Etching device and method for processing semiconductor lead frame
By designing a detachable etching device, the inconvenience problems existing in the maintenance and use of existing equipment are solved, convenient maintenance of guide wheels and cleaning of equipment inner walls are achieved, and overall maintenance efficiency and adaptability of spray etching are improved.
Patent Information
- Application Number
- CN202411955867.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-28
AI Technical Summary
There are many inconveniences in the maintenance and use of existing etching equipment, including irreconciliation and disassembly spraying mechanisms and conveying structures, spray etching in a single direction, inconvenient maintenance and difficult to clean, resulting in possible line changes or scratches.
An etching device for processing semiconductor lead frames is designed, including a removable conveying structure, a load bearing unit, a shunt valve tube and a plurality of removable spray structures. The device is removable for easy maintenance and cleaning and supports multi-directional spray etching.
Through the design of this device, convenient maintenance of guide wheels and cleaning of the inner wall of the equipment are achieved, the overall maintenance efficiency of the equipment and the adaptability of spray etching are improved, and the scalability of the assembly line and diverse etching methods are supported.
Smart Images

Figure CN119694892A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of lead frame processing equipment, and in particular to an etching device and method for processing a semiconductor lead frame. Background Art
[0002] Lead frame is the chip carrier of integrated circuit. It is a key structural component that uses bonding materials to realize the electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frame is a processing technology that forms a wire structure of specific shape and size on the conductive layer through etching to realize circuit connection. Most of the existing etching equipment is only realized by conveying and spraying; and the spray mechanism and the conveying structure cannot be disassembled and adjusted, which is inconvenient to maintain during use, and can only achieve spray etching in a single direction; at the same time, it is not conducive to wiping and cleaning the conveying roller during maintenance, and the inner wall of the equipment is prone to retain etching liquid or impurities. If it is not cleaned regularly and effectively, it is easy to cause the line to change or scratch the surface of the lead frame. When the etched frame breaks and falls under the roller, it is inconvenient to take it out. Therefore, an etching device and method for semiconductor lead frame processing are designed. Summary of the invention
[0003] The object of the present invention is to provide an etching device and method for semiconductor lead frame processing to solve the problems raised in the above background technology.
[0004] In order to solve the above-mentioned problem, the present invention provides the following technical solutions: an etching device for semiconductor lead frame processing, comprising a main structure, a conveying structure, a carrying unit, a diverter valve pipe and a plurality of spray structures; the conveying structure can be detachably arranged in the main structure, the carrying unit can be detachably arranged in the main structure and located above the conveying structure, the diverter valve pipe is movably arranged in the conveying structure and a plurality of valves are equidistantly arranged on the diverter valve pipe, and the plurality of spray structures can be detachably arranged on the carrying unit and are respectively connected to the diverter valve pipe through pipelines.
[0005] Preferably, the main structure includes an etching box, a rear cover, a control panel, a liquid pump, a front baffle, a pair of docking components, a pair of flip units and a box cover; the etching box is a box body without an upper wall, and the left and right side walls of the etching box are both provided with delivery ports near the middle, the front side wall of the etching box is provided with a cleaning port near the middle, the rear side wall of the etching box is provided with a driving port near the middle, the rear cover can be detachably buckled at the driving port position on the rear side of the etching box, the control panel is fixedly arranged on the front side wall of the etching box and is located above the cleaning port, the liquid pump is fixedly arranged on the etching box The bottom wall of the box is provided with a first pipe which runs through the left side wall of the etching box at the liquid inlet end of the liquid pump; the front baffle is detachably buckled at the cleaning port and fixed by bolts; a first handle is provided in the middle of the front side wall of the front baffle; a pair of the docking assemblies are detachably arranged at the delivery port of the etching box; a pair of the flip units are detachably arranged at the rear side wall of the etching box and are symmetrical to each other near the top; the box cover is a convex frame structure, and a glass plate is embedded in the middle of the upper wall of the box cover; the box cover is movably buckled above the etching box, and the box cover is connected to the flip units respectively.
[0006] Preferably, the docking assembly includes a docking frame, a sealing plate, a first shaft rod and a plurality of first guide wheels; the docking frame is a concave structure, and a vertical edge is provided in the middle of the upper and lower side walls; the docking frame can be removably embedded in the conveying port of the etching box, and the vertical edge is in contact with the side wall of the etching box; the sealing plate can be removably buckled between the two ends of the docking frame, and the sealing plate fits with the docking frame; one end of the sealing plate is movably inserted in the conveying port; the two ends of the first shaft rod are respectively movably inserted between the docking frame and the sealing plate; the plurality of first guide wheels are respectively and equidistantly mounted on the first shaft rod, and the first guide wheel is located in the middle of the docking frame.
