A wafer cleaning and drying device

Abstract

This application relates to the technical field of semiconductor processing, and provides a wafer cleaning and drying device, which includes a box body, a placement mechanism arranged in the box body for placing wafers, a cleaning mechanism arranged in the box body for cleaning the wafers located on the placement mechanism, a drying mechanism for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism and the drying mechanism respectively; at least two placement mechanisms are arranged at intervals along the height direction of the box body, and the placement mechanism includes two placement plates symmetrically arranged along the height direction of the box body, two first driving components respectively driving the two placement plates to rotate, two groups of rotating plates respectively rotatably connected to the surfaces of the two placement plates close to each other, and a second driving component for driving the rotating plates to rotate. This application has the beneficial effect of improving the processing efficiency of wafers.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor processing, and in particular, to a wafer cleaning and drying device. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon, which is then cut into circular sheets. Since micro-particles adhere to the surface of the wafer during the production process, it needs to be cleaned and dried.

[0003] Spray-type megasonic cleaning is a common cleaning and drying method during wafer processing. The main principle of its equipment is to clean the wafer by the high-energy frequency vibration effect combined with the chemical reaction of the cleaning agent. When in use, the wafer is first placed on the turntable and fixed. While the turntable rotates, the nozzle sprays the cleaning agent onto the surface of the wafer. After the megasonic is turned on, a high-speed acoustic micro-current is formed in the cleaning agent to clean the wafer. Finally, nitrogen or air is sprayed onto the surface of the wafer through the air pipe to achieve drying.

[0004] In the prior art, usually after one surface of the wafer is cleaned and dried, the wafer is turned over so that the other surface of the wafer faces upward for cleaning and drying. Such working efficiency is relatively low, so further improvement is needed. Summary of the Invention

[0005] In order to improve the processing efficiency of wafers, this application provides a wafer cleaning and drying device.

[0006] A wafer cleaning and drying device provided by this application adopts the following technical solutions:

[0007] A wafer cleaning and drying device, comprising a box body, a placement mechanism arranged in the box body for placing wafers, a cleaning mechanism arranged in the box body for cleaning the wafers located on the placement mechanism, a drying mechanism for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism and the drying mechanism respectively; at least two placement mechanisms are arranged at intervals along the height direction of the box body, and the placement mechanism includes two placement plates symmetrically arranged along the height direction of the box body, two first driving components respectively driving the two placement plates to rotate, two groups of rotating plates respectively rotatably connected to the surfaces of the two placement plates close to each other, and a second driving component for driving the rotating plates to rotate. The lower ends of the two placement plates are inclined towards each other, and the upper ends of the placement plates are rotatably connected to the box body. The second driving component and the first driving component are both electrically connected to the control mechanism. A turning component for turning the wafer over is arranged between the two placement mechanisms; an adsorption port is formed on the outer surface of the rotating plate, a chamber communicating with the adsorption port is formed in the rotating plate, and a negative pressure component for making the chamber in a negative pressure state is arranged on the rotating plate. The negative pressure component is electrically connected to the control mechanism; the drying mechanism is arranged below the placement mechanism, and a blocking component for blocking the cleaning agent and water when the cleaning mechanism cleans the wafers is arranged between the box body at the placement mechanism and the drying mechanism.

[0008] By adopting the above technical solutions, under normal conditions, the surfaces of the placement plates close to each other are inclined. After placing the wafers to be cleaned on the rotating plates of the upper placement mechanism, the control mechanism is used to start the negative pressure component to fix the wafers on the rotating plates. Then, the second driving component and the cleaning mechanism are started respectively to clean the wafers. When the surface of the wafer exposed at this time is cleaned, the first driving component is started to drive the placement plate to rotate to a certain angle, and then the negative pressure component is used to release the fixation of the rotating plate on one of the placement plates to the wafer. At this time, the wafer slides along the inclined direction of the placement plate towards the direction close to the placement plate with the opposite inclined direction below. As the turning component turns the wafer over, the other side of the wafer that has been cleaned on one side in the previous placement mechanism is set upwards. After all the wafers fall and are turned over to the lower placement mechanism, and a new batch of wafers to be cleaned are placed in the upper placement mechanism, then the cleaning mechanism is used to clean them.

