Waterproof microphone and electronic equipment

Abstract

The invention provides a waterproof microphone and electronic equipment, and the waterproof microphone comprises a substrate, a sound hole disposed on the substrate, and a housing which forms a packaging structure with the substrate. An airtight waterproof module is arranged at the sound hole; wherein the waterproof module is fixed at the sound hole through a bearing plate; an air leakage channel is arranged in the bearing plate; one end of the air leakage channel is communicated with the outer side of the substrate, and the other end of the air leakage channel is communicated with the sound hole. According to the invention, the mounting of the waterproof module can be simplified, and an airtight waterproof module can be adopted to realize a deepwater waterproof effect.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic products, and more specifically, to a waterproof microphone and electronic equipment. Background Art

[0002] MEMS stands for Micro-Electro-Mechanical System in English and its Chinese name is micro-electromechanical system. It refers to high-tech devices with a size of several millimeters or even smaller. Its internal structure is generally in the micrometer or even nanometer level. It is an independent intelligent system. MEMS technology has been widely used in electronics, medicine, industry, automobile and aerospace systems due to its advantages of miniaturization, intelligence, high integration and mass production.

[0003] In electronic products, MEMS microphones have become the first choice for mid-to-high-end portable smart electronic devices. In order to meet the increasingly high performance requirements of electronic products, microphones are usually required to have waterproof and dustproof functions, and have high performance, lightweight, and high reliability in harsh environments.

[0004] However, the existing MEMS microphone waterproof and dustproof solution is usually to directly stick a waterproof film on the sound hole of the microphone. This solution not only leads to poor consistency of the waterproof film, but the pressure and temperature of the chip and shell during the mounting process will also have a certain impact on the waterproof film, resulting in poor waterproof performance of the microphone and unable to meet deep water waterproof requirements. Summary of the invention

[0005] In view of the above problems, the purpose of the present invention is to provide a waterproof microphone and device to solve the problem that the waterproof membrane of the existing microphone waterproof solution has poor consistency, resulting in the waterproof performance being affected and unable to meet the deep water level waterproof requirements.

[0006] The waterproof microphone provided by the present invention includes a substrate, a sound hole arranged on the substrate, and a shell forming a packaging structure with the substrate; an airtight waterproof module is arranged at the sound hole; wherein the waterproof module is fixed at the sound hole through a supporting plate; and an air leakage channel is arranged inside the supporting plate; one end of the air leakage channel is connected to the outer side of the substrate, and the other end of the air leakage channel is connected to the sound hole.

[0007] In addition, an optional technical solution is that an embedding groove adapted to the waterproof module is provided on a side of the substrate away from the housing; the waterproof module is embedded and fixed in the embedding groove to seal and waterproof the sound hole.

[0008] In addition, an optional technical solution is that a waterproof groove is provided on the bearing plate, and the waterproof module is limited and fixed in the waterproof groove.

[0009] In addition, an optional technical solution is that the waterproof module includes a support base arranged in the waterproof groove and a waterproof membrane arranged on the support base; wherein the waterproof membrane and the support base are an integrally formed structure.

[0010] In addition, an optional technical solution is that the depth of the embedding groove is not less than the thickness of the bearing plate; and the depth of the waterproof groove is not less than the thickness of the supporting base.

[0011] In addition, an optional technical solution is that the air leakage channel is distributed in a spiral shape in the supporting plate.

[0012] In addition, an optional technical solution is that when the waterproof membrane is a rectangular structure, the aspect ratio of the waterproof membrane is less than 1.5.

[0013] In addition, an optional technical solution is that the bearing plate is a circular structure or a polygonal structure; the waterproof groove is a circular or polygonal structure.

[0014] In addition, an optional technical solution is to further include a MEMS chip and an ASIC chip which are arranged on the substrate and are conductively connected to each other; wherein the ASIC chip is conductively connected to the substrate.

[0015] Corresponding to the above-mentioned waterproof microphone, the present invention further provides an electronic device, comprising the above-mentioned waterproof microphone.

[0016] By utilizing the above-mentioned waterproof microphone and electronic device, the waterproof module is installed as a whole through a carrier board, which not only simplifies the separate mounting process of the waterproof membrane, but also avoids the influence of pressure and temperature on the waterproof membrane during the mounting process of the microphone chip and the housing. Furthermore, through the setting of the air discharge channel of the carrier board, the application of an airtight waterproof module on the microphone can be realized, thereby achieving a higher level of waterproofing.

[0017] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0019] Figure 1 is a schematic structural diagram of a waterproof microphone according to an embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of the structure of a load-bearing plate according to an embodiment of the present invention;

[0021] Figure 3 is a cross-sectional view of a carrying plate according to an embodiment of the present invention.

