Display module and electronic equipment

Abstract

The invention discloses a display module and electronic equipment, and belongs to the field of display. The display module comprises a screen body and a flexible circuit board layer, the screen body is provided with a non-display surface, and the flexible circuit board layer is arranged close to the non-display surface of the screen body; the screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, the flexible circuit board layer is divided into a first bent part and a straight part, the straight part is arranged close to the non-display surface, the first bent part is arranged far away from the non-display surface, and the plane where the straight part is located is parallel to the non-display surface. The first bending part at least partially covers the straight part after being bent, a first avoiding hole is formed in the first bending part, electronic elements are arranged on the straight part, and at least one electronic element is located in the first avoiding hole.

Description

Technical Field

[0001] The present application belongs to the field of display, and specifically relates to a display module and an electronic device. Background Art

[0002] With the development of science and technology, users not only require electronic devices to be powerful, but also pay more and more attention to extreme lightness and thinness. Specifically, electronic devices are not only required to be powerful, but also to be outstanding in appearance, light enough, thin enough and durable enough. As electronic devices have more and more functions, more and more devices are required. The pursuit of lightness and thinness makes the layout space of devices more and more extreme. The miniaturization of devices has become a current pain point. For example, when electronic devices are extremely light and thin, the capacity of the battery will be affected. The smaller the battery capacity, the shorter the user's use time, which affects the user experience. However, to ensure the battery capacity and meet the requirements of lightness and thinness, other devices need to make room, so it becomes particularly important to save space and increase component density. In the related art, the transfer circuit board of the display module of the electronic device currently carries many devices and requires a large space for wiring, resulting in a large area of ​​the transfer circuit board of the display module, which occupies more space of the whole machine, and then leads to a reduction in the installation space of the battery of the electronic device, making the battery capacity smaller. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a display module and an electronic device, which at least solves the problem that the area of ​​the adapter circuit board of the display module is large, thereby occupying more space of the entire machine, which in turn leads to a reduction in the installation space of the battery of the electronic device, resulting in a smaller battery capacity.

[0004] In a first aspect, an embodiment of the present application provides a display module, the display module comprising: a screen body and a flexible circuit board layer;

[0005] The screen body has a non-display surface, and the flexible circuit board layer is arranged adjacent to the non-display surface of the screen body;

[0006] The screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, and the flexible circuit board layer is divided into a first bending portion and a straight portion, the straight portion is arranged adjacent to the non-display surface, the first bending portion is arranged away from the non-display surface, the plane where the straight portion is located is parallel to the non-display surface, the first bending portion at least partially covers the straight portion after being bent, and a first avoidance hole is opened on the first bending portion, electronic components are arranged on the straight portion, and at least one of the electronic components is located in the first avoidance hole.

[0007] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a device body and a display module as described in any one of the first aspects above;

[0008] The display module is installed on the device body.

[0009] In the embodiment of the present application, since the flexible circuit board layer is arranged adjacent to the non-display surface of the flexible circuit board layer, and the flexible circuit board layer is parallel to the non-display surface, it is equivalent to the flexible circuit board being laid flat on the non-display surface of the screen body, and the flexible circuit board will not affect the display of the screen body, and the flexible circuit board can transmit signals to the screen body. Since the flexible circuit board layer is bent on the first side in the first direction, and the flexible circuit board layer is divided into a first bending portion and a straight portion, the straight portion is arranged adjacent to the non-display surface, and the first bending portion at least partially covers the straight portion after bending, it is equivalent to the first bending portion and the straight portion being stacked, so that the integrated circuit can be arranged in the first bending portion, avoiding increasing the area of ​​the flexible circuit board layer in the first direction, thereby causing the problem of the flexible circuit board layer occupying more space in the first direction. In addition, a first avoidance hole is arranged on the first bending portion, and an electronic component is arranged on the straight portion, and at least one electronic component is located in the first avoidance hole, so that the first bending portion can protect the electronic component, and in the process of transporting the display module or assembling the display module, the first bending portion can protect the electronic component to avoid the problem of the electronic component being damaged by force. That is, in the embodiment of the present application, by setting the bend of the flexible circuit board layer, and the flexible circuit board layer is divided into a first bend portion and a straight portion, an integrated circuit can be installed on the first bend portion, and electronic components can be arranged on the straight portion, so as to avoid the problem that the flexible circuit board layer occupies more space in the first direction, resulting in a reduction in the installation space of the battery inside the electronic device, thereby increasing the installation space of the battery of the electronic device and improving the capacity of the battery of the electronic device, and the electronic component is located in the first avoidance hole of the first bend portion, and the first bend portion can protect the electronic component, that is, in the embodiment of the present application, on the one hand, the space occupied by the flexible circuit board layer in the first direction can be reduced to improve the battery capacity of the electronic device, and on the other hand, it does not affect the installation of the electronic component and can protect the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 One of the schematic diagrams showing a display module provided in an embodiment of the present application;

