Chip testing device

Abstract

The invention provides a chip testing device, and relates to the technical field of testing equipment, the chip testing device comprises a case, a backboard is arranged in the case along a first direction, the case is divided into a first area and a second area which are arranged side by side along a second direction, at least two lifting liquid cooling modules and at least two to-be-tested chip modules are stacked in the first area from bottom to top along a third direction, and the lifting liquid cooling modules and the to-be-tested chip modules are stacked in the second area from bottom to top; the to-be-tested chip module is in drawing connection with the case, the lifting liquid cooling module dissipates heat of the to-be-tested chip module, the first area and the second area are in communication connection through the backboard, and it is guaranteed that the to-be-tested chip module is in normal operation while high and low temperature tests are completed; a driving module and an auxiliary module are stacked in the second area from bottom to top in the third direction, a control module is arranged on the same layer of the driving module, the driving module is connected with the lifting liquid cooling module, the auxiliary module is connected with the to-be-tested chip module, and the control module is electrically connected with the to-be-tested chip module, the lifting liquid cooling module, the driving module and the auxiliary module. And the first direction, the second direction and the third direction are vertical pairwise.

Description

Technical Field

[0001] The present application relates to the technical field of testing equipment, and in particular to a chip testing device. Background Art

[0002] With the continuous development and progress of AI (Artificial Intelligence) technology, AI chips have become a key link in the development of this technology. When performing performance testing on AI chips, high and low temperature tests are routine operations. The current testing equipment has low testing efficiency, mainly because the loading process of replacing the chip to be tested during the test is complicated, and the degree of automation of the test process is low, which in turn affects the test efficiency; at the same time, the current test is highly dependent on the operating staff, which increases the instability factors in the test process and also affects the accuracy of the test to a certain extent. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a chip testing device that can improve the degree of automation of testing, improve testing efficiency and test accuracy.

[0004] In one aspect of an embodiment of the present application, a chip testing device is provided, comprising a chassis, wherein a backplane is arranged in the chassis along a first direction to divide the chassis into a first area and a second area arranged side by side along a second direction, wherein at least two lifting liquid cooling modules and at least two chip modules to be tested are stacked from bottom to top in the first area along a third direction, wherein the chip modules to be tested are connected to the chassis by a drawer, wherein the lifting liquid cooling modules dissipate heat for the chip modules to be tested, and wherein the first area and the second area are communicatively connected via the backplane to ensure that the chip modules to be tested complete high and low temperature tests while operating normally;

[0005] The second zone is stacked with driving modules and auxiliary modules from bottom to top along the third direction. A control module is arranged on the same layer as the driving module. The driving module is connected to the lifting liquid cooling module to realize the lifting of the lifting liquid cooling module; the auxiliary module is connected to the chip module to be tested to ensure the normal operation of the chip module to be tested. The control module is electrically connected to the chip module to be tested, the lifting liquid cooling module, the driving module and the auxiliary module respectively. The first direction, the second direction and the third direction are perpendicular to each other.

[0006] Optionally, the chip module to be tested includes a test carrier, on which a buckle plate and a chip to be tested are provided. The chip module to be tested is arranged with one side of the chip to be tested facing the lifting liquid cooling module, a first connector is provided at the end of the buckle plate facing the backplane, and a second connector is provided at the end of the backplane facing the buckle plate. The first connector is plugged into the second connector to achieve communication connection between the chip module to be tested and the backplane.

[0007] Optionally, a power connector is also provided on the side of the backplane facing the chip module to be tested, and a power interface is correspondingly provided on the side of the chip module to be tested facing the backplane. The power interface of the chip module to be tested is plugged into the power connector of the backplane to achieve electrical connection of the chip module to be tested.

[0008] Optionally, the lifting liquid cooling module includes a lifting carrier, a lifting mechanism disposed on the lifting carrier, and a liquid cooling module disposed on the lifting mechanism, and the lifting mechanism lifts the liquid cooling module to make the liquid cooling module contact the chip to be tested.

[0009] Optionally, a jumper module is also provided on the lifting mechanism, the chip module to be tested includes a PCB board, the jumper module connects the PCB board and the buckle plate, the lifting mechanism realizes a first-level synchronous lifting of the liquid cooling module and the jumper module, and then realizes a second-level lifting of the jumper module, so that the jumper module and the PCB board can be plugged in.

