Silicon wafer management method and silicon wafer transmission control system

Abstract

The invention provides a silicon wafer management method and a silicon wafer transmission control system, and relates to the technical field of semiconductors. The method comprises the steps that transmission control parameters of a film library manager are obtained, and the transmission control parameters comprise a film taking control parameter, a scanning control parameter and a film placing control parameter; determining a wafer taking library from a plurality of preset silicon wafer libraries according to the wafer taking control parameters; a wafer taking manipulator is controlled to scan a wafer taking library, target silicon wafers in the wafer taking library are determined, and the wafer taking manipulator is controlled to convey the target silicon wafers to a silicon wafer workbench for exposure; and after the exposure is finished, determining a wafer placement library from a plurality of preset silicon wafer libraries according to the wafer placement control parameters, and controlling the wafer placement manipulator to carry the exposed target silicon wafer from the silicon wafer workbench to the wafer placement library. According to the method, the wafer taking manipulator and the wafer placing manipulator can be automatically controlled to complete the exposure operation of the silicon wafer, and tedious operation of a user is avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a silicon wafer management method and a silicon wafer transmission control system. Background Art

[0002] The silicon wafer library is a device in the lithography machine used to store silicon wafers. During the exposure operation of silicon wafers, the robot moves unexposed silicon wafers from the silicon wafer library and puts them back into the silicon wafer library after the exposure is completed or the exposure is abnormal.

[0003] Existing exposure operations require real-time user participation. For example, when taking or placing wafers, if there are abnormal conditions such as overlapping or tilted wafers in the current slot, the user needs to be notified to handle the abnormal conditions. Alternatively, every time the wafer library is changed, the user needs to reset the wafer taking and placing parameters of the wafer library. The operation is cumbersome and brings inconvenience to the user. Summary of the invention

[0004] In view of the deficiencies in the above-mentioned prior art, the present application provides a silicon wafer management method and a silicon wafer transmission control system to solve the problems existing in the prior art.

[0005] The technical solution adopted in the embodiment of the present application is as follows:

[0006] In a first aspect, an embodiment of the present application provides a silicon wafer management method, comprising:

[0007] Acquire the transmission control parameters of the film library manager, wherein the transmission control parameters include: film fetching control parameters, scanning control parameters and film placing control parameters;

[0008] According to the wafer fetching control parameter, determining a wafer fetching library from a plurality of preset wafer libraries;

[0009] Controlling a wafer picking robot to scan the wafer picking library, determining a target silicon wafer in the wafer picking library, and controlling the wafer picking robot to transport the target silicon wafer to a silicon wafer workbench for exposure;

[0010] After the exposure is completed, a wafer placement library is determined from the plurality of preset wafer libraries according to the wafer placement control parameters, and a wafer placement robot is controlled to transport the exposed target wafer from the wafer workbench to the wafer placement library.

[0011] In a second aspect, an embodiment of the present application provides a silicon wafer transmission control system, including: a transmission control device, a device front-end module; the device front-end module is provided with: a wafer taking robot, a wafer placing robot and a plurality of preset silicon wafer libraries;

[0012] The film taking robot and the film placing robot are respectively connected to the transmission control device;

[0013] The transmission control device is used to execute the silicon wafer management method described in the above embodiment.

[0014] In a third aspect, an embodiment of the present application provides a silicon wafer management device, including:

[0015] An acquisition module, used for acquiring transmission control parameters of the film library manager, wherein the transmission control parameters include: film fetching control parameters, scanning control parameters and film placing control parameters;

[0016] A determination module, used for determining a wafer library to be taken from a plurality of preset wafer libraries according to the wafer taking control parameter;

[0017] A control module, for controlling a wafer picking robot to scan the wafer picking library according to the scanning control parameters, determining a target silicon wafer in the wafer picking library, and controlling the wafer picking robot to transport the target silicon wafer to a silicon wafer workbench for exposure;

[0018] The transport module is used to determine the wafer placement library from the multiple preset silicon wafer libraries according to the wafer placement control parameters after the exposure is completed, and control the wafer placement robot to transport the exposed target silicon wafer from the silicon wafer workbench to the wafer placement library.

