Impedance tuner and multichannel impedance tuner

Abstract

The invention discloses an impedance tuner and a multi-channel impedance tuner. The impedance tuner comprises a double-layer circuit board, a coupling metal sheet and a displacement structure, the double-layer circuit board comprises a first metal patch, a dielectric plate and a second metal patch which are stacked in sequence; the double-layer circuit board further comprises connecting metal which is arranged on the outer side of the dielectric plate and used for connecting the first metal patch and the second metal patch so as to construct a waveguide cavity. Impedance configuration structures are arranged on the first metal patch and the second metal patch, the coupling metal sheet is used for being coupled with one metal patch of the double-layer circuit board, and the displacement structure is used for adjusting the distance between the coupling metal sheet and the double-layer circuit board. The impedance point of the tuner can be dynamically adjusted through the single double-layer circuit board and the corresponding coupling metal sheet, and the tuner is simple in structure and low in cost.

Description

Technical Field

[0001] The present application belongs to the technical field of tuning circuits, and in particular, relates to an impedance tuner and a multi-channel impedance tuner. Background Art

[0002] The impedance tuner is a key component in the load-pull test topology. It is equivalent to a "sliding resistor" on the impedance complex plane, which is used to traverse different impedance points on the Smith chart. In the load-pull test, we dynamically adjust the impedance point of the impedance tuner to examine the performance of the DUT under different load conditions. However, the traditional slide screw type impedance tuner is usually large in size, high in cost, and very inconvenient to use. Summary of the invention

[0003] The purpose of the present application is to provide an impedance tuner and a multi-channel impedance tuner, aiming to solve the problem that traditional tuners are large in size and high in cost.

[0004] A first aspect of an embodiment of the present application provides an impedance tuner, comprising: a double-layer circuit board, comprising a first metal patch, a dielectric plate, and a second metal patch stacked in sequence; the double-layer circuit board also comprises a connecting metal, the connecting metal is arranged on the outer side of the dielectric plate, and is used to connect the first metal patch and the second metal patch to construct a waveguide cavity; an impedance configuration structure is provided on the first metal patch and the second metal patch; a coupling metal sheet, the coupling metal sheet is used to couple with one of the metal patches of the double-layer circuit board to configure the equivalent capacitance of the impedance tuner; a displacement structure, the coupling metal sheet is fixed to the active end of the displacement structure, and the displacement structure is used to adjust the distance between the coupling metal sheet and the double-layer circuit board.

[0005] In one embodiment, the impedance configuration structure includes a short-circuit pin connecting the first metal patch and the second metal patch.

[0006] In one embodiment, the impedance configuration structure further includes an annular opening formed on the first metal patch, and a short-circuit nail connects the circular metal sheet in the annular opening and the second metal patch.

[0007] In one embodiment, the coupling metal sheet is arranged on a side of the double-layer circuit board where the first metal patch is arranged, and is arranged parallel to the first metal patch, and the annular opening is located within the orthographic projection of the coupling metal sheet on the double-layer circuit board.

[0008] In one embodiment, the displacement structure includes a micrometer, the coupling metal sheet is fixed to a movable end of the micrometer, and the micrometer is used to control the coupling metal sheet to move in a direction perpendicular to the double-layer circuit board.

[0009] In one embodiment, an input end is provided on the first metal patch, and an output end is provided on the second metal patch. The input end and the output end are respectively arranged on two opposite sides of the double-layer circuit board. A plurality of impedance configuration structures are provided in the double-layer circuit board, and the plurality of impedance configuration structures are arranged in sequence along the direction from the input end to the output end; the impedance tuner includes a plurality of coupling metal sheets, and the impedance configuration structures correspond to the coupling metal sheets one by one, and the orthographic projection of the geometric center of the coupling metal sheet on the double-layer circuit board overlaps with the corresponding impedance configuration structure.

