External electrode structure, preparation method, electronic component and electronic equipment

Abstract

The invention discloses an external electrode structure, a preparation method, an electronic component and electronic equipment, the external electrode structure is connected to a component main body of the electronic component, and the external electrode structure comprises a first electrode layer and a second electrode layer. The first electrode layer has a first side and a second side in a thickness direction thereof, and the first side is configured to be connected to the component body. The second electrode layer is connected to the second side, and at least part of the second electrode layer extends into the first electrode layer. In the external electrode structure disclosed by the invention, the second electrode layer extends into the second side of the first electrode layer, so that the adhesion area of the second electrode layer and the first electrode layer is increased, and the second electrode layer and the first electrode layer are anchored, so that the connection strength between the first electrode layer and the second electrode layer is improved; the risk that a first electrode layer and a second electrode layer are separated and fall off in the welding process or after welding of the outer electrode structure is reduced, and the risk that an electronic component falls off from a circuit board is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and in particular to an external electrode structure, a preparation method, an electronic component, and an electronic device. Background Art

[0002] In the related art, electronic components are usually welded to the circuit board through an external electrode structure. However, the existing external electrode structure has hole defects, which leads to connection problems such as separation of the external electrode structure and the main body of the electronic component during or after welding, and welding failure of the external electrode structure and the circuit board, which affects the adhesion of the electronic component to the circuit board and easily causes the electronic component to fall off the circuit board. Summary of the invention

[0003] The embodiments of the present application disclose an external electrode structure, a preparation method, an electronic component, and an electronic device, which are used to improve the adhesion of the electronic component on a circuit board.

[0004] In order to achieve the above-mentioned purpose, in a first aspect, the present application discloses an external electrode structure, which is applied to an electronic component. The electronic component includes a component body, and the external electrode structure includes:

[0005] A first electrode layer, the first electrode layer having a first side and a second side along a thickness direction thereof, the first side being configured to be connected to the component body of the electronic component;

[0006] A second electrode layer is connected to the second side and at least a portion of the second electrode layer extends into the first electrode layer.

[0007] As an optional embodiment, the second electrode layer includes a main body and an extension portion connected to the main body, the main body is connected to the second side and covers the second side, and the extension portion is located on a side of the main body close to the second side and extends into the first electrode layer along the thickness direction of the first electrode layer.

[0008] As an optional implementation manner, the thickness of the first electrode layer is S1, and the thickness of the extension portion is S2, satisfying: 0.1≤S2 / S1≤0.4.

[0009] As an optional implementation, the thickness of the extension portion is S2, wherein 5 μm≤S2≤25 μm.

[0010] As an optional embodiment, the first electrode layer includes a dense layer and a loose layer stacked in sequence along the thickness direction, the dense layer has the first side, the loose layer has the second side, the loose layer forms a pore structure, and at least part of the second electrode layer extends into the pore structure.

[0011] As an optional implementation, the pore structure is formed by at least one of etching, sandblasting, sputtering, and deposition on the second side, and at least a portion of the second electrode layer is formed in the pore structure by electroplating or vapor deposition.

[0012] As an optional implementation, the external electrode structure further includes a third electrode layer, wherein the third electrode layer is disposed on a side of the second electrode layer away from the first electrode layer and the third electrode layer covers the second electrode layer.

[0013] In a second aspect, the present application further discloses a method for preparing an external electrode, wherein the external electrode structure is the external electrode structure as described in the first aspect, and the preparation method comprises:

[0014] forming a first electrode layer;

[0015] Performing a modification process on the second side of the first electrode layer so that the second side is formed into a loose layer;

[0016] The second electrode layer is disposed on the second side, and at least a portion of the second electrode layer extends into the second side.

[0017] In a third aspect, the present application further discloses an electronic component, comprising:

[0018] Component body;

[0019] According to the external electrode structure described in the first aspect, the external electrode structure is connected to the component body.

[0020] In a fourth aspect, the present application further discloses an electronic device, including a circuit board, and the electronic components according to the third aspect, wherein the electronic components are connected to the circuit board.

