Substrate for manufacturing capacitor element and method for manufacturing capacitor element

Abstract

A substrate (1) for manufacturing a capacitor element is provided with: a substrate layer (10) which is divided into a product region (R1) constituting a capacitor element and an outer product region (R2) surrounding at least a portion of the product region (R1); and a sealing layer (20) provided so as to cover at least one main surface of the substrate layer (10). The product region (R1) includes: an anode plate (11) having a porous portion (11B) on at least one main surface of a core portion (11A); a dielectric layer (13) provided on the surface of the porous part (11B); and a cathode layer (12) provided on the surface of the dielectric layer (13). The product outer region (R2) includes a core portion (11A) of the anode plate (11). A through portion (30) penetrating through the anode plate (11) in the thickness direction is provided in at least a portion of a region located at the outer edge of the substrate layer (10) in the product outer region (R2). At least a portion of the through portion (30) is filled with a filling member (40).

Description

Technical Field

[0001] The present invention relates to a substrate for manufacturing a capacitor element and a method for manufacturing a capacitor element. Background Art

[0002] Patent document 1 discloses a module used in a semiconductor composite device that supplies a DC voltage regulated by a voltage regulator including a semiconductor active element to a load, and includes: a capacitor layer including at least one capacitor portion that forms a capacitor; a connecting terminal for electrically connecting to at least one of the voltage regulator and the load; and a through-hole conductor formed in a manner penetrating the capacitor portion in a thickness direction of the capacitor layer, and the capacitor is electrically connected to at least one of the load and the voltage regulator via the through-hole conductor.

[0003] In Patent Document 1 Fig.17 19 discloses a package substrate 200D including a capacitor layer 210, a first through-hole conductor 262A, and a second through-hole conductor 264A as an embodiment of a module. The capacitor layer 210 includes: a capacitor portion 230; a conductive portion 220 electrically connected to the first through-hole conductor 262A; a conductive portion 240 electrically connected to the second through-hole conductor 264A; and an insulating portion 225 stacked on the surface of the capacitor portion 230.

[0004] According to Patent Document 1, the capacitor layer 210 is formed by the following method.

[0005] First, both surfaces of the aluminum foil to be the anode plate 231 are processed into a porous shape, and a porous portion 234 is formed on the surface of the core portion 232. A dielectric layer is formed by applying an oxide film on the surface of the porous portion 234. Then, a cathode layer 236 is formed on the surface of the dielectric layer.

[0006] At this time, a part of the porous portion 234 may be cut by, for example, a dicing process until the core portion 232 is exposed, and the Cu paste may be attached to the exposed core portion 232. Thus, the capacitor portion 230 is formed.

[0007] Thereafter, through holes are formed in portions where through-hole conductors are to be formed by drilling, laser processing, or the like.

[0008] Next, a resin such as epoxy, polyimide or phenolic resin, or a mixed material of epoxy, polyimide or phenolic resin and an inorganic filler such as silica or alumina is laminated on the capacitor portion 230 and then thermally cured to seal the capacitor portion 230 and form the insulating portion 225. After the sealing process, the conductive layer 212 for forming the conductive portions 220 and 240 for connecting the through-hole conductors and the electrodes of the capacitor portion 230 is formed on the surface of the insulating portion 225 by plating wiring process or the like. In addition, through holes may be formed after the sealing process.

[0009] After that, the conductive layer 212 is processed by etching or the like to form the conductive parts 220 and 240. Then, holes are opened in the conductive parts 220 and 240 to reach the core part 232 of the anode plate 231 and the cathode layer 236 by laser processing or the like, and a conductor such as Cu is filled therein, so that the core part 232 of the anode plate 231 is electrically connected to the conductive part 220, and the cathode layer 236 is electrically connected to the conductive part 240. Thus, the capacitor layer 210 is formed. In addition, the core part 232 of the anode plate 231 may be directly connected to the through-hole conductor 262 at the end face of the anode plate 231. In this case, it is not necessary to form the conductive part 220.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: International Publication No. 2021 / 241325 Summary of the invention

[0013] Problem that the invention aims to solve

[0014] In the semi-finished stage of manufacturing a module such as the package substrate described in Patent Document 1, in the product outer region where the cathode layer is not formed, the tight fit between the insulating portion (hereinafter, also referred to as the sealing layer) and the anode plate or between the insulating portion and the conductive portion (hereinafter, also referred to as the external electrode layer) is lower than that in the product region. In addition, in the case where the insulating portion is composed of two or more layers, the tight fit between the insulating portions in the product outer region is also lower than that in the product region. Therefore, in the product outer region, bulging caused by delamination (interlayer peeling) is likely to occur, and depending on the situation, the bulging may develop to the product region.

[0015] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a substrate for manufacturing a capacitor element that can suppress swelling caused by delamination. Another object of the present invention is to provide a method for manufacturing a capacitor element using the substrate for manufacturing a capacitor element.

[0016] Solutions for solving problems

[0017] The substrate for manufacturing a capacitor element of the present invention includes: a substrate layer, which is divided into a product area constituting a capacitor element and an outer product area surrounding at least part of the product area; and a sealing layer, which is arranged in a manner covering at least one main surface of the substrate layer. The product area includes: an anode plate having a porous portion on at least one main surface of the core; a dielectric layer, which is arranged on the surface of the porous portion; and a cathode layer, which is arranged on the surface of the dielectric layer. The outer product area includes the core of the anode plate. At least part of the area located at the outer edge of the substrate layer in the outer product area is provided with a through portion that penetrates the anode plate in the thickness direction. At least part of the through portion is filled with a filling member. .

[0018] The method for manufacturing a capacitor element of the present invention includes the step of separating a product region by removing at least a part of a non-product region from the substrate for manufacturing a capacitor element of the present invention.

[0019] Effects of the Invention

[0020] According to the present invention, it is possible to provide a substrate for manufacturing a capacitor element that can suppress swelling caused by delamination. According to the present invention, it is also possible to provide a method for manufacturing a capacitor element using the substrate for manufacturing a capacitor element. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is an exploded perspective view schematically showing an example of the substrate for manufacturing a capacitor element according to the first embodiment of the present invention.

[0022] Figure 2 yes Figure 1 A top view of a substrate for manufacturing a capacitor element is shown.

[0023] Figure 3 It is a cross-sectional view schematically showing an example of the capacitor element manufacturing substrate according to the first embodiment of the present invention.

[0024] Figure 4 A is a plan view schematically showing an example of the arrangement of the through-portions in the product outer region. Figure 4 B is a cross-sectional view schematically showing an example of the arrangement of the through-portions in the product outer region.

[0025] Figure 5 A is a plan view schematically showing another example of the arrangement of the through-portions in the product outer region. Figure 5 B is a cross-sectional view schematically showing another example of the arrangement of the through-portions in the product outer region.

[0026] Figure 6 A is a cross-sectional view schematically showing an example of a process of separating the product region R1 from the capacitor element manufacturing substrate 1 . Figure 6 B is a plan view schematically showing an example of a process of separating the product region R1 from the capacitor element manufacturing substrate 1 .

[0027] Figure 7 A is a cross-sectional view schematically showing an example of a capacitor element obtained from the capacitor element manufacturing substrate 1 . Figure 7 B is a plan view schematically showing an example of a capacitor element obtained from the capacitor element manufacturing substrate 1 .

[0028] Figure 8 It is schematically indicated Figure 3 2 is a cross-sectional view of a first modified example of the capacitor element manufacturing substrate 1 shown.

[0029] Fig. 9 It is schematically indicated Figure 3 2 is a cross-sectional view of a second modified example of the capacitor element manufacturing substrate 1 shown.

[0030] Fig.10 It is a cross-sectional view schematically showing an example of a capacitor element manufacturing substrate according to a second embodiment of the present invention.

[0031] Fig.11 It is a cross-sectional view schematically showing another example of the capacitor element manufacturing substrate according to the second embodiment of the present invention.