[0010] In one embodiment, the impedance tuner includes a first impedance configuration structure, a second impedance configuration structure, a first coupling metal sheet, a second coupling metal sheet, a first displacement structure and a second displacement structure; the first impedance configuration structure and the second impedance configuration structure are arranged in sequence along the direction from the input end to the output end; the first coupling metal sheet is arranged on the side of the double-layer circuit board where the first metal patch is arranged, and is arranged in parallel with the first metal patch, and the first impedance configuration structure is located within the orthographic projection of the first coupling metal sheet on the double-layer circuit board; the first coupling metal sheet is fixed to the active end of the first displacement structure; the second coupling metal sheet is arranged on the side of the double-layer circuit board where the second metal patch is arranged, and is arranged in parallel with the second metal patch, and the second impedance configuration structure is located within the orthographic projection of the second coupling metal sheet on the double-layer circuit board; the second coupling metal sheet is fixed to the active end of the second displacement structure.

[0011] A second aspect of an embodiment of the present application provides a multi-channel impedance tuner, comprising a plurality of impedance tuners as described above, wherein the coupling metal sheets located on the same side of the double-layer circuit board are all arranged on the same circuit board, and each of the impedance tuners shares the double-layer circuit board and the displacement structure.

[0012] In one embodiment, a first impedance tuner and a second impedance tuner are included; the first impedance tuner includes a first impedance configuration structure, a second impedance configuration structure, a first coupling metal sheet and a second coupling metal sheet, and the second impedance tuner includes a third impedance configuration structure, a fourth impedance configuration structure, a third coupling metal sheet and a fourth coupling metal sheet; wherein the first coupling metal sheet and the third coupling metal sheet are arranged on a first circuit board, and the second coupling metal sheet and the fourth coupling metal sheet are arranged on a second circuit board; the first impedance configuration structure and the second impedance configuration structure are arranged in sequence along a direction from a first input end to a first output end, and the third impedance configuration structure and the fourth impedance configuration structure are arranged in sequence along a direction from a second input end to a second output end; the first coupling metal sheet is arranged on a side of the double-layer circuit board where the first metal patch is provided, and is arranged in parallel with the first metal patch, and the first impedance configuration structure is located at the The first coupling metal sheet is within the orthographic projection of the double-layer circuit board; the second coupling metal sheet is arranged on the side of the double-layer circuit board where the second metal patch is arranged, and is arranged in parallel with the second metal patch, and the second impedance configuration structure is located within the orthographic projection of the second coupling metal sheet on the double-layer circuit board; the third coupling metal sheet is arranged on the side of the double-layer circuit board where the first metal patch is arranged, and is arranged in parallel with the first metal patch, and the third impedance configuration structure is located within the orthographic projection of the third coupling metal sheet on the double-layer circuit board; the fourth coupling metal sheet is arranged on the side of the double-layer circuit board where the second metal patch is arranged, and is arranged in parallel with the second metal patch, and the fourth impedance configuration structure is located within the orthographic projection of the fourth coupling metal sheet on the double-layer circuit board; the first circuit board is fixed to the active end of the first displacement structure; the second circuit board is fixed to the active end of the second displacement structure.

[0013] In one embodiment, the double-layer circuit board includes a plurality of electromagnetic bandgap structures, and at least one of the electromagnetic bandgap structures is disposed between signal channels of two adjacent impedance tuners.

[0014] Compared with the prior art, the embodiments of the present application have the following beneficial effects: dynamic adjustment of the impedance point of the tuner can be achieved through a single double-layer circuit board and a corresponding coupling metal sheet, and the structure is simple and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of an impedance tuner provided in one embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure of a double-layer circuit board provided in one embodiment of the present application;

[0017] Figure 3 A schematic diagram of the structure of a coupling metal sheet provided in an embodiment of the present application;

[0018] Figure 4 An equivalent circuit diagram of an impedance tuner provided in one embodiment of the present application;

[0019] Figure 5 A schematic diagram of the structure of a via provided in one embodiment of the present application;

[0020] Figure 6 Another structural schematic diagram of an impedance tuner provided in one embodiment of the present application;

[0021] Figure 7 A schematic diagram of the structure of a multi-channel impedance tuner provided in one embodiment of the present application;

[0022] Figure 8 Another structural schematic diagram of a multi-channel impedance tuner provided in one embodiment of the present application;

[0023] Fig. 9 A schematic diagram of the structure of a first circuit board and a second circuit board provided in an embodiment of the present application;

[0024] Fig.10 A schematic diagram of a pattern of a first metal patch provided in an embodiment of the present application;

[0025] Fig.11 A schematic diagram of a pattern of an EBG unit provided in an embodiment of the present application;

[0026] Fig.12 A schematic diagram of an application circuit of a multi-channel impedance tuner provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] Figure 1 A schematic diagram of the structure of an impedance tuner provided in an embodiment of the present application is shown. For the sake of convenience, only the parts related to the present embodiment are shown, which are described in detail as follows:

[0032] An impedance tuner 10 includes: a double-layer circuit board 100, a coupling metal sheet 200 and a displacement structure 300.

