Intelligent preparation device and preparation process for semiconductor solder paste

Abstract

The invention discloses an intelligent preparation device and preparation process of semiconductor solder paste, which comprises the following steps: firstly, preparing raw materials to ensure the weight accuracy of each raw material, emulsifying the raw materials to ensure the sufficient dissolution of the materials, then vacuumizing and defoaming to ensure the stability and uniformity of the solder paste body, and grinding the paste body to obtain the semiconductor solder paste. The method comprises the following steps: grinding a solder paste body, filtering the solder paste body before grinding to remove possible impurities, then detecting and packaging, sampling the solder paste body to detect the viscosity, transferring the solder paste body into paste packaging after the solder paste body is qualified, and continuously grinding the solder paste body if the solder paste body is unqualified for multiple times until the solder paste body is qualified, so that the viscosity stability of the solder paste is improved, and the solder paste is ensured to show good fluidity in the welding process; according to the invention, uniform distribution of solder paste components is ensured, the fineness and uniformity of the solder paste can be improved, possible impurities can be removed, the purity of the solder paste is further improved, the welding quality is improved, the production efficiency is improved, the grinding frequency and the detection time are reduced, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of solder paste preparation, and more specifically, to an intelligent preparation device and preparation process for semiconductor solder paste. Background Art

[0002] Solder paste is a new type of material that came into being at the historic moment. It is a paste-like mixture formed by mixing solder powder and other materials. It is mainly used for welding PCB, capacitors, etc. in the SMT industry. With the rapid development of the electronics manufacturing industry, the requirements for welding materials are getting higher and higher. Solder paste is an important material for welding electronic components, and its performance directly affects the welding quality and product reliability.

[0003] At present, the common solder paste preparation processes on the market mainly include chemical synthesis, physical mixing and emulsification. These methods have their own advantages and disadvantages, but they generally have problems such as unstable viscosity and uneven composition, which makes it difficult to ensure the welding quality. The existing solder paste preparation device does not have a circulating grinding device. Although it can prepare solder paste of a certain quality, it still has shortcomings in viscosity stability, component uniformity and production efficiency. In addition, the emulsifier structure of the emulsifier does not have a heating and cooling device as well as a vacuum and ultrasonic stirring device, which cannot guarantee the stability and uniformity of the solder paste and the fineness of the solder paste.

[0004] Therefore, in order to solve the above problems, an intelligent preparation device and preparation process of semiconductor solder paste are proposed. Summary of the invention

[0005] In order to improve the above problems, the present application provides an intelligent preparation device and preparation process for semiconductor solder paste.

[0006] The present application provides an intelligent preparation device for semiconductor solder paste, which adopts the following technical solutions: An intelligent preparation device for semiconductor solder paste, comprising an emulsifier and an emulsifier barrel, a cold and hot unit and a grinder, wherein the emulsifier comprises an emulsifier barrel cover and an intelligent operation host, a vacuum pump is connected to the top of the intelligent operation host, the emulsifier barrel cover is connected to the bottom of one end of the vacuum pump, and the vacuum pump is connected to the emulsifier barrel cover through a pipeline, and the emulsifier barrel is arranged at the bottom of the emulsifier barrel cover; Among them, a cold and hot unit is arranged on one side of the emulsifying barrel, the grinder is arranged on the side of the emulsifying barrel away from the cold and hot unit, a vibrating feed hopper is arranged on the top of the grinder, and a discharge box is connected to the bottom of the grinder, a spiral loading tower is connected to the top of the discharge box, and a storage barrel is arranged on the side of the grinder away from the emulsifying machine.

[0007] Preferably, a feeding pump is connected between the storage barrel and the discharge box, and the bottom of the emulsification barrel is connected to a paste transfer pump, one side of the paste transfer pump is connected to a pumping pipe, and one end of the pumping pipe is connected to a vibrating feed hopper.

[0008] Preferably, a water storage tank is arranged between the cold and hot unit and the emulsification barrel, two groups of circulating water pipes are connected between the water storage tank and the emulsification barrel, the emulsification barrel comprises an outer barrel and an inner barrel, and hot and cold water pipes are coiled between the outer barrel and the inner barrel, both ends of the hot and cold water pipes are respectively connected to the two groups of circulating water pipes, and a temperature sensor probe is connected to the inner wall of the inner barrel.

