Method for recycling SAN foam board edgings
By processing the scraps of SAN foam board into the surface board and the core, and bonding the glue to form a complete board, the problem of the scraps of SAN foam board cannot be effectively recycled and utilized, achieving efficient utilization of resources and improving the strength of the board.
Patent Information
- Application Number
- CN202510156727.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-03-28
AI Technical Summary
The prior art lacks environmentally friendly methods to utilize the scraps of SAN foam boards, resulting in the inability to effectively recycle these materials and waste resources.
Through material selection, cutting, bonding and other steps, the scraps of SAN foam board are processed into the surface board and the core, and the complete sheet is formed by bonding the glue, thereby realizing the reuse of scraps.
It realizes the effective recycling and utilization of scraps of SAN foam boards, reduces the generation of hazardous waste, and improves the strength and overall performance of the finished board.
Smart Images

Figure CN119704448A_ABST
Abstract
Description
Technical Field
[0001] The invention generally relates to the field of plastic molding machinery, and in particular to a method for recycling edge strips of SAN foam boards. Background Art
[0002] SAN foam board refers to a foam board made of styrene-acrylonitrile copolymer (SAN) as the main raw material. It has the advantages of superior mechanical properties, good chemical stability, high heat resistance and good processing performance. It is widely used in the construction industry, packaging industry, transportation industry, and industrial fields. For example, the exterior wall insulation of buildings, the cushioning material of electronic products, the roof or bottom plate of trains, etc.
[0003] SAN foam board is mainly made by heating the raw materials to a specified temperature and then extruding and shaping them into a plate-shaped profile through an extruder. Since SAN foam board cannot be recycled like PET, it is necessary to minimize the scrapping of scraps. However, due to the working principle of the extruder, it is difficult to achieve the output of SAN foam board with a standard preset size. Therefore, cutting and shaping are required, which will produce scrap waste.
[0004] Therefore, the inventor believes that there is no more environmentally friendly method of utilizing SAN foam board scraps on the market. Summary of the invention
[0005] According to the present invention, in view of the problems existing in the prior art, a method for recycling SAN foam board edge strips is provided, comprising the following steps: Material selection: select the edge strips, and select the surface boards for processing into the two sides of the final board, as well as the board core between the two surface boards. The surface boards and the board core are spliced together to form the board; Plate cutting: cutting the standard surface plate according to the length and width of the finished product; then processing the core of the plate according to the thickness of the finished product to make the core of the plate into multiple rectangular strips of equal size; Bonding the core of the board: Apply glue to both sides of the strips used for the core of the board and bond them until the length and width of the finished product are formed; After the core of the board is solidified, glue is applied to both sides of the bonded core and one side of the two surface boards, and the two surface boards are bonded to both sides of the core. With the above technical features, the scraps of SAN board cutting are selected and utilized, and by bonding them together, a strong board is formed, thereby recycling the SAN board, and the excellent characteristics of the conventional integrated SAN board are not affected.
[0006] In some embodiments, before the core is bonded, the core surface needs to be roughened, and the side wall of the core strip to be bonded is ground with a grinding tool to form a rough surface on the side wall of the core strip, and the waste residue after grinding is collected. Thus, on the one hand, grinding the bonding surface can increase the roughness of the strip bonding surface, which improves the glue effect when in contact with the glue, and also increases the contact area between the strip and the glue, so that the bonding strength between the glue and the strip is higher.
[0007] In some embodiments, after the surface of the board core is roughened, the collected waste residue needs to be mixed with the glue and stirred thoroughly to form a mixed glue. In this way, the waste residue is recycled. After the waste residue and the glue are mixed, the mixed glue has a higher strength after solidification. In combination with the splicing between the strips, the overall strength of the SAN board can be increased.
[0008] In some embodiments, after the board core is bonded, a drilling tool is used to diagonally drill a hole from one side of the board core to the other side of the board core, wherein the hole penetrates at least two adjacent strips; When bonding the surface panels, one side of the surface panel and the core of the board need to be bonded together, and then the mixed glue is poured into the hole from the opening of the hole on the other side of the core of the board until the mixed glue pouring capacity exceeds the hole opening, and then the other side of the surface panel and the core of the board are bonded together. Thus, when pouring the mixed glue into the hole, on the one hand, the hole is penetrated by multiple strips, and the glue between the strips has not solidified. The poured mixed glue can contact with the glue between adjacent strips, and after the mixed slurry is solidified, it can not only increase the bonding strength between multiple strips, but also mix with the glue between the strips to increase the overall strength of the core of the board. Further, the mixed glue also connects the strips on both sides to each other, increasing the integrity of the final product; further, after the mixed glue is solidified, it forms a rod with strength, which is supported between the two surface panels, greatly increasing the strength of the finished SAN board.