[0032] Fig.12 It is schematically indicated Fig.10 2 is a cross-sectional view of a modified example of the capacitor element manufacturing substrate 2 shown.

[0033] Fig.13 It is schematically indicated Fig.11 2 is a cross-sectional view of a modified example of a capacitor element manufacturing substrate 2 ′.

[0034] Fig.14 It is a cross-sectional view schematically showing an example of a capacitor element manufacturing substrate according to a third embodiment of the present invention.

[0035] Fig.15 It is a cross-sectional view schematically showing another example of the capacitor element manufacturing substrate according to the third embodiment of the present invention.

[0036] Fig.16 It is schematically indicated Fig.14 2 is a cross-sectional view of a modified example of the capacitor element manufacturing substrate 3 shown.

[0037] Fig.17 It is schematically indicated Fig.15 2 is a cross-sectional view of a modified example of a capacitor element manufacturing substrate 3 ′. DETAILED DESCRIPTION

[0038] The following is an explanation of the substrate for manufacturing a capacitor element of the present invention. In addition, the present invention is not limited to the following structure, and can be appropriately changed within the scope of not changing the gist of the present invention. In addition, a structure formed by combining a plurality of the preferred structures described below is also the present invention.

[0039] The embodiments shown below are examples, and it is self-evident that parts of the structures shown in different embodiments can be replaced or combined. After the second embodiment, the description of matters common to the first embodiment is omitted, and the differences are mainly described. In particular, the same effects produced by the same structure are not mentioned in sequence in each embodiment.

[0040] In the following description, when there is no particular distinction between the embodiments, the substrate will be simply referred to as "the substrate for manufacturing a capacitor element of the present invention."

[0041] In this specification, terms indicating the relationship between elements (such as "vertical", "parallel", "orthogonal", etc.) and terms indicating the shape of an element do not express only strict meanings, but rather express substantially equivalent ranges, for example, also including differences of several percentages.

[0042] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, etc. may differ from those of actual products. The same reference numerals are used for the same or equivalent parts in the drawings. In addition, in each figure, the same reference numerals are marked for the same elements and repeated descriptions are omitted.

[0043] [First embodiment]

[0044] Figure 1 It is an exploded perspective view schematically showing an example of the substrate for manufacturing a capacitor element according to the first embodiment of the present invention. Figure 2 yes Figure 1 A top view of a substrate for manufacturing a capacitor element is shown. Figure 1 and Figure 2 In the figure, for convenience of description, a first external electrode layer 91 and a second external electrode layer 92 to be described later are omitted.

[0045] Figure 1 and Figure 2 The illustrated capacitor element manufacturing substrate 1 includes a substrate layer 10 and a sealing layer 20 provided so as to cover at least one main surface of the substrate layer 10 .

[0046] exist Figure 1 In the example shown, the sealing layer 20 is provided so as to cover two main surfaces facing each other in the thickness direction of the substrate layer 10. The substrate layer 10 is protected by the sealing layer 20.

[0047] The sealing layer 20 may be composed of only one layer or two or more layers on one main surface side of the substrate layer 10. When the sealing layer 20 is composed of two or more layers, the materials constituting the layers may be the same or different.

[0048] The sealing layer 20 is formed so as to seal the substrate layer 10 by, for example, a method of thermocompression bonding an insulating resin sheet or a method of applying an insulating resin paste and then thermally curing the paste.

[0049] like Figure 1 and Figure 2 As shown, the substrate layer 10 is divided into a product region R1 and an outer product region R2 surrounding at least a portion of the product region R1 .

[0050] The capacitor element manufacturing substrate 1 is a semi-finished product. As described later, by separating the product region R1 from the capacitor element manufacturing substrate 1, a capacitor element (for example, Figure 7 A and Figure 7 The capacitor element 100 is shown in B).

[0051] Product region R1 is a region constituting a capacitor element as a final product (finished product). The number of product regions R1 included in substrate layer 10 is not particularly limited, and may be one or more.

[0052] When the substrate layer 10 includes a plurality of product regions R1, the product regions R1 may be arranged regularly or irregularly. The sizes and planar shapes of the product regions R1 may be the same or may be partially or completely different.

[0053] exist Figure 1 and Figure 2 Although not shown, one or more capacitor units are arranged in each product region R1. The number of capacitor units arranged in each product region R1 may be the same, or may be partially or completely different.

[0054] When a plurality of capacitor units are arranged in the product region R1, the capacitor units may be arranged regularly or irregularly. The size and planar shape of the capacitor units may be the same or partially or completely different. Preferably, the capacitor units have the same structure, but may also include capacitor units with different structures.

[0055] exist Figure 1 and Figure 2In the example shown, the product outer region R2 is set in a manner that surrounds the entire product region R1. For example, when the planar shape of the product region R1 is a rectangle (i.e., a square or a rectangle), the product outer region R2 can be set in a manner that surrounds two opposite sides of the product region R1, or in an L-shaped manner that surrounds two adjacent sides of the product region R1, or in a frame-shaped manner that surrounds the four sides of the product region R1.

[0056] Figure 3 1 is a cross-sectional view schematically showing an example of a substrate for manufacturing a capacitor element according to the first embodiment of the present invention. Figure 3 yes Figure 2 A cross-sectional view taken along line III-III of a substrate for manufacturing a capacitor element is shown.

[0057] The product region R1 includes: an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A; a dielectric layer 13 provided on the surface of the porous portion 11B; and a cathode layer 12 provided on the surface of the dielectric layer 13. Thus, the product region R1 constitutes an electrolytic capacitor. Figure 3 In the example shown, the anode plate 11 has the porous portion 11B on both main surfaces of the core portion 11A, but the porous portion 11B may be formed on only one main surface of the core portion 11A.

[0058] In product region R1 , anode plate 11 , dielectric layer 13 , and cathode layer 12 constitute a capacitor unit.

[0059] Cathode layer 12 includes, for example, solid electrolyte layer 12A provided on the surface of dielectric layer 13. Preferably, cathode layer 12 further includes conductor layer 12B provided on the surface of solid electrolyte layer 12A. When cathode layer 12 includes solid electrolyte layer 12A, product region R1 constitutes a solid electrolytic capacitor.

[0060] The product outer region R2 includes the core 11A of the anode plate 11. Figure 3 As shown, the product outer region R2 may include the anode plate 11 having the porous portion 11B on at least one main surface of the core portion 11A, or may further include the dielectric layer 13 provided on the surface of the porous portion 11B.

[0061] The product-outside region R2 is a region that does not function as the final product, namely the capacitor element, or is not used as the final product, namely the capacitor element. In the final product, namely the capacitor element, the product-outside region R2 may be completely removed or partially retained.

[0062] In order to function as a capacitor element, the anode needs to be connected to the core 11A of the anode plate 11 and the cathode needs to be connected to the cathode layer 12. Therefore, the area where the anode is not connected to the core 11A of the anode plate 11 or the area where the cathode is not connected to the cathode layer 12 corresponds to the product outer area R2 that does not function as a capacitor element.

[0063] For example, even if there is a region where a through-hole conductor electrically connected to the anode plate 11 is provided, the region that does not function as a capacitor element in the final product corresponds to the product-outside region R2. In addition, in the stage of the semi-finished product, that is, the capacitor element manufacturing substrate 1, even if there is a region where a through-hole conductor electrically connected to the anode plate 11 and a through-hole conductor electrically connected to the cathode layer 12 are provided, the region to be removed until it becomes the final product also corresponds to the product-outside region R2.

[0064] A through portion 30 penetrating the anode plate 11 in the thickness direction is provided in at least a portion of the area located at the outer edge of the substrate layer 10 in the product outer region R2. The number of through portions 30 is not particularly limited, and may be one or more. The product outer region R2 provided with the through portion 30 only needs to include at least a portion of the area located at the outer edge of the substrate layer 10. Therefore, the through portion 30 may be provided in a portion of the area located at the outer edge of the substrate layer 10, or the through portion 30 may be provided in the entire area located at the outer edge of the substrate layer 10.

