A semiconductor wafer grinding device

Abstract

The present invention provides a semiconductor wafer grinding device, which includes a workbench, a grinding box, a transverse and longitudinal movement mechanism, a clamping and rotating mechanism, a grinding mechanism, and a detection mechanism. The grinding box includes a first box body and a second box body; the transverse and longitudinal movement mechanism is fixedly installed on the workbench; the clamping and rotating mechanism includes a clamping and rotating assembly and a supporting and rotating assembly. The supporting and rotating assembly is installed on the workbench, the clamping and rotating assembly is installed on the transverse and longitudinal movement mechanism, and the supporting and rotating assembly cooperates with the clamping and rotating assembly to clamp the silicon rod to be ground between them and can drive it to rotate; the grinding mechanism includes a first cylinder, a buffer assembly and a grinding assembly, and the grinding assembly grinds the outer surface of the silicon rod; the detection mechanism is used to detect the flatness of the outer surface of the ground silicon rod. After passing the detection, the clamping and rotating assembly clamps and fixes the silicon rod and drives it to move out of the first box body through the transverse and longitudinal movement mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer grinding equipment, and particularly relates to a semiconductor wafer grinding equipment. Background Art

[0002] Semiconductor wafers are mainly made of ultra-pure semiconductor materials, usually silicon. Silicon is abundant in reserves and easily forms stable oxides, making it an ideal material for modern CMOS processes. In addition, other materials are also used to manufacture wafers, such as sapphire (electrical insulator), gallium arsenide (with better optoelectronic properties and higher electron speed / mobility, used in high-speed transistors, lasers, and solar cells), and germanium (used in integrated optics and infrared imaging / detection applications).

[0003] Currently, the production of wafers requires the use of laser cutting equipment to cut silicon rods into extremely thin silicon wafers. Then, circuits and electronic components are formed on them using optical and chemical etching methods. Before laser cutting the silicon rods, their surfaces and ends are prone to wear and scratches during transportation. Therefore, it is necessary to use grinding equipment to grind their surfaces in advance to make them flat.

[0004] During the grinding process of existing silicon rods, when fixing the silicon rods and when the grinding roller contacts the silicon rods for grinding, the pressure generated between them cannot be precisely controlled, easily resulting in breakage of the silicon rods. In addition, there is a lack of detection of the flatness of the silicon rod surface during grinding. Due to the above factors, the defective rate is likely to increase. Summary of the Invention

[0005] The present invention provides a semiconductor wafer grinding equipment to solve the above technical problems.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A semiconductor wafer grinding device, comprising: a workbench; a grinding box, the grinding box includes a first box body and a second box body, the first box body is vertically through and fixedly installed on the tabletop of the workbench, the first box body is provided with a plurality of openings at equal angles around its central axis, one side of the second box body is open, and the open side thereof is fixedly connected to the opening; a horizontal and vertical movement mechanism, the horizontal and vertical movement mechanism is fixedly installed on the workbench; a clamping and rotating mechanism, the clamping and rotating mechanism includes a clamping and rotating component and a supporting and rotating component, the supporting and rotating component is installed on the workbench, the clamping and rotating component is installed on the horizontal and vertical movement mechanism, the silicon rod to be ground is placed on the supporting and rotating component, the supporting and rotating component cooperates with the clamping and rotating component to clamp the silicon rod to be ground therebetween and can drive it to rotate; a grinding mechanism, the grinding mechanism includes a first cylinder, a buffer component and a grinding component, the first cylinder is fixedly installed on the second box body, the output end of the first cylinder passes through the second box body and is fixedly connected to the buffer component, the grinding component is fixedly connected to the buffer component, the first cylinder drives the grinding component to move linearly and contact the outer surface of the silicon rod to be ground to grind its outer surface; and

[0008] a detection mechanism, a plurality of the detection mechanisms are installed in the first box body at equal angles around the central axis of the first box body, the detection mechanism includes a linear motion unit and a micro laser scanner, the micro laser scanner is installed on the linear motion unit, and the linear motion unit drives the micro laser scanner to move linearly up and down to detect the flatness of the outer surface of the ground silicon rod. After the detection is qualified, the clamping and rotating component clamps and fixes the silicon rod and drives it out of the first box body through the horizontal and vertical movement mechanism.