[0009] In some embodiments, before the surface plate is bonded, the surface plate surface needs to be roughened, and the surface plate bonding surface is ground with a grinding tool to form a rough surface on the surface plate bonding side wall, and the waste residue after grinding is collected, and the collected waste residue can also be used to prepare the mixed glue. In this way, the waste residue is recycled and the generation of useless waste is avoided.
[0010] In some embodiments, the ratio of the mixed adhesive solution is (1-1.5): 1. Thus, the solid content in the adhesive solution is increased, so that the strength of the cured adhesive solution is higher.
[0011] In some embodiments, after the surface board bonding process, after the surface board and the core board are bonded and cured, the bonding area on the periphery of the finished product is polished. In this way, on the one hand, the finished SAN board can be shaped to make the periphery of the finished SAN board smoother; on the other hand, the periphery of the finished SAN board after polishing has a higher roughness, which is beneficial to reduce the gap between adjacent SAN boards in actual work.
[0012] In some embodiments, after the peripheral side of the finished product is polished, the mixed glue is evenly applied to the peripheral side of the finished product. Therefore, since the peripheral side of the finished SAN board is polished, if the glue is unevenly applied, air channels will appear in the glue bonding area. Applying the mixed glue to the peripheral side of the finished SAN board can not only block the air channels, but also increase the integrity of the finished SAN board.
[0013] In summary, the present application includes at least one of the following beneficial technical effects: 1. The scraps cut after SAN board production are recycled and utilized to reduce the generation of hazardous waste; 2. By splicing the scraps, the finished SAN board will have higher strength; 3. The waste residue generated during the processing is recycled and utilized, and combined with the bonding structure between the strips, the overall strength of the finished SAN board is further increased.
[0014] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 A schematic diagram showing the overall structure of a SAN foam board splicing structure in a method for reusing SAN foam board edge strips according to an embodiment of the present invention; Figure 2 A flow chart of a method for recycling SAN foam board edge strips according to an embodiment of the present invention is shown.
[0016] Explanation of symbols 1. Surface board; 2. Core board; 21. Strip board; 3. Holes. DETAILED DESCRIPTION
[0017] Hereinafter, preferred embodiments (or implementation modes) of the present invention will be described in detail with reference to the accompanying drawings.
[0018] Reference below Figure 1-Figure 2 A method for recycling SAN foam board edge strips of the present invention is described below.
[0019] Figure 1The overall structural diagram of the SAN foam board splicing structure in a method for reusing SAN foam board edge strips according to an embodiment of the present invention is shown. Figure 1 As shown, a SAN foam board splicing structure includes a board core 2 in the middle, and surface boards 1 bonded to two opposite sides of the board core 2.
[0020] The board core 2 is composed of a plurality of strips 21 of the same size. The staff can calculate the size of the board core 2 according to the actual size of the finished product, and cut the strips 21 of the scraps so that each strip 21 forms a board body with a rectangular cross-section, and then form a mutually bonded board surface through mutual adhesion of glue.
[0021] The surface panel 1 is an integrated panel surface, which is an integrated panel surface formed by cutting the panel surface after extrusion molding by an extruder according to the thickness. Two of them are provided and bonded to both sides of the board core 2 by glue, so that a finished SAN board body is formed by bonding the board core 2 and the two surface panels 1. Since the surface panel 1 is an integrated board body, it is bonded to both sides of the board core 2, thereby enhancing the strength and toughness of the overall SAN board body, and the slender strip board 21 is located in the board core 2, which not only realizes the rational utilization of scraps, but also does not affect the physical strength of the overall SAN board body.
[0022] Specifically, the glue is epoxy resin glue, which is an important adhesive. It is mainly composed of epoxy resin, curing agent, toughening agent, diluent, filler, etc. Among them, epoxy resin is the core component. It is a high molecular polymer containing epoxy groups. The molecular structure contains active epoxy groups, which can undergo cross-linking reaction with the curing agent to form a three-dimensional network structure of the cured product. And it has excellent bonding properties, good chemical stability, and excellent mechanical properties. By using epoxy resin glue as the above-mentioned glue, the strength of the SAN board is greatly improved.