[0007] Preferably, the flip unit comprises a flip seat, a push-pull rod and a flip arm; the flip seat is concave, the flip seat can be detachably placed on the rear side wall of the etching box, and a first axial hole is opened in the middle of both ends of the flip seat, one end of the flip seat is opened with a cross-shaped locking groove connected with the first axial hole, the push-pull rod movably passes through the first axial holes at both ends of the flip seat, and baffles are arranged at both ends of the push-pull rod, one end of the push-pull rod is provided with a handle, and locking edges matching the cross-shaped locking groove are arranged on the front and rear sides of the middle part of the push-pull rod, and the locking edges are inserted into the two ends of the cross-shaped locking groove, the length of the locking edge is greater than the width of one end of the flip seat, the flip arm is L-shaped, and a second axial hole is opened in the middle of one end of the flip arm, and a connected I-shaped locking groove is opened on the front and rear sides of the second axial hole, one end of the flip arm is movably sleeved on the push-pull rod, and the I-shaped locking groove is sleeved on the locking edge, and the other end of the flip arm is fixedly connected to the rear side wall of the box cover. Preferably, the conveying structure includes a carrying box, a drain pipe, a transfer pipe, a plurality of bearings, a plurality of shaft seats, a plurality of second shaft rods, a plurality of second guide wheels, a motor, a plurality of double-groove pulleys and a plurality of belts; the carrying box is a box body without an upper wall, and a pick-up port corresponding to the cleaning port is provided on the front side wall of the carrying box, vertical plates are provided on the upper wall edges at both ends of the front and rear ends of the carrying box, the carrying box can be detachably embedded in the etching box, and the pick-up port and the cleaning port are relatively matched, and the upper wall edge of the carrying box is on the same horizontal line as the lower wall inside the conveying port The carrier box is fixed by bolts passing through the vertical plate, and the carrier box is located above the liquid pump. One end of the drainage pipe is fixed to the middle of the lower wall of the carrier box, and the other end of the drainage pipe passes through the bottom of the left wall of the etching box. One end of the transfer pipe is fixed to pass through the lower wall of the carrier box, and the other end of the transfer pipe is connected to the liquid outlet of the liquid pump. Several bearings are equidistantly embedded in the vertical plate, and the centers of the bearings correspond to the two ends of the first shaft rod. One end of several shaft seats is a round rod structure, and the other end is a rectangular rod structure. One end of the shaft seat is fixed The cam is fixedly connected to the first bearing above the rear side wall of the carrier box and is located in the rear cover, a U-shaped groove connected to the upper wall is opened in the middle of the front side wall of the other end of the shaft seat, and a connected arc groove is opened on the left and right sides of the U-shaped groove, a plurality of second shaft rods are relatively movably connected with the front end and the rear end, and the two ends of the second shaft rod are relatively flipped, one end of the second shaft rod is fixedly inserted in the first bearing above the front side wall of the carrier box, and the other end is movably embedded in the U-shaped groove of the shaft seat, and the left and right sides of the other end of the second shaft rod are provided with torsion blocks, and the torsion blocks are movably embedded in the arc groove, a plurality of second guide wheels are the same as the first guide wheels, a plurality of second guide wheels are respectively equidistantly mounted on the second shaft rod, and the upper wall of the second guide wheel is in the same horizontal plane as the upper wall of the first guide wheel, the motor is fixedly arranged on the lower wall inside the rear cover, and the motor is located below one of the shaft seats, a plurality of double-groove pulleys are respectively fixedly mounted on the motor driving end and one end of the shaft seat, a plurality of belt ends are respectively staggeredly mounted between the double-groove pulleys, and the double-groove pulleys are connected in series through belts and rotate in the same direction.
[0008] Preferably, the bearing unit includes a bearing plate, a pair of bearing seats, two pairs of adjusting bolts and two pairs of adjusting nuts; the bearing plate is rectangular, and a first adjusting groove is opened through the middle of the bearing plate, and second adjusting grooves are symmetrically opened on both sides of the first adjusting groove, a pair of the bearing seats are both L-shaped, and one end of the bearing seats is respectively opened with a first adjusting opening corresponding to the first adjusting groove, one end of the pair of bearing seats is movably arranged under the two ends of the bearing plate and is symmetrical to each other, and the other ends of the pair of bearing seats are respectively detachably arranged on the front and rear side walls in the etching box, one end of the two pairs of adjusting bolts is respectively movably passed through the two corners of one end of the bearing seats, and one end of the adjusting bolts is movably passed through the second adjusting opening, and the two pairs of adjusting nuts are respectively movably screwed on the adjusting bolts.
[0009] Preferably, in order to adjust the length according to actual etching spray requirements, the bearing seat in the bearing unit is moved a certain distance on the bearing plate, so that the bearing unit can be removably placed between the front and rear side walls in the etching box or between the front and rear side walls in the bearing box, and is used to adjust the nozzle to spray upward or downward and adjust according to the actual etching time or double-sided etching usage requirements.
[0010] Preferably, the spray structure includes a locking assembly, a nozzle and a plurality of nozzles; the locking assembly is movably arranged on a carrying plate, the nozzle is detachably arranged on the locking assembly, and one end of the nozzle is connected to a diverter valve tube, and a plurality of nozzles are equidistantly and detachably arranged on a lower wall of the nozzle; the locking assembly includes a locking platform, a fastening screw, a pressure rod, a finger rod, a spring and a locking rod; the locking platform is a convex structure, and a sleeve groove is provided on the middle upper wall of the locking platform near the rear end, the locking platform is detachably arranged on the carrying plate, and the sleeve groove is sleeved on the nozzle and is located between two nozzles, an installation cavity connected to the front side wall is provided in the top end of the locking platform, a locking hole is provided on the front upper wall of the locking platform, and the inner diameter of the locking hole is larger than the lock The diameter of the hole is at the position of the hole, and communicating fitting openings are provided on both sides of the lock hole, the fastening screw movably passes through the first adjusting groove and is screwed into the lower wall of the lock platform, the pressure rod is L-shaped, one end of the pressure rod movably passes through the upper wall of the lock platform and is located in the middle of the installation cavity, the other end of the pressure rod is located above the middle of the sleeve groove and fits with the upper wall of the lock platform, one end of the finger rod is fixedly arranged in the middle of the pressure rod and one end of the finger rod movably passes through the front side wall of the installation cavity, the spring movably sleeved on one end of the pressure rod and is located between one end of the finger rod and the lower wall of the installation cavity, one end of the locking rod movably passes through the other end of the finger rod, and the other end of the locking rod is symmetrically provided with fitting blocks corresponding to the fitting openings, and the fitting blocks movably pass through the lock hole and then rotate to lock.