[0033] like Figure 2 As shown, the double-layer circuit board 100 includes a first metal patch 110, a dielectric plate 120, and a second metal patch 130 which are stacked in sequence; the double-layer circuit board 100 also includes a connecting metal, which is arranged on the outer side of the dielectric plate 120 and is used to connect the first metal patch 110 and the second metal patch 130 to construct a waveguide cavity with a high Q value; an impedance configuration structure 140 is provided on the first metal patch 110 and the second metal patch 130 between the input end and the output end of the double-layer circuit board 100; the coupling metal sheet 200 is used to couple with one of the metal patches of the double-layer circuit board 100 to configure the equivalent capacitance of the impedance tuner 10; the coupling metal sheet 200 is fixed to the active end of the displacement structure 300, and the displacement structure 300 is used to adjust the distance between the coupling metal sheet 200 and the double-layer circuit board 100. Among them, the impedance configuration structure 140 is used to configure the inductance component and the capacitance component between the input end and the output end of the double-layer circuit board 100 to obtain a basic RLC resonator. The coupling metal sheet 200 is used to flexibly adjust the capacitance parameters between the input end and the output end of the double-layer circuit board 100 .

[0034] Traditional sliding screw type impedance tuners generally rely on metal CNC processing for manufacturing, which requires the production of air-filled parallel plate transmission lines, and the introduction of screw slide structure and reflection probe structure. The overall configuration has high assembly complexity and high precision requirements.

[0035] This embodiment can realize dynamic adjustment of the impedance point of the tuner through a single double-layer circuit board 100 and a corresponding coupling metal sheet 200, and has a simple structure, a small volume and a low cost.

[0036] In one embodiment, if Figure 2 As shown, the impedance configuration structure 140 includes a shorting nail 141 connecting the first metal patch 110 and the second metal patch 130 .

[0037] The short-circuit nail 141 connects the first metal patch 110 and the second metal patch 130 , and the short-circuit nail 141 can be regarded as a grounded inductor. By adjusting parameters such as the diameter of the short-circuit nail 141 , the inductance component of the impedance tuner 10 can be adjusted.

[0038] In some embodiments, the shorting spike 141 is perpendicular to the first metal patch 110 and the second metal patch 130 .

[0039] In some embodiments, the shorting pin 141 may be replaced by a plurality of vias.

[0040] In one embodiment, if Figure 2 As shown, the impedance configuration structure 140 further includes an annular opening 142 opened on the first metal patch 110 , and the shorting nail 141 connects the circular metal sheet in the annular opening 142 and the second metal patch 130 .

[0041] The annular opening 142 may be equivalent to a capacitor, and the equivalent capacitor may be adjusted by adjusting parameters such as the width of the annular opening 142 .

[0042] Meanwhile, the double-layer circuit board 100 itself has certain dielectric loss, and a basic RLC resonator can be obtained by combining the short-circuit nail 141 and the annular opening 142 .

[0043] In one embodiment, if Figure 3 As shown, the coupling metal sheet 200 is disposed on one side of the double-layer circuit board 100 where the first metal patch 110 is disposed, and the coupling metal sheet 200 and the first metal patch 110 are parallel to each other, and the orthographic projection of the coupling metal sheet 200 on the double-layer circuit board 100 completely covers the annular opening 142. The coupling metal sheet 200 may be circular.

[0044] The coupling metal sheet 200 can be spaced a certain distance from the first metal patch 110 to form a coupling capacitor. Specifically, the coupling metal sheet 200 can be coupled with the circular metal sheet in the annular opening 142 and part of the first metal patch 110 outside the annular opening 142 to form multiple coupling capacitors, thereby adjusting the equivalent capacitance of the impedance tuner 10.

[0045] The orthographic projection of the coupling metal sheet 200 on the double-layer circuit board 100 covers the annular opening 142 , so that the coupling metal sheet 200 and the first metal patch 110 can form a sufficiently large coupling capacitance.