[0011] Figure 2 A second schematic diagram showing a display module provided in an embodiment of the present application;

[0012] Figure 3 A third schematic diagram showing a display module provided in an embodiment of the present application;

[0013] Figure 4 A fourth schematic diagram showing a display module provided in an embodiment of the present application;

[0014] Figure 5 A fifth schematic diagram showing a display module provided in an embodiment of the present application.

[0015] Reference numerals:

[0016] 10: screen body; 101: non-display surface; 20: flexible circuit board layer; 201: first bending portion; 202: straight portion; 203: second bending portion; 204: third bending portion; 205: fourth bending portion; 2011: first avoidance hole; 2031: second avoidance hole; 2041: fourth avoidance hole; 2051: fifth avoidance hole; 100: first reinforced circuit board layer; 110: third avoidance hole; 001: electronic component; 002: adhesive layer; 003: connector; 004: mounting circuit board; 005: connecting circuit board; 006: adhesive; 007: conductive member; 008: adhesive glue; X: first direction: Y: second direction. DETAILED DESCRIPTION

[0017] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0018] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0019] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0020] like Figures 1 to 5As shown, the display module includes: a screen body 10 and a flexible circuit board layer 20;

[0021] The screen body 10 has a non-display surface 101, and the flexible circuit board layer 20 is arranged adjacent to the non-display surface 101 of the screen body 10; the screen body 10 has a first direction X, the flexible circuit board layer 20 is bent on the first side in the first direction X, and the flexible circuit board layer 20 is divided into a first bending portion 201 and a straight portion 202, the straight portion 202 is arranged adjacent to the non-display surface 101, the first bending portion 201 is arranged away from the non-display surface 101, the plane where the straight portion 202 is located is parallel to the non-display surface 101, the first bending portion 201 at least partially covers the straight portion 202 after being bent, and a first avoidance hole 2011 is opened on the first bending portion 201, an electronic component 001 is arranged on the straight portion 202, and at least one electronic component 001 is located in the first avoidance hole 2011.