[0019] In a fourth aspect, an embodiment of the present application provides a transmission control device, comprising: a processor, a storage medium and a bus, wherein the storage medium stores program instructions executable by the processor, and when the transmission control device is running, the processor communicates with the storage medium through the bus, and the processor executes the program instructions to implement the data processing method described in the above embodiment.

[0020] In a fifth aspect, an embodiment of the present application provides a readable storage medium, on which program instructions are stored, and when the program instructions are executed by a processor, the data processing method described in the above embodiment is implemented.

[0021] The beneficial effect of the present application is as follows: the present application provides a silicon wafer management method and a silicon wafer transmission control system, which can automatically control the wafer picking robot and the wafer placing robot to complete the exposure operation of the silicon wafer based on the transmission control parameters of the wafer library manager, has a high degree of intelligence, avoids tedious operations of the user, and does not require real-time participation of the user, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the structure of a silicon wafer transmission control system provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of a device front-end module provided in an embodiment of the present application;

[0025] Figure 3 One of the flow charts of the silicon wafer management method provided in the embodiment of the present application;

[0026] Figure 4 The second flowchart of the silicon wafer management method provided in the embodiment of the present application;

[0027] Figure 5 The third flowchart of the silicon wafer management method provided in the embodiment of the present application;

[0028] Figure 6 A schematic diagram of the structure of the silicon wafer management device provided in this application;

[0029] Figure 7 A schematic diagram of the structure of the transmission control device provided in this application. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0031] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0032] In the description of the present application, it should be noted that if the terms "upper", "lower", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0033] In addition, the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0034] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a direct connection, it can be an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] It should be noted that, in the absence of conflict, the features in the embodiments of the present application may be combined with each other.

[0036] An embodiment of the present application provides a silicon wafer management method, which can be generated by a transmission control device in a silicon wafer transmission control system. The transmission control device can be, for example, a terminal-oriented computer device.

[0037] First combine Figure 1 and Figure 2 , the silicon wafer transmission control system of the present application is described, such as Figure 1 As shown, the silicon wafer transmission control system includes a transmission control device and a device front-end module, such as Figure 2 As shown, the front-end module of the device is provided with a wafer taking robot, a wafer placing robot and a plurality of preset wafer libraries, and the wafer taking robot and the wafer placing robot are respectively connected to the transmission control device, based on which the transmission control device can control the wafer taking robot and the wafer placing robot to perform corresponding actions, thereby performing exposure operations on the wafers in the plurality of preset wafer libraries. Each preset wafer library can be provided with a plurality of slots, for example, a wafer library for placing 4 / 6-inch wafers has a total of 25 layers (25 slots), and a wafer library for placing 8-inch wafers has a total of 13 layers (13 slots).

[0038] Specifically, the exposure process includes: the wafer taking robot takes the unexposed silicon wafer from the silicon wafer library and places it on the pre-alignment position. After pre-alignment, the wafer taking robot places the pre-aligned silicon wafer on the silicon wafer workbench from the upper wafer position, and then the silicon wafer is exposed on the silicon wafer workbench. After exposure, the wafer placing robot moves the exposed silicon wafer back to the silicon wafer library from the lower wafer position. The role of pre-alignment is to accurately place the silicon wafer on the exposure table so that the circuit diagram on the mask can be accurately exposed at the specified position of the silicon wafer to improve the success rate of silicon wafer exposure.

[0039] The following is a specific example description of the silicon wafer management method provided by the present application through multiple examples in combination with the accompanying drawings.

[0040] Figure 3 One of the flow charts of the silicon wafer management method provided in the embodiment of the present application is as follows: Figure 3 As shown, the method includes:

[0041] S101: Acquire transmission control parameters of a film library manager.

