Semiconductor part processing and spraying equipment

Abstract

The invention relates to semiconductor part processing spraying equipment, and relates to the technical field of semiconductor part processing. The semiconductor part machining and spraying equipment comprises a machine body and a machining table, a tray and a rotating part are arranged on the machining table, the tray is rotationally connected with the machining table, the rotating part is used for driving the tray to rotate, a universal spray head and a mechanical arm are arranged on the machine body, and the mechanical arm is installed on the machine body. The universal spray head is installed on a tail end connector of the mechanical arm and used for spraying paint on the semiconductor parts on the tray, and the mechanical arm is used for driving the universal spray head to move so as to adjust the paint spraying direction and the paint spraying position of the universal spray head. The method has the effect of improving the spraying efficiency of the complex semiconductor parts.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor parts processing, and in particular to a semiconductor parts processing spraying equipment. Background Art

[0002] With the continuous development of social economy and the increasing level of science and technology, my country's electronic information industry is also booming. Semiconductors, as materials with conductivity between conductors and insulators at room temperature, have controllable orientation and play an important role in integrated circuits, consumer electronics, and communication systems. In the manufacture of semiconductor parts, in order to improve the performance and reliability of the product, it is generally necessary to spray the surface of the semiconductor parts to enhance the conductivity, corrosion resistance and appearance of the parts.

[0003] In the prior art, there is a semiconductor parts processing spraying device, which includes a machine body, a rotating disk, a rotating assembly and a spraying mechanism are arranged on the machine body, the rotating disk is rotatably connected to the machine body, and the rotating assembly is used to drive the rotating disk to rotate. The spraying mechanism is fixedly installed on the top of one side of the machine body, and the spray head of the spraying mechanism is fixedly arranged and faces the semiconductor parts placed on the rotating disk, so as to spray the semiconductor parts. When in use, the rotating assembly is controlled to drive the rotating disk to rotate, and the spraying mechanism sprays the semiconductor parts on the rotating disk.

[0004] Regarding the above-mentioned related technologies, since the nozzle of the spraying mechanism in the prior art is fixedly arranged and facing the rotating disk, when complex semiconductor parts need to be fully sprayed, it is difficult for the spraying mechanism to completely spray the surface of the semiconductor, so that relevant personnel need to use additional tools to manually hold the semiconductor parts and actively adjust the spraying position to achieve comprehensive spraying of the semiconductor parts. This greatly increases the workload of relevant personnel, thereby reducing the spraying efficiency of complex semiconductor parts, so it needs to be improved. Summary of the invention

[0005] In order to improve the spraying efficiency of complex semiconductor parts, the present application provides a semiconductor parts processing spraying equipment.

[0006] The present application provides a semiconductor parts processing spraying equipment, which adopts the following technical solution: A semiconductor parts processing spraying equipment comprises a machine body and a processing table, wherein a tray and a rotating part are arranged on the processing table, wherein the tray is rotatably connected to the processing table, and the rotating part is used to drive the tray to rotate; a universal nozzle and a mechanical arm are arranged on the machine body, wherein the mechanical arm is mounted on the machine body, the universal nozzle is mounted on the end interface of the mechanical arm, and is used to spray paint on the semiconductor parts on the tray, and the mechanical arm is used to drive the universal nozzle to move so as to adjust the spraying direction and spraying position of the universal nozzle.

[0007] By adopting the above technical solution, compared with the prior art, the spray head of the spray mechanism is fixedly arranged, so that when a complex semiconductor part needs to be fully sprayed, it is difficult for the spray mechanism to completely spray the surface of the semiconductor, and then the relevant personnel need to use additional tools to manually hold the semiconductor part to achieve full spraying of the semiconductor part, thereby reducing the spraying efficiency of the complex semiconductor parts; The present application configures a robotic arm and a universal nozzle so that the robotic arm can drive the change of its own end interface, thereby enabling the robotic arm to drive the universal nozzle installed on the end interface to move, adjust the painting direction and painting position of the universal nozzle, and thereby enable the universal nozzle to continuously spray paint on different positions of complex semiconductor parts, effectively replacing the manual operation of relevant personnel, facilitating the operation of relevant personnel, and thereby improving the spraying efficiency of complex semiconductor parts.