[0010] Optionally, a third connector is provided on the PCB board of the chip module to be tested, a fourth connector is provided on the buckle plate, and a jumper board is provided on the jumper module, one end of the jumper board is used to be plugged into the fourth connector, and the other end is used to be plugged into the third connector.

[0011] Optionally, the lifting vehicle is connected to the chassis by pulling, a pulley is provided on the lifting vehicle, and a hole is provided in the chassis, and the pulley cooperates with the hole to fix the relative position of the lifting liquid cooling module and the chassis.

[0012] Optionally, the driving module is further provided with an interface board as an external device in the same layer, and the interface board protrudes from the auxiliary module at one end away from the chip module to be tested along the second direction.

[0013] Optionally, a guide rail is provided on one side of the chassis along the second direction, and the chassis is push-pull matched with the cabinet through the guide rail.

[0014] Optionally, the auxiliary module is also provided with a heat dissipation module on the same layer, the heat dissipation module dissipates heat for the control module, and the control module is electrically connected to the heat dissipation module.

[0015] The chip testing device provided in the embodiment of the present application is designed as an independent chassis. The chassis is a standard 4U chassis size and can be placed in a standard ORv3 rack. A single chassis can realize the performance test of at least two chip modules to be tested. When multiple chassis are stacked in a cabinet, the performance test of multiple groups of chip modules to be tested can be realized, which can greatly improve the test efficiency. The chassis is convenient to stack in the cabinet and can be flexibly configured according to actual needs to meet different test needs. The chip module to be tested adopts a pull-out setting, which is convenient for replacing different chips to be tested for testing. The lifting liquid cooling module adopts an automatic lifting mode, which greatly improves the test efficiency; the lifting liquid cooling module dissipates heat for the chip module to be tested, ensuring the normal operation of the chip module to be tested. The auxiliary module ensures the normal operation of the chip module to be tested, and the driving module is used to realize the lifting and lowering of the lifting liquid cooling module. The present application adopts a modular setting, and each module is reasonably arranged in the chassis to ensure that the chip module to be tested completes the high and low temperature test while operating normally in a limited space. It can also be easily disassembled, simplifying the original complex loading process and reducing the skill requirements for operating employees. At the same time, the control module is used to automatically control each module and the entire machine, further improving the overall automation function of the device, thereby improving test efficiency and test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a schematic diagram of the appearance of a chip testing device provided in this embodiment;

[0018] Figure 2 This is one of the schematic diagrams of the chassis structure of the chip testing device provided in this embodiment;

[0019] Figure 3 This is the second schematic diagram of the chassis structure of the chip testing device provided in this embodiment;

[0020] Figure 4 Schematic diagram of the chip module to be tested in the chip testing device provided in this embodiment is in the pulled-out state;

[0021] Figure 5 Schematic diagram of the lifting and lowering liquid cooling module of the chip testing device provided in this embodiment;

[0022] Figure 6is a schematic structural diagram of the first area of ​​the chip testing device provided in this embodiment;

[0023] Figure 7 This is one of the structural schematic diagrams of the second area of ​​the chip testing device provided in this embodiment;

[0024] Figure 8 The structure of the second area of ​​the chip testing device provided in this embodiment is shown in FIG. Figure 2 ;

[0025] Fig. 9 is a schematic diagram of the partial structure of a chip module to be tested by a chip testing device provided in this embodiment;

[0026] Fig.10 is a schematic diagram of the structure of a test carrier of a chip test device provided in this embodiment;

[0027] Fig.11 is a schematic diagram of the structure of the chip testing device provided in this embodiment;

[0028] Fig.12a This is one of the schematic diagrams of the backplane structure of the chip testing device provided in this embodiment;

[0029] Figure 12b This is the second schematic diagram of the backplane structure of the chip testing device provided in this embodiment;

[0030] Fig.13 It is a schematic diagram of the connection structure between the back plate and the gusset plate of the chip testing device provided in this embodiment;

[0031] Fig.14 is a schematic diagram of the structure of the lifting mechanism of the chip testing device provided in this embodiment;

[0032] Fig.15 It is a schematic diagram of the structure of the lifting carrier of the chip testing device provided in this embodiment.