[0009] Preferably, an ultrasonic vibration chassis is connected below the vibrating feed hopper, a fixed connecting frame is connected between the ultrasonic vibration chassis and the grinder, an ultrasonic wave generator is arranged in the ultrasonic vibration chassis, and an ultrasonic vibration rod is connected to the top of the ultrasonic wave generator.

[0010] Preferably, a feed pipe is provided at the bottom of the vibrating feed hopper, and one end of the feed pipe extends into the grinder, and a grinding assembly and a grinding disc are sequentially arranged in the grinder from top to bottom, and a grinding roller is arranged on the top of the grinding disc.

[0011] Preferably, the grinding assembly comprises a grinding machine box and a plurality of groups of grinding rollers, a grinding discharge port is provided in the grinding assembly, a plurality of groups of grinding roller arrays are arranged in the grinding discharge port, and a transmission shaft is provided in the grinding rollers.

[0012] Preferably, two groups of grinding motors are arranged in the grinding machine box, and the output shafts of the two groups of grinding motors are respectively connected to two upper and lower adjacent transmission shafts, and a transmission belt is connected between the two adjacent transmission shafts.

[0013] Preferably, a circulating material pipe is connected between the spiral feeding tower and the vibrating feed hopper, and a feeding motor is connected to the top of the spiral feeding tower, a feeding transmission rod is connected to the output shaft of the feeding motor, and a spiral feeding plate is connected to the outer side of the feeding transmission rod.

[0014] Preferably, an electric partition plate is provided on the top inner wall of the discharge box, and a partition motor is connected to one side of the electric partition plate, a feeding slide is connected to the bottom inner wall of the discharge box, and the bottom end of the feeding slide extends to the bottom of the loading transmission rod, and a splash guard is provided above the feeding slide.

[0015] On the other hand, the present application provides a process for preparing a semiconductor solder paste, the preparation process comprising the following steps: Step 1, raw material preparation: 30-40 parts by weight of KG-604 rosin, 25-30 parts by weight of AXE rosin, 20-30 parts by weight of diethylene glycol butyl ether, 8-12 parts by weight of diethylene glycol methyl ether, 0.8-1.2 parts by weight of sebacic acid, 1.5-2.5 parts by weight of suberic acid, 0.3-0.8 parts by weight of benzotriazole, and 0.3-0.8 parts by weight of triethanolamine; Step 2, emulsification of raw materials: grab the corresponding chemical raw materials according to the standard dosage, weigh them, ensure the weight of each raw material is accurate, and set the emulsification process and subsequent steps through the intelligent operation host according to the processing procedure, put all the materials into the emulsification barrel of the emulsifier, ensure that the materials are fully added, and then start the emulsifier to heat and stir to dissolve, the duration is not less than 30 minutes, to ensure that the materials are fully dissolved; Step 3, vacuum degassing: After the emulsification work is completed, the emulsification barrel is cooled and vacuumed according to the setting of the step program of step 2 to completely remove the bubbles in the paste, and then stirred again in the emulsification barrel to ensure the stability and uniformity of the solder paste; Step 4, paste grinding: after the stirring is completed, according to the step program setting of step 2, the solder paste is moved into the grinder through the paste transfer pump for multiple automatic grindings, and each grinding time is not less than 10 minutes, and the solder paste is filtered before grinding to remove the existing impurities; Step 5, test packaging: Take samples of solder paste to test viscosity, and transfer to paste packaging if qualified. Take samples for testing after grinding twice more until the viscosity reaches the standard value of 180±10%PA.S.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: 1. Compared with the prior art, this intelligent preparation device for semiconductor solder paste improves the viscosity stability of the solder paste and ensures that it exhibits good fluidity during the welding process. The emulsifier heats and stirs to dissolve. When emulsification is carried out in the emulsification barrel, the hot and cold units heat through hot and cold water pipes to assist in the emulsification work, which lasts for not less than minutes to ensure that the material is fully dissolved. The material is fully dissolved by heating and stirring to form a uniform emulsified system.