[0021] Compared with the prior art, the beneficial effects of this application are:

[0022] The present application discloses an external electrode structure, a preparation method, an electronic component and an electronic device, wherein the external electrode structure is connected to the component body of the electronic component, and the external electrode structure includes a first electrode layer and a second electrode layer. The first electrode layer has a first side and a second side along its thickness direction, and the first side is configured to be connected to the component body. The second electrode layer is connected to the second side and at least part of the second electrode layer extends into the first electrode layer. In the external electrode structure disclosed in the present application, the second electrode layer extends into the second side of the first electrode layer, which can increase the attachment area of ​​the second electrode layer to the first electrode layer on the one hand, and can form an anchoring effect with the first electrode layer on the other hand, thereby facilitating the connection strength between the first electrode layer and the second electrode layer, so as to reduce the risk of the first electrode layer and the second electrode layer separating and falling off during or after welding of the external electrode structure, and reduce the risk of electronic components falling off from the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the structure of the electronic components disclosed in the embodiments of the present application;

[0025] Figure 2 for Figure 1 Sectional view at AA in the middle;

[0026] Figure 3 for Figure 2 The enlarged view of point B in the middle;

[0027] Figure 4 A front view of an electronic component disclosed in an embodiment of the present application;

[0028] Figure 5 This is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the present application.

[0029] Description of reference numerals:

[0030] 100. Electronic component; 1. External electrode structure; 11. First electrode layer; 11a. First side; 11b. Second side; 111. Dense layer; 112. Loose layer; 12. Second electrode layer; 121. Extension portion; 122. Main body; 13. Third electrode layer; 2. Component body; 21. Positive terminal; 22. Negative terminal; 3. Electrode coil;

[0031] 200. Circuit boards; 300. Electronic equipment. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In this application, the directions or positional relationships indicated by the terms "inside", "outside", "middle", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0034] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0035] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0037] In the related art, when the external electrode structure of the electronic component is formed on the component body, it needs to go through processes such as electroplating and curing. However, during the curing process of the external electrode structure, the bubbles formed inside it are not discharged in time, causing hole defects in the external electrode structure, which may lead to stress differences between the inside and outside of the external electrode structure. Furthermore, during the welding heating process, it is easy to cause the external electrode structure to fall off from the component body or the external electrode structure itself to be damaged, etc., which affects the successful welding of the electronic components on the circuit board and is not conducive to the production yield of the electronic components. Alternatively, even if the electronic components can be successfully welded on the circuit board, there is still a high risk of the electronic components falling off, which is not conducive to the normal use of electronic equipment.

[0038] Based on this, the present application discloses an external electrode structure, a preparation method, an electronic component and an electronic device. Among them, by extending part of the second electrode layer in the external electrode structure into the first electrode layer, an anchor is formed between the first electrode layer and the second electrode layer, which is conducive to increasing the connection strength between the electrode layers in the external electrode structure, improving the structural strength of the external electrode structure itself, reducing the probability of welding failure caused by its internal defects during welding of the external electrode structure and reducing the problem of the external electrode structure falling off from the component body, which is conducive to improving the product yield.

[0039] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0040] First, see Figure 1 and Figure 2 The present application discloses an external electrode structure 1, which is applied to an electronic component 100. The electronic component 100 includes a component body 2, and the external electrode structure 1 includes a first electrode layer 11 and a second electrode layer 12. The first electrode layer 11 has a first side 11a and a second side 11b along its thickness direction, the first side 11a is connected to the component body 2, the second electrode layer 12 is connected to the second side 11b of the first electrode layer 11, and a portion of the second electrode layer 12 extends into the first electrode layer 11, so that the first electrode layer 11 and the second electrode layer 12 form an anchor connection.

[0041] In the external electrode structure 1 disclosed in the present application, part of the second electrode layer extends into the first electrode layer, so that, on the one hand, part of the second electrode layer 12 extending into the first electrode layer 11 increases the contact area between the two. For example, the second electrode layer 12 can extend into the hole defect of the first electrode layer 11 to fill the hole defect. On the other hand, the second electrode layer 12 can also form an anchoring connection with the first electrode layer 11. This can not only weaken the stress problem caused by the hole defect, but also increase the contact area and connection strength between the first electrode layer 11 and the second electrode layer 12, reduce the probability of welding failure caused by damage to the external electrode structure 1 during welding of the electronic component 100, and improve the product yield.