[0009] The clamping and rotating assembly includes: a second cylinder, which is fixedly installed on the support frame, and its output end passes through the support frame; a connecting plate, which is fixedly connected to the output end of the second cylinder, and a first groove is formed at the center of the bottom of the connecting plate, and a connecting bearing is fixedly installed in the first groove; a first buffer unit, which includes a first sleeve, a first sleeve rod and a first buffer spring. One end of the first sleeve is fixedly connected to the inner ring of the connecting bearing, the first sleeve rod is slidably connected in the first sleeve, the first buffer spring is located in the first sleeve, and the two ends of the first buffer spring are respectively fixedly connected to a first limiting plate and a second limiting plate. A first pressure sensor is fixedly installed in the first sleeve, the first limiting plate is fixedly connected to the first pressure sensor, the second limiting plate is fixedly connected to one end of the first sleeve rod located in the first sleeve, and the other end of the first sleeve rod is fixedly connected to a pressing pad; an annular connecting cover, which is fixedly connected to the bottom of the connecting plate; and a clamping unit, which includes a plurality of electric telescopic rods, and the electric telescopic rods are fixedly installed on the outer wall of the annular connecting cover at equal angles with the center of the annular connecting cover as the center, and the movable ends of the electric telescopic rods pass through the annular connecting cover to its interior and are fixedly installed with clamping blocks.

[0010] The supporting and rotating assembly includes: a third motor, which is fixedly installed at the top inside the workbench, and the output shaft of the third motor passes through the workbench to its outside; a supporting table, which is fixedly connected to the output shaft of the third motor, and a second groove is provided on the tabletop of the supporting table, and a supporting pad is installed in the second groove.

[0011] The horizontal and vertical moving mechanism includes: a horizontal moving assembly, which includes a first mounting frame, a first motor, a first slider and a first guiding rod. The first mounting frame is of a U-shaped structure and is fixedly installed on the workbench. The first motor is fixedly installed on the first mounting frame, and a first screw rod is fixedly installed on the output shaft of the first motor. The end of the first screw rod away from the first motor is rotatably connected to the first mounting frame. The first slider is threadedly connected to the first screw rod, a first guiding hole is formed in the first slider, and the first guiding rod passes through the first guiding hole, and its two ends are fixedly connected to the first mounting frame; and a vertical moving assembly, which includes a second mounting frame, a second motor, a second slider, a second guiding rod and a support frame. The second mounting frame is vertically and fixedly installed on the first slider. The second motor is fixedly installed at the top end of the second mounting frame, and a second screw rod is fixedly installed on the output shaft of the second motor. The end of the second screw rod away from the second motor is rotatably connected to the second mounting frame; the second slider is of a T-shaped structure and is threadedly connected to the second screw rod. A second guiding hole is formed in the second slider, and the second guiding rod passes through the second guiding hole, and its two ends are fixedly connected to the second mounting frame. One end of the support frame is fixedly connected to the second slider.

[0012] The buffer assembly includes: a second buffer unit, which includes a second sleeve, a second sleeve rod, and a second buffer spring. One end of the second sleeve is fixedly connected to the output end of the first cylinder. The first sleeve rod is slidably connected within the first sleeve. The second buffer spring is located within the second sleeve. The two ends of the second buffer spring are respectively fixedly connected to a third limit plate and a fourth limit plate. A second pressure sensor is fixedly installed within the second sleeve. The third limit plate is fixedly connected to the second pressure sensor. The fourth limit plate is fixedly connected to one end of the second sleeve rod located within the second sleeve; and a third buffer unit, which includes a connecting plate. The connecting plate is fixedly connected to one end of the second sleeve rod located outside the second sleeve. A plurality of buffers are fixedly installed at equal intervals on one side of the connecting plate away from the second buffer unit.

[0013] The grinding assembly includes: a U-shaped plate, which is fixedly connected to the end of the buffer away from the connecting plate; a grinding roller, which is rotatably installed within the U-shaped plate; and a fourth motor, which is fixedly installed on the U-shaped plate. The output end of the fourth motor is fixedly connected to the grinding roller, and the fourth motor drives the grinding roller to rotate.

[0014] The linear motion unit includes: a mounting plate, which is fixedly connected to the first box body; a linear slide rail, which is fixedly installed on the mounting plate; and an electric slider, which is installed on the linear slide rail. The micro laser scanner is installed on the electric slider. A protective cover is also installed on the electric slider, and the micro laser scanner is located within the protective cover.

[0015] It further includes a dust suction mechanism, which includes: a dust suction part, which is a box body structure with a hollow center. The dust suction part is fixedly installed at the top of the first box body. A dust suction hole is provided at the bottom of the dust suction part; and a dust suction fan. The dust suction end of the dust suction fan is hermetically connected to a dust suction pipe. The end of the dust suction pipe away from the dust suction fan is hermetically connected and communicated with the dust suction part.

[0016] It further includes a control mechanism, which includes a control box. A controller is installed within the control box. A display screen and a control switch are installed on the control box. The display screen and the control switch are electrically connected to the controller. The first cylinder, the micro laser scanner, the first motor, the second motor, the second cylinder, the first pressure sensor, the second pressure sensor, the electric telescopic rod, the third motor, the fourth motor, the electric slider, and the dust suction fan are respectively electrically connected to the controller.