[0022] In the embodiment of the present application, since the flexible circuit board layer 20 is arranged adjacent to the non-display surface 101 of the flexible circuit board layer 20, it is equivalent to the flexible circuit board being laid flat on the non-display surface 101 of the screen body 10, and the flexible circuit board will not affect the display of the screen body 10, and the flexible circuit board can transmit signals to the screen body 10. Since the flexible circuit board layer 20 is bent at the first side in the first direction X, and the flexible circuit board layer 20 is divided into a first bending portion 201 and a straight portion 202, the straight portion 202 is arranged adjacent to the non-display surface 101, and the plane where the straight portion 202 is located is parallel to the non-display surface 101, and the first bending portion 201 is bent to at least partially cover the straight portion 202, it is equivalent to the first bending portion 201 and the straight portion 202 being arranged in a stacked manner, so that the integrated circuit can be integrated in the first bending portion 201, avoiding increasing the area of ​​the flexible circuit board in the first direction X, thereby causing the problem that the flexible circuit board layer 20 occupies more space in the first direction X. In addition, a first avoidance hole 2011 is provided on the first bending portion 201, and an electronic component 001 is provided on the straight portion 202. At least one electronic component 001 is located in the first avoidance hole 2011, so that the first bending portion 201 can protect the electronic component 001. During the transportation or assembly of the display module, the first bending portion 201 can protect the electronic component 001 to avoid the problem of the electronic component 001 being damaged by force. That is, in the embodiment of the present application, by setting the flexible circuit board layer 20 to be bent, and the flexible circuit board layer 20 is divided into a first bent portion 201 and a straight portion 202, an integrated circuit can be installed on the first bent portion 201, and an electronic component 001 can be arranged on the straight portion 202, so as to avoid the problem that the flexible circuit board layer 20 occupies more space in the first direction X, resulting in a reduction in the installation space of the battery inside the electronic device, thereby increasing the installation space of the battery of the electronic device and improving the capacity of the battery of the electronic device, and at least one electronic component 001 is located in the first avoidance hole 2011 of the first bent portion 201, and the first bent portion 201 can protect the electronic component 001, that is, in the embodiment of the present application, on the one hand, the space occupied by the flexible circuit board layer 20 in the first direction X can be reduced to improve the battery capacity of the electronic device, and on the other hand, it does not affect the installation of the electronic component 001 and can protect the electronic component 001.

[0023] It should be noted that the non-display surface 101 of the screen body 10 may be provided with a mounting circuit board 004, the mounting circuit board 004 is bonded to the non-display surface 101 of the screen body 10 by means of adhesive 008, the plane where the mounting circuit board 004 is located is parallel to the non-display surface 101, and the straight portion 202 is provided on the mounting circuit board 004, that is, the straight portion 202 is mounted on the mounting circuit board 004 by means of adhesive 006, and the adhesive 006 is provided with a conductive member 007, so that the straight portion 202 is electrically connected to the mounting circuit board 004. In addition, the screen body 10 is connected with a connecting circuit board 005, and the connecting circuit board 005 is connected to the mounting circuit board 004, so that the screen body 10 can transmit signals to the mounting circuit board 004 through the connecting circuit board 005, so that the mounting circuit board 004 transmits the signals to the electronic components 001 on the flexible circuit board and the circuit in the flexible circuit board.

[0024] In addition, in the embodiment of the present application, by setting the flexible circuit board layer 20 to be bent, and the flexible circuit board layer 20 is divided into a first bent portion 201 and a straight portion 202, an integrated circuit can be installed on the first bent portion 201, and the electronic component 001 is arranged on the straight portion 202. It is also possible to avoid setting up additional components in the stacking direction of the first bent portion 201 and the straight portion 202 to integrate the electronic component 001, thereby reducing the size of the display module in the stacking direction of the first bent portion 201 and the straight portion 202. The stacking direction of the first bent portion 201 and the straight portion 202 can be the thickness direction of the electronic device. When the electronic device is a mobile phone, the stacking direction of the first bent portion 201 and the straight portion 202 is the thickness direction of the mobile phone. Figure 1 As shown, the stacking direction of the first bending portion 201 and the straight portion 202 can be Figure 1 The direction of the mid-coordinate axis Z.

[0025] In addition, in the embodiment of the present application, when the electronic device is a mobile phone, the first direction X may be the length direction of the mobile phone. Figure 1 As shown, the first direction X can be Figure 1 The direction of the median axis X.

[0026] In addition, in the embodiment of the present application, the first bent portion 201 may completely cover the straight portion 202. Of course, the first bent portion 201 may also only cover a portion of the straight portion 202. This embodiment of the present application does not limit this.

[0027] In addition, in the embodiment of the present application, the first bending portion 201 and the straight portion 202 may be bonded by the bonding member 006. Of course, there may also be a gap between the first bending portion 201 and the straight portion 202. This embodiment of the present application does not limit this.