[0008] Preferably, a rotating disk is also provided on the processing table, and the rotating disk is rotatably connected to the processing table. The tray is mounted on the top of the rotating disk, and the top of the rotating disk is higher than the tray. The rotating member is used to drive the rotating disk to rotate. A clamping frame is also provided on the top of the rotating disk, and the clamping frame is slidably connected to the rotating disk, and one end extends out of the rotating disk and abuts against the top wall of the tray. A driving mechanism is also provided on the rotating disk, and the driving mechanism is used to drive the clamping frame to slide.

[0009] By adopting the above technical solution, the arrangement of the clamping frame and the driving mechanism makes it possible that when the pallet needs to be installed, it is only necessary to first put the pallet on the top of the rotating disk, and then drive the clamping frame to slide through the driving mechanism, and make one end of the clamping frame extend out of the main frame and abut against the top wall of the pallet, so as to achieve the compression and fixation of the pallet, which effectively facilitates the installation and removal of the pallet by relevant personnel.

[0010] Preferably, the driving mechanism includes a driving frame, which is located inside the rotating disk and is slidably connected to the rotating disk, and a sliding direction of the driving frame is different from a sliding direction of the clamping frame. An inclined driving surface is provided at the bottom end of the driving frame, and an inclined guide surface is provided at one end of the clamping frame close to the driving frame, and a side wall of the driving surface is in contact with a side wall of the guide surface.

[0011] By adopting the above technical solution, the drive frame is set so that when it is necessary to drive the abutment frame to slide, it is only necessary to slide the drive frame, so that the drive surface on the drive frame can slide relative to the guide surface on the clamping frame, so that the clamping frame can slide outside the main frame under the action of the guide surface and the drive surface, so that one end of the clamping frame extends out of the main frame, thereby realizing the driving of the clamping frame, which effectively facilitates the operation of relevant personnel.

[0012] Preferably, the driving mechanism also includes a locking frame, one end of which extends into the rotating disk and is inserted into the driving frame and rotatably connected to the driving frame. An external thread is also provided on the outside of the locking frame so that the locking frame is threadedly connected to the inner wall of the rotating disk.

[0013] By adopting the above technical solution, the locking frame is set so that when the driving frame needs to be driven, the relevant personnel can rotate the locking frame so that the external thread on the locking frame is continuously screwed into the rotating disk, so that the locking frame can drive the driving frame connected to its own rotation to slide, so that the driving frame drives the clamping frame to slide outside the rotating disk, thereby realizing the driving of the driving frame and the clamping frame. At the same time, during the process of driving the frame, the external thread on the locking frame is continuously screwed into the rotating disk, thereby gradually realizing the locking of the locking frame, and locking the driving frame is realized by locking the locking frame.

[0014] Preferably, a positioning frame is further provided on the rotating disk, and the positioning frame is not circular with the same axis as the rotating disk, and a positioning groove matching the shape of the positioning frame is also provided on the bottom wall of the tray, and the positioning frame is inserted into the positioning groove.

[0015] By adopting the above technical solution, the positioning frame and the positioning groove are set, so that after the pallet is placed on the rotating disk, the relevant personnel can fix the pallet and the rotating disk in the horizontal direction by inserting the positioning frame into the positioning groove, which effectively reduces the probability of the pallet accidentally slipping relative to the rotating disk when the pallet rotates with the rotating disk, thereby effectively ensuring the effect of the rotating disk driving the pallet to rotate.

[0016] Preferably, the positioning frame is slidably connected to the rotating disk, and the sliding direction is the axial direction of the rotating disk. A linkage component is also provided on the rotating disk, and the clamping frame drives the positioning frame to slide through the linkage component.

[0017] By adopting the above technical solution, the positioning frame and the linkage assembly are arranged so that when the tray is just mounted on the rotating disk, the positioning frame is not inserted into the positioning groove, so that when the relevant personnel rotate the locking frame, the locking frame drives the clamping frame to gradually slide out of the rotating disk. The clamping frame can drive the positioning frame to move upward through the linkage assembly, so that the positioning frame is inserted into the tray. The relevant personnel only need to align the position of the positioning groove on the tray to automatically insert the positioning frame into the positioning groove in the subsequent process, and there is no need to manually insert the positioning frame into the positioning groove, which effectively facilitates the operation of the relevant personnel.

[0018] Preferably, the linkage assembly comprises a linkage frame, one end of the linkage frame is rotatably connected to the clamping frame, and the other end of the linkage frame is rotatably connected to the positioning frame.