[0011] A method for using an etching device for semiconductor lead frame processing comprises the following steps: Step 1: The lead frame is moved through the existing conveying equipment through the docking assembly and enters from one side of the main structure, and is continuously conveyed and moved through the conveying structure; Step 2: When the lead frame moves in the etching box through the conveying structure, the etching liquid is supplied by the liquid pump and sprayed from the nozzle in the spray structure to contact the lead frame to etch the corresponding parts, and then moves out from the other side of the main structure as it moves; Step 3: According to the etching requirements, the carrying unit is installed in the etching box above the second wheel or placed in the carrying box below the second guide wheel for spraying at different etching times, and the corresponding locking assembly is used to facilitate the setting of nozzles with different numbers and spacings to set the spray range requirements according to actual needs; Step 4: During maintenance, the first shaft can be flipped to facilitate cleaning and wiping of the second guide wheel and cleaning of the inner wall of the carrier box or picking up materials dropped due to conveying and movement; Step 5: Use the flip unit to facilitate locking and fixing the box cover after it is opened or closed.
[0012] The etching device and method for semiconductor lead frame processing proposed by the present invention have the following beneficial effects: the present scheme, through a simple loading and unloading structure design, enables the second guide wheel for internal transportation to be flipped and disassembled with the help of a second shaft rod, which is convenient for wiping maintenance and cleaning of the inner wall of the equipment; the docking assembly enables the equipment to be spliced to extend the use of the assembly line; the width of the inner wall of the equipment is matched by a bearing unit, and multiple spray structures are installed according to needs for spray etching, which has more adaptability; at the same time, the width of the bearing unit is adjustable and cooperated with the spray structure, so that the nozzle on the nozzle can be set to spray downward above the second guide wheel or spray upward from the bottom of the guide wheel according to needs, for different spray etching times and methods; and the detachable bearing unit and the spray structure further ensure convenient maintenance and replacement and adjustment of the equipment; finally, if there is a situation of falling through the second guide wheel during the transportation process, it is also convenient to stop the machine for picking up, thereby achieving the following effects: 1. The guide wheel is easy to maintain: the second guide wheel for internal transportation can be turned over and disassembled with the help of the second shaft rod, which improves the convenience of wiping and maintaining the guide wheel. Since the guide wheel in traditional equipment is difficult to disassemble and clean, the guide wheel in the present invention can be easily disassembled, making the cleaning work more thorough. After the guide wheel has been used for a period of time, its surface may be contaminated with impurities in the etching process, which can be easily disassembled for comprehensive wiping to reduce the impact of impurities on the rotation of the guide wheel and product transportation.
[0013] 2. Easy cleaning of the inner wall of the equipment: The reversible disassembly of the guide wheel is not only convenient for its own maintenance, but also provides convenience for cleaning the inner wall of the equipment. After the guide wheel is removed, it is more convenient to touch the inner wall of the equipment to remove dirt and etching residues on the inner wall, which helps to keep the inside of the equipment clean and avoid affecting the performance of the equipment due to the accumulation of dirt on the inner wall, especially the viscous etching liquid.
[0014] 3. Overall equipment maintainability: The detachable design of the load-bearing unit and the spray structure further ensures convenient maintenance of the equipment. When the spray structure is blocked, damaged, or the nozzle position needs to be adjusted, it can be easily disassembled for repair or replacement, which reduces the difficulty and time cost of equipment maintenance and improves the overall maintenance efficiency of the equipment.
[0015] 4. Scalability of the assembly line: By docking components, the equipment can be spliced to extend the use of the assembly line, which makes the production line highly scalable.
[0016] 5. Strong adaptability of spray etching: The carrying unit can fit the width of the inner wall of the equipment and can install multiple spray structures for spray etching as needed. It has more adaptability and can flexibly adjust the number and layout of spray structures according to different product sizes and etching requirements.
[0017] 6. Diversity of etching methods: The width of the carrier unit is adjustable and cooperates with the spray structure. The nozzle on the nozzle can be set to spray downward above the second guide wheel or spray upward from the bottom of the second guide wheel according to needs, which is used for different etching times and methods (the etching liquid sprayed upward will not stay on the material for a long time, thereby shortening the etching time); this flexibility can meet different etching process requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the assembly structure of the present invention; Figure 2 A schematic diagram showing the structure of the combined use of the present invention; Figure 3 It is a schematic diagram of the main structure assembly structure of the present invention; Figure 4 It is a schematic diagram of the assembly structure of the conveying structure of the present invention; Figure 5 It is a schematic diagram of the assembly structure of the spray structure of the present invention; Figure 6 It is a schematic diagram of the split structure of the main structure of the present invention; Figure 7 It is a schematic diagram of the disassembly structure of the conveying structure of the present invention; Figure 8 This is a schematic diagram showing the structure of the load-bearing unit of the present invention after disassembly and enlargement; Fig. 9 This is a schematic diagram showing the structure of the spray structure of the present invention after disassembly and enlargement; Fig.10 This is a schematic diagram showing the structure of the flip unit of the present invention after disassembly and enlargement; Fig.11 This is a schematic diagram showing the enlarged structure of the assembly of the flip unit of the present invention; Fig.12 For the present invention Figure 6 A local enlarged view of point A in FIG. Fig.13 For the present invention Figure 7 A local enlarged view of point B in FIG. Fig.14 For the present invention Figure 7 A local enlarged view of point C in FIG. Fig.15 For the present invention Figure 7 A partial enlarged view of point D in the figure.
