Compression waveguide load structure

Abstract

The invention discloses a compression waveguide load structure which comprises a shell, a supporting mechanism is installed on the shell, a first heat dissipation mechanism is installed on the supporting mechanism, a connecting mechanism is installed on the first heat dissipation mechanism, a second heat dissipation mechanism is arranged on the first heat dissipation mechanism, and a fixing mechanism is arranged on the second heat dissipation mechanism. A guide rod penetrates through a circular hole to support and limit a connecting plate, a screw rod penetrates through a through hole, a rotating ring is rotationally connected with a circular ring groove, and the screw rod also penetrates through an inner hole of the rotating ring, so that the screw rod is in threaded connection with a threaded ring, the threaded ring is rotated, the threaded ring moves along the screw rod, the threaded ring drives the rotating ring to move, the rotating ring pushes the connecting plate to move through the circular ring groove, and the connecting plate drives a first heat dissipation plate to move. Therefore, the adjusting effect of the first heat dissipation plate is achieved, the screw ring is reversely rotated, the connecting plate can be taken out from the screw rod, and the effect of conveniently installing and disassembling the first heat dissipation plate is achieved.

Description

Technical Field

[0001] The invention relates to the field of transmission equipment, in particular to a compression waveguide loading structure. Background Art

[0002] Waveguide loads are terminal devices in transmission lines, mainly used to absorb power from RF or microwave systems. Waveguide loads require small residual return loss within the operating frequency band and maximum power under the same size. Loads are mainly used for test ports of test instruments, absorption terminals of radio stations and radar stations, terminals of communication test equipment, radar transmission debugging and testing, and as equivalent antennas when debugging transmitters. The mainstream of the market is low-power loads. As the antenna arrays of radar systems increase, the system power increases, and the need for medium and high-power loads increases, and the application demand gradually increases.

[0003] Waveguide loads generally place components into a housing, use the housing to protect the main components, and then improve the heat dissipation of the housing by installing and fixing heat sinks on the housing. However, conventional heat sinks are fixed on the surface of the housing, which firstly takes up more space during transportation and handling, and secondly, the heat sink is not easily damaged. Therefore, a compressed waveguide load structure is needed to facilitate the installation and removal of the heat sink. Summary of the invention

[0004] The object of the present invention is to provide a compression waveguide loading structure to overcome the defect that the heat sink is inconvenient to install and disassemble.

[0005] The technical solution to achieve the above purpose is: a compression waveguide load structure, including a shell, a supporting mechanism installed on the shell, a first heat dissipation mechanism installed on the supporting mechanism, a connecting mechanism installed on the first heat dissipation mechanism, a second heat dissipation mechanism arranged on the first heat dissipation mechanism, and a fixing mechanism arranged on the second heat dissipation mechanism.

[0006] Preferably, the supporting mechanism includes a support plate, a screw and a guide rod, the outer side walls on both sides of the shell are connected to the support plate, the upper end of the side wall of the support plate is connected to the screw, the bottom end of the side wall of the support plate is connected to the guide rod, and the side wall at the center of the screw and the side wall at the center of the guide rod are connected to the side wall of the support plate.

[0007] Preferably, the first heat dissipation mechanism includes a connecting plate, a circular hole, a through hole, an annular groove, a first heat dissipation plate and a placement groove, the bottom end of the first heat dissipation plate is connected to two symmetrically distributed connecting plates, the upper end of the side wall of the connecting plate is provided with a through hole, the side wall of the through hole is provided with an annular groove, the bottom end of the side wall of the connecting plate is provided with a circular hole, the top end of the first heat dissipation plate is provided with two symmetrically distributed placement grooves, and the side wall of the guide rod is slidably connected to the circular hole.

[0008] Preferably, the connecting mechanism includes a screw ring and a swivel, the side wall of the annular groove is rotatably connected to the swivel, one end of the swivel is connected to the screw ring, the inner side wall of the screw ring is threadedly connected to the screw rod, the side wall of the connecting plate is in contact with the surface of the outer shell, and the bottom end of the first heat sink is in contact with the top end of the outer shell.

[0009] Preferably, the second heat dissipation mechanism includes a connecting frame, a perforation, a top plate, a second heat dissipation plate and air holes, the top ends of the two connecting frames are connected to the top plates, the side walls of the connecting frames are provided with two symmetrically distributed perforations, the top ends of the top plates are connected to a plurality of second heat dissipation plates, the plurality of second heat dissipation plates are distributed in a circular array about the center of the top plate, and the side walls of the top plate are provided with a plurality of air holes.