[0019] By adopting the above technical solution, the linkage frame is set up so that in the process of the clamping frame gradually sliding out of the main frame, it can drive the linkage frame and one end of its own rotation connection to move together, so that the other end of the linkage frame can be displaced accordingly, and then the linkage frame can drive the positioning frame to slide, thereby driving the positioning frame, and at the same time realizing the linkage between the positioning frame and the clamping frame, which is convenient for the operation of relevant personnel.

[0020] Preferably, a rotating disk is further provided on the processing table, and the rotating disk is rotatably connected to the processing table. The tray is mounted on the top of the rotating disk. A fixed frame is also provided on the top of the rotating disk. The fixed frame is located above the tray and connected to the rotating disk. The bottom end of the fixed frame is abutted against the top wall of the tray, and the rotating member is used to drive the rotating disk to rotate.

[0021] By adopting the above technical solution, the setting of the rotating disk and the fixed frame makes it possible for relevant personnel to select suitable pallets according to the sizes of different semiconductor parts when it is necessary to spray semiconductor parts of different sizes. After the selection is completed, the fixed frame can be removed from the top of the rotating disk, so as to disassemble the installed pallet and install the pallet that needs to be replaced, which effectively facilitates the operation of relevant personnel and can adapt to semiconductor parts of different sizes.

[0022] Preferably, the number of the trays and the rotating member is set to be several and arranged correspondingly, the several trays are respectively arranged at different positions of the processing table, and the diameters of the trays are different.

[0023] By adopting the above technical solution, the tray and the rotating part are set to several settings, so that several semiconductor parts of different sizes can be placed on the processing table. Therefore, after the universal nozzle finishes spraying the semiconductor parts on one tray, the universal nozzle can be driven by the robotic arm to approach another tray, so as to spray the semiconductor parts on the other tray, thereby effectively improving the spraying efficiency of the semiconductor parts.

[0024] Preferably, a cooling pipe is further provided on the processing table, one end of the cooling pipe is used to connect to a liquid source, and the other end of the cooling pipe is directed toward the semiconductor parts on the tray so as to spray water mist onto the semiconductor parts.

[0025] By adopting the above technical solution, the cooling pipe is set so that during the spraying process, the cooling pipe can spray water mist to the sprayed semiconductor parts, so that the water mist absorbs heat when evaporating, reduces the temperature of the semiconductor parts, achieves cooling of the semiconductor parts, and effectively ensures the spraying effect of the semiconductor parts.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The setting of the robot arm and the universal nozzle enables the robot arm to drive its own end interface to change, so that the robot arm can drive the universal nozzle installed on the end interface to move, adjust the spraying direction and spraying position of the universal nozzle, and then enable the universal nozzle to continuously spray paint at different positions of complex semiconductor parts, effectively replacing the manual operation of relevant personnel, facilitating the operation of relevant personnel, and thus improving the spraying efficiency of complex semiconductor parts; 2. The arrangement of the clamping frame and the driving mechanism enables, when the pallet needs to be installed, the pallet only needs to be placed on the top of the rotating disk first, and then the clamping frame is driven to slide by the driving mechanism, and one end of the clamping frame extends out of the main frame and abuts against the top wall of the pallet, so that the pallet can be pressed and fixed, which effectively facilitates the installation and removal of the pallet by relevant personnel; 3. The setting of the positioning frame and the positioning groove enables relevant personnel to fix the pallet and the rotating disk in the horizontal direction by inserting the positioning frame into the positioning groove after the pallet is placed on the rotating disk, which effectively reduces the probability of the pallet accidentally slipping relative to the rotating disk when the pallet rotates with the rotating disk, thereby effectively ensuring the effect of the rotating disk driving the pallet to rotate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram used to illustrate the overall semiconductor parts processing spraying equipment in Example 1 of the present application.

[0028] Figure 2 It is a structural schematic diagram used to reflect the rotating part in Example 1 of the present application.

[0029] Figure 3 It is a schematic diagram of the structure of the fixing frame used to embody the embodiment 1 of the present application.

[0030] Figure 4 It is a structural schematic diagram used to reflect the sleeve part in Example 2 of the present application.

[0031] Figure 5 It is a structural schematic diagram used to reflect the driving mechanism in Example 2 of the present application.

