A welding device for semiconductor photosensitive components

Abstract

The present invention relates to the technical field of wave soldering machines, and discloses a soldering device for semiconductor photosensitive components, including a soldering machine main body. Inside the soldering machine main body, a tin furnace is installed. Inside the tin furnace, a nozzle assembly and a filtering assembly are installed. At the top of the tin furnace, there is a top plate. At the four corners of the top plate, fixing bolts are slidably connected. The fixing bolts penetrate through the top plate and are threadedly connected to the tin furnace. At both ends of the bottom of the top plate, stoppers are fixedly connected. An annular through groove is opened at the middle position of the top plate. At the top of the top plate, a lower limit ring and an upper limit ring that match the annular through groove are fixedly connected. At the top of the top plate, a walking assembly that matches the lower limit ring and the upper limit ring is provided. At the top of the walking assembly, a tipping assembly is fixedly connected. A slag cleaning spoon is fixedly connected to the side of the tipping assembly close to the tin furnace. A discharge chute is opened at the upper end of the side wall of the tin furnace. For this soldering device for semiconductor photosensitive components, during daily cleaning of the tin slag, as long as the device is started, slag cleaning can be automatically carried out, and the entire slag cleaning process is fast and convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of wave soldering machines, and particularly to a soldering device for semiconductor photosensitive components. Background Art

[0002] Semiconductor photosensitive components, as important devices for photoelectric conversion, have an extremely fine and strict production process. During the production and manufacturing process of semiconductor photosensitive components, the soldering process is a key step to ensure their stable performance and reliable connection. This link relies on the support of professional soldering equipment. Since wave soldering machines achieve fast and uniform soldering through the contact between the molten solder wave and the component pins, effectively improving production efficiency and soldering quality, among various types of soldering equipment, wave soldering machines have become the most commonly used soldering equipment in the production of semiconductor photosensitive components.

[0003] For example, a patent with the patent authorization announcement number CN117283075B discloses a lead-free wave soldering machine for the production of emergency lighting LED lamps, including a housing. The housing is provided with a conveying member penetrating along the horizontal direction. The lead-free wave soldering machine further includes a substrate cooling assembly, an air pump, and a refrigeration mechanism. The substrate cooling assembly is arranged at the lower end of the conveying member and is used to cool the soldered substrate. The substrate cooling assembly includes an air cooling component and a cooling nozzle. The air cooling component is used to cool the substrate, and the cooling nozzle is used to cool the solder joints on the substrate. The air pump is connected to the cooling nozzle, and the air pump is used for the initial cooling of the solder joints. The refrigeration mechanism is arranged inside the lead-free wave soldering machine, and the refrigeration mechanism is connected to the cooling nozzle. The refrigeration mechanism is used to provide a cold source for the cooling nozzle, and the cold source is used for the subsequent cooling of the solder joints. This kind of lead-free wave soldering machine for the production of emergency lighting LED lamps can cool the solder joints and the substrate differently.

[0004] The wave soldering machine in the above patent still has certain defects:

[0005] During the daily operation of the wave soldering machine, to ensure smooth startup and maintain high efficiency the next day, before the end of each day's work, the solder dross inside the tin furnace is cleaned. Generally, a special solder dross spoon is used to carefully scoop out the accumulated solder dross in the tin furnace and place it properly in a specially designed solder dross bucket for subsequent processing. However, in the actual operation process, due to the design characteristics of the wave soldering machine, the space between the top of the tin furnace and the bottom of the clamping and feeding mechanism is relatively narrow, which undoubtedly brings great inconvenience to the cleaning operation and also affects the cleaning efficiency to a certain extent. Summary of the Invention

[0006] Aiming at the deficiencies of the prior art, the present invention provides a soldering device for semiconductor photosensitive components, making the daily dross cleaning of the tin furnace simpler and more convenient.

