Substrate processing apparatus and method

Abstract

The present invention discloses a substrate processing apparatus and method, the substrate processing apparatus comprising: a processing container having a processing space therein; a support unit for supporting and rotating the substrate in the processing space; and a nozzle unit for supplying a processing solution to the substrate, in which the processing container includes a plurality of cups surrounding a processing space and provided such that openings through which the processing solution is introduced are stacked in an up-down direction, each of the plurality of cups including: a side wall; and an upper wall extending from the side wall toward the processing space, and an inner end of the upper wall of a first cup protruding further toward the processing space than an inner end of an upper wall of another cup, the upper wall of the first cup being located at an uppermost side of the plurality of cups.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0128371 filed in the Korean Intellectual Property Office on September 25, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a device and method for liquid processing substrate. Background Art

[0004] Generally, in the process of processing a glass substrate or a wafer in the process of manufacturing a flat panel display device or a semiconductor, various processes such as a photoresist coating process, a developing process, an etching process, and an ashing process are performed. In each process, in order to remove various contaminants attached to the substrate, a wet cleaning process using a chemical liquid or deionized water and a drying process for drying the chemical liquid or deionized water remaining on the surface of the substrate are performed.

[0005] The process of processing a substrate using liquid in each process includes an operation of supplying a liquid (such as a chemical liquid) to the substrate and rotating the substrate. During this operation, as the substrate rotates, the chemical liquid or the like is applied to the substrate and reacts with the substrate.

[0006] In this case, as the substrate rotates, the chemical liquid or the like is sputtered out of the substrate. The chemical liquid may be sputtered into the interior of a process container providing a process space for processing the substrate, but may also be sputtered out of the opening of the process container.

[0007] Specifically, the opening of the processing container must be set larger than the substrate to avoid interference with the chuck pins supporting the substrate from the side when the substrate enters. Since the opening is set wider than the width of the substrate, the processing container is easily splashed from the outside through the opening. The externally splashed chemical liquid and the like are fixed on the outside of the processing container and generate fumes, and the substrate may be contaminated by particles in the fumes during substrate processing. Summary of the invention

[0008] The present invention is directed to providing a substrate processing apparatus capable of minimizing splashing outside a processing container when rotating a substrate for liquid processing.

[0009] The present invention is also directed to providing a substrate processing apparatus capable of cleaning the exterior of a processing container.

[0010] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0011] An exemplary embodiment of the present invention provides a substrate processing device, which includes: a processing container having a processing space therein; a support unit for supporting and rotating a substrate in the processing space; and a nozzle unit for supplying a processing solution to the substrate, wherein the processing container includes a plurality of cup-shaped members, the plurality of cup-shaped members surround the processing space and are arranged so that openings through which the processing solution is introduced are stacked in an up-down direction, and each of the plurality of cup-shaped members includes: a side wall; and an upper wall, the upper wall extending from the side wall toward the processing space, and an inner end of the upper wall of a first cup-shaped member protrudes further toward the processing space than an inner end of an upper wall of another cup-shaped member, and the upper wall of the first cup-shaped member is located at the uppermost side of the plurality of cup-shaped members.

[0012] According to an exemplary embodiment, a groove may be formed in an inner end of the upper wall of the first cup.

[0013] According to an exemplary embodiment, the support unit may include a support plate on which the substrate is placed, and a plurality of chuck pins disposed to protrude upward from a top surface of the support plate and to support a lateral portion of the substrate when processing the substrate.

[0014] According to an exemplary embodiment, when a top end of the chuck pin moves to a position higher than an inner end of an upper wall of the first cup, the chuck pin may be inserted into the groove.

[0015] According to an exemplary embodiment, when viewed from above, the inner end of the upper wall of the first cup is at a shorter distance to the central axis of the support plate than to the outer end of the chuck pin.

[0016] According to an exemplary embodiment, the chuck pin can be configured to be movable between a supporting position for supporting a substrate and a standby position for releasing the support of the substrate, and when the chuck pin is in the standby position, the top end of the chuck pin can pass through the groove when moving to a position higher than the inner end of the upper wall of the first cup-shaped member.

[0017] According to an exemplary embodiment, an inner end of the upper wall of the first cup may be disposed to be inclined upward toward a central axis of the first cup.