[0017] The beneficial effects of the present invention:

[0018] The semiconductor wafer grinding equipment of the present invention realizes the fixation and rotation of the silicon rod through the arranged clamping and rotating assembly and the supporting and rotating assembly. When grinding the silicon rod, the force generated between the silicon rod and the grinding mechanism is buffered and shock-absorbed during the grinding process of the silicon rod through the buffer unit II and the buffer unit III. At the same time, the longitudinal force generated is buffered and shock-absorbed through the buffer unit I in the clamping and rotating assembly. The force generated between the silicon rod is controlled through the pressure sensor I and the pressure sensor II to achieve the purpose of reducing the damage of the silicon rod due to uneven force during the processing; in addition, the flatness of the surface of the silicon rod is detected through the arranged detection mechanism to improve the yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is the overall structural schematic diagram of the semiconductor wafer grinding equipment according to an embodiment of the present invention;

[0020] Figure 2 is Figure 1 the enlarged structural schematic diagram at A in

[0021] Figure 3 is another overall structural schematic diagram of the semiconductor wafer grinding equipment according to an embodiment of the present invention;

[0022] Figure 4 is the plan view of the semiconductor wafer grinding equipment according to an embodiment of the present invention;

[0023] Figure 5 is the structural schematic diagram of the clamping and rotating assembly according to an embodiment of the present invention;

[0024] Figure 6 is the structural schematic diagram of the supporting and rotating assembly according to an embodiment of the present invention;

[0025] Figure 7 is the connection plan view of the buffer unit I and the connection disk according to an embodiment of the present invention;

[0026] Figure 8 is the connection schematic diagram of the grinding box, the grinding mechanism and the detection mechanism according to an embodiment of the present invention;

[0027] Figure 9 is the plan view of the grinding box, the grinding mechanism and the detection mechanism according to an embodiment of the present invention;

[0028] Figure 10 is Figure 8 the enlarged structural schematic diagram at B in

[0029] Figure 11 is the structural schematic diagram of the box body I and the box body II according to an embodiment of the present invention;

[0030] Figure 12Schematic structural diagram of a grinding mechanism according to an embodiment of the present invention;

[0031] Figure 13 Planar schematic diagram of buffer unit two according to an embodiment of the present invention.

[0032] Explanation of reference numerals:

[0033] 1 - Workbench;

[0034] 2 - Grinding box, 21 - First box body, 211 - Opening, 22 - Second box body;

[0035] 3 - Transverse and longitudinal movement mechanism, 31 - Transverse movement component, 311 - First mounting frame, 312 - First motor, 313 - First screw rod, 314 - First slider, 315 - First guide rod; 32 - Longitudinal movement component, 321 - Second mounting frame, 322 - Second motor, 323 - Second screw rod, 324 - Second slider, 325 - Second guide rod, 326 - Support frame;

[0036] 4 - Clamping and rotating mechanism, 41 - Clamping and rotating component, 411 - Second cylinder, 412 - Connecting plate, 413 - First groove, 414 - Connecting bearing, 415 - First buffer unit, 4151 - First sleeve, 4152 - First sleeve rod, 4153 - First buffer spring, 4154 - First limiting plate, 4155 - Second limiting plate, 4156 - First pressure sensor, 4157 - Pressure pad, 416 - Ring-shaped connecting cover, 417 - Electric telescopic rod, 418 - Clamping block;

[0037] 42 - Support and rotating component, 421 - Third motor, 422 - Support platform, 423 - Support pad;

[0038] 5 - Grinding mechanism, 51 - First cylinder, 52 - Buffer component, 53 - Grinding component;

[0039] 521 - Second buffer unit, 5211 - Second sleeve, 5212 - Second sleeve rod, 5213 - Second buffer spring, 5214 - Third limiting plate, 5215 - Fourth limiting plate, 5216 - Second pressure sensor;

[0040] 522 - Third buffer unit, 5221 - Connecting plate, 5222 - Buffer;

[0041] 531 - U-shaped plate, 532 - Grinding roller, 533 - Fourth motor;

[0042] 6 - Detection mechanism, 61 - Linear motion unit, 611 - Mounting plate, 612 - Linear slide rail, 613 - Electric slider, 62 - Micro laser scanner, 63 - Protective cover;

[0043] 7 - Dust suction mechanism, 71 - Dust suction part, 72 - Dust suction fan, 73 - Dust suction pipe;

[0044] 8 - Control box. Specific implementation mode

[0045] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0046] As Figures 1 - 13 shown, a semiconductor wafer grinding device according to an embodiment of the present invention may include a workbench 1, a grinding box 2, a horizontal and vertical movement mechanism 3, a clamping and rotating mechanism 4, a grinding mechanism 5, and a detection mechanism 6.