[0019] In the figure: 1, main structure, 11, etching box, 12, back cover, 13, control panel, 14, liquid pump, 15, front baffle, 16, docking assembly, 161, docking frame, 162, sealing plate, 163, first shaft rod, 164, first guide wheel, 17, flip unit, 171, flip seat, 172, push-pull rod, 173, flip arm, 18, box cover, 2, conveying structure, 21, carrying box, 22, drain pipe, 23, transfer pipe, 24, bearing, 25, shaft seat, 26, second shaft rod, 27, second guide wheel, 28, motor, 29, double groove pulley, 20, belt, 3, carrying unit, 31, carrying plate, 32, Bearing seat, 33, adjusting bolt, 34, adjusting nut, 4, diverter valve pipe, 5, spray structure, 51, locking assembly, 511, locking platform, 512, fastening screw, 513, pressure rod, 514, finger rod, 515, spring, 516, locking rod, 52, nozzle, 53, nozzle, 61, delivery port, 62, cleaning port, 63, driving port, 71, picking port, 72, U-shaped groove, 73, arc groove, 74, torsion block, 75, vertical plate, 81, first adjusting groove, 82, second adjusting groove, 83, first adjusting port, 91, installation cavity, 92, sleeve groove, 93, lock hole, 101, cross-shaped lock groove, 102, straight-line lock groove. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] See also Figure 1-Figure 15 The present invention provides a technical solution: an etching device for semiconductor lead frame processing, comprising a main structure 1, a conveying structure 2, a carrying unit 3, a diverter valve pipe 4 and a plurality of spray structures 5; the conveying structure 2 is detachably arranged in the main structure 1, the carrying unit 3 is detachably arranged in the main structure 1 and is located above the conveying structure 2, the diverter valve pipe 4 is movably arranged in the conveying structure 2 and a plurality of valves are equidistantly arranged on the diverter valve pipe 4, and a plurality of spray structures 5 are detachably arranged on the carrying unit 3, and are respectively connected to the diverter valve pipe 4 through pipelines.
[0022] As a further solution of the present invention, the main structure 1 includes an etching box 11, a rear cover 12, a control panel 13, a liquid pump 14, a front baffle 15, a pair of docking components 16, a pair of flip units 17 and a box cover 18; the etching box 11 is a box body without an upper wall, and the left and right side walls of the etching box 11 are both provided with a delivery port 61 near the middle, the front side wall of the etching box 11 is provided with a cleaning port 62 near the middle, and the rear side wall of the etching box 11 is provided with a driving port 63 near the middle, the rear cover 12 is detachably buckled at the driving port 63 on the rear side of the etching box 11, the control panel 13 is fixedly arranged on the front side wall of the etching box 11 and is located above the cleaning port 62, and the liquid pump 1 4 is fixedly arranged on the lower wall of the etching box 11, and a first pipe penetrating the left side wall of the etching box 11 is arranged at the liquid inlet end of the liquid pump 14, the front baffle 15 is detachably buckled at the cleaning port 62 and fixed by bolts, a first handle is arranged in the middle of the front side wall of the front baffle 15, a pair of docking assemblies 16 are detachably arranged at the delivery port 61 of the etching box 11, a pair of flip units 17 are detachably arranged at the rear side wall of the etching box 11 and are symmetrical to each other near the top, the box cover 18 is a convex frame structure, and a glass plate is embedded in the middle of the upper wall of the box cover 18, the box cover 18 is movably buckled above the etching box 11, and the box cover 18 is connected to the flip units 17 respectively.
[0023] As a further solution of the present invention, the docking assembly 16 includes a docking frame 161, a sealing plate 162, a first shaft rod 163 and a plurality of first guide wheels 164; the docking frame 161 is a concave structure, and a vertical edge is provided in the middle of the upper and lower side walls. The docking frame 161 can be detachably embedded in the conveying port 61 of the etching box 11, and the vertical edge is in contact with the side wall of the etching box 11. The sealing plate 162 can be detachably buckled between the two ends of the docking frame 161, and the sealing plate 162 fits with the docking frame 161. One end of the sealing plate 162 is movably inserted in the conveying port 61, and the two ends of the first shaft rod 163 are respectively movably inserted between the docking frame 161 and the sealing plate 162. A plurality of first guide wheels 164 are respectively equidistantly mounted on the first shaft rod 163, and the first guide wheel 164 is located in the middle of the docking frame 161.
[0024] As a further solution of the present invention, the flip unit 17 includes a flip seat 171, a push-pull rod 172 and a flip arm 173; the flip seat 171 is concave, and the flip seat 171 can be detachably placed on the rear side wall of the etching box 11, and a first shaft hole is opened in the middle of both ends of the flip seat 171, and a cross-shaped lock groove 101 connected to the first shaft hole is opened at one end of the flip seat 171, and the push-pull rod 172 is movable through the first shaft holes at both ends of the flip seat 171, and baffles are set at both ends of the push-pull rod 172, and a pull rod is set at one end of the push-pull rod 172. The front and rear sides of the middle of the push-pull rod 172 are provided with locking edges that match the cross-shaped locking groove 101, and the locking edges are inserted into the two ends of the cross-shaped locking groove 101. The length of the locking edge is greater than the width of one end of the flip seat 171. The flip arm 173 is L-shaped, and a second shaft hole is opened in the middle of one end of the flip arm 173. The front and rear sides of the second shaft hole are connected with a straight-shaped locking groove. One end of the flip arm 173 is movably sleeved on the push-pull rod 172, and the straight-shaped locking groove 102 is sleeved on the locking edge. The other end of the flip arm 173 is fixedly connected to the rear side wall of the box cover 18. As a further solution of the present invention, the conveying structure 2 includes a carrying box 21, a drain pipe 22, a transfer pipe 23, a plurality of bearings 24, a plurality of shaft seats 25, a plurality of second shaft rods 26, a plurality of second guide wheels 27, a motor 28, a plurality of double-groove pulleys 29 and a plurality of belts 20; the carrying box 21 is a box body without an upper wall, and a pick-up port 71 corresponding to the cleaning port 62 is opened on the front side wall of the carrying