[0028] In addition, in some embodiments, the flexible circuit board layer 20 is also bent on the second side of the first direction X, and the flexible circuit board layer 20 is divided into a straight portion 202 and a second bent portion 203, the first side and the second side are opposite to each other in the first direction X, and the second bent portion 203 at least partially covers the first bent portion 201 after being bent, and the second bent portion 203 is located on the side of the first bent portion 201 away from the straight portion 202.

[0029] Since the second bending portion 203 at least partially covers the first bending portion 201 after bending, it is equivalent to the second bending portion 203 and the first bending portion 201 being stacked, so that the integrated circuit can also be integrated in the second bending portion 203, avoiding the problem of increasing the area of ​​the flexible circuit board in the first direction X, resulting in the space inside the electronic device being occupied by the flexible circuit board, and then resulting in the problem of reduced battery capacity of the electronic device. In addition, the second bending portion 203 is located on the side of the first bending portion 201 away from the straight portion 202, so that the second bending portion 203 has less impact on the electronic component 001 on the straight portion 202, ensuring that the electronic component 001 can operate effectively. That is, by bending the flexible circuit board on the second side of the first direction X, the space occupied by the flexible circuit board in the first direction X can be further reduced, which is conducive to improving the battery capacity of the electronic device.

[0030] It should be noted that the second bending portion 203 and the first bending portion 201 can be bonded together by the adhesive 006, so that the first bending portion 201 can fix the second bending portion 203 to avoid the problem of the second bending portion 203 being easy to shake.

[0031] In addition, in some embodiments, a second avoidance hole 2031 is provided on the second bending portion 203 , and the second avoidance hole 2031 is at least partially communicated with the first avoidance hole 2011 .

[0032] Through such a setting, it is equivalent to that the second avoidance hole 2031 will avoid the electronic component 001 in the first avoidance hole 2011, so as to avoid the second bending portion 203 from blocking the electronic component 001 in the first avoidance hole 2011, resulting in the problem that the performance of the electronic component 001 may be affected. That is, by setting the second avoidance hole 2031 and the first avoidance hole 2011 at least partially connected along the direction in which the first bending portion 201 and the second bending portion 203 are stacked, the second avoidance hole 2031 will not block the electronic component 001, thereby ensuring the effective operation of the electronic component 001.

[0033] It should be noted that when the size of the electronic component 001 is relatively large, the electronic component 001 may extend into the second avoidance hole 2031 , that is, the electronic component 001 is located in both the first avoidance hole 2011 and the second avoidance hole 2031 .

[0034] In addition, in some embodiments, Figure 3 As shown, along the direction from the first bent portion 201 to the straight portion 202, a first reinforced circuit board layer 100 is provided on the surface of the first bent portion 201 facing the straight portion 202, and a third avoidance hole 110 is provided on the first reinforced circuit board layer 100. Along the direction from the first bent portion 201 to the straight portion 202, the third avoidance hole 110 is at least partially connected with the first avoidance hole 2011, and at least one electronic component 001 is located in the first avoidance hole 2011 and the third avoidance hole 110.

[0035] Since the first reinforcing circuit board layer 100 is disposed on the surface of the first bending portion 201 facing the straight portion 202, an integrated circuit can be disposed in the first reinforcing circuit board layer 100, which is equivalent to increasing the components on which the integrated circuit can be disposed, and can avoid the increase in the size of the flexible circuit board in the first direction X in order to dispose an additional integrated circuit, so that the size of the flexible circuit board in the first direction X can be reduced. In addition, the first reinforcing circuit board is provided with a third avoidance hole 110, and the third avoidance hole 110 is at least partially connected to the first avoidance hole 2011, so that at least one electronic component 001 can be located in the first avoidance hole 2011 and the third avoidance hole 110, thereby avoiding the problem that the first reinforcing circuit board affects the electronic component 001. That is, by providing the first reinforcing circuit board layer 100, an integrated circuit can be disposed in the first reinforcing circuit board layer 100, which is conducive to reducing the space occupied by the flexible circuit board in the first direction X.