[0033] Icons: 10-chassis; 10A-first zone; 10B-second zone; 101-top plate; 102-bottom plate; 102a-hole; 103-side plate; 104-dust screen; 105-guide rail; 106-back plate; 106a-second connector; 106b-power connector; 106c-guide pin; 106d-functional interface; 11-chip module to be tested; 110-test carrier; 111-gusset plate; 112-first connector; 1 13-PCB board; 114-third connector; 12-lifting liquid cooling module; 120-handle; 121-front panel; 122-display screen; 123-button; 124-lifting mechanism; 125-lifting carrier; 126-pulley; 13-auxiliary module; 14-heat dissipation module; 15-drive module; 16-control module; 17-interface board; 18-water cut-off switch; F1-first direction; F2-second direction; F3-third direction. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0035] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0036] It should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Please refer to Figure 1As shown, an embodiment of the present application provides a chip testing device, including: a chassis 10, a backplane 106 is arranged in the chassis 10 along the first direction F1 to divide the chassis 10 into a first zone 10A and a second zone 10B along the second direction F2, the first zone 10A is stacked with at least two lifting liquid cooling modules 12 and at least two chip modules to be tested 11 from bottom to top along the third direction F3, the chip module to be tested 11 is connected to the chassis 10 by a pull-pull connection, the lifting liquid cooling module 12 dissipates heat for the chip module to be tested 11, the first zone 10A and the second zone 10B are communicatively connected via the backplane 106 to ensure that the chip module to be tested 11 completes high and low temperature tests while operating normally.

[0038] The second zone 10B is stacked with a driving module 15 and an auxiliary module 13 from bottom to top along the third direction F3. A control module 16 is arranged on the same layer as the driving module 15, and a heat dissipation module 14 is arranged on the same layer as the auxiliary module 13. The driving module 15 is connected to the lifting liquid cooling module 12 to realize the lifting and lowering of the lifting liquid cooling module 12; the auxiliary module 13 is connected to the chip module to be tested 11 to ensure the normal operation of the chip module to be tested 11, and the heat dissipation module 14 dissipates heat for the control module 16. The control module 16 is electrically connected to the chip module to be tested 11, the lifting liquid cooling module 12, the driving module 15, the auxiliary module 13 and the heat dissipation module 14 respectively, and the first direction F1, the second direction F2 and the third direction F3 are perpendicular to each other.

[0039] like Figure 2 , Figure 3 As shown, the chassis 10 is a standard 4U chassis size, so as to fit the cabinet and enable the chassis 10 to be conveniently placed in the cabinet for stacking. In the present application, multiple chip test devices can be stacked in the cabinet, and each chip test device can dissipate heat for at least two chip modules 11 to be tested. When multiple chip test devices are stacked, space can be saved; after multiple chip test devices are stacked, multiple groups of chip modules 11 to be tested can also be dissipated at the same time, thereby improving test efficiency.

[0040] For example, the chassis 10 includes a bottom plate 102, a side plate 103 and a top plate 101, which are connected by screws and have good structural stability. The chassis 10 is a semi-enclosed structure with front and rear openings along the second direction F2. The front opening of the chassis 10 is used to facilitate the pushing and pulling of the chip module 11 to be tested and the lifting and lowering of the liquid cooling module 12. The rear opening of the chassis 10 is used to facilitate the setting of Figure 7 The interface board 17 is used to connect with the customer's equipment.

[0041] The side plate 103 can be set as a multi-hole plate, which can eliminate stress, reduce the weight of the chassis 10, and facilitate heat dissipation of the chassis 10. The outside of the side plate 103 is covered with a dustproof net 104 for dust prevention; the outside of the dustproof net 104 is installed with a guide rail 105 so that the chassis 10 can be easily pushed into the cabinet. The bottom plate 102 is provided with a hole 102a to accommodate the pulley 126 ( Fig.13 ), the relative positions of the chassis 10 and the lifting liquid cooling module 12 are fixed by the cooperation of the pulley 126 and the hole 102a, and the lifting liquid cooling module 12 can be pushed into the chassis 10 through the pulley. The pulley 126 at the bottom of the lifting liquid cooling module 12 cooperates with the chassis 10, and the guide rail 105 of the side panel 103 of the chassis 10 cooperates with the cabinet, so that when the lifting liquid cooling module 12 is pushed into the chassis 10 and the chip testing device is pushed into the cabinet as a whole, the manual load can be reduced, making the chip testing device structure stable. Through testing, the chassis 10 is subjected to a single-sided force of 1600N, the maximum deformation is about 0.03mm, and the average deformation of the middle part is about 0.023mm.