box 21, and vertical plates 75 are provided on the upper wall edges of the front and rear ends of the carrying box 21. The carrying box 21 can be detachably embedded in the etching box 11, and the pick-up port 71 is relatively matched with the cleaning port 62, and the upper wall edge of the carrying box 21 is relatively matched with the conveying box 11. The lower wall of the opening 61 is on the same horizontal line, the carrier box 21 is fixed by bolts penetrating the vertical plate 75, and the carrier box 21 is located above the liquid pump 14, one end of the drain pipe 22 is fixed to the middle of the lower wall of the carrier box 21, and the other end of the drain pipe 22 penetrates the bottom of the left wall of the etching box 11, one end of the transfer pipe 23 is fixed to penetrate the lower wall of the carrier box 21, and the other end of the transfer pipe 23 is connected to the liquid outlet end of the liquid pump 14, a number of bearings 24 are respectively equidistantly embedded in the vertical plate 75, and the center of the bearing 24 corresponds to the two ends of the first shaft rod 163, one end of a number of shaft seats 25 is a round rod structure, and the other end is a rectangular rod structure, the shaft seat One end of the shaft seat 25 is fixedly inserted into the middle of the first bearing 24 above the rear side wall of the carrier box 21, and is located in the rear cover 12. A U-shaped groove 72 connected to the upper wall is opened in the middle of the front side wall of the other end of the shaft seat 25, and the left and right sides of the U-shaped groove 72 are opened with connected arc grooves 73. The front and rear ends of the plurality of second shaft rods 26 are relatively movably connected, and the two ends of the second shaft rods 26 are relatively turned over. One end of the second shaft rod 26 is fixedly inserted into the first bearing 24 above the front side wall of the carrier box 21, and the other end is movably embedded in the U-shaped groove 72 of the shaft seat 25. The left and right sides of the other end of the second shaft rod 26 are provided with torsion blocks 74 , and the torsion block 74 is movably embedded in the arc groove 73, a plurality of second guide wheels 27 are the same as the first guide wheel 164, and a plurality of second guide wheels 27 are respectively equidistantly mounted on the second shaft rod 26, and the upper wall of the second guide wheel 27 is in the same horizontal plane as the upper wall of the first guide wheel 164, the motor 28 is fixedly arranged on the lower wall inside the rear cover 12, and the motor 28 is located below one of the shaft seats 25, a plurality of double-groove pulleys 29 are respectively fixedly mounted on the driving end of the motor 28 and one end of the shaft seat 25, and the two ends of a plurality of belts 20 are respectively staggered and mounted between the double-groove pulleys 29, and the double-groove pulleys 29 are connected in series through the belts 20 and rotate in the same direction.
[0025] As a further solution of the present invention, the bearing unit 3 includes a bearing plate 31, a pair of bearing seats 32, two pairs of adjusting bolts 33 and two pairs of adjusting nuts 34; the bearing plate 31 is rectangular, and a first adjusting groove 81 is opened through the middle of the bearing plate 31, and second adjusting grooves 82 are symmetrically opened on both sides of the first adjusting groove 81. The pair of bearing seats 32 are both L-shaped, and one end of the bearing seats 32 is respectively opened with a first adjusting port 83 corresponding to the first adjusting slot 81, one end of the pair of bearing seats 32 is respectively movably arranged below the two ends of the bearing plate 31 and is symmetrical with each other, and the other ends of the pair of bearing seats 32 are respectively detachably arranged on the front and rear side walls of the etching box 11, one end of the two pairs of adjusting bolts 33 is respectively movably passed through the two corners of one end of the bearing seat 32, and one end of the adjusting bolt 33 is movably passed through the second adjusting port, and the two pairs of adjusting nuts 34 are respectively movably screwed on the adjusting bolts 33.
[0026] As a further solution of the present invention, the spray structure 5 includes a locking assembly 51, a nozzle 52 and a plurality of nozzles 53; the locking assembly 51 is movably mounted on the carrier plate 31, the nozzle 52 is detachably mounted on the locking assembly 51, and one end of the nozzle 52 is connected to the diverter valve pipe 4, and the plurality of nozzles 53 are detachably mounted on the lower wall of the nozzle 52 at equal distances; The locking assembly 51 includes a locking platform 511, a fastening screw 512, a pressure rod 513, a finger rod 514, a spring 515 and a locking rod 516; the locking platform 511 is a convex structure, and a sleeve groove 92 is provided on the upper wall of the middle part of the locking platform 511 near the rear end, the locking platform 511 can be detachably placed on the bearing plate 31, and the sleeve groove 92 is sleeved on the nozzle 52 and is located between the two nozzles 53, a mounting cavity 91 connected to the front side wall is provided in the top of the locking platform 511, a locking hole 93 is provided on the upper wall of the front end of the locking platform 511, the inner diameter of the locking hole 93 is larger than the diameter at the locking hole 93, and communicating fitting openings are provided on both sides of the locking hole 93, the fastening screw 512 movably passes through the first adjustment groove 81 and is screwed to the locking platform Inside the lower wall 511, the pressure rod 513 is L-shaped, one end of the pressure rod 513 is movably passed through the upper wall of the locking platform 511 and is located in the middle of the installation cavity 91, the other end of the pressure rod 513 is located above the middle of the sleeve groove 92 and fits with the upper wall of the locking platform 511, one end of the finger rod 514 is fixedly set in the middle of the pressure rod 513 and one end of the finger rod 514 is movably passed through the front side wall of the installation cavity 91, the spring 515 is movably sleeved on one end of the pressure rod 513 and is located between one end of the finger rod 514 and the lower wall of the installation cavity 91, one end of the locking rod 516 is movably passed through the other end of the finger rod 514, and the other end of the locking rod 516 is symmetrically provided with a fitting block corresponding to the fitting mouth, and the fitting block is movably passed through the lock hole 93 and then rotated to lock.
