieving quick clamping. There is no need for dedicated clamping power. Synchronous control can be achieved by using the lifting support part, which reduces the investment in power equipment and has a good comprehensive use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the present invention;

[0023] Figure 2 It is a schematic diagram of the lifting support part of the present invention;

[0024] Figure 3 It is an explosion diagram of the composite processing component and the gas supply component of the present invention;

[0025] Figure 4 It is a schematic diagram of the connection between the clamping assembly and the compression assembly of the present invention;

[0026] Figure 5 is a cross-sectional schematic diagram of a compression assembly of the present invention;

[0027] Figure 6 It is a cross-sectional schematic diagram of the distribution sleeve of the present invention;

[0028] Figure 7 It is a cross-sectional schematic diagram of the detection platform of the present invention.

[0029] In the figure: 1. testing table; 2. adapter; 3. lifting support; 31. movable table; 32. bottom plate; 33. electric push rod; 34. adapter slot; 4. composite processing assembly; 41. jet pipe 1; 42. jet pipe 2; 43. side pipe; 44. side shaft; 45. gear 1; 46. support plate; 5. air supply assembly; 51. air pump; 52. connecting sleeve; 6. power unit; 7. clamping assembly; 71. push rod; 72. push plate; 73. elastic clamping pad; 74. distribution sleeve; 75. spring 1; 8. middle pipe; 9. compression assembly; 91. connecting sleeve; 92. middle frame; 93. sleeve rod; 94. piston plate; 95. spring 2; 10. slide groove; 11. sleeve hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figures 1 to 7As shown, the embodiment of the present invention provides a ceramic circuit board insulation test device and a test method thereof, including a test platform 1 and a test mechanism, the top of the test platform 1 is provided with an adapter port 2, the interior of the adapter port 2 is provided with a lifting support portion 3, the top of the test platform 1 is fixedly provided with a composite processing component 4, one end of the composite processing component 4 is located in the adapter port 2, and the other end is located above the adapter port 2, the back of the test platform 1 is fixedly provided with an air supply component 5, the air supply component 5 inputs pressurized air into the composite processing component 4, and the top of the test platform 1 is provided with a plurality of air supply components 5. Clamping assemblies 7 are provided on both sides, a compression assembly 9 is fixedly provided inside the adapter 2, an intermediate tube 8 is fixedly connected between the compression assembly 9 and the clamping assembly 7, and the compression assembly 9 controls the movement of the clamping assembly 7. The composite processing assembly 4 includes an air jet pipe 1 41, an air jet pipe 2 42, a side pipe 43, a side shaft 44, a gear 1 45 and a support plate 46. The outer surfaces of the air jet pipe 1 41 and the air jet pipe 2 42 are provided with circumferentially distributed air outlet holes. The air jet pipe 1 41 is rotatably sleeved in the adapter 2, and the air jet pipe 2 42 is rotatably located above the adapter 2.

[0032] Embodiment: When in use, place the circuit board to be tested on the top of the lifting support part 3, start the lifting support part 3, and the electric push rod 33 drives the movable platform 31 to move downward. As the movable platform 31 moves downward, the compression assembly 9 is pushed downward, and the movable platform 31 pushes the sleeve rod 93, so that the sleeve rod 93 drives the piston plate 94 to move downward in the connecting sleeve 91 and squeezes the internal lubricating oil. The lubricating oil pressure increases, so that the compression assembly 9 further squeezes the lubricating oil filled inside into the sleeve hole 11 through the intermediate pipe 8. The hydraulic oil located in the sleeve hole 11 applies hydraulic pressure to the inner end of the push rod 71, so that the push rod 71 and the push plate 72 move synchronously, and the clamping assemblies 7 on both sides move close synchronously, so that the push plates 72 on both sides are pressed against the two sides of the circuit board through the elastic clamping pads 73, and the circuit board on the top of the lifting support part 3 is quickly clamped and fixed, and then the circuit board is fixed and kept suspended, and the power unit 6 is started. The rotating motor in 6 drives the gear 1 45 to rotate through the gear 2, thereby driving the jet pipe 1 41 and the jet pipe 2 42 in the composite processing component 4 to rotate. The jet pipe 1 41 in the composite processing component 4 is located below the circuit board and rotates, and the jet pipe 2 42 is located above the circuit board and rotates. The air supply component 5 is started, and the pressurized air is input into the composite processing component 4. The pressurized air is respectively input into the jet pipe 1 41 and the jet pipe 42 through two side pipes 43 distributed up and down, and the jet pipe 1 41 rotates the pressurized air and sprays it toward the bottom of the circuit board for cleaning, and the jet pipe 2 42 rotates the pressurized air and sprays it toward the top of the circuit board for cleaning. The dust removal and cleaning of the upper and lower parts of the circuit board are completed, and the external wiring terminal is held so that one end of the wiring terminal is electrically connected to the test mechanism, and the other end is electrically connected to the clamped circuit board. The test is started. During the test, the circuit board keeps being purged from top to bottom, the surface temperature is reduced, and the test is completed.