[0065] The through portion 30 may be a hole that penetrates the anode plate 11 in the thickness direction or a groove that disconnects the anode plate 11 in the thickness direction. When a plurality of through portions 30 are provided in the product outer region R2, the through portions 30 may be a mixture of holes that penetrate the anode plate 11 in the thickness direction and grooves that disconnect the anode plate 11 in the thickness direction.

[0066] The width of the through portion 30 may be constant in the thickness direction, may decrease in the thickness direction, or may increase in the thickness direction. In addition, the width of the through portion 30 may be smaller at the center side than at the two main surface sides of the anode plate 11, or may be larger at the center side than at the two main surface sides of the anode plate 11.

[0067] At least a portion of the through portion 30 is filled with the filling member 40. Figure 3 In the example shown, the entire through portion 30 is filled with the filling member 40, but a portion of the through portion 30 may be filled with the filling member 40. For example, a gap may exist in the space surrounded by the filling member 40 in the through portion 30, or a gap may exist between the through portion 30 and the filling member.

[0068] exist Figure 3In the example shown, the filling member 40 includes an insulating member. For example, the insulating member includes the sealing layer 20 that penetrates into the through-portion 30. The sealing layer 20 only needs to penetrate into at least a portion of the through-portion 30, but may penetrate into the entire through-portion 30.

[0069] like Figure 3 As shown, preferably, the filling member 40 is in contact with the sealing layer 20 on at least one main surface side of the substrate layer 10, and preferably, the filling member 40 is in contact with the sealing layer 20 on both main surface sides of the substrate layer 10. As described above, the filling member 40 can be integrated with the sealing layer 20 on at least one main surface side of the substrate layer 10, and can also be integrated with the sealing layer 20 on both main surface sides of the substrate layer 10.

[0070] By providing the through-portion 30 at least partially in the area located at the outer edge of the substrate layer 10 in the product outer region R2, and filling at least partially in the through-portion 30 with the filling member 40, the close contact between the sealing layer 20 and the anode plate 11 in the product outer region R2 can be improved. Therefore, the bulging caused by delamination in the product outer region R2 can be suppressed. Thus, the bulging in the product region R1 can also be suppressed.

[0071] Although not shown, the through portion 30 may be provided at least partially in a region between adjacent product regions R1 in the product non-region R2 . In this case, it is preferable that at least a portion of the through portion 30 is filled with the filling member 40 .

[0072] When a plurality of through-portions 30 are provided in the product outside region R2 , the through-portions 30 that are not filled with the filling member 40 may be included.

[0073] It can also be, Figure 3 As shown, in the product outer region R2, a virtual electrode layer 50 is provided on the surface of the sealing layer 20. In this case, for the product outer region R2, either one virtual electrode layer 50 or multiple virtual electrode layers 50 may be provided. The virtual electrode layer 50 may be provided on the surface of the sealing layer 20 on both main surface sides or on the surface of the sealing layer 20 on any one main surface side. The virtual electrode layer 50 may also extend to the product region R1. In addition, in the product outer region R2, the virtual electrode layer 50 may not be provided on the surface of the sealing layer 20. The virtual electrode layer 50 is an example of a virtual layer. The virtual layer may be a conductive layer like an electrode layer or an insulating layer like an insulating layer.

[0074] When a dummy layer such as a dummy electrode layer 50 is provided in the product outer region R2, it is preferred that at least one end of the through-hole 30 is covered by the dummy layer. Figure 3In the illustrated example, both end portions of the through-hole 30 are covered by the dummy electrode layer 50 , but only one end portion of the through-hole 30 may be covered by the dummy electrode layer 50 .

[0075] It is preferable that the structure of the dummy electrode layer 50 is common to the first external electrode layer 91 and the second external electrode layer 92 described later.

[0076] The following reference Figure 3 An example of the structure of the product region R1 will be described.

[0077] In the product region R1, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, the insulating layer 15 may be provided between the sealing layer 20 and the anode plate 11 on any one of the main surfaces, or between the sealing layer 20 and the anode plate 11 on both main surfaces.

[0078] The insulating layer 15 may be composed of only one layer or may be composed of two or more layers. When the insulating layer 15 is composed of two or more layers, the materials constituting the respective layers may be the same or different.

[0079] exist Figure 3 In the example shown, the insulating layer 15 includes a first insulating layer 15A provided on the surface of the dielectric layer 13 and a second insulating layer 15B provided on the surface of the first insulating layer 15A. The thickness of the first insulating layer 15A may be the same as the thickness of the second insulating layer 15B, may be larger than the thickness of the second insulating layer 15B, or may be smaller than the thickness of the second insulating layer 15B.

[0080] The product region R1 may include a first through-hole conductor 61 which is provided so as to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the anode plate 11 .

[0081] The first through-hole conductor 61 only needs to be provided on the inner wall surface of the first through-hole 71 that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction. The first through-hole conductor 61 may be provided only on the inner wall surface of the first through-hole 71 or throughout the first through-hole 71.

[0082] When viewed in plan from the thickness direction, one first through-hole conductor 61 may be provided inside the cathode layer 12 included in each capacitor portion, or two or more first through-hole conductors 61 may be provided.

[0083] Preferably, if Figure 3 As shown, an insulating material (in Figure 3 In the middle is the insulating layer 15) for insulation.

[0084] Preferably, if Figure 3 As shown, the first through-hole conductor 61 is electrically connected to the anode plate 11 at the inner wall surface of the first through-hole 71 .

[0085] like Figure 3 As shown in the figure, in the case where the first through-hole conductor 61 is provided only on the inner wall surface of the first through-hole 71, a first resin filling portion 81 filled with a resin material may be provided inside the first through-hole conductor 61. The first resin filling portion 81 is provided in the space surrounded by the first through-hole conductor 61 in the first through-hole 71. If the space in the first through-hole 71 is eliminated by providing the first resin filling portion 81, the occurrence of delamination of the first through-hole conductor 61 is suppressed. In addition, the first resin filling portion 81 may be either a conductor or an insulator.

[0086] The product region R1 may include the second through-hole conductor 62 which is provided so as to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the cathode layer 12 .

[0087] Second through-hole conductor 62 may be provided at least on the inner wall surface of second through-hole 72 penetrating anode plate 11 and sealing layer 20 in the thickness direction. Second through-hole conductor 62 may be provided only on the inner wall surface of second through-hole 72 or throughout the entire interior of second through-hole 72.

[0088] When viewed from the thickness direction, one or more second through-hole conductors 62 may be provided inside the cathode layer 12 included in each capacitor portion. For one capacitor portion, the number of second through-hole conductors 62 and the number of first through-hole conductors 61 may be the same or different.

[0089] Preferably, if Figure 3 As shown, an insulating material (in Figure 3 The sealing layer 20 is partially insulated.

[0090] like Figure 3 As shown in the figure, in the case where the second through-hole conductor 62 is provided only on the inner wall surface of the second through-hole 72, a second resin filling portion 82 filled with a resin material may be provided inside the second through-hole conductor 62. The second resin filling portion 82 is provided in the space surrounded by the second through-hole conductor 62 in the second through-hole 72. If the space in the second through-hole 72 is eliminated by providing the second resin filling portion 82, the delamination of the second through-hole conductor 62 is suppressed. In addition, the second resin filling portion 82 may be either a conductor or an insulator.

[0091] When the first through-hole conductor 61 or the second through-hole conductor 62 is provided inside the sealing layer 20 , it is preferable to provide the insulating layer 15 around the first through-hole conductor 61 or the second through-hole conductor 62 on at least one main surface of the anode plate 11 .