[0042] Please combine Figure 3 As shown, in some embodiments, the first electrode layer 11 includes a dense layer 111 and a loose layer 112 sequentially stacked in the thickness direction, the dense layer 111 has the above-mentioned first side 11a, the loose layer 112 has the above-mentioned second side 11b, the loose layer 112 can be formed with a pore structure, and at least part of the second electrode layer 12 extends into the pore structure. In a first aspect, the present application actively forms a loose layer 112 with a pore structure on the second side 11b of the first electrode layer 11, so that when the second electrode layer 12 is arranged on the second side 11b, part of the second electrode layer 12 can extend into the pore structure.

[0043] In this way, the first electrode layer 11 and the second electrode layer 12 can form an anchor connection. On the second aspect, the first side 11a where the first electrode layer 11 is connected to the component body 2 forms a dense layer 111, and the internal structure of the dense layer 111 is tight, and its structural strength is good, and it is not easily affected by welding and the connection is disconnected or damaged. In addition, when the dense layer 111 is formed on the surface of the component body 2, the dense layer 111 has good adhesion to the component body 2, which is conducive to reducing the risk of the first electrode layer 11 falling off from the component body 2.

[0044] Optionally, the dense layer 111 may be formed by infiltration and sintering, or by vapor deposition, which is not specifically limited in the present application.

[0045] Optionally, the pore structure may be formed by performing at least one of etching, sandblasting, sputtering, and deposition on the dense layer 111 .

[0046] In one example, after forming the dense layer 111 , the first electrode layer 11 of the present application further forms a loose layer 112 on the dense layer by sandblasting, sputtering or deposition.

[0047] In another example, after the entire first electrode layer 11 is formed into the dense layer 111 , a portion of the dense layer 111 is then formed into the loose layer 112 by etching.

[0048] It can be seen that the present application forms a loose layer 112 with a pore structure on the second side 11b by modifying the second side 11b in the above manner, so that the second electrode layer 12 extends into the pore structure to form an anchoring connection with the first electrode layer 11.

[0049] In some embodiments, since the second side 11b of the first electrode layer 11 is formed as a loose layer 112, the connection interface between the portion of the second electrode layer 12 extending into the first electrode layer 11 and the first electrode layer 11 is relatively rough and irregular in shape, which can help further enhance the adhesion between the first electrode layer 11 and the second electrode layer 12.

[0050] In some embodiments, the second electrode layer 12 includes a main body portion 122 and an extension portion 121 connected to the main body portion 122. The main body portion 122 is connected to the second side 11b and covers the second side 11b.

[0051] The main body 122 of the second electrode layer 12 of the present application is coated on the second side 11b of the first electrode layer 11, so that the connection between the two is more compact. Figure 2 In the structure shown, the cross section of the main body 122 is "U"-shaped and is coated on the second side 11b, that is, coated on the loose layer 112, and the main body 122 at least partially covers the edge side of the first electrode layer 11. In this way, the main body 122 can be better coated on the first electrode layer 11, thereby improving the connection strength between the first electrode layer 11 and the second electrode layer 12 and reducing the risk of the two falling off during the welding process.

[0052] Optionally, the first side 11a of the first electrode layer 11, that is, the dense layer 111 mentioned above, is coated and connected to the component body 2. It can be understood that by increasing the contact area between the first electrode layer 11 and the component body 2, the connection strength between the two is improved to prevent the external electrode structure 1 from falling off from the component body 2. Figure 2 As shown, the cross section of the first side 11a is in a "U" shape and covers the component body 2, and the first side 11a covers part of the edge side of the component body 2 along the surface of the first electrode layer 11. In this way, the first electrode layer 11 can be better connected to the component body 2, the connection strength between the first electrode layer 11 and the component body 2 is improved, and the risk of the two falling off during the welding process is reduced.

[0053] It should be noted that in Figure 1 In the example shown, the direction indicated by X is the thickness direction of the first electrode layer 11 .

[0054] Optionally, the extension portion 121 is located at one side of the loose layer 112 of the main body portion 122 and extends into the first electrode layer 11 along the thickness direction of the first electrode layer 11 .

[0055] That is, the second electrode layer 12 extends into the second side 11b through the extension portion 121 to achieve an anchor connection with the first electrode layer 11, thereby improving the connection strength between the second electrode layer 12 and the first electrode layer 11. The main body portion 122 is then covered and connected to the second side 11b, so that the connection strength between the first electrode layer 11 and the second electrode layer 12 is further improved.

[0056] Optionally, the shape of the extension portion 121 may be columnar, block-shaped, conical, etc., which is not specifically limited in the present application.