[0018] According to an exemplary embodiment, the upper wall of the first cup-shaped member may include a main body portion and a protrusion, and when the main body portion is observed from above, the inner end of the main body portion may coincide with the inner end of the upper wall of the other cup-shaped member, the protrusion may be detachably arranged at the inner end of the main body portion, and a groove may be formed in the inner end of the protrusion.

[0019] Another exemplary embodiment of the present invention provides a substrate processing device, which includes: a processing container, which has a barrel shape with an open top and provides a processing space; a supporting unit, which is used to support and rotate the substrate in the processing space; and a liquid supply unit, which is used to supply a processing solution to the substrate supported on the supporting unit, wherein the processing container includes: a side wall, which is arranged in a ring shape and surrounds the supporting unit; and an upper wall, which extends from the top end of the side wall toward the central axis of the supporting unit and forms a groove at the inner end of the upper wall.

[0020] According to an exemplary embodiment, the support unit may include a support plate on which the substrate is placed, and a plurality of chuck pins disposed to protrude upward from a top surface of the support plate and to support a lateral portion of the substrate when processing the substrate.

[0021] According to an exemplary embodiment, the chuck pin can be configured to be movable between a supporting position for supporting a substrate and a standby position for releasing the support of the substrate, and when the chuck pin is in the standby position, the top end of the chuck pin can pass through the groove when moving to a position higher than the upper wall.

[0022] According to an exemplary embodiment, when viewed from above, in the standby position, an inner end of the upper wall may be disposed closer to a central axis of the support plate than an outer end of the chuck pin.

[0023] According to an exemplary embodiment, the groove may be formed at a position corresponding to the standby position.

[0024] According to an exemplary embodiment, the groove may be provided for insertion of the chuck pin when a top end of the chuck pin moves to a position higher than the upper wall.

[0025] According to an exemplary embodiment, the chuck pin may be arranged such that, when viewed from above, in the supporting position, an outer end of the chuck pin is closer to the central axis of the supporting plate than an inner end of the upper wall.

[0026] According to an exemplary embodiment, the upper wall may be provided to be inclined upward toward a central axis of the support plate.

[0027] According to an exemplary embodiment, the portion extending from the upper wall may be a protrusion, and the upper wall and the protrusion may be separable.

[0028] Another exemplary embodiment of the present invention provides a substrate processing device, which includes: a processing container having a processing space therein; a support unit for supporting and rotating the substrate in the processing space; and a nozzle unit for supplying a processing solution to the substrate; wherein the processing container includes a plurality of cup-shaped members, the plurality of cup-shaped members surrounding the processing space and arranged so that openings through which the processing solution is introduced are stacked in an up-down direction, each of the plurality of cup-shaped members includes: a side wall; and an upper wall, the upper wall extending from the side wall toward the processing space, and the inner end of the upper wall of the first cup-shaped member protrudes further toward the processing space than the inner end of the upper wall of another cup-shaped member, the upper wall of the first cup-shaped member is located at the uppermost side of the plurality of cup-shaped members, a groove is formed in the inner end of the upper wall of the first cup-shaped member, a chuck pin is arranged to be movable between a supporting position for supporting the substrate and a standby position for releasing the support of the substrate, and the groove is used for inserting the chuck pin when the top end of the chuck pin moves to a position higher than the inner end of the upper wall of the first cup when the chuck pin is in the standby position.

[0029] According to an exemplary embodiment, the plurality of cup-shaped members may further include a second cup-shaped member, which may be located inside the first cup-shaped member, the upper wall of the second cup-shaped member being arranged parallel to the upper wall of the first cup-shaped member but being located at a lower position than the upper wall of the first cup-shaped member, and the substrate processing device may further include a lifting member for adjusting the relative height of the first cup-shaped member and the second cup-shaped member.

[0030] According to an exemplary embodiment, the upper wall may be disposed to be inclined upward toward a central axis of the supporting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] By studying the detailed description in conjunction with the accompanying drawings, various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not considered to be drawn to scale. For clarity, the various dimensions in the drawings may be exaggerated.

[0032] Figure 1 FIG. 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0033] Figure 2 To schematically show Figure 1 FIG. 1 is a diagram of an exemplary embodiment of a liquid processing chamber.

[0034] Figure 3 To schematically show Figure 2 FIG. 1 is a diagram of a liquid processing chamber viewed from above.

[0035] Figure 4 To illustrate the use of Figure 2 A flow chart of a method for processing a substrate in a liquid processing chamber.