[0007] To achieve the above object, the present invention provides the following technical solution: A welding device for a semiconductor photosensitive element, including a welding machine main body. Inside the welding machine main body, a tin furnace is installed. Inside the tin furnace, a nozzle assembly and a filtering assembly are installed. The top of the tin furnace is provided with a top plate. At the four corners of the top plate, fixing bolts are slidably connected. The fixing bolts penetrate through the top plate and are threadedly connected to the tin furnace. At both ends of the bottom of the top plate, stoppers are fixedly connected. An annular through groove is opened at the middle position of the top plate. At the top of the top plate, a lower limit ring and an upper limit ring matching the annular through groove are fixedly connected. At the top of the top plate, a traveling assembly matching the lower limit ring and the upper limit ring is provided. At the top of the traveling assembly, a tilting assembly is fixedly connected. On the side of the tilting assembly close to the tin furnace, a slag cleaning spoon is fixedly connected. At the upper end of the side wall of the tin furnace, a discharge chute is opened. On the outer wall of the tin furnace, a guide pipe matching the discharge chute is fixedly connected. At the end of the guide pipe far from the tin furnace, a temporary storage and recycling assembly is installed.

[0008] Further, the traveling assembly includes a moving frame, a traveling motor, and traveling wheels. Between the lower limit ring and the upper limit ring, traveling wheels matching them are provided. On the top of the upper limit ring, a moving frame is slidably connected. On the side of the moving frame far from the tin furnace, a traveling motor is fixedly connected. The output end of the traveling motor is fixedly connected to the traveling wheel.

[0009] Further, the tilting assembly includes a rack plate, a transmission gear, a follower gear, and a limiting frame. On one side of the top plate, a rack plate is fixedly connected. On the side of the moving frame far from the tin furnace, a transmission gear is rotatably connected. On the top of the moving frame, a limiting frame is fixedly connected. At the upper end of the limiting frame, a follower gear is rotatably connected. On one side of the follower gear, a slag cleaning spoon is fixedly connected. The follower gear is meshed with the transmission gear. At the top of the slag cleaning spoon, a conduit is fixedly connected. At the bottom of the slag cleaning spoon, a reinforcing plate is fixedly connected.

[0010] Further, the temporary storage and recycling assembly includes a stirring and recycling bin, a stirring motor, a stirrer, and a gate. On the top of the stirring and recycling bin, a stirring motor is fixedly connected. Inside the stirring and recycling bin, a stirrer is rotatably connected. The output end of the stirring motor is fixedly connected to the stirrer. At the lower end of the side of the stirring and recycling bin close to the guide pipe, a gate is slidably connected.

[0011] Further, at the end of the guide pipe far from the tin furnace, a filter screen is fixedly connected. On both sides of the guide pipe, limiting frames are fixedly connected. At the end of the limiting frame far from the tin furnace, a card slot is opened. The limiting frame is matched with the stirring and recycling bin. At the lower end of the side of the stirring and recycling bin far from the guide pipe, a clamping plate is slidably connected. On the inner sides of both ends of the clamping plate, sliders are fixedly connected. On both sides of the stirring and recycling bin, sliding grooves matching the sliders are opened. At both ends of the clamping plate, limiting bolts are slidably connected. The ends of the limiting bolts penetrate through the clamping plate and the limiting frame and are threadedly connected to the stirring and recycling bin.

[0012] Further, a plug board is fixedly connected to the bottom of the stirring and recycling bin, a cross board matching the plug board is arranged between the two limiting frames, and two ends of the cross board are respectively fixedly connected to the two limiting frames.

[0013] Further, a plurality of limiting columns are slidably connected to the middle position of the gate, both ends of the limiting columns are fixedly connected to the stirring and recycling bin, a downward pressing elastic member is sleeved on the upper end of the limiting columns, the upper end of the downward pressing elastic member is fixedly connected to the stirring and recycling bin, the lower end of the downward pressing elastic member is fixedly connected to the gate, a wedge-shaped block is fixedly connected to one side of the gate close to the material guiding pipe, and an extrusion block matching the wedge-shaped block is fixedly connected to the end of the moving frame.