[0047] Specifically, the grinding box 2 includes a box body one 21 and a box body two 22. Among them, the box body one 21 is vertically penetrated and fixedly installed on the tabletop of the workbench 1. A plurality of openings 211 are provided on the box body one 21 at equal angles around its central axis. One side of the box body two 22 is open, and the open side thereof is fixedly connected to the opening 211; the horizontal and vertical movement mechanism 3 is fixedly installed on the workbench 1; the clamping and rotating mechanism 4 includes a clamping and rotating assembly 41 and a supporting and rotating assembly 42. Among them, the supporting and rotating assembly 42 is installed on the workbench 1, and the clamping and rotating assembly 41 is installed on the horizontal and vertical movement mechanism 3. The silicon rod to be ground is placed on the supporting and rotating assembly 42. The supporting and rotating assembly 42 cooperates with the clamping and rotating assembly 41 to clamp the silicon rod to be ground between them and can drive it to rotate; the grinding mechanism 5 includes a cylinder one 51, a buffer assembly 52, and a grinding assembly 53. Among them, the cylinder one 51 is fixedly installed on the box body two 22. The output end of the cylinder one 51 passes through the box body two 22 and is fixedly connected to the buffer assembly 52. The grinding assembly 53 is fixedly connected to the buffer assembly 52. The cylinder one 51 drives the grinding assembly 53 to perform a linear motion and contacts the outer surface of the silicon rod to be ground to grind its outer surface; a plurality of detection mechanisms 6 are installed in the box body one 21 at equal angles around the central axis of the box body one 21. The detection mechanism 6 includes a linear motion unit 61 and a micro laser scanner 62. The micro laser scanner 62 is installed on the linear motion unit 61. The linear motion unit 61 drives the micro laser scanner 62 to perform a vertical linear motion to detect the flatness of the outer surface of the ground silicon rod. After passing the detection, the clamping and rotating assembly 41 clamps and fixes the silicon rod and drives it out of the box body one 21 through the horizontal and vertical movement mechanism 3.

[0048] As Figure 5 and Figure 7As shown, the clamping and rotating assembly 41 may include a second cylinder 411, a connecting disk 412, a first buffer unit 415, an annular connecting cover 416, and a clamping unit. Among them, the second cylinder 411 is fixedly installed on the support frame 326, and its output end passes through the support frame 326; the connecting disk 412 is fixedly connected to the output end of the second cylinder 411. A first groove 413 is formed at the center of the bottom of the connecting disk 412, and a connecting bearing 414 is fixedly installed in the first groove 413; the first buffer unit 415 includes a first sleeve 4151, a first sleeve rod 4152, and a first buffer spring 4153. One end of the first sleeve 4151 is fixedly connected to the inner ring of the connecting bearing 414. The first sleeve rod 4152 is slidably connected in the first sleeve 4151. The first buffer spring 4153 is located in the first sleeve 4151. Two ends of the first buffer spring 4153 are respectively fixedly connected to a first limiting plate 4154 and a second limiting plate 4155. A first pressure sensor 4156 is fixedly installed in the first sleeve 4151. The first limiting plate 4154 is fixedly connected to the first pressure sensor 4156. The second limiting plate 4155 is fixedly connected to one end of the first sleeve rod 4152 located inside the first sleeve 4151. The other end of the first sleeve rod 4152 is fixedly connected to a pressure pad 4157; the annular connecting cover 416 is fixedly connected to the bottom of the connecting disk 412; the clamping unit includes a plurality of electric telescopic rods 417. The electric telescopic rods 417 are fixedly installed on the outer wall of the annular connecting cover 416 at equal angles with the center of the annular connecting cover 416 as the center. The movable ends of the electric telescopic rods 417 pass through the annular connecting cover 416 to its interior and are fixedly installed with clamping blocks 418.

[0049] As Figure 4 and Figure 6 shown, the support and rotating assembly 42 may include a third motor 421 and a support table 422. Among them, the third motor 421 is fixedly installed at the top inside the workbench 1, and the output shaft of the third motor 421 passes through the workbench 1 to its outside; the support table 422 is fixedly connected to the output shaft of the third motor 421. A second groove is provided on the tabletop of the support table 422, and a support pad 423 is installed in the second groove.