[0023] In order to further improve the bonding force between the glue and the surface plate 1 and the core 2. The bonding side walls of the strip 21 and the bonding side walls of the surface plate 1 are roughened by grinding tools. The roughened surface of the strip 21 or the surface plate 1 can improve the adhesion of the glue, and also increase the contact area between the glue and the strip 21 or the surface plate 1, thereby improving the bonding effect between the glue and the attached objects and increasing the strength of the overall SAN board. In addition, the powdery waste residue formed after grinding the SAN board can be recycled and reused, and mixed with the glue to form a mixed glue.
[0024] Specifically, the waste residue and the glue are mixed in a ratio of (1-1.5):1, and stirred until fully mixed to form a mixed glue. The mixed glue has a high solid content and is thicker, which can not only achieve the bonding effect, but also has a much higher strength than the glue itself after solidification.
[0025] Therefore, in order to improve the strength of the whole SAN board, a plurality of oblique through holes are evenly opened from one side of the board core 2 to the other side, and at least two strips 21 are passed through the through holes. Then the board core 2 is fixed to the surface board 1 on one side by glue, and then the mixed glue is poured into all the through holes until the glue exceeds the surface height of the through holes, and then the surface board 1 on the other side is fixed to the board core 2 by glue. After the mixed glue is poured, it can not only bond and fix multiple adjacent strips 21, but also contact the glue between adjacent strips 21, greatly increasing the radiation range of the mixed glue, and as the mixed glue solidifies, it not only connects the surface boards 1 on both sides to each other, but also forms a solid column, thereby forming a plurality of dense columns between the two surface boards 1, greatly increasing the strength of the whole SAN board, and making its physical properties much higher than the performance of the finished product through the extruder.
[0026] After curing, the surrounding side of the whole SAN board needs to be polished and roughened. On the one hand, the strips 21 that are out of position during the bonding process are polished to make the whole SAN board smoother. On the other hand, it is also conducive to the re-adhesion of the glue. Finally, the mixed glue is evenly applied to the surrounding side of the polished SAN board, which can fill the gaps and further increase the strength of the SAN board.
[0027] Figure 2 The flowchart of a method for reusing SAN foam board edge strips according to an embodiment of the present invention is shown. Figure 2 As shown, the present embodiment provides a method for re-strengthening the SAN foam board edge strips, which is used to prepare the splicing structure of the above-mentioned SAN foam board, and the specific preparation steps are as follows: S1: Material selection, sorting the scraps of SAN foam board, distinguishing the integrated noodles that can be used for reuse and the strips cut on the side; Among them, the one-piece panel is mainly formed by cutting the SAN foam board in thickness to form an one-piece board body, which can be used as a surface panel; and the scraps on both sides of the SAN foam board can be cut and used for splicing the core of the board.
[0028] S2: Plate cutting: Select appropriate surface plates for cutting according to the pre-prepared finished product; then select appropriate strip plates according to the thickness of the pre-prepared finished product, and separate the strip plates into multiple strip plates of equal size with rectangular cross-sections, so that the overall thickness of the two surface plates and the core after bonding is close to the thickness of the pre-prepared finished product.
[0029] S3: The surface of the board core is roughened. The surface of the strip board to be bonded is polished with a grinding tool. On the one hand, the strip board is refined and shaped, and on the other hand, the bonding surface of the strip board is roughened. The finely crushed waste residue after grinding is recycled for later use.
[0030] S4: Board core bonding: apply glue on the bonding surface of the strips, and place the strips in a frame-shaped mold, so that adjacent strips are bonded to each other and form a bonded board surface.
[0031] S5: Oblique punching: use a punching tool to diagonally punch multiple holes that penetrate the board core from one side to the other side after bonding. The diameter of the hole is between 1.5cm and 3.5cm, and the hole penetrates at least two strips at the same time.
[0032] S6: The surface of the panel is roughened. The surface to be bonded and both sides of the panel core are polished with a polishing tool, and the finely crushed waste residue after polishing is recycled for later use.
[0033] S7: Prepare mixed glue solution, mix the recycled waste residue and glue solution in a ratio of (1-1.5):1, and mix the waste residue and glue solution evenly with a stirring tool, and set aside for later use.