[0014] Further, an extrusion positioning block is slidably connected to one side of the lower end of the limiting frame close to the slag cleaning spoon, a storage cavity is formed at one end of the extrusion positioning block away from the slag cleaning spoon, an outward pushing elastic member is arranged inside the storage cavity, one end of the outward pushing elastic member is fixedly connected to the extrusion positioning block, and the other end of the outward pushing elastic member is fixedly connected to the limiting frame.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. For the welding equipment of the semiconductor photosensitive element, when cleaning the tin slag daily, as long as the walking assembly is started, the walking assembly will drive the slag cleaning spoon to move, so as to gather the tin slag into the slag cleaning spoon. After the slag cleaning spoon moves to the preset position, the dumping assembly will drive the slag cleaning spoon to rotate, so as to scoop out the gathered tin slag from the tin furnace and let the tin slag enter the temporary storage and recycling assembly for temporary storage and recycling, which is convenient for subsequent processing. The whole slag cleaning process is fast and convenient, and easy to operate.

[0017] 2. For the welding equipment of the semiconductor photosensitive element, when the walking assembly is close to the temporary storage and recycling assembly and the transmission gear has not contacted the rack plate, the extrusion block will first contact the wedge-shaped block, so as to open the gate of the temporary storage and recycling assembly, so that the internal solder can return to the tin furnace through the material guiding pipe, reducing the waste of solder.

[0018] 3. For the welding equipment of the semiconductor photosensitive element, after the slag cleaning spoon dumps the tin slag, it will fall back into the tin furnace by gravity. During the falling process of the slag cleaning spoon, the extrusion positioning block will extrude the slag cleaning spoon, so as to reduce the falling speed of the slag cleaning spoon and avoid the solder splashing caused by the too fast falling speed of the slag cleaning spoon. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is the structural schematic diagram of the whole of the present invention;

[0020] Figure 2 is the structural schematic diagram of the tin furnace of the present invention;

[0021] Figure 3Schematic diagram of the structure of the tin furnace and the stirring recovery bin of the present invention;

[0022] Figure 4 Schematic diagram of the structure of the top plate of the present invention;

[0023] Figure 5 For the present invention Figure 4 Partial enlarged schematic diagram of part A in

[0024] Figure 6 Schematic diagram of the connection structure between the material guide pipe and the stirring recovery bin of the present invention;

[0025] Figure 7 Bottom view of the material guide pipe and the stirring recovery bin of the present invention;

[0026] Figure 8 Partial cross-sectional view of the material guide pipe and the stirring recovery bin of the present invention;

[0027] Figure 9 Schematic diagram of the connection structure between the moving frame and the slag cleaning spoon of the present invention;

[0028] Figure 10 For the present invention Figure 9 Partial enlarged schematic diagram of part B in

[0029] In the figure: 1. Welding machine main body; 2. Tin furnace; 3. Top plate; 4. Fixed bolt; 5. Stopper; 6. Lower limit ring; 7. Upper limit ring; 8. Rack plate; 9. Moving frame; 10. Traveling motor; 11. Traveling wheel; 12. Driving gear; 13. Follow-up gear; 14. Limit frame; 15. Slag cleaning spoon; 16. Reinforcing plate; 17. Duct; 18. Extrusion positioning block; 19. Storage cavity; 20. Outer pushing elastic member; 21. Extrusion block; 22. Discharge groove; 23. Material guide pipe; 24. Filter screen; 25. Limit frame; 26. Cross plate; 27. Card slot; 28. Stirring recovery bin; 29. Slide groove; 30. Slide block; 31. Card plate; 32. Limit bolt; 33. Stirring motor; 34. Stirrer; 35. Limit column; 36. Lower pressing elastic member; 37. Gate; 38. Wedge block; 39. Insertion plate. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0031] Please refer to Figures 1 to 10, A soldering device for semiconductor photosensitive components, including a soldering machine main body 1. Inside the soldering machine main body 1, there is a tin furnace 2. Inside the tin furnace 2, there are a nozzle assembly and a filtering assembly. At the top of the tin furnace 2, there is a top plate 3. At the four corners of the top plate 3, there are sliding connection fixing bolts 4. The fixing bolts 4 penetrate through the top plate 3 and are threadedly connected to the tin furnace 2. At both ends of the bottom of the top plate 3, there are fixed stoppers 5. At the middle position of the top plate 3, there is an annular through groove. At the top of the top plate 3, there are a lower limit ring 6 and an upper limit ring 7 that match the annular through groove. On the top of the top plate 3, there is a walking assembly that matches the lower limit ring 6 and the upper limit ring 7. At the top of the walking assembly, there is a tipping assembly. On the side of the tipping assembly close to the tin furnace 2, there is a slag cleaning spoon 15. At the upper end of the side wall of the tin furnace 2, there is a discharge slot 22. On the outer wall of the tin furnace 2, there is a guide pipe 23 that matches the discharge slot 22. At the end of the guide pipe 23 far from the tin furnace 2, there is a temporary storage and recycling assembly.