[0046] The equivalent circuit diagram of the impedance tuner 10 is as follows: Figure 4 As shown, the input impedance Z of the impedance tuner 10 is in The calculation formula is:

[0047]

[0048] In formula (1), R is the dielectric loss of the double-layer circuit board 100, L post is the equivalent inductance corresponding to the short-circuit nail 141, C e is the equivalent capacitance determined by the annular opening 142 and the coupling metal sheet 200. It can be understood that by adjusting the distance between the coupling metal sheet 200 and the double-layer circuit board 100 through the displacement structure 300, the equivalent capacitance can be adjusted, thereby adjusting the input impedance Z in Make adjustments.

[0049] Among them, the equivalent capacitance value C e The calculation formula for (h) is:

[0050]

[0051] In formula (2), C ring is the capacitance value of the capacitor formed by the annular opening 142, C t12 (h) is the total capacitance value of the capacitor formed by the coupling metal sheet 200, C t1 is the capacitance value of the capacitor formed by the coupling metal sheet 200 and the circular metal sheet in the annular opening 142, C t2 is the capacitance value of the capacitor formed by the coupling metal sheet 200 and the portion of the first metal patch 110 outside the annular opening 142, a is the radius of the circular metal sheet inside the annular opening 142, b is the radius of the coupling metal sheet 200, w is the width of the annular opening 142, and h is the distance between the coupling metal sheet 200 and the first metal patch 110.

[0052] In one embodiment, the displacement structure 300 includes a micrometer, and the coupling metal sheet 200 is fixed to a movable end of the micrometer. The micrometer is used to control the coupling metal sheet 200 to move in a direction perpendicular to the double-layer circuit board 100 .

[0053] The micrometer can be used to accurately control the distance between the coupling metal sheet 200 and the double-layer circuit board 100 , thereby accurately controlling the coupling capacitance formed by the coupling metal sheet 200 .

[0054] In some embodiments, the displacement structure 300 may include a motor to drive the coupled metal sheet 200 to be displaced.

[0055] In one embodiment, if Figure 5 As shown, the double-layer circuit board 100 is provided with a plurality of vias 143 connecting the first metal patch 110 and the second metal patch 130 , and the plurality of vias 143 are used to form a perfect electric wall (PEC).

[0056] The performance of the impedance tuner 10 can be adjusted according to actual needs by utilizing the enclosure effect of the ideal electric wall.

[0057] In one embodiment, if Figure 6 As shown, an input end is provided on the first metal patch 110, and an output end is provided on the second metal patch 130. The input end and the output end are respectively arranged on two opposite sides of the double-layer circuit board 100. A plurality of impedance configuration structures 140 are provided in the double-layer circuit board 100. The plurality of impedance configuration structures 140 are arranged in sequence along the direction from the input end to the output end. The impedance tuner 10 includes a plurality of coupling metal sheets 200. The impedance configuration structures 140 correspond to the coupling metal sheets 200 one by one. The orthographic projection of the geometric center of the coupling metal sheet 200 on the double-layer circuit board 100 overlaps with the corresponding impedance configuration structure 140.

[0058] By using multiple impedance configuration structures 140 and multiple coupling metal sheets 200 , multiple cascaded RLC resonators can be formed, so as to more flexibly adjust the parameters of the impedance tuner 10 .

[0059] In one embodiment, if Figure 6As shown, the impedance tuner 10 includes a first impedance configuration structure 150, a second impedance configuration structure 160, a first coupling metal sheet 210, a second coupling metal sheet 220, a first displacement structure 310 and a second displacement structure 320; the first impedance configuration structure 150 and the second impedance configuration structure 160 are arranged in sequence from the input end to the output end; the first coupling metal sheet 210 is arranged on a side of the double-layer circuit board 100 where the first metal patch 110 is arranged, and is arranged in parallel with the first metal patch 110, and the first impedance configuration structure 150 is located within the orthographic projection of the first coupling metal sheet 210 on the double-layer circuit board 100; the first coupling metal sheet 210 is fixed to the active end of the first displacement structure 310; the second coupling metal sheet 220 is arranged on a side of the double-layer circuit board 100 where the second metal patch 130 is arranged, and is arranged in parallel with the second metal patch 130, and the second impedance configuration structure 160 is located within the orthographic projection of the second coupling metal sheet 220 on the double-layer circuit board 100; the second coupling metal sheet 220 is fixed to the active end of the second displacement structure 320.