[0009] After the cleaning of both surfaces of the wafer is completed, the placement plate of the placement mechanism below is rotated again by the first driving component. After the fixation of the wafer is released, the wafer falls into the drying mechanism below to dry both sides of the wafer. Since the drying mechanism is arranged below the placement mechanism and the rotating plate rotates, during the cleaning process of the cleaning mechanism, water will fall into the drying mechanism below. Therefore, a blocking component is provided to block it, so as to reduce the impact on the drying of the cleaned wafer.

[0010] In the above way, compared with the cleaning and drying method in the prior art, one drying process can be reduced to improve the processing efficiency of the wafer. And because there is a placement plate, and the two are inclined to each other. After one side of the wafer is cleaned, it will fall onto the placement mechanism below and be turned over by the flipping component to clean the other side of the wafer, so as to increase the number of wafers cleaned and further accelerate the processing efficiency of the wafer.

[0011] Preferably, rotation grooves for the rotating plate to be rotatably connected are respectively formed through the surfaces of the two placement plates close to each other. The second driving component includes a gear ring fixedly connected to the lower surface of the rotating plate, a gear meshing with the gear ring, and a second driving motor for driving the gear to rotate. The negative pressure component includes a connecting pipe rotatably connected to the middle of the rotating plate to communicate with the chamber and an air pump communicating with the connecting pipe for air supply or air extraction.

[0012] By adopting the above technical solution, when the wafer is placed on the rotating plate, the air pump is started to make the chamber in a negative pressure state to fix the wafer on the rotating plate. Then the second driving motor is started to drive the gear, the gear ring and the rotating plate to rotate in sequence, and the cleaning mechanism is started to cooperate to clean the wafer.

[0013] Preferably, the placement plates in the two placement mechanisms are the first placement plate and the second placement plate respectively from top to bottom along the height direction of the box body. The flipping component includes a cross plate arranged on the first placement plate and a partition strip arranged between the two second placement plates. There are two cross plates which are respectively arranged at the lower ends of the two first placement plates. The length direction of the cross plate is parallel to the length direction of the first placement plate, and the two cross plates are overlapped; abutting surfaces for abutting against the wafer sliding down from the first placement plate are respectively formed on the opposite side walls of the partition strip. The two ends of the partition strip are respectively connected to the opposite side walls of the box body. The second placement plate abuts against the lower surface of the partition strip, and the width of the partition strip is smaller than the width after the two cross plates are overlapped.

[0014] By adopting the above technical solution, the lower ends of the two first placement plates move towards each other, and the angle formed between the cross plate and the first placement plate is set as an obtuse angle. Since there are two cross plates arranged in a lapped manner, two first driving components need to be started respectively to drive the two first placement plates to rotate towards the placement mechanism below. After rotating to a certain angle, the wafer on the first placement plate is first released. At this time, the wafer slides down under the action of gravity and moves along the first placement plate and the cross plate towards the second placement plate. When the wafer abuts against the second placement plate, then when the first driving component is started to drive the first placement plate to rotate back to its original position, at this time, a thrust is applied to the wafer so that the angle formed between the wafer and the second placement plate becomes an acute angle. At this time, the wafer abuts against the second placement plate with the washed side under the action of gravity, that is, the operation of turning over the wafer is completed.

[0015] Among them, the two cross plates are arranged in a lapped manner, and the width after lapping is greater than the width of the spacer strip, so that the wafer can be inclined towards the second placement plate as much as possible after the first placement plate is reset, so as to improve the feasibility of the turning-over operation.

[0016] Preferably, air holes are formed on the upper surface of the cross plate away from the first placement plate, a communication cavity communicating with the air holes is arranged inside the cross plate, and a first air pipe for supplying or pumping air communicating with the communication cavity is arranged on the cross plate.

[0017] By adopting the above technical solution, by providing air holes, a certain thrust can be given to the wafer during the reset process of the first placement plate to push the wafer towards the second placement plate, so as to improve the success probability of wafer turning over.

[0018] Preferably, the flipping assembly further includes a first airbag arranged on the cross plate. The first airbag has a first expansion inner cavity, and the air hole communicates with the first expansion inner cavity.