[0034] S8: Bonding of one side of the surface panel: Apply glue evenly on one side of the board core and the bonding surface of one of the surface panels, then bond the board core and one side of the surface panel together, and place the surface panel under the board core.
[0035] S9: Pour the mixed glue liquid. Slowly pour the reserved mixed glue liquid into the hole from the opening of the hole until the mixed glue liquid protrudes from the surface of the hole. During the process of pouring the glue liquid, the board core should be slowly shaken to reduce the generation of bubbles during the pouring process.
[0036] S10: Bonding the other side surface board, evenly apply glue to the surface of the board core and the bonding surface of the other side surface board, and butt the surface board and the board core to bond them to each other.
[0037] S11: Compact and solidify. Use heavy objects to press on the top of the surface board to make the two surface boards fit tightly with the board core, and place the solidified SAN board in the temperature and humidity environment required for the curing of epoxy resin glue.
[0038] After curing, a column of dense mixed glue is formed inside the finished SAN board, which forms multiple connecting columns between the two surface panels, which not only increases the bonding strength between adjacent strips, but also makes the connection between the core and the surface panels tighter and stronger.
[0039] S12: Grinding the periphery of the finished product. Grinding the bonding area around the cured SAN board can not only shape the protruding strips or misplaced panels, but also clean up the excess glue.
[0040] S13: Edge sealing and curing, evenly apply the mixed glue on the periphery of the SAN board, and cure the SAN board into shape. After the periphery of the finished SAN board is polished, it is conducive to the adhesion of the mixed glue, making the mixed glue adhere more evenly, and also filling the gaps on the periphery of the finished SAN board, further increasing the strength of the finished SAN board.
[0041] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0042] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A method for recycling SAN foam board edge strips, characterized in that: The following steps are involved: Material selection: select the edge strips, and select the surface boards for processing into the two sides of the final board, as well as the board core between the two surface boards. The surface boards and the board core are spliced together to form the board; Plate cutting: cutting the standard surface plate according to the length and width of the finished product; then processing the core of the plate according to the thickness of the finished product to make the core of the plate into multiple rectangular strips of equal size; Bonding the core of the board, applying glue on both sides of the strips used for the core of the board, and bonding them until the length and width of the pre-prepared finished product are formed; For bonding the surface panels, glue is applied on both sides of the board core after bonding, and glue is applied on one side of the two surface panels, and the two surface panels are bonded to both sides of the board core respectively.
2. The method for recycling SAN foam board edge strips according to claim 1, characterized in that: Before the core board is bonded, the core board surface needs to be roughened, and the side wall of the core board strip to be bonded is ground with a grinding tool to form a rough surface on the side wall of the core board strip bonding, and the waste residue after grinding is collected.
3. The method for recycling SAN foam board edge strips according to claim 2, characterized in that: After the surface of the board core is roughened, the collected waste residue needs to be mixed with the glue and stirred thoroughly to form a mixed glue.
4. The method for recycling SAN foam board edge strips according to claim 3, characterized in that: After the board core is bonded, a drilling tool is used to diagonally drill a hole from one side of the board core to the other side of the board core, wherein the hole penetrates at least two adjacent strips; When bonding the surface panels, one side of the surface panel and the board core need to be bonded together, and then the mixed glue liquid is poured into the hole opening on the other side of the board core until the mixed glue liquid pouring capacity exceeds the hole opening, and then the other side of the surface panel and the board core are bonded together.
5. The method for recycling SAN foam board edge strips according to claim 3, characterized in that: Before bonding the surface panels, the surface panels need to be roughened. Use a grinding tool to grind the bonding surface of the surface panels to form a rough surface on the bonding side walls of the surface panels. Collect the waste residue after grinding. The collected waste residue can also be used to prepare the mixed glue solution.
6. The method for recycling SAN foam board edge strips according to claim 5, characterized in that: The composition ratio of the mixed glue solution is waste residue: glue solution (1-1.5):
1.
7. The method for recycling SAN foam board edge strips according to claim 6, characterized in that: After the surface plate bonding process, when the surface plate and the core plate are bonded and cured, the bonding area around the finished product is polished.
8. The method for recycling SAN foam board edge strips according to claim 7, characterized in that: After polishing the periphery of the finished product, apply the mixed glue evenly around the periphery of the finished product.