[0032] In the soldering device for semiconductor photosensitive components of the present invention, when cleaning the tin slag inside the tin furnace 2 daily, as long as the walking assembly is started, the walking assembly will drive the slag cleaning spoon 15 to move along the edge of the annular through groove, so as to gather the tin slag into the slag cleaning spoon 15. After the slag cleaning spoon 15 moves to a preset position (i.e., the position where the temporary storage and recycling assembly is located), the tipping assembly will drive the slag cleaning spoon 15 to rotate, so as to scoop out the tin slag gathered in the slag cleaning spoon 15 from the tin furnace 2 and let the tin slag fall into the temporary storage and recycling assembly for temporary storage treatment, which is convenient for subsequent processing. And the slag cleaning spoon 15 can continue to move in the next circle until the tin slag content in the tin furnace 2 is reduced to a certain range, so that the soldering machine main body 1 can be smoothly started and maintain high efficiency the next day, and then the device is turned off. The whole slag cleaning process is fast, convenient and easy to operate. In addition, the internal structures of the soldering machine main body 1 and the tin furnace 2 in the present invention are similar to those of a lead-free wave soldering machine structure for emergency lighting LED lamp production disclosed in a patent with a patent authorization announcement number of CN117283075B, so no more elaboration will be made here.

[0033] As a preferred technical solution of the present invention, the walking assembly includes a moving frame 9, a walking motor 10 and walking wheels 11. Between the lower limit ring 6 and the upper limit ring 7, there are walking wheels 11 that match them. On the top of the upper limit ring 7, there is a sliding connection moving frame 9. On the side of the moving frame 9 far from the tin furnace 2, there is a walking motor 10. The output end of the walking motor 10 is fixedly connected to the walking wheels 11.

[0034] Specifically, when the slag cleaning spoon 15 needs to move along the annular through groove in the middle position of the top plate 3, only the walking motor 10 needs to be started. The walking motor 10 will drive the walking wheels 11 to rotate between the lower limit ring 6 and the upper limit ring 7, thereby driving the moving frame 9 to move. In addition, the walking motor 10 is powered by a storage battery, and the storage battery can be installed on the moving frame 9. Since this power supply method belongs to the existing mature technology and the storage battery is also an existing mature product, no further elaboration will be made here.

[0035] As a preferred technical solution of the present invention, the dumping assembly includes a rack plate 8, a transmission gear 12, a follower gear 13 and a limit frame 14. A rack plate 8 is fixedly connected to one side of the top plate 3. A transmission gear 12 is rotatably connected to the side of the moving frame 9 away from the tin furnace 2. A limit frame 14 is fixedly connected to the top of the moving frame 9. The upper end of the limit frame 14 is rotatably connected to a follower gear 13. One side of the follower gear 13 is fixedly connected to the slag cleaning spoon 15. The follower gear 13 is meshed with the transmission gear 12. A conduit 17 is fixedly connected to the top of the slag cleaning spoon 15. A reinforcing plate 16 is fixedly connected to the bottom of the slag cleaning spoon 15.