[0019] By adopting the above technical solution, by providing a first airbag, the gas blown out from the air hole is collected and expanded, and after expansion, it pushes the wafer towards the rotating plate. As the gas increases, the expandable distance is relatively large. Compared with directly blowing air from the air hole to push the wafer to flip, the possibility of flipping failure can be reduced. And the first airbag can seal the air hole to reduce the possibility of cleaning liquid or water entering the air hole subsequently.

[0020] Preferably, the spacer strip is elastic, the flipping assembly further includes a lifting member for driving the spacer strip to lift along the height direction of the box body, and the inclination angle of the second placement plate is greater than the inclination angle of the first placement plate.

[0021] By adopting the above technical solution, the partition strip is elastically arranged to reduce the possibility of damage when the wafer falls onto the second placement plate below, and it is also convenient to improve the sealing effect between the second placement plate and the partition strip, reducing the possibility of water overflowing into the drying mechanism below during the wafer cleaning process. To facilitate the wafer to fall into the drying mechanism below for drying, the inclination angle of the second placement plate is made larger than that of the first placement plate, and a lifting member is provided to drive the partition strip to move up and down along the height direction of the box body to adjust the height position of the partition strip, so as to facilitate providing a falling space for the wafer to fall into the drying mechanism below for drying.

[0022] Preferably, the partition strip is a second airbag, and the second airbag has a second expansion cavity inside. The second airbag is connected to a second air pipe for air injection or extraction. When air is inflated into the second airbag through the second air pipe, it expands in the direction close to the second placement plate.

[0023] By adopting the above technical solution, the second airbag can also expand itself to abut against the second placement plate to achieve a sealing effect.

[0024] Preferably, the blocking assembly is arranged on the second placement plate. The blocking assembly includes a blocking plate that can expand and contract when the second placement plate rotates. The blocking plate includes a plurality of folding plates connected to each other. A plurality of through holes are formed in the surface of the second placement plate along its own length direction, and the through holes are located above the folding plates. A drain pipe for discharging the water and cleaning agent used for cleaning out of the box body is fixedly penetrated through the side wall of the box body.

[0025] By adopting the above technical solution, for the blocking of water and cleaning agent by the drying assembly below, it is specifically blocked by the blocking plate that can expand and contract when the second rotating plate rotates.

[0026] Preferably, the blocking assembly further includes two flow guide plates both arranged below the blocking plate. The two flow guide plates are symmetrically arranged along the axis of the box body. The two flow guide plates are respectively arranged on both sides of the second placement plate and are connected to the box body. The length direction of the flow guide plate is perpendicular to the length direction of the blocking plate. The flow guide plate is inclined in the direction away from the second placement plate; the drying mechanism includes a conveying rack arranged below the second placement plate, a placement rack arranged on the conveying rack for the wafer to be placed obliquely, and an exhaust pipe for conveying gas to dry the wafer.

[0027] By adopting the above technical solution, since the baffle is composed of several interconnected folding plates, the sealing performance between it and the box body may be poor, and there may be gaps between two baffle plates, and water may overflow into the drying mechanism below. To prevent this, a diversion plate is provided for blocking. Due to the movement of the partition strip or the rotation of the second placement plate, the wafer after cleaning will fall obliquely onto the conveying rack. Therefore, a placement rack is provided on the conveying rack for placing the wafer, and then the wafer is dried through an exhaust pipe.

[0028] Preferably, the placement rack includes a cross bar, two groups of support bars that are inclined and arranged on both sides of the cross bar respectively, and a connecting rod arranged parallel to the length direction of the cross bar. The length direction of the cross bar is arranged parallel to the width direction of the conveying rack, and an adsorbent for adsorbing moisture is provided on the placement rack.

[0029] By adopting the above technical solution, since the support bars are inclined, the wafer will be placed obliquely after falling, so that the two relatively exposed surfaces of the wafer can be dried through the exhaust pipe, and the part in contact with the placement rack is adsorbed by the adsorbent.