[0010] Preferably, the connecting frame is in a U-shape, and the side wall of the connecting frame is plug-connected with the placement groove.

[0011] Preferably, the fixing mechanism comprises slots, screw holes and screws, the top of the housing is provided with two groups of symmetrically distributed slots, the side walls of the slots are provided with screw holes, and the side walls of the screw holes are threadedly connected to the screws.

[0012] Preferably, the side wall of the slot is plugged into one end of the connecting frame, the side wall of the screw and the side wall of the guide rod are provided with straight holes, the connecting plate, the first heat sink, the connecting frame, the top plate and the second heat sink are all made of the same material, and the first heat sink is made of a thermally conductive alloy.

[0013] The beneficial effects of the present invention are:

[0014] 1) Pass the guide rod through the circular hole to support and limit the connecting plate, pass the screw through the through hole, and the swivel is rotatably connected to the circular groove, so the screw also passes through the inner hole of the swivel, so that the screw and the screw ring are threadedly connected, rotate the screw ring, the screw ring moves along the screw, the screw ring drives the swivel to move, the swivel pushes the connecting plate to move through the circular groove, and the connecting plate drives the first heat sink to move, thereby achieving the adjustment effect of the first heat sink, and the screw ring is rotated in the opposite direction to remove the connecting plate from the screw, thereby achieving the effect of convenient installation and disassembly of the first heat sink.

[0015] 2) Insert the connecting frame into the placement groove so that the connecting frame is in contact with the first heat sink, so that the heat of the first heat sink is transferred to the connecting frame, and then transferred to the top plate through the connecting frame, and finally transferred to the second heat sink. The second heat sink is distributed in a circular array so that the airflow flowing from all sides can pass through the gaps between the second heat sinks, so as to improve the heat dissipation effect of the second heat sink, thereby improving the heat dissipation effect of the shell, avoiding that the airflow in multiple directions cannot effectively flow through the gaps between adjacent first insulation plates, and using the air holes to avoid that the hot air from the first heat sink cannot be dissipated from the top in time.

[0016] 3) Insert the connecting frame into the placement slot, then insert the bottom end of the connecting frame into the slot, align the through hole with the screw hole, pass the screw through the through hole, and connect the screw with the through hole thread, so as to clamp and fix the connecting frame to achieve the fixing effect of the second heat dissipation mechanism, unscrew the screw to pull the connecting frame out of the slot and the placement slot, so as to achieve the effect of convenient disassembly of the second heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the explosion structure of the present invention;

[0020] Figure 4 It is a schematic diagram of the shell structure of the present invention;

[0021] Figure 5 is a schematic structural diagram of a first heat sink of the present invention;

[0022] Figure 6 It is a schematic diagram of the spiro ring structure of the present invention;

[0023] Figure 7 is a schematic diagram of a top view of the structure of a second heat sink of the present invention;

[0024] Figure 8 is a bottom view of the structure of the second heat sink of the present invention;

[0025] Fig. 9 It is a schematic diagram of a cross-sectional top view of the structure of the present invention;

[0026] Fig.10 It is a cross-sectional front view structural schematic diagram of the present invention;

[0027] Fig.11 yes Fig. 9 Schematic diagram of the enlarged structure at point A in the middle.

[0028] Figure Number:

[0029] 1. Shell; 2. Support mechanism; 201. Support plate; 202. Screw; 203. Guide rod; 3. First heat dissipation mechanism; 301. Connecting plate; 302. Round hole; 303. Through hole; 304. Circular groove; 305. First heat dissipation plate; 306. Placement groove; 4. Connecting mechanism; 401. Screw ring; 402. Swivel; 5. Second heat dissipation mechanism; 501. Connecting frame; 502. Perforation; 503. Top plate; 504. Second heat dissipation plate; 505. Air vent; 6. Fixing mechanism; 601. Slot; 602. Screw hole; 603. Screw; 7. Straight hole. DETAILED DESCRIPTION

[0030] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] The present invention will be further described below in conjunction with the accompanying drawings.

[0032] Reference Figure 1-11 A compression waveguide load structure includes a shell 1, a supporting mechanism 2 is installed on the shell 1, a first heat dissipation mechanism 3 is installed on the supporting mechanism 2, a connecting mechanism 4 is installed on the first heat dissipation mechanism 3, a second heat dissipation mechanism 5 is arranged on the first heat dissipation mechanism 3, and a fixing mechanism 6 is arranged on the second heat dissipation mechanism 5.