[0042] like Figure 3 As shown, a backplane 106 is provided in the chassis 10, and the backplane 106 is provided along a first direction F1 of the chassis 10. The backplane 106 divides the chassis 10 into a first zone 10A and a second zone 10B along both sides of the backplane 106, and the first zone 10A and the second zone 10B are arranged side by side along a second direction F2; for example, the first direction F1 in the present application is the width direction of the chassis 10, and the second direction F2 is the length direction of the chassis 10, the first zone 10A is located at the front end of the chassis 10, and the second zone 10B is located at the rear end of the chassis 10.

[0043] During the high and low temperature test of AI chips, on the one hand, it is necessary to ensure the normal operation of the AI ​​chip, and on the other hand, it is necessary to solve the heat dissipation problem of the chip to ensure that the chip will not be damaged. This is because the current test equipment usually uses a heat dissipation cold plate for heat dissipation. The contact between the heat dissipation cold plate and the chip to be tested is generally achieved through a downward pressure mechanism, so that the heat dissipation cold plate is pressed on the chip to be tested. However, the downward pressure mechanism itself has weight, and there is a risk of damaging the chip to be tested.

[0044] In this application, if Figures 4 to 6As shown, in the first zone 10A, the lifting liquid cooling module 12 and the chip module to be tested 11 are stacked along the third direction F3, i.e., the height direction of the chassis 10, and the lifting liquid cooling module 12 can dissipate heat for the chip module to be tested 11. A heat-conducting material is installed on the contact surface between the lifting liquid cooling module 12 and the chip module to be tested 11, and the heat-conducting material is used to fill the tiny gap between the lifting liquid cooling module 12 and the chip module to be tested 11 to enhance the heat dissipation effect. The chip module to be tested 11 is located above the lifting liquid cooling module 12. Therefore, this can not only facilitate the replacement of the heat-conducting material, but also avoid the weight of the lifting liquid cooling module 12 itself from causing pressure on the chip module to be tested 11, thereby reducing the probability of damage to the chip module to be tested 11.

[0045] like Figure 4 The chip module 11 to be tested of the present application is connected to the chassis 10 by a pull-out method, and the chip module 11 to be tested can be conveniently pulled out of the chassis 10 by a pull-out method to replace a different chip to be tested for performance testing. For example, the chip module 11 to be tested and the backplane 106 can be connected in communication to perform performance testing on the chip module 11 to be tested.

[0046] The lifting liquid cooling module 12 can be lifted and lowered in the chassis 10. Along the third direction F3, when the lifting liquid cooling module 12 is lifted to a position in contact with the chip module 11 to be tested, the chip module 11 to be tested can be cooled; when the lifting liquid cooling module 12 is lowered to a position where there is a gap between the lifting liquid cooling module 12 and the chip module 11 to be tested, it is convenient to pull the chip module 11 to be tested out of the chassis 10, so that different chips to be tested can be replaced for performance testing. After replacing the chip to be tested, the chip module 11 to be tested is pushed into the chassis 10 again, and the lifting liquid cooling module 12 is lifted to a position in contact with the chip module 11 to be tested, and the chip module 11 to be tested is cooled. This reciprocating process can achieve performance testing of the chip module 11 while also cooling the chip module 11 to be tested.

[0047] The present application has at least two chip modules to be tested 11 and lifting liquid cooling modules 12 respectively, and the chip modules to be tested 11 and the lifting liquid cooling modules 12 are arranged in a one-to-one correspondence. When there are multiple chip modules to be tested 11 and lifting liquid cooling modules 12, performance testing and heat dissipation of multiple groups of chip modules to be tested 11 can be performed simultaneously to improve testing efficiency in a limited space.

[0048] like Figure 4 , Figure 5 As shown, there are two chip modules 11 to be tested and two lifting and cooling modules 12, which are arranged symmetrically along the first direction F1. The two chip modules 11 to be tested and the lifting and cooling modules 12 can be shared. Figure 7 , Figure 8 The control module 16 and the interface board 17 are provided.