[0017] 2. Compared with the prior art, the intelligent preparation device of semiconductor solder paste ensures the uniform distribution of solder paste components and improves the welding quality. After the emulsification barrel completes the emulsification work, the cold and hot water pipes are used for cooling by the cold and hot water units, and the emulsification barrel is evacuated by the vacuum machine to remove the bubbles in the solder paste, further improving the stability and uniformity of the solder paste. After the bubbles are removed, the solder paste is stirred again in the emulsification barrel, and the solder paste entering the vibrating feed hopper is further improved in fineness and uniformity by ultrasonic oscillation. The ultrasonic generator in the ultrasonic vibration chassis acts on the ultrasonic vibration rod, and the ultrasonic vibration rod acts on the solder paste through ultrasonic waves.

[0018] 3. Compared with the prior art, the intelligent preparation device for semiconductor solder paste sets the corresponding operation program for the intelligent operation host 13 through automated production and processing of the quality of emulsified materials, and the intelligent operation host 13 automatically controls the emulsification grinding and vacuum degassing in a wired or wireless manner, thereby improving production efficiency, reducing the number of grinding times and detection time, and reducing production costs. The solder paste that has been stirred again is added to the grinder through a vibrating feed hopper for grinding, and the grinding component performs the initial grinding, and the solder paste is finely ground again on the grinding disc through a grinding roller, and the solder paste in the discharge box is separated by an electric partition plate, thereby realizing the circulation of the solder paste. Transportation and storage work, when circulating grinding is carried out, one end of the electric partition plate is against the feeding slide plate, and at this time the electric partition plate guides the falling solder paste to the spiral feeding tower, and the solder paste transported to the top of the spiral feeding tower is returned to the vibrating feed hopper through the circulating material pipe for re-grinding, and the number of cyclic grinding is not less than three times, and when the solder paste is ground to the standard, the feeding slide plate is driven by the partition motor to rotate, so that the feeding slide plate is away from the feeding slide plate, and the solder paste falls vertically to the bottom of the discharge box under the action of gravity, and at this time the splash guard is used to prevent the fallen solder paste from splashing to one side of the spiral feeding tower, and the solder paste that falls to the bottom of the discharge box is transported to the storage barrel for storage by the feeding pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of the flow chart of this application; Figure 2 A schematic diagram of the structure of the main body of this application; Figure 3 This is a schematic structural diagram of the side section of the emulsification barrel of the present application; Figure 4 This is a schematic diagram of the structure of the grinding machine of this application; Figure 5 This is a schematic structural diagram of the side section of the vibrating feed hopper of the present application; Figure 6It is a schematic structural diagram of the side section of the grinding machine of the present application; Figure 7 This is a schematic diagram of the structure of the grinding assembly of the present application from a top view; Figure 8 This is a schematic structural diagram of the side section of the material box of the present application; Fig. 9 This is a schematic diagram of the structure of the electric partition plate of this application.

[0020] The accompanying drawings are marked as follows: 1. emulsifier; 11. emulsifier barrel cover; 12. vacuum pump; 13. intelligent operation host; 14. paste transfer pump; 141. pump pipe; 2. emulsifier barrel; 21. outer cylinder; 22. inner cylinder; 23. hot and cold water pipes; 24. temperature sensor probe; 3. hot and cold units; 31. water storage tank; 311. circulating water pipe; 4. grinder; 41. vibrating feed hopper; 411. discharge pipe; 42. discharge box; 421. feeding slide plate; 422. partition motor; 423. electric partition plate; 424. splash guard ; 43. Spiral feeding tower; 431. Feeding motor; 432. Circulating material pipe; 433. Feeding transmission rod; 434. Spiral feeding plate; 44. Ultrasonic vibration chassis; 441. Fixed connecting frame; 442. Ultrasonic generator; 443. Ultrasonic vibration rod; 45. Grinding assembly; 451. Grinding chassis; 452. Grinding motor; 453. Grinding roller; 4531. Drive shaft; 4532. Drive belt; 454. Grinding discharge port; 46. Grinding disc; 461. Grinding roller; 5. Storage barrel; 51. Feeding pump. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] The following is combined with Figure 1 -Attached Fig. 9 , further details of this application are given.