[0027] Working principle: First, the delivery ports 61 on the left and right side walls of the etching box 11 in the equipment are both provided with docking components 16, and then the two etching boxes 11 can be connected and extended through the docking frame 161 in the docking component 16; the drainage pipe 22 of the equipment is connected to the corresponding pipeline for discharge after spray etching, and the liquid inlet end of the liquid pump 14 is connected to the corresponding supply etching liquid, and at the same time, the liquid inlet end of the liquid pump 14 can be provided with a multi-port electromagnetic valve according to demand, so that the liquid pump 14 can supply etching liquid and clean water respectively, and the liquid outlet end of the liquid pump 14 is connected to the transfer tube 23, and the delivered liquid passes through the carrier box 21 through the transfer tube 23, and is diverted to the nozzle 52 with the help of the diverter valve tube 4 connected to the transfer tube 23; clean water is supplied for later maintenance to dilute the etching liquid and rinse the etching liquid, and then after the equipment is powered on, the equipment is controlled through the control panel 13; When in use, the lead frame that is transported and processed by other existing equipment is prompted to enter from the docking assembly 16 on one side of the etching box 11, and is carried and moved by the first guide wheel 164 on the first shaft 163 supported by the sealing plate 162. After the lead frame enters the etching box 11, it is carried and moved by the second guide wheel 27 in the conveying structure 2; The second guide wheel 27 is driven by the motor 28 in the rear cover 12 behind the control driving port 63, and the double groove pulley 29 is linked in series with the belt 20, so that the shaft seat 25 is rotated through the bearing 24 and the arc groove 73 is used to apply force to the second shaft rod 26, so that multiple second shaft rods 26 rotate in the same direction, so that the second guide wheel 27 rotates above the carrier box 21 to transport the moving lead frame; As the lead frame is transported and moved, the driving liquid pump 14 extracts the etching liquid and supplies it to multiple nozzles 52 through the diverter valve pipe 4. Figure 1 As shown, the spray structure 5 is placed under the second guide wheel 27 through the carrying unit 3, and the lead frame is sprayed and etched from the nozzle 53, and finally the lead frame is moved out of the equipment or enters the next etching box 11 through the docking assembly 16 on the other side of the etching box 11; When cleaning and maintaining the device, the front baffle 15 can be removed to clean the inner wall of the carrier box 21 directly through the cleaning port 62 and the pick-up port 71, without removing the second guide wheel 27 to clean from above; If the second guide wheel 27 needs to be cleaned, the box cover 18 can be opened, and the box cover 18 can be supported and flipped open by the flip unit 17. When the box cover 18 flips, the flip arm 173 will flip on the flip seat 171, and the push-pull rod 172 will rotate 90 degrees through the I-shaped lock groove 102 on the flip arm 173 and the lock edge in the middle of the push-pull rod 172. After the lock edge on the push-pull rod 172 corresponds to one end of the cross-shaped lock groove 101, the push-pull rod 172 is pulled to move the lock edge on the push-pull rod 172 to one side and insert it into the cross-shaped lock groove 101 to achieve locking and limiting. In the same principle, when the box cover 18 is closed, it is also locked with the help of the push-pull rod 172; Before the box cover 18 is opened, it is necessary to pump clean water through the liquid pump 14 and spray it through the nozzle 53 to neutralize, dilute and rinse the residual etching liquid in the equipment to prevent the odor from spreading or corroding the human body and causing harm; then, when the box cover 18 is opened, the following instructions are attached Figure 2 As shown, firstly, force is applied to one end of the second shaft rod 26 connected to the shaft seat 25, and one end of the second shaft rod 26 is turned upward, so that the second shaft rod 26 is disengaged from the U-shaped groove 72 and the arc groove 73, and then, with the help of one end of the second shaft rod 26 and the other end, the space in the middle of the carrier box 21 is opened after turning, and the second guide wheel 27 and the first guide wheel 164 can be wiped one by one, and the other end of the second shaft rod 26 can also be pulled out from the bearing 24 for disassembly; After the second guide wheel 27 is disassembled, the spray structure 5 supported by the bearing unit 3 in the bearing box 21 can be seen from above; since the bearing seat 32 in the bearing unit 3 can move a certain distance on the bearing plate 31, and the bearing seat 32 is fixed on the bearing plate 31 by the adjusting bolt 33 passing through the second adjusting slot 82 and cooperating with the adjusting nut 34, the overall support width of the bearing unit 3 can be adjusted, and it can be used to fit in the bearing box 21 or the etching box 11, and can be installed above or below the second guide wheel 27 according to needs, and is used for the downward spraying or upward spraying of the spray head 53 respectively; When the carrying unit 3 is fixed, the locking assembly 51 in the spray structure 5 can be installed on the carrying unit 3 according to the needs, and the spacing can be adjusted movably, so as to adjust the spacing of the nozzles 53 on the spray pipe 52 installed by the fixing assembly, and adjust the spraying range according to the needs; When the nozzle 52 needs to be removed, the locking rod 516 is rotated to unlock and disengage from the locking hole 93, and then the pressing rod 513 is lifted up by the force of the spring 515, so that the upper part of the sleeve groove 92 can be unlocked, and the nozzle 52 can be picked up, pressed down and blocked for removal; When the nozzle 52 needs to be installed, the nozzle 52 is inserted into the sleeve groove 92 of the locking platform 511, and the nozzle 53 is placed on both sides of the locking platform 511. Then, the pressure rod 513 is pressed down to compress the spring 515, so that one end of the pressure rod 513 is attached to the upper part of the sleeve groove 92 to limit the nozzle 52. At this time, one end of the locking rod 516 is inserted into the locking hole 93. The locking rod 516 is rotated to pass through the fitting of the locking hole 93 and is locked with the locking hole 93. When the locking platform 511 needs to be disassembled or moved, it can be adjusted and disassembled by rotating the fastening screw 512 passing through the first adjustment groove 81 and the first adjustment port 83 corresponding to the first adjustment groove 81, and the carrying unit 3 is detachable, so that the entire space inside the equipment can be cleaned without obstruction.