[0036] Figures 5 to 7 To show that Figure 4 A cross-sectional view of the operation of a liquid processing chamber during a substrate loading operation.

[0037] Figure 8 A diagram showing cleaning of the exterior of a process vessel.

[0038] Fig. 9 The figure schematically shows another exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0039] Hereinafter, exemplary embodiments of the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention may be implemented differently and is not limited to the following exemplary embodiments. In the following description of the present invention, detailed descriptions of known functions and configurations incorporated herein are omitted to avoid making the subject matter of the present invention unclear. In addition, throughout the accompanying drawings, the same reference numerals are used for components with similar functions and effects.

[0040] Unless explicitly stated to the contrary, the word "include" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements. It should be understood that the terms "including" and "having" are intended to indicate the presence of the features, quantities, operations, operations, constituent elements and parts, or combinations thereof, described in the specification, and do not exclude the pre-existence or addition of one or more other features, quantities, operations, operations, constituent elements and parts, or combinations thereof.

[0041] Singular expressions used herein include plural expressions unless they have clearly opposite meanings in the context. Therefore, the shapes, sizes, etc. of elements in the drawings may be exaggerated for clearer description.

[0042] Terms such as first and second are used to describe different constituent elements, but the constituent elements should not be limited by the terms. These terms are only used to distinguish one constituent element from another constituent element. For example, without departing from the scope of the present disclosure, the first constituent element can be named as the second constituent element, and similarly, the second constituent element can be named as the first constituent element.

[0043] It should be understood that when a constituent element is referred to as being “coupled to another constituent element” or “connected to another constituent element”, the constituent element may be directly coupled to another constituent element or connected to another constituent element, but other constituent elements may be interposed. Conversely, when a constituent element is “directly coupled to another constituent element” or “directly connected to another constituent element”, it should be understood that there are no interposed elements. Other expressions describing the relationship between constituent elements, such as “between… and…”, “just between… and…” or “adjacent to…” and “directly adjacent to…”, should be interpreted similarly.

[0044] All terms (including technical terms or scientific terms) used herein have the same meaning as those generally understood by those skilled in the art, unless these terms are defined differently. Terms defined in general dictionaries will be interpreted as having meanings that match their meanings in the relevant technical context, and unless these terms are clearly defined in this application, they should not be interpreted as ideal meanings or overly formal meanings.

[0045] The foregoing detailed description illustrates the present invention. In addition, the above content shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, within the scope of the inventive concept disclosed in this specification, the scope equivalent to the content of the present invention and / or the technology or knowledge in the art, the foregoing content can be modified or amended. The foregoing exemplary embodiments describe the best state of the technical spirit of the implementation of the present invention, and various changes required in the specific application fields and uses of the present invention are possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should be interpreted as also including other exemplary embodiments.

[0046] In the present exemplary embodiment, the present application is described based on a process for cleaning a substrate by using a treatment solution as an example. However, the present exemplary embodiment is not limited to the cleaning process, but can be applied to various substrate processing processes using liquids, such as etching processes, ashing processes, and developing processes.

[0047] Figure 1 FIG. 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0048] See also Figure 1, the substrate processing apparatus includes an index module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction 92, and when viewed from above, a direction perpendicular to the first direction 92 is referred to as a second direction 94 and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0049] The index module 10 transfers the substrate W from the container 80 containing the substrate W therein to the process module 20, and causes the substrate W that has been completely processed in the process module 20 to be contained in the container 80. The longitudinal direction of the index module 10 is arranged along the second direction 94. The index module includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the process module 20 based on the index frame 14. The container 80 containing the substrate W therein is placed on the loading port 12. The loading port 12 may be provided in plural, and the plural loading ports 12 may be provided in the second direction 94.

[0050] An airtight container such as a Front Open Unified Pod (FOUP) may be used as the container 80. The container 80 may be placed on the load port 12 by a transport device (not shown) such as an overhead transport, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0051] The index robot 120 is provided to the index frame 14. A guide rail 140 (whose longitudinal direction is the second direction 94) is provided inside the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 140. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable forward and backward, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0052] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a liquid processing chamber 400. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process of liquid-treating the substrate W by supplying liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0053] The transfer chamber 300 may be arranged such that the longitudinal direction is the first direction 92. The buffer unit 200 may be arranged between the index module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided, and the plurality of liquid processing chambers are provided on the side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0054] According to an example, the liquid processing chambers 400 are respectively disposed on both sides of the transfer chamber 300. At each of the two sides of the transfer chamber 300, the liquid processing chambers 400 may be disposed in an A×B (each of A and B is a natural number of 1 or greater) array along the first direction 92 and the third direction 96.