[0033] First, by utilizing the coordinated action of the composite processing component 4, the air supply component 5, the lifting support part 3, and the clamping component 7, the clamping and suspension processing of the circuit board after placement is realized, so that the circuit board has sufficient operating space at the bottom and top after positioning, and the jet pipe 2 42 and the jet pipe 1 41 distributed up and down, while rotating synchronously, blow out the pressurized air, and cooperate with the upper and lower purging processing to clean the upper and lower surfaces of the circuit board before testing, with a large purging area and good cleaning effect, to avoid residual particles affecting the connection test effect.

[0034] In addition, by again utilizing the synchronous purge effect of the upper and lower surfaces, during the actual test process, by maintaining a continuous and stable purge process, the circuit board under power-on test is cooled to avoid rapid damage in the event of overheating and to promptly handle the overheating problem.

[0035] On the other hand, by utilizing the cooperation between the lifting support part 3 and the clamping assembly 7 and utilizing the linkage compression effect of the compression assembly 9, when moving downward to open the bottom space of the circuit board, the hydraulic pressure in the compression assembly 9 is simultaneously utilized to realize the synchronous action of the clamping assemblies 7 on both sides, thereby realizing quick clamping. There is no need for dedicated clamping power, and synchronous control can be achieved by utilizing the lifting support part 3, thereby reducing the investment in power equipment and achieving a good comprehensive use effect.

[0036] Among them, the lifting support part 3 includes a movable platform 31, a base plate 32, an electric push rod 33 and an adapter groove 34. The movable platform 31 is movably sleeved in the adapter port 2, the base plate 32 is fixedly connected in the adapter port 2, the electric push rod 33 is fixedly installed on the top surface of the base plate 32, the movable end of the electric push rod 33 is fixedly connected to the movable platform 31, and the adapter groove 34 is opened on the top of the movable platform 31.

[0037] By utilizing the matching groove 34 and the air jet tube 41, it is ensured that when the movable platform 31 is located in the matching port 2, it supports the top circuit board on the one hand, and adapts to the assembly of the air jet tube 41 on the other hand.

[0038] A slide groove 10 is provided on the top of the testing platform 1 . The slide groove 10 is located on both sides of the adapter port 2 and is communicated with the adapter port 2 . Holes 11 are provided on both sides of the testing platform 1 .

[0039] The inside of the clamping assembly 7 is made conductive by using the sleeve hole 11 , and the clamping assembly 7 is pushed to move and control by using hydraulic force. The slide groove 10 is used to adapt to the movement of the clamping assembly 7 .

[0040] Among them, the left ends of the jet pipe 1 41 and the jet pipe 2 42 are fixedly connected and communicated with the side pipe 43, the right ends of the jet pipe 1 41 and the jet pipe 2 42 are fixedly connected with the side shaft 44, the side pipes 43 and the side shaft 44 at both ends of the jet pipe 1 41 are rotatably sleeved in the detection platform 1, the side pipes 43 and the side shaft 44 at both ends of the jet pipe 2 42 are rotatably sleeved with the support plate 46, the support plate 46 is fixedly connected to the top of the detection platform 1, the gear 1 45 is fixedly sleeved on the outer surface of the side shaft 44, and the two sets of gears 1 45 are meshed with each other.

[0041] The side pipe 43 conducts gas, and the output gas of the gas supply component 5 is conducted to the side pipe 43 and then to the injection pipe 1 41 and the injection pipe 2 42 .

[0042] Among them, a power unit 6 is fixedly provided on the front of the test bench 1. The power unit 6 includes a rotating motor and gear 2. The rotating motor controls the rotation of gear 2 sleeved on the output shaft. Gear 2 is meshed and connected with gear 1 45. The testing mechanism is fixed on both sides of the top of the test bench 1.

[0043] The power unit 6 provides rotational power to maintain rotation.

[0044] The air supply assembly 5 includes an air pump 51 and a connecting sleeve 52 . The connecting sleeve 52 is connected to the air outlet end of the air pump 51 , and the connecting sleeve 52 is connected to the two groups of side pipes 43 .

[0045] The air supply assembly 5 provides a purge air flow to achieve cleaning and cooling.

[0046] Among them, the clamping assembly 7 includes a push rod 71, a push plate 72, an elastic clamping pad 73, a distribution sleeve 74 and a spring 75. The push plate 72 is slidably sleeved in the slide groove 10, one end of the push rod 71 is fixedly connected to the push plate 72, and the other end is movably sleeved in the sleeve hole 11, the elastic clamping pad 73 is fixedly connected to the front side of the push plate 72, the distribution sleeve 74 is fixedly connected to the side of the detection table 1 and is connected to the sleeve hole 11, one end of the spring 75 is fixed in the distribution sleeve 74, and the other end is fixedly connected to the push rod 71.