[0023] Embodiment 1: An intelligent preparation device for semiconductor solder paste, referring to Figure 1 , including an emulsifier 1 and an emulsifier barrel 2, a cold and hot unit 3 and a grinder 4, the emulsifier 1 includes an emulsifier barrel cover 11 and an intelligent operation host 13, the top of the intelligent operation host 13 is connected with a vacuum pump 12, the emulsifier barrel cover 11 is connected to the bottom of one end of the vacuum pump 12, and the vacuum pump 12 is connected to the emulsifier barrel cover 11 through a pipeline, and the emulsifier barrel 2 is arranged at the bottom of the emulsifier barrel cover 11; Among them, a cold and hot unit 3 is arranged on one side of the emulsification barrel 2, a grinder 4 is arranged on the side of the emulsification barrel 2 away from the cold and hot unit 3, a vibrating feed hopper 41 is arranged on the top of the grinder 4, and a discharge box 42 is connected to the bottom of the grinder 4, a spiral loading tower 43 is connected to the top of the discharge box 42, and a storage barrel 5 is arranged on the side of the grinder 4 away from the emulsifier 1; the quality of the processed emulsified material can be used to set the corresponding operation program for the intelligent operation host 13, and the intelligent operation host 13 automatically controls the emulsification grinding and vacuum degassing in a wired or wireless manner, the emulsifier 1 is used for stirring and emulsifying the solder paste raw materials, and the bottom of the emulsification barrel cover 11 is connected to an electric component for stirring, shearing and emulsification, and the emulsifier 1 drives the components connected to the emulsification barrel cover 11 to stir and emulsify the solder paste raw materials in the emulsification barrel 2, and the solder paste raw materials that need to be processed into solder paste or the processed solder paste raw materials The solder paste is placed in the inner cylinder 22 of the emulsifying barrel 2, and the water storage tank 31 contains liquid water for heating or cooling, and the water in the water storage tank 31 is cooled or heated by the cold and hot water unit 3. The water in the water storage tank 31 is transported by the circulating water pipe 311 to the cold and hot water pipe 23 inside the outer cylinder 21 to heat or cool the solder paste raw material or solder paste in the inner cylinder 22. When the emulsification work is carried out in the emulsifying barrel 2, the cold and hot water unit 3 performs heating work through the cold and hot water pipe 23 to assist in the emulsification work, and the materials are fully dissolved by heating and stirring to form a uniform emulsified system. After the emulsification work of the emulsifying barrel 2 is completed, the cold and hot water unit 3 performs cooling work through the cold and hot water pipe 23, and the emulsification barrel 2 is vacuumed by the vacuum pump 12, so as to remove bubbles in the solder paste, further improve the stability and uniformity of the solder paste, and after the bubbles are removed, stir again in the emulsifying barrel 2.

[0024] Reference Figure 1 A feeding pump 51 is connected between the storage barrel 5 and the discharge box 42, and the bottom of the emulsification barrel 2 is connected to the paste transfer pump 14, one side of the paste transfer pump 14 is connected to a pumping pipe 141, and one end of the pumping pipe 141 is connected to the vibrating feed hopper 41; the material after emulsification in the emulsification barrel 2 is sent into the vibrating feed hopper 41 through the paste transfer pump 14 and the pumping pipe 141, and the solder paste in the discharge box 42 is transported to the storage barrel 5 by the feeding pump 51 for storage.

[0025] Reference Figure 2 and Figure 4A water storage tank 31 is arranged between the cold and hot unit 3 and the emulsifying barrel 2, two groups of circulating water pipes 311 are connected between the water storage tank 31 and the emulsifying barrel 2, the emulsifying barrel 2 comprises an outer barrel 21 and an inner barrel 22, and a hot and cold water pipe 23 is coiled between the outer barrel 21 and the inner barrel 22, both ends of the hot and cold water pipe 23 are respectively connected to the two groups of circulating water pipes 311, and a temperature sensing probe 24 is connected to the inner wall of the inner barrel 22; the material is put into the inner barrel 22 for processing, the cold and hot unit 3 heats or cools the water in the water storage tank 31, and the hot and cold water in the water storage tank 31 enters the hot and cold water pipe 23 through the circulating water pipe 311, and heats or cools the inner barrel 22 through the hot and cold water pipe 23, and the temperature in the inner barrel 22 is monitored in real time by the temperature sensing probe 24, and the heating or cooling work of the cold and hot unit 3 is adjusted in real time according to the monitored temperature.