[0036] Specifically, when the moving frame 9 approaches the rack plate 8, the transmission gear 12 will be meshed with the rack plate 8. During the movement of the moving frame 9, the rack plate 8 will push the transmission gear 12 to rotate, and the transmission gear 12 will then push the follower gear 13 to rotate. Then, the follower gear 13 will drive the slag cleaning spoon 15 to rotate in the moving direction of the moving frame 9, so as to scoop up the tin slag inside the tin furnace 2. The scooped-up tin slag will fall into the temporary storage and recovery assembly through the conduit 17 for temporary storage treatment. In addition, after the moving frame 9 moves away from the rack plate 8, the transmission gear 12 will lose the push and restriction of the rack plate 8, and the transmission gear 12 will no longer be able to push and restrict the follower gear 13. The slag cleaning spoon 15 fixedly connected to the follower gear 13 will also lose the restriction. At this time, the slag cleaning spoon 15 will rotate under the action of gravity until it returns to its original position. The reinforcing plate 16 can not only reinforce and protect the slag cleaning spoon 15, but also increase the weight of the lower end of the slag cleaning spoon 15, making it easier for the slag cleaning spoon 15 to return to its original position.

[0037] As a preferred technical solution of the present invention, the temporary storage and recovery assembly includes a stirring and recovery bin 28, a stirring motor 33, a stirrer 34 and a gate 37. A stirring motor 33 is fixedly connected to the top of the stirring and recovery bin 28. A stirrer 34 is rotatably connected to the inside of the stirring and recovery bin 28. The output end of the stirring motor 33 is fixedly connected to the stirrer 34. A gate 37 is slidably connected to the lower end of the stirring and recovery bin 28 near the guide pipe 23.

[0038] As a preferred technical solution of the present invention, a filter screen 24 is fixedly connected to the end of the material guiding pipe 23 far away from the tin furnace 2. Limit frames 25 are fixedly connected to both sides of the material guiding pipe 23. A clamping groove 27 is formed at the end of the limit frame 25 far away from the tin furnace 2. The limit frame 25 is matched with the stirring and recycling bin 28. A clamping plate 31 is slidably connected to the lower end of the side of the stirring and recycling bin 28 far away from the material guiding pipe 23. Sliders 30 are fixedly connected to the inner sides of both ends of the clamping plate 31. Sliding grooves 29 matched with the sliders 30 are formed on both sides of the stirring and recycling bin 28. Both ends of the clamping plate 31 are slidably connected with limit bolts 32. The end parts of the limit bolts 32 penetrate through the clamping plate 31 and the limit frame 25 and are threadedly connected with the stirring and recycling bin 28.

[0039] Specifically, when installing the stirring and recycling bin 28, only need to place the stirring and recycling bin 28 on the limit frame 25, then push the stirring and recycling bin 28 until the clamping plate 31 is aligned with the clamping groove 27 on the limit frame 25, then push the clamping plate 31 into the clamping groove 27, and tighten the limit bolts 32. The installation process is simple and convenient; in addition, after the slag cleaning spoon 15 pours the tin slag and part of the solder into the stirring and recycling bin 28, the stirring motor 33 will drive the stirrer 34 to stir the solder and the tin slag, so that the solder particles wrapped in the tin slag are remelted into other liquid solder and finally precipitate to the bottom of the stirring and recycling bin 28. Then open the gate 37, and the liquid solder will flow back into the tin furnace 2 through the filter screen 24, while the tin slag will be intercepted for subsequent treatment.

[0040] As a preferred technical solution of the present invention, a plug board 39 is fixedly connected to the bottom of the stirring and recycling bin 28. A cross board 26 matched with the plug board 39 is arranged between the two limit frames 25. Both ends of the cross board 26 are fixedly connected with the two limit frames 25 respectively.

[0041] Specifically, the plug board 39 will be hooked on the cross board 26, thereby restricting the stirring and recycling bin 28 and making the connection between the stirring and recycling bin 28 and the limit frame 25 more stable.

[0042] As a preferred technical solution of the present invention, a plurality of limit columns 35 are slidably connected to the middle position of the gate 37. Both ends of the limit columns 35 are fixedly connected with the stirring and recycling bin 28. A downward pressing elastic member 36 is sleeved on the upper end of the limit column 35. The upper end of the downward pressing elastic member 36 is fixedly connected with the stirring and recycling bin 28, and the lower end of the downward pressing elastic member 36 is fixedly connected with the gate 37. A wedge-shaped block 38 is fixedly connected to the side of the gate 37 close to the material guiding pipe 23. An extrusion block 21 matched with the wedge-shaped block 38 is fixedly connected to the end of the moving frame 9.