[0092] In addition, an insulating layer 15 may be provided on at least one main surface of the anode plate 11 so as to surround the cathode layer 12. By surrounding the cathode layer 12 with the insulating layer 15, insulation between the anode plate 11 and the cathode layer 12 is ensured, and a short circuit between the two is prevented. The insulating layer 15 may be provided so as to surround a portion of the cathode layer 12, but is preferably provided so as to surround the entire cathode layer 12.

[0093] exist Figure 3 Although not shown, the product region R1 may include a third through-hole conductor which is provided to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is not electrically connected to the anode plate 11 and the cathode layer 12 .

[0094] The product region R1 may include a first external electrode layer 91 provided on the surface of the sealing layer 20 and electrically connected to the anode plate 11 and the first through-hole conductor 61. The first external electrode layer 91 may extend to the non-product region R2.

[0095] For one capacitor portion, one first external electrode layer 91 may be provided, or a plurality of first external electrode layers 91 may be provided.

[0096] The planar shape of the first external electrode layer 91 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or rectangular), a quadrilateral other than a rectangle, a triangle, a pentagon, a hexagon or other polygon, a circle, an ellipse, a shape formed by combining these shapes, etc. In addition, the planar shape of the first external electrode layer 91 may also be an L-shape, a C-shape (Japanese コ-shape), a step shape, etc.

[0097] The product region R1 may include a second external electrode layer 92 provided on the surface of the sealing layer 20 and electrically connected to the cathode layer 12 and the second through-hole conductor 62. The second external electrode layer 92 may extend to the non-product region R2.

[0098] One capacitor section may include one second external electrode layer 92 or a plurality of second external electrode layers 92. The number of second external electrode layers 92 and the number of first external electrode layers 91 may be the same or different for one capacitor section.

[0099] The planar shape of the second external electrode layer 92 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or rectangular), a quadrilateral other than a rectangle, a triangle, a pentagon, a hexagon, a polygon, a circle, an ellipse, a shape formed by combining these shapes, etc. In addition, the planar shape of the second external electrode layer 92 may also be an L-shape, a C-shape (Japanese コ-shape), a step shape, etc. The planar shape of the second external electrode layer 92 when viewed from the thickness direction may be the same as or different from the planar shape of the first external electrode layer 91 when viewed from the thickness direction.

[0100] exist Figure 3 Although not shown, product region ( R1 ) may include a via conductor provided so as to penetrate sealing layer 20 in the thickness direction.

[0101] For example, product region R1 may include a via conductor electrically connected to anode plate 11. In this case, anode plate 11 is electrically led out to the outside of sealing layer 20 via the via conductor and can be electrically connected to the outside of sealing layer 20. The number of via conductors electrically connected to anode plate 11 may be one or more.

[0102] Alternatively, product region R1 may include a via conductor electrically connected to cathode layer 12. In this case, cathode layer 12 is electrically led out to the outside of sealing layer 20 via the via conductor and can be electrically connected to the outside of sealing layer 20. The number of via conductors electrically connected to cathode layer 12 may be one or more.

[0103] Figure 4 A is a plan view schematically showing an example of the arrangement of the through-portions in the product outer region. Figure 4 B is a cross-sectional view schematically showing an example of the configuration of the through-portion in the product outer region. Figure 4 The A is along Figure 4 Top view of line AA of B.

[0104] Preferably, if Figure 4 A and Figure 4 As shown in B, in the product outer area R2 (refer to Figure 3 In the embodiment of the present invention, at least three through-holes 30 are arranged at equal intervals. The term "equal intervals" as used herein does not have a strict meaning, but indicates a substantially equal range, and includes, for example, a difference of several percentages.

[0105] By arranging at least three through-portions 30 at equal intervals, local stress concentration is prevented, thereby suppressing delamination. In addition, as long as at least three through-portions 30 are arranged at equal intervals, through-portions 30 having different intervals may be included.

[0106] The distance between the through-holes 30 arranged at equal intervals (in Figure 4 The length indicated by the arrow in A is not particularly limited, but is preferably less than 1 mm. On the other hand, the distance between the through-holes 30 arranged at equal intervals is, for example, more than 0.1 mm.

[0107] Figure 5 A is a plan view schematically showing another example of the arrangement of the through-portions in the product outer region. Figure 5 B is a cross-sectional view schematically showing another example of the configuration of the through-portion in the product outer region. Figure 5 The A is along Figure 5 Top view of line AA of B.

[0108] Preferably, if Figure 5 A and Figure 5 As shown in B, in the product outer area R2 (refer to Figure 3 In the embodiment of the present invention, at least three through-portions 30 are arranged at equal intervals, and at least two of the through-portions 30 arranged at equal intervals have the same planar shape when viewed from the thickness direction. In particular, it is preferred that all of the through-portions 30 arranged at equal intervals have the same planar shape. The term "same planar shape" as used herein does not mean a strict expression, but means a substantially equal range, and includes, for example, an expression of a difference of several percentages.

[0109] Hereinafter, an example of a method for manufacturing a capacitor element using the capacitor element manufacturing substrate 1 will be described. Thus, a method for manufacturing a capacitor element using the capacitor element manufacturing substrate of the present invention is also one of the present invention.

[0110] Figure 6 A is a cross-sectional view schematically showing an example of a process of separating the product region R1 from the capacitor element manufacturing substrate 1 . Figure 6 B is a plan view schematically showing an example of a process of separating the product region R1 from the capacitor element manufacturing substrate 1 .

[0111] like Figure 6 A and Figure 6 As shown in FIG. 1B, the product area R1 is separated by removing the product area R2 from the capacitor element manufacturing substrate 1. For example, the capacitor element manufacturing substrate 1 may be cut at the position of the cutting line CL1 to remove the entire product area R2. Alternatively, the capacitor element manufacturing substrate 1 may be cut at the position of the cutting line CL1a to remove a portion of the product area R2.

[0112] Figure 7A is a cross-sectional view schematically showing an example of a capacitor element obtained from the capacitor element manufacturing substrate 1 . Figure 7 B is a plan view schematically showing an example of a capacitor element obtained from the capacitor element manufacturing substrate 1 .

[0113] For example, in Figure 6 A and Figure 6 In B, when the capacitor element manufacturing substrate 1 is cut at the position of the cutting line CL1, the Figure 7 A and Figure 7 The capacitor element 100 is shown in B.

[0114] Figure 8 It is schematically indicated Figure 3 2 is a cross-sectional view of a first modified example of the capacitor element manufacturing substrate 1 shown.

[0115] exist Figure 8 In the illustrated capacitor element manufacturing substrate 1A, the sealing layer 20 includes a first sealing layer 21 provided to cover at least one main surface of the substrate layer 10 , and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0116] exist Figure 8 In the example shown, the filling member 40 includes an insulating member. For example, the insulating member includes the second sealing layer 22 that enters the through-portion 30. The second sealing layer 22 only needs to enter at least a portion of the through-portion 30, and may enter the entire through-portion 30.

[0117] Fig. 9 It is schematically indicated Figure 3 2 is a cross-sectional view of a second modified example of the capacitor element manufacturing substrate 1 shown.

[0118] exist Fig. 9 In the illustrated capacitor element manufacturing substrate 1B, the sealing layer 20 includes a first sealing layer 21 provided to cover at least one main surface of the substrate layer 10 , and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0119] exist Fig. 9 In the example shown, the filling member 40 includes an insulating member. For example, the insulating member includes the first sealing layer 21 that enters the through-portion 30. The first sealing layer 21 only needs to enter at least a portion of the through-portion 30, and may enter the entire through-portion 30.

[0120] like Figure 8 or Fig. 9As shown, when the sealing layer 20 is composed of two or more layers, by filling at least a portion of the through-portion 30 with the filling member 40, the close contact between the first sealing layer 21 and the second sealing layer 22 in the product outer region R2 can be improved. Therefore, it is possible to suppress bulging caused by delamination in the product outer region R2. Thus, it is also possible to suppress bulging in the product region R1.