[0033] Reference Figure 2-6 and attached Fig.11 The support mechanism 2 includes a support plate 201, a screw rod 202 and a guide rod 203. The outer side walls of both sides of the housing 1 are connected to the support plates 201. The upper end of the side wall of the support plate 201 is connected to the screw rod 202. The lower end of the side wall of the support plate 201 is connected to the guide rod 203. The side wall at the center of the screw rod 202 and the side wall at the center of the guide rod 203 are connected to the side wall of the support plate 201. The first heat dissipation mechanism 3 includes a connecting plate 301, a circular hole 302, a through hole 303, an annular groove 304, a first heat sink 305 and a placement groove 306, the bottom end of the first heat sink 305 is connected to two symmetrically distributed connecting plates 301, the upper end of the side wall of the connecting plate 301 is provided with a through hole 303, the side wall of the through hole 303 is provided with a circular groove 304, the bottom end of the side wall of the connecting plate 301 is provided with a circular hole 302, the top end of the first heat sink 305 is provided with two symmetrically distributed placement grooves 306, and the side wall of the guide rod 203 is slidably connected to the circular hole 302;

[0034] The connecting mechanism 4 includes a screw ring 401 and a swivel 402. The side wall of the annular groove 304 is rotatably connected to the swivel 402. One end of the swivel 402 is connected to the screw ring 401. The inner side wall of the screw ring 401 is threadedly connected to the screw rod 202. The side wall of the connecting plate 301 is in contact with the surface of the outer shell 1, and the bottom end of the first heat dissipation plate 305 is in contact with the top end of the outer shell 1.

[0035] The guide rod 203 is passed through the circular hole 302 to support and limit the connecting plate 301, the screw 202 is passed through the through hole 303, and the swivel 402 is rotatably connected with the annular groove 304, so the screw 202 also passes through the inner hole of the swivel 402, so that the screw 202 is threadedly connected with the screw ring 401, and the screw ring 401 is rotated, and the screw ring 401 moves along the screw 202, and the screw ring 401 drives the swivel 402 to move, and the swivel 402 pushes the connecting plate 301 to move through the annular groove 304, and the connecting plate 301 drives the first heat sink 305 to move, thereby achieving the adjustment effect of the first heat sink 305, and the screw ring 401 is rotated in the opposite direction to remove the connecting plate 301 from the screw 202, so as to achieve the effect of convenient installation and removal of the first heat sink 305, and the connecting plate 301 and the first heat sink 305 are attached to the surface of the shell 1 to provide heat dissipation for the shell 1.

[0036] Reference Figure 7-10 The second heat dissipation mechanism 5 includes a connecting frame 501, a through hole 502, a top plate 503, a second heat dissipation plate 504 and a vent hole 505. The top ends of the two connecting frames 501 are connected to the top plates 503. The side walls of the connecting frames 501 are provided with two symmetrically distributed through holes 502. The top ends of the top plates 503 are connected to a plurality of second heat dissipation plates 504. The plurality of second heat dissipation plates 504 are arranged in an array around the center of the top plate 503. The side walls of the top plate 503 are provided with a plurality of vent holes 505. The connecting frame 501 is in a U-shape. The side walls of the connecting frame 501 are plug-connected with the placement groove 306.

[0037] The connecting frame 501 is inserted into the placement groove 306 so that the connecting frame 501 is in contact with the first heat sink 305, so that the heat of the first heat sink 305 is transferred to the connecting frame 501, and then transferred to the top plate 503 through the connecting frame 501, and finally transferred to the second heat sink 504. The second heat sinks 504 are distributed in a circular array so that the airflow flowing from all sides can pass through the gaps between the second heat sinks 504, so as to improve the heat dissipation effect of the second heat sink 504, thereby improving the heat dissipation effect of the housing 1, avoiding that the airflow in multiple directions cannot effectively flow through the gaps between the adjacent first heat insulation plates 305, and using the air holes 505, it can be avoided that the hot air of the first heat sink 305 cannot be dissipated from the top in time.

[0038] Reference Figure 4 and attached Fig. 9The fixing mechanism 6 includes a slot 601, a screw hole 602 and a screw 603. Two groups of symmetrically distributed slots 601 are provided at the top of the housing 1. The side walls of the slots 601 are provided with screw holes 602. The side walls of the screw holes 602 are threadedly connected to the screws 603. The side walls of the slots 601 are plug-connected to one end of the connecting frame 501. The side walls of the screw rod 202 and the side walls of the guide rod 203 are both provided with straight holes 7 to reduce the mass of the overall device. The connecting plate 301, the first heat sink 305, the connecting frame 501, the top plate 503 and the second heat sink 504 are all made of the same material, and the first heat sink 305 is made of a thermally conductive alloy.