[0043] Specifically, before the moving frame 9 approaches the rack plate 8 but the transmission gear 12 has not yet contacted the rack plate 8, the extrusion block 21 will first contact the wedge block 38, and during the movement of the moving frame 9, the wedge block 38 will be extruded and pushed upward. The wedge block 38 will drive the gate 37 to move upward. After the gate 37 is opened, the solder in the stirring and recycling bin 28 can return to the tin furnace 2 through the material guiding pipe 23. When the transmission gear 12 on the moving frame 9 contacts the rack plate 8, the extrusion block 21 has already passed over the wedge block 38. Under the action of the downward pressing elastic member 36, the gate 37 will fall back to its original position.

[0044] As a preferred technical solution of the present invention, an extrusion positioning block 18 is slidably connected to one side of the lower end of the limit frame 14 close to the slag cleaning spoon 15. A receiving cavity 19 is formed at one end of the extrusion positioning block 18 away from the slag cleaning spoon 15. An outward pushing elastic member 20 is provided inside the receiving cavity 19. One end of the outward pushing elastic member 20 is fixedly connected to the extrusion positioning block 18, and the other end of the outward pushing elastic member 20 is fixedly connected to the limit frame 14.

[0045] Specifically, after the transmission gear 12 disengages from the rack plate 8 and during the downward movement of the slag cleaning spoon 15, the slag cleaning spoon 15 will first contact the extrusion positioning block 18. Since the extrusion positioning block 18 is pushed outward by the outward pushing elastic member 20, there will be a large sliding friction force between the extrusion positioning block 18 and the slag cleaning spoon 15 to hinder the downward movement of the slag cleaning spoon 15. However, since the total gravity of the slag cleaning spoon 15 and the reinforcement plate 16 is greater than the sliding friction force, the slag cleaning spoon 15 can still rotate downward, but the rotation speed will decrease. In this way, when the slag cleaning spoon 15 contacts the solder in the tin furnace 2, the solder will not splash due to excessive impact force, reducing the waste of solder. In addition, the extrusion positioning block 18 will also limit the position of the slag cleaning spoon 15. In this way, during the movement of the moving frame 9, even if the slag cleaning spoon 15 is pushed and blocked by the solder, the slag cleaning spoon 15 will not rotate in the opposite direction of the movement direction of the moving frame 9.

[0046] It should be noted that: The nozzle assembly and the filtering assembly inside the tin furnace 2 of the present invention are both existing mature products. In the present invention, only the outer shell shapes of the nozzle assembly and the filtering assembly will be changed to be annular, the same as the annular through groove in the middle position of the top plate 3, so as to facilitate the movement of the slag cleaning spoon 15. The internal structures of the nozzle assembly and the filtering assembly have not been changed at all, so no detailed description will be made here.

[0047] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention.

Claims

1. A semiconductor photosensitive element welding device, comprising a welding machine body (1), a tin furnace (2) installed inside the welding machine body (1), a nozzle assembly and a filter assembly installed inside the tin furnace (2), characterized in that: The top of the tin furnace (2) is provided with a top plate (3), and the four corners of the top plate (3) are slidably connected with fixing bolts (4), and the fixing bolts (4) penetrate the top plate (3) and are threadedly connected to the tin furnace (2), and both ends of the bottom of the top plate (3) are fixedly connected with stoppers (5), and an annular through groove is opened in the middle of the top plate (3), and a lower limit ring (6) and an upper limit ring (7) matching the annular through groove are fixedly connected to the top of the top plate (3), and the top of the top plate (3) is provided with a plurality of stoppers (5). A walking assembly matching with a lower limit ring (6) and an upper limit ring (7) is provided at the top, a dumping assembly is fixedly connected to the top of the walking assembly, a slag cleaning spoon (15) is fixedly connected to the side of the dumping assembly close to the tin furnace (2), a discharge groove (22) is provided at the upper end of the side wall of the tin furnace (2), a guide pipe (23) matching with the discharge groove (22) is fixedly connected to the outer wall of the tin furnace (2), and a temporary storage recovery assembly is installed at the end of the guide pipe (23) away from the tin furnace (2); The travel assembly comprises a moving frame (9), a travel motor (10) and a travel wheel (11); a travel wheel (11) matching the lower limit ring (6) and the upper limit ring (7) is provided between the lower limit ring (6) and the upper limit ring (7); the top of the upper limit ring (7) is slidably connected to the moving frame (9); the side of the moving frame (9) away from the tin furnace (2) is fixedly connected to the travel motor (10); and the output end of the travel motor (10) is fixedly connected to the travel wheel (11); The tipping assembly comprises a rack plate (8), a transmission gear (12), a follower gear (13) and a limit frame (14); one side of the top plate (3) is fixedly connected to the rack plate (8); the side of the moving frame (9) away from the tin furnace (2) is rotatably connected to the transmission gear (12); the top of the moving frame (9) is fixedly connected to the limit frame (14); the upper end of the limit frame (14) is rotatably connected to the follower gear (13); one side of the follower gear (13) is fixedly connected to a slag cleaning spoon (15); the follower gear (13) is meshed with the transmission gear (12); the top of the slag cleaning spoon (15) is fixedly connected to a guide tube (17); and the bottom of the slag cleaning spoon (15) is fixedly connected to a reinforcing plate (16).