[0049] The second area 10B is stacked with a driving module 15 and an auxiliary module 13 along the third direction F3 . The auxiliary module 13 is provided with a heat dissipation module 14 on the same layer, and the driving module 15 is provided with a control module 16 on the same layer.

[0050] The function of the auxiliary module 13 cooperates with the chip module to be tested 11, and the auxiliary module 13 is used to ensure the normal operation of the chip module to be tested 11. The driving module 15 is connected to the lifting liquid cooling module 12, and the driving module 15 is used to drive the lifting liquid cooling module 12 to lift. The heat dissipation module 14 can be a heat dissipation fan, which is used to dissipate heat from the mainboard in the control module 16. The control module 16 is electrically connected to the chip module to be tested 11, the auxiliary module 13, the lifting liquid cooling module 12, and the heat dissipation module 14, respectively, to realize automatic control of these modules and the whole machine, so that these modules can work in coordination. A water cut-off switch 18 is also provided on one side of the control module 16 along the first direction F1, and the control module 16 is electrically connected to the water cut-off switch 18, and the water cut-off switch 18 is used to control the water circuit operation of the chip testing device.

[0051] In addition, the module of the present application is arranged in two layers along the third direction F3, and the upper and lower layers are designed in a step-difference manner. The lower layer protrudes from the upper layer, and the protruding part of the lower layer is the interface board 17. The chip testing device of the present application is connected to the customer's equipment through the interface board 17.

[0052] The interface board 17 is arranged in the same layer as the driving module 15, and is away from one end of the chip module 11 under test along the second direction F2. The interface board 17 protrudes from the auxiliary module 13 to form a step-type design, which can be perfectly combined with the customer's equipment in a limited space.

[0053] In summary, the chip testing device provided in the embodiment of the present application is designed as an independent chassis 10. The width and height of the chassis 10 are standard 4U chassis sizes and can be placed in a standard ORv3 rack. A single chassis 10 can realize the performance test of at least two chip modules 11 to be tested. When multiple chassis 10 are stacked in a cabinet, the performance test of multiple groups of chip modules 11 to be tested can be realized, which can greatly improve the test efficiency. The chassis 10 is convenient to stack in the cabinet and can be flexibly configured according to actual needs to meet different test requirements. The lifting liquid cooling module 12 adopts an automatic lifting mode to achieve heat dissipation of the chip module 11 to be tested, which greatly improves the test efficiency; by dissipating the heat of the chip module 11 to be tested, the normal operation of the chip module 11 to be tested is guaranteed. The present application adopts a modular setting and is reasonably laid out in the chassis 10 to ensure that the chip module 11 to be tested completes high and low temperature tests while operating normally in a limited space. It can also be easily disassembled, simplifying the original complex loading process and reducing the skill requirements for operating employees. At the same time, the control module 16 performs automatic control on other modules and the whole machine, further improving the overall automation function of the device, improving the test efficiency and the test accuracy.

[0054] Specifically, refer to Figures 9 to 11 As shown, the chip module 11 to be tested includes a test carrier 110, on which a test chip and a buckle plate 111 are arranged. The chip module 11 to be tested is arranged with one side of the chip facing the lifting liquid cooling module 12, so that the chip module 11 to be tested is pushed into the chassis 10 with the test chip facing downward so as to fit with the lifting liquid cooling module 12 to dissipate heat for the chip to be tested.

[0055] like Fig.12a , Fig.13 As shown, a first connector 112 is provided at the end of the pinch plate 111 facing the backplane 106, and a second connector 106a is provided at the end of the backplane 106 facing the pinch plate 111. When the chip module 11 to be tested is pushed into the chassis 10, the first connector 112 is plugged into the second connector 106a of the backplane 106, thereby realizing the communication connection between the chip module 11 to be tested and the backplane 106, so as to perform performance testing on the chip to be tested.

[0056] By connecting through the connector between the back plate 106 and the buckle plate 111, cables can be saved, the internal space of the chassis 10 can be increased, and it is convenient to set up multiple groups of chip modules 11 to be tested and corresponding lifting liquid cooling modules 12 in the chassis 10, and dissipate heat for multiple groups of chips to be tested at the same time.