[0036] In addition, in the embodiment of the present application, there may be a gap between the first reinforced circuit board layer 100 and the straight portion 202. Of course, the first reinforced circuit board layer 100 may also be bonded to the straight portion 202 through the adhesive 006, so that the straight portion 202 can fix the first reinforced circuit board layer 100. This embodiment of the present application is not limited here.

[0037] In addition, in some embodiments, the first reinforced circuit board layer 100 is arranged on the surface of the first bending portion 201 facing the straight portion 202 through the adhesive layer 002, and the adhesive layer 002 is provided with a through hole, which is at least partially connected to the third avoidance hole 110 and the first avoidance hole 2011; wherein, a connecting member 003 is provided in the through hole, and the connecting member 003 respectively connects the first reinforced circuit board layer 100 and the first bending portion 201.

[0038] Since the first reinforced circuit board layer 100 is arranged on the surface of the first bending portion 201 facing the straight portion 202 through the adhesive layer 002, the first bending portion 201 can fix the first reinforced circuit board layer 100, thereby preventing the first reinforced circuit board layer 100 from shaking relative to the first bending portion 201. In addition, the adhesive layer 002 is provided with a through hole, and a connector 003 is provided in the through hole. The connector 003 connects the first reinforced circuit board layer 100 and the first bending portion 201 respectively. Therefore, the first reinforced circuit board layer 100 and the first bending portion 201 can be connected through the connector 003, and the existence of the through hole provides an installation space for the connector 003, so that it is easy to install the connector 003, and then it is easy to electrically connect the first reinforced circuit board layer 100 and the first bending portion 201. That is, by providing the adhesive layer 002 and the connector 003 , not only can the first reinforced circuit board layer 100 be prevented from shaking relative to the first bending portion 201 , but also the first reinforced circuit board layer 100 can be easily electrically connected to the first bending portion 201 .

[0039] It should be noted that the connector 003 may be a metal layer, which is disposed on the inner wall of the through hole, and the metal layer is electrically connected to the first reinforced circuit board layer 100 and the first bending portion 201, respectively, so that the first bending portion 201 is electrically connected to the first reinforced circuit board layer 100. Of course, the connector 003 may also be other components, for example, the connector 003 is a wire, and for another example, the connector 003 is a metal rod. The specific type of the connector 003 is not limited in the embodiment of the present application.

[0040] In addition, in some embodiments, the screen body 10 has a second direction Y, the second direction Y intersects with the first direction X, the flexible circuit board layer 20 is bent on the third side in the second direction Y, and the flexible circuit board layer 20 is divided into a third bending portion 204 and a straight portion 202, the third bending portion 204 at least partially covers the first bending portion 201 after bending, and the third bending portion 204 is located on the side of the first bending portion 201 away from the straight portion 202.

[0041] Since the third bending portion 204 at least partially covers the first bending portion 201 after bending, it is equivalent to the third bending portion 204 and the first bending portion 201 being stacked, so that the integrated circuit can also be integrated in the third bending portion 204, avoiding the problem of increasing the area of ​​the flexible circuit board layer 20 in the second direction Y, resulting in the space inside the electronic device being occupied by the flexible circuit board layer 20, and then resulting in the problem of reduced battery capacity of the electronic device. In addition, the third bending portion 204 is located on the side of the first bending portion 201 away from the straight portion 202, so that the third bending portion 204 has less impact on the electronic component 001 on the straight portion 202, ensuring that the electronic component 001 can operate effectively. That is, by bending the flexible circuit board layer 20 on the third side of the second direction Y, the space occupied by the flexible circuit board layer 20 in the second direction Y can be reduced, so that the internal space utilization rate of the electronic device is improved.

[0042] It should be noted that the third bending portion 204 and the first bending portion 201 can be bonded together by the adhesive 006, so that the first bending portion 201 can fix the third bending portion 204 to avoid the problem of the third bending portion 204 being easy to shake.