[0055] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 having a longitudinal direction along the first direction 92 is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 in which the substrate W is placed, and the hand 322 may be provided to be movable forward and backward, rotatable about a third direction 96, and movable along the third direction 96. A plurality of hands 322 are provided to be spaced apart in the vertical direction, and the hands 322 may be moved forward and backward independently of each other.

[0056] The buffer unit 200 includes a plurality of buffer zones 220 on which the substrate W is placed. The buffer zones 220 may be arranged to be spaced apart from each other along the third direction 96. The front and back sides of the buffer unit 200 are open. The front side is a side facing the index module 10, and the back side is a side facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front side, and the transfer robot 320 may approach the buffer unit 200 through the back side.

[0057] Figure 2 To schematically show Figure 1 FIG. 4 is a diagram of an exemplary embodiment of a liquid processing chamber 400. Figure 2 The liquid processing chamber 400 includes a housing 410, a processing container 420, a support unit 440, a nozzle unit 460, a lifting unit 480, a liquid supply unit 460, and a controller.

[0058] The housing 410 is provided in a substantially rectangular parallelepiped shape. The process container 420 , the support unit 440 , and the nozzle unit 460 are provided in the housing 410 .

[0059] The processing container 420 has a processing space with an open top, and liquid processing is performed on the substrate W in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid onto the substrate W supported by the support unit 440. The liquid may be provided in various types and may be sequentially supplied onto the substrate W. The lifting unit 480 adjusts the relative height between the processing container 420 and the support unit 440.

[0060] In one example, the processing container 420 has a plurality of cups 422, 424, and 426. Each of the cups 422, 424, and 426 has a collection space for collecting liquid for processing a substrate. Each of the cups 422, 424, and 426 is provided with a ring shape around the support unit 440. During the liquid treatment process, the treatment solution sputtered by the rotation of the substrate W enters the collection space through the inlets 422a, 424a, and 426a of the respective cups 422, 424, and 426. In one example, the processing container 420 has a first cup 426, a second cup 424, and a third cup 422. The first cup 422 is provided to surround the support unit 440, the second cup 424 is provided to surround the first cup 426, and the third cup 422 is provided to surround the second cup 424. The second inlet 424a for receiving liquid into the second cup 424 may be positioned above the first inlet 426a for receiving liquid into the first cup 426, and the third inlet 422a for receiving liquid into the third cup 422 may be positioned above the second inlet 424a.

[0061] Figure 3 for Figure 2 An enlarged view of some of the cups and support units in the liquid processing chamber of FIG. Figure 3 , the first cup 426 , the second cup 424 , and the third cup 422 will be described in more detail.

[0062] The first cup-shaped member 426 includes a side wall 426a, an upper wall 426b and a projection 426c. The side wall 426a is arranged in an annular shape. The side wall 426a is arranged to surround the side wall 424a. The side wall 426a is mounted on the guide rail. The side wall 426a can move along the longitudinal direction of the guide rail. The upper wall 426b is arranged to be annular extending inwardly from the inner surface of the side wall 426a. The upper wall 426b is arranged to be inclined upward from the side wall 426a toward the central axis of the support plate 342. The upper wall 426b extends to have an inner diameter smaller than the upper wall 422b. The inner end 426d of the upper wall 426b can extend to be closer to the central axis of the support plate 342 than the outer end 448a of the chuck pin 448, which will be discussed later. The upper wall 426b can be extended to such an extent that interference does not occur between the first cup-shaped member 426 and the substrate W when loading or unloading the substrate W. The inner end 426d of the upper wall 426b is provided with a groove 426e. In one example, when viewed from above, the groove 426e can be provided at a position corresponding to the position where the chuck pin 448 is provided. Further, the groove 426e can be provided in the same number as the chuck pin 448. The protrusion 426c is provided as a ring extending downward from the far end of the upper wall 426b. When viewed from the side, the bottom end of the protrusion 426c can be positioned as a bottom end higher than the upper wall 426b.