[0042] The transmission control device is divided into a control layer and an access layer. Before executing the method of this application, the user can set the transmission control parameters in the film library manager of the access layer. When executing the method of this application, the control layer can obtain the transmission control parameters from the film library manager.

[0043] Among them, the transmission control parameters include wafer picking control parameters, scanning control parameters and wafer placing control parameters. The wafer picking control parameters are used to indicate the method of taking unexposed silicon wafers from multiple silicon wafer libraries, the scanning control parameters are used to indicate the method of scanning silicon wafers, and the wafer placing control parameters are used to indicate the method of transporting the exposed silicon wafers back to multiple silicon wafer libraries.

[0044] S102, determining a wafer fetching library from a plurality of preset silicon wafer libraries according to wafer fetching control parameters.

[0045] According to the wafer fetching control parameter Select, the wafer fetching library can be determined from multiple preset wafer libraries, that is, from which wafer library the wafer fetching robot will fetch the unexposed wafer.

[0046] S103, according to the scanning control parameters, control the wafer picking robot to scan the wafer picking library, determine the target silicon wafer in the wafer picking library, and control the wafer picking robot to transport the target silicon wafer to the silicon wafer workbench for exposure.

[0047] The wafer picking robot is provided with a scanning device, which can scan the silicon wafer. After the wafer picking library is determined, the wafer picking robot is controlled to scan the wafer picking library according to the scanning control parameter ScanOption. The function of the scanning is to determine the target silicon wafer among the multiple silicon wafers in the wafer picking library, and then the wafer picking robot is controlled to transport the target silicon wafer to the silicon wafer workbench for exposure. It should be noted that before the wafer picking robot transports the target silicon wafer to the silicon wafer workbench for exposure, the target silicon wafer will be placed on the pre-alignment position for pre-alignment to improve the success rate of silicon wafer exposure.

[0048] S104, after the exposure is completed, according to the wafer placement control parameters, a wafer placement library is determined from a plurality of preset wafer placement libraries, and a wafer placement robot is controlled to move the exposed target silicon wafer from the wafer workbench to the wafer placement library.

[0049] After the exposure is completed, the control layer determines the wafer placement library from multiple preset silicon wafer libraries based on the wafer placement control parameters, and controls the wafer placement robot to move the exposed target silicon wafer from the silicon wafer workbench to the wafer placement library, thereby completing an exposure operation for the target silicon wafer. By repeating the above process, the silicon wafers in multiple silicon wafer libraries can be exposed.

[0050] In this embodiment, the user only needs to set the transmission control parameters in the film library manager before the exposure operation begins, and subsequently only needs to replace the film library in time during the operation to efficiently complete the exposure task.

[0051] To summarize, the embodiment of the present application provides a silicon wafer management method, which can automatically control the wafer picking robot and the wafer placing robot to complete the exposure operation of the silicon wafer based on the transmission control parameters of the wafer library manager. It has a high degree of intelligence, avoids tedious operations of the user, and does not require real-time participation of the user, thereby improving the user experience.

[0052] In one embodiment, the wafer fetching control parameter Select may include a wafer library position identification parameter Left or Right. S102, determining a wafer fetching library from a plurality of preset wafer libraries according to the wafer fetching control parameter, may include: determining, according to the wafer library position identification parameter, from a plurality of preset wafer libraries, a wafer library at a target position indicated by the wafer library position identification parameter as a wafer fetching library.

[0053] For example, if there are two silicon wafer libraries, the options for Select are Left and Right. The user can choose different Select options on the library manager interface. Left means using one of the two silicon wafer libraries as the wafer extraction library, and Right means using the other silicon wafer library as the wafer extraction library. Specifically, Left and Right can respectively represent the silicon wafer libraries on the left and right, or the silicon wafer libraries on the top and bottom, as long as they represent silicon wafer libraries in two different positions. The specific meanings of Left and Right are not limited here.