[0060] It can be understood that a cascaded first RLC resonator and a second RLC resonator can be constructed by the first impedance configuration structure 150, the second impedance configuration structure 160, the first coupling metal sheet 210, the second coupling metal sheet 220, the first displacement structure 310, and the second displacement structure 320. In this embodiment, the first coupling metal sheet 210 and the second coupling metal sheet 220 are respectively located on both sides of the double-layer circuit board 100 and are staggered, so that the first coupling metal sheet 210 and the second coupling metal sheet 220 can be prevented from interfering with each other as much as possible.

[0061] The equivalent inductance value and the equivalent capacitance value of the first RLC resonator and the second RLC resonator can be the same, so that the Q value of the first RLC resonator and the second RLC resonator are exactly the same. The first RLC resonator and the second RLC resonator can also adjust the equivalent capacitance value separately according to actual needs, so that the load point covers a certain area on the Smith chart, thereby achieving a good impedance tuning effect.

[0062] The input end and the output end may be provided with corresponding microstrip lines respectively, and the microstrip lines may be connected to corresponding radio frequency connectors, for example, may be connected to an SMA head.

[0063] By increasing the Q values ​​of the first RLC resonator and the second RLC resonator, the Smith chart coverage of the impedance tuner 10 can be made as large as possible and the coverage blind area can be made as small as possible.

[0064] When in use, the distance h2 between the first coupling metal sheet 210 and the double-layer circuit board 100 and the distance h1 between the second coupling metal sheet 220 and the double-layer circuit board 100 can be adjusted respectively, so that the impedance point can be moved along an arc in the Smith chart.

[0065] Figure 7 A schematic diagram of the structure of a multi-channel impedance tuner 20 provided in an embodiment of the present application is shown. For the sake of convenience, only the parts related to the present embodiment are shown, which are described in detail as follows:

[0066] A multi-channel impedance tuner 20 includes multiple impedance tuners 10 as described in any of the above embodiments. The coupling metal sheets 200 located on the same side of a double-layer circuit board 100 are all arranged on the same circuit board, and each impedance tuner 10 shares the double-layer circuit board 100 and the displacement structure 300.

[0067] When the coupling metal sheets 200 located on the same side of the double-layer circuit board 100 are all arranged on the same circuit board, and each impedance tuner 10 shares the double-layer circuit board 100 and the displacement structure 300, a plurality of completely identical impedance tuners 10 can be constructed, that is, a plurality of identical single-channel tuners can be obtained, and the plurality of identical single-channel tuners can be applied to the load-pull test technology to facilitate corresponding testing.

[0068] In one embodiment, if Figure 7 As shown, the multi-channel impedance tuner 20 includes a first impedance tuner 11 and a second impedance tuner 12 .

[0069] like Figure 8 , Fig. 9 and Fig.10As shown, the first impedance tuner 11 includes a first impedance configuration structure 150, a second impedance configuration structure 160, a first coupling metal sheet 210 and a second coupling metal sheet 220, and the second impedance tuner 12 includes a third impedance configuration structure 170, a fourth impedance configuration structure 180, a third coupling metal sheet 230 and a fourth coupling metal sheet 240; wherein the first coupling metal sheet 210 and the third coupling metal sheet 230 are arranged on the first circuit board 410, and the second coupling metal sheet 220 and the fourth coupling metal sheet 240 are arranged on the second circuit board 420; the first impedance configuration structure 150 and the second impedance configuration structure 160 are arranged in sequence along the direction from the first input end to the first output end, and the third impedance configuration structure 170 and the fourth impedance configuration structure 180 are arranged in sequence along the direction from the second input end to the second output end; the first coupling metal sheet 210 is arranged on one side of the double-layer circuit board 100 where the first metal patch 110 is provided, and is arranged parallel to the first metal patch 110, and the first impedance configuration structure 150 is located at the first coupling metal patch 110. The second coupling metal sheet 210 is within the orthographic projection on the double-layer circuit board 100; the second coupling metal sheet 220 is arranged on the side of the double-layer circuit board 100 where the second metal patch 130 is arranged, and is arranged in parallel with the second metal patch 130, and the second impedance configuration structure 160 is located within the orthographic projection of the second coupling metal sheet 220 on the double-layer circuit board 100; the third coupling metal sheet 230 is arranged on the side of the double-layer circuit board 100 where the first metal patch 110 is arranged, and is arranged in parallel with the first metal patch 110, and the third impedance configuration structure 170 is located within the orthographic projection of the third coupling metal sheet 230 on the double-layer circuit board 100; the fourth coupling metal sheet 240 is arranged on the side of the double-layer circuit board 100 where the second metal patch 130 is arranged, and is arranged in parallel with the second metal patch 130, and the fourth impedance configuration structure 180 is located within the orthographic projection of the fourth coupling metal sheet 240 on the double-layer circuit board 100; the first circuit board 410 is fixed to the active end of the first displacement structure 310; the second circuit board 420 is fixed to the active end of the second displacement structure 320.