[0030] In summary, the present application has the following beneficial effects:

[0031] By the above method, compared with the cleaning and drying methods in the prior art, one drying process can be reduced, so as to improve the processing efficiency of the wafer. And since a placement plate is provided and the two are inclined, after one side of the wafer is cleaned, it can fall onto the placement mechanism below and be turned over by the flipping assembly to clean the other side of the wafer, thereby increasing the number of wafers that can be cleaned and further accelerating the processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is the overall structural schematic diagram of Embodiment 1 of the present application;

[0033] Figure 2 is the internal structural schematic diagram of Embodiment 1 of the present application;

[0034] Figure 3 is the rear structural schematic diagram of the box body in Embodiment 1 of the present application;

[0035] Figure 4 is the structural schematic diagram of the rotating plate in Embodiment 1 of the present application;

[0036] Figure 5 is the structural schematic diagram of the second driving assembly in Embodiment 1 of the present application;

[0037] Figure 6 is the structural schematic diagram of the placement rack in Embodiment 1 of the present application;

[0038] Figure 7 is a schematic diagram of the structure of the toggle member in Example 2 of the present application;

[0039] Figure 8 is a schematic cross-sectional structural diagram of the horizontal plate in Example 3 of the present application;

[0040] Figure 9 is a schematic diagram of the structure of the lifting member in Example 3 of the present application;

[0041] Figure 10 It is a schematic diagram of the structure of the first airbag in Example 4 of the present application.

[0042] Explanation of the reference numerals: 1. Box body; 11. Opening; 12. Box door; 13. Drain pipe; 14. Negative pressure assembly; 141. Connecting pipe; 142. Air pump; 143. Dust cover; 15. Through hole; 16. Mounting plate; 2. Placement mechanism; 21. Placement plate; 211. Perforation; 212. Rotating rod; 213. Rotating groove; 214. First placement plate; 215. Second placement plate; 22. First drive assembly; 23. Rotating plate; 231. Adsorption port; 232. Chamber; 24. Second drive assembly; 241. Gear ring; 242. Gear; 243. Second drive motor; 3. Cleaning mechanism; 31. Spray head ; 32. Water supply pipe; 33. Third drive assembly; 4. Drying mechanism; 41. Conveying rack; 42. Placement rack; 421. Cross bar; 422. Support rod; 423. Connecting rod; 424. Adsorbent; 43. Exhaust pipe; 5. Flip assembly; 51. Cross plate; 511. Air hole; 512. Connecting cavity; 513. First air pipe; 52. Spacer; 53. Lifting member; 531. Ring; 532. Screw rod; 533. Fourth drive motor; 54. First air bag; 6. Blocking assembly; 61. Blocking plate; 62. Guide plate; 7. Toggle member; 71. Rotating shaft; 72. Toggle rod; 73. Third drive motor. DETAILED DESCRIPTION

[0043] The following is combined with Figure 1 -Attached Figure 10 , further details of this application are given.

[0044] The embodiment of the present application discloses a wafer cleaning and drying device.

[0045] Embodiment 1:

[0046] A wafer cleaning and drying device, referring to Figure 1 , Figure 2, including a box body 1, a placement mechanism 2 arranged in the box body 1 for placing wafers, a cleaning mechanism 3 arranged in the box body 1 for cleaning the wafers on the placement mechanism 2, a drying mechanism 4 for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism 3 and the drying mechanism 4, respectively. A flipping assembly 5 for turning the wafers over is arranged between the two placement mechanisms 2 to turn the wafers over. Among them, the control mechanism is used to control the parameters of the entire cleaning and drying process, such as cleaning time, drying temperature, etc., and usually adopts intelligent control equipment such as PLC or single-chip microcomputer to realize automatic control and precise adjustment. Since this is a prior art, it will not be elaborated here.

[0047] The top of the box 1 is provided with an opening 11 for placing wafers, and the box 1 is provided with a door 12 for opening and closing the opening 11. It should be noted that two symmetrically arranged conveyor belts may also be provided, and correspondingly, the box 1 is provided with a through slot for the conveyor belts to pass through, so as to convey the wafers to the placement mechanism 2, which is specifically provided according to the needs. The side wall of the box 1 is fixedly provided with a drain pipe 13 for discharging the water and detergent used for cleaning from the box 1.

[0048] Reference Figure 2 , Figure 3 In this embodiment, at least two placement mechanisms 2 are arranged at intervals along the height direction of the box body 1, and the two placement mechanisms 2 and the drying mechanism 4 are arranged at intervals along the height direction, wherein the placement mechanism 2 specifically includes two placement plates 21 symmetrically arranged along the height direction of the box body 1, two first driving components 22 that respectively drive the two placement plates 21 to rotate, two groups of rotating plates 23 that are respectively rotatably connected to the surfaces of the two placement plates 21 that are close to each other, and a second driving component 24 for driving the rotating plates 23 to rotate.