[0022] The reference numerals include: substrate 1 , housing 2 , MEMS chip 3 , ASIC chip 4 , acoustic hole 5 , welding ring 6 , carrier plate 7 , air leakage channel 71 , inner opening 72 , outer opening 73 , waterproof membrane 8 .

[0023] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0024] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0025] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0027] In order to solve the problem that the waterproof film installation consistency of the existing microphone waterproof solution is poor, which affects the waterproof performance and cannot meet the deep water level waterproof requirements, the present invention provides a waterproof microphone and an electronic device, wherein an embedding groove is arranged on a substrate, and the waterproof module is directly arranged in the embedding groove after forming an integral structure. This can not only simplify the separate mounting process of the waterproof membrane, but also avoid the influence of pressure and temperature on the waterproof membrane during the mounting process of the microphone chip and the housing, thereby achieving a higher level of waterproofing.

[0028] In order to describe the waterproof microphone and the electronic device in the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] Figure 1 shows a schematic structure of a waterproof microphone according to an embodiment of the present invention; Figure 2 and Figure 3 The schematic structure of the carrying plate according to the embodiment of the present invention is shown from different angles respectively.

[0030] like Figures 1 to 3 As shown together, the waterproof microphone implemented in the present invention includes: a substrate 1, a sound hole 5 arranged on the substrate 1, and a shell 2 forming a packaging structure with the substrate 1, and the shell 2 and the substrate 1 can be soft-welded by using a welding ring 6; an airtight waterproof module is arranged at the sound hole 5, and the water module is fixed at the sound hole 5 through a supporting plate 7; and an air leakage channel 71 is arranged inside the supporting plate 7; one end of the air leakage channel 71 is connected to the outer side of the substrate 1, and the other end of the air leakage channel 71 is connected to the sound hole 5, thereby realizing the application of the airtight waterproof module in the microphone through the air leakage channel 71.

[0031] Among them, an embedding groove adapted to the waterproof module is provided on the side of the substrate 1 away from the shell 2. During the assembly process of the waterproof microphone, the waterproof module is directly embedded and fixed in the corresponding embedding groove as a whole to seal the sound hole 5 for waterproofing.

[0032] Among them, a waterproof groove is arranged on the carrier plate 7, and the waterproof module includes a supporting base and a waterproof membrane 8 arranged on the supporting base; wherein, the carrier plate 7 can be made of a metal plate, and during the packaging process of the waterproof membrane 8, the waterproof module can be first mounted in the waterproof groove of the carrier plate 7, so that the waterproof membrane can be avoided in the waterproof groove, and then after the chip and the shell 2 of the microphone are packaged, the carrier plate 7 and the waterproof module are regarded as a whole to avoid the pressure and temperature during the mounting process of the chip and the shell 2 affecting the waterproof membrane 8, thereby simplifying the mounting operation of the waterproof membrane 8 and improving the consistency of the product.

[0033] In order to achieve deep water waterproof effect and avoid affecting the waterproof performance due to setting microholes on the waterproof membrane 8, the waterproof membrane 8 of the embodiment of the present invention adopts an airtight waterproof membrane. The waterproof membrane 8 and the supporting base are an integrally formed structure. Its materials include but are not limited to PPS, PI and silicone rubber, etc., and the size of the waterproof membrane 8 is larger than the size of the sound hole 5, so as to achieve deep water level waterproof. At the same time, the integrally formed waterproof module has good compliance and vibration characteristics, so that the sound signal can pass smoothly and be transmitted to the two ends of the chip where the sound hole is located, thereby reducing the sound loss (which can be less than 2dB).

[0034] In a specific embodiment of the present invention, the depth of the embedding groove provided on the substrate 1 is not less than the thickness of the supporting plate 7. Similarly, the depth of the waterproof groove provided on the supporting plate 7 is not less than the thickness of the supporting base, so that the waterproof module can be avoided inside the substrate 1 to prevent the waterproof module from being worn during the pasting, transfer or use of the waterproof microphone.

[0035] Furthermore, in order to achieve the balance of air pressure inside and outside the waterproof microphone, the carrier plate 7 can be set as a hollow frame structure (such as Figure 2 As shown), an air leakage channel 71 is arranged around the carrier plate 7 inside the carrier plate 7, wherein one end of the air leakage channel 71 (inner opening 72) is connected to the outer side of the substrate 1, and the other end of the air leakage channel 71 (outer opening 73) is connected to the sound hole 5, so that the two openings of the air leakage channel 71 are respectively located on both sides of the waterproof module, thereby achieving air pressure balance inside and outside the microphone.