[0057] Optionally, at least part of the second electrode layer 12 is formed in the pore structure by electroplating or vapor deposition.

[0058] For example, when the second electrode layer 12 is provided, an extension portion 121 may be first formed in the pore structure by electroplating or vapor deposition, and when the extension portion 121 fills the pore structure, a main body portion 122 is gradually formed on the surface of the first electrode layer 11, and finally the second electrode layer 12 is formed. The second electrode layer 12 formed in this manner can be better anchored to the first electrode layer 11.

[0059] In some embodiments, the thickness of the first electrode layer 11 is S1, and the thickness of the extension portion 121 is S2, wherein S1 and S2 satisfy the following: 0.1≤S2 / S1≤0.4. For example, S2 / S1 may be 0.10-0.15, 0.15-0.20, 0.20-0.25, 0.25-0.30, 0.30-0.35, 0.35-0.40, etc., for example, 0.10, 0.13, 0.15, 0.18, 0.20, 0.23, 0.25, 0.28, 0.30, 0.33, 0.35, 0.38 or 0.40, etc.

[0060] On the basis of extending the extension portion 121 of the second electrode layer 12 into the first electrode layer 11, in order to avoid the situation where the extension portion 121 extends too long and affects the internal structural strength of the first electrode layer 11, the present application controls the thickness range of the extension portion 121 to satisfy a certain proportional relationship with the thickness of the first electrode layer 11, thereby achieving the goal of both ensuring that the extension portion 121 can be stably anchored in the first electrode layer 11 and reducing the impact of the extension portion 121 on the internal structural strength of the first electrode layer 11.

[0061] In some embodiments, the thickness of the extension portion 121 is S2, wherein 5μm≤S2≤25μm. Exemplarily, the thickness S2 of the extension portion 121 may be 5μm-8μm, 8μm-10μm, 10μm-13μm, 13μm-15μm, 15μm-18μm, 18μm-20μm, 20μm-23μm, 23μm-25μm, etc. For example, the thickness S2 of the extension portion 121 may be 5μm, 8μm, 10μm, 13μm, 15μm, 18μm, 20μm, 23μm or 25μm, etc. The present application controls the extension thickness of the extension portion 121 in the first electrode layer 11 to maintain it at 5μm-25μm, accounting for approximately 10%-40% of the thickness of the first electrode layer 11, thereby reducing the occupancy of the extension portion 121 in the first electrode layer 11, weakening the influence of the extension portion 121 on the structural strength of the first electrode layer 11, and avoiding the situation where structural defects in the first electrode layer 11 affect the welding effect.

[0062] In some embodiments, the outer electrode structure 1 further includes a third electrode layer 13, which is disposed on a side of the second electrode layer 12 away from the first electrode layer 11. The present application reduces oxidation of the outer electrode structure 1 by disposing the third electrode layer 13, thereby improving welding effect.

[0063] Optionally, the third electrode layer 13 is coated on the outer surface of the second electrode layer 12. Exemplarily, when the third electrode layer 13 is disposed on the second electrode layer 12, the third electrode layer 13 is coated on the outer surface of the second electrode layer 12, such as Figure 2 In the structure shown, the cross section of the third electrode layer 13 is "U"-shaped and covers the second electrode layer 12. In this way, the third electrode layer 13 can be better connected to the second electrode layer 12, thereby improving the connection strength between the third electrode layer 13 and the second electrode layer 12 and reducing the risk of the two falling off during welding.

[0064] Optionally, when the third electrode layer 13 is provided, it can be formed on the second electrode layer 12 by electroplating or vapor deposition, which is not specifically limited in the present application.

[0065] Optionally, the first electrode layer 11 may be at least one of silver, platinum, gold, and copper, which is not specifically limited in the present application.

[0066] Optionally, the second electrode layer 12 may be at least one of nickel, tin, and zinc, which is not specifically limited in the present application.

[0067] Optionally, the third electrode layer 13 may be at least one of silver, nickel, tin, and zinc, which is not specifically limited in the present application.

[0068] In a second aspect, the present application further discloses a method for preparing an external electrode structure 1, wherein the external electrode structure 1 is the external electrode structure as described in the first aspect, and the preparation method comprises:

[0069] S101, forming a first electrode layer on the component body;

[0070] S102, performing a modification process on the second side of the first electrode layer so that the second side is formed into a loose layer;

[0071] S103, disposing a second electrode layer on the second side, and extending part of the second layer into the second side.