[0026] Reference Figure 4 and Figure 5 An ultrasonic vibration machine box 44 is connected to the bottom of the vibration feed hopper 41, a fixed connecting frame 441 is connected between the ultrasonic vibration machine box 44 and the grinder 4, an ultrasonic wave generator 442 is arranged in the ultrasonic vibration machine box 44, and an ultrasonic vibration rod 443 is connected to the top of the ultrasonic wave generator 442; the ultrasonic vibration machine box 44 and the vibration feed hopper 41 are connected to the grinder 4 through the fixed connecting frame 441, and the solder paste entering the vibration feed hopper 41 is further improved in fineness and uniformity of the solder paste through ultrasonic oscillation, and the ultrasonic wave generator 442 in the ultrasonic vibration machine box 44 acts on the ultrasonic vibration rod 443, and the ultrasonic vibration rod 443 acts on the solder paste through ultrasonic waves.

[0027] Reference Figure 5 and Figure 6 A discharge pipe 411 is provided at the bottom of the vibrating feed hopper 41, and one end of the discharge pipe 411 extends into the grinder 4, in which a grinding assembly 45 and a grinding disc 46 are sequentially provided from top to bottom, and a grinding roller 461 is provided on the top of the grinding disc 46; the solder paste in the vibrating feed hopper 41 enters the grinder 4 through the discharge pipe 411 for grinding, and is initially ground by the grinding assembly 45, and the solder paste is finely ground again on the grinding disc 46 by the grinding roller 461.

[0028] Reference Figure 6 and Figure 7 The grinding assembly 45 includes a grinding machine box 451 and multiple groups of grinding rollers 453. A grinding discharge port 454 is provided in the grinding assembly 45. The multiple groups of grinding rollers 453 are arranged in an array in the grinding discharge port 454. A transmission shaft 4531 is provided in the grinding rollers 453. The solder paste first falls into the grinding discharge port 454 and is squeezed and ground by the multiple groups of grinding rollers 453.

[0029] Reference Figure 7Two groups of grinding motors 452 are arranged in the grinding machine box 451, and the output shafts of the two groups of grinding motors 452 are respectively connected to the upper and lower adjacent transmission shafts 4531, and a transmission belt 4532 is connected between the two adjacent transmission shafts 4531; the grinding motor 452 in the grinding machine box 451 drives the grinding roller 453 to rotate through the transmission shaft 4531, and the grinding roller 453 drives other grinding rollers 453 to rotate and grind through the transmission belt 4532 during the rotation process.

[0030] Reference Figure 8 A circulating material pipe 432 is connected between the spiral feeding tower 43 and the vibrating feeding hopper 41, and a feeding motor 431 is connected to the top of the spiral feeding tower 43, a feeding transmission rod 433 is connected to the output shaft of the feeding motor 431, and a spiral feeding plate 434 is connected to the outer side of the feeding transmission rod 433; the feeding transmission rod 433 is driven by the feeding motor 431 to rotate, and the feeding transmission rod 433 drives the spiral feeding plate 434 connected to it to rotate during the rotation, and the spiral feeding plate 434 drives the solder paste in the unloading box 42 to be transported to the top of the spiral feeding tower 43 during the rotation, and the solder paste transported to the top of the spiral feeding tower 43 flows back to the vibrating feeding hopper 41 through the circulating material pipe 432 for re-grinding, and the number of cycle grinding is not less than three times.