[0057] A power connector 106b and a guide pin 106c are also provided on the side of the back plate 106 facing the chip module 11 to be tested. A power interface is correspondingly provided on the side of the chip module 11 to be tested facing the back plate 106. When the first connector 112 and the second connector 106a are blindly plugged, the power interface of the chip module 11 to be tested is also plugged into the power connector 106b of the back plate 106 to achieve electrical connection to the chip module 11 to be tested. The guide pin 106c facilitates the guiding and alignment of the chip module 11 to be tested and the back plate 106 to achieve precise plugging.

[0058] like Figure 12b As shown, a side of the backplane 106 away from the chip module 11 to be tested, that is, the side of the backplane 106 facing the second zone 10B, is designed with a variety of different functional interfaces 106d, so that the modules in the first zone 10A and the second zone 10B before and after the backplane 106 can be communicated and connected, thereby saving most of the cables used in the existing cable connection, increasing the internal space of the chassis 10, and making the interior of the chassis 10 tidier and reducing risk points.

[0059] For the lifting liquid cooling module 12, Fig.14 , Fig.15 As shown, it includes a lifting carrier 125, a lifting mechanism 124, a liquid cooling module and a jumper module. The lifting carrier 125 can push the lifting liquid cooling module 12 as a whole into the chassis 10 or pull it out from the chassis 10. The lifting mechanism 124 is set on the lifting carrier 125. The lifting mechanism 124 is used to lift the liquid cooling module so that the liquid cooling module is in contact with the chip to be tested to achieve the best heat dissipation effect.

[0060] In some embodiments, the liquid cooling module includes a heat dissipation cold plate. The purpose of the lifting mechanism 124 is to lift the heat dissipation cold plate. The heat dissipation cold plate is relative to the chip to be tested and has a similar size. When the lifting mechanism 124 lifts the heat dissipation cold plate, the chip to be tested can be cooled in a targeted manner, and the heat dissipation effect is good.

[0061] A jumper module is also provided on the lifting mechanism 124, and the jumper module is used to be plugged into the interface of the PCB board 113 in the chip module 11 to be tested. For example, a third connector 114 is provided on the interface of the PCB board 113 of the chip module 11 to be tested, and a fourth connector is correspondingly provided on the pinch plate 111. A plurality of jumper boards are designed on the jumper module, and the fourth connector to be connected is fixedly connected to the rear end of the jumper board through a cable, and the front end is plugged into the third connector 114, so that the connection or disconnection between the PCB board 113 in the chip module 11 to be tested and the pinch plate 111 can be realized.

[0062] The present application can realize two-stage lifting through the lifting mechanism 124, wherein the lifting mechanism 124 is a first-stage lifting for the liquid cooling module and a second-stage lifting for the jumper module. In specific application, the lifting mechanism 124 first drives the liquid cooling module and the jumper module to be lifted by a first stage synchronously, so that the liquid cooling module is in contact with the chip to be tested, and at this time the jumper module has not yet been plugged into the interface of the PCB board 113 of the chip module 11 to be tested; then, the motor inside the jumper module drives the jumper module itself to be lifted by a second stage, completing the plugging of the jumper module with the interface of the PCB board 113 of the chip module 11 to be tested.

[0063] There can be multiple jumper modules. When performing performance testing on the chip to be tested, some or all of the jumper modules can be selected to be raised as needed to plug into the interface of the PCB board 113 of the chip module 11 to be tested.

[0064] Specifically, the chip module 11 to be tested completes the communication connection between the pinch board 111 and the PCB board 113 through the jumper module, the pinch board 111 is communicated with the backboard 106, and the auxiliary module 13 is communicated with the backboard 106 and the interface board 17 respectively, so that the signal of the chip module 11 to be tested is exported from the interface board 17 to realize the performance test of the chip module 11 to be tested. Other modules are set with reference to the above and will not be described in detail.

[0065] In addition, since the pushing and pulling of the lifting liquid cooling module 12 is a low-frequency operation, it only needs to be pulled out from the chassis 10 when the thermal conductive material is replaced or the lifting liquid cooling module 12 fails. In order to facilitate the replacement of the thermal conductive material, the lifting liquid cooling module 12 is designed as a pushing and pulling mechanism. When the lifting liquid cooling module 12 is pulled and connected to the chassis 10, a handle 120 is installed on the front panel 121 of the lifting liquid cooling module 12 at the front end along the second direction F2 to facilitate the pulling and pulling operation.