[0032] Figure 6 It is a structural diagram used to reflect the linkage component in Example 2 of the present application.

[0033] Explanation of the accompanying drawings: 1. Machine body; 11. Processing table; 111. Tray; 1111. Sleeve groove; 1112. Positioning groove; 12. Rotating member; 13. Rotating disk; 131. Sleeve portion; 14. Cooling pipe; 3. Universal nozzle; 4. Robotic arm; 5. Positioning frame; 6. Fixed frame; 7. Driving mechanism; 71. Driving frame; 711. Driving surface; 72. Locking frame; 8. Snap-on frame; 81. Guide surface; 9. Return spring; 10. Linkage assembly; 101. Linkage frame. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-6 This application is described in further detail.

[0035] Embodiment 1 of the present application discloses a semiconductor parts processing spraying equipment. Figure 1 and Figure 2 The semiconductor parts processing spraying equipment includes a body 1 and a processing table 11, on which a tray 111 and a rotating member 12 are arranged. The tray 111 is rotatably connected to the processing table 11, and the rotating member 12 is used to drive the tray 111 to rotate. The body 1 is provided with a universal nozzle 3 and a mechanical arm 4, and the mechanical arm 4 is installed on the body 1. The universal nozzle 3 is installed on the end interface of the mechanical arm 4, and is used to spray paint on the semiconductor parts on the tray 111, and the mechanical arm 4 is used to drive the universal nozzle 3 to move, so as to adjust the spraying direction and spraying position of the universal nozzle 3.

[0036] Reference Figure 1 and Figure 2 The processing table 11 is placed on the machine body 1, and a rotating disk 13 is also provided on the processing table 11. In the embodiment of the present application, the number of the rotating disks 13 is set to two, and the two rotating disks 13 are respectively set at the two ends of the processing table 11 along its own length direction, and are both rotatably connected to the processing table 11 through a pin shaft, and the rotation axis is vertically set.

[0037] Reference Figure 2In the embodiment of the present application, the number of rotating members 12 is set to two, and the two rotating members 12 are arranged in a one-to-one correspondence with the two rotating disks 13, and each rotating member 12 is arranged as a combination structure of a reduction motor, a belt and a pulley. The reduction motor is fixedly installed in the processing table 11, and is used to drive one of its pulleys to rotate. The belt is sleeved on each pulley and the corresponding rotating disk 13 to realize the transmission between the pulley and the rotating disk 13, and realize the driving of the rotating disk 13 to rotate.

[0038] Reference Figure 2 The number of trays 111 is set to be several. In the embodiment of the present application, the number of trays 111 is set to be two, and the two trays 111 are arranged in one-to-one correspondence with the two rotating disks 13. A sleeve groove 1111 is provided through the center of the bottom wall of each tray 111, and a positioning groove 1112 is also provided on the bottom wall of each tray 111. Each positioning groove 1112 is connected to the corresponding sleeve groove 1111, and each positioning groove 1112 is not a circular groove.

[0039] Reference Figure 2 and Figure 3 The top of each rotating disk 13 is provided with a sleeve portion 131, and each sleeve portion 131 is integrally formed with the top of the main body of the corresponding rotating disk 13. Each sleeve portion 131 passes through the sleeve groove 1111 on the tray 111 from the bottom of the tray 111 upwards and reaches the top of the tray 111, so that the tray 111 is sleeved on the corresponding sleeve portion 131.

[0040] Reference Figure 3 A positioning frame 5 is disposed at the top of each rotating disk 13 body, and the positioning frame 5 is located at the bottom of the sleeve portion 131 and is fixedly connected to the rotating disk 13. Each positioning frame 5 is matched with a positioning groove 1112 on a corresponding tray 111, and when the tray 111 is sleeved on the sleeve portion 131, each positioning frame 5 is embedded in the corresponding positioning groove 1112, so that the rotating disk 13 can drive the tray 111 to rotate together.

[0041] Reference Figure 3 A fixing frame 6 is disposed on the top of each sleeve portion 131, and the bottom wall of each fixing frame 6 abuts against the top wall of the corresponding tray 111. In the embodiment of the present application, each fixing frame 6 is configured to be cylindrical and coaxially disposed with the sleeve portion 131, and the diameter is larger than the opening diameter of the positioning groove 1112. Each fixing frame 6 is fixedly connected to the top of the corresponding sleeve portion 131 by a plurality of bolts, so as to fix the corresponding tray 111 by abutting.