[0070] It should be noted that the traditional load-pull test technology requires first establishing a mapping relationship between the tuner scale and the tuner impedance before testing. This requires repeated disassembly and assembly of the topology, and efforts must be made to maintain the consistency of the tuner scale and impedance mapping relationship in each step. This places extremely high demands on the consistency of the tuner and is time-consuming and labor-intensive.

[0071] Each displacement structure 300 of the present embodiment can adjust the equivalent capacitance in the first impedance tuner 11 and the second impedance tuner 12 at the same time. Compared with the traditional Load-pull test technology, by adjusting the distance between the coupling metal sheet 200 and the double-layer circuit board 100, the adjustment of the parameters of each impedance tuner 10 can be achieved without repeatedly disassembling and assembling the components in the circuit. At the same time, since the first coupling metal sheet 210 and the third coupling metal sheet 230 are arranged on the first circuit board 410, the second coupling metal sheet 220 and the fourth coupling metal sheet 240 are arranged on the second circuit board 420. By adjusting the first circuit board 410, the spacing between the first coupling metal sheet 210, the third coupling metal sheet 230 and the double-layer circuit board 100 can be synchronously adjusted, so that the capacitance value of the capacitor formed by the first coupling metal sheet 210, the third coupling metal sheet 230 and the double-layer circuit board 100 is consistent. Similarly, the capacitance value of the capacitor formed by the second coupling metal sheet 220, the fourth coupling metal sheet 240 and the double-layer circuit board 100 can be consistent through the second circuit board 420. The operation is simple and the threshold for use is low. Finally, the first impedance tuner 11 and the second impedance tuner 12 also have high consistency to meet the requirements of the Load-pull test technology.

[0072] Specifically, in one embodiment, the multi-channel impedance tuner 20 includes two fixed plates and a fixed bracket, the double-layer circuit board 100 is clamped and fixed between the two fixed plates by the fixed bracket, the first circuit board 410 can be fixed to one of the fixed plates by the first displacement structure 310, and the second circuit board 420 can be fixed to the other fixed plate by the second displacement structure 320, and the first circuit board 410 and the second circuit board 420 can be limited by the fixed bracket to ensure that the first circuit board 410 and the second circuit board 420 can always remain parallel to the double-layer circuit board 100.

[0073] In one embodiment, if Figure 7 , Figure 8 , Fig.10 As shown, the double-layer circuit board 100 includes a plurality of electromagnetic bandgap structures 500 (EBG), and at least one electromagnetic bandgap structure 500 is disposed between the signal channels of two adjacent impedance tuners 10 .

[0074] The electromagnetic bandgap structure 500 can reduce the energy coupling between the two impedance tuners 10 and avoid mutual interference between the two impedance tuners 10 , thereby further reducing the size of the multi-channel impedance tuner 20 .

[0075] In one embodiment, the double-layer circuit board 100, the first circuit board 410 and the second circuit board 420 are all PCB boards with a size of 110 mm×40 mm×1.6 mm, and from top to bottom along the z-axis direction they are the first circuit board 410, the double-layer circuit board 100 and the second circuit board 420 respectively.

[0076] like Fig.10 As shown, the first metal patch 110 and the second metal patch 130 are both provided with an EBG structure composed of 25 (5×5) EBG units, and the patterns of the first metal patch 110 and the second metal patch 130 present a mirror image characteristic with respect to the XoZ plane, and the patterns of the first circuit board 410 and the second circuit board 420 present a mirror image characteristic with respect to the XoZ plane. Thus, the impedances of the first impedance tuner 11 and the second impedance tuner 12 are always kept the same.