[0063] The second cup-shaped member 424 comprises a side wall 424a, an upper wall 424b and a projection 426c. The side wall 424a is arranged in an annular shape. The side wall 424a is positioned between the side wall 424a and the side wall 426a. The upper wall 424b is arranged in an annular shape extending inwardly from the top of the side wall 424a. The upper wall 424b is arranged to be inclined upwardly from the side wall 424a. The upper wall 424b is arranged to have an opening with the same inner diameter as the upper wall 422b. The projection 424c is arranged in an annular shape extending downwardly from the far end of the upper wall 424b. When viewed from the side, the bottom end of the projection 424c can be positioned higher than the bottom end of the upper wall 424b. The bottom surface portion 424d extends inwardly from the bottom end of the side wall 424a.

[0064] The third cup-shaped member 422 comprises a side wall 422a, an upper wall 422b and a projection 422c. The side wall 422a is arranged to be annular in shape. The side wall 422a is arranged to have a smaller inner diameter than the supporting side wall 428a. The upper wall 422b is arranged to be annular in shape extending inwardly from the top of the side wall 422a. The upper wall 422b is arranged to face the direction tilted upward from the side wall 422a. The projection 422c is arranged to be annular in shape extending downwardly from the far end of the upper wall 422b. When viewed from the side, the bottom end of the projection 422c can be positioned higher than the bottom end of the upper wall 422b.

[0065] The support unit 440 includes a support plate 442, a drive shaft 444, a support pin 446 and a chuck pin 448. The top surface of the support plate 442 may be provided with a substantially circular shape and may have a diameter greater than the diameter of the substrate W. The support pin 446 is provided at the center of the support plate 442 to support the rear surface of the substrate W, and the support pin 446 is provided with a top end protruding from the support plate 442 so that the substrate W is spaced a certain distance from the support plate 442. The chuck pin 448 is provided at the edge of the support plate 442. A plurality of chuck pins 448 are provided. The chuck pin 448 is provided to be further away from the center of the support plate 442 than the support pin 446. The chuck pin 448 is provided to protrude from the top surface of the support plate 442. The support pin 448 supports the lateral portion of the substrate W to prevent the substrate W from being laterally offset from the fixed position when the support plate W rotates. The chuck pin 448 is provided to be linearly movable between the standby position A1 and the support position A2 along the radial direction of the support plate 442. The standby position A1 is a position farther from the center of the support plate 442 than the support position A2. When the substrate W is loaded into or unloaded from the substrate support unit 440, the chuck pin 448 is positioned at the standby position A1, and when a process is performed on the substrate W, the chuck pin 448 is positioned in the support position A2. At the support position A2, the chuck pin 448 contacts the lateral portion of the substrate W. The drive shaft 444 driven by the driver 446 is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 relative to its central axis. The drive shaft 444 is set to a barrel shape, and its longitudinal direction faces up and down. The rotating shaft 444 is fixedly coupled to the bottom surface of the support plate 442. The driver 446 provides a driving force to the drive shaft 444 to rotate the drive shaft 444. When the driver 446 provides a driving force to the drive shaft 444, the support plate 442 and the drive shaft 444 rotate together.

[0066] The nozzle unit 460 includes a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies a treatment solution onto the substrate W. The treatment solution may be a cleaning solution. In one example, the cleaning solution may be water. The water may be pure water or deionized water.

[0067] The first nozzle 462 and the second nozzle 464 are supported on different arms 461, respectively, and the arms 461 can move independently. Alternatively, the first nozzle 462 and the second nozzle 464 can be mounted on the same arm and move simultaneously.

[0068] Optionally, the nozzle unit may further include one or more nozzles in addition to the first nozzle 462 and the second nozzle 464. The additional nozzles may supply different types of processing solutions to the substrate. For example, other types of processing solutions may be acidic solutions or alkaline solutions for removing impurities on the substrate. In addition, another type of processing solution may be an alcohol having a surface tension lower than that of water. For example, the alcohol may be isopropyl alcohol.

[0069] The lifting unit 480 linearly moves the processing container 420 in the up-down direction. The relative height between the processing container 420 and the substrate W is changed by the up-down movement of the processing container 420. This changes the cups 422, 424 and 426 according to the type of liquid supplied to the substrate W, so that the liquids can be collected respectively. The lifting unit 480 includes a connecting member 482, a moving shaft 484 and a driver 486. The moving shaft 484 is positioned at one side of the processing container 420. The connecting member 482 connects the moving shaft 484 and the side wall 426a to each other. When the moving shaft 484 is moved in the up-down direction by the driver 486, the processing container 420 moves together with the moving shaft 484. Different from the above description, the processing container 420 can be fixedly installed, and the lifting unit 480 can move the supporting unit 440 in the up-down direction.