[0031] Reference Figure 8 and Fig. 9 The top inner wall of the unloading box 42 is provided with an electric partition plate 423, and a partition motor 422 is connected to one side of the electric partition plate 423, and a feeding slide plate 421 is connected to the bottom inner wall of the unloading box 42, and the bottom end of the feeding slide plate 421 extends to the bottom of the loading transmission rod 433, and a splash shield 424 is provided above the feeding slide plate 421; the solder paste in the unloading box 42 is separated by the electric partition plate 423, so as to realize the circulation transportation and storage of the solder paste. When performing the circulation grinding, one end of the electric partition plate 423 abuts against the feeding slide plate 421, and at this time, the electric partition plate 423 guides the falling solder paste to the spiral loading tower 43, and when the solder paste is ground to the standard, the partition motor 422 drives the feeding slide 421 to rotate, so that the feeding slide 421 is away from the feeding slide 421, and the solder paste falls vertically to the bottom of the discharge box 42 due to the action of gravity, and at this time, the splash guard 424 prevents the fallen solder paste from splashing to one side of the spiral loading tower 43, and the solder paste that falls to the bottom of the discharge box 42 is transported to the storage barrel 5 for storage by the feeding pump 51.

[0032] On the other hand, the embodiment of the present application also provides a process for preparing a semiconductor solder paste, comprising the following steps: Step 1, raw material preparation: KG-604 rosin 30kg, AXE rosin 25kg, diethylene glycol butyl ether 20kg, diethylene glycol methyl ether 8kg, sebacic acid 0.8kg, suberic acid 1.5kg, benzotriazole 0.3kg, triethanolamine 0.3kg; Step 2, emulsification of raw materials: grab the corresponding chemical raw materials according to the standard dosage, weigh them, ensure the weight of each raw material is accurate, and set the emulsification process and subsequent steps through the intelligent operation host according to the processing procedure, put all the materials into the emulsification barrel of the emulsifier, ensure that the materials are fully added, and then start the emulsifier to heat and stir to dissolve, the duration is not less than 30 minutes, to ensure that the materials are fully dissolved; Step 3, vacuum degassing: After the emulsification work is completed, the emulsification barrel is cooled and vacuumed according to the setting of the step program of step 2 to completely remove the bubbles in the paste, and then stirred again in the emulsification barrel to ensure the stability and uniformity of the solder paste; Step 4, paste grinding: after the stirring is completed, according to the step program setting of step 2, the solder paste is moved into the grinder through the paste transfer pump for multiple automatic grindings, and each grinding time is not less than 10 minutes, and the solder paste is filtered before grinding to remove the existing impurities; Step 5, test packaging: Take samples of solder paste to test viscosity, and transfer to paste packaging if qualified. Take samples for testing after grinding twice more until the viscosity reaches the standard value of 180±10%PA.S.

[0033] Embodiment 2: The difference between the second embodiment and the first embodiment is that a process for preparing a semiconductor solder paste comprises the following steps: Step 1, raw material preparation: KG-604 rosin 35kg, AXE rosin 28kg, diethylene glycol butyl ether 25kg, diethylene glycol methyl ether 10kg, sebacic acid 1kg, suberic acid 2kg, benzotriazole 0.5kg, triethanolamine 0.5kg; Step 2, emulsification of raw materials: grab the corresponding chemical raw materials according to the standard dosage, weigh them, ensure the weight of each raw material is accurate, and set the emulsification process and subsequent steps through the intelligent operation host according to the processing procedure, put all the materials into the emulsification barrel of the emulsifier, ensure that the materials are fully added, and then start the emulsifier to heat and stir to dissolve, the duration is not less than 30 minutes, to ensure that the materials are fully dissolved; Step 3, vacuum degassing: After the emulsification work is completed, the emulsification barrel is cooled and vacuumed according to the setting of the step program of step 2 to completely remove the bubbles in the paste, and then stirred again in the emulsification barrel to ensure the stability and uniformity of the solder paste; Step 4, paste grinding: after the stirring is completed, according to the step program setting of step 2, the solder paste is moved into the grinder through the paste transfer pump for multiple automatic grindings, and each grinding time is not less than 10 minutes, and the solder paste is filtered before grinding to remove the existing impurities; Step 5, test packaging: Take samples of solder paste to test viscosity, and transfer to paste packaging if qualified. Take samples for testing after grinding twice more until the viscosity reaches the standard value of 180±10%PA.S.