[0121] [Second embodiment]

[0122] In the capacitor element manufacturing substrate according to the second embodiment of the present invention, the filling member includes a conductive member.

[0123] Fig.10 It is a cross-sectional view schematically showing an example of a capacitor element manufacturing substrate according to a second embodiment of the present invention.

[0124] exist Fig.10 In the illustrated capacitor element manufacturing substrate 2 , the filling member 40 includes a conductive member 41 .

[0125] exist Fig.10 In the example shown, the conductive member 41 only needs to be provided on the inner wall surface of the through portion 30. The conductive member 41 may be provided only on the inner wall surface of the through portion 30 or may be provided throughout the interior of the through portion 30.

[0126] It can also be, Fig.10 As shown, the conductive member 41 is in contact with the anode plate 11 at the inner wall surface of the through portion 30 .

[0127] like Fig.10 As shown in the figure, when the conductive member 41 is provided only on the inner wall surface of the through-portion 30, a resin filling portion 45 filled with a resin material may be provided inside the conductive member 41. The resin filling portion 45 is provided in the space surrounded by the conductive member 41 in the through-portion 30. If the space in the through-portion 30 is eliminated by providing the resin filling portion 45, the occurrence of delamination of the conductive member 41 is suppressed. In addition, the resin filling portion 45 may be either a conductor or an insulator.

[0128] Preferably, the structure of the conductive member 41 is common to the first through-hole conductor 61 and the second through-hole conductor 62 .

[0129] In the product outer region R2 , a dummy electrode layer 50 may be provided on the surface of the sealing layer 20 .

[0130] When a dummy layer such as a dummy electrode layer 50 is provided in the product outer region R2, it is preferred that at least one end of the through-hole 30 is covered by the dummy layer. Fig.10In the illustrated example, both end portions of the through-hole 30 are covered by the dummy electrode layer 50 , but only one end portion of the through-hole 30 may be covered by the dummy electrode layer 50 .

[0131] In particular, it is preferred that Fig.10 As shown, the conductive member 41 included in the filling member 40 is connected to the dummy electrode layer 50. In this case, delamination is further suppressed.

[0132] Fig.11 It is a cross-sectional view schematically showing another example of the capacitor element manufacturing substrate according to the second embodiment of the present invention.

[0133] exist Fig.11 In the capacitor element manufacturing substrate 2' shown, the filling member 40 further includes an insulating member 42 located outside the conductive member 41. In this way, the filling member 40 may be composed of two or more layers from the inner wall surface of the through portion 30 toward the inner side.

[0134] exist Fig.11 In the example shown, the insulating member 42 includes the sealing layer 20 penetrating into the through portion 30. The sealing layer 20 only needs to penetrate at least part of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0135] like Fig.11 As shown, preferably, the insulating member 42 is in contact with the sealing layer 20 on at least one main surface side of the substrate layer 10, and preferably, the insulating member 42 is in contact with the sealing layer 20 on both main surface sides of the substrate layer 10. As described above, the insulating member 42 may be integral with the sealing layer 20 on at least one main surface side of the substrate layer 10, or may be integral with the sealing layer 20 on both main surface sides of the substrate layer 10.

[0136] exist Fig.11 In the capacitor element manufacturing substrate 2' shown in FIG. 1 , the filling member 40 includes the insulating member 42, and thus Fig.10 Compared with the capacitor element manufacturing substrate 2 shown, delamination is further suppressed.

[0137] Fig.12 It is schematically indicated Fig.10 2 is a cross-sectional view of a modified example of the capacitor element manufacturing substrate 2 shown.

[0138] It can also be, Fig.12 As shown in the capacitor element manufacturing substrate 2A, the sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of the substrate layer 10 , and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0139] Fig.13 It is schematically indicated Fig.11 2 is a cross-sectional view of a modified example of a capacitor element manufacturing substrate 2 ′.

[0140] It can also be, Fig.13 As shown in the capacitor element manufacturing substrate 2B, the sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of the substrate layer 10 , and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0141] exist Fig.13 In the example shown, the insulating member 42 includes the first sealing layer 21 penetrating into the through portion 30. The first sealing layer 21 only needs to penetrate at least part of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0142] [Third Embodiment]

[0143] In the capacitor element manufacturing substrate of the third embodiment of the present invention, the product outer region includes: an anode plate having a porous portion on at least one main surface of the core; a dielectric layer provided on the surface of the porous portion; and a cathode layer provided on the surface of the dielectric layer.

[0144] Fig.14 It is a cross-sectional view schematically showing an example of a capacitor element manufacturing substrate according to a third embodiment of the present invention.

[0145] exist Fig.14 In the capacitor element manufacturing substrate 3 shown, the product outer region R2 includes: an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A; a dielectric layer 13 provided on the surface of the porous portion 11B; and a cathode layer 12 provided on the surface of the dielectric layer 13.

[0146] Preferably, the structure of the cathode layer 12 provided in the product outer region R2 is common to that of the cathode layer 12 provided in the product region R1.

[0147] Alternatively, in the product outer region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, it is preferred that the through portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 and the anode plate 11 on any one of the main surfaces, or between the sealing layer 20 and the anode plate 11 on both main surfaces.

[0148] The insulating layer 15 may be composed of only one layer or may be composed of two or more layers. When the insulating layer 15 is composed of two or more layers, the materials constituting the respective layers may be the same or different.

[0149] exist Fig.14 In the example shown, the insulating layer 15 includes a first insulating layer 15A provided on the surface of the dielectric layer 13 and a second insulating layer 15B provided on the surface of the first insulating layer 15A. The thickness of the first insulating layer 15A may be the same as the thickness of the second insulating layer 15B, may be larger than the thickness of the second insulating layer 15B, or may be smaller than the thickness of the second insulating layer 15B.

[0150] Preferably, the insulating layer 15 in the product outer region R2 is provided around the penetration portion 30. Alternatively, the insulating layer 15 may be provided so as to surround the cathode layer 12 in the product outer region R2.

[0151] Preferably, the structure of the insulating layer 15 provided in the product outer region R2 is common to the insulating layer 15 provided in the product region R1. In addition, the insulating layer 15 may be provided only in the product outer region R2 without providing the insulating layer 15 in the product region R1. The structure of the insulating layer 15 provided in the product outer region R2 may be in contact with the insulating layer 15 provided in the product region R1 or may be separated from the insulating layer 15 provided in the product region R1.

[0152] Other structures and Fig.10 The structure of the capacitor element manufacturing substrate 2 shown is common.

[0153] like Fig.14 As shown, by setting the product outer region R2 to have a common structure with the product region R1, the difference in thickness of the sealing layer 20 between the product region R1 and the product outer region R2 is reduced. Therefore, the generation of stress caused by the undulation of the substrate is suppressed. In addition, by filling at least a part of the through portion 30 with the filling member 40, bulging caused by delamination in the product outer region R2 can be suppressed.

[0154] Fig.15 It is a cross-sectional view schematically showing another example of the capacitor element manufacturing substrate according to the third embodiment of the present invention.

[0155] exist Fig.15 In the capacitor element manufacturing substrate 3' shown in FIG. Fig.14 Similarly to the capacitor element manufacturing substrate 3 shown, the product outer region R2 includes: an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A; a dielectric layer 13 disposed on the surface of the porous portion 11B; and a cathode layer 12 disposed on the surface of the dielectric layer 13.

[0156] Alternatively, in the product outer region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, it is preferred that the through portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 and the anode plate 11 on any one of the main surfaces, or between the sealing layer 20 and the anode plate 11 on both main surfaces.

[0157] Other structures and Fig.11 The same is true for the capacitor element manufacturing substrate 2' shown.

[0158] Fig.16 It is schematically indicated Fig.14 2 is a cross-sectional view of a modified example of the capacitor element manufacturing substrate 3 shown.