[0043] In addition, in the embodiment of the present application, when the electronic device is a mobile phone, the second direction Y may be the width direction of the mobile phone. Figure 5 As shown, the second direction Y can be Figure 5 The direction of the mid-coordinate axis Y.

[0044] In addition, in the embodiment of the present application, the third bending portion 204 may cover part of the first bending portion 201. Of course, the third bending portion 204 may also cover the entire first bending portion 201. This embodiment of the present application does not limit this.

[0045] In addition, in some embodiments, a fourth avoidance hole 2041 is disposed on the third bending portion 204 , and along the direction from the third bending portion 204 to the first bending portion 201 , the fourth avoidance hole 2041 is at least partially connected to the first avoidance hole 2011 .

[0046] Through such a setting, it is equivalent to that the fourth avoidance hole 2041 will avoid the electronic component 001 in the first avoidance hole 2011, so as to avoid the third bending portion 204 from blocking the electronic component 001 in the first avoidance hole 2011, resulting in the problem that the performance of the electronic component 001 may be affected. That is, by setting the fourth avoidance hole 2041 and the first avoidance hole 2011 at least partially in communication along the direction in which the third bending portion 204 and the first bending portion 201 are stacked, the third avoidance hole 2041 will not block the electronic component 001, thereby ensuring the effective operation of the electronic component 001.

[0047] It should be noted that when the size of the electronic component 001 is relatively large, the electronic component 001 may extend into the fourth avoidance hole 2041 , that is, the electronic component 001 is located in both the first avoidance hole 2011 and the fourth avoidance hole 2041 .

[0048] In addition, in some embodiments, the flexible circuit board layer 20 is bent at the fourth side in the second direction Y, and the flexible circuit board layer 20 is divided into a straight portion 202 and a fourth bent portion 205, the fourth side is opposite to the third side in the second direction Y, the fourth bent portion 205 at least partially covers the third bent portion 204 after being bent, and the fourth bent portion 205 is located on the side of the third bent portion 204 away from the straight portion 202.

[0049] Since the fourth bending portion 205 at least partially covers the third bending portion 204 after bending, it is equivalent to the fourth bending portion 205 and the third bending portion 204 being stacked, so that the integrated circuit can also be integrated in the fourth bending portion 205, avoiding the problem of increasing the area of ​​the flexible circuit board layer 20 in the second direction Y, resulting in the space inside the electronic device being occupied by the flexible circuit board layer 20, and then resulting in the problem of reduced battery capacity of the electronic device. In addition, the fourth bending portion 205 is located on the side of the third bending portion 204 away from the straight portion 202, so that the fourth bending portion 205 has less impact on the electronic component 001 on the straight portion 202, ensuring that the electronic component 001 can operate effectively. That is, by bending the flexible circuit board layer 20 on the fourth side of the second direction Y, the space occupied by the flexible circuit board layer 20 in the second direction Y can be reduced, so that the space utilization rate inside the electronic device is improved.

[0050] It should be noted that the fourth bending portion 205 and the third bending portion 204 can be bonded together by the adhesive 006, so that the third bending portion 204 can fix the fourth bending portion 205 to avoid the problem of the fourth bending portion 205 being easy to shake.

[0051] In addition, in the embodiment of the present application, the fourth bending portion 205 may cover part of the third bending portion 204. Of course, the fourth bending portion 205 may also cover the entire third bending portion 204. This embodiment of the present application does not limit this.

[0052] In addition, in some embodiments, a fifth avoidance hole 2051 is disposed on the fourth bending portion 205 , and along the direction from the third bending portion 204 to the fourth bending portion 205 , the fifth avoidance hole 2051 is at least partially connected with the fourth avoidance hole 2041 .