[0050] In an embodiment of the present invention, during grinding, the silicon rod is placed at the central position within the second groove of the support table 422. The transverse and longitudinal movement mechanism 3 drives the clamping and rotating assembly 41 to move directly above the silicon rod. Then, the second cylinder 411 is activated, and the second cylinder 411 drives the connection disk 412 to move downward in a straight line until the pressing pad 4157 of the first buffer unit 415 abuts against the top of the silicon rod. The pressing pad 4157 can be made of rubber or silica gel pad. After the pressing pad 4157 abuts against the top end of the silicon rod, the pressing pad 4157 squeezes the first sleeve rod 4152 to slide within the first sleeve 4151. The first sleeve rod 4152 squeezes the first buffer spring 4153, and the first limiting plate 4154 applies a certain pressure to the first pressure sensor 4156. The first pressure sensor 4156 detects the generated pressure, thereby controlling the pressure generated when the pressing pad 4157 abuts against the silicon rod and avoiding damage to the silicon rod.

[0051] When grinding the silicon rod, the third motor 421 drives the support table 422 to rotate. Since the first buffer unit 415 is connected to the inner ring of the bearing, the first buffer unit 415 can rotate. The first buffer unit 415 abuts against the top end of the silicon rod, so that the silicon rod can rotate between the clamping and rotating assembly 41 and the support and rotating assembly 42.

[0052] In an embodiment of the present invention, as Figure 1 、 Figure 2 and Figure 3 shown, the transverse and longitudinal movement mechanism 3 may include a transverse movement component 31 and a longitudinal movement component 32. Among them, the transverse movement component 31 includes a first mounting frame 311, a first motor 312, a first slider 314, and a first guide rod 315. Among them, the first mounting frame 311 has a U-shaped structure and is fixedly installed on the workbench 1. The first motor 312 is fixedly installed on the first mounting frame 311. A first screw rod 313 is fixedly installed on the output shaft of the first motor 312. The end of the first screw rod 313 away from the first motor 312 is rotatably connected to the first mounting frame 311. The first slider 314 is threadedly connected to the first screw rod 313. A first guide hole is provided on the first slider 314. The first guide rod 315 passes through the first guide hole, and its two ends are fixedly connected to the first mounting frame 311; the longitudinal movement component 32 includes a second mounting frame 321, a second motor 322, a second slider 324, a second guide rod 325, and a support frame 326. Among them, the second mounting frame 321 is vertically and fixedly installed on the first slider 314. The second motor 322 is fixedly installed at the top end of the second mounting frame 321. A second screw rod 323 is fixedly installed on the output shaft of the second motor 322. The end of the second screw rod 323 away from the second motor 322 is rotatably connected to the second mounting frame 321; the second slider 324 has a T-shaped structure and is threadedly connected to the second screw rod 323. A second guide hole is provided on the second slider 324. The second guide rod 325 passes through the second guide hole, and its two ends are fixedly connected to the second mounting frame 321. One end of the support frame 326 is fixedly connected to the second slider 324.

[0053] When the longitudinal moving assembly 32 makes a lateral movement, the first motor 312 is started. The first motor 312 drives the first screw 313 to rotate. The slider 314 on the first screw 313 makes a linear motion along the first guide rod 315, thereby driving the longitudinal moving assembly 32 to move. When the longitudinal moving assembly 32 drives the clamping and rotating assembly 41 to move longitudinally, the second motor 322 is started. The second motor 322 drives the second screw 323 to rotate. The slider 324 on the second screw 323 makes a linear motion along the second guide rod 325, thereby driving the clamping and rotating assembly 41 to make a longitudinal linear motion.

[0054] In an embodiment of the present invention, as Figure 12 and Figure 13 shown, the buffer assembly 52 may include a second buffer unit 521 and a third buffer unit 522. Specifically, the second buffer unit 521 may include a second sleeve 5211, a second sleeve rod 5212, and a second buffer spring 5213. Among them, one end of the second sleeve 5211 is fixedly connected to the output end of the first cylinder 51. The first sleeve rod 4152 is slidably connected in the first sleeve 4151. The second buffer spring 5213 is located in the second sleeve 5211. The two ends of the second buffer spring 5213 are respectively fixedly connected to a third limiting plate 5214 and a fourth limiting plate 5215. A second pressure sensor 5216 is fixedly installed in the second sleeve 5211. The third limiting plate 5214 is fixedly connected to the second pressure sensor 5216. The fourth limiting plate 5215 is fixedly connected to one end of the second sleeve rod 5212 located inside the second sleeve 5211. Specifically, the third buffer unit 522 includes a connecting plate 5221. The connecting plate 5221 is fixedly connected to one end of the second sleeve rod 5212 located outside the second sleeve 5211. A plurality of buffers 5222 are fixedly installed at equal intervals on the side of the connecting plate 5221 away from the second buffer unit 521.