[0159] It can also be, Fig.16 As shown in the capacitor element manufacturing substrate 3A, the sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of the substrate layer 10 and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0160] Fig.17 It is schematically indicated Fig.15 2 is a cross-sectional view of a modified example of a capacitor element manufacturing substrate 3 ′.

[0161] It can also be, Fig.17 As shown in the capacitor element manufacturing substrate 3B, the sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of the substrate layer 10 , and a second sealing layer 22 provided on the surface of the first sealing layer 21 .

[0162] exist Fig.17 In the example shown, the insulating member 42 includes the first sealing layer 21 penetrating into the through portion 30. The first sealing layer 21 only needs to penetrate at least part of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0163] [Other embodiments]

[0164] The capacitor element manufacturing substrate of the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the present invention regarding the structure of the product region and the non-product region, manufacturing conditions, and the like.

[0165] For example, in the first or second embodiment of the present invention, an insulating layer may be provided between the anode plate and the sealing layer in the product outer region, similarly to the third embodiment. In this case, it is preferred that the through portion penetrates the anode plate and the insulating layer in the thickness direction.

[0166] Preferably, the insulating layer in the product outer region is provided around the penetration portion. Alternatively, the insulating layer may be provided in the product outer region so as to surround the cathode layer.

[0167] In the substrate for manufacturing a capacitor element of the present invention, when a plurality of through-portions are provided in the product outer region, the through-portions filled with the filling members described in different embodiments may be mixed.

[0168] The following describes the detailed structure of the capacitor section included in the product area.

[0169] As the plane shape of the capacitor portion when viewed from the thickness direction, for example, a rectangle (square or rectangular), a quadrilateral other than a rectangle, a triangle, a pentagon, a hexagon or other polygon, a circle, an ellipse, a shape formed by combining these shapes, etc. In addition, the plane shape of the capacitor portion may also be an L-shape, a C-shape (Japanese コ-shape), a step shape, etc.

[0170] Preferably, the anode plate 11 is formed of a so-called valve metal that exhibits a valve action. Examples of the valve metal include metal monomers such as aluminum, tantalum, niobium, titanium, and zirconium, or alloys containing at least one of these metals. Among them, aluminum or an aluminum alloy is preferred.

[0171] The shape of the anode plate 11 is preferably a flat plate, and more preferably a foil. Thus, in this specification, "plate-like" also includes "foil-like".

[0172] The anode plate 11 only needs to have the porous portion 11B on at least one main surface of the core 11A. That is, the anode plate 11 may have the porous portion 11B on only one main surface of the core 11A, or may have the porous portion 11B on both main surfaces of the core 11A. The porous portion 11B is preferably a porous layer formed on the surface of the core 11A, and more preferably an etching layer.

[0173] The thickness of the anode plate 11 before etching is preferably 60 μm or more and 200 μm or less. The thickness of the core 11A that is not etched after etching is preferably 15 μm or more and 70 μm or less. The thickness of the porous portion 11B is designed to match the required withstand voltage and electrostatic capacitance, but preferably, the total thickness of the porous portions 11B on both sides of the core 11A is 10 μm or more and 180 μm or less.

[0174] The pore size of the porous portion 11B is preferably 10 nm or more and 600 nm or less. The pore size of the porous portion 11B refers to a median diameter D50 measured by a mercury porosimeter. The pore size of the porous portion 11B can be controlled by adjusting various conditions during etching, for example.

[0175] The dielectric layer 13 provided on the surface of the porous portion 11B is porous reflecting the surface state of the porous portion 11B and has a fine concavoconvex surface shape. Preferably, the dielectric layer 13 is composed of an oxide film of the above-mentioned valve-acting metal. For example, when an aluminum foil is used as the anode plate 11, the surface of the aluminum foil is subjected to an anodic oxidation treatment (also called chemical conversion treatment) in an aqueous solution containing ammonium adipate or the like, so that the dielectric layer 13 composed of an oxide film can be formed.

[0176] The thickness of the dielectric layer 13 is designed to match the required withstand voltage and electrostatic capacitance, but is preferably not less than 10 nm and not more than 100 nm.

[0177] In the case where the cathode layer 12 includes a solid electrolyte layer 12A, as a material constituting the solid electrolyte layer 12A, for example, conductive polymers such as polypyrroles, polythiophenes, and polyanilines can be cited. Among them, polythiophenes are preferred, and poly (3,4-ethylenedioxythiophene) called PEDOT is particularly preferred. In addition, the above-mentioned conductive polymer may also include a dopant such as polystyrene sulfonic acid (PSS). In addition, it is preferred that the solid electrolyte layer 12A includes an inner layer that fills the pores (recesses) of the dielectric layer 13 and an outer layer that covers the dielectric layer 13.

[0178] The thickness of solid electrolyte layer 12A from the surface of porous portion 11B is preferably 2 μm or more and 20 μm or less.

[0179] The solid electrolyte layer 12A is formed, for example, by a method of forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 13 using a treatment solution containing a monomer such as 3,4-ethylenedioxythiophene, or by a method of applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 13 and drying it.

[0180] The solid electrolyte layer 12A can be formed in a predetermined region by applying the above-mentioned treatment liquid or dispersion liquid to the surface of the dielectric layer 13 by a method such as sponge transfer, screen printing, dispenser coating, or inkjet printing.

[0181] When cathode layer 12 includes conductor layer 12B, conductor layer 12B includes at least one of a conductive resin layer and a metal layer. Conductor layer 12B may be only a conductive resin layer or only a metal layer. Preferably, conductor layer 12B covers the entire surface of solid electrolyte layer 12A.

[0182] Examples of the conductive resin layer include a conductive adhesive layer containing at least one conductive filler selected from the group consisting of a silver filler, a copper filler, a nickel filler, and a carbon filler.

[0183] As the metal layer, for example, metal plating, metal foil, etc. can be cited. Preferably, the metal layer is formed of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as main components. In addition, the "main component" refers to the element component with the largest weight ratio.

[0184] Conductor layer 12B includes, for example, a carbon layer provided on the surface of solid electrolyte layer 12A and a copper layer provided on the surface of the carbon layer.

[0185] The carbon layer is provided to electrically and mechanically connect the solid electrolyte layer 12A to the copper layer. The carbon layer can be formed in a predetermined area by applying carbon paste to the surface of the solid electrolyte layer 12A by sponge transfer, screen printing, dispenser coating, inkjet printing, etc. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

[0186] The copper layer can be formed in a predetermined region by applying a copper paste to the surface of the carbon layer by sponge transfer, screen printing, spray coating, dispenser coating, inkjet printing, etc. The thickness of the copper layer is preferably 2 μm or more and 20 μm or less.

[0187] The sealing layer 20 is made of an insulating material. In this case, it is preferable that the sealing layer 20 contains an insulating resin.

[0188] Examples of the insulating resin contained in the sealing layer 20 include epoxy resin and phenol resin.

[0189] Preferably, the sealing layer 20 further contains a filler.

[0190] Examples of the filler contained in the sealing layer 20 include inorganic fillers such as silica particles and alumina particles.

[0191] A layer such as a stress relaxation layer or a moisture-proof film may be provided between the anode plate 11 and the sealing layer 20 .

[0192] The insulating layer 15 is made of an insulating material. In this case, it is preferable that the insulating layer 15 is made of an insulating resin.

[0193] Examples of the insulating resin constituting the insulating layer 15 include polyphenylsulfone resin, polyethersulfone resin, cyanate resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), polyimide resin, polyamideimide resin, epoxy resin, and derivatives or precursors thereof.

[0194] The insulating layer 15 may be made of the same resin as the sealing layer 20. If the insulating layer 15 contains an inorganic filler different from the sealing layer 20, it may adversely affect the effective capacitance of the capacitor. Therefore, the insulating layer 15 is preferably made of a single resin.

[0195] The insulating layer 15 can be formed in a predetermined region by applying a masking material such as a composition containing an insulating resin to the surface of the porous portion 11B by a method such as sponge transfer, screen printing, dispenser coating, or inkjet printing.