[0070] Hereinafter, a method of processing the substrate W by using the above-mentioned substrate processing apparatus will be described.

[0071] Figure 4 is a flow chart showing a process of processing a substrate, and Figures 5 to 7 To show the chronological order Figure 4 Figure 2 shows a schematic diagram of a substrate loading operation.

[0072] See also Figure 4 , the method of processing a substrate includes a substrate loading operation S10, a substrate processing operation S20, a substrate unloading operation S30, and a process container cleaning operation S40.

[0073] The substrate loading operation S10 is an operation of loading the substrate W onto the supporting unit 340. Figures 5 to 7 The process of loading the substrate onto the support unit is described in the order of Figure 5 , the chuck pin 448 is positioned in the standby position A1. The process container 420 descends. When the process container 420 descends, the chuck pin 448 is inserted into the groove 426e formed in the upper wall 426b of the first cup 426. Therefore, even if the upper wall 426b is extended until the upper wall 426b interferes with the chuck pin 448, the substrate W can be loaded onto the support pin 446 without interference. Figure 6 , the transfer robot 320 delivers the substrate W onto the supporting pins 446. Then, the transfer robot 320 moves backward, and the substrate W is supported by the supporting pins 446. Figure 7, the chuck pin 448 moves linearly from the standby position A1 to the supporting position A2. Therefore, the chuck pin 448 supports the substrate W from the side. In one example, the chuck pin 448 can move linearly from the standby position A1 to the supporting position A2 in the space formed by the groove 426e. In one example, when the chuck pin 448 is positioned in the supporting position A2, the distance from the outer end 448a of the chuck pin 448 to the central axis of the supporting plate 342 can be greater than the inner end 426d of the upper wall 426b. The inner end 426d of the upper wall 426b can extend to a position where it does not interfere with the substrate during the descent of the processing container 420. Thereafter, the processing container 420 rises and the substrate processing operation S20 is performed.

[0074] The substrate processing operation S20 adjusts the relative heights of the first cup 426 and the second cup 424 according to the type of the processing solution. In one example, the relative heights of the first cup 426 and the second cup 424 may be adjusted so that when the substrate is processed with the first processing solution, the first processing solution is collected into the first inlet 426a, and when the substrate is processed with the second processing solution, the second processing solution is collected into the second inlet 424a.

[0075] The substrate unloading operation S30 is an operation of unloading the substrate W by lowering the process container 420. First, the process container 420 is lowered. When the process container 420 is lowered, the chuck pin 448 is inserted back into the groove 426e. Then the supporting pin 448 is moved from the supporting position A2 to the standby position A1. Therefore, the substrate W is delivered from the chuck pin 448 to the supporting pin 446. The substrate W is supported by the supporting pin 446 again. Then, the transfer robot 320 takes over the substrate W from the supporting pin 446 and transfers the substrate W to the transfer chamber 300.

[0076] Hereinafter, a method of cleaning a process container by using the above-mentioned substrate processing apparatus will be described.

[0077] Figure 8 FIG. 2 is a diagram showing an operation of cleaning a substrate by using a substrate processing apparatus according to an exemplary embodiment of the present invention. Figure 8 , the outer side of the first cup 426 is cleaned during the process container cleaning operation S40. In the first cleaning operation S40, the substrate W is loaded. The substrate W is loaded onto the support plate 442 in the same manner as the substrate loading operation S10. In this case, the top end of the inner end 426d of the first cup 426 is positioned at a lower position than the substrate W. The cleaning solution nozzle 409 disperses the cleaning solution onto the substrate W. The cleaning solution flows from the substrate W to the outer side of the first cup 426. Contaminants attached to the outer side of the first cup 426 are cleaned by the cleaning solution.

[0078] Generally, the opening of the first cup 426 needs to be positioned so that the inner end 426d of the first cup 426 is farther from the central axis of the support plate 342 than the outer end 448a of the chuck pin 448 to avoid interference between the first cup 426 and the chuck pin 448 during substrate loading and unloading. Therefore, the opening of the process container is wide, so that the processing solution is easily splashed to the outside of the process container 420. There is a problem in that when the substrate W is processed, the chemical solution splashed to the outside of the process container 420 generates fume and the like and contaminates the substrate W.