[0054] In one embodiment, the scanning control parameter is a delayed scanning parameter LazyScan, and S103 controlling the wafer picking robot to scan the wafer picking library to determine the target silicon wafer in the wafer picking library may include: according to the delayed scanning parameter, controlling the wafer picking robot to automatically scan the wafer picking library to determine the target silicon wafer in the wafer picking library.

[0055] In this way, the silicon wafer library will not be scanned automatically each time it rotates to the working position. Before performing the exposure operation, if the silicon wafer library has not been scanned, a scan will be automatically performed. The working position refers to the normal position of the silicon wafer library. When replacing the silicon wafers in the silicon wafer library, the silicon wafer library needs to be rotated out of the working position and then rotated back to the working position after replacement.

[0056] In another embodiment, the scanning control parameter may be a passive scanning parameter NoScan, and the step of controlling the wafer picking robot to scan the wafer picking library and determine the target silicon wafer in the wafer picking library in S103 may include: controlling the wafer picking robot to scan the wafer picking library and determine the target silicon wafer in the wafer picking library according to the scanning control operation manually input by the user. In this way, the scanning of the silicon wafer library is completely performed by the user, and the user controls the scanning by himself before the exposure operation.

[0057] The scanning control parameter may also be a real-time scanning parameter EagerScan. According to the real-time scanning parameter, the wafer picking robot is controlled to scan the target wafer library rotated to the working position among the multiple preset wafer libraries. That is, among the multiple preset wafer libraries, as long as there is a target wafer library rotated to the working position, the target wafer library is automatically scanned. In this mode of the real-time scanning parameter EagerScan, there is no need to scan after determining the wafer picking library, and scanning is performed as long as it is rotated to the working position.

[0058] In one embodiment, the wafer placement control parameter may include a wafer library mode parameter ControlMode, and determining a wafer placement library from a plurality of preset wafer libraries according to the wafer placement control parameter in S104 may include:

[0059] If the wafer library mode parameter ControlMode is the single wafer library mode Single, then it is determined that the wafer placement library and the wafer retrieval library are the same wafer library, that is, in Single mode, only one wafer library is used, and the wafer retrieval robot takes out the unexposed wafers from the wafer library, and the wafer placement robot needs to put the exposed wafers back into the wafer library (including normally exposed and abnormally exposed wafers).

[0060] Alternatively, if the wafer library mode parameter ControlMode is the multi-wafer library mode Double, at this time, at least two wafer libraries are used. In this case, the wafer placement control parameter also includes the wafer stream parameter Stream, such as Figure 4 As shown in the figure, the process of determining the film library specifically includes:

[0061] S201. Determine a wafer storage library from a plurality of preset wafer storage libraries according to wafer flow parameters.

[0062] S202: If the wafer flow parameter is a local wafer flow parameter, determine that the wafer storage library and the wafer retrieval library are the same wafer storage library.

[0063] If the wafer flow parameter Stream is the local wafer flow parameter Local, it is determined that the wafer storage and the wafer retrieval library are the same wafer storage, that is, all wafers after the exposure operation are returned to their source locations (the location includes the wafer storage and slots).

[0064] S202, if the wafer flow parameters are other wafer flow parameters, determine a first wafer placement library and a second wafer placement library other than the wafer retrieval library from a plurality of preset wafer libraries, the first wafer placement library and the second wafer placement library being used to place wafers in different exposure states, respectively.

[0065] If the wafer flow parameter Stream is other wafer flow parameter Other, a first wafer storage and a second wafer storage are determined from multiple preset wafer storages, and the first wafer storage and the second wafer storage are used to place wafers in different exposure states, respectively. The different exposure states may include normal exposure and abnormal exposure, for example. When the wafer flow parameter Stream is other wafer flow parameter Other, the normally exposed wafers are placed in the first wafer storage, and the abnormally exposed wafers are placed in the second wafer storage.

[0066] In one embodiment, the transport control parameters may also include a processing batch parameter CarrierMode, such as Figure 5 As shown, the step S103 of controlling the wafer picking robot to scan the wafer picking library to determine the target silicon wafer in the wafer picking library may include:

[0067] S301, controlling the film fetching robot to scan the film fetching library.