[0072] It is understandable that when forming the dense first electrode layer 11 on the component body 2, a method of infiltration and sintering or vapor deposition can be adopted.

[0073] The modification treatment of the second side 11 b of the first electrode layer 11 refers to forming the second side 11 b of the first electrode layer 11 into a loose layer by at least one of etching, sandblasting, sputtering, and deposition.

[0074] It can be understood that the method of disposing the second electrode layer 12 on the second side 11 b may include at least one of electroplating, physical vapor deposition, chemical vapor deposition, etc., which is not specifically limited in this embodiment.

[0075] The present application adopts the above-mentioned preparation method to set an external electrode structure 1 on the component body 2, so that an anchoring connection is formed between the first electrode layer 11 and the second electrode layer 12 inside the external electrode structure 1, thereby improving the structural strength of the external electrode structure 1, which is beneficial to avoid welding failures such as damage during welding and separation of the electrode layers.

[0076] Third, please refer to Figures 1 to 4 The present application also discloses an electronic component 100 , comprising a component body 2 and an external electrode structure 1 as described in the first aspect, wherein the external electrode structure 1 is connected to the component body 2 .

[0077] The component body 2 of the electronic component 100 disclosed in the present application is provided with the external electrode structure 1 disclosed in the first aspect, which has good internal structural strength, improves the internal hole defects, and avoids the situation where the internal structural defects of the external electrode structure 1 affect the welding effect of the electronic component 100 on the circuit board 200.

[0078] In some embodiments, the component body 2 has a positive terminal 21 and a negative terminal 22, and the external electrode structure 1 includes two, and the two external electrode structures 1 respectively cover the positive terminal 21 and the negative terminal 22. For example, when the external electrode structure 1 is provided on the component body 2, as shown in FIG. Figure 4As shown, the cross-section of the external electrode structure 1 is "U"-shaped and covers one end of the component body 2, so that the external electrode structure 1 is better connected to the component body 2, which helps to prevent the external electrode structure 1 from falling off the component body 2.

[0079] In addition, an external electrode structure 1 is provided at the positive terminal 21 and the negative terminal 22 of the component body 2 , which is conducive to achieving a good electrical connection between the component body 2 and the circuit board 200 .

[0080] Optionally, the component body 2 may also have a terminal connected to other circuit structures. For example, taking a ground terminal as an example, the ground terminal is provided with an external electrode structure 1, and the ground terminal is connected to the circuit board 200 through the external electrode structure 1, so that the ground terminal of the component body 2 forms a stable connection with the circuit board 200.

[0081] In order to achieve effective electrical conduction of the outer electrode structure 1, see Figure 4 Optionally, the electronic component 100 further includes an electrode coil 3 (such as Figure 4 ), the electrode coil 3 is located in the component body 2, and the electrode coil 3 is electrically connected to the external electrode structure 1. Exemplarily, before the external electrode structure 1 is provided, part of the electrode coil 3 is exposed to the component body 2, and when the external electrode structure 1 is provided on the component body 2, the external electrode structure 1 is connected to the electrode coil 3. In this way, the external electrode structure 1 is electrically connected to the component body 2, which is conducive to forming an effective electrical connection when the electronic component 100 is soldered on the circuit board 200.

[0082] Optionally, the component body 2 may be a magnet, a ceramic body, etc., which is not specifically limited in this application.

[0083] In order to better understand the scheme of the present application, the data results of the relevant embodiments and comparative examples are provided below as examples, as shown in Table 1 below:

[0084] Table 1

[0085]

[0086]

[0087] In the above Table 1, Example 1 is a multilayer chip thermistor, wherein the thickness of the first electrode layer 11 is 50 μm, and the extension thickness of the second electrode layer 12 in the first electrode layer 11 is 20 μm.

[0088] Embodiment 2 is a multilayer chip inductor, wherein the thickness of the first electrode layer 11 is 30 μm, and the extension thickness of the second electrode layer 12 in the first electrode layer 11 is 8 μm.

[0089] The comparative example is a multilayer chip inductor, in which the thickness of the first electrode layer 11 in the related art is 50 μm and the second electrode layer 12 does not extend inside the first electrode layer 11 .