[0049] Reference Figure 2 , Figure 3 , Figure 4 In this embodiment, the length direction of the placement plate 21 is parallel to the width direction of the box body 1, the placement plate 21 located at the top is arranged close to the opening 11, the lower ends of the two placement plates 21 are arranged inclined in the direction of approaching each other, and the surface of the placement plate 21 is penetrated with a plurality of through holes 211 along its own length direction, so that water can flow through the placement plate 21 into the box body 1. The upper end of the placement plate 21 is rotatably connected to the box body 1, specifically, a rotating rod 212 is rotatably penetrated at the upper end of the placement plate 21, and the two ends of the rotating rod 212 are rotatably connected to the opposite side walls of the box body 1 respectively. For the rotation of the placement plate 21, the first driving component 22 is specifically a first driving motor fixedly connected to the box body 1, and the output shaft of the first driving motor is rotatably penetrated through the side wall of the box body 1 to be fixedly connected to one end of the rotating rod 212.

[0050] Reference Figure 4 ,Figure 5 Among them, a plurality of rotating plates 23 are arranged at intervals along the length direction of the placing plate 21, specifically set according to requirements. The upper surface of the rotating plate 23 protrudes from the upper surface of the placing plate 21. An adsorption port 231 is formed on the outer surface of the rotating plate 23, and a chamber 232 communicating with the adsorption port 231 is formed inside the rotating plate 23.

[0051] Refer to Figure 2 、 Figure 5 On the box body 1, a negative pressure assembly 14 is provided for making the inside of the chamber 232 in a negative pressure state. The negative pressure assembly 14 includes a connecting pipe 141 rotatably connected to the middle of the rotating plate 23 and communicating with the chamber 232, an air pump 142 communicating with the connecting pipe 141 for air supply or air extraction, and a dust-proof cover 143 covering the air pump 142. In this embodiment, the connecting pipe 141 is a corrugated hose, so as to adapt to the rotation of the placing plate 21. The connecting pipe 141 rotatably penetrates through the side wall of the box body 1 and extends to the outside of the box body 1. The air pump 142 is fixedly connected to the outside of the box body 1. The dust-proof cover 143 is provided with a plurality of filter holes for filtering the outside air. The air pump 142 is electrically connected to the control mechanism.

[0052] For the rotation of the rotating plate 23, rotating grooves 213 for the rotating connection of the rotating plate 23 are formed through the mutually approaching surfaces of the two placing plates 21. The second driving assembly 24 includes a gear ring 241 fixedly connected to the lower surface of the rotating plate 23, a gear 242 meshing with the gear ring 241, and a second driving motor 243 for driving the gear 242 to rotate. For more than three rotating plates 23 arranged on one placing plate 21, two gears 242 are provided, and the two gears 242 are respectively a driving gear and a driven gear.

[0053] Among them, the cleaning mechanism 3 is used to clean impurities and contaminants on the surface of the wafer. In this embodiment, the cleaning mechanism 3 specifically includes a spray head 31 arranged above the placing plate 21, a water supply pipe 32 connected to the spray head 31 for water supply, and a third driving assembly 33 for driving the spray head 31 to move. The water supply pipe 32 penetrates through the box body 1 and is connected to an external water source or water pipe. Since the spray head 31 and the third driving assembly 33 are both prior arts, they will not be elaborated here.

[0054] For the convenience of distinction, in this embodiment, the placement plates 21 in the two placement mechanisms 2 are respectively the first placement plate 214 and the second placement plate 215 from top to bottom along the height direction of the box body 1. Among them, the flipping assembly 5 specifically includes a cross plate 51 arranged on the first placement plate 214 and a partition strip 52 arranged between the two second placement plates 215. There are two cross plates 51, which are respectively arranged at the lower ends of the two first placement plates 214. The length direction of the cross plate 51 is parallel to the length direction of the first placement plate 214, and the two cross plates 51 are lapped. In this embodiment, abutting surfaces for abutting against the wafers sliding down from the first placement plate 214 are formed on the opposite side walls of the partition strip 52. The two ends of the partition strip 52 are respectively fixedly connected to the opposite side walls of the box body 1. The second placement plate 215 abuts against the lower surface of the partition strip 52, and the width of the partition strip 52 is smaller than the width after the two cross plates 51 are lapped.