[0068] According to the scanning control parameters, the film taking robot is controlled to scan the film taking library.

[0069] S302, determining a target silicon wafer from silicon wafers of a target batch corresponding to the processing batch parameter in the wafer library according to the processing batch parameter and the scanning result of the wafer library.

[0070] The processing batch parameters may include New and Old. New indicates that a silicon wafer library may contain silicon wafers of different batches, and Old indicates that the silicon wafers in a silicon wafer library are from the same batch. After controlling the wafer picking robot to scan the wafer picking library, the target silicon wafer is determined from the silicon wafers of the target batch corresponding to the processing batch parameters in the wafer picking library according to the processing batch parameters and the scanning results of the wafer picking library.

[0071] In one embodiment, the method of the present application also includes: if the wafer library mode parameter is the multi-wafer library mode Double, and the silicon wafer flow parameter is the local silicon wafer flow parameter Local, then after the exposure of the silicon wafers in multiple preset silicon wafer libraries is completed, the first wafer library replacement indication information is output to prompt the user that the silicon wafers in all silicon wafer libraries need to be replaced.

[0072] Alternatively, if the wafer library mode parameter is the multi-wafer library mode Double, and the silicon wafer flow parameter is other silicon wafer flow parameter Other, then after either the first wafer library or the second wafer library is full, the second wafer library replacement indication information is output to prompt the user to replace the silicon wafers in the full silicon wafer library.

[0073] Alternatively, if the wafer library mode parameter is the alternating wafer library mode Continue, and the wafer flow parameter is the local wafer flow parameter Local, then after any wafer library in the multiple preset wafer libraries is exposed, the third wafer library replacement indication information is output. Among them, the alternating wafer library mode Continue is the third wafer library mode parameter in addition to Single and Other, which is used to indicate that multiple wafer libraries are used in turn. For example, taking two wafer libraries as an example, the two wafer libraries will be used alternately.

[0074] Among the multiple parameters provided in this application, the wafer library mode parameter ControlMode can be specified as Double and Continue only when the user uses two or more wafer libraries, and the wafer flow parameter Stream can be specified as Other only when the user uses two or more wafer libraries. The remaining parameters are not limited and can be freely combined.

[0075] Take the example of using two wafer libraries, where the wafer fetching control parameter Select is Left, the wafer flow parameter Stream is Local, the batch processing parameter CarrierMode is New, the scanning control parameter ScanOption is EagerScan, the wafer library mode parameter ControlMode is Continue, and two wafer libraries are used. Assuming that both wafer libraries are available new wafer libraries before the exposure operation starts, the exposure operation process executed according to the above parameter combination is as follows:

[0076] 1. The wafer-taking robot takes the wafer from slot 0 of the left wafer library (Left), and puts it back into the wafer library after pre-alignment, exposure and other processes. Since the Stream option is specified as Local, the exposed silicon wafer will be put back into slot 0 of the left wafer library.

[0077] 2. Repeat the exposure process until all the silicon wafers in the left wafer library are exposed.

[0078] Taking the 4-inch wafer library as an example, after all 25 exposed silicon wafers are returned to the left wafer library, the ControlMode parameter is checked. If the exposure of the entire batch is not completed, the wafers will continue to be taken from the right wafer library (Right) in the Continue mode, and the user will be notified to change the left wafer library. When the user changes the left wafer library, the robot can normally pick up and put wafers in the right wafer library. After the exposure on the right side is completed, if the left wafer library is replaced, the operation can continue, thus improving efficiency.

[0079] 3. After the user replaces the left film library and the left film library rotates back to the working position, since ScanOption is specified as EagerScan, the scanning device on the film-taking robot will automatically scan the new film library without the user having to perform manual scanning operations. At this time, the robot may be busy, for example, the preloading station has not yet completed preloading. In this case, record the film library that needs to be scanned and continue to complete the scanning operation when the robot is idle.