[0034] Embodiment three: The difference between the second embodiment and the first embodiment is that a process for preparing a semiconductor solder paste comprises the following steps: Step 1, raw material preparation: KG-604 rosin 40kg, AXE rosin 30kg, diethylene glycol butyl ether 30kg, diethylene glycol methyl ether 12kg, sebacic acid 1.2kg, suberic acid 2.5kg, benzotriazole 0.8kg, triethanolamine 0.8kg; Step 2, emulsification of raw materials: grab the corresponding chemical raw materials according to the standard dosage, weigh them, ensure the weight of each raw material is accurate, and set the emulsification process and subsequent steps through the intelligent operation host according to the processing procedure, put all the materials into the emulsification barrel of the emulsifier, ensure that the materials are fully added, and then start the emulsifier to heat and stir to dissolve, the duration is not less than 30 minutes, to ensure that the materials are fully dissolved; Step 3, vacuum degassing: After the emulsification work is completed, the emulsification barrel is cooled and vacuumed according to the setting of the step program of step 2 to completely remove the bubbles in the paste, and then stirred again in the emulsification barrel to ensure the stability and uniformity of the solder paste; Step 4, paste grinding: after the stirring is completed, according to the step program setting of step 2, the solder paste is moved into the grinder through the paste transfer pump for multiple automatic grindings, and each grinding time is not less than 10 minutes, and the solder paste is filtered before grinding to remove the existing impurities; Step 5, test packaging: Take samples of solder paste to test viscosity, and transfer to paste packaging if qualified. Take samples for testing after grinding twice more until the viscosity reaches the standard value of 180±10%PA.S.

[0035] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An intelligent preparation device for semiconductor solder paste, comprising an emulsifier (1) and an emulsifier barrel (2) as well as a cooling and heating unit (3) and a grinder (4), characterized in that: The emulsifying machine (1) comprises an emulsifying barrel cover (11) and an intelligent operating main unit (13); the top of the intelligent operating main unit (13) is connected to a vacuum pump (12); the emulsifying barrel cover (11) is connected to the bottom of one end of the vacuum pump (12); and the vacuum pump (12) is connected to the emulsifying barrel cover (11) via a pipeline; the emulsifying barrel (2) is arranged at the bottom of the emulsifying barrel cover (11); A cooling and heating unit (3) is arranged on one side of the emulsifying barrel (2), the grinding machine (4) is arranged on a side of the emulsifying barrel (2) away from the cooling and heating unit (3), a vibrating feed hopper (41) is arranged on the top of the grinding machine (4), and a material discharge box (42) is connected to the bottom of the grinding machine (4), a spiral material loading tower (43) is connected to the top of the material discharge box (42), and a material storage barrel (5) is arranged on the side of the grinding machine (4) away from the emulsifying machine (1).

2. The intelligent preparation device for semiconductor solder paste according to claim 1, characterized in that: A feeding pump (51) is connected between the material storage barrel (5) and the material discharge box (42), and the bottom of the emulsification barrel (2) is connected to a paste transfer pump (14), one side of the paste transfer pump (14) is connected to a pumping pipe (141), and one end of the pumping pipe (141) is connected to the inside of the vibrating feed hopper (41).

3. The intelligent preparation device for semiconductor solder paste according to claim 1, characterized in that: A water storage tank (31) is provided between the cold and hot unit (3) and the emulsification barrel (2); two groups of circulating water pipes (311) are connected between the water storage tank (31) and the emulsification barrel (2); the emulsification barrel (2) comprises an outer barrel (21) and an inner barrel (22); a cold and hot water pipe (23) is coiled between the outer barrel (21) and the inner barrel (22); both ends of the cold and hot water pipe (23) are respectively connected to the two groups of circulating water pipes (311); and a temperature sensing probe (24) is connected to the inner wall of the inner barrel (22).

4. The intelligent preparation device for semiconductor solder paste according to claim 1, characterized in that: An ultrasonic vibration machine box (44) is connected below the vibration feed hopper (41), a fixed connection frame (441) is connected between the ultrasonic vibration machine box (44) and the grinder (4), an ultrasonic wave generator (442) is arranged inside the ultrasonic vibration machine box (44), and an ultrasonic vibration rod (443) is connected to the top of the ultrasonic wave generator (442).