[0077] At the same time, if Fig.10 As shown, taking the first metal patch 110 as an example, a feeding structure 610 in the form of a coplanar waveguide (CPW) is further provided on the first metal patch 110. The feeding structure 610 can be provided at the input end or the output end, and is used to transmit the RF signal from the corresponding adapter 620 to the channel in the multi-channel impedance tuner, or to transmit the RF signal in the channel to the corresponding adapter 620. Specifically, the adapter 620 can be an SMA adapter.

[0078] For example, Fig.11 As shown, a single EBG unit 510 is rectangular, and each side of the rectangle is provided with two strip-shaped gaps perpendicular to the corresponding sides, so that the EBG unit 510 forms five square patches and one cross-shaped patch 520, and the EBG unit 510 is centrally symmetrical. By adjusting the width of the strip-shaped gap and the size of the cross-shaped patch 520, the working frequency band of the EBG unit 510 can be adjusted according to actual needs, so that the EBG unit 510 isolates the signal in the multi-channel impedance tuner 20.

[0079] Among them, the five square patches include a first square metal sheet 511, a second square metal sheet 512, a third square metal sheet 513, a fourth square metal sheet 514 and a fifth square metal sheet 515. The first square metal sheet 511 is arranged at the center of the EBG unit 510, and the two diagonals of the first square metal sheet 511 coincide with the two diagonals of the EBG unit 510. The second square metal sheet 512, the third square metal sheet 513, the fourth square metal sheet 514 and the fifth square metal sheet 515 are respectively arranged on the four corners of the EBG unit 510, and one diagonal of the second square metal sheet 512, the third square metal sheet 513, the fourth square metal sheet 514 and the fifth square metal sheet 515 coincides with the diagonal of the EBG unit 510.

[0080] Specifically, Fig.12 As shown, when a Load-pull test is performed, the first input terminal is connected to the first test device 30, the first output terminal is connected to the matching load, the second input terminal is connected to the output terminal of the chip to be tested 40, and the second output terminal is connected to the second test device 50. Since the impedances of the two impedance tuners 10 remain the same at all times, the coupling capacitor formed by the coupling metal sheet 200 can be adjusted to test the chip to be tested 40 under different impedance states, thereby obtaining the Load-pull diagram of the chip to be tested under different impedance conditions without repeatedly disassembling circuits and devices.

[0081] The traditional load-pull test technology will reduce the impedance coverage of the chip 40 to be tested due to the introduction of the coupler and has high performance requirements for the first test device 30, requiring a specific high-performance series of first test devices 30. However, the impedance adjustment range of the multi-channel impedance tuner 20 of this embodiment is larger and can be used with any first test device 30.

[0082] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0083] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0084] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An impedance tuner, characterized in that: include: A double-layer circuit board comprises a first metal patch, a dielectric plate and a second metal patch which are stacked in sequence; the double-layer circuit board further comprises a connecting metal which is arranged on the outer side of the dielectric plate and is used to connect the first metal patch and the second metal patch to construct a waveguide cavity; the first metal patch and the second metal patch are provided with an impedance configuration structure; A coupling metal sheet, the coupling metal sheet being used to couple with one of the metal patches of the double-layer circuit board to configure an equivalent capacitance of the impedance tuner; A displacement structure, wherein the coupling metal sheet is fixed at the movable end of the displacement structure, and the displacement structure is used to adjust the distance between the coupling metal sheet and the double-layer circuit board.

2. The impedance tuner according to claim 1, wherein: The impedance configuration structure includes a shorting spike connecting the first metal patch and the second metal patch.

3. The impedance tuner according to claim 2, wherein: The impedance configuration structure further includes an annular opening formed on the first metal patch, and a short-circuit nail connects the circular metal sheet in the annular opening and the second metal patch.

4. The impedance tuner according to claim 3, characterized in that The coupling metal sheet is arranged on one side of the double-layer circuit board where the first metal patch is arranged, and is arranged parallel to the first metal patch. The annular opening is located within the orthographic projection of the coupling metal sheet on the double-layer circuit board.

