Preparation method of thick copper circuit board and circuit board
By pre-etching the circuit grooves on the semi-cured sheet and filling them with copper slurry, the problem of difficult to prepare circuit boards in combination with high thickness and small spacing in the prior art is solved, and the effect of efficient preparation of thick copper circuit boards is achieved.
CN119697891APending Publication Date: 2025-03-25AKM ELECTRONICS INDAL PANYU
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Patent Information
- Application Number
- CN202411618473.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
It is difficult to effectively prepare circuit boards with copper thickness or above in the prior art, especially when circuit etching is performed on the copper layer, and it is difficult to achieve the combination of small pitch and high thickness.
Method used
Thick copper circuit boards were prepared by pre-etching the circuit grooves on the semi-cured sheet and filling and covering with copper slurry to form a first copper layer, followed by line etching and post-treatment.
Benefits of technology
It realizes the preparation of high-thickness thick copper circuit boards under small spacing, which improves the production capacity and finished product quality.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN119697891A_ABST
Abstract
The invention provides a preparation method of a thick copper circuit board and a circuit board. The preparation method comprises the following steps: S1, providing an insulating plate and a prepreg; s2, the prepreg is arranged on the surface of the insulating plate in a stacked mode, and then the prepreg is pressed on the insulating plate in a fit mode; s3, a circuit groove is manufactured on the prepreg, and the shape of the circuit groove corresponds to the shape of the circuit pattern; s4, the prepreg is treated with copper paste, so that the circuit groove is filled with a copper material, a copper surface is formed on the prepreg, and a circuit substrate is obtained; and S5, carrying out circuit etching on the copper layer of the prepreg to obtain a thick copper circuit pattern, and then carrying out post-processing to obtain the thick copper circuit board.
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