[0039] After the connecting frame 501 is inserted into the placement slot 306, the bottom end of the connecting frame 501 is inserted into the slot 601, the through hole 502 is aligned with the screw hole 602, the screw 603 is passed through the through hole 502, and the screw 603 is threadedly connected with the through hole 502, so as to clamp and fix the connecting frame 501 to achieve the fixing effect of the second heat dissipation mechanism 5, and the screw 603 is unscrewed to realize the connection frame 501 to be pulled out from the slot 601 and the placement slot 306, so as to realize the effect of convenient disassembly of the second heat dissipation mechanism 5.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments may still be modified, or some or all of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A compression waveguide loading structure, comprising a housing (1), characterized in that: A supporting mechanism (2) is installed on the housing (1), a first heat dissipation mechanism (3) is installed on the supporting mechanism (2), a connecting mechanism (4) is installed on the first heat dissipation mechanism (3), a second heat dissipation mechanism (5) is arranged on the first heat dissipation mechanism (3), and a fixing mechanism (6) is arranged on the second heat dissipation mechanism (5).

2. A compression waveguide loading structure according to claim 1, characterized in that: The support mechanism (2) comprises a support plate (201), a screw rod (202) and a guide rod (203); the outer side walls on both sides of the housing (1) are connected to the support plates (201); the upper end of the side wall of the support plate (201) is connected to the screw rod (202); the lower end of the side wall of the support plate (201) is connected to the guide rod (203); the side wall at the center of the screw rod (202) and the side wall at the center of the guide rod (203) are both connected to the side wall of the support plate (201).

3. A compression waveguide loading structure according to claim 2, characterized in that: The first heat dissipation mechanism (3) comprises a connecting plate (301), a circular hole (302), a through hole (303), an annular groove (304), a first heat dissipation plate (305) and a placement groove (306); the bottom end of the first heat dissipation plate (305) is connected to two symmetrically distributed connecting plates (301); the upper end of the side wall of the connecting plate (301) is provided with a through hole (303); the side wall of the through hole (303) is provided with an annular groove (304); the bottom end of the side wall of the connecting plate (301) is provided with a circular hole (302); the top end of the first heat dissipation plate (305) is provided with two symmetrically distributed placement grooves (306); and the side wall of the guide rod (203) is slidably connected to the circular hole (302).

4. A compression waveguide loading structure according to claim 3, characterized in that: The connecting mechanism (4) comprises a screw ring (401) and a rotating ring (402); the side wall of the annular groove (304) is rotatably connected to the rotating ring (402); one end of the rotating ring (402) is connected to the screw ring (401); the inner side wall of the screw ring (401) is threadedly connected to the screw rod (202); the side wall of the connecting plate (301) is in contact with the surface of the outer shell (1); and the bottom end of the first heat dissipation plate (305) is in contact with the top end of the outer shell (1).

5. A compression waveguide loading structure according to claim 3, characterized in that: The second heat dissipation mechanism (5) comprises a connecting frame (501), a perforation (502), a top plate (503), a second heat dissipation plate (504) and a vent hole (505); the top ends of the two connecting frames (501) are connected to the top plates (503); the side wall of the connecting frame (501) is provided with two symmetrically distributed perforations (502); the top end of the top plate (503) is connected to a plurality of second heat dissipation plates (504); the plurality of second heat dissipation plates (504) are arranged in an array around the center of the top plate (503); and the side wall of the top plate (503) is provided with a plurality of vent holes (505).

6. A compression waveguide loading structure according to claim 5, characterized in that: The connecting frame (501) is in a U-shape, and the side wall of the connecting frame (501) is plugged and connected to the placement groove (306).

7. A compression waveguide loading structure according to claim 5, characterized in that: The fixing mechanism (6) comprises a slot (601), a screw hole (602) and a screw (603); the top of the housing (1) is provided with two groups of symmetrically distributed slots (601); the side walls of the slots (601) are provided with screw holes (602); and the side walls of the screw holes (602) are threadedly connected to the screws (603).

8. A compression waveguide loading structure according to claim 7, characterized in that: The side wall of the slot (601) is plugged and connected to one end of the connecting frame (501); the side wall of the screw rod (202) and the side wall of the guide rod (203) are both provided with straight holes (7); the connecting plate (301), the first heat sink (305), the connecting frame (501), the top plate (503) and the second heat sink (504) are all made of the same material; the first heat sink (305) is made of a thermally conductive alloy.

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