5. The intelligent preparation device for semiconductor solder paste according to claim 1, characterized in that: A feed pipe (411) is provided at the bottom of the vibrating feed hopper (41), and one end of the feed pipe (411) extends into the grinder (4). A grinding assembly (45) and a grinding disc (46) are sequentially provided in the grinder (4) from top to bottom, and a grinding roller (461) is provided on the top of the grinding disc (46).

6. The intelligent preparation device for semiconductor solder paste according to claim 5, characterized in that: The grinding assembly (45) comprises a grinding machine box (451) and a plurality of groups of grinding rollers (453); a grinding discharge port (454) is provided in the grinding assembly (45); the plurality of groups of grinding rollers (453) are arranged in an array in the grinding discharge port (454); and a transmission shaft (4531) is provided in the grinding rollers (453).

7. The intelligent preparation device for semiconductor solder paste according to claim 6, characterized in that: Two groups of grinding motors (452) are arranged in the grinding machine box (451), and the output shafts of the two groups of grinding motors (452) are respectively connected to two upper and lower groups of adjacent transmission shafts (4531), and a transmission belt (4532) is connected between the two adjacent groups of transmission shafts (4531).

8. The intelligent preparation device for semiconductor solder paste according to claim 7, characterized in that: A circulating material pipe (432) is connected between the spiral loading tower (43) and the vibrating feed hopper (41), and a loading motor (431) is connected to the top of the spiral loading tower (43), a loading transmission rod (433) is connected to the output shaft of the loading motor (431), and a spiral loading plate (434) is connected to the outer side of the loading transmission rod (433).

9. The intelligent preparation device for semiconductor solder paste according to claim 8, characterized in that: The top inner wall of the unloading box (42) is provided with an electric partition plate (423), and a partition motor (422) is connected to one side of the electric partition plate (423); the bottom inner wall of the unloading box (42) is connected with a feeding slide plate (421), and the bottom end of the feeding slide plate (421) extends to the bottom of the loading transmission rod (433); and a splash guard plate (424) is provided above the feeding slide plate (421).

10. A process for preparing semiconductor solder paste, using the semiconductor solder paste preparation device according to any one of claims 1 to 9, characterized in that: The preparation process comprises the following steps: Step 1, raw material preparation: 30-40 parts by weight of KG-604 rosin, 25-30 parts by weight of AXE rosin, 20-30 parts by weight of diethylene glycol butyl ether, 8-12 parts by weight of diethylene glycol methyl ether, 0.8-1.2 parts by weight of sebacic acid, 1.5-2.5 parts by weight of suberic acid, 0.3-0.8 parts by weight of benzotriazole, and 0.3-0.8 parts by weight of triethanolamine; Step 2, emulsification of raw materials: grab the corresponding chemical raw materials according to the standard dosage, weigh them, ensure that the weight of each raw material is accurate, and set the emulsification process and subsequent steps through the intelligent operation host (13) according to the processing procedure, put all the materials into the emulsification barrel (2) of the emulsifier (1), ensure that the materials are completely added, and then start the emulsifier (1) to heat and stir to dissolve, the duration is not less than 30 minutes, to ensure that the materials are fully dissolved; Step 3, vacuum degassing: after the emulsification work is completed, the emulsification barrel (2) is cooled and vacuumed according to the setting of the step program in step 2 to completely remove the bubbles in the paste, and the paste is stirred again in the emulsification barrel (2) to ensure the stability and uniformity of the solder paste; Step 4, grinding the paste: after the stirring is completed, according to the step program set in step 2, the solder paste is transferred to the grinder (4) through the paste transfer pump (14) for multiple automatic grinding (not less than 3 times), and each grinding time is not less than 10 minutes, and the solder paste is filtered before grinding to remove impurities; Step 5, test packaging: Take samples of solder paste to test viscosity, and transfer to paste packaging if qualified (if unqualified, continue grinding for multiple times until qualified), and take samples for testing after every 2 grindings until the viscosity reaches the standard value of 180±10%PA.S.

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