[0079] However, according to an exemplary embodiment of the present invention, by extending the upper wall of the first cup 426 to provide a narrow opening of the first cup 426, the chemical solution can be prevented from being splashed to the outside of the process container 420 during rotation. In addition, by forming a groove 426e at a position corresponding to the chuck pin 448 in the inner end 426d of the first cup 426, when the process container 420 is lowered by the transfer robot to transfer the substrate to the support unit, the process container 420 and the chuck pin 448 can be prevented from interfering (colliding). Therefore, the substrate W can be supported without interfering with the chuck pin 448, and the outside of the first cup 426 can be cleaned. Therefore, contamination of the substrate can be minimized during substrate processing.

[0080] In the above example, the present invention has been described based on the case where the upper wall 426b of the first cup-shaped member 426 is an integral type as an example. However, the present invention is not limited thereto, and as described above, the upper wall of the first cup-shaped member is formed by the body portion 427, wherein the inner end 426d of the upper wall 426b of the first cup-shaped member 426 coincides with the inner ends 424d and 422d of the upper walls 424c and 422c of the other cup-shaped members to provide the same width of opening, and the protrusion 428 is detachably provided on the inner end 427a of the body portion 427, and the groove 428b may be formed in the inner end 428a of the protrusion 428.

[0081] Further, in the above example, the present invention is described based on the case where the process container 420 includes a plurality of cups 422, 424, and 426 as an example, wherein the openings through which the process solution is introduced are stacked in the up-and-down direction. However, the present invention is not limited thereto, and the process container 420 may be provided only to the first cup 426, such as Fig. 9 shown.

[0082] Further, in the above example, the present invention is described based on a process of providing a cleaning solution as a processing solution and cleaning a substrate by using the cleaning solution as an example. However, the present exemplary embodiment is not limited to the cleaning process, but can be applied to various substrate processing processes using liquids, such as etching processes, ashing processes, and developing processes.

[0083] In addition, in the above example, the present invention is described based on the case where the cups 422, 424 and 426 are integrally formed and moved up and down together by the lifting unit 480. However, the present invention is not limited thereto, and the first cup 426, the second cup 424 and the third cup 422 may be driven independently.

[0084] The foregoing detailed description illustrates the present invention. In addition, the above content shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, within the scope of the inventive concept disclosed in this specification, the scope equivalent to the content of the present invention and / or the technology or knowledge in the art, the foregoing content can be modified or amended. The foregoing exemplary embodiments describe the best state of the technical spirit of the implementation of the present invention, and various changes required in the specific application fields and uses of the present invention are possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should be interpreted as also including other exemplary embodiments.

Claims

1. A substrate processing device, comprising: a processing vessel having a processing space therein; a supporting unit, the supporting unit being used to support and rotate the substrate in the processing space; as well as a nozzle unit for supplying a processing solution to the substrate; wherein the processing container comprises a plurality of cup-shaped members, the plurality of cup-shaped members surround the processing space and are arranged so that openings are stacked in an up-and-down direction, and the processing solution is introduced through the openings, Each of the plurality of cups comprises: side walls; and an upper wall extending from the side wall toward the processing space, and An inner end of an upper wall of a first cup-shaped member protrudes further toward the processing space than an inner end of an upper wall of another cup-shaped member, and the upper wall of the first cup-shaped member is located at an uppermost side among the plurality of cup-shaped members.

2. The substrate processing device according to claim 1, wherein: A groove is formed in the inner end of the upper wall of the first cup.

3. The substrate processing device according to claim 2, wherein: The supporting unit comprises: a support plate on which the substrate is placed; and A plurality of chuck pins are provided to protrude upward from a top surface of the support plate and to support a lateral portion of the substrate when the substrate is processed.

4. The substrate processing device according to claim 3, wherein: When the top end of the chuck pin moves to a position higher than the inner end of the upper wall of the first cup, the chuck pin is inserted into the groove.

5. The substrate processing device according to claim 3, wherein: When viewed from above, the inner end of the upper wall of the first cup-shaped member is located at a shorter distance from the central axis of the support plate than from the outer end of the chuck pin.