[0055] Among them, the drying mechanism 4 is arranged below the placement mechanism 2. Before describing the drying mechanism 4, in order to reduce the possibility that the water and cleaning agent used during the cleaning mechanism 3 cleaning the wafers located on the placement mechanism 2 overflow to the drying mechanism 4, in this embodiment, a blocking assembly 6 for blocking the cleaning agent and water during the wafer cleaning by the cleaning mechanism 3 is arranged between the box body 1 and the placement mechanism 2 and the drying mechanism 4.

[0056] In this embodiment, the blocking assembly 6 is arranged on the second placement plate 215. The blocking assembly 6 includes a blocking plate 61 that can be telescoped when the second placement plate 215 rotates and two diversion plates 62 both arranged below the blocking plate 61. Among them, one end of the blocking plate 61 far from the second placement plate 215 is connected to the box body 1. The blocking plate 61 includes a plurality of interconnected folding plates, and the plurality of folding plates are connected to be in a zigzag or wavy shape, which is specifically set according to requirements. It should be noted that the folding plates are arranged below the second placement plate 215. Among them, the two diversion plates 62 are symmetrically arranged along the axis of the box body 1. The two diversion plates 62 are respectively arranged on both sides of the second placement plate 215 and are connected to the box body 1. The length direction of the diversion plate 62 is perpendicular to the length direction of the blocking plate 61, and the diversion plate 62 is inclined in a direction away from the second placement plate 215.

[0057] Among them, the drying mechanism 4 includes a conveying rack 41 arranged below the second placement plate 215, a placement rack 42 arranged on the conveying rack 41 for the wafers to be placed obliquely, and an exhaust pipe 43 for conveying gas to the second placement plate 215 to dry the wafers. In this embodiment, the length direction of the conveying rack 41 is parallel to the length direction of the box body 1. A through hole 15 for the conveying rack 41 to pass through is formed on one side wall of the box body 1, so as to convey the washed and dried wafers out of the box body 1 for collection.

[0058] Refer to Figure 6, wherein the placing rack 42 specifically includes a crossbar 421, two groups of support rods 422 arranged obliquely on both sides of the crossbar 421, and a connecting rod 423 arranged parallel to the length direction of the crossbar 421, and the length direction of the crossbar 421 is arranged parallel to the width direction of the conveying rack 41. Further, in order to reduce the possibility of inadequate drying, in this embodiment, an adsorbent 424 for absorbing moisture is provided on the placing rack 42, and the adsorbent 424 is specifically a water-absorbing sponge.

[0059] The implementation principle of a wafer cleaning and drying device in the embodiment of the present application is as follows: through the above method, compared with the cleaning and drying method in the prior art, one drying process can be reduced to improve the processing efficiency of the wafer. And because a placement plate 21 is provided, the two are arranged at an angle, after cleaning one side of the wafer, it can fall to the placement mechanism 2 below and be turned over by the flip assembly 5 to clean the other side of the wafer, thereby increasing the number of wafers cleaned to further speed up the processing efficiency of the wafer.

[0060] Embodiment 2:

[0061] Reference Figure 7 , which is different from Example 1, is that, in order to improve the drying effect of the wafers, a toggle member 7 for toggling the wafers can be provided in the box body 1. The toggle member 7 specifically includes a rotating shaft 71 rotatably connected to the box body 1, a toggle rod 72 provided on the rotating shaft 71, and a third driving motor 73 for driving the rotating shaft 71 to rotate. The toggle rod 72 can be arranged at intervals along the length direction of the rotating shaft 71. The toggle member 7 can also include two vertical rods and a connecting rod connected between the vertical rods. The connecting rod is used to toggle the wafers. The third driving motor 73 can rotate forward or reverse, so as to be adapted to the placement state of the wafer on the placement rack 42 for toggling.