[0036] Among them, since there is a certain height difference between the two sides of the waterproof module (in the direction perpendicular to the substrate), the air leakage channel 71 can be distributed in a spiral shape inside the supporting plate 7, and is set in the supporting plate 7 by various methods such as etching, so that the air leakage channel 71 can conduct the air pressure on both sides of the waterproof module. In addition, the air leakage channel 71 is arranged around the supporting plate 7, and can also realize a path with large acoustic impedance, avoid acoustic short circuit phenomenon, and can quickly achieve pressure equalization without sound leakage.

[0037] It should be noted that the bearing plate 7 in the embodiment of the present invention can be set to a circular structure or a rectangular or other polygonal structure. Similarly, the waterproof groove can also be set to a circular or multi-deformed structure, and is not limited to the specific structure shown in the drawings. Among them, when the waterproof module adopts a rectangular structure, the aspect ratio of the waterproof module is set to be less than 1.5, which can effectively reduce the high-frequency split vibration of the waterproof module, thereby obtaining better acoustic performance.

[0038] In another specific embodiment of the present invention, the waterproof microphone also includes a MEMS chip 3 and an ASIC chip 4 which are arranged on a substrate 1 and are conductive with each other, wherein the ASIC chip 4 is connected and conductive with the substrate 1, the MEMS chip 3 is mainly used to sense external signals and convert the sensed external analog signals into electrical signals, and the ASIC chip 4 is mainly used to perform signal modulation such as filtering on the electrical signals transmitted by the MEMS, and convert the modulated signals into digital signals in a fixed format and then transmit them to the external circuit for analysis and processing.

[0039] Corresponding to the above waterproof microphone, the present invention further provides an electronic device, comprising the above waterproof microphone. It should be noted that the embodiments of the above electronic device can refer to the description of the above waterproof microphone embodiment, which will not be described one by one here.

[0040] According to the waterproof microphone and electronic device of the present invention, an embedding groove is provided on the substrate, and a waterproof module covering the sound hole is directly provided in the embedding groove. The waterproof module is installed as a whole, which can not only simplify the separate mounting process of the waterproof membrane, but also avoid the influence of pressure and temperature on the waterproof membrane during the mounting process of the microphone chip and the shell; in addition, an air discharge channel is provided in the supporting plate of the waterproof module, which can realize a large sound resistance channel. Without affecting the waterproof effect, the air pressure inside and outside the microphone is balanced, thereby avoiding the occurrence of acoustic short circuit and achieving a high level of microphone waterproof effect.

[0041] The waterproof microphone and the electronic device according to the present invention are described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the waterproof microphone and the electronic device proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A waterproof microphone, comprising a substrate, a sound hole arranged on the substrate, and a shell forming a packaging structure with the substrate; characterized in that: An airtight waterproof module is provided at the sound hole; wherein, The waterproof module is fixed to the sound hole through a bearing plate; and an air leakage channel is provided inside the bearing plate; One end of the air leakage channel is communicated with the outer side of the substrate, and the other end of the air leakage channel is communicated with the sound hole.

2. The waterproof microphone according to claim 1, characterized in that: An embedding groove matched with the waterproof module is arranged on a side of the substrate away from the shell; the waterproof module is embedded and fixed in the embedding groove to seal and waterproof the sound hole.

3. The waterproof microphone according to claim 2, characterized in that: A waterproof groove is arranged on the carrying plate, and the waterproof module is limited and fixed in the waterproof groove.

4. The waterproof microphone according to claim 3, characterized in that: The waterproof module includes a support base arranged in the waterproof groove and a waterproof membrane arranged on the support base; wherein, The waterproof membrane and the supporting base are an integrally formed structure.

5. The waterproof microphone according to claim 4, characterized in that: The depth of the embedding groove is not less than the thickness of the bearing plate; The depth of the waterproof groove is not less than the thickness of the support base.

6. The waterproof microphone according to claim 1, characterized in that: The air leakage channel is distributed in a spiral shape in the bearing plate.

7. The waterproof microphone according to claim 4, characterized in that: When the waterproof membrane is a rectangular structure, the aspect ratio of the waterproof membrane is less than 1.

5.

8. The waterproof microphone according to claim 3, characterized in that: The bearing plate is a circular structure or a polygonal structure; The waterproof groove is a circular structure or a polygonal structure.

9. The waterproof microphone according to claim 1, characterized in that: It also includes a MEMS chip and an ASIC chip which are arranged on the substrate and are connected to each other; wherein, The ASIC chip is electrically connected to the substrate.

10. An electronic device, characterized in that: Comprising the waterproof microphone according to any one of claims 1 to 9.

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