[0042] Reference Figure 2, the processing table 11 is also provided with a plurality of cooling tubes 14. In the embodiment of the present application, the number of cooling tubes 14 is set to four, and the four cooling tubes 14 are all set to be universal nozzles, so that the relevant personnel can arbitrarily change the direction of the nozzle and the distance between the end and the semiconductor parts. One end of each cooling tube 14 is installed on the processing table 11 and is located between the two trays 111.

[0043] Reference Figure 2 One end of each cooling tube 14 is connected to a liquid source. In the embodiment of the present application, the liquid source is a box storing the liquid source, and the box is connected to one end of each cooling tube 14 through a pipeline. A pump body for extracting liquid is also provided on the pipeline to realize the liquid delivery, so that the liquid is sprayed into a mist at the end of the cooling tube 14. One end of each cooling tube 14 can be adjusted to face the semiconductor parts to be sprayed on each tray 111.

[0044] Reference Figure 1 The robot arm 4 is fixedly mounted on the machine body 1 and is located on one side of the processing table 11. In the embodiment of the present application, the robot arm 4 has multiple degrees of freedom, so that the end interface on the robot arm 4 can be displaced to any position on each tray 111.

[0045] Reference Figure 1 The universal nozzle 3 is fixedly mounted at the end interface of the robot arm 4. The universal nozzle 3 is connected to a paint source through a pipeline. In the embodiment of the present application, the paint source is a box storing paint. The nozzle of the universal nozzle 3 can be moved to any position on each tray 111 along with the end interface of the robot arm 4, and can be adjusted at multiple angles.

[0046] Reference Figure 1 In the embodiment of the present application, a cooling spray tube may also be provided on the universal nozzle 3, so that water mist can be sprayed during spraying to cool the semiconductor parts.

[0047] The implementation principle of a semiconductor parts processing spraying equipment in Example 1 of the present application is as follows: when it is necessary to spray the semiconductor parts on the tray 111, the robot arm 4 drives the universal nozzle 3 to move, and adjusts the nozzle angle of the universal nozzle 3 so that the universal nozzle 3 can spray any position of the semiconductor parts. In this process, the spray pipe for cooling on the universal nozzle 3 continuously sprays water mist to cool the semiconductor parts. After the spraying is completed, the rotating part 12 drives the tray 111 to rotate, and at the same time opens the cooling pipe 14, so that the cooling pipe 14 sprays water mist to cool the semiconductor parts on the tray 111.

[0048] Embodiment 2: The difference between the second embodiment of the present application and the first embodiment is that: Figure 4and Figure 5 The top of each sleeve portion 131 is also provided with a driving mechanism 7, each driving mechanism 7 includes a driving frame 71 and a locking frame 72, and the bottom end of each locking frame 72 vertically extends downward into the top of the sleeve portion 131. An external thread is provided on the outer wall of each locking frame 72, so that the locking frame 72 is threadedly connected with the corresponding sleeve portion 131.

[0049] Reference Figure 5 and Figure 6 Each driving frame 71 is located in the corresponding sleeve portion 131 and is slidably connected to the inner wall of the corresponding sleeve portion 131, and the sliding direction is the axial direction of the sleeve portion 131. The bottom end of each locking frame 72 is inserted into the top end of the corresponding driving frame 71 and is rotatably connected to the corresponding driving frame 71 through a bearing, so that when the locking frame 72 is gradually screwed into the corresponding sleeve portion 131, the bottom end of the locking frame 72 can drive the driving frame 71 to slide downward.

[0050] Reference Figure 5 and Figure 6 In the embodiment of the present application, the driving frames 71 are all configured as blocks, and an inclined driving surface 711 is provided at the intersection between the four side walls and the bottom wall of each driving frame 71, and the bottom end of the driving surface 711 is inclined toward the inside of the driving frame 71.

[0051] Reference Figure 4 and Figure 5 , a clamping frame 8 is also provided in the sleeve portion 131. In the embodiment of the present application, the number of the clamping frames 8 is set to four, and the four clamping frames 8 are arranged equidistantly along the circumference of the axis of the sleeve portion 131, and are provided one-to-one with the four driving surfaces 711. Each clamping frame 8 is slidably connected to the inner wall of the corresponding sleeve portion 131, and the sliding direction is the length direction of itself.