[0062] Embodiment 3:

[0063] Reference Figure 8 , which is different from Example 1, is that an air hole 511 is opened on the upper surface of the horizontal plate 51 away from the first placement plate 214, a connecting cavity 512 connected to the air hole 511 is arranged in the horizontal plate 51, and a first air supply pipe 513 connected to the connecting cavity 512 for supplying or exhausting air is arranged on the horizontal plate 51.

[0064] Reference Figure 9, wherein the partition strip 52 is elastic, and the flipping assembly 5 further includes a lifting member 53 for driving the partition strip 52 to lift and lower along the height direction of the box body 1. The lifting member 53 specifically includes a collar 531 fixedly connected to the partition strip 52, a lead screw 532 coaxially passing through the collar 531, and a fourth driving motor 533 for driving the lead screw 532 to rotate. The length direction of the lead screw 532 is parallel to the height direction of the box body 1. The box body 1 protrudes with mounting plates 16 for the two ends of the lead screw 532 to be rotatably connected. The fourth driving motor 533 is fixedly connected to one of the mounting plates 16, and the output shaft of the fourth driving motor 533 rotatably passes through the mounting plate 16 to be fixedly connected to the lead screw 532. It should be noted that in order for the wafer to fall onto the lower placement rack 42 along the inclination of the second placement plate 215 after the negative pressure assembly 14 releases the fixation of the wafer, at this time, the inclination angle of the second placement plate 215 needs to be greater than the inclination angle of the first placement plate 214.

[0065] Embodiment 4:

[0066] Referring to Figure 10 , which is different from Embodiment 3 in that the flipping assembly 5 further includes a first airbag 54 provided on the cross plate 51. The first airbag 54 has a first expansion cavity, and the air hole 511 communicates with the first expansion cavity to collect the gas flowing out at the air hole 511, so as to be used to push the wafer during the reset process of the first placement plate 214 for the flipping operation. Wherein, the partition strip 52 is a second airbag, the second airbag has a second expansion cavity, the second airbag is communicated with a second air pipe for air injection or air extraction, and the second air pipe passes through the box body 1 to connect to the corresponding air pump. When the second airbag is inflated through the second air pipe, it expands in the direction close to the second placement plate 215.

[0067] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore: All equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A wafer cleaning and drying device, characterized in that: The invention comprises a box (1), a placement mechanism (2) arranged in the box (1) for placing wafers, a cleaning mechanism (3) arranged in the box (1) for cleaning the wafers on the placement mechanism (2), a drying mechanism (4) for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism (3) and the drying mechanism (4); at least two of the placement mechanisms (2) are arranged at intervals along the height direction of the box (1); the placement mechanism (2) comprises two placement plates (21) symmetrically arranged along the height direction of the box (1), two first drive components (22) respectively driving the two placement plates (21) to rotate, two groups of rotating plates (23) respectively connected to surfaces of the two placement plates (21) close to each other, and a second drive component (24) for driving the rotating plates (23) to rotate, and the lower ends of the two placement plates (21) are oriented toward each other. The rotating plate (23) is tilted in the approaching direction, the upper end of the placement plate (21) is rotatably connected to the box body (1), the first drive assembly (22) and the second drive assembly (24) are both electrically connected to the control mechanism, and a flip assembly (5) for turning the wafer is arranged between the two placement mechanisms (2); an adsorption port (231) is provided on the outer surface of the rotating plate (23), a chamber (232) connected to the adsorption port (231) is provided in the rotating plate (23), a negative pressure assembly (14) for making the chamber (232) present a negative pressure state is arranged on the rotating plate (23), and the negative pressure assembly (14) is electrically connected to the control mechanism; the drying mechanism (4) is arranged below the placement mechanism (2), and the box body (1) is provided between the placement mechanism (2) and the drying mechanism (4) with a blocking assembly (6) for blocking the cleaning agent and water used by the cleaning mechanism (3) when cleaning the wafer.

2. The wafer cleaning and drying device according to claim 1, characterized in that: The surfaces of the two placement plates (21) adjacent to each other are penetrated with a rotation groove (213) for rotationally connecting the rotating plate (23); the second driving component (24) includes a gear ring (241) fixedly connected to the lower surface of the rotating plate (23), a gear (242) meshing with the gear ring (241), and a second driving motor (243) driving the gear (242) to rotate; the negative pressure component (14) includes a connecting pipe (141) rotatably connected to the middle of the rotating plate (23) to communicate with the chamber (232) and an air pump (142) connected to the connecting pipe (141) to supply or exhaust air.