[0053] By such arrangement, it is possible to avoid the fourth bending portion 205 shielding the electronic component 001 in the first avoidance hole 2011, which may affect the performance of the electronic component 001. That is, by arranging along the direction in which the fourth bending portion 205 and the third bending portion 204 are stacked, the fifth avoidance hole 2051 is at least partially connected to the fourth avoidance hole 2041, and the fourth avoidance hole 2041 is opposite to the first avoidance hole 2011, so as to avoid the fourth bending portion 205 shielding the electronic component 001, thereby ensuring the effective operation of the electronic component 001.

[0054] It should be noted that when the size of the electronic component 001 is relatively large, the electronic component 001 may extend into the fifth avoidance hole 2051 , that is, the electronic component 001 is located in the first avoidance hole 2011 , the fourth avoidance hole 2041 and the fourth avoidance hole 2041 at the same time.

[0055] In addition, in the embodiment of the present application, a second reinforced circuit board layer may be provided on the surface of the fourth bending portion 205 away from the third bending portion 204, and an integrated circuit may be implemented in the second reinforced circuit board layer.

[0056] In addition, in the embodiment of the present application, when the flexible circuit board layer 20 is bent along the first side and the second side of the first direction X to form a first bending portion 201 and a second bending portion 203, and the flexible circuit board layer 20 is bent along the third side and the fourth side of the second direction Y to form a third bending portion 204 and a fourth bending portion 205, at this time, it is equivalent to bending the edge of the flexible circuit board layer 20, so that the size of the flexible circuit board layer 20 in the first direction X and the second direction Y is reduced.

[0057] In addition, in the embodiment of the present application, during the production of the display module, the two layers of flexible circuit board layers 20 can be bonded and pressed together using PP material, and then the two layers of flexible circuit board layers 20 pressed together can be insulated, and then the two layers of flexible circuit board layers 20 can be partially punched and grooved to form avoidance holes, and then the two layers of flexible circuit board layers 20 can be bent to form a first bending portion 201 and a straight portion 202. Alternatively, when the flexible circuit board layer 20 is bent, the first bending portion 201, the second bending portion 203, the third bending portion 204, and the fourth bending portion 205 can be formed respectively.

[0058] It should be noted that, in the embodiment of the present application, the adhesive 008 or the adhesive member 006 can be anisotropic conductive film (ACF).

[0059] In the embodiment of the present application, by setting the flexible circuit board layer 20 to be bent, and the flexible circuit board layer 20 is divided into a first bent portion 201 and a straight portion 202, an integrated circuit can be installed on the first bent portion 201, and an electronic component 001 can be arranged on the straight portion 202, so as to avoid the problem that the flexible circuit board layer 20 occupies more space in the first direction X, resulting in a reduction in the installation space of the battery inside the electronic device, thereby increasing the installation space of the battery of the electronic device and improving the capacity of the battery of the electronic device, and at least one electronic component 001 is located in the first avoidance hole 2011 of the first bent portion 201, and the first bent portion 201 can protect the electronic component 001, that is, in the embodiment of the present application, on the one hand, the space occupied by the flexible circuit board in the first direction X can be reduced to improve the battery capacity of the electronic device, and on the other hand, it does not affect the installation of the electronic component 001 and can protect the electronic component 001. In addition, in the embodiment of the present application, by providing the first reinforcing circuit board layer 100 on the surface of the first bending portion 201 facing the straight portion 202 along the direction in which the first bending portion 201 and the straight portion 202 are stacked, it is also possible to avoid the size of the flexible circuit board layer 20 in the first direction X increasing in order to provide an additional integrated circuit, so that the size of the flexible circuit board in the first direction X can be reduced. In addition, the flexible circuit board layer 20 is bent at the third side in the second direction Y, and the flexible circuit board layer 20 is divided into the third bending portion 204 and the straight portion 202, and an integrated circuit can also be provided in the third bending portion 204, so as to avoid increasing the area of ​​the flexible circuit board in the second direction Y, resulting in more space inside the electronic device being occupied by the flexible circuit board, and thus resulting in the problem of reduced battery capacity of the electronic device.

[0060] An embodiment of the present application provides an electronic device, which includes a device body and a display module in any of the above embodiments; the display module is installed on the device body.