[0052] Reference Figure 5 and Figure 6 A guide surface 81 is provided at the intersection of the side wall and the top wall of each clamping frame 8 near one end of the driving frame 71, and the top end of each guide surface 81 is inclined away from the corresponding driving frame 71 to correspond to the adjacent driving surface 711. Each driving surface 711 is in contact with the guide surface 81 on the corresponding clamping frame 8, so that when the driving frame 71 moves, it can drive the corresponding clamping frame 8 to slide through the driving surface 711 and the guide surface 81.

[0053] Reference Figure 5 and Figure 6 One end of each clamping frame 8 away from the corresponding driving frame 71 extends out of the corresponding sleeve portion 131 along its own length direction, and is located above the corresponding tray 111, and the bottom wall is against the top wall of the corresponding tray 111 to fix the tray 111.

[0054] Reference Figure 5 and Figure 6 A return spring 9 is provided on each clamping frame 8, and each return spring 9 is located on the side of the clamping frame 8 away from the driving frame 71. One end of each return spring 9 abuts against the corresponding clamping frame 8, and the other end abuts against the inner wall of the corresponding sleeve portion 131.

[0055] Reference Figure 5 and Figure 6 Each positioning frame 5 is slidably connected to the corresponding rotating disk 13, and the sliding direction is vertical, and the top end of each positioning frame 5 can slide into the corresponding rotating disk 13, so that the positioning frame 5 is separated from the positioning groove 1112 on the corresponding tray 111. A linkage assembly 10 is also arranged in each rotating disk 13, and each linkage assembly 10 includes a plurality of linkage frames 101. In the embodiment of the present application, the number of linkage frames 101 is set to four, and the four linkage frames 101 are arranged in a one-to-one correspondence with the four clamping frames 8.

[0056] Reference Figure 5 and Figure 6 One end of each linkage frame 101 is rotatably connected to one end of the corresponding clamping frame 8 located in the rotating disk 13 through a pin shaft, and the other end of each linkage frame 101 is rotatably connected to the corresponding positioning frame 5 through a pin shaft, so that the clamping frame 8 can drive the positioning frame 5 to slide.

[0057] Reference Figure 5 and Figure 6 In the initial state, that is, when the clamping frame 8 is completely retracted into the sleeve portion 131 under the elastic force of the return spring 9, the driving frame 71 is located at the top of its own sliding path. When the locking frame 72 rotates and gradually screws into the sleeve portion 131, the locking frame 72 drives the driving frame 71 to move downward, so that the driving frame 71 continuously contacts the guide surface 81 on the corresponding clamping frame 8 through the driving surface 711, pushing one end of the clamping frame 8 to slide out of the sleeve portion 131, thereby fixing the tray 111.

[0058] Reference Figure 5 and Figure 6 During this process, the card-jointed frame 8 drives the top end of the corresponding linkage frame 101 to move together, so that the bottom end of the linkage frame 101 drives the docking frame to slide upward, so that the positioning frame 5 is gradually inserted into the positioning groove 1112 at the bottom of the tray 111, thereby realizing automatic positioning and fixation of the tray 111.

[0059] The implementation principle of a semiconductor parts processing spraying device according to Embodiment 2 of the present application is as follows: when the tray 111 needs to be installed on the rotating disk 13, the rotating disk 13 is first sleeved on the corresponding sleeve portion 131. Then, when the locking frame 72 is rotated and gradually screwed into the sleeve portion 131, the locking frame 72 drives the driving frame 71 to move downward, so that the driving frame 71 continuously contacts the guide surface 81 on the corresponding clamping frame 8 through the driving surface 711, pushing one end of the clamping frame 8 to slide out of the sleeve portion 131, thereby fixing the tray 111. In this process, the clamping frame 8 drives the top end of the corresponding linkage frame 101 to move together, so that the bottom end of the linkage frame 101 drives the positioning frame 5 to slide upward, so that the positioning frame 5 is gradually inserted into the positioning groove 1112 at the bottom of the tray 111, realizing automatic positioning and fixing of the tray 111.