[0055] In an embodiment of the present invention, the cross-section of the first box body 21 is square or circular. Four grinding mechanisms 5 are provided and are equally distributed at 90 degrees around the central axis of the first box body 21. After the silicon rod is fixed between the clamping and rotating assembly 41 and the supporting and rotating assembly 42, the first cylinder 51 is started. The first cylinder 51 pushes the second buffer unit 521 and the third buffer unit 522 to move, thereby pushing the grinding assemblies 53 to contact the surface of the silicon rod from four directions respectively. The pressure sensor 5216 can detect the pressure generated when the grinding assembly 53 contacts the silicon rod, avoiding damage to the silicon rod. In addition, the pressure detected by the pressure sensor 5216 can also more precisely control the grinding amount of the silicon rod. When the silicon rod is ground, a force and a reaction force are generated between the silicon rod and the grinding assembly 53. The reaction force acts on the third buffer unit 522 and the first buffer unit 415. The buffering and shock absorption during the grinding process of the silicon rod are realized through the deformation of the second buffer spring 5213 and the buffer 5222, that is, soft contact, thereby reducing the situation that the silicon rod is damaged due to uneven force during the processing. Exemplarily, the buffer 5222 can adopt a hydraulic buffer 5222. Of course, the present invention is not limited thereto, and a pneumatic buffer 5222, a spring buffer 5222, etc. can also be adopted.

[0056] In an embodiment of the present invention, as Figure 12 shown, the grinding assembly 53 may include a U-shaped plate 531, a grinding roller 532, and a fourth motor 533. Among them, the U-shaped plate 531 is fixedly connected to the end of the buffer 5222 away from the connecting plate 5221; the grinding roller 532 is rotatably installed in the U-shaped plate 531; the fourth motor 533 is fixedly installed on the U-shaped plate 531, and the output end of the fourth motor 533 is fixedly connected to the grinding roller 532, and the fourth motor 533 drives the grinding roller 532 to rotate.

[0057] After the grinding roller 532 contacts the silicon rod from four directions, the fourth motor 533 is started. The fourth motor 533 drives the grinding roller 532 to rotate. The grinding roller 532 presses on the silicon rod to complete the grinding of the surface of the silicon rod, further making its surface flat and improving the surface flatness.

[0058] In an embodiment of the present invention, as Figure 8 、 Figure 9 and Figure 10 shown, the linear motion unit 61 may include a mounting plate 611, a linear slide rail 612, and an electric slider 613. Among them, the mounting plate 611 is fixedly connected to the first box body 21; the linear slide rail 612 is fixedly installed on the mounting plate 611; the electric slider 613 is installed on the linear slide rail 612, the micro laser scanner 62 is installed on the electric slider 613, and a protective cover 63 is also installed on the electric slider 613. The micro laser scanner 62 is located inside the protective cover 63.

[0059] After preliminary grinding, the grinding work on the silicon rod is paused, and the electric slider 613 is started. The electric slider 613 moves linearly up and down on the linear guide rail, thereby driving the micro laser scanner 62 to move linearly up and down to realize the up and down scanning detection of the silicon rod and detect the flatness of its surface. Among them, there are four detection mechanisms 6, which are respectively distributed between adjacent grinding mechanisms 5, and are evenly distributed at 90 degrees around their central axes in the first box body 21 to detect the flatness of the surfaces of four positions of the silicon rod respectively. The flatness is comprehensively judged by detecting multiple data. If the qualified standard is not reached, the surface of the silicon rod continues to be ground. If the qualified standard is reached, the electric telescopic rod 417 is started, and the electric telescopic rod 417 clamps the top of the silicon rod from multiple directions, and the silicon rod is taken out of the first box body 21 through the horizontal and vertical mechanisms.

[0060] In an embodiment of the present invention, as Figure 1 and Figure 4 shown, the present invention further includes a dust collection mechanism 7. Specifically, the dust collection mechanism 7 may include a dust collection part 71 and a dust collection fan 72. Among them, the dust collection part 71 is a box structure with a hollow center, and the dust collection part 71 is fixedly installed on the top of the first box body 21, and dust suction holes are provided at the bottom of the dust collection part 71; the dust suction end of the dust collection fan 72 is hermetically connected with a dust suction pipe 73, and the end of the dust suction pipe 73 away from the dust collection fan 72 is hermetically connected and communicated with the dust collection part 71.

[0061] During the grinding process of the silicon rod, the dust collection fan 72 is started, and the dust and impurities generated in the first box body 21 are adsorbed through the dust collection part 71.

[0062] In an embodiment of the present invention, as Figure 1 shown, the present invention further includes a control mechanism. The control mechanism may include a control box 8. A controller is installed in the control box 8. Exemplarily, the controller may adopt a single-chip microcomputer or a PLC. A display screen and a control switch are installed on the control box 8, and the display screen and the control switch are electrically connected to the controller. The first cylinder 51, the micro laser scanner 62, the first motor 312, the second motor 322, the second cylinder 411, the first pressure sensor 4156, the second pressure sensor 5216, the electric telescopic rod 417, the third motor 421, the fourth motor 533, the electric slider 613 and the dust collection fan 72 are respectively electrically connected to the controller.