[0090] Among them, failure mode A indicates that the second electrode layer 12 and the third electrode layer 13 fall off, failure mode B indicates that the component body 2 breaks, and failure mode C indicates that the pad falls off.

[0091] From the data analysis of Table 1 above, it can be seen that in Examples 1 and 2 using the external electrode structure 1 of the present application, in relevant tests, the failure forms are mostly external factors such as the breakage of the component body 2 and the detachment of the pad, and the external electrode structure 1 has little effect on welding failure.

[0092] In the comparative examples, welding failure is mostly caused by internal structural factors of the outer electrode structure 1.

[0093] In addition, according to the data in Table 1, it can be seen that the adhesion of the electronic component 100 in Example 1 and Example 2 on the circuit board 200 is significantly improved compared with the control example, which is beneficial to reduce the probability of the electronic component 100 falling off after welding with the circuit board 200.

[0094] For the fourth aspect, please see Figure 5 The present application further discloses an electronic device 300 , including a circuit board 200 and the electronic component 100 disclosed in the third aspect. The electronic component 100 is connected to the circuit board 200 .

[0095] The circuit board 200 in the electronic device 300 disclosed in the present application is welded with the electronic component 100, and the electronic component 100 has a strong adhesion to the circuit board 200, which is beneficial to preventing the risk of the electronic component 100 falling off the circuit board 200 due to external factors such as the electronic device 300 falling or bumping, avoiding the electronic device 300 from malfunctioning or being damaged due to the falling of the electronic component 100, and is beneficial to extending the service life of the electronic device 300.

[0096] Optionally, the electronic device 300 may be a mobile phone, a tablet computer, a laptop computer, a desktop computer, a CNC machine tool, an electronic toy, a washing machine, an air conditioner, etc., which is not specifically limited in this application.

[0097] The external electrode structure, preparation method, electronic components and electronic devices disclosed in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the external electrode structure, preparation method, electronic components and electronic devices of the present application and their core ideas; at the same time, for general technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An external electrode structure, characterized in that: Applied to electronic components, the electronic components include a component body, and the external electrode structure includes: A first electrode layer, the first electrode layer having a first side and a second side along a thickness direction thereof, the first side being configured to be connected to the component body of the electronic component; A second electrode layer is connected to the second side and at least a portion of the second electrode layer extends into the first electrode layer.

2. The external electrode structure according to claim 1, characterized in that: The second electrode layer includes a main body and an extension portion connected to the main body, the main body is connected to the second side and covers the second side, the extension portion is located on a side of the main body close to the second side and extends into the first electrode layer along the thickness direction of the first electrode layer.

3. The external electrode structure according to claim 2, characterized in that: The thickness of the first electrode layer is S1, and the thickness of the extension portion is S2, which satisfies: 0.1≤S2 / S1≤0.

4.

4. The external electrode structure according to claim 3, characterized in that: The thickness of the extension portion is S2, wherein 5 μm≤S2≤25 μm.

5. The external electrode structure according to any one of claims 1 to 4, characterized in that: The first electrode layer includes a dense layer and a loose layer stacked in sequence along the thickness direction, the dense layer has the first side, the loose layer has the second side, the loose layer forms a pore structure, and at least part of the second electrode layer extends into the pore structure.

6. The external electrode structure according to claim 5, characterized in that: The pore structure is formed by at least one of etching, sandblasting, sputtering, and deposition on the second side, and at least a portion of the second electrode layer is formed in the pore structure by electroplating or vapor deposition.

7. The external electrode structure according to any one of claims 1 to 4, characterized in that: The external electrode structure further includes a third electrode layer, which is disposed on a side of the second electrode layer away from the first electrode layer and covers the second electrode layer.

8. A method for preparing an external electrode structure, characterized in that: The external electrode structure is the external electrode structure according to any one of claims 1 to 7, The preparation method comprises: forming a first electrode layer; Performing a modification process on the second side of the first electrode layer so that the second side is formed into a loose layer; A second electrode layer is disposed on the second side, and at least a portion of the second electrode layer extends into the second side.

9. An electronic component, characterized in that: include: Component body; According to any one of claims 1 to 7, the external electrode structure is connected to the component body.

10. An electronic device, characterized in that: include; Circuit boards; and The electronic component according to claim 9, wherein the electronic component is connected to the circuit board.

Images