[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An etching device for semiconductor lead frame processing, characterized in that: The invention comprises a main structure (1), a conveying structure (2), a bearing unit (3), a diverter valve pipe (4) and a plurality of spray structures (5); the conveying structure (2) is detachably mounted in the main structure (1); the bearing unit (3) is detachably mounted in the main structure (1) and is located above the conveying structure (2); the diverter valve pipe (4) is movably mounted in the conveying structure (2) and a plurality of valves are equidistantly arranged on the diverter valve pipe (4); and a plurality of spray structures (5) are detachably mounted on the bearing unit (3) and are respectively connected to the diverter valve pipe (4) through pipelines.
2. The etching device for semiconductor lead frame processing according to claim 1, characterized in that: The main structure (1) comprises an etching box (11), a rear cover (12), a control panel (13), a liquid pump (14), a front baffle (15), a pair of docking assemblies (16), a pair of flip units (17) and a box cover (18); The etching box (11) is a box body without an upper wall, and the left and right side walls of the etching box (11) are both provided with a delivery port (61) near the middle, the front side wall of the etching box (11) is provided with a cleaning port (62) near the middle, and the rear side wall of the etching box (11) is provided with a driving port (63) near the middle, the rear cover (12) is detachably buckled on the driving port (63) on the rear side of the etching box (11), the control panel (13) is fixedly arranged on the front side wall of the etching box (11) and is located above the cleaning port (62), the liquid pump (14) is fixedly arranged on the lower wall of the etching box (11), and the liquid inlet end of the liquid pump (14) is provided with a liquid penetrating through the left side of the etching box (11). The first pipe of the side wall, the front baffle (15) is detachably buckled at the cleaning port (62) and fixed by bolts, a first handle is provided in the middle of the front side wall of the front baffle (15), a pair of docking assemblies (16) are detachably arranged at the conveying port (61) of the etching box (11), a pair of flip units (17) are detachably arranged at the rear side wall of the etching box (11) and are symmetrical to each other near the top, the box cover (18) is a convex frame structure, and a glass plate is embedded in the middle of the upper wall of the box cover (18), the box cover (18) is movably buckled above the etching box (11), and the box cover (18) is connected to the flip units (17).
3. The etching device for semiconductor lead frame processing according to claim 2, characterized in that: The docking assembly (16) comprises a docking frame (161), a sealing plate (162), a first shaft (163), and a plurality of first guide wheels (164); The docking frame (161) is a concave structure, and a vertical edge is provided in the middle of the upper and lower side walls. The docking frame (161) can be detachably embedded in the conveying port (61) of the etching box (11), and the vertical edge is in contact with the side wall of the etching box (11). The sealing plate (162) can be detachably buckled between the two ends of the docking frame (161), and the sealing plate (162) and the docking frame (161) are in contact. One end of the sealing plate (162) is movably inserted in the conveying port (61), and the two ends of the first shaft rod (163) are respectively movably inserted between the docking frame (161) and the sealing plate (162). A plurality of the first guide wheels (164) are respectively equidistantly mounted on the first shaft rod (163), and the first guide wheels (164) are located in the middle of the docking frame (161).
4. The etching device for semiconductor lead frame processing according to claim 3, characterized in that: The turning unit (17) comprises a turning seat (171), a push-pull rod (172) and a turning arm (173); The flip seat (171) is concave, and the flip seat (171) can be detachably placed on the rear side wall of the etching box (11), and a first axial hole is opened in the middle of both ends of the flip seat (171), and one end of the flip seat (171) is opened with a cross-shaped locking groove (101) connected to the first axial hole, and the push-pull rod (172) movably passes through the first axial holes at both ends of the flip seat (171), and both ends of the push-pull rod (172) are provided with blocking sheets, one end of the push-pull rod (172) is provided with a handle, and the front and rear sides of the middle of the push-pull rod (172) are provided with cross-shaped locking grooves connected to the first axial hole. The flip arm (173) is L-shaped, and a second axial hole is provided in the middle of one end of the flip arm (173). The second axial hole is provided with a connected I-shaped locking groove at both sides. One end of the flip arm (173) is movably mounted on the push-pull rod (172), and the I-shaped locking groove (102) is mounted on the locking edge. The other end of the flip arm (173) is fixedly connected to the rear wall of the box cover (18).
5. The etching device for semiconductor lead frame processing according to claim 4, characterized in that: The conveying structure (2) comprises a carrying box (21), a drainage pipe (22), a transfer pipe (23), a plurality of bearings (24), a plurality of shaft seats (25), a plurality of second shaft rods (26), a plurality of second guide wheels (27), a motor (28), a plurality of double-groove pulleys (29), and a plurality of belts (20); The carrier box (21) is a box body without an upper wall, and a pick-up port (71) corresponding to the cleaning port (62) is provided on the front side wall of the carrier box (21). Vertical plates (75) are provided on the upper wall edges of both the front and rear ends of the carrier box (21). The carrier box (21) can be detachably embedded in the etching box (11), and the pick-up port (71) and the cleaning port (62) are relatively matched. The upper wall edge of the carrier box (21) and the lower wall of the delivery port (61) are on the same horizontal line. The carrier box (21) is fixed by bolts penetrating the vertical plates (75), and the carrier box (21) is located above the liquid pump (14). One end of the drainage pipe (22) is fixed to the front claw of the carrier box (21). 1) in the middle of the lower wall, and the other end of the drainage pipe (22) passes through the bottom of the left wall of the etching box (11), one end of the transfer pipe (23) is fixedly passed through the lower wall of the carrier box (21), and the other end of the transfer pipe (23) is connected to the liquid outlet end of the liquid pump (14), a plurality of bearings (24) are respectively equidistantly embedded in the vertical plate (75), and the center of the bearing (24) corresponds to the two ends of the first shaft rod (163), one end of the plurality of shaft seats (25) is a round rod structure, and the other end is a rectangular rod structure, one end of the shaft seats (25) is respectively fixedly passed through the middle of the first bearing (24) above the rear side wall of the carrier box (21), and is located in the rear cover (12), the shaft A U-shaped groove (72) communicating with the upper wall is formed in the middle of the front side wall of the other end of the seat (25), and the U-shaped groove (72) is formed with connected arc grooves (73) on the left and right sides. The front and rear ends of the plurality of second shaft rods (26) are relatively movably connected, and the two ends of the second shaft rods (26) are relatively turned over. One end of the second shaft rod (26) is fixedly inserted into the first bearing (24) above the front side wall of the carrier box (21), and the other end is movably embedded in the U-shaped groove (72) of the shaft seat (25). Twist blocks (74) are provided on the left and right sides of the other end of the second shaft rod (26), and the twist blocks (74) are movably embedded in the arc groove (73). The plurality of second guide rods (26) are The wheel (27) is the same as the first guide wheel (164), and a plurality of the second guide wheels (27) are respectively equidistantly mounted on the second shaft rod (26), and the upper wall of the second guide wheel (27) is in the same horizontal plane as the upper wall of the first guide wheel (164). The motor (28) is fixedly arranged on the inner lower wall of the rear cover (12), and the motor (28) is located below one of the shaft seats (25). A plurality of the double-groove pulleys (29) are respectively fixedly mounted on the driving end of the motor (28) and one end of the shaft seat (25), and the two ends of a plurality of the belts (20) are respectively staggeredly mounted between the double-groove pulleys (29), and the double-groove pulleys (29) are connected in series through the belts (20) and rotate in the same direction.