[0047] The clamping assembly 7 realizes rapid movement on both sides, and quickly clamps and fixes the circuit board when the bottom loses support. The elastic clamping pad 73 buffers the clamping force, maintaining the clamping while avoiding excessive clamping and breaking of the circuit board.

[0048] Among them, the compression assembly 9 includes a connecting sleeve 91, an intermediate frame 92, a sleeve rod 93, a piston plate 94 and a second spring 95. The connecting sleeve 91 is fixedly connected to the top of the intermediate frame 92 and is connected to the inside of the intermediate frame 92. The two ends of the intermediate frame 92 are respectively fixedly connected and connected to the intermediate tubes 8 on both sides. The sleeve rod 93 is movably sleeved on the top of the connecting sleeve 91. The piston plate 94 is movably sleeved inside the connecting sleeve 91 and fixedly connected to the inner end of the sleeve rod 93. One end of the second spring 95 is fixed in the connecting sleeve 91, and the other end is fixedly connected to the piston plate 94. The sleeve rod 93 is located on the moving path of the movable platform 31.

[0049] The compression assembly 9 adapts to the downward movement of the movable table 31 , pushes the sleeve rod 93 downward, squeezes the internal hydraulic oil, and cooperates with the intermediate pipe 8 to communicate the hydraulic pressure, thereby realizing the clamping action of the clamping assembly 7 .

[0050] A testing method for a ceramic circuit board insulation testing device comprises the following testing steps:

[0051] Step 1: Place the circuit board to be tested on the top of the lifting support part 3, start the lifting support part 3, and as the movable platform 31 moves downward, push the compression assembly 9 downward, so that the compression assembly 9 further squeezes the lubricating oil filled inside into the sleeve hole 11 through the intermediate tube 8, so that the clamping assemblies 7 on both sides move close synchronously, and quickly clamp and fix the circuit board on the top of the lifting support part 3;

[0052] Step 2: The circuit board is then clamped and fixed and placed in the air, the power unit 6 is started, the power unit 6 drives the composite processing assembly 4 to rotate, the jet pipe 1 41 in the composite processing assembly 4 is located below the circuit board and rotates, and the jet pipe 2 42 is located above the circuit board and rotates;

[0053] Step 3: Start the air supply assembly 5, input the pressurized air into the composite processing assembly 4, and the jet pipe 1 41 rotates the pressurized air and sprays it toward the bottom of the circuit board for cleaning, and the jet pipe 2 42 rotates the pressurized air and sprays it toward the top of the circuit board for cleaning, and the dust removal on the upper and lower sides of the circuit board is completed;

[0054] Step 4: Hold the external terminal so that one end of the terminal is electrically connected to the test mechanism and the other end is electrically connected to the clamped circuit board. Start the test. During the test, the circuit board is purged from top to bottom to reduce the surface temperature and complete the test.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A ceramic circuit board insulation test device, comprising a test bench (1) and a test mechanism, characterized in that: The top of the test platform (1) is provided with an adapter port (2), the interior of the adapter port (2) is provided with a lifting support portion (3), the top of the test platform (1) is fixedly provided with a composite processing component (4), one end of the composite processing component (4) is located in the adapter port (2), and the other end is located above the adapter port (2), the back of the test platform (1) is fixedly provided with an air supply component (5), the air supply component (5) inputs pressurized air into the composite processing component (4), the top of the test platform (1) is provided with clamping components (7) on both sides, and the interior of the adapter port (2) is fixedly provided with a compression component (7). The invention relates to a composite processing component (9), wherein an intermediate tube (8) is fixedly connected between the compression component (9) and the clamping component (7), and the compression component (9) controls the movement of the clamping component (7). The composite processing component (4) comprises an air jet pipe 1 (41), an air jet pipe 2 (42), a side pipe (43), a side shaft (44), a gear 1 (45) and a support plate (46). The outer surfaces of the air jet pipe 1 (41) and the air jet pipe 2 (42) are both provided with circumferentially distributed air outlet holes. The air jet pipe 1 (41) is rotatably sleeved in the adapter port (2), and the air jet pipe 2 (42) is rotatably located above the adapter port (2).

2. A ceramic circuit board insulation testing device according to claim 1, characterized in that: The lifting support part (3) comprises a movable platform (31), a bottom plate (32), an electric push rod (33) and an adapting groove (34); the movable platform (31) is movably sleeved in the adapting port (2); the bottom plate (32) is fixedly connected to the adapting port (2); the electric push rod (33) is fixedly mounted on the top surface of the bottom plate (32); the movable end of the electric push rod (33) is fixedly connected to the movable platform (31); and the adapting groove (34) is provided on the top of the movable platform (31).