3. The wafer cleaning and drying device according to claim 1, characterized in that: The placement plates (21) in the two placement mechanisms (2) are respectively a first placement plate (214) and a second placement plate (215) from top to bottom along the height direction of the box body (1); the flip assembly (5) comprises a transverse plate (51) arranged on the first placement plate (214) and a partition bar (52) arranged between the two second placement plates (215); two transverse plates (51) are provided and are respectively arranged at the lower ends of the two first placement plates (214); the transverse plates (51) are arranged on the first placement plate (214) and the second placement plates (215) are arranged on the second placement plate (215); ) is parallel to the length direction of the first placement plate (214), and the two transverse plates (51) are overlapped; the opposite side walls of the partition bar (52) are provided with abutment surfaces for abutting against the wafers sliding down from the first placement plate (214), the two ends of the partition bar (52) are respectively connected to the opposite side walls of the box body (1), the second placement plate (215) abuts against the lower surface of the partition bar (52), and the width of the partition bar (52) is smaller than the width of the two transverse plates (51) after overlap.

4. The wafer cleaning and drying device according to claim 3, characterized in that: An air hole (511) is provided on the upper surface of the transverse plate (51) away from the first placement plate (214), a connecting cavity (512) connected to the air hole (511) is provided in the transverse plate (51), and a first air supply pipe (513) connected to the connecting cavity (512) for supplying or exhausting air is provided on the transverse plate (51).

5. The wafer cleaning and drying device according to claim 4, characterized in that: The turnover assembly (5) further comprises a first air bag (54) arranged on the transverse plate (51), the first air bag (54) having a first expansion inner cavity, and the air hole (511) being connected to the first expansion inner cavity.

6. The wafer cleaning and drying device according to claim 3, characterized in that: The partition bar (52) is elastic, and the flip assembly (5) further comprises a lifting member (53) for driving the partition bar (52) to move up and down along the height direction of the box body (1), and the inclination angle of the second placement plate (215) is greater than the inclination angle of the first placement plate (214).

7. The wafer cleaning and drying device according to claim 3, characterized in that: The partition strip (52) is a second airbag having a second expansion cavity therein. The second airbag is connected to a second air supply pipe for supplying or exhausting air. When the second airbag is inflated through the second air supply pipe, the second airbag expands in a direction close to the second placement plate (215).

8. The wafer cleaning and drying device according to claim 3, characterized in that: The blocking assembly (6) is arranged on the second placement plate (215), and the blocking assembly (6) comprises a blocking plate (61) that can be extended and retracted as the second placement plate (215) rotates, and one end of the blocking plate (61) away from the second placement plate (215) is connected to the box body (1); a plurality of through holes (211) are formed on the surface of the second placement plate (215) along its own length direction, and the through holes (211) are located above the blocking plate (61); a drainage pipe (13) for discharging cleaning water and cleaning agent from the box body (1) is fixedly formed on the side wall of the box body (1).

9. The wafer cleaning and drying device according to claim 8, characterized in that: The blocking assembly (6) further comprises two guide plates (62) both arranged below the blocking plate (61), the two guide plates (62) being symmetrically arranged along the axis of the box body (1), the two guide plates (62) being respectively arranged on both sides of the second placement plate (215) and connected to the box body (1), the length direction of the guide plates (62) being perpendicular to the length direction of the blocking plate (61), and the guide plates (62) being inclined in a direction away from the second placement plate (215); the drying mechanism (4) comprises a conveying rack (41) arranged below the second placement plate (215), a placement rack (42) arranged on the conveying rack (41) for placing wafers at an angle, and an exhaust pipe (43) for conveying gas to dry the wafers.

10. The wafer cleaning and drying device according to claim 9, characterized in that: The placement rack (42) comprises a crossbar (421), two groups of support rods (422) arranged at an angle on both sides of the crossbar (421), and a connecting rod (423) arranged parallel to the length direction of the crossbar (421); the length direction of the crossbar (421) is arranged parallel to the width direction of the conveying rack (41); and an adsorbent (424) for adsorbing moisture is arranged on the placement rack (42).

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