[0196] The insulating layer 15 may be formed in the porous portion 11B before or after the dielectric layer 13 is formed.

[0197] The first external electrode layer 91 is electrically connected to the anode plate 11. Figure 3 In the example shown, the first external electrode layer 91 is provided on the surface of the first through-hole conductor 61, and functions as a connection terminal of the capacitor portion. Figure 3 In the illustrated example, the first external electrode layer 91 is electrically connected to the anode plate 11 via the first through-hole conductor 61 , and functions as a connection terminal for the anode plate 11 .

[0198] Examples of the constituent material of the first external electrode layer 91 include metal materials containing low-resistance metals such as silver, gold, and copper. In this case, the first external electrode layer 91 is formed by plating the surface of the first through-hole conductor 61, for example.

[0199] In order to improve the close fit between the first external electrode layer 91 and other components, here, in order to improve the close fit between the first external electrode layer 91 and the first through-hole conductor 61, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler and carbon filler and resin can also be used as the constituent material of the first external electrode layer 91.

[0200] The second external electrode layer 92 is electrically connected to the cathode layer 12. Figure 3 In the illustrated example, the second external electrode layer 92 is provided on the surface of the second through-hole conductor 62 , and functions as a connection terminal of the capacitor portion.

[0201] Examples of the constituent material of the second external electrode layer 92 include metal materials containing low-resistance metals such as silver, gold, and copper. In this case, the second external electrode layer 92 is formed by plating the surface of the second through-hole conductor 62, for example.

[0202] In order to improve the close fit between the second external electrode layer 92 and other components, here, in order to improve the close fit between the second external electrode layer 92 and the second through-hole conductor 62, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler and carbon filler and resin can also be used as the constituent material of the second external electrode layer 92.

[0203] It is preferable that the constituent materials of the first external electrode layer 91 and the second external electrode layer 92 are the same in at least the type, but they may be different from each other.

[0204] When multiple capacitor parts are arranged in a planar direction, a first external electrode layer 91 electrically connected to the anode plate 11 and a second external electrode layer 92 electrically connected to the cathode layer 12 can be provided in each capacitor part, or at least one of the first external electrode layer 91 and the second external electrode layer 92 can be provided in common in multiple capacitor parts.

[0205] The first external electrode layer 91 and the second external electrode layer 92 may be provided on both main surfaces of the sealing layer 20 , or may be provided on only one main surface of the sealing layer 20 .

[0206] When the first through-hole conductor 61 is electrically connected to the anode plate 11 at the inner wall surface of the first through-hole 71, it is preferable that the first through-hole conductor 61 is electrically connected to the end surface of the anode plate 11 facing the inner wall surface of the first through-hole 71 in the planar direction. Thus, the anode plate 11 is electrically conducted to the outside via the first through-hole conductor 61.

[0207] Preferably, the core 11A and the porous portion 11B are exposed on the end surface of the anode plate 11 and are electrically connected to the first through-hole conductor 61. In this case, the porous portion 11B is electrically connected to the first through-hole conductor 61 in addition to the core 11A.

[0208] Preferably, when viewed in the thickness direction, the first through-hole conductor 61 is electrically connected to the anode plate 11 over the entire circumference of the first through-hole 71. In this case, the connection resistance between the anode plate 11 and the first through-hole conductor 61 is easily reduced, and thus the equivalent series resistance (ESR) is easily reduced.

[0209] The second through-hole conductor 62 is electrically connected to the cathode layer 12 through, for example, the second external electrode layer 92 and a via conductor.

[0210] The first through-hole conductor 61 is formed, for example, as follows. First, a first through-hole 71 is formed that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction by drilling, laser processing, etc. Then, the first through-hole conductor 61 is formed by metallizing the inner wall surface of the first through-hole 71 with a metal material containing a metal with low resistance such as copper, gold, silver, etc. When forming the first through-hole conductor 61, for example, the inner wall surface of the first through-hole 71 is metallized by using a non-electrolytic copper plating process, an electrolytic copper plating process, etc., so that the processing becomes easy. In addition, regarding the method of forming the first through-hole conductor 61, in addition to the method of metallizing the inner wall surface of the first through-hole 71, a method of filling the first through-hole 71 with a metal material, a composite material of metal and resin, etc.

[0211] In the planar direction, an anode connection layer may be provided between the anode plate 11 and the first through-hole conductor 61. That is, the anode plate 11 and the first through-hole conductor 61 may be electrically connected via the anode connection layer.

[0212] The anode connection layer is provided between the anode plate 11 and the first through-hole conductor 61 in the planar direction, and the anode connection layer functions as a barrier layer for the anode plate 11, more specifically, as a barrier layer for the core portion 11A and the porous portion 11B. If the anode connection layer functions as a barrier layer for the anode plate 11, the dissolution of the anode plate 11 generated during the treatment with the chemical solution for forming the external electrode layer such as the first external electrode layer 91 is suppressed, and the penetration of the chemical solution into the capacitor portion is further suppressed, so that the reliability is easily improved.

[0213] Preferably, the anode connection layer includes a layer containing nickel as a main component. In this case, damage to the metal (eg, aluminum) constituting the anode plate 11 is reduced, so the barrier property of the anode connection layer to the anode plate 11 is easily improved.

[0214] Furthermore, in the planar direction, the anode connection layer may not be provided between the anode plate 11 and the first through-hole conductor 61 . In this case, the first through-hole conductor 61 may be directly connected to the end surface of the anode plate 11 .

[0215] The second through-hole conductor 62 is formed, for example, as follows. First, a through-hole is formed that penetrates the anode plate 11 and the cathode layer 12 in the thickness direction by drilling, laser processing, etc. Next, the through-hole is filled with an insulating material. The second through-hole 72 is formed by drilling, laser processing, etc. on the portion filled with the insulating material. At this time, the diameter of the second through-hole 72 is made smaller than the diameter of the through-hole filled with the insulating material, so that the insulating material exists between the inner wall surface of the through-hole formed previously and the inner wall surface of the second through-hole 72 in the plane direction. Thereafter, the second through-hole conductor 62 is formed by metallizing the inner wall surface of the second through-hole 72 with a metal material containing a low-resistance metal such as copper, gold, or silver. When forming the second through-hole conductor 62, for example, the inner wall surface of the second through-hole 72 is metallized by electroless copper plating, electrolytic copper plating, etc., so that processing becomes easy. In addition, the second through-hole conductor 62 may be formed by filling the second through-hole 72 with a metal material, a composite material of metal and resin, or the like, other than metalizing the inner wall surface of the second through-hole 72 .

[0216] Examples of the constituent material of the via conductor include metal materials containing a low-resistance metal such as silver, gold, or copper.

[0217] The via conductor is formed, for example, by plating the inner wall surface of a via hole penetrating the sealing layer 20 in the thickness direction with the above-mentioned metal material or by filling the via hole with a conductive paste and then performing a heat treatment.

[0218] The capacitor element obtained from the capacitor element manufacturing substrate of the present invention can be appropriately used as a constituent material of a composite electronic component. Such a composite electronic component includes, for example: a capacitor element; an external electrode layer, which is provided on the surface of the sealing layer of the capacitor element and is electrically connected to the anode plate and cathode layer of the capacitor element, respectively; and an electronic component, which is connected to the external electrode layer.

[0219] In the composite electronic component, the electronic component connected to the external electrode layer may be either a passive element or an active element. Both the passive element and the active element may be connected to the external electrode layer, or either the passive element or the active element may be connected to the external electrode layer. In addition, a composite of the passive element and the active element may be connected to the external electrode layer.

[0220] Examples of passive components include inductors, etc. Examples of active components include memories, GPUs (Graphical Processing Units), CPUs (Central Processing Units), MPUs (Micro Processing Units), and PMICs (Power Management ICs).