[0066] The front panel 121 is also provided with a display screen 122 for displaying pressure values, a button 123 for starting and resetting the chip testing device, and other functional accessories to perform corresponding functions.

[0067] The above are only embodiments of the present application and are not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A chip testing device, characterized in that: The invention comprises: a chassis, wherein a backplane is arranged in the chassis along a first direction to divide the chassis into a first area and a second area arranged side by side along a second direction, wherein at least two lifting liquid cooling modules and at least two chip modules to be tested are stacked from bottom to top in the first area along a third direction, wherein the chip modules to be tested are connected to the chassis by a drawer, and the lifting liquid cooling modules dissipate heat for the chip modules to be tested, and the first area and the second area are connected by communication via the backplane to ensure that the chip modules to be tested complete high and low temperature tests while operating normally; The second zone is stacked with driving modules and auxiliary modules from bottom to top along the third direction. A control module is arranged on the same layer as the driving module. The driving module is connected to the lifting liquid cooling module to realize the lifting of the lifting liquid cooling module; the auxiliary module is connected to the chip module to be tested to ensure the normal operation of the chip module to be tested. The control module is electrically connected to the chip module to be tested, the lifting liquid cooling module, the driving module and the auxiliary module respectively. The first direction, the second direction and the third direction are perpendicular to each other.

2. The chip testing device according to claim 1, characterized in that: The chip module to be tested includes a test carrier, on which a buckle plate and a chip to be tested are arranged. The chip module to be tested is arranged with one side of the chip to be tested facing the lifting liquid cooling module, a first connector is arranged at the end of the buckle plate facing the backplane, and a second connector is arranged at the end of the backplane facing the buckle plate. The first connector is plugged into the second connector to achieve communication connection between the chip module to be tested and the backplane.

3. The chip testing device according to claim 2, characterized in that: A power connector is also provided on the side of the backplane facing the chip module to be tested, and a power interface is correspondingly provided on the side of the chip module to be tested facing the backplane. The power interface of the chip module to be tested is plugged into the power connector of the backplane to achieve electrical connection of the chip module to be tested.

4. The chip testing device according to claim 2, characterized in that: The lifting liquid cooling module includes a lifting carrier, a lifting mechanism arranged on the lifting carrier, and a liquid cooling module arranged on the lifting mechanism. The lifting mechanism lifts the liquid cooling module to make the liquid cooling module contact with the chip to be tested.

5. The chip testing device according to claim 4, characterized in that: The lifting mechanism is also provided with a jumper module, the chip module to be tested includes a PCB board, the jumper module connects the PCB board and the buckle plate, the lifting mechanism realizes a first-level synchronous lifting of the liquid cooling module and the jumper module, and then realizes a second-level lifting of the jumper module, so that the jumper module and the PCB board can be plugged in.

6. The chip testing device according to claim 5, characterized in that: A third connector is provided on the PCB board of the chip module to be tested, a fourth connector is provided on the buckle board, and a jumper board is provided on the jumper module, one end of the jumper board is used to be plugged into the fourth connector, and the other end is used to be plugged into the third connector.

7. The chip testing device according to claim 4, characterized in that: The lifting carrier is connected to the chassis by pulling, and a pulley is provided on the lifting carrier. A hole is provided in the chassis, and the pulley cooperates with the hole to fix the relative position of the lifting liquid cooling module and the chassis.

8. The chip testing device according to claim 1, characterized in that: The driving module is also provided with an interface board as an external device in the same layer, and the interface board protrudes from the auxiliary module at one end away from the chip module to be tested along the second direction.

9. The chip testing device according to claim 1, characterized in that: A guide rail is provided on one side of the chassis along the second direction, and the chassis is push-pull matched with the cabinet through the guide rail.

10. The chip testing device according to any one of claims 1 to 9, characterized in that: The auxiliary module is also provided with a heat dissipation module on the same layer. The heat dissipation module dissipates heat for the control module. The control module is electrically connected to the heat dissipation module.

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