2. The semiconductor photosensitive element welding device according to claim 1, characterized in that: The temporary storage recovery component comprises a stirring recovery bin (28), a stirring motor (33), an agitator (34) and a gate (37); the stirring motor (33) is fixedly connected to the top of the stirring recovery bin (28); the agitator (34) is rotatably connected to the interior of the stirring recovery bin (28); the output end of the stirring motor (33) is fixedly connected to the agitator (34); and the gate (37) is slidably connected to the lower end of the stirring recovery bin (28) on a side close to the material guide pipe (23).

3. The semiconductor photosensitive element welding device according to claim 2, characterized in that: The end of the material guide tube (23) away from the tin furnace (2) is fixedly connected to a filter screen (24), and both sides of the material guide tube (23) are fixedly connected to a limit frame (25), and the end of the limit frame (25) away from the tin furnace (2) is provided with a slot (27), and the limit frame (25) matches the stirring recovery bin (28), and the lower end of the stirring recovery bin (28) away from the material guide tube (23) is slidably connected to a clamping plate (31), and the inner sides of both ends of the clamping plate (31) are fixedly connected to sliders (30), and both sides of the stirring recovery bin (28) are provided with sliding grooves (29) matching the sliders (30), and both ends of the clamping plate (31) are slidably connected to limit bolts (32), and the ends of the limit bolts (32) pass through the clamping plate (31) and the limit frame (25) and are threadedly connected to the stirring recovery bin (28).

4. The semiconductor photosensitive element welding device according to claim 3, characterized in that: A plug plate (39) is fixedly connected to the bottom of the mixing recovery bin (28), a transverse plate (26) matching the plug plate (39) is provided between the two limit frames (25), and two ends of the transverse plate (26) are respectively fixedly connected to the two limit frames (25).

5. The semiconductor photosensitive element welding device according to claim 2, characterized in that: A plurality of limit columns (35) are slidably connected to the middle position of the gate (37), both ends of the limit columns (35) are fixedly connected to the stirring recovery bin (28), the upper end of the limit column (35) is sleeved with a downward pressing elastic member (36), the upper end of the downward pressing elastic member (36) is fixedly connected to the stirring recovery bin (28), the lower end of the downward pressing elastic member (36) is fixedly connected to the gate (37), a wedge block (38) is fixedly connected to one side of the gate (37) close to the material guide pipe (23), and an extrusion block (21) matching the wedge block (38) is fixedly connected to the end of the movable frame (9).

6. The semiconductor photosensitive element welding device according to claim 1, characterized in that: An extrusion positioning block (18) is slidably connected to a side of the lower end of the limiting frame (14) close to the slag cleaning spoon (15); a storage cavity (19) is provided at one end of the extrusion positioning block (18) away from the slag cleaning spoon (15); an outward push elastic member (20) is provided inside the storage cavity (19); one end of the outward push elastic member (20) is fixedly connected to the extrusion positioning block (18), and the other end of the outward push elastic member (20) is fixedly connected to the limiting frame (14).

Images