[0061] Among them, a control circuit board can be set in the device body, and the control circuit board is electrically connected to the flexible circuit board layer 20, so that the control circuit board can transmit signals to the flexible circuit board layer 20, and then the flexible circuit board layer 20 can transmit signals to the screen body 10, thereby realizing the control of the screen body 10 by the control circuit board.

[0062] It should be noted that in the embodiments of the present application, electronic devices include but are not limited to controllers, smart devices, terminal products and other devices, where smart devices are, for example, smart phones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices and other devices, and terminal products include personal computers, tablet computers and other products.

[0063] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0064] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: The display module comprises: a screen body and a flexible circuit board layer; The screen body has a non-display surface, and the flexible circuit board layer is arranged adjacent to the non-display surface of the screen body; The screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, and the flexible circuit board layer is divided into a first bending portion and a straight portion, the straight portion is arranged adjacent to the non-display surface, the first bending portion is arranged away from the non-display surface, the plane where the straight portion is located is parallel to the non-display surface, the first bending portion at least partially covers the straight portion after being bent, and a first avoidance hole is opened on the first bending portion, electronic components are arranged on the straight portion, and at least one of the electronic components is located in the first avoidance hole.

2. The display module according to claim 1, characterized in that: The flexible circuit board layer is also bent at the second side of the first direction, and the flexible circuit board layer is divided into the straight portion and a second bent portion, the first side and the second side are opposite to each other in the first direction, the second bent portion at least partially covers the first bent portion after being bent, and the second bent portion is located on the side of the first bent portion away from the straight portion.

3. The display module according to claim 2, characterized in that: The second bending portion is provided with a second avoidance hole, and the second avoidance hole is at least partially communicated with the first avoidance hole.

4. The display module according to claim 1, characterized in that: Along the direction from the first bent portion to the straight portion, a first reinforced circuit board layer is provided on the surface of the first bent portion facing the straight portion, and a third avoidance hole is provided on the first reinforced circuit board layer. Along the direction from the first bent portion to the straight portion, the third avoidance hole is at least partially connected with the first avoidance hole, and at least one of the electronic components is located in the first avoidance hole and the third avoidance hole.

5. The display module according to claim 4, characterized in that: The first reinforced circuit board layer is arranged on the surface of the first bending portion facing the straight portion through an adhesive layer, and the adhesive layer is provided with a through hole, and the through hole is at least partially communicated with the third avoidance hole and the first avoidance hole; Wherein, a connecting piece is arranged in the through hole, and the connecting piece is respectively connected to the first reinforced circuit board layer and the first bending portion.

6. The display module according to claim 1, characterized in that: The screen body has a second direction, which intersects with the first direction. The flexible circuit board layer is bent on a third side in the second direction, and the flexible circuit board layer is divided into a third bending portion and the straight portion. After being bent, the third bending portion at least partially covers the first bending portion, and the third bending portion is located on the side of the first bending portion away from the straight portion.

7. The display module according to claim 6, characterized in that: A fourth avoidance hole is provided on the third bending portion, and along the direction from the third bending portion to the first bending portion, the fourth avoidance hole is at least partially communicated with the first avoidance hole.

8. The display module according to claim 6, characterized in that: The flexible circuit board layer is bent at the fourth side in the second direction, and the flexible circuit board layer is divided into the straight portion and a fourth bent portion, the fourth side is opposite to the third side in the second direction, the fourth bent portion at least partially covers the third bent portion after being bent, and the fourth bent portion is located on the side of the third bent portion away from the straight portion.

9. The display module according to claim 8, characterized in that: The fourth bending portion is provided with a fifth avoidance hole, and along the direction from the third bending portion to the fourth bending portion, the fifth avoidance hole is at least partially communicated with the fourth avoidance hole.

10. An electronic device, characterized in that: The electronic device comprises a device body and a display module according to any one of claims 1 to 9; The display module is installed on the device body.

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