[0080] In summary, the present application provides a silicon wafer management method, which has the following advantages:

[0081] 1. Different parameters can be freely combined to achieve a balance between work efficiency and manual controllability. For example, when using more than two film libraries, users can choose the options of Double, Local, and EagerScan, which has a higher degree of automation; or choose the options of Single, Local, and NoScan, and the operator can manually scan and change the film library.

[0082] 2. Strong scalability. Whether it is adding more wafer libraries to the subsequent lithography machine, or cooperating with the coating and developing equipment after the wafer is exposed, the expansion of new requirements will not affect the existing transmission and control strategy. For example, when using more than two wafer libraries, you can add Left1...Leftn and other CST numbers on the basis of the existing Select parameters without affecting the operation logic of Left and Right, thus realizing openness to expansion.

[0083] The following is a corresponding explanation of the device, equipment and storage medium for executing the silicon wafer management method provided by any of the above embodiments of the present application. Its specific implementation process and the technical effects produced are the same as those of the corresponding method embodiments mentioned above. For the sake of brief description, for the parts not mentioned in the following embodiments, please refer to the corresponding contents in the method embodiments.

[0084] Figure 6 A schematic diagram of the structure of the silicon wafer management device provided in this application, such as Figure 7 As shown, the present application provides a silicon wafer management device, comprising:

[0085] The acquisition module 10 is used to acquire the transmission control parameters of the film library manager, wherein the transmission control parameters include: film fetching control parameters, scanning control parameters and film placing control parameters.

[0086] The determination module 20 is used to determine a wafer fetching library from a plurality of preset silicon wafer libraries according to the wafer fetching control parameters.

[0087] The control module 30 is used to control the wafer picking robot to scan the wafer picking library according to the scanning control parameters, determine the target silicon wafer in the wafer picking library, and control the wafer picking robot to transport the target silicon wafer to the silicon wafer workbench for exposure.

[0088] The transport module 40 is used to determine a wafer placement library from a plurality of preset wafer placement libraries according to wafer placement control parameters after exposure is completed, and control a wafer placement robot to transport the exposed target wafer from the wafer workbench to the wafer placement library.

[0089] The above-mentioned device is used to execute the method provided by the aforementioned embodiment, and its implementation principle and technical effect are similar, which will not be repeated here.

[0090] The above modules may be one or more integrated circuits configured to implement the above methods, such as one or more application specific integrated circuits (ASICs), or one or more microprocessors, or one or more field programmable gate arrays (FPGAs). For another example, when a module is implemented in the form of a processing element scheduling program code, the processing element may be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call program code. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).

[0091] Alternatively, if Figure 7 As shown, the present application provides an implementation method of a transmission control device, which may include a processor 100, a storage medium 200 and a bus 300. The storage medium stores program instructions executable by the processor. When the transmission control device is running, the processor and the storage medium communicate through the bus, and the processor executes the program instructions to implement the silicon wafer management method of the above embodiment.

[0092] Optionally, the present application further provides a readable storage medium, on which program instructions are stored, and when the program instructions are executed by a processor, the silicon wafer management method of the above embodiment is implemented.

[0093] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0094] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0095] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0096] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (English: processor) to perform some steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (English: Read-Only Memory, abbreviated: ROM), random access memory (English: Random Access Memory, abbreviated: RAM), disk or optical disk and other media that can store program codes.

[0097] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A silicon wafer management method, characterized in that: include: Acquire the transmission control parameters of the film library manager, wherein the transmission control parameters include: film fetching control parameters, scanning control parameters and film placing control parameters; According to the wafer fetching control parameter, determining a wafer fetching library from a plurality of preset wafer libraries; According to the scanning control parameters, the wafer picking robot is controlled to scan the wafer picking library, determine the target silicon wafer in the wafer picking library, and control the wafer picking robot to transport the target silicon wafer to the silicon wafer workbench for exposure; After the exposure is completed, a wafer placement library is determined from the plurality of preset wafer libraries according to the wafer placement control parameters, and a wafer placement robot is controlled to transport the exposed target wafer from the wafer workbench to the wafer placement library.