[0221] The capacitor element has a sheet-like shape as a whole. Therefore, in the composite electronic component, the capacitor element can be treated like a mounting substrate, and the electronic component can be mounted on the capacitor element. Moreover, by setting the shape of the electronic component mounted on the capacitor element to be sheet-like, the capacitor element and the electronic component can be connected in the thickness direction via a through-hole conductor that penetrates each electronic component in the thickness direction. As a result, active components and passive components can be configured as batch modules.

[0222] For example, a capacitor element can be electrically connected between a voltage regulator including a semiconductor active element and a load to which the converted DC voltage is supplied, thereby forming a switching regulator.

[0223] In the composite electronic component, a circuit layer may be formed on any surface of a capacitor matrix sheet in which a plurality of capacitor elements are further arranged, and the circuit layer may be connected to the passive element or the active element.

[0224] Alternatively, the capacitor element may be disposed in a cavity previously provided in the substrate, embedded in a resin, and then a circuit layer may be formed on the resin. Alternatively, other electronic components (passive or active) may be mounted in other cavities of the substrate.

[0225] Alternatively, the capacitor element may be mounted on a smooth carrier such as a wafer or glass, and a circuit layer may be formed after the outer layer is formed with a resin, and then the passive element or active element may be connected thereto.

[0226] The following contents are disclosed in this specification.

[0227] <1>

[0228] A substrate for manufacturing a capacitor element, wherein:

[0229] The capacitor element manufacturing substrate comprises:

[0230] a substrate layer divided into a product region constituting a capacitor element and an out-of-product region surrounding at least a portion of the product region; and

[0231] a sealing layer provided so as to cover at least one main surface of the substrate layer,

[0232] The product area includes: an anode plate having a porous portion on at least one main surface of a core; a dielectric layer disposed on a surface of the porous portion; and a cathode layer disposed on a surface of the dielectric layer.

[0233] The product outer region includes the core of the anode plate.

[0234] A through portion penetrating the anode plate in the thickness direction is provided at least partially in an area located at the outer edge of the substrate layer in the product outer area.

[0235] At least a portion of the through portion is filled with a filling member.

[0236] <2>

[0237] The substrate for manufacturing a capacitor element according to <1>, wherein

[0238] The filling member includes a conductive member.

[0239] <3>

[0240] The substrate for manufacturing a capacitor element according to <2>, wherein:

[0241] The filling member is composed of two or more layers of members extending inward from the inner wall surface of the through-portion.

[0242] <4>

[0243] The substrate for manufacturing a capacitor element according to <3>, wherein:

[0244] The filling member further includes an insulating member located outside the conductive member.

[0245] <5>

[0246] The substrate for manufacturing a capacitor element according to <1>, wherein

[0247] The filling member includes an insulating member.

[0248] <6>

[0249] The substrate for manufacturing a capacitor element according to <4> or <5>, wherein:

[0250] The insulating member includes the sealing layer that penetrates into at least a portion of the through portion.

[0251] <7>

[0252] The substrate for manufacturing a capacitor element according to any one of <1> to <6>, wherein

[0253] The product outer region includes: the anode plate having the porous portion on at least one main surface of the core; the dielectric layer provided on the surface of the porous portion; and the cathode layer provided on the surface of the dielectric layer.

[0254] <8>

[0255] The substrate for manufacturing a capacitor element according to any one of <1> to <7>, wherein

[0256] In the product outer region, an insulating layer is provided between the anode plate and the sealing layer.

[0257] The through portion penetrates the anode plate and the insulating layer in the thickness direction.

[0258] <9>

[0259] The substrate for manufacturing a capacitor element according to any one of <1> to <8>, wherein

[0260] In the product outer region, at least three of the through portions are arranged at equal intervals.

[0261] <10>

[0262] The substrate for manufacturing a capacitor element according to <9>, wherein:

[0263] At least two of the through portions arranged at equal intervals have the same planar shape as viewed in the thickness direction.

[0264] <11>

[0265] The substrate for manufacturing a capacitor element according to any one of <1> to <10>, wherein

[0266] In the product outer region, a virtual layer is provided on the surface of the sealing layer.

[0267] At least one end portion of the through portion is covered by the dummy layer.

[0268] <12>

[0269] A method for manufacturing a capacitor element, wherein:

[0270] The method for manufacturing a capacitor element includes the step of isolating a product area by removing at least a part of a product-free area from the capacitor element manufacturing substrate according to any one of <1> to <11>.

[0271] Description of Reference Numerals

[0272] 1, 1A, 1B, 2, 2', 2A, 2B, 3, 3', 3A, 3B, a substrate for manufacturing a capacitor element; 10, a substrate layer; 11, an anode plate; 11A, a core portion; 11B, a porous portion; 12, a cathode layer; 12A, a solid electrolyte layer; 12B, a conductor layer; 13, a dielectric layer; 15, an insulating layer; 15A, a first insulating layer; 15B, a second insulating layer; 20, a sealing layer; 21, a first sealing layer; 22, a second sealing layer; 30, a through portion; 40, Filling member; 41, conductive member; 42, insulating member; 45, resin filling portion; 50, virtual electrode layer (virtual layer); 61, first through-hole conductor; 62, second through-hole conductor; 71, first through-hole; 72, second through-hole; 81, first resin filling portion; 82, second resin filling portion; 91, first external electrode layer; 92, second external electrode layer; 100, capacitor element; CL1, CL1a, cutting line; R1, product area; R2, area outside the product.

Claims

1. A substrate for manufacturing a capacitor element, wherein: The capacitor element manufacturing substrate comprises: a substrate layer divided into a product region constituting a capacitor element and an out-of-product region surrounding at least a portion of the product region; and a sealing layer provided so as to cover at least one main surface of the substrate layer, The product area includes: an anode plate having a porous portion on at least one main surface of a core; a dielectric layer disposed on a surface of the porous portion; and a cathode layer disposed on a surface of the dielectric layer. The out-of-product region includes the core of the anode plate, A through portion penetrating the anode plate in the thickness direction is provided at least partially in the area located at the outer edge of the substrate layer in the product outer area, At least a portion of the through portion is filled with a filling member.

2. The substrate for manufacturing a capacitor element according to claim 1, wherein The filling member includes a conductive member.

3. The substrate for manufacturing a capacitor element according to claim 2, wherein: The filling member is composed of two or more layers of members extending inward from the inner wall surface of the through portion.

4. The substrate for manufacturing a capacitor element according to claim 3, wherein: The filling member further includes an insulating member located outside the conductive member.

5. The substrate for manufacturing a capacitor element according to claim 1, wherein The filling member includes an insulating member.

6. The substrate for manufacturing a capacitor element according to claim 4 or 5, wherein: The insulating member includes the sealing layer that penetrates into at least a portion of the through portion.

7. The substrate for producing a capacitor element according to any one of claims 1 to 6, wherein The product outer region includes: the anode plate having the porous portion on at least one main surface of the core; the dielectric layer provided on the surface of the porous portion; and the cathode layer provided on the surface of the dielectric layer.

8. The substrate for capacitor element production according to any one of claims 1 to 7, wherein In the product outer region, an insulating layer is provided between the anode plate and the sealing layer, The through portion penetrates the anode plate and the insulating layer in the thickness direction.

9. The substrate for producing a capacitor element according to any one of claims 1 to 8, wherein In the product outer region, at least three through portions are arranged at equal intervals.

10. The substrate for manufacturing a capacitor element according to claim 9, wherein At least two of the through portions arranged at equal intervals have the same planar shape as viewed in the thickness direction.

11. The substrate for producing a capacitor element according to any one of claims 1 to 10, wherein In the product outer region, a virtual layer is provided on the surface of the sealing layer, At least one end portion of the through portion is covered by the dummy layer.

12. A method for manufacturing a capacitor element, wherein: The method for manufacturing a capacitor element includes the step of separating a product region by removing at least a part of a non-product region from the capacitor element manufacturing substrate according to any one of claims 1 to 11.

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