[0063] Among them, the pressure data detected by the first pressure sensor 4156 and the second pressure sensor 5216 are displayed on the display screen. At the same time, the detection data of the micro laser scanner 62 on the silicon rod are also displayed on the display screen.

[0064] According to the semiconductor wafer grinding equipment of the embodiment of the present invention, the clamping and rotating assembly 41 and the supporting and rotating assembly 42 are provided to fix and rotate the silicon rod. When the silicon rod is polished, the force generated between the silicon rod and the polishing mechanism is buffered and shock-absorbed during the polishing process of the silicon rod through the second buffer unit 521 and the third buffer unit 522. At the same time, the longitudinal force generated is buffered and shock-absorbed through the first buffer unit 415 in the clamping and rotating assembly 41. The force generated between the silicon rod is controlled through the first pressure sensor 4156 and the second pressure sensor 5216, so as to achieve the purpose of reducing the damage of the silicon rod due to uneven force during the processing. In addition, the flatness of the surface of the silicon rod is detected through the provided detection mechanism 6 to improve the yield of the wafer.

[0065] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0066] The above embodiments only express several implementation manners of the present invention, and the description is relatively specific and detailed, but it cannot be understood as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, various modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A semiconductor wafer grinding device, characterized in that: include: Workbench; A grinding box, the grinding box comprising a first box body and a second box body, the first box body is through-through from top to bottom and fixedly mounted on the table top of the workbench, the first box body is provided with a plurality of openings at equal angles with its axis as the center, one side of the second box body is open, and the open side thereof is fixedly connected to the opening; A transverse and longitudinal moving mechanism, wherein the transverse and longitudinal moving mechanism is fixedly mounted on the workbench; A clamping and rotating mechanism, the clamping and rotating mechanism comprising a clamping and rotating assembly and a supporting and rotating assembly, the supporting and rotating assembly being mounted on the workbench, the clamping and rotating assembly being mounted on the transverse and longitudinal moving mechanisms, the silicon rod to be ground being placed on the supporting and rotating assembly, the supporting and rotating assembly cooperating with the clamping and rotating assembly to clamp the silicon rod to be ground therebetween and drive it to rotate; A grinding mechanism, the grinding mechanism comprising a cylinder 1, a buffer assembly and a grinding assembly, the cylinder 1 is fixedly mounted on the box body 2, the output end of the cylinder 1 passes through the box body 2 and is fixedly connected to the buffer assembly, the grinding assembly is fixedly connected to the buffer assembly, the cylinder 1 drives the grinding assembly to perform linear motion, contacts with the outer surface of the silicon rod to be ground, and grinds the outer surface; and A detection mechanism, wherein the detection mechanism is provided with a plurality of detection mechanisms, which are installed in the box body one at equal angles with the central axis of the box body one as the center, and the detection mechanism comprises a linear motion unit and a micro laser scanner, wherein the micro laser scanner is installed on the linear motion unit, and the linear motion unit drives the micro laser scanner to perform up and down linear motion to detect the flatness of the outer surface of the ground silicon rod. After the detection is qualified, the clamping and rotating assembly clamps and fixes the silicon rod and drives it to be moved out of the box body one through the transverse and longitudinal moving mechanisms; Wherein, the clamping and rotating assembly comprises: Cylinder 2, wherein the cylinder 2 is fixedly mounted on the support frame, and an output end thereof passes through the support frame; A connecting plate, the connecting plate is fixedly connected to the output end of the second cylinder, a groove 1 is provided at the center of the bottom of the connecting plate, and a connecting bearing is fixedly installed in the groove 1; A buffer unit 1, the buffer unit 1 comprises a sleeve 1, a sleeve rod 1 and a buffer spring 1, one end of the sleeve 1 is fixedly connected to the inner ring of the connecting bearing, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 1 is located in the sleeve 1, the two ends of the buffer spring 1 are respectively fixedly connected to a limit plate 1 and a limit plate 2, a pressure sensor 1 is fixedly installed in the sleeve 1, the limit plate 1 is fixedly connected to the pressure sensor 1, the limit plate 2 is fixedly connected to one end of the sleeve rod 1 located in the sleeve 1, and the other end of the sleeve rod 1 is fixedly connected to a pressure pad; an annular connection cover, the annular connection cover is fixedly connected to the bottom of the connection plate; and A clamping unit, the clamping unit comprising a plurality of electric telescopic rods, the electric telescopic rods being fixedly mounted on the outer wall of the annular connection cover at equal angles with the center of the annular connection cover as the center, the movable ends of the electric telescopic rods passing through the annular connection cover to the inside thereof and being fixedly mounted with clamping blocks; The supporting rotating assembly comprises: Motor 3, wherein the motor 3 is fixedly mounted on the top of the workbench, and the output shaft of the motor 3 passes through the workbench to the outside thereof; and A support platform is fixedly connected to the output shaft of the motor three, and a groove two is provided on the surface of the support platform, and a support pad is installed in the groove two.

2. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The lateral and longitudinal movement mechanisms include: A lateral movement assembly, the lateral movement assembly comprising a mounting frame 1, a motor 1, a slider 1 and a guide rod 1, the mounting frame 1 is a U-shaped structure, which is fixedly mounted on the workbench, the motor 1 is fixedly mounted on the mounting frame 1, a screw 1 is fixedly mounted on the output shaft of the motor 1, an end of the screw 1 away from the motor 1 is rotatably connected to the mounting frame 1, the slider 1 is threadedly connected to the screw 1, a guide hole 1 is formed on the slider 1, the guide rod 1 passes through the guide hole 1, and both ends of the guide rod 1 are fixedly connected to the mounting frame 1; and A longitudinal moving component, which includes a mounting frame 2, a motor 2, a slider 2, a guide rod 2 and a support frame. The mounting frame 2 is vertically fixedly mounted on the slider 1, the motor 2 is fixedly mounted on the top of the mounting frame 2, the output shaft of the motor 2 is fixedly mounted with a screw 2, and the end of the screw 2 away from the motor 2 is rotatably connected to the mounting frame 2; the slider 2 is a T-shaped structure, which is threadedly connected to the screw 2, and the slider 2 is provided with a guide hole 2, the guide rod 2 passes through the guide hole 2, and its two ends are fixedly connected to the mounting frame 2, and one end of the support frame is fixedly connected to the slider 2.

3. The semiconductor wafer grinding equipment according to claim 2, characterized in that: The buffer assembly comprises: A buffer unit 2, the buffer unit 2 comprising a sleeve 2, a sleeve rod 2 and a buffer spring 2, one end of the sleeve 2 is fixedly connected to the output end of the cylinder 1, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 2 is located in the sleeve 2, both ends of the buffer spring 2 are respectively fixedly connected to a limit plate 3 and a limit plate 4, a pressure sensor 2 is fixedly installed in the sleeve 2, the limit plate 3 is fixedly connected to the pressure sensor 2, and the limit plate 4 is fixedly connected to one end of the sleeve rod 2 located in the sleeve 2; and The buffer unit three comprises a connecting plate, the connecting plate is fixedly connected to one end of the sleeve rod two located outside the sleeve two, and a plurality of buffers are fixedly installed at equal intervals on one side of the connecting plate away from the buffer unit two.

4. The semiconductor wafer grinding equipment according to claim 3, characterized in that: The grinding assembly comprises: A U-shaped plate, the U-shaped plate being fixedly connected to an end of the buffer away from the connecting plate; a grinding roller, the grinding roller being rotatably mounted in the U-shaped plate; and Motor 4, wherein the motor 4 is fixedly mounted on the U-shaped plate, the output end of the motor 4 is fixedly connected to the grinding roller, and the motor 4 drives the grinding roller to rotate.

5. The semiconductor wafer grinding equipment according to claim 4, characterized in that: The linear motion unit comprises: A mounting plate, the mounting plate being fixedly connected to the box body 1; A linear slide rail, the linear slide rail is fixedly mounted on the mounting plate; and An electric slider is installed on the linear slide rail, the micro laser scanner is installed on the electric slider, a protective cover is also installed on the electric slider, and the micro laser scanner is located inside the protective cover.

6. The semiconductor wafer grinding equipment according to claim 5, characterized in that: It also includes a dust suction mechanism, which includes: A dust suction part, wherein the dust suction part is a box structure with a hollow center, the dust suction part is fixedly installed on the top of the box, and a dust suction hole is provided at the bottom of the dust suction part; and A dust suction fan, wherein the dust suction end of the dust suction fan is sealedly connected with a dust suction pipe, and one end of the dust suction pipe away from the dust suction fan is sealedly connected and communicated with the dust suction part.

7. The semiconductor wafer grinding equipment according to claim 6, characterized in that: It also includes a control mechanism, which includes a control box, a controller is installed in the control box, a display screen and a control switch are installed on the control box, the display screen and the control switch are electrically connected to the controller, and the cylinder 1, the micro laser scanner, the motor 1, the motor 2, the cylinder 2, the pressure sensor 1, the pressure sensor 2, the electric telescopic rod, the motor 3, the motor 4, the electric slider and the dust suction fan are electrically connected to the controller respectively.

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