6. The substrate processing device according to claim 5, wherein: The chuck pin is arranged to be movable between a supporting position for supporting the substrate and a standby position for releasing the support of the substrate, and When the chuck pin is in the standby position, the top end of the chuck pin passes through the groove when moving to a position higher than the inner end of the upper wall of the first cup-shaped member.

7. The substrate processing device according to claim 6, wherein: The inner end of the upper wall of the first cup-shaped member is arranged to be inclined upward toward the central axis of the first cup-shaped member.

8. The substrate processing device according to claim 7, wherein: The upper wall of the first cup-shaped member includes a body portion and a protrusion, When the main body is viewed from above, the inner end of the main body coincides with the inner end of the upper wall of the other cup-shaped member, The protrusion is detachably disposed at the inner end of the body portion, and The groove is formed at the inner end of the protrusion.

9. A substrate processing device, comprising: a processing container having a barrel shape with an open top and providing a processing space; a supporting unit, the supporting unit being used to support and rotate the substrate in the processing space; as well as a liquid supply unit for supplying a processing solution to the substrate supported on the support unit, Wherein, the processing container comprises: a side wall, the side wall being arranged in an annular shape and surrounding the supporting unit; and an upper wall extending from a top end of the side wall toward a central axis of the support unit, and A groove is formed at an inner end of the upper wall.

10. The substrate processing device according to claim 9, wherein: The supporting unit comprises: a support plate on which the substrate is placed; and A plurality of chuck pins are provided to protrude upward from a top surface of the support plate and to support a lateral portion of the substrate when the substrate is processed.

11. The substrate processing device according to claim 10, wherein: The chuck pin is arranged to be movable between a supporting position for supporting the substrate and a standby position for releasing the support of the substrate, and When the chuck pin is in the standby position, the top end of the chuck pin passes through the groove when moving to a position higher than the upper wall.

12. The substrate processing device according to claim 11, wherein: When viewed from above, in the standby position, the inner end of the upper wall is disposed closer to the central axis of the support plate than the outer end of the chuck pin.

13. The substrate processing device according to claim 12, wherein: The groove is formed at a position corresponding to the standby position.

14. The substrate processing device according to claim 12, wherein: The groove is configured for insertion of the chuck pin when the top end of the chuck pin moves to a position higher than the upper wall.

15. The substrate processing device according to claim 14, wherein: The chuck pin is arranged so that, in the supporting position, the outer end of the chuck pin is closer to the central axis of the supporting plate than the inner end of the upper wall when viewed from above.

16. The substrate processing device according to claim 15, wherein: The upper wall is arranged to be inclined upward toward the central axis of the support plate.

17. The substrate processing device according to claim 16, wherein: The portion extending from the upper wall is a protrusion, and The upper wall and the protrusion are separable.

18. A substrate processing device, comprising: a processing vessel having a processing space therein; a supporting unit, the supporting unit being used to support and rotate the substrate in the processing space; as well as a nozzle unit for supplying a processing solution to the substrate; wherein the processing container comprises a plurality of cup-shaped members, the plurality of cup-shaped members surround the processing space and are arranged so that openings are stacked in an up-and-down direction, and the processing solution is introduced through the openings, Each of the plurality of cups comprises: side walls; and an upper wall extending from the side wall toward the processing space, and The inner end of the upper wall of the first cup-shaped member protrudes further toward the processing space than the inner end of the upper wall of the other cup-shaped member, and the upper wall of the first cup-shaped member is located at the uppermost side of the plurality of cup-shaped members. forming a groove in the inner end of the upper wall of the first cup-shaped member, The chuck pin is arranged to be movable between a supporting position for supporting the substrate and a standby position for releasing the support of the substrate, and The groove is used for insertion of the chuck pin when the top end of the chuck pin moves to a position higher than the inner end of the upper wall of the first cup when the chuck pin is in the standby position.

19. The substrate processing device according to claim 18, wherein: The plurality of cups further comprises a second cup, The second cup-shaped member is located at the inner side of the first cup-shaped member, The upper wall of the second cup-shaped member is arranged parallel to the upper wall of the first cup-shaped member but is located at a lower position than the upper wall of the first cup-shaped member, and The substrate processing device further includes a lifting member for adjusting a relative height of the first cup-shaped member and the second cup-shaped member.

20. The substrate processing device according to claim 19, wherein: The upper wall is arranged to be inclined upward toward the central axis of the support unit.

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