[0060] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor parts processing spraying device, comprising a body (1) and a processing table (11), wherein a tray (111) and a rotating member (12) are arranged on the processing table (11), wherein the tray (111) is rotatably connected to the processing table (11), and the rotating member (12) is used to drive the tray (111) to rotate, and wherein: The machine body (1) is provided with a universal nozzle (3) and a mechanical arm (4); the mechanical arm (4) is mounted on the machine body (1); the universal nozzle (3) is mounted on the end interface of the mechanical arm (4) and is used to spray paint on semiconductor parts on the tray (111); the mechanical arm (4) is used to drive the universal nozzle (3) to move so as to adjust the spraying direction and spraying position of the universal nozzle (3).

2. A semiconductor parts processing spraying equipment according to claim 1, characterized in that: The processing table (11) is also provided with a rotating disk (13), the rotating disk (13) is rotatably connected to the processing table (11), the tray (111) is sleeved on the top of the rotating disk (13), and the top of the rotating disk (13) is higher than the tray (111), the rotating member (12) is used to drive the rotating disk (13) to rotate, and the top of the rotating disk (13) is also provided with a clamping frame (8), the clamping frame (8) is slidably connected to the rotating disk (13), and one end of the clamping frame (8) extends out of the rotating disk (13) and abuts against the top wall of the tray (111), and the rotating disk (13) is also provided with a driving mechanism (7), and the driving mechanism (7) is used to drive the clamping frame (8) to slide.

3. A semiconductor parts processing spraying equipment according to claim 2, characterized in that: The driving mechanism (7) comprises a driving frame (71), the driving frame (71) being located inside the rotating disk (13) and being slidably connected to the rotating disk (13), and the sliding direction of the driving frame (71) is different from the sliding direction of the clamping frame (8), the bottom end of the driving frame (71) is provided with an inclined driving surface (711), and the end of the clamping frame (8) close to the driving frame (71) is provided with an inclined guiding surface (81), and the side wall of the driving surface (711) is in contact with the side wall of the guiding surface (81).

4. A semiconductor parts processing spraying equipment according to claim 3, characterized in that: The driving mechanism (7) further comprises a locking frame (72), one end of which extends into the rotating disk (13) and is inserted into the driving frame (71) and is rotatably connected to the driving frame (71). The locking frame (72) is also provided with an external thread so that the locking frame (72) is threadedly connected to the inner wall of the rotating disk (13).

5. The semiconductor parts processing spraying equipment according to claim 2, characterized in that: A positioning frame (5) is also provided on the rotating disk (13), and the positioning frame (5) is not circular with the same axis as the rotating disk (13). A positioning groove (1112) matching the shape of the positioning frame (5) is also provided on the bottom wall of the tray (111), and the positioning frame (5) is inserted into the positioning groove (1112).

6. A semiconductor parts processing spraying equipment according to claim 5, characterized in that: The positioning frame (5) is slidably connected to the rotating disk (13), and the sliding direction is the axial direction of the rotating disk (13). A linkage assembly (10) is also provided on the rotating disk (13), and the clamping frame (8) drives the positioning frame (5) to slide through the linkage assembly (10).

7. A semiconductor parts processing spraying equipment according to claim 6, characterized in that: The linkage assembly (10) comprises a linkage frame (101), one end of the linkage frame (101) is rotatably connected to the clamping frame (8), and the other end of the linkage frame (101) is rotatably connected to the positioning frame (5).

8. The semiconductor parts processing spraying equipment according to claim 1, characterized in that: A rotating disk (13) is also provided on the processing table (11), and the rotating disk (13) is rotatably connected to the processing table (11). The tray (111) is sleeved on the top of the rotating disk (13). A fixing frame (6) is also provided on the top of the rotating disk (13). The fixing frame (6) is located above the tray (111) and is connected to the rotating disk (13). The bottom end of the fixing frame (6) abuts against the top wall of the tray (111). The rotating member (12) is used to drive the rotating disk (13) to rotate.

9. The semiconductor parts processing spraying equipment according to claim 1, characterized in that: The number of the trays (111) and the rotating member (12) is set to be several and arranged correspondingly. The several trays (111) are respectively arranged at different positions of the processing table (11), and the diameters of the trays (111) are different.

10. The semiconductor parts processing spraying equipment according to claim 1, characterized in that: The processing table (11) is also provided with a cooling pipe (14), one end of which is used to connect to a liquid source, and the other end of which is directed toward the semiconductor parts on the tray (111) so as to spray water mist onto the semiconductor parts.

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