3. A ceramic circuit board insulation testing device according to claim 1, characterized in that: A slide groove (10) is provided on the top of the detection platform (1), and the slide groove (10) is located on both sides of the adapter port (2) and is connected to the adapter port (2). Holes (11) are provided on both sides of the detection platform (1).

4. A ceramic circuit board insulation testing device according to claim 1, characterized in that: The left ends of the jet pipe 1 (41) and the jet pipe 2 (42) are fixedly connected to and communicated with the side pipe (43), the right ends of the jet pipe 1 (41) and the jet pipe 2 (42) are fixedly connected to the side shaft (44), the side pipes (43) and the side shaft (44) at both ends of the jet pipe 1 (41) are rotatably sleeved in the detection platform (1), the side pipes (43) and the side shaft (44) at both ends of the jet pipe 2 (42) are rotatably sleeved with a support plate (46), the support plate (46) is fixedly connected to the top of the detection platform (1), the gear 1 (45) is fixedly sleeved on the outer surface of the side shaft (44), and the two sets of gears 1 (45) are meshed with each other.

5. The ceramic circuit board insulation testing device according to claim 1, characterized in that: A power unit (6) is fixedly provided on the front of the test bench (1), and the power unit (6) comprises a rotating motor and a second gear. The rotating motor controls the rotation of the second gear sleeved on the output shaft, and the second gear is meshedly connected with the first gear (45). The testing mechanism is fixed on both sides of the top of the test bench (1).

6. The ceramic circuit board insulation test device according to claim 1, characterized in that: The air supply assembly (5) comprises an air pump (51) and a connecting sleeve (52), wherein the connecting sleeve (52) is connected to the air outlet end of the air pump (51), and the connecting sleeve (52) is connected to two groups of side pipes (43).

7. The ceramic circuit board insulation testing device according to claim 1, characterized in that: The clamping assembly (7) comprises a push rod (71), a push plate (72), an elastic clamping pad (73), a distribution sleeve (74) and a spring (75); the push plate (72) is slidably sleeved in the slide groove (10); one end of the push rod (71) is fixedly connected to the push plate (72), and the other end is movably sleeved in the sleeve hole (11); the elastic clamping pad (73) is fixedly connected to the front side of the push plate (72); the distribution sleeve (74) is fixedly connected to the side of the detection platform (1) and communicated with the sleeve hole (11); one end of the spring (75) is fixed in the distribution sleeve (74), and the other end is fixedly connected to the push rod (71).

8. The ceramic circuit board insulation testing device according to claim 1, characterized in that: The compression assembly (9) comprises a connecting sleeve (91), an intermediate frame (92), a sleeve rod (93), a piston plate (94) and a second spring (95). The connecting sleeve (91) is fixedly connected to the top of the intermediate frame (92) and is in communication with the interior of the intermediate frame (92). The two ends of the intermediate frame (92) are respectively fixedly connected to and in communication with the intermediate tubes (8) on both sides. The sleeve rod (93) is movably sleeved on the top of the connecting sleeve (91). The piston plate (94) is movably sleeved inside the connecting sleeve (91) and is fixedly connected to the inner end of the sleeve rod (93). One end of the second spring (95) is fixed in the connecting sleeve (91) and the other end is fixedly connected to the piston plate (94). The sleeve rod (93) is located on the moving path of the movable platform (31).

9. The testing method of a ceramic circuit board insulation testing device according to claim 8, characterized in that: The test steps include: The first step: placing the circuit board to be tested on the top of the lifting support part (3), starting the lifting support part (3), and as the movable platform (31) moves downward, pushing the compression component (9) downward, so that the compression component (9) further squeezes the lubricating oil filled inside into the sleeve hole (11) through the intermediate tube (8), so that the clamping components (7) on both sides move close to each other synchronously, and quickly clamp and fix the circuit board on the top of the lifting support part (3); Step 2: The circuit board is then clamped and fixed and placed in the air, and the power unit (6) is started, and the power unit (6) drives the composite processing assembly (4) to rotate, and the first jet pipe (41) in the composite processing assembly (4) is located below the circuit board and rotates, and the second jet pipe (42) is located above the circuit board and rotates; Step 3: Start the air supply assembly (5), input the pressurized air into the composite processing assembly (4), and the first jet pipe (41) rotates the pressurized air and sprays it toward the bottom of the circuit board for cleaning, and the second jet pipe (42) rotates the pressurized air and sprays it toward the top of the circuit board for cleaning, and the dust removal and cleaning of the bottom and bottom of the circuit board are completed; Step 4: Hold the external terminal so that one end of the terminal is electrically connected to the test mechanism and the other end is electrically connected to the clamped circuit board. Start the test. During the test, the circuit board is purged from top to bottom to reduce the surface temperature and complete the test.

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