6. The etching device for semiconductor lead frame processing according to claim 5, characterized in that: The bearing unit (3) comprises a bearing plate (31), a pair of bearing seats (32), two pairs of adjusting bolts (33) and two pairs of adjusting nuts (34); The bearing plate (31) is rectangular, and a first adjustment groove (81) is formed through the middle of the bearing plate (31), and second adjustment grooves (82) are formed symmetrically on both sides of the first adjustment groove (81). The pair of bearing seats (32) are both L-shaped, and first adjustment openings (83) corresponding to the first adjustment grooves (81) are formed at one end of the bearing seats (32). One end of the pair of bearing seats (32) is movably arranged below two ends of the bearing plate (31) and is symmetrical to each other. The other ends of the pair of bearing seats (32) are detachably arranged on the front and rear side walls of the etching box (11). One end of the two pairs of adjustment bolts (33) is movably passed through two corners of one end of the bearing seats (32), and one end of the adjustment bolts (33) is movably passed through the second adjustment opening. The two pairs of adjustment nuts (34) are movably screwed on the adjustment bolts (33).
7. The etching device for semiconductor lead frame processing according to claim 6, characterized in that: The spray structure (5) comprises a locking assembly (51), a spray pipe (52) and a plurality of spray heads (53); the locking assembly (51) is movably mounted on the carrier plate (31); the spray pipe (52) is detachably mounted on the locking assembly (51); one end of the spray pipe (52) is connected to the diverter valve pipe (4); and the plurality of spray heads (53) are detachably mounted on the lower wall of the spray pipe (52) at equal distances; The locking assembly (51) comprises a locking platform (511), a fastening screw (512), a pressure rod (513), a finger rod (514), a spring (515) and a locking rod (516); The locking platform (511) is a convex structure, and a sleeve groove (92) is provided on the middle upper wall of the locking platform (511) near the rear end. The locking platform (511) can be detachably placed on the bearing plate (31), and the sleeve groove (92) is sleeved on the nozzle (52) and is located between the two nozzles (53). A mounting cavity (91) communicating with the front side wall is provided in the top of the locking platform (511). A locking hole (93) is provided on the front upper wall of the locking platform (511). The inner diameter of the locking hole (93) is larger than the diameter at the locking hole (93), and communicating fitting openings are provided on both sides of the locking hole (93). The fastening screw (512) movably passes through the first adjustment groove (81) and is screwed to the lower wall of the locking platform (511). The pressure rod (513) is L-shaped. One end of the pressure rod (513) movably passes through the upper wall of the locking platform (511) and is located in the middle of the installation cavity (91); the other end of the pressure rod (513) is located above the middle of the sleeve groove (92) and fits with the upper wall of the locking platform (511); one end of the finger rod (514) is fixedly arranged in the middle of the pressure rod (513) and one end of the finger rod (514) movably passes through the front side wall of the installation cavity (91); the spring (515) is movably sleeved on one end of the pressure rod (513) and is located between one end of the finger rod (514) and the lower wall of the installation cavity (91); one end of the locking rod (516) movably passes through the other end of the finger rod (514); the other end of the locking rod (516) is symmetrically provided with a fitting block corresponding to the fitting opening, and the fitting block movably passes through the lock hole (93) and then rotates to lock.
8. An etching method for semiconductor lead frame processing, which is applied to an etching device for semiconductor lead frame processing as claimed in claim 7, characterized in that: The following steps are involved: Step 1: The lead frame is moved through the docking assembly (16) from one side of the main structure (1) by using existing conveying equipment, and is continuously conveyed and moved through the conveying structure (2); Step 2: When the lead frame moves through the conveying structure (2) in the etching box (11), the etching liquid is supplied by the liquid pump (14) and sprayed from the nozzle (53) in the spray structure (5) to contact with the lead frame to etch the corresponding parts, and then moves out from the other side of the main structure (1) as it moves; Step 3: According to etching requirements, the carrier unit (3) is installed in the etching box (11) above the second wheel or placed in the carrier box (21) below the second guide wheel (27) for spraying at different etching times, and nozzles (52) of different numbers and spacings are arranged through corresponding locking components (51) to set the spray range requirements according to actual requirements; Step 4: During maintenance, the first shaft (163) can be turned over to facilitate cleaning and wiping of the second guide wheel (27) and cleaning of the inner wall of the carrier box (21) or picking up materials dropped due to conveying and movement; Step 5: The flip unit (17) is used to facilitate the locking and fixing of the box cover (18) after it is opened or closed.
Citation Information
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