2. The method according to claim 1, characterized in that The wafer fetching control parameters include: wafer library location identification parameters; Determining a wafer library from a plurality of preset wafer libraries according to the wafer access control parameter includes: According to the wafer library position identification parameter, a wafer library at a target position indicated by the wafer library position identification parameter is determined from the plurality of preset wafer libraries as the wafer fetching library.

3. The method according to claim 1, characterized in that The scanning control parameter is a delayed scanning parameter, and the control of the wafer picking robot to scan the wafer picking library to determine the target silicon wafer in the wafer picking library includes: According to the delayed scanning parameters, the wafer picking robot is controlled to automatically scan the wafer picking library to determine the target silicon wafer in the wafer picking library.

4. The method according to claim 1, characterized in that: The scanning control parameter is a passive scanning parameter, and the control of the wafer picking robot to scan the wafer picking library to determine the target silicon wafer in the wafer picking library includes: According to the input scanning control operation, the wafer picking robot is controlled to scan the wafer picking library to determine the target silicon wafer in the wafer picking library.

5. The method according to claim 1, characterized in that The method further comprises: If the scanning control parameter is a real-time scanning parameter, the wafer picking robot is controlled to scan the target wafer library rotated to the working position among the multiple preset wafer libraries according to the real-time scanning parameter.

6. The method according to claim 1, characterized in that The wafer placement control parameter includes: a wafer library mode parameter, and determining a wafer placement library from the plurality of preset wafer libraries according to the wafer placement control parameter includes: If the wafer library mode parameter is a single wafer library mode, it is determined that the wafer placement library and the wafer retrieval library are the same wafer library; or, If the wafer library mode parameter is a multi-wafer library mode, the wafer placement control parameter further includes: a wafer flow parameter, and the wafer placement library is determined from the multiple preset wafer libraries according to the wafer flow parameter.

7. The method according to claim 6, characterized in that The step of determining the wafer placement library from the plurality of preset wafer libraries according to the wafer flow parameters includes: If the wafer flow parameter is a local wafer flow parameter, determining that the wafer storage library and the wafer retrieval library are the same wafer storage library; If the wafer flow parameters are other wafer flow parameters, a first wafer placement library and a second wafer placement library outside the wafer retrieval library are determined from the multiple preset wafer libraries, and the first wafer placement library and the second wafer placement library are respectively used to place wafers in different exposure states.

8. The method according to claim 1, characterized in that: The transmission control parameters also include: processing batch parameters; the control of the wafer picking robot to scan the wafer picking library to determine the target silicon wafer in the wafer picking library includes: Controlling the film taking robot to scan the film taking library; According to the processing batch parameters and the scanning result of the wafer library, the target silicon wafer is determined from the silicon wafers of the target batch corresponding to the processing batch parameters in the wafer library.

9. The method according to claim 7, characterized in that: The method further comprises: If the wafer library mode parameter is a multi-wafer library mode, and the wafer flow parameter is a local wafer flow parameter, after the exposure of the wafers in the plurality of preset wafer libraries is completed, the first wafer library replacement indication information is output; or, If the wafer library mode parameter is a multi-wafer library mode, and the wafer flow parameter is other wafer flow parameters, then after any one of the first wafer library and the second wafer library is full, the second wafer library replacement indication information is output; or, If the wafer library mode parameter is an alternating wafer library mode, and the wafer flow parameter is a local wafer flow parameter, after the exposure of any wafer library among the plurality of preset wafer libraries is completed, a third wafer library replacement indication information is output.

10. A silicon wafer transmission control system, characterized in that: include: Transmission control equipment, equipment front-end modules; The front-end module of the equipment is provided with: a wafer taking robot, a wafer placing robot and a plurality of preset silicon wafer libraries; The film taking robot and the film placing robot are respectively connected to the transmission control device; The transmission control device is used to execute the silicon wafer management method described in any one of claims 1-9 above.

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