5. The impedance tuner according to claim 1, wherein: The displacement structure comprises a micrometer, the coupling metal sheet is fixed at the movable end of the micrometer, and the micrometer is used to control the coupling metal sheet to move in a direction perpendicular to the double-layer circuit board.

6. The impedance tuner according to any one of claims 1 to 5, characterized in that: The first metal patch is provided with an input end, and the second metal patch is provided with an output end, and the input end and the output end are respectively arranged on two opposite sides of the double-layer circuit board, and a plurality of impedance configuration structures are provided in the double-layer circuit board, and the plurality of impedance configuration structures are arranged in sequence along the direction from the input end to the output end; the impedance tuner includes a plurality of coupling metal sheets, and the impedance configuration structures correspond to the coupling metal sheets one by one, and the orthographic projection of the geometric center of the coupling metal sheet on the double-layer circuit board overlaps with the corresponding impedance configuration structure.

7. The impedance tuner according to claim 6, wherein: The impedance tuner comprises a first impedance configuration structure, a second impedance configuration structure, a first coupling metal sheet, a second coupling metal sheet, a first displacement structure and a second displacement structure; The first impedance configuration structure and the second impedance configuration structure are arranged in sequence along a direction from the input end to the output end; The first coupling metal sheet is arranged on a side of the double-layer circuit board where the first metal patch is arranged, and is arranged in parallel with the first metal patch; the first impedance configuration structure is located within the orthographic projection of the first coupling metal sheet on the double-layer circuit board; the first coupling metal sheet is fixed to the movable end of the first displacement structure; The second coupling metal sheet is arranged on a side of the double-layer circuit board where the second metal patch is arranged, and is arranged parallel to the second metal patch. The second impedance configuration structure is located within the orthographic projection of the second coupling metal sheet on the double-layer circuit board. The second coupling metal sheet is fixed to the movable end of the second displacement structure.

8. A multi-channel impedance tuner, characterized in that: It comprises a plurality of impedance tuners as claimed in any one of claims 1 to 7, wherein the coupling metal sheets located on the same side of the double-layer circuit board are all arranged on the same circuit board, and each of the impedance tuners shares the double-layer circuit board and the displacement structure.

9. The multi-channel impedance tuner according to claim 8, characterized in that: including a first impedance tuner and a second impedance tuner; The first impedance tuner includes a first impedance configuration structure, a second impedance configuration structure, a first coupling metal sheet and a second coupling metal sheet, and the second impedance tuner includes a third impedance configuration structure, a fourth impedance configuration structure, a third coupling metal sheet and a fourth coupling metal sheet; wherein the first coupling metal sheet and the third coupling metal sheet are arranged on a first circuit board, and the second coupling metal sheet and the fourth coupling metal sheet are arranged on a second circuit board; The first impedance configuration structure and the second impedance configuration structure are arranged in sequence along a direction from the first input end to the first output end, and the third impedance configuration structure and the fourth impedance configuration structure are arranged in sequence along a direction from the second input end to the second output end; The first coupling metal sheet is arranged on a side of the double-layer circuit board where the first metal patch is arranged, and is arranged in parallel with the first metal patch, and the first impedance configuration structure is located within the orthographic projection of the first coupling metal sheet on the double-layer circuit board; The second coupling metal sheet is arranged on a side of the double-layer circuit board where the second metal patch is arranged, and is arranged in parallel with the second metal patch, and the second impedance configuration structure is located within the orthographic projection of the second coupling metal sheet on the double-layer circuit board; The third coupling metal sheet is arranged on a side of the double-layer circuit board where the first metal patch is arranged, and is arranged in parallel with the first metal patch, and the third impedance configuration structure is located within the orthographic projection of the third coupling metal sheet on the double-layer circuit board; The fourth coupling metal sheet is arranged on a side of the double-layer circuit board where the second metal patch is arranged, and is arranged in parallel with the second metal patch, and the fourth impedance configuration structure is located within the orthographic projection of the fourth coupling metal sheet on the double-layer circuit board; The first circuit board is fixed to the movable end of the first displacement structure; the second circuit board is fixed to the movable end of the second displacement structure.

10. The multi-channel impedance tuner according to claim 8, characterized in that: The double-layer circuit board includes a plurality of electromagnetic bandgap structures, and at least one of the electromagnetic bandgap structures is arranged between the signal channels of two adjacent impedance tuners.

Images